JP4439693B2

JP4439693B2 - Printed circuit board conveying method and apparatus

Info

Publication number: JP4439693B2
Application number: JP2000228878A
Authority: JP
Inventors: 正淡野; 平石井
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2000-07-28
Filing date: 2000-07-28
Publication date: 2010-03-24
Anticipated expiration: 2020-07-28
Also published as: JP2002043793A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品実装機における電子部品の実装処理域にプリント基板を搬出入するプリント基板搬送方法及び装置に関するもので、詳しくは、プリント基板一枚当たりの実装処理時間を短縮して、生産効率を向上させるための改良に関するものである。
【０００２】
【従来の技術】
図４は、電子部品実装機１における電子部品の実装処理域にプリント基板３を搬出入するプリント基板搬送装置５の従来例を示したものである。
【０００３】
電子部品実装機１は、実装作業用のテーブル１１の上面を実装処理域としたもので、テーブル１１の上方には、実装ヘッド１２を装備している。この実装ヘッド１２は、図に矢印（イ）で示す中心軸回りに回転可能なヘッド本体１３の下端面に、電子部品を吸着する吸着ノズル１４を複数配備した構成である。各吸着ノズル１４は、昇降可能に装備されていて、ヘッド本体１３の回転動作と各吸着ノズル１４の昇降動作の組み合わせで、図示しない電子部品供給部に供給されたチップ形の電子部品を前記実装処理域にあるプリント基板３上の所望位置に移載する。
【０００４】
プリント基板搬送装置５は、テーブル１１上の実装処理域内でプリント基板３を移動させる実装域コンベヤ２１と、前記実装域コンベヤ２１と同期運転可能で電子部品を実装処理すべきプリント基板３を前工程から前記実装域コンベヤ２１に供給する搬入コンベヤ２３と、前記実装域コンベヤ２１と同期運転可能で前記実装処理域で所定の実装処理を済ませた処理済みプリント基板３を実装域コンベヤ２１上から次工程に搬出する搬出コンベヤ２５とで、実装処理域を通るプリント基板の搬送路を形成しており、各コンベヤ２１，２３，２５の動作を制御装置２７によって制御する。
【０００５】
各コンベヤ２１，２３，２５は、前記テーブル１１上の実装処理域の範囲内に収まる寸法であれば、種々の大きさのプリント基板３が取り扱えるように、幅寸法が可変に構成されたり、あるいは、幅寸法の異なるコンベヤに付け替え可能にされている。
【０００６】
図示の実装域コンベヤ２１上に実線で示したプリント基板３は、実装処理域の寸法に対してかなり小型の基板を示し、実装域コンベヤ２１上に二点破線で示したプリント基板３ａは、拡大図にも示すように、小型の基板を略６個合わせた大きさの大型基板である。
【０００７】
従来の制御装置２７は、前記実装ヘッド１２による実装処理を基板１枚単位で実施することを前提としたもので、１枚の基板への実装処理が済むと、実装処理済みの基板が搬出コンベヤ２５に搬出されると共に、次に処理すべき１枚の基板が搬入コンベヤ２３から搬出コンベヤ２５に供給されるように、各コンベヤ２１，２３，２５の動作を制御する。
【０００８】
【発明が解決しようとする課題】
ところで、電子部品の実装点数が少ないプリント基板では、前記実装ヘッド１２による実装処理時間がかなり短時間で完了するのに対し、処理済みのプリント基板３の搬出や新規のプリント基板の搬入に大きな時間がかかり、実装基板の生産効率の低下を招くという問題があった。
【０００９】
そこで、このような１枚のプリント基板当たりの搬出入に要する時間を短縮して、生産効率の向上を図るために、図５又は図６に示す方法が提案されている。
【００１０】
図５に示した方法は、処理対象の基板３が小型の場合には、本来のプリント基板３の代わりに、実装処理域の範囲内に収まる程度で複数枚のプリント基板３を一体化した多面取基板３ｂを使い、この多面取基板３ｂ単位で１枚ずつ処理するものである。
【００１１】
図６に示した方法は、処理対象の基板３が小型の場合には、実装処理域の範囲内に収まる程度のトレー３ｃ上に、独立した複数枚のプリント基板３を配置するものである。
【００１２】
これらの方法によれば、実質的には、１枚のプリント基板３当たりの搬出入に要する時間を短縮することができる。
【００１３】
しかし、図５に示した方法の場合は、実装処理後に、多面取基板３ｂを各プリント基板３に分割する基板切断作業が必要になり、新たな作業工程が増えるため、大きな生産性の向上は期待できない。
【００１４】
また、図６に示した方法の場合は、新たにトレー３ｃから取り外す作業工程が新たに必要になるだけでなく、各プリント基板３を正確に位置決めできる高精度なトレー３ｃの製造が不可欠になり、大きな生産性の向上が期待できないだけでなく、トレー３ｃの製造によるコストアップを招く恐れがある。
【００１５】
このような背景から、電子部品実装機の実装処理域に、一度に複数枚のプリント基板を直接搬出入する提案もされている。
【００１６】
しかし、従来の場合、実装処理域にプリント基板を搬出入するコンベヤは、通常、搬送ベルト等の移動手段の上に単純にプリント基板を載置した状態で基板の搬送を行うもので、複数枚のプリント基板を連続して順に実装処理域に供給すると、実装処理域内でプリント基板相互が衝突した際に、一部のプリント基板同士の端部が重なって、実装処理が不可能になる恐れがある。
【００１７】
そこで、従来では、特開２０００−１１４７９９号公報にも開示のように、複数枚のプリント基板を載置する実装処理域は、予め、載置する枚数分だけ、個別に位置決めストッパや、プリント基板の有無を検出するセンサ等を設置する構成としているが、このような対応では、ストッパのセンサの多数装備によるコストアップや、制御の複雑化による信頼性の低下という問題を招く。
【００１８】
そこで、本発明の目的は上記課題を解消することにあり、実装処理域へのプリント基板の搬出入を複数枚単位で実施することで、１枚のプリント基板当たりの搬出入に要する時間を短縮できると同時に、実装域コンベヤに装備する基板位置決め用のストッパや基板検出用のセンサの装備数の増大を抑えることができ、また、実装処理後に基板の切断等の手間が不要で、安価に生産効率の大幅な向上を図ることができるプリント基板搬送方法及び装置を提供することである。
【００１９】
【課題を解決するための手段】
本発明の上記目的は、電子部品実装機における電子部品の実装処理域にプリント基板を搬出入するプリント基板搬送方法であって、前記実装処理域内で複数枚のプリント基板を搬送方向に沿って互いに端部を突き合わせて連ねた状態に載置可能な大きさの実装域コンベヤと、前記実装域コンベヤと同期運転可能で電子部品を実装処理すべきプリント基板を前工程から前記実装域コンベヤに供給する搬入コンベヤと、前記実装域コンベヤと同期運転可能で前記実装処理域で所定の実装処理を済ませた処理済みプリント基板を実装域コンベヤ上から次工程に搬出する搬出コンベヤとで、実装処理域を通るプリント基板の搬送路を形成しておき、実装域コンベヤと搬出コンベヤとを連動させて前記実装域コンベヤ上の実装処理済みプリント基板を全て搬出コンベヤに移載する基板一括搬出処理と、前記搬入コンベヤと実装域コンベヤとを連動させて前記搬入コンベヤ上のプリント基板を前記実装域コンベヤに最大載置枚数分だけ移載した後に前記実装域コンベヤ上の各プリント基板に対して電子部品の実装処理を実施させる基板一括搬入処理と、前記基板一括搬入処理による移載枚数が最大載置枚数に満たない処理途中で前記搬入コンベヤ上のプリント基板が品切れになったときに、前記基板一括搬入処理を終了して、前記実装域コンベヤに移載済みの載置枚数分に対して電子部品の実装処理を実施させる端数搬入処理とを適宜実施することで、実装処理域でのプリント基板への実装処理を複数枚ずつ行うことを特徴とするプリント基板搬送方法により達成される。
