JP2011054900A - Component mounting machine, and component mounting line - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To shorten a tact time or a processing cycle time. <P>SOLUTION: A component mounting machine includes a first head unit 3 for mounting components on a substrate in a first mounting position P1, a second head unit 4 for mounting components on the substrate in a second mounting position P2 which is downstream side of the first mounting position P1 in a substrate conveying direction X2, and a decision means for determining whether the substrate can be conveyed from the first mounting position P1 to the second mounting position P2. The components allowed to be mounted by the first head unit 3 and the components allowed to be mounted by the second head unit 4 are common at least part of the components, and which of the first head unit 3 and the second head unit 4 is used for mounting the common component is determined based on the decision results of the decision means, and the mounting of the common component is suitably distributed between the first mounting means and the second mounting means according to the decision results to shorten the tact time. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a technique for mounting components on a board at each mounting position while transferring the board between a plurality of mounting positions.

  Conventionally, components are mounted on a substrate while the substrate is transported in a predetermined transport direction. For example, in the electronic component mounting apparatus disclosed in Patent Document 1, two mounting stages are provided side by side in the substrate transport direction, and component mounting is performed on each of the upstream mounting stage and the downstream mounting stage in the substrate transport direction. Executed. Specifically, in the upstream side mounting stage, component mounting is performed on the board transported from the upstream side in the board transport direction. Then, the board on which the component mounting on the upstream stage is completed is conveyed to the downstream mounting stage. Subsequently, in the downstream mounting stage, component mounting is further performed on the board on which the component mounting in the upstream stage has been completed. In this way, a board on which predetermined components are mounted can be produced.

JP 2000-068691 A

  By the way, in order to shorten the tact time in the configuration as described above, it is preferable to transport the substrate on which the component mounting is completed at the mounting position as soon as possible from the mounting position to the downstream side in the substrate transport direction. This is because by doing so, a new board can be received at the mounting position from the upstream side in the board conveyance direction, and subsequent component mounting can be started quickly. However, depending on the situation on the downstream side of the mounting position, it is not always possible to transfer the board on which component mounting has been completed immediately to the downstream side in the board transfer direction. It is necessary to let For this reason, the standby time of the substrate greatly affects the tact time, and as a result, the tact time may be increased.

  The present invention has been made in view of the above-described problems, and has an object to shorten the tact time.

  In order to achieve the above object, the component mounter according to the present invention mounts a component at the first mounting position on the substrate that has been transported from the upstream side in the substrate transport direction to the first mounting position. The mounting means and a second mounting position for mounting the component on the board transported from the first mounting position to the second mounting position at the second mounting position downstream in the board transport direction with respect to the first mounting position. Mounting means, determination means for determining whether or not the board at the first mounting position can be transported from the first mounting position toward the downstream side in the board transport direction, and component mounting of the first mounting means and the second mounting means A component that can be mounted by the first mounting means and a component that can be mounted by the second mounting means are at least partially common, and the control means includes the first mounting means and the second mounting means. A common component that can be mounted in common by the mounting means is the first mounting means. Whether to implement in any spare second mounting means it is characterized by determining based on the determination result of the determination means.

  In the invention thus configured (component mounting machine), the first mounting means for mounting the component on the board at the first mounting position, and the second mounting position downstream of the first mounting position in the board transport direction. Second mounting means for mounting components on the board is provided. Therefore, after the component is mounted on the substrate by the first mounting means at the first mounting position, the component can be further mounted on the substrate by the second mounting means at the second mounting position. At this time, the board on which component mounting is executed at the first mounting position is transported from the first mounting position toward the downstream side in the board transport direction in order to receive component mounting at the second mounting position. It becomes. However, depending on the situation downstream of the first mounting position in the substrate transport direction, the substrate cannot be transported from the first mounting position toward the downstream side of the substrate transport direction, so it is necessary to wait for the substrate at the first mounting position. In some cases, this waiting time has a great influence on the tact time.

  Accordingly, the present invention has the following configuration in order to cope with such a problem. That is, in the present invention, the component that can be mounted by the first mounting means and the component that can be mounted by the second mounting means are at least partially common, in other words, the first mounting means and the second mounting means. Can mount components common to each other (common components). In addition, the present invention includes a determination unit that determines whether or not the substrate at the first mounting position can be transported from the first mounting position toward the downstream side in the substrate transport direction. Based on this, it is determined which of the first mounting means and the second mounting means is to mount the common component. Therefore, by distributing the mounting of the common component between the first mounting means and the second mounting means according to the determination result of the determination means, the influence of the waiting time of the board at the first mounting position on the tact time is reduced. Thus, the tact time can be shortened.

  At this time, if the substrate cannot be moved from the first mounting position to the second mounting position, the determination unit determines that the substrate cannot be transported from the first mounting position, while moving from the first mounting position to the second mounting position. If the substrate can be moved, it may be determined that the substrate can be transported from the first mounting position. By distributing the mounting of common components between the first mounting means and the second mounting means in accordance with the determination result, the influence of the waiting time of the board at the first mounting position on the tact time is reduced, and the tact time is reduced. Time can be shortened.

  In addition, when the determination unit determines that the substrate cannot be transported from the first mounting position, the control unit causes the substrate to stand by at the first mounting position, and common components for the substrate waiting at the first mounting position. The component mounting may be performed by the first mounting means. In such a configuration, mounting of the common component is executed by the first mounting means on the board waiting at the first mounting position. Therefore, since it is not necessary to mount the common component that has been mounted during the standby at the first mounting position by the second mounting unit at the second mounting position, the component by the second mounting unit at the second mounting position. The time required for mounting can be shortened. As described above, by mounting the common components on the board that is waiting at the first mounting position, it is possible to effectively use the waiting time of the board at the first mounting position and to shorten the tact time. Yes.

  In addition, when the determination unit determines that the substrate can be transported from the first mounting position, if there is an unmounted common component with respect to the substrate at the first mounting position, the control unit You may comprise so that mounting of a common component may be performed by the 2nd mounting means with respect to the board | substrate conveyed from the 1st mounting position to the 2nd mounting position. In such a configuration, even when some common components are not mounted on the substrate at the first mounting position when the determination unit determines that the substrate can be transported from the first mounting position, For the common components for mounting, the second mounting means mounts on the substrate at the second mounting position. Therefore, since the first mounting means does not need to mount the unmounted common component at the first mounting position, the time required for component mounting by the first mounting means at the first mounting position can be shortened, and the tact time can be reduced. Can be shortened.

  In addition, when the determination unit determines that the substrate can be transported from the first mounting position, the control unit determines the components to be mounted by the first mounting unit prior to transporting the substrate from the first mounting position. It is confirmed whether or not all of the parts exclusive to the first mounting means other than the common parts are already mounted on the substrate at the first mounting position. The mounting of the unmounted first mounting means dedicated component may be continued on the first mounting position on the substrate at the first mounting position so that the mounting of all the first mounting means dedicated components is completed. . With this configuration, the mounting of the first mounting means dedicated component on the substrate by the first mounting means can be completed with certainty.

  The first mounting means and the second mounting means further include prediction means for predicting whether or not a part breakage occurs in at least a part of the common parts, and the control means includes a part breakage prediction means that the part breakage prediction means The mounting of the common component that is predicted may be executed by one of the first mounting means and the second mounting means that is not predicted to cause the common component to run out. In such a configuration, when a component shortage is predicted by either the first mounting means or the second mounting means, the subsequent mounting of the common component where the component shortage is expected is not predicted. Implementation means execute. Therefore, it is possible to reduce the tact time by reducing the frequency of the component replenishment operation such as interrupting the mounting operation of the component mounter for replenishment of the component when the component runs out.

