JP2008066361A - Part mounting machine and part mounting machine production line system - Google Patents

Part mounting machine and part mounting machine production line system Download PDF

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JP2008066361A
JP2008066361A JP2006239857A JP2006239857A JP2008066361A JP 2008066361 A JP2008066361 A JP 2008066361A JP 2006239857 A JP2006239857 A JP 2006239857A JP 2006239857 A JP2006239857 A JP 2006239857A JP 2008066361 A JP2008066361 A JP 2008066361A
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mounting
component
station
substrate
board
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JP4823822B2 (en
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Tetsuro Miyamoto
哲朗 宮本
Hiroaki Usui
弘章 薄井
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Juki Corp
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Juki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a part mounting machine which can reduce unnecessary idle state and easily improve operability. <P>SOLUTION: The part mounting machine 10 positions and fixes a conveyed substrate 2 and mounts a predetermined part to a mounting position on the substrate assigned to each of mounting stations 12 and 14 that are connected in parallel in a plurality of piece to mount the part to the substrate, and is provided with a plurality of mounting stations 12 and 14 wherein at least a part of the parts to be mounted to the substrate 2 is common and an assignment control means 20 that dynamically changes the mounting point of the common part assigned to each of the mounting stations 12 and 14 according to the manufacturing state of the part mounting machine 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、部品実装機及び部品実装機生産ラインシステムに関する。特に、無駄なアイドル状態を低減させ、稼働率の向上を容易に図ることが可能な部品実装機及び部品実装機生産ラインシステムに関する。   The present invention relates to a component mounter and a component mounter production line system. In particular, the present invention relates to a component mounter and a component mounter production line system that can reduce a useless idle state and can easily improve an operation rate.

従来、基板に部品を実装する実装ステーションが複数直列に接続された部品実装機は、搬送されてくる基板に対して実装ステーション毎に予め配置決定された基板上の搭載点(静的な搭載点)に順次部品を実装する生産プログラムを有し、このプログラムでは、基板が次の実装ステーションにスムーズに移ることができるように、各実装ステーションにおける各基板に対する実装時間がほぼ等しい値に設定されている。   Conventionally, a component mounter in which a plurality of mounting stations for mounting components on a board are connected in series is mounted on a board (static mounting point) that is determined in advance for each mounting station with respect to the board being transported. In this program, the mounting time for each board at each mounting station is set to approximately the same value so that the board can smoothly move to the next mounting station. Yes.

なお、特許文献1には、基板の搬入および搬出を行う2台の基板搬送装置を並列に部品実装機に設けるとともに、適切な制御を行う発明が記載されている。   Patent Document 1 describes an invention in which two board transfer devices for carrying in and out boards are provided in parallel in a component mounter and appropriate control is performed.

特開2004−1284000号公報JP 2004-1284000 A

しかしながら、従来の生産方式では、部品実装機の実装ステーションや複数の部品実装機が直列に接続された生産ラインの部品実装機において、生産中の部品切れ等のエラーにより搬送バランスが乱れた場合や、前工程の実装ステーションや部品実装機が高い生産能力を有している場合(例えば、2枚同時搬出)等、部品実装機や生産ラインの生産状態が変化しても、予め決められた生産バランス(静的な生産バランス)によって、実装ステーション毎や部品実装機毎に同じ静的な搭載点に対して生産を行うため、その実装ステーションや部品実装機での実装が完了しないと次の実装ステーションや部品実装機での実装を始めることができず、無駄なアイドル状態が発生していた。このため、実装基板1枚当りの平均生産時間である実装タクトが長くなり、生産性を低下させてしまう問題点が生じていた。   However, in the conventional production system, when the mounting balance of the component mounting machine or the component mounting machine on the production line where a plurality of component mounting machines are connected in series, the conveyance balance is disturbed due to an error such as out of parts during production. Even if the production status of the component mounter or production line changes, such as when the mounting station or component mounter in the previous process has a high production capacity (for example, two sheets are carried out simultaneously) Because the same static mounting point is produced for each mounting station and each component mounter by balance (static production balance), the next mounting must be completed if the mounting at that mounting station or component mounter is not completed. Mounting on a station or component mounter could not be started and a wasteful idle state occurred. For this reason, the mounting tact, which is the average production time per mounting board, is increased, resulting in a problem that productivity is lowered.

又、特許文献1に記載の発明は、基板搬送装置を並列に設けた特殊な装置であるため、汎用性に乏しく、導入や改良にコストを要してしまう問題点があった。   Moreover, since the invention described in Patent Document 1 is a special device in which the substrate transfer device is provided in parallel, there is a problem that it is poor in versatility and requires cost for introduction and improvement.

本発明は、前記従来の問題点を解消すべくなされたもので、無駄なアイドル状態を低減させ、稼働率の向上を容易に図ることを課題とする。   The present invention has been made to solve the above-described conventional problems, and it is an object of the present invention to reduce a useless idle state and easily improve an operating rate.