【００２０】
また、本発明の上記目的は、電子部品実装機における電子部品の実装処理域にプリント基板を搬出入するプリント基板搬送装置であって、前記実装処理域内で複数枚のプリント基板を搬送方向に沿って互いに端部を突き合わせて連ねた状態に載置可能な大きさの実装域コンベヤと、この実装域コンベヤ上の搬送方向先頭に位置するプリント基板を実装処理域端の定位置に位置決めする実装域ストッパと、前記実装域コンベヤと同期運転可能で電子部品を実装処理すべきプリント基板を前工程から前記実装域コンベヤに供給する搬入コンベヤと、この搬入コンベヤ上におけるプリント基板の存在を検出する搬入部基板検出センサと、前記搬入コンベヤ上の搬送方向先頭に位置するプリント基板を当該搬入コンベヤの先端の定位置に位置決めする搬入位置ストッパと、前記搬入コンベヤから実装域コンベヤに移載されたプリント基板の枚数を計数する搬入基板計数カウンタと、前記実装域コンベヤと同期運転可能で前記実装処理域で所定の実装処理を済ませた処理済みプリント基板を実装域コンベヤ上から次工程に搬出する搬出コンベヤと、前記実装域コンベヤから搬出コンベヤに移載された処理済みプリント基板の枚数を計数する搬出基板計数カウンタと、搬出入するプリント基板の寸法を教示する処理基板情報を入力する搬送データ入力部と、前記搬送データ入力部から入力された処理基板情報を記憶するメモリと、搬出入するプリント基板を前記実装処理域内の実装域コンベヤ上に互いに端部を突き合わせて連ねた状態で載置可能な最大載置枚数を予め入力された処理基板情報から算出する演算手段と、上記の各コンベヤや各ストッパの動作を、前記実装処理域における実装処理の進行状況と各センサ及び各カウンタの出力と前記最大載置枚数に基づいて制御することで、前記実装処理域へのプリント基板の搬出入を調整する制御装置とを備え、前記制御装置には、実装域コンベヤと搬出コンベヤとを連動させて前記実装域コンベヤ上の実装処理済みプリント基板を全て搬出コンベヤに移載する基板一括搬出処理機能と、前記搬入コンベヤと実装域コンベヤとを連動させて前記搬入コンベヤ上のプリント基板を前記実装域コンベヤに最大載置枚数分だけ移載した後に前記実装域コンベヤ上の各プリント基板に対して電子部品の実装処理を実施させる基板一括搬入処理機能と、前記基板一括搬入処理機能による移載枚数が最大載置枚数に満たない処理途中で前記搬入コンベヤ上のプリント基板が品切れになったときに、前記基板一括搬入処理機能による処理を終了して、前記実装域コンベヤに移載済みの載置枚数分に対して電子部品の実装処理を実施させる端数搬入処理機能とを備えたことを特徴とするプリント基板搬送装置により達成される。
【００２１】
そして、上記構成によれば、電子部品実装機の実装処理域に装備した実装域コンベヤ上での複数枚のプリント基板は、互いに端部を突き合わせて連ねた状態で載置するため、先頭の一枚のプリント基板さえ正確に位置決めすれば、２番目以降に載置されるプリント基板は自然に先頭に追随して位置決めされる。
【００２２】
そのため、実装域コンベヤに装備する基板位置決め用のストッパや基板検出用のセンサは、先頭のプリント基板に対するもののみに節約することができる。
【００２３】
したがって、実装処理域へのプリント基板の搬出入を複数枚単位で実施することで、１枚のプリント基板当たりの搬出入に要する時間を短縮することができ、かつ、実装域コンベヤに装備する基板位置決め用のストッパや基板検出用のセンサの装備数の増大を抑えることができる。
【００２４】
また、実装域コンベヤへの複数枚のプリント基板の載置は、多面取基板の採用による一体化や、トレーによる位置決めを利用していないため、実装処理後に、プリント基板相互の切断やトレーからの取り外し作業等が必要なく、速やかに、次工程に搬出することができる。
【００２５】
したがって、実装処理後に基板の切断等の手間が不要で、安価に生産効率の大幅な向上を図ることができる。
【００２６】
なお、好ましくは、上記のプリント基板搬送装置において、前記実装域コンベヤ及び搬入コンベヤ及び搬出コンベヤの各コンベヤに、搬送するプリント基板の両側縁の厚さ方向への変位を規制して搬送するプリント基板相互の重なりを防止する基板側縁ガイドを装備した構成とするとよい。
【００２７】
このようにすると、各コンベヤの両側に装備する単純な構造のガイド部材で、搬送時のプリント基板の浮き上がりを防止することができる。
【００２８】
したがって、実装域コンベヤに移載されたプリント基板相互が衝突等で端部が重なった状態となることを確実に防止でき、隣接するプリント基板相互が互いに端部を突き合わせて連ねた状態で位置決めされた良好な載置状態を確保することができる。
【００２９】
【発明の実施の形態】
以下、本発明に係るプリント基板搬送方法及び装置の好適な実施形態を図面に基づいて詳細に説明する。
【００３０】
図１〜図３は本発明に係るプリント基板搬送方法及び装置の一実施形態を示したもので、図１は本発明に係るプリント基板搬送装置の一実施形態の斜視図、図２は図１に示したプリント基板搬送装置のブロック図、図３は図１に示したプリント基板搬送装置で実施するプリント基板搬送方法のフローチャートである。
【００３１】
以下、一実施形態のプリント基板搬送装置３１と、この装置によって実施されるプリント基板搬送方法について、詳述する。
【００３２】
プリント基板搬送装置３１は、電子部品実装機１における電子部品の実装処理域にプリント基板３を搬出入するものである。
【００３３】
電子部品実装機１は、実装作業用のテーブル１１の上面を実装処理域としたもので、テーブル１１の上方には、実装ヘッド１２を装備している。この実装ヘッド１２は、図に矢印（ロ）で示す中心軸回りに回転可能なヘッド本体１３の下端面に、電子部品を吸着する吸着ノズル１４を複数配備した構成である。各吸着ノズル１４は、昇降可能に装備されていて、ヘッド本体１３の回転動作と各吸着ノズル１４の昇降動作の組み合わせで、図示しない電子部品供給部に供給されたチップ形の電子部品を前記実装処理域上の所望位置に移載する。
【００３４】
プリント基板搬送装置３１は、図１及び図２に示すように、テーブル１１の実装処理域内で複数枚（図では、３枚）のプリント基板３を搬送方向に沿って互いに端部を突き合わせて連ねた状態に載置可能な大きさの実装域コンベヤ３３と、この実装域コンベヤ３３上の搬送方向先頭に位置するプリント基板３を実装処理域端の定位置に位置決めする実装域ストッパ３５と、実装域コンベヤ３３上の搬送方向先頭に位置するプリント基板３の存在を検出する実装域基板検出センサ３６と、前記実装域コンベヤ３３と同期運転可能で電子部品を実装処理すべきプリント基板３を前工程から前記実装域コンベヤ３３に供給する搬入コンベヤ３７と、この搬入コンベヤ３７上におけるプリント基板３の存在を検出する複数個の搬入部基板検出センサ３９ａ，３９ｂ，……と、前記搬入コンベヤ３７上の搬送方向先頭に位置するプリント基板３を当該搬入コンベヤ３７の先端の定位置に位置決めする第１の搬入位置ストッパ４１ａと、搬入コンベヤ３７上の先頭から２番目以降のプリント基板３を位置決めする第２の搬入位置ストッパ４１ｂと、前記搬入部基板検出センサ３９ａ，３９ｂ，……の出力に基づいて前記搬入コンベヤ３７から実装域コンベヤ３３に移載されたプリント基板３の枚数を計数する搬入基板計数カウンタ４３と、前記実装域コンベヤ３３と同期運転可能で前記実装処理域で所定の実装処理を済ませた処理済みプリント基板３を実装域コンベヤ３３上から次工程に搬出する搬出コンベヤ４５と、前記実装域コンベヤ３３から搬出コンベヤ４５に移載された処理済みプリント基板３を検出する搬出部基板検出センサ４６と、この搬出部基板検出センサ４６の出力に基づいて前記実装域コンベヤ３３から搬出コンベヤ４５に移載された処理済みプリント基板３の枚数を計数する搬出基板計数カウンタ４７と、搬出入するプリント基板３の寸法等を教示する処理基板情報を入力する搬送データ入力部４９（図２参照）と、前記搬送データ入力部４９から入力された処理基板情報等を記憶するメモリ５１と、搬出入するプリント基板３を前記実装処理域内の実装域コンベヤ３３上に互いに端部を突き合わせて連ねた状態で載置可能な最大載置枚数を予め入力された処理基板情報から算出する演算手段５３と、上記の各コンベヤ３３，３７，４５や各ストッパ３５，４１ａ，４１ｂの動作を制御する制御装置５５とを備えている。