  In order to achieve the above object, the component mounting line according to the present invention includes a first mounter that mounts components at a predetermined mounting position on a substrate transported from the upstream side in the substrate transport direction. A second mounting machine for mounting components on the board transported from the first mounting machine on the downstream side of the board mounting direction with respect to the first mounting machine, and a board at a mounting position of the first mounting machine And a control device for controlling component mounting of the first mounting machine and the second mounting machine, wherein the first mounting machine includes a determination device that determines whether or not it can be transferred from the mounting position toward the downstream side in the board transfer direction. The components that can be mounted by the mounting machine and the components that can be mounted by the second mounting machine are at least partially in common, and the control device includes common components that can be mounted by both the first mounting machine and the second mounting machine. Whether to mount on the first mounting machine or the second mounting machine It is characterized by determining based on the judgment result of the device.

  In the invention thus configured (component mounting line), the first mounting machine that mounts components at a predetermined mounting position, and the first mounting machine downstream from the first mounting machine in the board transport direction. A second mounting machine for mounting components on the conveyed board is provided. Therefore, after the first mounting machine performs component mounting on the board at a predetermined mounting position, the second mounting machine can further mount components on the board. At this time, the board on which the component mounting is executed at the mounting position in the first mounting machine receives the component mounting in the second mounting machine, so that the board mounting direction downstream from the mounting position in the first mounting machine. It will be conveyed toward the side. However, depending on the situation downstream of the first mounting position in the board transport direction, the board cannot be transported from the mounting position of the first mounting machine toward the downstream side of the board transport direction. There is a need to wait the substrate at the position, and this waiting time may greatly affect the tact time.

  Accordingly, the present invention has the following configuration in order to cope with such a problem. That is, in the present invention, the component that can be mounted on the first mounting machine and the component that can be mounted on the second mounting machine are at least partially in common, in other words, the first mounting machine and the second mounting machine. Can mount components common to each other (common components). Moreover, the present invention includes a determination device that determines whether or not the substrate at the mounting position of the first mounting machine can be transported from the mounting position toward the downstream side in the substrate transport direction. Based on the result, it is determined which of the first mounting machine and the second mounting machine is to mount the common component. Therefore, by distributing the mounting of the common component between the first mounting machine and the second mounting machine according to the determination result of the determination apparatus, the waiting time of the board at the mounting position of the first mounting machine is given to the tact time. It is possible to reduce the influence and shorten the tact time.

  It is possible to reduce the tact time by reducing the influence of the waiting time of the substrate at the mounting position on the tact time.

It is a top view which shows one form of the surface mounter which can apply this invention. It is a top view which shows one form of the surface mounter which can apply this invention. FIG. 3 is a block diagram showing an electrical configuration of the surface mounter shown in FIGS. 1 and 2. It is a flowchart which shows component mounting operation | movement of the 1st head unit in 1st Embodiment. It is a flowchart which shows component mounting operation | movement of the 2nd head unit in 1st Embodiment. It is a figure which shows the component mounting example performed when the 2nd mounting position is vacant. It is a figure which shows the example of component mounting performed when the mounted board | substrate in which all the component mounting was completed in the 2nd mounting position is waiting. FIG. 10 is a diagram illustrating an example of a mounting operation when a mounted substrate is transported from the second mounting position during mounting at the first mounting position, although the mounted substrate is initially waiting at the second mounting position. It is a flowchart which shows the components mounting operation | movement of the 2nd head unit in 2nd Embodiment. It is a figure which shows the example of component mounting performed when a part cut is anticipated in some common components which can mount 2nd head unit. It is a schematic diagram which shows one form of the component mounting line which can apply this invention. It is a flowchart which shows the component mounting operation performed with the surface mounting machine 200 or the surface mounting machine 300 in 3rd Embodiment. It is a figure which shows the example of component mounting which can be performed with the flowchart of FIG.

First Embodiment FIGS. 1 and 2 are both plan views showing one embodiment of a surface mounter to which the present invention can be applied. In these drawings, an X direction parallel to the substrate transport direction and a Y direction perpendicular to the X direction are shown. The X-direction arrow X1 faces the upstream side in the substrate transport direction, and the X-direction arrow X2 faces the downstream side in the substrate transport direction. Further, the arrow Y1 in the Y direction faces one side in the Y direction, and the arrow Y2 in the Y direction faces the other side in the Y direction. The surface mounting machine 100 has a configuration capable of mounting components on two boards 1a and 1b at a time. More specifically, the two boards 1a and 1b are carried into the machine (FIG. 1). Then, the boards 1a and 1b are positioned at the mounting positions P1 and P2 (FIG. 2), and components are mounted on the boards 1a and 1b at the mounting positions P1 and P2.

  FIG. 3 is a block diagram showing an electrical configuration of the surface mounter shown in FIGS. 1 and 2. As shown in FIG. 3, the electrical configuration of the surface mounter 100 includes a substrate transfer device control unit 102, a first head, in addition to a main control unit 101 for comprehensively controlling each part of the surface mounter 100. A unit controller 103 and a second head unit controller 104 are provided. The substrate transfer device control unit 102 controls a substrate transfer device 2 to be described later, and controls substrate transfer. Further, the first and second head unit controllers 103 and 104 control first and second head units 3 and 4 to be described later, and control the mounting of components on the transported board. Furthermore, the electrical configuration of the surface mounter 100 is provided with a communication unit 105 for communicating with a host computer and other external devices. Then, the main control unit 101 controls the substrate transfer device control unit 102 and the head unit control unit 103 based on the external information obtained through the communication unit 105, so that an appropriate operation according to the external information is performed. The transfer device 2 and the first and second head units 3 and 4 can be executed. Further, the main control unit 101 can confirm the presence / absence of the substrate at the first mounting position P1 based on the detection result of the substrate detection sensor provided in the vicinity of the first mounting position P1, and the vicinity of the second mounting position P2. The presence or absence of the substrate at the second mounting position P2 can be confirmed on the basis of the detection result of the substrate detection sensor provided on the substrate.

  As shown in FIGS. 1 and 2, the surface mounter 100 includes a substrate transfer device 2 that extends in the X direction, and a first head unit 3 and a second head unit 4 that are movable in the XY direction above the substrate transfer device 2. And. Each of the substrate transfer device 2, the first head unit 3 and the second head unit 4 is disposed on a base 5. A plurality of tape feeders 6 are arranged in the X direction as component supply units for supplying components at both ends of the base 5 on the Y direction side. The first head unit 3 mounts components supplied from the Y1 side tape feeder in the Y direction, and the second head unit 4 mounts components supplied from the Y2 side tape feeder in the Y direction.

  The substrate transfer device 2 includes a first conveyor unit 21, a second conveyor unit 22, and a third conveyor unit 23 that are arranged in the X direction. And the board | substrate conveyance apparatus 2 carries out the operation | movement of these conveyor units 21, 22, and 23, carries in board | substrate 1a, 1b to X direction, or carries out board | substrate 1a, 1b to mounting position P1, P2. Or positioning. Details are as follows.

  The first conveyor unit 21 includes a pair of conveyors 211 and 212 arranged at intervals in the Y direction, and the second conveyor unit 22 includes a pair of conveyors 221 and 222 arranged at intervals in the Y direction. 23 includes a pair of conveyors 231 and 232 arranged at intervals in the Y direction. In addition, the substrate transport device 2 is provided with two transport motors 80 and 81 that generate driving force for transporting the substrates 1a and 1b in the X direction (to the X2 side in the X direction). . Of these transport motors 80 and 81, the transport motor 80 is provided to drive the first and second conveyor units 21 and 22. That is, in response to the driving force of the conveyance motor 80, the conveyance belts of the conveyors 211 and 212 of the first conveyor unit 21 and the conveyance belts of the conveyors 221 and 222 of the second conveyor unit 22 are synchronized with each other in the X direction. It is conveyed to. On the other hand, the conveyance motor 81 is provided to drive the third conveyor unit 23. That is, the conveyor belts of the conveyors 231 and 232 of the third conveyor unit 23 are synchronously conveyed in the X direction by receiving the driving force of the conveyance motor 81.

