JP2801453B2 - Method and apparatus for dividing insulating substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the division of a circuit insulating substrate (hereinafter simply referred to as an "insulating substrate") for an electronic circuit device having divided processing lines, and particularly to a mounting part connecting portion on the insulating substrate at the time of division. The present invention relates to a method and an apparatus for dividing an insulating substrate, which are suitable for minimizing generated stress and for automatically setting up equipment.

[0002]

2. Description of the Related Art A conventional method of dividing an insulating substrate will be described with reference to FIGS. FIG. 14 is a view showing a dividing method by manual operation, in which a downward bending force is applied to both ends of the insulating substrate 1 with the hand 15 around the dividing line 12 to cause a crack to propagate from the dividing line 12 as a starting point. It is a method of dividing.

FIG. 15 is a front view showing another dividing method, in which an edge 16 is applied to the lower surface of the insulating substrate 1 so as to face the dividing line 12, and a downward bending force 17 is applied to the insulating substrate 1. This is a method in which the dividing force is concentrated on the upper end of the edge 16 and the crack is accurately propagated from the dividing processing line 12 as a starting point to be divided. Incidentally, Japanese Patent Application Laid-Open No. 57-4714 is mentioned as one related to this kind of technology.

[0004]

In the above-mentioned conventional technique, bending is applied to the insulating substrate by applying a bending force to the insulating substrate, and stress is applied to a connection portion of a mounted component (for example, an electronic component such as an LSI) on the insulating substrate. This causes a problem of lowering the reliability of component connection. In addition, there is also a problem that the connection with the preceding and following processes is not taken into consideration, so that it is not possible to adapt to automatic production of equipment.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems of the prior art, and a first object of the present invention is to reduce a stress generated at a mounting component connection portion on an insulating substrate at the time of division. A second object of the present invention is to provide an improved dividing method of an insulating substrate which can be performed, and a second object of the present invention is to automatically divide the insulating substrate so as to take into consideration the connection with the preceding and following steps.

[0006]

According to the object of the present invention, there is provided a method and a device for dividing an insulated substrate, wherein the divided processing lines are provided on the main surface of the insulating substrate in advance at both end surfaces of the insulating substrate. At least one set is sandwiched between two or more substrate holding parts, at least one set on each side, orthogonal to it, and while pressing the blade along the longitudinal direction of the split processing line from the back side of the processing surface of the split processing line, This can be achieved by rotating at least one set of substrate holding units in a direction opposite to the pressing direction of the blade.

Hereinafter, the means for achieving the object of the present invention will be specifically described. The first object, in the dividing method of the insulating substrate on which a plurality of dividing the processing line that separates the advance circuit blocks cut into pieces of the circuit blocks of an insulating substrate provided on the main surface of the insulating substrate, wherein the insulating substrate Division line
The substrate end surface perpendicular to the both sides of the dividing line
At least one set of substrate holding portions is sandwiched between at least two sets of substrate holding portions provided , and a blade is pressed at a predetermined pressure from the back side of the processing surface of the split processing line along the longitudinal direction of the split processing line. This is achieved by a method of dividing the insulating substrate in which the substrate is rotated in the direction in which the blade is pressed.

The insulating substrate is generally a mounting substrate on which electronic components such as a semiconductor device are mounted and connected on a circuit. However, in some cases, a circuit substrate on which electronic components are not mounted may be used. . As the material of the substrate, a ceramic circuit board, a printed circuit board made of a glass epoxy substrate, or the like is also an object. However, a material having low flexibility such as a ceramic substrate is preferable because of ease of cutting.