【００３５】
そして、本実施形態のプリント基板搬送装置３１の場合、上記の各コンベヤ３３，３７，４５の両側壁Ｈには、図１に拡大して示すように、搬送するプリント基板３の両側縁の厚さ方向への変位（図で矢印（ハ）方向の変位）を規制して、搬送するプリント基板３相互の重なりを防止する基板側縁ガイド５７を装備している。この基板側縁ガイド５７は、プリント基板３の搬送時や移載時に、プリント基板３同士が端部を衝突させても、端部の浮き上がりを防止して、基板同士の重なりの発生を防止する。
【００３６】
制御装置５５は、電子部品実装機１の実装処理域における実装処理の進行状況と、各センサ３６，３９ａ，３９ｂ，４６及び各カウンタ４３，４７の出力とを監視しており、これらの各センサやカウンタの出力と演算手段５３で算出した最大載置枚数等に基づいて各コンベヤ３３，３７，４５や各ストッパ３５，４１ａ，４１ｂの動作を制御することで、前記実装処理域へのプリント基板３の搬出入を調整する。
【００３７】
また、制御装置５５は、各コンベヤ３３，３７，４５によるプリント基板の移載状況に応じて、実装処理の開始を、電子部品実装機１の吸着ノズル１４を駆動するノズル駆動手段６１に指示する。
【００３８】
更に、制御装置５５は、搬入コンベヤ３７にプリント基板３を受け渡すまでの前工程の進行状況を、前工程監視装置６３からの出力信号によって検知していて、前工程で障害が発生した場合に、前記搬入コンベヤ３７上にプリント基板３が残存している時には、搬入コンベヤ３７上に残存しているプリント基板３を全て実装処理して、搬出コンベヤ４５に搬出し終えてから、搬出入処理を停止させる。
【００３９】
以上の制御装置５５は、図２にも示すように、実装域コンベヤ３３と搬出コンベヤ４５とを連動させて前記実装域コンベヤ３３上の実装処理済みプリント基板３を全て搬出コンベヤ４５に移載する基板一括搬出処理機能７１と、前記搬入コンベヤ３７と実装域コンベヤ３３とを連動させて前記搬入コンベヤ３７上のプリント基板３を前記実装域コンベヤ３３に最大載置枚数分だけ移載した後に前記実装域コンベヤ３３上の各プリント基板３に対して電子部品の実装処理を実施させる基板一括搬入処理機能７３と、前記基板一括搬入処理機能７３による移載枚数が最大載置枚数に満たない処理途中で前記搬入コンベヤ３７上のプリント基板３が品切れになったときに、前記基板一括搬入処理機能７３による処理を終了して、前記実装域コンベヤ３３に移載済みの載置枚数分に対して電子部品の実装処理を実施させる端数搬入処理機能７５とを備えて、これらの各機能を駆使することで、実装域コンベヤ３３上への複数枚単位での基板移載処理を実現する。
【００４０】
前記制御装置５５の諸機能７１，７３，７５を駆使した具体的な処理手順は、本実施形態の場合、図３に示す如きである。
【００４１】
すなわち、まず、搬送データ入力部４９から処理可能なプリント基板の最大サイズや、実際に処理するプリント基板３のサイズ、前記基板一括搬入処理機能７３で処理したい最大枚数等を指定する（ステップＳ３０１〜Ｓ３０３）。
【００４２】
ステップＳ３０１で入力する処理可能なプリント基板の最大サイズとは、実装域コンベヤ３３が実装処理域内で搬送し得る最大寸法である。ステップＳ３０１，３０２の入力を済ませると、演算手段５３が実装域コンベヤ３３上での最大載置枚数を算出する。
【００４３】
ステップＳ３０３で入力する値は、演算手段５３が算出した最大載置枚数以下の任意値を指定することができるが、このステップＳ３０３で指定がない場合には、演算手段５３の算出した最大載置枚数が指定値と見なされる。
【００４４】
搬送データ入力部４９から必要な情報の入力が終了すると、入力情報に基づいて、制御装置５５が各コンベヤ３３，３７，４５や各ストッパ３５，４１ａ，４１ｂの動作を制御して、実装域コンベヤ３３へのプリント基板３の搬出入を開始する。
【００４５】
具体的には、まず、搬入コンベヤ３７及び実装域コンベヤ３３を駆動させると共に、プリント基板搬送装置３１の先頭の搬入位置ストッパ４１ａを下降させて、プリント基板搬送装置３１の先頭に位置しているプリント基板３を実装域コンベヤ３３に移動させる（ステップＳ３０４，Ｓ３０５）。その際、各基板検出センサ３６，３９ａ，３９ｂ，４６等の出力を監視し（Ｓ３０６）、搬入コンベヤ３７の先頭のプリント基板３が実装域コンベヤ３３に移載されたら、搬入基板計数カウンタ４３を上昇させる（Ｓ３０７）。１枚のプリント基板３が搬入コンベヤ３７から実装域コンベヤ３３に移載されると、搬入基板計数カウンタ４３が計数値の＋１更新する（ステップＳ３０８）。次いで、搬入基板計数カウンタ４３の更新値を判定することによって、実装域コンベヤ３３に移載されたプリント基板３の枚数が当初の指定の最大載置枚数に達しているかどうか判定し（ステップＳ３０９）、最大載置枚数に達していない場合は、ステップＳ３１０に進んで、搬入コンベヤ３７にプリント基板３の在庫が有るか否かを判定する。
【００４６】
ステップＳ３１０で在庫があると判定された場合には、ステップＳ３０６に戻って、搬入コンベヤ３７から実装域コンベヤ３３へのプリント基板３の移載を、もう一度繰り返す。
【００４７】
ステップＳ３０９で規定数の基板の移載が完了したと判定された場合や、ステップＳ３１０で搬入コンベヤ３７上に在庫がないと判定された場合は、何れも、ステップＳ３２１に進む。
【００４８】
ステップＳ３２１は、制御装置５５からノズル駆動手段６１へ出力される実装開始信号によって実施されるもので、実装域コンベヤ３３に移載された複数枚のプリント基板３に対して電子部品実装機１の実装ヘッド１２が電子部品の実装処理を規定手順で行う。
【００４９】
以上のステップＳ３０６からステップＳ３２１の処理は、基板一括搬入処理機能７３又は端数搬入処理機能７５による。
【００５０】
ステップＳ３２１の処理が完了すると、搬出コンベヤ４５及び実装域コンベヤ３３の作動が開始されて、実装処理済みのプリント基板を実装域コンベヤ３３から搬出コンベヤ４５に移載する作業が始まる（ステップＳ３２２，Ｓ３２３）。この場合には、搬出基板計数カウンタ４７によって、実装域コンベヤ３３から搬出コンベヤ４５に移載されたプリント基板３の枚数を計数して（ステップＳ３２４）、実装域コンベヤ３３上の全てのプリント基板３が搬出コンベヤ４５に移載完了した時に、搬出基板計数カウンタ４７の計数値と、搬入基板計数カウンタ４３の計数値が一致していれば、正常終了である。
【００５１】
以上のステップＳ３２２〜Ｓ３２４の処理は、基板一括搬出処理機能７１による。
そして、ステップＳ３２４で正常終了した場合には、搬入コンベヤ３７上でのプリント基板３の在庫が確認され、在庫が有る場合にはステップＳ３０４に戻って、再び、新たな搬入処理を開始し、搬入コンベヤ３７上の在庫がない場合には、搬出入処理の終了となる（ステップＳ３２５）。
【００５２】
本実施形態のプリント基板搬送装置３１で実施したプリント基板搬送方法では、電子部品実装機１の実装処理域に装備した実装域コンベヤ３３上での複数枚のプリント基板３は、互いに端部を突き合わせて連ねた状態で載置するため、先頭の一枚のプリント基板３さえ正確に位置決めすれば、２番目以降に載置されるプリント基板３は自然に先頭に追随して位置決めされる。
【００５３】
そのため、実装域コンベヤ３３に装備する基板位置決め用のストッパや基板検出用のセンサは、先頭のプリント基板３に対するもののみに節約することができる。