  Of the conveyors 211 and 212 of the first conveyor unit 21, the Y2 side conveyor 212 in the Y direction is fixed to the base 5 in the vicinity of the tape feeder 6 provided on the Y2 side in the Y direction. On the other hand, the Y2 side conveyor 212 in the Y direction is configured to be movable in the Y direction with respect to the base 5 as the ball screw shaft 213a rotates. Accordingly, the substrate motor control unit 102 controls a drive motor (not shown) that drives the ball screw shaft 213a, thereby adjusting the intervals in the Y direction of the conveyors 211 and 212 according to the widths of the substrates 1a and 1b. can do. Then, in a state where the intervals between the conveyors 211 and 212 are adjusted in accordance with the substrates 1a and 1b, the substrate conveyor control unit 102 appropriately controls the conveyor motor 80, so that the first conveyor unit 21 is the surface mounter 100. Upon receiving the substrates 1a and 1b from the outside, the substrates 1a and 1b are transferred to the second conveyor unit 22 at the substrate delivery position P3.

  Of the conveyors 221 and 222 of the second conveyor unit 22, the Y1 side conveyor 221 in the Y direction moves in the Y direction independently of the Y2 side conveyor 222 in response to the driving force from the rotary motor 82. It is configured freely. Therefore, by controlling the rotation of the rotary motor 82 by the substrate transport device control unit 102, the interval between the conveyors 221 and 222 in the Y direction can be adjusted according to the widths of the substrates 1a and 1b. Then, in a state in which the interval between the conveyors 221 and 222 is adjusted according to the widths of the substrates 1a and 1b, the substrate transport device controller 102 appropriately controls the drive motor 83 and the transport motor 80, whereby the second conveyor unit 22 1 can receive the substrates 1a and 1b from the first conveyor unit 21 and can pass the substrates 1a and 1b to the third conveyor unit at the substrate delivery position P3 shown in FIG. Further, the conveyors 221 and 222 of the second conveyor unit 22 are configured to be movable in the Y direction while receiving the driving force from the driving motor 83 and maintaining their respective intervals. Therefore, when the substrate transport device control unit 102 appropriately controls the drive motor 83 and the transport motor 80, the second conveyor unit 22 can position the substrates 1a and 1b at the substrate delivery position P3 or the first mounting position P1. it can. Since the second conveyor unit 22 is configured as described above, the second conveyor unit 22 receives the unmounted boards 1a and 1b from the first conveyor unit 21 at the board delivery position P3, and moves and positions them to the first mounting position P1. The boards 1a and 1b that have been mounted at the first mounting position P1 can be returned to the board delivery position P3 and transferred to the third conveyor unit 23.

  The third conveyor unit 23 includes a pair of conveyors 231 and 232 arranged at intervals in the Y direction. Among these conveyors 231 and 232, the Y2 side conveyor 232 in the Y direction is disposed in the vicinity of the tape feeder 6 provided on the Y2 side in the Y direction. On the other hand, the Y1 side conveyor 232 in the Y direction is configured to be movable in the Y direction with respect to the base 5 as the ball screw shafts 233a and 233b rotate. Therefore, the substrate transport device control unit 102 controls a drive motor (not shown) that drives the ball screw shafts 233a and 233b, so that the interval in the Y direction of the conveyors 231 and 232 depends on the width of the substrates 1a and 1b. Can be adjusted. Then, in a state where the interval between the conveyors 231 and 232 is adjusted according to the widths of the substrates 1a and 1b, the substrate conveyor control unit 102 appropriately controls the conveyance motor 81, whereby the third conveyor unit 23 is The substrates 1a and 1b from the conveyor unit 22 are received and positioned at the second mounting position P2, or conveyed in the X2 direction toward the outside of the surface mounter.

  Next, the first and second head units 3 and 4 will be described. As shown in FIGS. 1 and 2, the first head unit 3 and the second head unit 4 have the same configuration. Further, the first head unit 3 (second head unit 4) can pick up a component from the component extraction portion 6a of the tape feeder 6 and mount the component on the substrate. Note that the components include small electronic components such as semiconductor integrated circuit devices, transistors, capacitors, and resistors.

  Further, as shown in FIGS. 1 and 2, the first head unit 3 and the second head unit 4 are configured to be linearly movable in the X direction along head unit support portions 31 and 41 extending in the X direction, respectively. Yes. Specifically, the head unit support portion 31 (head unit support portion 41) includes a ball screw shaft 31a (41a) extending in the X direction, a servo motor 31b (41b) that rotates the ball screw shaft 31a (41a), and an X direction. Guide rails (not shown). A mover 73 made of a field coil is attached to both ends of the head unit support portion 31 and the head unit support portion 41 and is disposed in the vicinity of a stator 72 provided on the fixed rail portion 70.

  The first head unit 3 has a ball nut 32 that is screwed onto the ball screw shaft 31a. The second head unit 4 has a ball nut 42 that is screwed onto the ball screw shaft 41a. Accordingly, the first head unit 3 (second head unit 4) is rotated in the X direction with respect to the head unit support portion 31 (41) by rotating the ball screw shaft 31a (41a) by the servo motor 31b (41b). Moved to.

  Each of the head unit support portions 31 and 41 is configured to be movable in the Y direction along a pair of fixed rail portions 70 that extend in the Y direction so as to straddle the substrate transport apparatus 2. The pair of fixed rail portions 70 are configured to be used in common with the head unit support portions 31 and 41, respectively. Further, the pair of fixed rail portions 70 are respectively provided with guide rails 71 that support both end portions of the head unit support portion 31 (41) so as to be movable in the Y direction, and on the inner side surface of the fixed rail portion 70 along the Y direction. And a stator 72 made of a plurality of permanent magnets arranged. That is, the head unit support portion 31 (41) is linearly movable in the Y direction along the guide rail 71 by supplying a current to the mover 73 formed of a field coil. That is, the first head unit 3 (second head unit 4) can be moved in the XY directions on the base 5 by the head unit support portion 31 (41) and the linear motor 7.

  Further, the first head unit 3 and the second head unit 4 can be mounted at both the first mounting position P1 upstream in the board transport direction X2 and the second mounting position P2 downstream in the board transport direction X2. As it is, each movable range is set. However, in the present embodiment, the first head unit 3 mounts the component supplied from the Y1-side tape feeder in the Y direction on the substrate 1b positioned at the first mounting position P1, and The 2-head unit 4 mounts a component by mounting the component supplied from the Y2-side tape feeder in the Y direction on the substrate 1a positioned at the second mounting position P2. The movement distance of the 1st head unit 3 and the 2nd head unit 4 at the time is shortened, and the tact time is improved. That is, the first head unit 3 (second head unit 4) is moved above the tape feeder 6 (component supply position) in the Y1 direction (Y2 direction) by the linear motor 7 when adsorbing components. By moving in the X direction along the head unit support portion 31 (41), the suction nozzle 35 (45) is configured to be disposed above the predetermined component extraction portion 6a. When mounting the components, the first head unit 3 (second head unit 4) is moved above the substrate 1b (1a) at the mounting position P1 (P2) by the linear motor 7 and supported by the head unit. The suction nozzle 35 (45) is configured to be positioned at a predetermined position of the substrate 1b (1a) by being moved in the X direction along the portion 31 (41).

  Ten suction nozzles 35 (45) arranged in a line in the X direction are attached to the first head unit (second head unit 4), and each suction nozzle 35 (45) sucks components. be able to. The first head unit 3 (second head unit 4) first holds the component by acquiring the component from the component extraction unit 6a at the component supply position and then moving in the Y2 (Y1) direction. The mounting position P1 (P2) is moved upward. And the 1st head unit 3 (2nd head unit 4) is comprised so that components may be mounted in the predetermined mounting point of the board | substrate 1b (1a) surface, repeating the movement of a X direction and a Y direction. When the mounting operation is completed, the first head unit 3 (second head unit 4) is moved back in the Y1 (Y2) direction to return to the component supply position (above the tape feeder 6) again from above the board. The component acquisition (suction) operation is executed from the component take-out unit 6a.