本発明は、搬送されてくる基板を位置決め固定し、該基板に部品を実装する実装ステーションが複数直列に接続され、該実装ステーション毎に予め割当てられた基板上の搭載点に、決められた部品を実装する部品実装機において、前記基板に実装する部品の少なくとも一部が互いに共通とされた複数の実装ステーションと、該各実装ステーションに割当てられている共通部品の搭載点を、前記部品実装機の生産状態に応じて動的に変更する割当制御手段と、を有することで、前記課題を解決したものである。   In the present invention, a plurality of mounting stations for positioning and fixing a substrate to be conveyed and mounting components on the substrate are connected in series, and a predetermined component is mounted on a mounting point on the substrate that is assigned in advance for each mounting station. A component mounting machine for mounting a plurality of mounting stations in which at least some of the components to be mounted on the board are common to each other, and mounting points of the common components assigned to the mounting stations, The assignment control means for dynamically changing according to the production state is solved to solve the above problem.

前記割当制御手段は、実装ステーションの一つにおいて部品切れの生産状態が発生した場合、該部品と同じ部品を供給できる代替フィーダを他の実装ステーション内で検索し、検索された代替フィーダを有する前記他の実装ステーションに基板を搬送し、検索された前記代替フィーダの部品を前記基板上の搭載点に実装させることができる。   The allocation control means searches for an alternative feeder capable of supplying the same part as the part in another mounting station when a production state where a part is out of production occurs in one of the mounting stations, and includes the searched alternative feeder. The board can be transported to another mounting station, and the searched alternative feeder component can be mounted on the mounting point on the board.

本発明は、又、搬送されてくる基板を位置決め固定し、該基板に部品を実装する部品実装機が複数直列に接続され、該部品実装機毎に予め割当てられた基板上の搭載点に、決められた部品を実装する部品実装機生産ラインシステムおいて、前記基板に実装する部品の少なくとも一部が互いに共通とされた複数の部品実装機と、該各部品実装機に割当てられている共通部品の搭載点を、前記部品実装機生産ラインシステムの生産状態に応じて動的に変更する割当制御手段と、を有することで、前記課題を解決したものである。   In the present invention, a plurality of component mounters for fixing and positioning the substrate to be transported and mounting components on the substrate are connected in series, and a mounting point on the substrate pre-assigned to each component mounter is In a component mounter production line system for mounting a determined component, a plurality of component mounters in which at least some of the components mounted on the board are common to each other, and a common assigned to each of the component mounters The problem is solved by having an allocation control means for dynamically changing the mounting point of the component according to the production state of the component mounter production line system.

本発明によれば、部品実装機や生産ラインの生産状態が変化しても、最適な生産バランスを実現でき、従来の静的な生産バランスによる生産よりも、基板上の搭載点を動的に変更して各実装ステーションや部品実装機のアイドル時間を短縮し、稼働率の向上を容易に図ることができ、平均的な実装タクトを低減させることができる。特に、生産開始時など後工程のアイドル時間が比較的長くなる場合において、最短時間で後工程へ基板を搬送でき、各実装ステーションや各部品実装機のアイドル時間を短縮することができるため、稼働率の向上を容易に図ることができ、平均的な実装タクトを低減させることができる。   According to the present invention, an optimal production balance can be realized even if the production state of a component mounting machine or production line changes, and the mounting point on the board can be dynamically changed rather than the production based on the conventional static production balance. It is possible to shorten the idle time of each mounting station or component mounting machine by changing it, so that the operating rate can be easily improved, and the average mounting tact can be reduced. In particular, when the idle time of the post-process is relatively long, such as at the start of production, the board can be transferred to the post-process in the shortest time, and the idle time of each mounting station and each component mounting machine can be shortened. The rate can be easily improved, and the average mounting tact can be reduced.

更に、実装ステーションの一つにおいて部品切れが発生した場合、この部品と同じ部品を供給できる代替フィーダを他の実装ステーション内で検索し、検索された代替フィーダを有する他の実装ステーションに基板を搬送し、検索された代替フィーダの部品を基板上の搭載点に実装させた場合、部品切れが発生しても代替フィーダ検索を別ステーションでも可能とすることで、一時停止することなく、ノンストップ生産を行うことができる。   Furthermore, when a component breakage occurs in one of the mounting stations, the alternative feeder that can supply the same component as this component is searched in another mounting station, and the board is transferred to the other mounting station having the searched alternative feeder. When the searched alternative feeder parts are mounted on the mounting point on the board, non-stop production is possible without pause by enabling alternative feeder search even if the parts run out. It can be performed.

又、これら上述の効果は、部品実装機や、部品実装機生産ラインシステムを制御する生産プログラムの変更により可能であり、新たな機器の導入や改良が不要であるため、汎用性を有している。   These effects can be achieved by changing the production program for controlling the component mounter and the component mounter production line system, and it is not necessary to introduce or improve new equipment. Yes.

以下、図面を参照して、本発明に係る実施形態について説明する。   Embodiments according to the present invention will be described below with reference to the drawings.