【００５４】
したがって、実装処理域へのプリント基板３の搬出入を複数枚単位で実施することで、１枚のプリント基板３当たりの搬出入に要する時間を短縮することができ、かつ、実装域コンベヤ３３に装備する基板位置決め用のストッパや基板検出用のセンサの装備数の増大を抑えることができる。
【００５５】
また、実装域コンベヤ３３への複数枚のプリント基板３の載置は、多面取基板の採用による一体化や、トレーによる位置決めを利用していないため、実装処理後に、プリント基板３相互の切断やトレーからの取り外し作業等が必要なく、速やかに、次工程に搬出することができる。
【００５６】
したがって、実装処理後に基板の切断等の手間が不要で、安価に生産効率の大幅な向上を図ることができる。
【００５７】
そして、本実施形態の場合、各コンベヤ３３，３７，４５には、搬送するプリント基板３の両側縁の厚さ方向への変位を規制して搬送するプリント基板３相互の重なりを防止する基板側縁ガイド５７を装備していて、搬送時のプリント基板３の浮き上がりを防止することができる。
【００５８】
したがって、実装域コンベヤ３３に移載されたプリント基板３相互が衝突等で端部が重なった状態となることを確実に防止でき、隣接するプリント基板３相互が互いに端部を突き合わせて連ねた状態で位置決めされた良好な載置状態を確保することができる。
【００５９】
なお、上記の実施形態では、搬入コンベヤ３７上に十分の在庫が有る場合には、演算手段５３が算出した最大載置枚数でプリント基板の搬出入を繰り返す事としたが、電子部品実装機１の実装ヘッド１２の処理能力や、１枚のプリント基板当たりの実装部品数が多い場合などに応じて、実装域コンベヤ３３上に載置する基板枚数は、最大載置枚数以下の適宜値に変更設定してもよい。
【００６０】
【発明の効果】
本発明のプリント基板搬送方法及び装置によれば、電子部品実装機の実装処理域に装備した実装域コンベヤ上での複数枚のプリント基板は、互いに端部を突き合わせて連ねた状態で載置するため、先頭の一枚のプリント基板さえ正確に位置決めすれば、２番目以降に載置されるプリント基板は自然に先頭に追随して位置決めされる。
【００６１】
そのため、実装域コンベヤに装備する基板位置決め用のストッパや基板検出用のセンサは、先頭のプリント基板に対するもののみに節約することができる。
【００６２】
したがって、実装処理域へのプリント基板の搬出入を複数枚単位で実施することで、１枚のプリント基板当たりの搬出入に要する時間を短縮することができ、かつ、実装域コンベヤに装備する基板位置決め用のストッパや基板検出用のセンサの装備数の増大を抑えることができる。
【００６３】
また、実装域コンベヤへの複数枚のプリント基板の載置は、多面取基板の採用による一体化や、トレーによる位置決めを利用していないため、実装処理後に、プリント基板相互の切断やトレーからの取り外し作業等が必要なく、速やかに、次工程に搬出することができる。
【００６４】
したがって、実装処理後に基板の切断等の手間が不要で、安価に生産効率の大幅な向上を図ることができる。
【００６５】
また、請求項３に記載の構成とすると、各コンベヤの両側に装備する単純な構造のガイド部材で、搬送時のプリント基板の浮き上がりを防止することができる。
【００６６】
したがって、実装域コンベヤに移載されたプリント基板相互が衝突等で端部が重なった状態となることを確実に防止でき、隣接するプリント基板相互が互いに端部を突き合わせて連ねた状態で位置決めされた良好な載置状態を確保することができる。
【図面の簡単な説明】
【図１】本発明に係るプリント基板搬送装置の一実施形態の斜視図である。
【図２】図１に示したプリント基板搬送装置のブロック図である。
【図３】図１に示したプリント基板搬送装置で実施するプリント基板搬送方法のフローチャートである。
【図４】従来のプリント基板搬送装置の概略構成を示す斜視図である。
【図５】複数枚のプリント基板を一括して実装処理するための多面取基板の斜視図である。
【図６】複数枚のプリント基板を一括して実装処理するためにトレーを使用したプリント基板配置例を示す斜視図である。
【符号の説明】
１電子部品実装機
３プリント基板
３１プリント基板搬送装置
３３実装域コンベヤ
３５実装域ストッパ
３６実装域基板検出センサ
３７搬入コンベヤ
３９ａ，３９ｂ，…… 搬入部基板検出センサ
４１ａ，４１ｂ搬入位置ストッパ
４３搬入基板計数カウンタ
４５搬出コンベヤ
４６搬出部基板検出センサ
４７搬出基板計数カウンタ
４９搬送データ入力部
５１メモリ
５３演算手段
５５制御装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed circuit board transport method and apparatus for carrying a printed circuit board into and out of an electronic component mounting processing area in an electronic component mounting machine, and more particularly, to reduce the mounting processing time per printed circuit board and produce it. The present invention relates to an improvement for improving efficiency.
[0002]
[Prior art]
FIG. 4 shows a conventional example of the printed circuit board transport device 5 that carries the printed circuit board 3 in and out of the electronic component mounting process area in the electronic component mounting machine 1.
[0003]
The electronic component mounting machine 1 has a mounting processing area on the upper surface of a table 11 for mounting work, and a mounting head 12 is provided above the table 11. The mounting head 12 has a configuration in which a plurality of suction nozzles 14 for sucking electronic components are arranged on the lower end surface of a head main body 13 that can rotate around a central axis indicated by an arrow (A) in the drawing. Each suction nozzle 14 is mounted so as to be able to move up and down, and a chip-type electronic component supplied to an electronic component supply unit (not shown) is mounted by combining the rotation operation of the head body 13 and the lifting operation of each suction nozzle 14. Transfer to a desired position on the printed circuit board 3 in the processing area.