A rotating shaft parallel to the dividing line is connected to the substrate holding section, and the substrate is held by pressing the shaft against the end face of the substrate. Then, at the time of holding the substrate, the interval between the rotation axes is arbitrarily set so that one division processing line to be divided exists between at least two sets of substrate holding units, and preferably, each of the rotation axes is separated from the division processing line. To hold the end of the circuit block. That is, at the time of division, the blade is pressed against the back surface along the longitudinal direction of the division processing line, and the axes of the holding parts are rotated outward with respect to this blade as a fulcrum, thereby performing the leverage principle. As for the rotation of the shaft, it is desirable to simultaneously rotate the shafts of the holding portions on both sides of the dividing line, but it is also possible to fix only one side and not rotate the other set. It is desirable to rotate the shaft in synchronization with the blade when the blade is pressed against the substrate to apply a dividing force. Also, when applying a dividing force by pressing the blade against the substrate, it is necessary to take care not to apply an excessive pressure that would destroy the substrate.

A second object of the present invention is to provide a semiconductor device in which a plurality of divided processing lines for preliminarily dividing a circuit block sandwich both end surfaces of an insulating substrate provided on a main surface of the insulating substrate with holding portions, and hold the circuit block in the holding portion. A dividing device for cutting the insulating substrate into pieces while holding the insulating substrate, wherein the device directly cuts the dividing processing line of the insulating substrate.
The interlinking substrate end face, provided on both sides of the dividing processing line
A substrate holding means sandwiched by at least two sets of substrate holding portions, a means for applying a predetermined dividing force by pressing a blade along the longitudinal direction of the division processing line from the back surface of the division processing line, Means for rotating the set of substrate holders in opposition to the blade pressing direction.

Preferably, a rotating shaft parallel to the dividing line is connected to the holding portion, and when the blade is pressed to apply a dividing force, the holding portion is rotated about the axis in synchronization with the division. The substrate holding means and the means for pressing the blade to apply a predetermined splitting force are combined to facilitate the splitting of the insulating substrate. So that

It is desirable that the holding section in contact with the insulating substrate is not limited to a plane type , but rather has a V-shape, a U-shape, or an inverted L-shape to more stably hold the board. Further, the contact portion of the holding portion with the insulating substrate may be formed of a moderately elastic material, for example, a material such as a hard rubber such as urethane or plastic, so that the end portion may be damaged by the holding portion when the substrate is divided. It is possible to prevent it before it happens.

Further, in the apparatus of the present invention, after the circuit block is cut into individual pieces by the dividing means, a judgment means (read by a defect detection sensor) for judging a good product or a defective product of the divided circuit block is provided. A sorting mechanism for sorting and a control device for automatically controlling a series of these operations can be provided, which makes it possible to completely automate the process from division to sorting.

[0014] Specific examples of the means for judging non-defective / defective products include, for example, detection of defective portions such as chips and protrusions in a divided processing line portion of a circuit block cut into pieces, and mounting on an insulating substrate. Detection of presence / absence of a component (whether or not it is mounted at a predetermined position), detection of presence / absence of a marking previously attached to a circuit block of the insulating substrate as a defective circuit in an inspection process at the time of forming the insulating substrate, and the like.

In the apparatus of the present invention, unnecessary portions, such as peripheral portions of the insulating substrate, on which circuit blocks are not formed, can also be cut, and these are discarded to a discharge mechanism provided in association with the dividing means. . Further, a mechanism is provided in which defective products are discarded to a defective product discharge unit provided in association with the determination means based on the determination results of good products and defective products of the divided circuit blocks, and the good products are transported to the next process. be able to.

The above division is performed in a division stage.
As means for transferring the substrate to this stage, a transfer mechanism capable of rotating the insulating substrate in units of 90 degrees can be provided. Also, a mechanism for rotating the divided pieces in units of 90 degrees to align them in the same direction can be provided.

It is desirable that the interval between the plurality of divided processing lines provided on the insulating substrate is set to a dimension larger than the thickness of the insulating substrate. In addition, when a plurality of orthogonal dividing lines are provided on the insulating substrate, two dividing means are independently installed in order to enable dividing in two directions, and each dividing step is performed in each dividing stage. It is desirable to do.