(第1実施形態)
図1は、2つの実装ステーションを有する部品実装機の概要図である。部品実装機10は、位置決め固定された基板2上に部品を実装する第1実装ステーション12及び第2実装ステーション14と、当該各実装ステーション12、14を制御する制御部20とを有している。
(First embodiment)
FIG. 1 is a schematic diagram of a component mounter having two mounting stations. The component mounting machine 10 includes a first mounting station 12 and a second mounting station 14 that mount components on the substrate 2 that is positioned and fixed, and a control unit 20 that controls the mounting stations 12 and 14. .

前記両実装ステーション12、14は、各々基板2を搬送する搬送路22、24と、基板2上に実装される部品を供給する複数のフィーダ26とを有している。   Each of the mounting stations 12 and 14 includes transport paths 22 and 24 for transporting the substrate 2, and a plurality of feeders 26 for supplying components to be mounted on the substrate 2.

前記第1実装ステーション12と第2実装ステーション14とは、直列に接続され、基板2を第1実装ステーション12から第2実装ステーション14へ搬送できるように、実装ステーション12、14における各々の搬送路22、24が連結されている。   The first mounting station 12 and the second mounting station 14 are connected in series, and the respective transport paths in the mounting stations 12 and 14 so that the substrate 2 can be transported from the first mounting station 12 to the second mounting station 14. 22 and 24 are connected.

前記フィーダ26は、各実装ステーション12、14に対して実装が割当てられている部品を供給できるように、各実装ステーション12、14に、各々並設されている。例えば、図1では、模式的に、第1実装ステーション12には、フィーダ26A、26Bが、第2実装ステーション14には、フィーダ26B、26Cが、各々並設されている。ここで、第1実装ステーション12のフィーダ26Bと第2実装ステーション14のフィーダ26Bには、同じ部品が収容されている。   The feeder 26 is juxtaposed to each mounting station 12, 14 so as to supply components to which mounting is assigned to each mounting station 12, 14. For example, in FIG. 1, feeders 26 </ b> A and 26 </ b> B are typically provided in the first mounting station 12, and feeders 26 </ b> B and 26 </ b> C are provided in parallel in the second mounting station 14. Here, the same components are accommodated in the feeder 26B of the first mounting station 12 and the feeder 26B of the second mounting station 14.

前記基板2上には、搬送路22又は搬送路24上で位置決め固定(クランプ)された後、実装ヘッド(図示せず)に配設されたカメラにより撮像され、部品を実装する搭載点を正確に割り出す(補正する)ための基板マーク2Mと、実装の精度が要求されるIC部品等に対する搭載点を補正するための専用の基板マーク2Nとが付されている。   On the substrate 2, after being positioned and fixed (clamped) on the conveyance path 22 or the conveyance path 24, the image is picked up by a camera disposed on a mounting head (not shown), and the mounting point for mounting the component is accurately determined. A board mark 2M for determining (correcting) and a dedicated board mark 2N for correcting a mounting point for an IC component or the like that requires mounting accuracy are attached.

図2は、基板2上の搭載点に実装されている部品を模式的に示した平面図である。図2に示される如く、例えば、部品4Aの搭載点は図中基板2左側の3箇所であり、部品4Bの搭載点は基板2中央の6箇所、部品4Cの搭載点は基板2右側の3箇所である。   FIG. 2 is a plan view schematically showing components mounted on the mounting points on the substrate 2. As shown in FIG. 2, for example, the mounting points of the component 4A are three places on the left side of the board 2 in the figure, the mounting points of the part 4B are six places in the center of the board 2, and the mounting points of the part 4C are three places on the right side of the board 2. It is a place.

基板2上のこれらの搭載点は、予め部品4A、4B、4Cごとに決められていて、部品4Aはフィーダ26Aから、部品4Bはフィーダ26Bから、部品4Cはフィーダ26Cから供給され、第1実装ステーション12では部品4Aと部品4Bの実装と、第2実装ステーション14では部品4Bと部品4Cの実装ができるように、これらフィーダ26がセットされている。   These mounting points on the board 2 are determined in advance for each of the components 4A, 4B, and 4C. The component 4A is supplied from the feeder 26A, the component 4B is supplied from the feeder 26B, and the component 4C is supplied from the feeder 26C. The feeders 26 are set so that the components 12A and 4B can be mounted at the station 12 and the components 4B and 4C can be mounted at the second mounting station 14.

このように、部品4Aは第1実装ステーション12にのみセットされているため、第1実装ステーション12でしか実装できないので、部品4Aの実装は第1実装ステーション12に割り当てられている。又、部品4Cは第2実装ステーション14にのみセットされているため、第2実装ステーション14でしか実装できないので、部品4Cの実装は第2実装ステーション14に割り当てられている。   As described above, since the component 4A is set only at the first mounting station 12, it can be mounted only at the first mounting station 12. Therefore, the mounting of the component 4A is assigned to the first mounting station 12. Further, since the component 4C is set only at the second mounting station 14, it can be mounted only at the second mounting station 14. Therefore, the mounting of the component 4C is assigned to the second mounting station 14.