[0004]
The printed circuit board transport device 5 includes a mounting area conveyor 21 for moving the printed circuit board 3 within the mounting processing area on the table 11, and a printed circuit board 3 that can be operated synchronously with the mounting area conveyor 21 and on which electronic components are to be mounted. From the mounting area conveyor 21, the carry-in conveyor 23 that supplies the mounting area conveyor 21 to the mounting area conveyor 21 and the processed printed board 3 that can be operated synchronously with the mounting area conveyor 21 and that has undergone predetermined mounting processing in the mounting area. The carry-out conveyor 25 that is carried out forms a conveyance path for the printed circuit board passing through the mounting processing area, and the operation of each of the conveyors 21, 23, 25 is controlled by the control device 27.
[0005]
Each of the conveyors 21, 23, and 25 may be configured to have a variable width so that various sizes of the printed circuit board 3 can be handled as long as the dimensions are within the range of the mounting processing area on the table 11, or , It can be replaced with a conveyor of different width dimensions.
[0006]
The printed board 3 indicated by a solid line on the illustrated mounting area conveyor 21 is a board that is considerably smaller than the dimensions of the mounting processing area, and the printed board 3a indicated by a two-dot broken line on the mounting area conveyor 21 is enlarged. As shown in the figure, it is a large substrate having a size obtained by combining approximately six small substrates.
[0007]
The conventional control device 27 is based on the premise that the mounting process by the mounting head 12 is carried out in units of one board. When the mounting process on one board is completed, the board that has been mounted is transferred to the carry-out conveyor. The conveyors 21, 23, and 25 are controlled so that one substrate to be processed is supplied from the carry-in conveyor 23 to the carry-out conveyor 25.
[0008]
[Problems to be solved by the invention]
By the way, in the printed circuit board with a small number of electronic component mounting points, the mounting processing time by the mounting head 12 is completed in a considerably short time, whereas a large time is required for carrying out the processed printed circuit board 3 and carrying in a new printed circuit board. Therefore, there is a problem in that the production efficiency of the mounting board is reduced.
[0009]
Therefore, in order to shorten the time required to carry in / out such a printed board and improve the production efficiency, the method shown in FIG. 5 or FIG. 6 has been proposed.
[0010]
In the method shown in FIG. 5, when the substrate 3 to be processed is small, a plurality of printed boards 3 are integrated in such a manner that they are within the mounting processing area instead of the original printed board 3. The substrate 3b is used to process the multiple substrates 3b one by one.
[0011]
In the method shown in FIG. 6, when the substrate 3 to be processed is small, a plurality of independent printed boards 3 are arranged on a tray 3c that is within the mounting processing area.
[0012]
According to these methods, the time required for loading / unloading per printed board 3 can be substantially shortened.
[0013]
However, in the case of the method shown in FIG. 5, after the mounting process, a board cutting operation for dividing the multi-sided board 3b into each printed board 3 is required, and new work steps are increased. I can't expect it.
[0014]
Further, in the case of the method shown in FIG. 6, not only a new work process to be removed from the tray 3c is required, but also production of a highly accurate tray 3c capable of accurately positioning each printed circuit board 3 becomes indispensable. In addition to the expectation of a significant improvement in productivity, there is a risk of increasing the cost due to the manufacture of the tray 3c.
[0015]
Against this background, proposals have been made to directly carry in and out a plurality of printed circuit boards at once in a mounting processing area of an electronic component mounting machine.
[0016]
However, in the conventional case, a conveyor for carrying a printed circuit board into and out of a mounting processing area usually conveys a board with the printed circuit board simply placed on a moving means such as a conveyor belt. If the printed circuit boards are successively supplied to the mounting processing area, when the printed circuit boards collide with each other in the mounting processing area, the ends of some of the printed circuit boards may overlap and the mounting processing may become impossible. is there.
[0017]
Therefore, conventionally, as disclosed in Japanese Patent Application Laid-Open No. 2000-114799, the mounting processing area in which a plurality of printed boards are placed is previously divided into positioning stoppers and printed boards by the number to be placed. However, such a countermeasure causes problems such as an increase in cost due to a large number of stopper sensors and a decrease in reliability due to complicated control.
[0018]
Accordingly, an object of the present invention is to solve the above-mentioned problems, and by reducing the time required for loading / unloading per printed circuit board by carrying out the loading / unloading of printed circuit boards to / from the mounting processing area in units of multiple sheets. At the same time, it can suppress the increase in the number of board positioning stoppers and board detection sensors equipped on the mounting area conveyor, and it eliminates the need for cutting the board after the mounting process. It is an object of the present invention to provide a printed board carrying method and apparatus capable of greatly improving efficiency.
[0019]
[Means for Solving the Problems]
The above object of the present invention is a printed circuit board transport method for carrying a printed circuit board into and out of an electronic component mounting process area in an electronic component mounting machine, wherein a plurality of printed circuit boards are connected to each other along the transport direction in the mounting process area. A mounting area conveyor of a size that can be placed in a state in which the end portions are butted together, and a printed circuit board that can be operated synchronously with the mounting area conveyor and on which electronic components are to be mounted is supplied from the previous process to the mounting area conveyor. Passing through the mounting process area by a carry-in conveyor and a carry-out conveyor that is capable of synchronous operation with the mounting area conveyor and that has completed a predetermined mounting process in the mounting process area, and carries the processed printed board from the mounting area conveyor to the next process. A printed circuit board conveyance path is formed, and the mounting area conveyor and the carry-out conveyor are interlocked so that all the printed circuit boards on the mounting area conveyor are mounted. The mounting area after transferring the printed circuit board on the carry-in conveyor to the mounting area conveyor by the maximum number of sheets by linking the board carrying-out process to be transferred to the carry-out conveyor and the carrying-in conveyor and the mounting area conveyor. Printed circuit board on the carry-in conveyor in the middle of the process of carrying in the process of mounting the electronic components on each printed circuit board on the conveyor, and the number of transferred sheets by the process of carrying in the board in a batch does not reach the maximum number of loaded sheets When the product is out of stock, the substrate batch carry-in process is terminated, and a fraction carry-in process is executed as appropriate to carry out the electronic component mounting process for the number of sheets already transferred to the mounting area conveyor. Thus, this is achieved by a printed circuit board conveyance method characterized by performing a plurality of mounting processes on the printed circuit board in the mounting processing area.
[0020]
Another object of the present invention is a printed circuit board transport apparatus for carrying a printed circuit board into and out of an electronic component mounting process area in an electronic component mounting machine, wherein a plurality of printed circuit boards are transported in the mounting process area along the transport direction. Mounting area conveyor that has a size that can be placed in a state where the ends of the mounting area are connected to each other, and a mounting area that positions the printed circuit board located at the top in the transport direction on this mounting area conveyor at a fixed position at the end of the mounting processing area A stopper, a carry-in conveyor that can be operated synchronously with the mounting area conveyor and that is to mount electronic components from a previous process to the mounting area conveyor, and a carry-in unit that detects the presence of the printed board on the carry-in conveyor The board detection sensor and the printed circuit board positioned at the top in the transport direction on the carry-in conveyor are positioned at a fixed position at the tip of the carry-in conveyor. An in-position stopper, a carry-in board counter that counts the number of printed boards transferred from the carry-in conveyor to the mount area conveyor, and can be operated synchronously with the mount area conveyor, and a predetermined mount process is completed in the mount process area. An unloading conveyor for unloading the processed printed circuit board from the mounting area conveyor to the next process, an unloading board counter for counting the number of processed printed boards transferred from the mounting area conveyor to the unloading conveyor, and unloading Printed circuit board Dimensions Transfer data input unit for inputting processing board information to be taught and input from the transfer data input unit Processing board information The maximum number of sheets that can be placed in a state where the memory to be stored and the printed circuit board to be carried in and out are connected to each other on the mounting area conveyor in the mounting processing area are calculated from processing board information inputted in advance. The calculation means, the operation of each conveyor and each stopper, the progress of the mounting process in the mounting process area, the output of each sensor and each counter, For the maximum number And a control device that adjusts loading / unloading of the printed circuit board to / from the mounting processing area by controlling based on the control, and the control device interlocks the mounting area conveyor and the unloading conveyor on the mounting area conveyor. A substrate batch carry-out processing function for transferring all mounted printed boards to the carry-out conveyor, and the carry-in conveyor and the mount area conveyor are linked to each other so that the printed board on the carry-in conveyor is loaded on the mount area conveyor for the maximum number of sheets to be loaded. Board transfer processing function for carrying out mounting processing of electronic components on each printed circuit board on the mounting area conveyor after transfer, and the transfer number of boards by the substrate batch transfer processing function is less than the maximum number of placements When the printed circuit board on the carry-in conveyor becomes out of stock during the process, the process by the board batch carry-in process function is terminated, and the mounting area converter It is accomplished by a printed circuit board conveying apparatus characterized by comprising a fractional loading processing functions for carrying out the process of mounting the electronic component with respect to the transfer already mounting 置枚 several minutes.