  In the present embodiment, a part on which the first head unit 3 can be mounted and a part on which the second head unit 4 can be mounted are partially shared. In other words, at the end of the base 5 on the Y1 direction side, the tape feeder 6 that houses the first head unit-exclusive parts that can be mounted only by the first head unit 3, and the first head unit 3 and the second head. A tape feeder 6 that stores common parts that can be mounted in common by the unit 4 is attached. Further, at the end of the base 5 on the Y2 direction side, the tape feeder 6 that houses the second head unit exclusive parts that can be mounted only by the second head unit 4 and the tape feeder that houses the common parts mentioned above. 6 is attached. The first head unit 3 can mount the first head unit dedicated component and the common component on the substrate positioned at the first mounting position P1 by receiving the component supply from the tape feeder 6 on the Y1 direction side. It is. In addition, the second head unit 4 can mount components dedicated to the second head unit and common components on the substrate positioned at the second mounting position P2 by receiving component supply from the tape feeder 6 on the Y2 direction side. It is. The surface mounter 100 according to this embodiment includes components that can be mounted in common by the first head unit 3 and the second head unit 4 and then performs a component mounting operation as follows.

  FIG. 4 is a flowchart showing the component mounting operation of the first head unit in the first embodiment. FIG. 5 is a flowchart showing the component mounting operation of the second head unit in the first embodiment. The operations in these flowcharts are executed by the cooperation of the main control unit 101, the substrate transport apparatus control unit 102, the first head unit control unit 103, and the second head unit control unit 104. Further, as described above, each of the first head unit 3 and the second head unit 4 can mount (can be mounted) a dedicated component (first head unit dedicated component, second head unit dedicated component) and a common component. However, in this embodiment, it is assumed that the exclusive components are preferentially mounted (mounted) from among the exclusive components and the common components, and the common components are mounted after the exclusive components have been mounted.

  First, the component mounting operation of the first head unit 3 will be described with reference to FIG. When the main control unit 101 confirms that the substrate is positioned and fixed at the first mounting position P1, the main control unit 101 determines in step 101 whether there is a component to be mounted by the first head unit 3 or not. When there is no component to be mounted (in the case of “NO” in step S101), the flowchart of FIG. 4 ends, and the main control unit 101 causes the substrate transfer apparatus control unit 102 to transfer the substrate from the first mounting position P1. In response to this, the substrate transfer device control unit 102 receives the transfer and transfers the substrate from the first mounting position P1 to the second mounting position P2.

  On the other hand, when there is a component to be mounted (in the case of “YES” in step S101), the main control unit 101 proceeds to step S102 and the second mounting position P2 is vacant (that is, the second mounting position P2). The board does not exist). If the second mounting position P2 is not empty (“NO” in step S102), the board cannot be transported from the first mounting position P1 to the second mounting position P2, so the first head unit controller 103. Causes the first head unit 3 to perform component mounting. Specifically, after the first head unit 3 sucks the component in step S103, in step S104, the sucked component is mounted on the substrate at the first mounting position P1. As long as the second mounting position P2 is not empty and the board cannot be transported from the first mounting position P1 to the second mounting position P2, steps S101 to S104 are repeatedly executed by the first head unit 3. Component mounting continues. As described above, the component mounting order by the first head unit 3 is the order of the first head unit exclusive component and the common component. Therefore, even if the component mounting of all the first head unit exclusive components is completed, 2 When the mounting position P2 is not empty, the first head unit 3 mounts the common components on the board at the first mounting position P1.

  On the other hand, if the board at the second mounting position P2 is transported from the second mounting position P2 to the downstream side in the board transport direction X2, and the second mounting position P2 is free, “YES” is determined in step S102. Then, the first head unit controller 103 executes the operation of step S105. That is, the first head unit control unit 103 determines whether or not the next component that the first head unit 3 attracts next is a component dedicated to the first head unit. If the next suction component is the first head unit exclusive component, the component mounting of the first head unit exclusive component has not been completed. Therefore, the operations of steps S103 and S104 are executed to execute the first head unit 3 Continues mounting the first head unit dedicated component on the substrate at the first mounting position P1, and completes the mounting of the first head unit dedicated component on the substrate. On the other hand, when it is determined in step S105 that the next suction component is not the first head unit exclusive component (when “NO” is determined in step S105), the first head unit control unit 103 performs step S106. Then, after notifying the second head unit controller 104 of the unmounted component information, the component mounting by the first head unit 3 at the first mounting position P1 is terminated. When the component mounting is completed, the main control unit 101 notifies the substrate transfer device control unit 102 that the substrate transfer from the first mounting position P1 is possible, and receives the substrate transfer. The apparatus control unit 102 conveys the substrate from the first mounting position P1 to the second mounting position P2.

  That is, if it is determined in step S105 that the next suction component is not the first head unit dedicated component, at least the first head unit dedicated component has been mounted on the substrate, and is not mounted on the substrate (not mounted). The mounting component is a common component and a component exclusive to the second head unit, and is a component that can be mounted by the second head unit 4. In addition, the second mounting position P2 is empty, and the substrate can be transported from the first mounting position P1 to the second mounting position P2. Therefore, by leaving the mounting of these unmounted components to the second head unit 4, the first head unit control unit 103 passes the unmounted component information to the second head unit control unit 104, and the substrate transfer device control unit 102 The substrate is transported from the first mounting position P1 to the second mounting position P2. In this way, preparations for receiving the next substrate at the first mounting position P1 are completed.

  Subsequently, a component mounting operation by the second head unit 4 will be described with reference to FIG. When the second head unit control unit 104 confirms that the substrate has been positioned at the second mounting position P2, in step S201, the second head unit control unit 104 receives the unmounted component information from the first head unit control unit 103, Set to "Information". Then, the second head unit control unit 104 executes the following component mounting based on the “component information to be mounted”. Specifically, in step S202, the second head unit control unit 104 determines whether or not there is a component to be mounted (mounted) on the substrate at the second mounting position P2, based on “component information to be mounted”. to decide. If there is no component to be mounted (in the case of “NO” in step S202), the flowchart of FIG. 5 ends, and the main control unit 101 sends the board transfer device control unit 102 from the second mounting position P2. Upon receiving the notification that the substrate can be transferred, the substrate transfer device control unit 102 that has received the notification transfers the substrate from the second mounting position P2 to the downstream side in the substrate transfer direction X2, and the surface mounter 100 receives the substrate. Unload from.

  On the other hand, when there is a component to be mounted (in the case of “YES” in step S202), the second head unit control unit 104 causes the second head unit 4 to execute the operations of step S203 and step 204. Thereby, the second head unit 4 sucks the component (step S203), and mounts the sucked component on the substrate at the second mounting position P2 (step S204).

  The above is the flow of the mounting operation performed by the first head unit 3 and the second head unit 4 in the first embodiment. Next, a more specific example that can be executed by the above flow will be described with reference to FIGS.

  FIG. 6 is a diagram illustrating an example of component mounting that is executed when the second mounting position is empty. The meaning of each column in the figure is as follows. The value in the column “Mounting Data” is a value numbered for one operation of mounting one component on the board. The alphabet on the left side of the “parts” column is a sign indicating the type of each part, and parts having the same alphabet are the same type. Here, the same type means not only that the functions (capacitor, resistance, etc.) of the parts are the same, but also the other shapes, sizes, etc. are the same. The item on the right side of the “parts” column indicates whether each part is a first head unit exclusive part, a common part, or a second head unit exclusive part. In the example of the figure, the part A is the first head unit exclusive part, the parts B, C and D are the common parts, and the parts E and F are the second head unit exclusive parts. The “determination” column indicates a result of the main control unit 101 determining which of the first and second mounting positions P1 and P2 is to mount each component.