一方、部品4Bは、両実装ステーション12、14にセットされ、両実装ステーション12、14に共通する部品であるため、どちらの実装ステーション12、14でも実装可能であり、動的に割り当てが変更(後述)できるようにセットされている。即ち、複数の実装ステーション12、14には、基板2に実装する部品4A、4B、ACの少なくとも一部が互いに共通とされた部品4Bがセットされている。   On the other hand, since the component 4B is set in both the mounting stations 12 and 14 and is common to both the mounting stations 12 and 14, it can be mounted in either mounting station 12 and 14, and the allocation is dynamically changed ( It is set so that it can be done later. That is, in the plurality of mounting stations 12 and 14, components 4 </ b> A and 4 </ b> B to be mounted on the substrate 2 and components 4 </ b> B in which at least a part of AC is common to each other are set.

次に、図3に基づき、制御部20により制御された各実装ステーション12、14に割当てられている共通部品4Bの搭載点を、部品実装機10の生産状態に応じて動的に変更する割当制御手段の処理手順について説明する。   Next, on the basis of FIG. 3, the allocation of dynamically changing the mounting point of the common component 4 </ b> B allocated to each mounting station 12, 14 controlled by the control unit 20 according to the production state of the component mounting machine 10. A processing procedure of the control means will be described.

まず、第1実装ステーション(第1ステーション)12の位置決め固定位置まで基板2を搬入して固定する。この位置決め固定された基板2上の基板マーク2Mを実装ヘッドに配設されたカメラにより撮像して基板マーク認識を行う。なお、ノズルの交換が必要な場合は、実装前にノズル交換を行う。   First, the substrate 2 is carried and fixed to the positioning and fixing position of the first mounting station (first station) 12. The substrate mark 2M on the substrate 2 positioned and fixed is imaged by a camera disposed on the mounting head to recognize the substrate mark. If it is necessary to replace the nozzle, the nozzle is replaced before mounting.

そして、第1実装ステーション12に割当てられている基板2上の搭載点のうち第1実装ステーション12でのみ実装可能な部品に対する搭載点に、部品を実装する動作を優先的に行う(ステップS1)。例えば、フィーダ26Aに収容されている部品4Aの部品を、部品4Bに優先させて、基板2上の基板マーク2Nに対応する搭載点に実装していく。   Then, among the mounting points on the board 2 assigned to the first mounting station 12, the operation of mounting the components is preferentially performed at the mounting points for the components that can be mounted only at the first mounting station 12 (step S1). . For example, the component 4A accommodated in the feeder 26A is mounted on the mounting point corresponding to the substrate mark 2N on the substrate 2 with priority over the component 4B.

次に、第1実装ステーション12でのみ実装可能な搭載点に対する実装が完了するまで実装を進める(ステップS2)。例えば、図2中左側の3つの搭載点全てに部品4Aが実装されるまで、実装を繰り返す。   Next, mounting is advanced until mounting for mounting points that can be mounted only at the first mounting station 12 is completed (step S2). For example, the mounting is repeated until the component 4A is mounted on all three mounting points on the left side in FIG.

第1実装ステーション12でのみ実装可能な搭載点に対する実装の終了後、第2実装ステーション14がアイドル状態か否か、即ち、第2実装ステーション14に基板2が有るか無か、第2実装ステーション14での実装がほぼ完了し、第2実装ステーション14にある基板2をまもなく搬出できるか否か等、部品実装機10の生産状態を判定する(ステップS3)。   After the mounting of the mounting points that can be mounted only at the first mounting station 12, the second mounting station 14 is in an idle state, that is, whether the second mounting station 14 has the substrate 2 or not. 14, the production state of the component mounting machine 10 is determined (step S <b> 3), such as whether or not the mounting at 14 is almost completed and the board 2 in the second mounting station 14 can be unloaded soon.

第2実装ステーション14がアイドル状態であれば、第1実装ステーション12から基板2を搬出する(ステップS4)。   If the second mounting station 14 is in the idle state, the board 2 is unloaded from the first mounting station 12 (step S4).

搬出後、第2実装ステーション14から搬出された基板2を、搬送路24上の位置決め固定する位置まで搬送した後、第2実装ステーション14での実装動作を始める(ステップS5)。   After carrying out, the board | substrate 2 carried out from the 2nd mounting station 14 is conveyed to the position which fixes the positioning on the conveyance path 24, Then, mounting operation in the 2nd mounting station 14 is started (step S5).

ステップS3で第2実装ステーション14がアイドル状態でなければ、第1実装ステーション12で実装可能な搭載点が有るか無かを判定する(ステップS6)。例えば、第1実装ステーション12のフィーダ26Bから供給できる部品4Bの搭載点で、まだ部品4Bが実装されていない搭載点を検索し、実装可能な搭載点が有るか無かを判定する。   If the second mounting station 14 is not in the idle state in step S3, it is determined whether there is a mounting point that can be mounted in the first mounting station 12 (step S6). For example, a mounting point where the component 4B can be supplied from the feeder 26B of the first mounting station 12 is searched for a mounting point where the component 4B is not yet mounted, and it is determined whether there is a mounting point that can be mounted.