In the next step, there is provided a control device capable of performing the division and stopping the insulated substrate divided into individual pieces in synchronization with a device for processing, for example, terminal insertion, appearance inspection, packing and the like in the next step. It can also be provided. Further, before starting the dividing operation, an abnormality detecting function for detecting whether or not the divided processing line has been processed to a predetermined depth or more may be provided.

Further, as another example of the abnormality detecting function, a pressure sensor for measuring the pressing force of the blade pressing the back surface of the insulating substrate at the time of division is provided, and when the pressing pressure exceeds a specified value, the pressing force of the blade is detected. Means can be provided that can be released.

[0020]

According to the method and the apparatus for dividing an insulating substrate according to the present invention, the insulating substrate is sandwiched by holding portions having at least two sets of rotating shafts on both sides of the dividing line, and the blade is pressed against the back surface of the dividing line. When a force is applied, the holder rotates around the rotation axis in synchronization with the division, so that the stress generated at the connection between the electronic component mounted on the insulating substrate and the insulating substrate can be reduced. The device for dividing an insulating substrate according to the present invention has a mechanism for judging non-defective / defective products of a circuit block and a mechanism for sorting (sorting), so that the device can be operated in conjunction with a device for a next process for performing other processing.

Further, since the insulating substrate dividing apparatus according to the present invention has an unnecessary portion discharging mechanism, it can be automatically operated even if a circuit block is formed around the insulating substrate. Further, the insulating substrate dividing device according to the present invention is:
Before or after the division of the insulating substrate, the insulating substrate can be rotated in units of 90 degrees, so that the substrates can be supplied in the same direction to the device in the next step. Further, since the insulating substrate dividing apparatus according to the present invention can be divided into arbitrary dimensions larger than the thickness of the insulating substrate, the versatility is high.

In the apparatus for dividing an insulating substrate according to the present invention, since the division along the dividing line in two directions orthogonal to each other is performed by two stages separately installed, the work time is short. In addition, the apparatus for dividing an insulating substrate according to the present invention synchronizes with an apparatus for processing in the next step, so that it is easy to make equipment lines. Further, since the insulating substrate dividing device according to the present invention has a function of detecting an abnormality of the divided processing line, the insulating substrate is not defective.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. <Embodiment 1> FIGS. 2 to 4 show an embodiment of a method of holding an insulating substrate and a method of dividing the same according to the present invention.
3 is a perspective view showing a method of holding the insulating substrate, FIG. 3 is a side view showing a method of dividing the insulating substrate, and FIG.
FIG. 5 is a side view showing a holding state of the insulating substrate holding portion. The method of holding the insulating substrate will be described with reference to FIG. 2. First, the divided processing lines 12 are provided on the main surface in advance,
For example, a ceramic insulating substrate 1 on which electronic components are mounted is prepared, and both side surfaces of the insulating substrate 1 are sandwiched and held by a holding portion 2 orthogonally to a dividing line 12 for dividing a circuit block of the insulating substrate 1. As this holding method, a total of two sets of the holding part 2 having the rotation axis 13 parallel to the division processing line 12 are provided on each side with the division processing line 12 at the position to be divided as a center line. The shafts 13 of the holder 2 are pressed against each other in the direction of the insulating substrate 1 to hold the insulating substrate 1.

Next, the insulating substrate 1 thus held is
Will be described with reference to FIG. As shown in FIG. 3 (a), the divisional processing is performed on the insulating substrate 1 held by the substrate holder 2 connected to the two sets of rotating shafts 13 with the surface on which the divisional processing line 12 is provided facing upward. The insulating substrate 1 is divided by pressing the blade 3 in the direction of the arrow A along the longitudinal direction of the division processing line 12 from the back surface of the processing surface of the line 12 and applying a division force. In synchronization with this division, the substrate holder 2 rotates in the direction of arrow B about the rotation shaft 13 while holding the insulating substrate 1 as shown in FIG. Can be reduced. The length of the blade 3 is desirably adjusted to the length of the dividing line to be almost divided so that the blade 3 can be supported over the entire length of the back surface of the substrate.