[0021]
According to the above configuration, since the plurality of printed circuit boards on the mounting area conveyor provided in the mounting processing area of the electronic component mounting machine are placed with their end portions facing each other, As long as even one printed circuit board is accurately positioned, the second and subsequent printed circuit boards are naturally positioned following the head.
[0022]
For this reason, the board positioning stopper and board detection sensor provided in the mounting area conveyor can be saved only for the first printed board.
[0023]
Therefore, the time required for loading / unloading per printed board can be reduced by carrying the printed board into / out of the mounting processing area in units of multiple boards, and the board mounted on the mounting area conveyor An increase in the number of positioning stoppers and substrate detection sensors can be suppressed.
[0024]
In addition, the placement of multiple printed circuit boards on the mounting area conveyor does not use integration by adopting multiple chamfered boards or positioning by a tray. Removal work or the like is not necessary, and it can be quickly carried out to the next process.
[0025]
Therefore, it is not necessary to cut the substrate after the mounting process, and the production efficiency can be greatly improved at low cost.
[0026]
Preferably, in the above-described printed circuit board conveyance device, the printed circuit board that conveys the mounting area conveyor, the carry-in conveyor, and the carry-out conveyor by restricting displacement in the thickness direction of both side edges of the printed circuit board to be conveyed. It is preferable that the substrate side edge guide for preventing the mutual overlap is provided.
[0027]
If it does in this way, the guide member of the simple structure equipped on both sides of each conveyor can prevent the printed circuit board from being lifted at the time of conveyance.
[0028]
Therefore, it is possible to reliably prevent the printed circuit boards transferred to the mounting area conveyor from overlapping each other due to a collision or the like, and the adjacent printed circuit boards are positioned in a state where the end parts are connected to each other. A good mounting state can be ensured.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a printed circuit board conveying method and apparatus according to the invention will be described in detail with reference to the drawings.
[0030]
1 to 3 show an embodiment of a printed circuit board conveying method and apparatus according to the present invention, FIG. 1 is a perspective view of an embodiment of a printed circuit board conveying apparatus according to the present invention, and FIG. FIG. 3 is a flowchart of a printed circuit board conveying method implemented by the printed circuit board conveying apparatus shown in FIG.
[0031]
Hereinafter, the printed circuit board conveyance device 31 of one embodiment and the printed circuit board conveyance method implemented by this device will be described in detail.
[0032]
The printed circuit board transport device 31 carries the printed circuit board 3 in and out of the electronic component mounting process area in the electronic component mounting machine 1.
[0033]
The electronic component mounting machine 1 has a mounting processing area on the upper surface of a table 11 for mounting work, and a mounting head 12 is provided above the table 11. The mounting head 12 has a configuration in which a plurality of suction nozzles 14 for sucking electronic components are arranged on the lower end surface of a head main body 13 that can rotate around a central axis indicated by an arrow (b) in the drawing. Each suction nozzle 14 is mounted so as to be able to move up and down, and a chip-type electronic component supplied to an electronic component supply unit (not shown) is mounted by combining the rotation operation of the head body 13 and the lifting operation of each suction nozzle 14. Transfer to a desired position on the processing area.
[0034]
As shown in FIGS. 1 and 2, the printed circuit board transport device 31 connects a plurality of (three in the figure) printed circuit boards 3 with their end portions abutted with each other along the transport direction in the mounting processing area of the table 11. A mounting area conveyor 33 of a size that can be placed in a mounted state, a mounting area stopper 35 for positioning the printed circuit board 3 positioned at the head in the transport direction on the mounting area conveyor 33 at a fixed position at the end of the mounting processing area, and mounting A mounting area board detection sensor 36 for detecting the presence of the printed circuit board 3 positioned at the head in the transport direction on the area conveyor 33, and a printed circuit board 3 that can be operated synchronously with the mounting area conveyor 33 and on which electronic components are to be mounted are pre-processed. And a plurality of carry-in board detection sensors 3 for detecting the presence of the printed circuit board 3 on the carry-in conveyor 37. a, 39b,..., a first loading position stopper 41a for positioning the printed circuit board 3 positioned at the top in the conveying direction on the loading conveyor 37 at a fixed position at the tip of the loading conveyor 37, and the loading conveyor 37 Transfer from the carry-in conveyor 37 to the mounting area conveyor 33 based on the outputs of the second carry-in position stopper 41b for positioning the second and subsequent printed circuit boards 3 from the top and the carry-in board detection sensors 39a, 39b,. A loaded board counter 43 that counts the number of printed boards 3 and a processed printed board 3 that has been subjected to a predetermined mounting process in the mounting processing area and can be operated synchronously with the mounting area conveyor 33 on the mounting area conveyor 33. From the mounting area conveyor 33 to the unloading conveyor 45 to the next process. An unloading part board detection sensor 46 for detecting the board 3 and an unloading process for counting the number of processed printed boards 3 transferred from the mounting area conveyor 33 to the unloading conveyor 45 based on the output of the unloading part board detection sensor 46 A substrate count counter 47, a transport data input unit 49 (see FIG. 2) for inputting processing substrate information that teaches the dimensions and the like of the printed circuit board 3 to be carried in and out, and processing substrate information input from the transport data input unit 49, etc. A processing board in which the maximum number of sheets that can be placed in a state where the end portions of the printed circuit board 3 to be carried in and out are connected to each other on the mounting area conveyor 33 in the mounting processing area is input in advance. An arithmetic means 53 that calculates from information, and a control device 55 that controls the operations of the conveyors 33, 37, and 45 and the stoppers 35, 41a, and 41b are provided. Yes.
[0035]
In the case of the printed circuit board transport device 31 of the present embodiment, the thicknesses of both side edges of the printed circuit board 3 to be transported are shown on both side walls H of the conveyors 33, 37, and 45 as shown in an enlarged view in FIG. A board-side edge guide 57 that restricts displacement in the vertical direction (displacement in the direction of the arrow (c) in the figure) and prevents the printed boards 3 to be conveyed from overlapping each other is provided. The substrate side edge guide 57 prevents the end portions from rising and prevents the substrates from overlapping each other even when the printed circuit boards 3 collide with each other when the printed circuit boards 3 are transported or transferred. .
[0036]
The control device 55 monitors the progress of the mounting process in the mounting processing area of the electronic component mounting machine 1 and the outputs of the sensors 36, 39a, 39b, 46 and the counters 43, 47. And the operation of the conveyors 33, 37, 45 and the stoppers 35, 41a, 41b based on the output of the counter and the maximum number of loaded sheets calculated by the calculation means 53, etc. Adjust the loading / unloading of 3.