第1実装ステーション12で、既に部品を実装できる搭載点が無ければ、第1実装ステーション12から基板2を搬出するステップS4に移り、まだ搭載点があれば、第1実装ステーション12で実装可能な搭載点の実装動作を行う(ステップS7)。   If there is no mounting point on the first mounting station 12 where components can already be mounted, the process proceeds to step S4 for unloading the substrate 2 from the first mounting station 12, and if there is still a mounting point, mounting is possible at the first mounting station 12. The mounting operation of the mounting point is performed (step S7).

以上、これらの手順は、まず第1実装ステーション12で、基板2上に部品を実装し、次に、第2実装ステーション14に基板2を搬送して実装するという生産の流れ(順次生産フロー)である。ここで順次生産とは、各実装ステーション12、14でのみ実装可能な搭載点があり、且つ、一部共通する部品がある場合において、第1実装ステーション12で生産したら、次に第2実装ステーション14で生産することであり、必ず両実装ステーション12、14での実装をする必要性があるという制約が付く。   As described above, these procedures are performed by first mounting parts on the board 2 at the first mounting station 12, and then transporting and mounting the board 2 on the second mounting station 14 (sequential production flow). It is. Here, “sequential production” means that when there are mounting points that can be mounted only at each mounting station 12 and 14 and there are some parts in common, if production is performed at the first mounting station 12, then the second mounting station. 14, and there is a restriction that it is necessary to mount at both mounting stations 12 and 14.

従来、静的な生産バランスを考慮し、第1実装ステーション12で、3個の部品4A、及び、6個の部品4Bのうち図2の基板2上の左側の3個を基板2上に実装し、次に第2実装ステーション14で、図2中右側の残りの3個の部品4B及び3個の部品4Cを実装するため、第2実装ステーション14がアイドル状態でも第1実装ステーション12で部品を実装している間は、前工程から次の基板が搬送されてきても、基板を第1実装ステーション12に搬入することはできないが、本実施形態によれば、生産開始時など生産状態が変化し、後工程の第2実装ステーション14のアイドル時間が長くなる場合、第1実装ステーション12での実装をキャンセルさせ、第2実装ステーション14に、基板2を搬出させ、第2実装ステーション14で実装し、第1実装ステーション12に前工程からの基板を搬出させ、そこで実装できるので、各実装ステーション12、14でのアイドル時間を短縮することができる。   Conventionally, in consideration of a static production balance, the first mounting station 12 mounts the three parts 4A and six parts 4B on the left side of the board 2 in FIG. Then, in order to mount the remaining three components 4B and three components 4C on the right side in FIG. 2 at the second mounting station 14, the components are installed at the first mounting station 12 even when the second mounting station 14 is in an idle state. During mounting, even if the next substrate is transported from the previous process, the substrate cannot be carried into the first mounting station 12. However, according to the present embodiment, the production state such as when production is started If the idle time of the second mounting station 14 in the post process changes and becomes longer, the mounting at the first mounting station 12 is canceled, and the substrate 2 is carried out to the second mounting station 14, and the second mounting station Implemented in 4, to out the substrate from the previous step to the first mounting station 12, where it is possible to implement, it is possible to shorten the idle time at each of the mounting stations 12, 14.

(第2実施形態)
図4及び図5を参照して、本発明に係る第2実施形態について説明する。
(Second Embodiment)
A second embodiment according to the present invention will be described with reference to FIGS.

第2実施形態の構成は、第1実施形態とほぼ同じであるが、図4に示される如く、部品実装機30の各実装ステーション12、14に並設されているフィーダ26に収容されている部品種が全て同じであることと、制御部20の割当制御手段に関する生産プログラムの内容とが異なる。例えば、第1実装ステーション12及び第2実装ステーション14の各々には、フィーダ26A、26B、26Cが並設されている。   The configuration of the second embodiment is almost the same as that of the first embodiment. However, as shown in FIG. 4, the second embodiment is accommodated in a feeder 26 provided in parallel with each of the mounting stations 12 and 14 of the component mounting machine 30. The parts types are all the same, and the contents of the production program relating to the allocation control means of the control unit 20 are different. For example, each of the first mounting station 12 and the second mounting station 14 is provided with feeders 26A, 26B, and 26C.

次に、図5に基づき、制御部20の生産プログラムの内容について説明する。   Next, the contents of the production program of the control unit 20 will be described based on FIG.

まず、基板2を部品実装機30に搬入して第1実装ステーション12の搬送路22上を通過させ、第2実装ステーション14の搬送路24上に位置決め固定して、実装を開始する。基板2が搬送路22上を通過した後、基板3を部品実装機30に搬入し、第1実装ステーション12の搬送路22上に位置決め固定して、実装を開始する(ステップS10)。即ち、両実装ステーション12、14で同時に実装している(同時実装)状態になる。   First, the board 2 is carried into the component mounting machine 30 and passed over the transport path 22 of the first mounting station 12, positioned and fixed on the transport path 24 of the second mounting station 14, and mounting is started. After the board 2 has passed over the transport path 22, the board 3 is carried into the component mounting machine 30, positioned and fixed on the transport path 22 of the first mounting station 12, and mounting is started (step S10). In other words, both mounting stations 12 and 14 are simultaneously mounted (simultaneous mounting).