As shown in FIG. 4, the shape of the contact portion of the substrate holding portion 2 connected to the rotating shaft 13 with the insulating substrate 1 may be flat as shown in FIG. FIG.
The V-shape shown in FIG. 5, the U-shape shown in FIG. 6C, or the inverted L-shape shown in FIG. Regardless of the straight shape or another shape, as shown in FIG. 3E, the material of the contact portion 14 of the substrate holding portion 2 with the insulating substrate 1 is made of urethane having appropriate elasticity. System, hard rubber, or an elastic body such as plastic, which makes it possible to deform the contact portion 14 and further improve the holding force,
Moreover, since the contact is soft via the elastic body, the insulating substrate 1 can be divided without causing a problem such as chipping of the substrate. In this embodiment, all the shafts 13 of the two sets of holding units 2 are rotated, but only one of the sets is rotated and the other set of shafts is fixed without being rotated. It is also possible.

<Embodiment 2> FIG. 1 is a perspective view showing an essential part of an insulating substrate dividing apparatus according to an embodiment of the present invention, which is capable of automatically dividing an insulating substrate. . From the magazine 6, a so-called multi-cavity insulating substrate 1, in which a plurality of divided processing lines 12 are arranged perpendicularly in two directions of XY (indicated by broken lines 12), is taken out by a transport mechanism (not shown). , To the receiving table 7-1. Next, it is rotated in a specified direction by a rotary transport mechanism 4-1 that can rotate in units of 90 degrees, and transported to a first division stage (not shown). Here, two sets of substrate holding units 2-1 are used.
Then, the ends of the insulating substrate 1 are fixed at predetermined intervals with the division processing line 12 as the center line, and division is performed in the same direction (for example, the Y direction) by the blade 3-1. The substrate holding and dividing operations are sequentially repeated to perform all divisions in the Y direction.

It should be noted that an upper limit is set for the pressing pressure of the blade so that an excessive pressure is not applied to the insulating substrate, so that the substrate is prevented from being broken and the reliability and the yield are improved. ing. This pressing pressure will be described later in detail with reference to FIG. Further, the interval between the two sets of substrate holding units 2-1 can be arbitrarily set by adjusting the interval between the shafts 13 of each set.

Next, the insulating substrate 1 that has been divided in one direction is transported to the next receiving table 7-2. Further, it is rotated in a designated direction by a rotary transport mechanism 4-2 which can rotate in units of 90 degrees,
It is conveyed to another second division stage not shown. As shown in the figure, the substrate holding unit 2-2 and the blade 3-2 of the second division stage are connected to the first
Are arranged at positions orthogonal to those of the divided stages, but the functions are the same. The reason for the orthogonality is that the configuration is convenient in accordance with the subsequent transport direction, and it is also possible to set the position in the same direction without orthogonality.

After fixing the insulating substrate 1 conveyed to the second division stage by the substrate holding section 2-2, the blade 3-2
Divides the circuit block in the remaining one direction (for example, the X direction) into individual pieces. At each split stage,
Unnecessary portions around the insulating substrate where no circuit blocks are formed are also divided, and the unnecessary portions are separated into waste disposal holes 8-2.
(The pit 8-1 of the first division stage is not shown). The circuit block 10 divided into the individual pieces is conveyed by the discharge conveyor 11 of the next process transferred at the same time as the division. A defect detection sensor 5 is provided on a part of the discharge conveyor 11.
To set up the board peripheral parts (chips, protrusions, etc.),
The presence / absence of a part is determined, and the defective product is discarded in the waste product dropping hole 8-3 in the defective product discharge unit 9. As described above, only the non-defective circuit block 10 is discharged to the next process device in the same direction as the next process device.