[0037]
Further, the control device 55 instructs the nozzle driving means 61 that drives the suction nozzle 14 of the electronic component mounting machine 1 to start the mounting process according to the transfer state of the printed board by the conveyors 33, 37, and 45. .
[0038]
Further, the control device 55 detects the progress of the previous process until the printed circuit board 3 is delivered to the carry-in conveyor 37 by the output signal from the previous process monitoring device 63, and when a failure occurs in the previous process. When the printed circuit board 3 remains on the carry-in conveyor 37, all the printed circuit boards 3 remaining on the carry-in conveyor 37 are mounted, and after being carried out to the carry-out conveyor 45, the carry-in / out process is performed. Stop.
[0039]
As shown in FIG. 2, the above-described control device 55 moves the mounting area conveyor 33 and the carry-out conveyor 45 together to transfer all the mounted printed boards 3 on the mounting area conveyor 33 to the carry-out conveyor 45. After the substrate batch carry-out processing function 71, the carry-in conveyor 37 and the mounting area conveyor 33 are interlocked, the printed circuit board 3 on the carry-in conveyor 37 is transferred to the mounting area conveyor 33 by the maximum number of sheets to be mounted. A substrate batch carry-in processing function 73 for performing the electronic component mounting process on each printed circuit board 3 on the area conveyor 33, and a process in which the number of sheets transferred by the substrate batch carry-in processing function 73 is less than the maximum placement number. When the printed circuit board 3 on the carry-in conveyor 37 is out of stock, the processing by the substrate batch carry-in processing function 73 is terminated, and the mounting area conveyor 3 is equipped with a fraction carrying-in processing function 75 for carrying out the electronic component mounting process for the number of sheets that have been transferred, and by using these functions, a plurality of sheets are mounted on the mounting area conveyor 33. Realizes substrate transfer processing in units.
[0040]
A specific processing procedure using the various functions 71, 73, 75 of the control device 55 is as shown in FIG. 3 in the case of this embodiment.
[0041]
That is, first, the maximum size of the printed circuit board that can be processed, the size of the printed circuit board 3 that is actually processed, the maximum number of sheets to be processed by the substrate batch carry-in processing function 73, and the like are designated from the transport data input unit 49 (steps S301 to S301). S303).
[0042]
The maximum size of the processable printed circuit board input in step S301 is the maximum dimension that the mounting area conveyor 33 can convey in the mounting processing area. When the input in steps S301 and S302 is completed, the calculation means 53 calculates the maximum number of sheets to be placed on the mounting area conveyor 33.
[0043]
As the value input in step S303, an arbitrary value equal to or less than the maximum placement number calculated by the computing unit 53 can be designated. However, if there is no designation in this step S303, the maximum placement calculated by the computing unit 53 is specified. The number of sheets is considered the specified value.
[0044]
When the input of necessary information from the transport data input unit 49 is completed, the control device 55 controls the operations of the conveyors 33, 37, 45 and the stoppers 35, 41a, 41b based on the input information, and the mounting area conveyor The loading / unloading of the printed circuit board 3 to / from 33 is started.
[0045]
Specifically, first, the carry-in conveyor 37 and the mounting area conveyor 33 are driven, and the print-in position stopper 41a at the top of the printed board transport device 31 is lowered to print the print located at the top of the print board transport device 31. The substrate 3 is moved to the mounting area conveyor 33 (steps S304 and S305). At that time, the outputs of the board detection sensors 36, 39a, 39b, 46, etc. are monitored (S306). When the top printed board 3 of the carry-in conveyor 37 is transferred to the mounting area conveyor 33, the carry-in board counter 43 is set. Increase (S307). When one printed board 3 is transferred from the carry-in conveyor 37 to the mounting area conveyor 33, the carry-in board counter 43 updates the count value by +1 (step S308). Next, by determining the updated value of the carry-in board counter 43, it is determined whether or not the number of printed boards 3 transferred to the mounting area conveyor 33 has reached the initially specified maximum number (step S309). If the maximum number of loaded sheets has not been reached, the process proceeds to step S310 to determine whether or not the printed board 3 is in stock on the carry-in conveyor 37.
[0046]
If it is determined in step S310 that there is an inventory, the process returns to step S306, and the transfer of the printed circuit board 3 from the carry-in conveyor 37 to the mounting area conveyor 33 is repeated once more.
[0047]
If it is determined in step S309 that the transfer of the specified number of substrates has been completed, or if it is determined in step S310 that there is no stock on the carry-in conveyor 37, the process proceeds to step S321.
[0048]
Step S321 is performed by a mounting start signal output from the control device 55 to the nozzle driving means 61, and the electronic component mounting machine 1 is applied to the plurality of printed circuit boards 3 transferred to the mounting area conveyor 33. The mounting head 12 performs the electronic component mounting process according to a specified procedure.
[0049]
The processing from step S306 to step S321 is performed by the substrate batch loading processing function 73 or the fraction loading processing function 75.
[0050]
When the process of step S321 is completed, the operation of the carry-out conveyor 45 and the mounting area conveyor 33 is started, and the work of transferring the printed circuit board after the mounting process from the mounting area conveyor 33 to the carry-out conveyor 45 starts (steps S322 and S323). ). In this case, the number of printed circuit boards 3 transferred from the mounting area conveyor 33 to the unloading conveyor 45 is counted by the unloading board counting counter 47 (step S324), and all the printed circuit boards 3 on the mounting area conveyor 33 are counted. When the transfer to the carry-out conveyor 45 is completed, if the count value of the carry-out substrate count counter 47 and the count value of the carry-in substrate count counter 43 coincide with each other, the process ends normally.
[0051]
The processing in steps S322 to S324 described above is performed by the substrate batch carry-out processing function 71.
If the process is normally completed in step S324, the inventory of the printed circuit board 3 on the carry-in conveyor 37 is confirmed. If there is a stock, the process returns to step S304 to start a new carry-in process again. If there is no inventory on the conveyor 37, the carry-in / out process ends (step S325).
[0052]
In the printed circuit board conveying method performed by the printed circuit board conveying apparatus 31 of the present embodiment, the plurality of printed circuit boards 3 on the mounting area conveyor 33 provided in the mounting processing area of the electronic component mounting machine 1 are end to face each other. Therefore, if only the first printed circuit board 3 is accurately positioned, the second and subsequent printed circuit boards 3 are naturally positioned following the top.
[0053]
Therefore, the substrate positioning stopper and the substrate detection sensor provided in the mounting area conveyor 33 can be saved only for the first printed circuit board 3.
[0054]
Therefore, by carrying out the loading / unloading of the printed circuit board 3 to / from the mounting processing area in units of a plurality of sheets, the time required for loading / unloading per printed circuit board 3 can be shortened, and the mounting area conveyor 33 It is possible to suppress an increase in the number of equipped substrate positioning stoppers and substrate detection sensors.
[0055]
In addition, the mounting of the plurality of printed circuit boards 3 on the mounting area conveyor 33 does not use integration by adopting a multi-circuit board or positioning by a tray. There is no need to remove the tray and the like can be quickly carried out to the next process.
[0056]
Therefore, it is not necessary to cut the substrate after the mounting process, and the production efficiency can be greatly improved at low cost.
[0057]
In the case of the present embodiment, the conveyors 33, 37, and 45 each have a substrate side that prevents the overlapping of the printed circuit boards 3 to be conveyed by restricting the displacement in the thickness direction of both side edges of the printed circuit board 3 to be conveyed. Since the edge guide 57 is provided, it is possible to prevent the printed board 3 from being lifted during conveyance.
[0058]
Accordingly, it is possible to reliably prevent the printed circuit boards 3 transferred to the mounting area conveyor 33 from overlapping each other due to a collision or the like, and the adjacent printed circuit boards 3 are connected to each other with their end parts aligned. Thus, it is possible to ensure a good placement state that is positioned in step (b).