この同時実装が開始されたら、第2実装ステーション14がアイドル状態か否かを判定する(ステップS11)。アイドル状態でなければ、同時実装を続け、アイドル状態であれば、部品がまだ実装されていない残りの搭載点に対して、第1実装ステーション12で部品を実装するために必要な時間の見積値(第1実施ステーションの残り実装動作時間)と、第1実装ステーション12から第2実装ステーション14へ現在実装している基板3を搬送して位置決め固定するまでに要する時間の見積値(第2実装ステーションの基板搬入動作時間)とを比較して判定する(ステップS12)。   When this simultaneous mounting is started, it is determined whether or not the second mounting station 14 is in an idle state (step S11). If it is not in the idle state, the simultaneous mounting is continued, and if it is in the idle state, the estimated time required for mounting the component at the first mounting station 12 for the remaining mounting points where the component is not yet mounted. (Remaining mounting operation time of the first mounting station) and an estimated value (second mounting time) required for transporting and fixing the board 3 currently mounted from the first mounting station 12 to the second mounting station 14 It is determined by comparing with the substrate loading operation time of the station (step S12).

判定の結果、第1実装ステーション12の残り実装動作時間が、短ければ、そのまま第1実装ステーション12での実装を完了させ(ステップS13)、長ければ、基板3を第1実装ステーション12から搬出する(ステップS14)。   As a result of the determination, if the remaining mounting operation time of the first mounting station 12 is short, the mounting at the first mounting station 12 is completed as it is (step S13), and if long, the substrate 3 is unloaded from the first mounting station 12. (Step S14).

搬出後、第2実装ステーション14に基板3が搬入され、残りの搭載点に部品を実装する(ステップS15)。   After carrying out, the board | substrate 3 is carried in to the 2nd mounting station 14, and components are mounted in the remaining mounting points (step S15).

以上、これらの手順は、各実装ステーション12、14に実装できる部品が全て共通してセットされ、第1実装ステーション12でも第2実装ステーション14でも、基板2、3上の搭載点に対して部品を実装できる場合(同時生産)であり、順次生産のような制約はなく、広範囲の部品に渡り、互いの実装ステーション12、14で実装を補うことが可能である。   As described above, all the components that can be mounted on the mounting stations 12 and 14 are set in common in these procedures, and the components are mounted on the mounting points on the boards 2 and 3 in both the first mounting station 12 and the second mounting station 14. Can be mounted (simultaneous production), and there is no restriction such as sequential production, and the mounting can be supplemented by mutual mounting stations 12 and 14 over a wide range of parts.

基板2、3が2枚ほぼ同時に部品実装機30に搬入されてきた場合は、1枚目の基板2は第1実装ステーション12を通過し、第2実装ステーション14で全ての搭載点に対して部品の実装が可能であり、2枚目の基板3は第1実装ステーション12で実装が可能であるため、2枚の基板2、3に対して同時生産ができ、平均な実装タクトの短縮を図ることができる。   When two substrates 2 and 3 are carried into the component mounting machine 30 almost simultaneously, the first substrate 2 passes through the first mounting station 12 and is mounted on all mounting points at the second mounting station 14. Since components can be mounted and the second board 3 can be mounted at the first mounting station 12, it can be produced simultaneously on the two boards 2 and 3, and the average mounting tact time can be reduced. Can be planned.

又、第2実装ステーション14の方が先に基板2が搬入された実装を開始しているので、第1実装ステーション12より先に実装が完了し、第1実装ステーション12の前工程からすでに基板が搬出されてきている場合は、第1実装ステーション12での実装をキャンセルし、第2実装ステーション14に基板2を搬出し、前工程からの基板を第1実装ステーション12にすぐに搬入できる。第2実装ステーション14では、第1実装ステーション12で実装する予定だった部品の搭載点に対して、第2実装ステーション14に実装の割当てを動的に変更することで、各実装ステーション12、14のアイドル時間を第1実施形態の場合よりも短縮できる。   In addition, since the second mounting station 14 has started the mounting in which the substrate 2 is carried in first, the mounting is completed before the first mounting station 12, and the substrate has already been processed from the previous process of the first mounting station 12. Has been carried out, the mounting at the first mounting station 12 can be canceled, the board 2 can be carried out to the second mounting station 14, and the board from the previous process can be carried into the first mounting station 12 immediately. In the second mounting station 14, the mounting assignment is dynamically changed to the second mounting station 14 for the mounting points of the components that are scheduled to be mounted in the first mounting station 12, so that each mounting station 12, 14 is mounted. The idle time can be shortened compared to the case of the first embodiment.