  As described above, the component mounting example in FIG. 6 corresponds to a state in which the second mounting position P2 is empty. In other words, the operation after the determination of “YES” in step S102 in the flowchart in FIG. Correspond. In this case, as described with reference to the flowchart of FIG. 4, when the mounting of the first head unit exclusive component is completed on the substrate at the first mounting position P1, the subsequent component mounting is performed at the second mounting position P2. It is executed by the head unit 4. Correspondingly, in the mounting operation example shown in FIG. 6, only the component A, which is the first head unit exclusive component, is mounted at the first mounting position P1, and the other components B to F are at the second mounting position P2. Implemented.

  FIG. 7 is a diagram illustrating an example of component mounting that is executed when a mounted substrate on which all component mounting has been completed is waiting at the second mounting position. The contents of each column in the figure are the same as those in FIG. The component mounting example in FIG. 7 corresponds to an operation after the second mounting position P2 is not empty, that is, after “NO” is determined in step S102 of the flowchart in FIG. In this case, as described with reference to the flowchart of FIG. 4, as long as the substrate is not transported from the second mounting position P2, the first head unit 3 mounts the first head unit dedicated component and the common component on the first mounting position P1. Continue on. Correspondingly, in the mounting operation example shown in FIG. 7, the first head unit exclusive component A and the common components B to D are mounted at the first mounting position P1. Then, after the second mounting position P2 is vacant, the board is transported from the first mounting position P1 to the second mounting position P2, and the second head unit dedicated parts E and F are transferred to the board at the second mounting position P2. Implementation is running.

  FIG. 8 is a diagram illustrating a mounting operation example when the mounted substrate is initially waiting at the second mounting position but the mounted substrate is transported from the second mounting position during mounting at the first mounting position. More specifically, the case where the mounted substrate is transported from the second mounting position P2 while the mounting data is 4 to 5 is shown. In such a case, as described with reference to the flowchart of FIG. 4, as long as the second mounting position P2 is not free, the first head unit 3 continues to mount components at the first mounting position P1, while the second mounting position When the position P2 is free, the subsequent component mounting is executed at the second mounting position P2 on the condition that the mounting of the first head unit exclusive component is completed. Correspondingly, in the mounting operation example shown in FIG. 7, while there is a mounted substrate at the second mounting position P2 (between mounting data 1 to 4), the first head unit dedicated component A and the common component B While mounting is performed at the first mounting position P1, after the mounted substrate is transported from the second mounting position P2 (after mounting data 5), the remaining common components (component C to component D) and the second head The unit exclusive component is mounted at the second mounting position.

  As described above, in the surface mounting machine (component mounting machine) of the first embodiment, the first head unit 3 (first mounting means) for mounting components on the board at the first mounting position P1, and the second mounting position P2. The second head unit 4 (second mounting means) for mounting components on the board is provided. Therefore, after mounting the component on the substrate from the first head unit 3 at the first mounting position P1, the component can be further mounted on the substrate by the second head unit 4 at the second mounting position P2. At this time, the board on which component mounting has been executed at the first mounting position P1 is directed from the first mounting position P1 toward the downstream side in the board transport direction X2 in order to receive component mounting at the second mounting position P2. It will be transported. However, depending on the situation downstream from the first mounting position P1 in the board transport direction X2, the board cannot be transported from the first mounting position P1 toward the downstream side in the board transport direction X2, so the board at the first mounting position P1. In some cases, the waiting time greatly affects the tact time.

  Therefore, in order to cope with such a problem, the surface mounter 100 of the first embodiment has the following configuration. That is, in the surface mounter 100, the component on which the first head unit 3 can be mounted and the component on which the second head unit 4 can be mounted are at least partially in common. In other words, the first head unit The third and second head units can mount components common to each other (common components). Moreover, the surface mounting machine 100 includes a main control unit 101 (determination unit) that determines whether or not the substrate at the first mounting position P1 can be transported from the first mounting position P1 toward the downstream side in the substrate transport direction. Based on the determination result, it is determined which of the first mounting means P1 and the second mounting means P2 is to mount the common component. Accordingly, by distributing the mounting of the common components between the first head unit 3 and the second head unit 4 according to the determination result of the main control unit 101, the waiting time of the board at the first mounting position P1 is tact time. It is possible to reduce the tact time by reducing the influence on the time.

  More specifically, in the first embodiment, when the main control unit 101 cannot move the substrate from the first mounting position P1 to the second mounting position P2 (in the case of “NO” in step S102 of FIG. 4), When it is determined that the board cannot be transported from the first mounting position P1, the board can be moved from the first mounting position P1 to the second mounting position P2 (in the case of “YES” in step S102 of FIG. 4), the first It is determined that the board can be transported from one mounting position P1. Then, according to the determination result, the mounting of the common components is distributed between the first head unit 3 and the second head unit 4, thereby affecting the waiting time of the board at the first mounting position P1 on the tact time. The tact time is shortened by making it smaller.

  In the first embodiment, when the main control unit 101 determines that the substrate cannot be transported from the first mounting position P1 (in the case of “NO” in step S102 of FIG. 4), the main mounting unit 101 mounts the substrate on the first mounting. While waiting at the position P1, the first head unit 3 is caused to execute component mounting of common components on the board waiting at the first mounting position P1 (steps S102 to S104 in FIG. 4). That is, in the first embodiment, mounting of common components is executed by the first head unit 3 on the board that is waiting at the first mounting position P1. Accordingly, since it is not necessary to mount the common component that has been mounted during the standby at the first mounting position P1 by the second head unit 4 at the second mounting position P2, the second component at the second mounting position P2 is eliminated. The time required for component mounting by the head unit can be shortened. As described above, by mounting the common components on the board on standby at the first mounting position P1, it is possible to effectively use the standby time of the board at the first mounting position P1 and reduce the tact time. It has become.

  In the first embodiment, when it is determined that the substrate can be transported from the first mounting position P1 (in the case of “NO” in step S102 of FIG. 4), the substrate at the first mounting position P1 is When there is an unmounted common component, the main control unit 101 mounts the unmounted common component on the second head unit 4 with respect to the substrate transported from the first mounting position P1 to the second mounting position P2. (Step S106 in FIG. 4 and FIG. 5). In such a configuration, when the main control unit 101 determines that the board can be transported from the first mounting position P1, some common components are not mounted on the board at the first mounting position P1. In addition, the second head unit 4 mounts the unmounted common components on the substrate at the second mounting position P2. Accordingly, since the first head unit 3 does not need to mount the unmounted common component at the first mounting position P1, the time required for component mounting by the first head unit 3 at the first mounting position P1 is shortened. In addition, the tact time can be shortened. From another point of view, this configuration conveys the board from the first mounting position P1 to the second mounting position P2 as soon as the second mounting position P2 is empty, on condition that the mounting of the first head unit dedicated component is completed. (Steps S102 and S105 in FIG. 4). As a result, the first mounting position P1 can be made free, and component mounting on the next board at the first mounting position can be started quickly. In this respect as well, the tact time can be shortened. It has become.

  In the first embodiment, when the main control unit 101 determines that the substrate can be transported from the first mounting position P1, the first control unit 101 first transports the substrate from the first mounting position P1. It is confirmed whether or not all of the head unit exclusive parts are already mounted on the substrate at the first mounting position P1 (step S105 in FIG. 4). If there is an unmounted first mounting means exclusive part, The mounting of the unmounted first mounting means dedicated component is continued by the first head unit 3 on the substrate at the first mounting position P1, and the mounting of all the first mounting means dedicated components is completed. This makes it possible to reliably complete the mounting of the first head unit exclusive component on the substrate by the first head unit 3.