Note that the series of operations are automatically operated by a control device (not shown) in the present apparatus. In other words, this control device transports the insulating substrate 1 and controls the insulating substrate 1 by the substrate holding unit 2 in the divided stage.
Inspection and sorting of the divided circuit blocks 10 based on the detection information of the defective product detection sensor 5 and the first control unit that controls the holding and division of the defective products, transporting the non-defective product to the next process and discarding the defective product And a second control unit that performs operations such as the above.

FIG. 13 is a characteristic diagram for explaining a change in pressure for pressing the blade against the insulating substrate according to the present invention. In the figure, the vertical axis represents the blade pressing pressure, and the horizontal axis represents the elapsed time from the start of blade ascent. In the case of the normal dividing line shown in FIG. 9A, the pressure gradually increases after the blade comes into contact with the substrate, and the substrate is divided by the pressure P1 and the pressure returns to 0 at the same time. On the other hand, when the divided processing line in FIG. 3B is abnormal (for example, when the line depth is too shallow), the pressure becomes P1.
In this case, since the substrate is not divided, the pressure further increases, and eventually the substrate is broken. Therefore, P2 where the pressure is slightly larger than P1 is set as a limit, and when the pressure exceeds P2, it is determined that there is an abnormality, the blade that has been raised is lowered, and the division is stopped. According to the present invention, since an upper limit is set for the pressing pressure, an excessive pressure is not applied to the insulating substrate, and the substrate is not broken.

<Embodiment 3> In FIG. 1, judgment and selection for separating a circuit block 10 in which the insulating substrate 1 is automatically divided into a non-defective product and a non-defective product by a control device based on detection information of a defective product detection sensor 5 are performed. The work flow of the method will be described with reference to FIGS. First, in FIG. 5, an insulating substrate for dividing the circuit block 10 into a non-defective product and a non-defective product, and a sorting mechanism for discarding the non-defective product and discharging only the non-defective product to the next process are shown in FIG. By incorporating it into the substrate dividing device, it is possible to make a line with the next process. Judgment of non-defective and defective products,
A specific example of the selection method will be described below.

FIG. 6 shows a circuit block 1 by a dividing operation.
Insulation with a mechanism to check the periphery of the insulated substrate classified into 0, determine the occurrence of chipping and protrusions around the substrate, discard what has occurred by the sorting mechanism, and transport only good products to the next process 1 shows a substrate dividing device. This determination mechanism is performed based on the detection information of the defective product detection sensor 5 in FIG.
It comprises an image reading device such as a CD sensor or an industrial imaging camera. The read image information is performed by a control device having a built-in comparison circuit for storing the correct image information of the correct circuit block 10 in a memory if necessary, and comparing the read image information with the image information.

FIG. 7 is a diagram for detecting the presence or absence of mounted electronic components on the insulating substrate divided into the circuit blocks 10. If there is no mounted component, it is discarded as a defective product, and only the mounted component is transferred as a good product to the next step. 1 shows an insulating substrate dividing apparatus having a pass / fail judgment mechanism. Normally, electronic components are mounted on the correct circuit block 10, and a defective mark is formed on the circuit block 10 which has become defective in the board inspection process so that no component is mounted.

FIG. 8 shows a pass / fail judgment mechanism for detecting a circuit block in which a part of the circuit block 10 has been subjected to marking processing of a defective product in advance on the insulating substrate divided into the circuit block 10 and discarding it as a defective product. 1 shows an insulating substrate dividing device having the following. Usually, electronic components are often mounted on a substrate to be divided, but a substrate on which no components are mounted can also be a target to be divided, so this apparatus is effective in that case.