又、基板の搬入動作には、クランプ動作や補正用の基板マーク2M、2N、3M、3Nに対する認識動作、ノズル交換動作等が発生する場合といった搬送による生産状態の変化があり、ステップS12によりそれらを考慮して実装タクトの短縮を図ることができる。例えば、第1実装ステーション12で最後の部品に実装をする前に、前工程から基板が搬出されてきて、第2実装ステーション14がアイドル状態だったとしても、第1実装ステーション12で最後の部品に実装を行ってから基板2を搬出することにより、第2実装ステーション14では基板2を通過させ、時間の掛かる基板の搬入動作を削減することができる。   In addition, there are changes in the production state due to conveyance, such as when a clamping operation, a recognition operation for the correction substrate marks 2M, 2N, 3M, and 3N, a nozzle replacement operation, etc. occur in the substrate carry-in operation. Therefore, the mounting tact can be shortened. For example, even if the board is unloaded from the previous process before mounting on the last component at the first mounting station 12 and the second mounting station 14 is in an idle state, the last component at the first mounting station 12 By carrying out the substrate 2 after carrying out the mounting, the second mounting station 14 allows the substrate 2 to pass through, thereby reducing the time-consuming substrate loading operation.

(第3実施形態)
図6を参照して、部品切れが発生した時のノンストップ生産を可能とした本発明に係る第3実施形態について説明する。
(Third embodiment)
With reference to FIG. 6, a third embodiment according to the present invention that enables non-stop production when a part cut occurs will be described.

第3実施形態は、第1実施形態のように各実装ステーション12、14のフィーダ26に一部共通の部品がある場合の構成でも、第2実施形態のように全く同じ種類の部品がある場合の構成でも適用できる。   In the third embodiment, even when the feeder 26 of each of the mounting stations 12 and 14 has some common parts as in the first embodiment, there are parts of the same type as in the second embodiment. This configuration can also be applied.

以下に、図6に基づき、第3実施形態の手順について説明する。   Below, based on FIG. 6, the procedure of 3rd Embodiment is demonstrated.

第1実装ステーション12において部品切れの生産状態が発生した場合、第1実装ステーション12のフィーダ26の中に、部品切れした部品と同じ部品を供給できる代替のフィーダ26(代替フィーダ)を検索し、当該代替フィーダ26が有るか無かを判定する(ステップS20)。   When a production state in which parts are out of production occurs in the first mounting station 12, an alternative feeder 26 (substitute feeder) that can supply the same parts as the parts out of parts is searched for in the feeder 26 of the first mounting station 12. It is determined whether or not there is the alternative feeder 26 (step S20).

代替フィーダ26が有れば、当該代替フィーダ26を使用して第1実装ステーション12で実装を続け(ステップS21)、代替フィーダ26が無ければ、第2実装ステーション14に前記代替フィーダ26が有るか無かを判定する(ステップS22)。   If there is an alternative feeder 26, mounting is continued at the first mounting station 12 using the alternative feeder 26 (step S21). If there is no alternative feeder 26, whether the alternative feeder 26 is present at the second mounting station 14 or not. It is determined whether there is none (step S22).

ここでも、前記代替フィーダ26が無ければ、第1実装ステーション12における部品切れしたフィーダ26を交換し(ステップS23)、前記代替フィーダ26が有れば、第1実装ステーション12から基板2を搬出する(ステップS24)。   Here, if there is no substitute feeder 26, the feeder 26 that has run out of parts in the first mounting station 12 is replaced (step S23), and if there is the substitute feeder 26, the board 2 is unloaded from the first mounting station 12. (Step S24).

次に、第2実装ステーション14から搬出した基板2を、搬送路24上の位置決め固定の位置まで搬送して固定した後、第2実装ステーション14での実装動作を始める(ステップS25)。   Next, after the board | substrate 2 carried out from the 2nd mounting station 14 is conveyed and fixed to the positioning fixed position on the conveyance path 24, the mounting operation in the 2nd mounting station 14 is started (step S25).

本実施形態によれば、部品切れが発生した時のノンストップ生産を可能となる。又、部品切れ以外の早期に回復できるエラーが第1実装ステーション12等で発生した場合でも、第2実装ステーション14等の後工程に基板を搬送することで、後工程で搬送された基板に部品を実装し続けることができるという、エラーに対する頑健性を有する。特に、第2実施形態の場合、部品実装機や生産ラインを止めることなく、エラーに対処できる。   According to the present embodiment, non-stop production is possible when a component break occurs. In addition, even when an error that can be recovered at an early stage other than out of parts occurs in the first mounting station 12 or the like, by transferring the board to the subsequent process in the second mounting station 14 or the like, the component is transferred to the board transferred in the subsequent process. Has robustness against errors that can continue to be implemented. In particular, in the case of the second embodiment, it is possible to cope with an error without stopping the component mounter or the production line.