Second Embodiment By the way, in the surface mounter 100 as described above, so-called component breakage may occur in some components while component mounting on a substrate is repeated. Therefore, in the second embodiment, a component mounting operation as shown in FIG. Note that the surface mounter 100 of the second embodiment can execute the component mounting operation of the first embodiment described above, and can further execute the component mounting operation shown in FIG. 9.

  FIG. 9 is a flowchart showing the component mounting operation of the second head unit in the second embodiment. The component mounting operation of the first head unit is the same as that in the first embodiment, and thus the description thereof is omitted. As shown in FIG. 9, when the second head unit control unit 104 confirms that the board is positioned at the second mounting position P2, it receives unmounted component information from the first head unit control unit 103 in step S301. And set it to “Part information to be mounted”. In step S302, the second head unit control unit 104 determines whether there is a component to be mounted (mounted) on the substrate at the second mounting position P2 from the “component information to be mounted”. When there is a component to be mounted (in the case of “YES” in step S302), the second head unit control unit 104 causes the second head unit 4 to execute the operations of step S303 and step 304. Thereby, the second head unit 4 sucks the component (step S303), and mounts the sucked component on the substrate at the second mounting position P2 (step S304).

  On the other hand, when there is no component to be mounted (in the case of “NO” in step S302), the main control unit 101 feeds the common component among the feeders 6 for the second head unit 4 (common component feeder). ) It is determined whether or not there is a part that is expected to cause the part to run out (step S305). Such prediction can be performed as follows, for example. That is, when the common component feeder 6 is attached to the surface mounter 100 in the setup operation, the initial number of the common component feeder 6 is set in the main control unit 101, and the components of the common component feeder 6 are set. Each time is mounted on the board, the number of components is counted down from the initial number of components. Then, when the number of parts is equal to or less than the predetermined number (in other words, when the remaining number of parts of the common part feeder 6 is equal to or less than the predetermined number), it is only necessary to be configured to predict that the parts will run out. . Then, if the component shortage is not predicted (“NO” in step S305), the flowchart of FIG. On the other hand, if it is predicted that the parts will run out (if “YES” in step S 305), in the subsequent component mounting, the first head unit 3 causes the first head unit 3 to replace the common components stored in the common component feeder 6. The main control unit 101 determines to mount at one mounting position P1, and the flowchart of FIG. 9 ends.

  The above is the flow of the mounting operation performed by the second head unit 4 in the second embodiment. Next, a more specific example that can be executed by the above flow will be described with reference to FIG.

  FIG. 10 is a diagram illustrating an example of component mounting that is executed when it is predicted that part of the common component on which the second head unit can be mounted will be out of component. The contents of each column in the figure are the same as those in FIG. More specifically, FIG. 10 shows the common in the tape feeder 6 that supplies the common component B to the second head unit 4 as a result of repeating the mounting of the common component B by the second head unit 4 at the second mounting position P2. This corresponds to the operation after the component B is predicted to be out of the common component B in which the second head unit 4 can be mounted in the state where the component B is predicted to be out of the component, that is, in step S102 of the flowchart of FIG. In this case, as described with reference to the flowchart of FIG. 9, in the subsequent mounting operation, the common component B is mounted by the first head unit 3. Correspondingly, in the mounting operation example shown in FIG. 10, the common component B is mounted by the first head unit 3 at the first mounting position P1. In the mounting operation example shown in the figure, the common component C following the common component B is also mounted at the first mounting position P1, but the component mounting is not predicted for this common component C, so the second mounting position It can also be mounted with P2.

  As described above, in the surface mounter of the second embodiment, the main control unit 101 predicts whether or not a component break will occur in at least a part of the common components in the second head unit. Then, when the main control unit 101 predicts that the component is out, the main control unit 101 causes the first head unit 3 to execute mounting of the common component in which the component is predicted to be out. In such a configuration, when the second head unit 4 is predicted to run out of parts, the subsequent mounting of the common part that is expected to run out of parts is performed by the first head unit 3 (the head that is not expected to run out of parts). Unit). Accordingly, it is possible to reduce the frequency of the component replenishment operation such as interrupting the mounting operation of the surface mounter 100 for replenishment of the component when the component runs out, thereby shortening the tact time.

Third Embodiment In the above embodiment, the present invention is applied to the surface mounter 100 that mounts components on the board at the mounting positions P1 and P2 while transporting the board in the order of the first and second mounting positions P1 and P2. Explained the case. However, the application target of the present invention is not limited to such a surface mounter 100, and the present invention is applied to all configurations in which component mounting is performed on a substrate at each mounting position while sequentially transporting the substrate to a plurality of mounting positions. be able to. Therefore, for example, the present invention may be applied to a component mounting line as shown in FIG.

  FIG. 11 is a schematic diagram showing one form of a component mounting line to which the present invention is applicable. As shown in the figure, in this component mounting line 1000, three surface mounters 200, 300, 400 are arranged in this order in the substrate transport direction X2, and these surface mounters 200, 300, Component mounting is executed in each of the surface mounters 200, 300, and 400 while sequentially transporting the substrate to 400. Further, the component mounting line 1000 is provided with a host computer HC. The host computer HC transports the board between the surface mounters 200, 300, and 400, and the components in each of the surface mounters 200, 300, and 400. Control the implementation. In the following description, the term “downstream equipment” is used. However, this downstream equipment refers to a surface mounting machine on the downstream side in the board transport direction X2 from the own equipment, and for the surface mounting machine 200. The surface mounters 300 and 400 correspond to downstream equipment, and for the surface mounter 300, the surface mounter 400 corresponds to downstream equipment. In particular, the downstream equipment adjacent to the downstream side in the substrate transport direction X2 is appropriately referred to as “the latest downstream equipment”. That is, for the surface mounter 200, the surface mounter 300 corresponds to the nearest downstream equipment, and for the surface mounter 300, the surface mounter 400 corresponds to the nearest downstream equipment.

  The surface mounter 200 located at the most upstream position in the board transfer direction X2 receives the board from the further upstream side in the board transfer direction X2, and then positions and fixes the board at the mounting position P200. The surface mounter 200 mounts the components on the substrate at the mounting position P200, and then carries the substrate out to the surface mounter 300 (downstream equipment) on the downstream side in the substrate transport direction X2. The surface mounter 300 temporarily positions the board received from the surface mounter 200 at the standby position W300 and then fixes the substrate at the mounting position P300. Then, the surface mounter 300 performs component mounting on the substrate at the mounting position P300, and then carries the substrate out to the surface mounter 400 (downstream equipment) on the downstream side in the substrate transport direction. The surface mounter 400 temporarily positions the substrate received from the surface mounter 300 at the standby position W400, and then fixes the positioning at the mounting position P400. Then, the surface mounter 400 performs component mounting on the board at the mounting position P300, and then carries the board to the downstream side in the board transport direction.

  Here, the reason why the standby position W300 (W400) is provided in the surface mounter 300 (400) is as follows. That is, if such a standby position W300 (W400) is provided, even if the mounting position P300 (P400) of the surface mounter 300 (400) is not vacant, the substrate is received at the standby position W300 (W400) for the time being. It becomes possible. Therefore, the surface mounter 300 (400) can accept the substrate from the upstream side of the substrate transport direction X2 regardless of the vacant state of the mounting position P300 (P400). Therefore, when the surface mounter 200 (300) on the upstream side of the surface mounter 300 (400) is used, the surface mounter 300 (400) on the upstream side does not depend on the vacant state of the mounting position P300 (P400) of the downstream surface mounter 300 (400). Then, the board can be carried out, and the subsequent component mounting on the board can be started quickly. As a result, the tact time can be shortened. This is the reason why the standby positions W300 and W400 are provided.