FIG. 9 is a diagram showing a defect in the shape of the insulating substrate divided into the circuit blocks 10 when chips or protrusions are generated around the substrate in the process of division, the presence or absence of a component mounted on the substrate, and the presence or absence of a defective product display mark. This is a device for separating insulating substrates equipped with a pass / fail judgment mechanism that detects all inspection items and discards defective products.This device can be operated in conjunction with the next process to perform other processing And

<Embodiment 4> For the entire apparatus shown in FIG.
The flow of the work will be described more specifically with reference to FIGS. The example of the dividing device shown in the block diagram in FIG. 10 shows the divided processing line 1 of the insulating substrate 1 for easy understanding.
The case where 2 is one direction (for example, the X direction) has been described. Therefore, a case will be described in which only the second division stage of the first and second division stages in FIG. 1 is used. First, the insulating substrate 1 discharged from the magazine 6 is aligned with the direction of the dividing line 12 before dividing.
It is rotated and positioned in an arbitrary direction by the transport mechanism 4 that can rotate in units of 90 degrees. Next, it is divided into individual pieces in a division stage. At this time, unnecessary portions, such as the peripheral portion of the insulating substrate 1 where the circuit block 10 is not formed, are discarded by the unnecessary portion discharging mechanism into the waste dropping hole 8, and only the insulating substrate constituting the circuit block 10 is transferred to the next rotating stage. Transport.

In the rotating stage, the substrate on which the circuit block 10 is formed is positioned in an arbitrary direction by a rotating mechanism that can rotate in units of 90 degrees. Supply in the same direction. At this time, the quality of the substrate is determined by the method described in the third embodiment, and only good products are discharged to the next process.

FIG. 11 shows a flow of the operation for dividing a so-called multi-piece substrate in which a plurality of division processing lines 12 are inserted into the insulating substrate 1 at right angles to the X and Y directions. In the case of FIG. 7A, the division stages are combined into one place, and after the division in one direction (for example, the Y direction) is completed, the divided substrates are rotated by 90 degrees by the rotary transport unit, and again in the same division stage. The circuit block 10 is divided in the other direction (X direction) and cut into individual pieces. In the case of FIG. 4B, the dividing device is composed of two independently arranged dividing stages. In the first dividing stage, after the division in one direction (for example, the Y direction) is completed, the other is divided. And performs division in the remaining one direction (X direction).

In the case of FIG. 2A, since the division is performed in two directions on the same stage, there is a disadvantage that the division time is slightly longer, but there is an advantage that the equipment cost is reduced. On the other hand, in the case of FIG.
Since the division is performed by disposing independent and separate stages, there is an advantage that the division can be performed in parallel and the division time can be shortened, but the size of the apparatus is somewhat increased.

FIG. 12 shows an embodiment in the case of interlocking with a next process apparatus for performing processing other than division. A synchronization signal indicating that the device is in operation or stopped is extracted from a device (e.g., a terminal insertion device, a visual inspection device, a packing device, etc.) to be processed in the next process, and is input to a dividing device, a determining device, and a sorting device of the dividing device, respectively. It is possible to sequentially execute and stop the division, the quality judgment, and the sorting work of the insulating substrate. This makes it possible to make a line with the next process apparatus. These series of operations are automatically controlled by the control device described in the second embodiment.

[0042]

According to the method and apparatus for dividing an insulating substrate according to the present invention, the intended object can be achieved.
That is, the stress applied to the substrate at the time of division can be reduced, and when mounted on an insulating substrate, the connection reliability of components can be greatly improved. In addition, the apparatus for dividing an insulating substrate according to the present invention includes, for example, a mechanism for judging a non-defective product and a defective product of a circuit block and a sorting mechanism, a mechanism for discharging unnecessary portions of the insulating substrate, and a process for separating the insulating substrate after division in a direction suitable for the device in the next process. Since the apparatus has a rotary conveyance mechanism for supplying the same and a mechanism for synchronizing with the next process equipment, the equipment can be made into a line, and the cost of the insulating substrate can be reduced by saving labor. Furthermore, in the splitting operation, since an upper limit is set on the pressing pressure of the blade and an excessive pressure is not applied to the insulating substrate, the destruction of the substrate can be prevented, and the reliability and the yield can be improved. Was.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a main part which is an embodiment of a dividing apparatus according to the present invention.