[0059]
In the above embodiment, when there is sufficient stock on the carry-in conveyor 37, the printed circuit board is repeatedly carried in and out with the maximum number of sheets calculated by the calculation means 53. However, the electronic component mounting machine 1 The number of substrates placed on the mounting area conveyor 33 is changed to an appropriate value equal to or less than the maximum number of placements depending on the processing capacity of the mounting head 12 and the case where there are many mounting parts per printed board. It may be set.
[0060]
【The invention's effect】
According to the printed circuit board transport method and apparatus of the present invention, a plurality of printed circuit boards on a mounting area conveyor equipped in a mounting processing area of an electronic component mounting machine are placed in a state in which their end portions are brought into contact with each other. For this reason, if even the first printed circuit board is accurately positioned, the second and subsequent printed circuit boards are naturally positioned following the top.
[0061]
For this reason, the board positioning stopper and board detection sensor provided in the mounting area conveyor can be saved only for the first printed board.
[0062]
Therefore, the time required for loading / unloading per printed board can be reduced by carrying the printed board into / out of the mounting processing area in units of multiple boards, and the board mounted on the mounting area conveyor An increase in the number of positioning stoppers and substrate detection sensors can be suppressed.
[0063]
In addition, the placement of multiple printed circuit boards on the mounting area conveyor does not use integration by adopting multiple chamfered boards or positioning by a tray. Removal work or the like is not necessary, and it can be quickly carried out to the next process.
[0064]
Therefore, it is not necessary to cut the substrate after the mounting process, and the production efficiency can be greatly improved at low cost.
[0065]
In addition, with the configuration described in claim 3, it is possible to prevent the printed circuit board from being lifted during conveyance with a guide member having a simple structure provided on both sides of each conveyor.
[0066]
Therefore, it is possible to reliably prevent the printed circuit boards transferred to the mounting area conveyor from overlapping each other due to a collision or the like, and the adjacent printed circuit boards are positioned in a state where the end parts are connected to each other. A good mounting state can be ensured.
[Brief description of the drawings]
FIG. 1 is a perspective view of an embodiment of a printed circuit board transport apparatus according to the present invention.
FIG. 2 is a block diagram of the printed circuit board conveyance device shown in FIG.
FIG. 3 is a flowchart of a printed circuit board conveyance method performed by the printed circuit board conveyance apparatus shown in FIG. 1;
FIG. 4 is a perspective view showing a schematic configuration of a conventional printed circuit board transport device.
FIG. 5 is a perspective view of a multi-sided board for mounting a plurality of printed boards together.
FIG. 6 is a perspective view showing a printed circuit board arrangement example in which a tray is used for collectively mounting a plurality of printed circuit boards.
[Explanation of symbols]
1 Electronic component mounting machine
3 Printed circuit board
31 Printed circuit board transport device
33 Mounting area conveyor
35 Mounting area stopper
36 Mounting area board detection sensor
37 Carry-in conveyor
39a, 39b, ... carry-in board detection sensor
41a, 41b Loading position stopper
43 Loading board counter
45 Unloading conveyor
46 Unloading part board detection sensor
47 Unloading board counter
49 Transfer data input section
51 memory
53 Calculation means
55 Control device

Claims

A printed circuit board conveying method for carrying a printed circuit board into and out of an electronic component mounting processing area in an electronic component mounting machine,
Within the mounting processing area, a plurality of printed circuit boards can be mounted in a state where the printed circuit boards are connected to each other along the conveying direction, and an electronic component that can be operated synchronously with the mounting area conveyor. A carry-in conveyor that supplies a printed circuit board to be mounted from the previous process to the mounting area conveyor, and a processed printed circuit board that has been subjected to a predetermined mounting process in the mounting processing area and can be operated synchronously with the mounting area conveyor. With the carry-out conveyor to carry out from the top to the next process, a printed circuit board conveyance path that passes through the mounting processing area is formed,
A substrate batch carry-out process in which the mounting area conveyor and the carry-out conveyor are linked to transfer all the printed circuit boards on the mount area conveyor to the carry-out conveyor, and the carry-in conveyor and the mount area conveyor are linked in the carry-in A substrate batch carrying-in process in which a mounting process of electronic components is performed on each printed circuit board on the mounting area conveyor after the printed board on the conveyor is transferred to the mounting area conveyor by the maximum number of sheets, and the substrate batch When the printed board on the carry-in conveyor is out of stock in the middle of the process when the number of sheets transferred by the carry-in process is less than the maximum number of sheets to be loaded, the board batch-loading process is completed and transferred to the mounting area conveyor. By appropriately performing the fraction loading process that implements the electronic component mounting process for the number of mounted sheets, the mounting process on the printed circuit board in the mounting process area is performed. Printed substrate transfer method which is characterized in that one by plural.

A printed circuit board transport device for carrying a printed circuit board into and out of an electronic component mounting processing area in an electronic component mounting machine,
A mounting area conveyor having a size capable of placing a plurality of printed circuit boards in a state in which the end portions of the printed circuit boards are connected to each other along the conveying direction in the mounting area, and is positioned at the beginning of the conveying direction on the mounting area conveyor. A mounting area stopper for positioning the printed circuit board at a fixed position at the end of the mounting process area, and a carry-in conveyor for supplying a printed circuit board on which electronic components are to be mounted and processed from the previous process to the mounting area conveyor. A carry-in board detection sensor for detecting the presence of a printed board on the carry-in conveyor, a carry-in position stopper for positioning a print board located at the top in the carrying direction on the carry-in conveyor at a fixed position at the tip of the carry-in conveyor, A carry-in board counter for counting the number of printed boards transferred from the carry-in conveyor to the mounting area conveyor; The printed circuit board that has been subjected to a predetermined mounting process in the mounting processing area and can be operated synchronously with the area conveyor, and is transferred from the mounting area conveyor to the next process. and unloading the substrate counting counter for counting the number of processed printed circuit board, a transport data input unit for inputting processing board information for teaching the size of the printed circuit board for loading and unloading, the substrate information inputted from said transport data input unit The maximum number of sheets that can be placed in a state where the memory to be stored and the printed circuit board to be carried in and out are connected to each other on the mounting area conveyor in the mounting processing area are calculated from processing board information inputted in advance. The calculation means, the operation of each conveyor and each stopper, the progress of the mounting process in the mounting process area, each sensor and each counter By controlling on the basis of the maximum loading置枚number and output, and a control device for adjusting the loading and unloading of printed circuit board to the mounting processing zone,
The control device includes a substrate batch carry-out processing function for transferring all the mounted printed boards on the mounting area conveyor to the carry-out conveyor by interlocking the mounting area conveyor and the carry-out conveyor, and the carry-in conveyor and the mount area conveyor. In conjunction with the circuit board, the printed circuit board on the carry-in conveyor is transferred to the mounting area conveyor by a maximum number of sheets, and then the electronic components are mounted on each printed circuit board on the mounting area conveyor. When the printed circuit board on the carry-in conveyor is out of stock during the process in which the transfer number by the carry-in process function and the substrate batch carry-in process function is less than the maximum number of loaded sheets, the process by the substrate batch carry-in process function is performed. And a fraction carry-in processing function for carrying out the electronic component mounting process for the number of sheets that have been transferred to the mounting area conveyor. PCB conveying apparatus according to claim.

Each of the mounting area conveyor, the carry-in conveyor, and the carry-out conveyor is equipped with board side edge guides that prevent displacement between printed boards to be conveyed by restricting displacement in the thickness direction of both side edges of the printed boards to be conveyed. The printed circuit board conveying apparatus according to claim 2, wherein