  As the surface mounters 200, 300, and 400 used in the component mounting line 1000, the surface mounter 100 described in detail in the first embodiment may be used. At this time, for example, the first mounting position P1 may be used as the mounting positions P200, P300, and P400, and the substrate delivery position P3 may function as the standby positions W300 and W400. Of course, a surface mounter having a configuration different from that of the surface mounter 100 described in detail in the first embodiment can also be used as the surface mounters 200, 300, and 400. In the component mounting line 1000 of the third embodiment, the following component mounting operation is executed in order to further reduce the tact time.

FIG. 12 is a flowchart showing a component mounting operation executed by the surface mounter 200 or the surface mounter 300 in the third embodiment. FIG. 13 is a diagram showing an example of component mounting that can be executed according to the flowchart of FIG. The contents of each column in the figure are the same as those in FIG. As shown in FIG. 13, the component mounting line 1000 mounts components A to F on the board. Here, the attribute of each part is as follows. That is,
Component A: Exclusive component of surface mounter 200,
Component B: common component of the surface mounters 200, 300, 400,
Component C: Common component of the surface mounters 200 and 400,
Component D: common component of the surface mounters 200 and 400,
Component E: Exclusive component of surface mounter 300 Component F: Exclusive component of surface mounter 300

  First, the operation executed by the surface mounter 200 or the surface mounter 300 will be described with reference to FIG. When the host computer HC confirms that the board is positioned and fixed at the mounting position P200 (P300), it determines in step 401 whether there is a part to be mounted. When there is no component to be mounted (in the case of “NO” in step S401), the flowchart of FIG. 12 ends, and the surface mounter 200 (300) controls the downstream equipment 300 (under control of the host computer HC). 400).

  On the other hand, if there is a component to be mounted (in the case of “YES” in step S401), the host computer HC proceeds to step S402 and the downstream equipment 300 (400) closest to the surface mounter 200 (300) is present. Determine whether it is free. Specifically, the presence or absence of a substrate at the standby position W300 (W400) of the downstream facility 300 (400) is confirmed. If there is no substrate at the standby position W300 (W400), the downstream facility 300 (400) is free. On the other hand, if there is a substrate at the standby position W300 (W400), it is determined that the downstream facility 300 (400) is not empty. If the downstream facility 300 (400) is not empty (“NO” in step S402), the substrate cannot be transferred from the surface mounter 200 (300) to the nearest downstream facility 300 (400). The host computer HC causes the surface mounter 200 (300) to execute component mounting. Specifically, after the head unit of the surface mounter 200 (300) sucks the component in step S403, the sucked component is mounted on the substrate at the mounting position P200 (P300) in step S404. As long as the downstream equipment 300 (400) is not empty and the substrate transfer from the surface mounter 200 (300) to the downstream equipment 300 (400) cannot be performed, steps S401 to S404 are repeatedly executed, Component mounting by the surface mounter 200 (300) is continued. Here, the component mounting order by the surface mounter 200 (300) is set to the order of the exclusive component and the common component. Accordingly, when the downstream equipment 200 (300) is not vacant even after the mounting of all the dedicated parts is completed, the surface mounter 200 (300) is common to the board at the mounting position P200 (P300). Mount the parts. At this time, since the surface mounter 200 can mount the components B, C, and D as common components, the common components B, C, and D are mounted, and the surface mounter 300 can mount only the component B as a common component. Therefore, the common component B is mounted.

  On the other hand, when the standby position W300 (W400) of the downstream equipment 300 (400) is vacant, “YES” is determined in the step S402, and the determination in the step S405 is executed by the host computer HC. That is, the host computer HC determines whether or not the component that the head unit of the surface mounter 200 (300) next sucks is a dedicated component of the own equipment 200 (300). If the next suction component is a dedicated component of the own equipment 200 (300), the parts mounting in the own equipment 200 (300) is not completed, so the operations of steps S403 and S404 are executed, The mounting machine 200 (300) continues mounting the exclusive component on the board at the mounting position P200 (P300), and completes the mounting of the exclusive component of the own equipment 200 (300). On the other hand, if it is determined in step S405 that the next suction component is not an exclusive component of the own equipment 200 (300) (if “NO” is determined in step S405), the host computer HC proceeds to step S406. Then, after notifying the downstream equipment 200, 300 (300) of the non-mounted parts information, the component mounting in the own equipment 200 (300) is terminated. As the component mounting ends, the host computer HC transports the board from the surface mounter 200 (300) to the standby position W300 (W400) of the downstream facility 300 (400).

  That is, if it is determined in step S405 that the next suction component is not a dedicated component of the surface mounter 200 (300), at least the mounting of the dedicated component of the own equipment 200 (300) on the board is completed. Therefore, the components that are not mounted (not mounted) on the board are common components and dedicated components of the downstream facility 300 (400), and are components that can be mounted by the downstream facilities 300 and 400 (400). Moreover, the standby position W300 (W400) of the nearest downstream facility 300 (400) is vacant, and the substrate can be transported to the nearest downstream facility 300 (400). Therefore, the host computer HC passes the information on the non-mounted parts to the control unit of the downstream side equipment 300, 400 (400), and the board is assumed to leave the mounting of these non-mounted parts to the downstream side equipment 300, 400 (400). Is carried out to the nearest downstream facility 300 (400). In this way, in the surface mounter 200 (300), preparations for receiving the next board at the mounting position P200 (P300) are made.

  Incidentally, the common component B can be mounted by the surface mounters 200, 300, and 400. Therefore, it is preferable to pass information related to the component B among the unmounted component information in the surface mounter 200 to the control units of both the surface mounter 300 and the surface mounter 400. In this way, the mounting of the component B can be appropriately distributed and executed by the surface mounter 300 and the surface mounter 400. In addition, since the common components C and D cannot be mounted by the surface mounter 300, the information regarding the components C and D among the non-mount information in the surface mounter 200 should be passed only to the control unit of the surface mounter 400. good.

  The above is the flow of the mounting operation executed by the component mounting line 1000 in the third embodiment. Next, a specific example executed by the above flow will be described with reference to FIG. FIG. 13 shows a case where the standby position W300 of the latest downstream equipment 300 is vacant between the mounting data 3 and the mounting data 4 while the parts are mounted by the surface mounting machine 200 (that is, in FIG. 12). Step 402 of the flowchart shows a case where “YES” is determined for the downstream equipment 300). In this case, as described with reference to the flowchart of FIG. 12, if the mounting of the surface mounter 200 is completed on the board at the mounting position P200, the subsequent component mounting is executed by the downstream facilities 200 and 300. Correspondingly, in the mounting operation example shown in FIG. 13, in the surface mounter 200, only a part of the exclusive component A and the common component B (common component B mounted by the mounting data 3) is the surface mounter 200. The other components are mounted in the downstream facilities 300 and 400.

  As described above, the component mounting line of the third embodiment has the following configuration. That is, in this component mounting line 1000, components that can be mounted on the surface mounters 200, 300, and 400 are at least partially common, in other words, the surface mounters 200, 300, and 400 are components that are common to each other. (Common parts) can be mounted. In addition, the component mounting line 1000 includes a host computer HC (determination device) that determines whether or not the surface mounters 200, 300, and 400 can transport a substrate toward the downstream side in the substrate transport direction from its own equipment. Therefore, based on the determination result, it is determined which of the surface mounters 200, 300, and 400 has the common component self-run. Therefore, by distributing the mounting of the common components between the surface mounters 200, 300, and 400 according to the determination result of the host computer HC, the influence of the waiting time of the board in the surface mounters 200 and 300 on the tact time is affected. The tact time can be shortened by reducing the tact time.