FIG. 2 is a perspective view of a substrate holding unit in the apparatus of the present invention.

FIG. 3 is a front view illustrating a dividing method according to the present invention.

FIG. 4 is a side view of FIG. 2 showing a substrate holding unit of the apparatus of the present invention.

FIG. 5 is a flow chart of the division work of the apparatus of the present invention.

FIG. 6 is a division work flow chart of the apparatus of the present invention.

FIG. 7 is a division work flow chart of the apparatus of the present invention.

FIG. 8 is a division work flow chart of the apparatus of the present invention.

FIG. 9 is a flow chart of the division work of the apparatus of the present invention.

FIG. 10 is a division work flow chart of the apparatus of the present invention.

FIG. 11 is a division work flow chart of the apparatus of the present invention.

FIG. 12 is a division work flow chart of the apparatus of the present invention.

FIG. 13 is a characteristic diagram showing a relationship between an elapsed time from the start of blade ascent and a pressing pressure.

FIG. 14 is an explanatory diagram of a conventional dividing method.

FIG. 15 is an explanatory diagram of another conventional dividing method.

[Explanation of symbols]

1 ... insulating substrate, 2 ... substrate holding part,
3 ... blade, 4 ... rotating conveyance section, 5 ... defect detection sensor, 6 ... magazine, 7 ... receiving stand,
Reference numeral 8 denotes a waste dropping hole, 9 denotes a defective product discharge part, 10 denotes a circuit block, 11 denotes a next process discharge conveyor, 12 denotes a divided processing line, 13 denotes a rotating shaft of a substrate holding part, 14 denotes a contact part elastic body, and 15 denotes a hand.
16 ... edge, 17 ... direction of dividing force.

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Sumio Hayashida 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Within the Information and Communications Division, Hitachi, Ltd. (72) Inventor Koji Touchi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd.Information and Communication Division (72) Inventor Yukito Takahashi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa PrefectureInformation and Communication Division, Hitachi, Ltd. (72) Saburo Umeda 216 Totsuka-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture Hitachi, Ltd. Information and Communications Division (72) Inventor Yukihei Miyamoto 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside Hitachi Advanced Systems, Ltd. (56) References JP-A-5-124031 (JP, A) 52-19210 (JP, B2) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 3/00 B26F 3/00

Claims (18)