なお、第1実施形態、第2実施形態、及び、第3実施形態は、複数の実装ステーションを有する1台の部品実装機でなくても、図7に示される如く、部品実装機40、42、44が直列に接続された部品実装機生産ラインを管理するホストコンピュータ50が接続された部品実装機生産ラインシステム60においても、適用可能であり、各部品実装機のアイドル時間を短縮し、生産ライン全体の稼働率の向上を容易に図ることができ、生産ライン全体の平均的な実装タクトを低減させる等ができる。なお、各実施形態における実装ステーションが、部品実装機に対応する。   In the first embodiment, the second embodiment, and the third embodiment, as shown in FIG. 7, the component mounters 40 and 42 are not necessarily one component mounter having a plurality of mounting stations. , 44 can also be applied to a component mounter production line system 60 to which a host computer 50 that manages a component mounter production line connected in series is connected. The operation rate of the entire line can be easily improved, and the average mounting tact of the entire production line can be reduced. A mounting station in each embodiment corresponds to a component mounting machine.

本発明に係る第1実施形態を適用する部品実装機を模式的に示す平面図The top view which shows typically the component mounting machine to which 1st Embodiment which concerns on this invention is applied. 前記部品実装機において基板上の搭載点に実装された部品を模式的に示す平面図The top view which shows typically the components mounted in the mounting point on a board | substrate in the said component mounting machine 前記第1実施形態の手順を示すフローチャートFlow chart showing the procedure of the first embodiment 本発明に係る第2実施形態を適用する部品実装機を模式的に示す平面図The top view which shows typically the component mounting machine to which 2nd Embodiment which concerns on this invention is applied. 前記第2実施形態の手順を示すフローチャートFlowchart showing the procedure of the second embodiment 本発明に係る第3実施形態の手順を示すフローチャートThe flowchart which shows the procedure of 3rd Embodiment which concerns on this invention. 本発明を適用可能な部品実装機生産ラインシステムの構成を示す説明図Explanatory drawing which shows the structure of the component mounting machine production line system which can apply this invention

符号の説明Explanation of symbols

2…基板
4…部品
10、30、40、42、44…部品実装機
12、14…実装ステーション
26…フィーダ
60…部品実装機生産ラインシステム

DESCRIPTION OF SYMBOLS 2 ... Board | substrate 4 ... Components 10, 30, 40, 42, 44 ... Component mounting machine 12, 14 ... Mounting station 26 ... Feeder 60 ... Component mounting machine production line system

Claims (3)

搬送されてくる基板を位置決め固定し、該基板に部品を実装する実装ステーションが複数直列に接続され、該実装ステーション毎に予め割当てられた基板上の搭載点に、決められた部品を実装する部品実装機において、
前記基板に実装する部品の少なくとも一部が互いに共通とされた複数の実装ステーションと、
該各実装ステーションに割当てられている共通部品の搭載点を、前記部品実装機の生産状態に応じて動的に変更する割当制御手段と、
を有することを特徴とする部品実装機。
A component that mounts a predetermined component at a mounting point on the substrate that is pre-assigned to each of the mounting stations, in which a plurality of mounting stations for mounting and mounting the component on the substrate are connected in series. In the mounting machine,
A plurality of mounting stations in which at least some of the components mounted on the substrate are common to each other;
Allocation control means for dynamically changing the mounting point of the common component allocated to each mounting station according to the production state of the component mounting machine;
A component mounting machine characterized by comprising:
前記割当制御手段が、
実装ステーションの一つにおいて部品切れが発生した場合、該部品と同じ部品を供給できる代替フィーダを他の実装ステーション内で検索し、検索された代替フィーダを有する前記他の実装ステーションに基板を搬送し、検索された前記代替フィーダの部品を前記基板上の搭載点に実装させることを特徴とする請求項1に記載の部品実装機。
The allocation control means is
When a component shortage occurs in one of the mounting stations, an alternative feeder capable of supplying the same component as that component is searched for in another mounting station, and the board is transferred to the other mounting station having the searched alternative feeder. The component mounting machine according to claim 1, wherein the retrieved component of the alternative feeder is mounted on a mounting point on the board.
搬送されてくる基板を位置決め固定し、該基板に部品を実装する部品実装機が複数直列に接続され、該部品実装機毎に予め割当てられた基板上の搭載点に、決められた部品を実装する部品実装機生産ラインシステムおいて、
前記基板に実装する部品の少なくとも一部が互いに共通とされた複数の部品実装機と、
該各部品実装機に割当てられている共通部品の搭載点を、前記部品実装機生産ラインシステムの生産状態に応じて動的に変更する割当制御手段と、
を有することを特徴とする部品実装機生産ラインシステム。
Positioning and fixing the board that is being transported, multiple component mounters that mount components on the board are connected in series, and a predetermined component is mounted at a mounting point on the board that is pre-assigned to each component mounter In the component mounting machine production line system
A plurality of component mounters in which at least some of the components mounted on the substrate are made common to each other;
Allocation control means for dynamically changing the mounting point of the common component allocated to each of the component mounting machines according to the production state of the component mounting machine production line system;
A component mounting machine production line system characterized by comprising:
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011054900A (en) * 2009-09-04 2011-03-17 Yamaha Motor Co Ltd Component mounting machine, and component mounting line
JP2011249548A (en) * 2010-05-26 2011-12-08 Panasonic Corp Component mounting method, component mounting machine, and turn data creation method

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