  That is, the component mounting line 1000 of the third embodiment has a configuration similar to that of the surface mounter 100 of the first embodiment. More specifically, the relationship between the surface mounter 200 and the surface mounter 300, the relationship between the surface mounter 200 and the surface mounter 400, or the relationship between the surface mounter 300 and the surface mounter 400 in the third embodiment is as follows. This is similar to the relationship between the first head unit 3 and the second head unit 4 in one embodiment. Further, steps S401 to S406 in the flowchart of FIG. 12 executed in the component mounting in the third embodiment are similar to steps S101 to S106 in the flowchart of FIG. 4 executed in the component mounting in the first embodiment. is doing. As a result, in the component mounting line 1000 of the third embodiment, the same effects as those of the surface mounter 100 of the first embodiment can be obtained, and the tact time can be shortened.

Others As described above, in the first embodiment, the surface mounter 100 corresponds to the “component mounter” of the present invention. The first head unit 3 (or the first head unit 3 and the feeder 6) corresponds to the “first mounting means” of the present invention, and the second head unit 4 (or the second head unit 4 and the feeder 6). Corresponds to the “second mounting unit” of the present invention, and the main control unit 101, the first head unit control unit 103, and the second head unit control unit 104 cooperate with each other in the “determination unit” and “control unit” of the present invention. The first head unit exclusive part corresponds to the “first mounting means exclusive part” of the present invention, and the second head unit exclusive part corresponds to the “second mounting means exclusive part” of the present invention. In the second embodiment, the main control unit 101 corresponds to the “prediction means” of the present invention. In the third embodiment, the relationship between the surface mounter 200 and the surface mounter 300, the relationship between the surface mounter 200 and the surface mounter 400, or the relationship between the surface mounter 300 and the surface mounter 400 is as follows. This corresponds to the relationship between the “first mounting machine” and the “second mounting machine” of the invention. The host computer HC functions as the “determination device” and “control device” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. In the second embodiment, the component 6 is predicted to be cut out of the common component in the feeder 6 for the second head unit 4, and the first component is mounted by the first head unit 3 on the mounting of the common component in which the component cut is predicted. Was going to be done with. However, if the feeder 6 for the first head unit 3 is predicted to run out of common parts, and the feeder 6 for the first head unit 3 is predicted to run out of common parts, The mounting of the common component predicted to be out of components may be executed by the second head unit 4 at the second mounting position P2.

  In addition, the first head unit 3 and the second head unit of the first embodiment and the surface mounters 200, 300, and 400 of the third embodiment are given priority from the exclusive parts among the exclusive parts and the common parts. In other words, the common component is mounted after the exclusive component has been mounted. However, the mounting order of components is not limited to this.

  In the third embodiment, the standby positions W300 and W400 are provided in the surface mounters 300 and 400. However, the standby positions W300 and W400 may be omitted. In this case, the surface mounters 300 and 400 may be configured to position and fix the substrate received from the upstream side in the substrate transport direction X2 to the mounting positions P300 and P400 as they are. Further, the determination in step S402 in FIG. 12 may be executed by confirming the presence or absence of the substrate at the mounting positions P300 and P400.

  In the first and second embodiments, the first mounting position P1 and the second mounting position P2 are shifted from each other in the Y direction. However, the positional relationship between the first mounting position P1 and the second mounting position P2 is as follows. However, the mounting positions P1, P2 may be the same in the Y direction.

  In the first and second embodiments, the first head unit 3 and the second head unit 4 have the same configuration, but the head units 3 and 4 may have different configurations.

  In the first embodiment, whether or not the board can be transported from the first mounting position P1 is determined based on whether or not the second mounting position P2 is empty (step S102 in FIG. 4). Not limited to this, if the board standby position provided immediately downstream of the second mounting position P2 is vacant, the board at the second mounting position is moved to the downstream board as soon as the mounting at the second mounting position P2 is completed. While carrying out to a standby position, you may start conveyance of the board | substrate from the 1st mounting position P1. That is, unlike the first embodiment in which it is determined whether or not the board can be transported from the first mounting position P1 based on whether or not the second mounting position P2 is empty, the board at the second mounting position P2 is transported. Whether or not the board can be transported from the first mounting position P1 is determined based on whether or not the board can be transported. In this case, since the substrate is transported from the first mounting position P1 to the second mounting position P2 at the transporting timing from the second mounting position P2 to the substrate standby position provided downstream of the second mounting position P2, more Tact time can be shortened.

  DESCRIPTION OF SYMBOLS 100 ... Surface mounter, X2 ... Board conveyance direction, P1 ... 1st mounting position, P2 ... 2nd mounting position, 3 ... 1st head unit, 4 ... 2nd head unit, 101 ... Main control part, 103 ... 1st Head unit control unit, 104 ... second head unit control unit, 1000 ... component mounting line, 200, 300, 400 ... mounting machine, HC ... host computer

Claims (7)

First mounting means for mounting a component at the first mounting position on the substrate transported from the upstream side in the substrate transport direction to the first mounting position;
A component is mounted on the board that has been transported from the first mounting position to the second mounting position at a second mounting position downstream in the board transport direction with respect to the first mounting position. 2 mounting means;
Determining means for determining whether or not the substrate at the first mounting position can be transported from the first mounting position toward the downstream side in the substrate transport direction;
Control means for controlling component mounting of the first mounting means and the second mounting means,
The component that can be mounted by the first mounting means and the component that can be mounted by the second mounting means are at least partially common,
The control means determines whether the first mounting means and the second mounting means are to mount a common component that can be mounted in common by the first mounting means and the second mounting means. A component mounter characterized in that it is determined based on a result.   The determination unit determines that the substrate cannot be transported from the first mounting position when the substrate cannot be moved from the first mounting position to the second mounting position. The component mounting machine according to claim 1, wherein when the board can be moved to the second mounting position, it is determined that the board can be transported from the first mounting position. When the determination means determines that the substrate cannot be transported from the first mounting position,
The control unit causes the board to stand by at the first mounting position, and causes the first mounting means to perform component mounting of the common component on the board waiting at the first mounting position. 2. The component mounting machine according to 2.   When the determination unit determines that the substrate can be transported from the first mounting position, and there is an unmounted common component with respect to the substrate at the first mounting position, the control unit includes: 4. The mounting of the unmounted common component is performed by the second mounting unit on the substrate transported from the first mounting position to the second mounting position. 5. The component mounting machine described. If the determination means determines that the substrate can be transported from the first mounting position,
Prior to the transfer of the substrate from the first mounting position, the control means includes all of the components mounted by the first mounting means that are exclusive to the first mounting means other than the common component. It is confirmed whether or not the mounting is performed on the board at the mounting position. If there is an unmounted first mounting means dedicated component, the mounting of the unmounted first mounting means dedicated component is performed as described above. 5. The component mounting machine according to claim 4, wherein the mounting of all the components dedicated to the first mounting unit is completed by continuing the first mounting unit with respect to the substrate at the first mounting position. A predicting unit that predicts whether or not a component breakage occurs in at least a part of the common component in any of the first mounting unit and the second mounting unit;
One of the first mounting means and the second mounting means that is not predicted to cause the common part to be out of the first mounting means and the second mounting means when the control means predicts the part shortage by the part shortage prediction means. The component mounter according to claim 1, wherein the component mounter is executed. A first mounting machine that mounts a component at a predetermined mounting position on the board conveyed from the upstream side in the board conveying direction;
A second mounting machine that mounts components on the board that has been transported from the first mounting machine on the downstream side of the board transporting direction with respect to the first mounting machine;
A determination device that determines whether or not the substrate at the mounting position of the first mounting machine can be transported from the mounting position toward the downstream side in the substrate transport direction;
A control device for controlling component mounting of the first mounting machine and the second mounting machine,
The component that can be mounted by the first mounting machine and the component that can be mounted by the second mounting machine are at least partially common,
The control device determines whether the common component that can be mounted in common by the first mounting machine and the second mounting machine is to be mounted on the first mounting machine or the second mounting machine. A component mounting line that is determined based on a result.

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