(57) [Claims] 1. A method of dividing an insulating substrate in advance a plurality of division processing line that separates the circuit blocks cut into pieces of the circuit blocks of an insulating substrate provided on the main surface of the insulating substrate, the divided processing of the insulating substrate Substrate edge perpendicular to the line
A blade is pressed with a predetermined pressure along the longitudinal direction of the divided processing line from the back side of the processing surface of the divided processing line while being sandwiched by at least two sets of substrate holding portions provided on both sides of the divided processing line. A method of dividing an insulating substrate, wherein at least one set of substrate holding units is rotated while facing in the direction in which the blade is pressed. 2. The method according to claim 1, further comprising the steps of: setting an interval between rotation axes connected to the substrate holding unit so that one processing line to be split exists between at least two sets of substrate holding units; 2. The insulating substrate according to claim 1, wherein the holding is performed by rotating the shafts of the holding portions outward with respect to each other with the blade pressed from the back side along the longitudinal direction of the division processing line as a fulcrum. How to split. 3. When dividing, the timing of rotating the shaft of the substrate holding portion and the timing of applying the dividing force by pressing the blade against the substrate are synchronized, and the dividing force is applied by pressing the blade against the substrate. 3. The method for dividing an insulating substrate according to claim 1, wherein the pressure is set within a pressure which does not break the substrate obtained by measuring in advance. 4. The method according to claim 1, wherein the insulating substrate comprises an insulating substrate in which a circuit is incorporated, and further comprises a mounting substrate on which electronic components are mounted and connected in advance. 5. The method according to claim 4, wherein said insulating substrate is formed of a ceramic substrate. 6. A plurality of divided processing lines for dividing a circuit block in advance are formed by individually holding both ends of an insulating substrate provided on a main surface of the insulating substrate by holding portions, and holding the circuit block by the holding portion. An insulated substrate dividing apparatus for cutting out an edge of a substrate orthogonal to the divisional processing line of the insulated substrate.
At least two sets each provided on both sides of the split line
Substrate holding means sandwiched between the substrate holding portions, means for pressing a blade along the longitudinal direction of the division processing line from the back side of the processing surface of the division processing line to apply a predetermined dividing force, and at least one set of substrate holding portions. Means for rotating the substrate in a direction opposite to the blade pressing direction. 7. A rotating shaft parallel to the dividing line is connected to the substrate holding portion, and when a blade is pressed to apply a dividing force,
Means for applying a predetermined dividing force by pressing the substrate holding means and the blade against each other, in synchronization with the division, the holding section comprising a mechanism for rotating each other around the axis against the dividing force of the blade; 7. The apparatus for dividing an insulating substrate according to claim 6, wherein the steps (a), (b), and (c) are performed to divide the insulating substrate. 8. The insulating substrate dividing apparatus according to claim 6, wherein the cross-sectional shape of the substrate holding portion that comes into contact with the insulating substrate is a flat shape , a V shape, a U shape, or an inverted L shape. 9. The insulating substrate dividing apparatus according to claim 6, wherein a contact portion of the substrate holding portion with the insulating substrate is formed of an elastic body. 10. A circuit for cutting a circuit block into individual pieces by a dividing means, a judging means for judging a non-defective product and a defective product of the divided circuit block, a selecting means for separating the divided circuit blocks, and automatically controlling a series of these operations. an insulating substrate dividing apparatus according to any one of the controller and the claims 6 to 9 comprising comprises a to. 11. The cut pieces obtained by cutting the unnecessary portion which is not the circuit blocks in the peripheral portion of the insulating substrate is formed, any claims 6 to 9 comprising a structure in which dumped into discharge mechanism provided in association with the dividing means The device for dividing an insulating substrate according to any one of the preceding claims. 12. A defective product is discarded to a defective product discharge unit provided in association with the determination means based on a result of the determination of a good product or a defective product of the divided circuit blocks, and the non-defective product is transported to the next process. any one of claims 6 to 9 comprising comprises a mechanism
2. The dividing device for an insulating substrate according to claim 1. Has 13. divided stages carried out the division as a means for conveying the insulating substrate here, any one of claims 6 to 9 comprising an insulating substrate provided with a rotatable transfer mechanism in 90-degree increments A device for dividing an insulating substrate according to one of the preceding claims. 14. divided pieces of insulating substrate dividing apparatus according to any one of claims 6 to 9 comprising comprises a transport mechanism that rotates aligned in the same direction at 90 degree increments. 15. In order to divide an insulating substrate provided with a plurality of orthogonal dividing lines, two independent dividing means are provided corresponding to the dividing lines in two directions. The apparatus for dividing an insulating substrate according to any one of claims 6 to 9 , wherein the apparatus is configured to be divided by a stage. 16. The divided insulating substrate into individual pieces, the implementation of division in synchronism with the processor of the next step, in any one of claims 6 to 9 comprising comprises a stop capable controller An insulated substrate dividing apparatus as described in the above. To 17. Before entering the dividing operation, in advance any one of the division processing line is formed by including an abnormality detection mechanism for detecting whether the processed until more depth defined claims 6 to 9
4. The apparatus for dividing an insulating substrate according to any one of the above. 18. A pressure sensor for measuring a pressing force of a blade pressing the back surface of the insulating substrate at the time of division, and comprising means for releasing the pressing force of the blade when the pressing pressure exceeds a prescribed value. any of claim 6 to 9
A device for dividing an insulating substrate according to one of the preceding claims.