JP2004288691A - System and method for mounting electronic component - Google Patents

System and method for mounting electronic component Download PDF

Info

Publication number
JP2004288691A
JP2004288691A JP2003075689A JP2003075689A JP2004288691A JP 2004288691 A JP2004288691 A JP 2004288691A JP 2003075689 A JP2003075689 A JP 2003075689A JP 2003075689 A JP2003075689 A JP 2003075689A JP 2004288691 A JP2004288691 A JP 2004288691A
Authority
JP
Japan
Prior art keywords
electronic component
component mounting
mounting
production information
information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003075689A
Other languages
Japanese (ja)
Other versions
JP4127086B2 (en
Inventor
Hideo Matsuoka
英男 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2003075689A priority Critical patent/JP4127086B2/en
Publication of JP2004288691A publication Critical patent/JP2004288691A/en
Application granted granted Critical
Publication of JP4127086B2 publication Critical patent/JP4127086B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system and a method for mounting electronic component by which the operability of data movement can be improved at the time of allocating mounting work. <P>SOLUTION: The electronic component mounting system is constituted by linking a plurality of electronic component mounting devices 2A, 2B, etc., together and connecting the control units 10 of the mounting devices 2A, 2B, etc., to each other through a network. The control unit 10 of each mounting device 2A, 2B, etc., is provided with a function of fetching the production information of the other mounting devices and editing data required for work allocation. Thereby, any one of the mounting devices 2A, 2B, etc., constituting the electronic component mounting system can execute the shifting of the specific portions of the production information of the electronic component mounting devices 2A, 2B, etc., among the mounting devices 2A, 2B, etc., and the updating of the production information after the information is shifted among the mounting devices 2A, 2B, etc., at the time of processing device-wise mounting work allocation for setting/updating the allocation of mounting work to the electronic component mounting devices 2A, 2B, etc. Consequently, the operability of the data movement can be improved at the time of allocating the mounting work. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、電子部品を基板に実装する電子部品実装システムおよび電子部品実装方法に関するものである。
【0002】
【従来の技術】
電子部品実装ラインでは、一般に複数の電子部品実装装置を連結して電子部品実装システムを構成することが行われる。このような電子部品実装システムでは、基板はこれらの電子部品実装装置を順次通過し、各電子部品実装装置においては予め当該装置に割付けられた所定量の電子部品のみが実装される。この方法によれば、1つの電子部品実装装置での実装時間を短縮して、タクトタイムを大幅に短縮することができるという利点がある(例えば特許文献1参照)。
【0003】
上述のような電子部品実装システムでは、各装置間の実装作業の割付は必ずしも固定・不変ではなく、実装作業を実行する過程において割付の変更が必要となる場合がある。例えば1つの基板品種に対して生産開始前のデータ準備作業時に予め設定された初期割付が不適切であった場合には、作業実行過程において各装置間の実装タクトタイムのばらつきが発生するため、このばらつきを極力小さくすることを目的として実装作業の割付を修正する作業が行われる。
【0004】
この作業においては、作業範囲の変更に伴って変更の対象となる電子部品を収容したパーツフィーダを電子部品実装装置間で移動させる作業とともに、これらの実装作業に対応したデータ類、すなわち各パーツフィーダの配列情報を示すフィーダデータや、基板における実装点の位置を示す実装データなど、部品実装動作に必要なデータを入れ替えるデータ移動作業が必要となる。
【0005】
【特許文献1】
特開2000−49498号公報
【0006】
【発明が解決しようとする課題】
フィーダデータや実装データなど、電子部品実装システムにおいて使用されるデータは、一般に共通のデータベースに記憶されており、上述のデータ移動作業に際しては、従来はその都度データベースからデータを読み取って必要な編集処理を行った後、各電子部品実装装置に作業実行用のデータとして取り込ませる方法が用いられていた。
【0007】
しかしながらこのような従来の方法では、移動対象となるデータを各電子部品実装装置に適合させるデータ編集作業が複雑になり、データ移動作業に手間と時間を要するとともに、これらの処理を行うためのデータ処理端末などの専用設備が必要とされていた。このため実装作業の実行過程において作業割付を修正する必要が生じた場合に、迅速にデータ移動処理を行うことが難しく、この作業を簡便な構成で操作性よく実行することが可能な電子部品実装システムが要望されていた。
【0008】
そこで本発明は、実装作業割付の際のデータ移動処理の操作性を向上させることができる電子部品実装システムおよび電子部品実装方法を提供することを目的とする。
【0009】
【課題を解決するための手段】
請求項1記載の電子部品実装システムは、複数の電子部品実装装置を連結しそれぞれの電子部品実装装置の制御部をネットワークで相互に接続して構成された電子部品実装システムであって、前記電子部品実装装置が、電子部品を供給するパーツフィーダが複数配列された部品供給部と、前記制御部によって制御され前記部品供給部から電子部品を取り出して基板に移送搭載する機構部と、前記複数の電子部品実装装置の接続構成情報を記憶する接続構成情報記憶部と、前記接続構成情報に基づいて前記電子部品実装システムを構成する他の電子部品実装装置と通信する通信部と、前記部品供給部における電子部品のパーツフィーダの配列を示す部品供給情報と前記基板における電子部品の実装位置を示す実装情報とを関連づけた生産情報のうち、自装置で実行される実装作業範囲についての生産情報である自己生産情報を記憶する自己生産情報記憶部と、前記他の電子部品実装装置に対し当該電子部品実装装置で実行される実装作業についての生産情報である他装置生産情報を要求する指令を生成する他装置生産情報要求指令生成手段と、前記通信部を介して受信した前記他装置生産情報を記憶する他装置生産情報記憶部と、特定された複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の前記生産情報の更新を実行することにより、当該複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付手段とを備えた。
【0010】
請求項2記載の電子部品実装システムは、請求項1記載の電子部品実装システムであって、前記電子部品実装装置は前記特定された複数の電子部品実装装置の生産情報を同一表示画面に表示する表示手段を備え、前記装置別実装作業割付手段は、前記装置間シフトの対象となる特定部分の部品供給情報を前記表示手段の表示に基づいて指定する入力手段と、指定された部品供給情報の移動に伴ってこの部品供給情報と対応関係にある実装情報を追従移動させる移動リンク手段とを有する。
【0011】
請求項3記載の電子部品実装方法は、電子部品を供給するパーツフィーダが複数配列された部品供給部と、部品供給部から電子部品を取り出して基板に移送搭載し前記制御部によって制御される機構部と、前記複数の電子部品実装装置の接続構成情報を記憶する接続構成情報記憶部と、前記接続構成情報に基づいて前記電子部品実装システムを構成する他電子部品実装装置と通信する通信部と、前記部品供給部における電子部品のパーツフィーダの配列を示す部品供給情報と前記基板における電子部品の実装位置を示す実装情報とを関連づけた生産情報のうち、自装置で実行される実装作業範囲についての生産情報を示す自己生産情報を記憶する自己生産情報記憶部と、前記他の電子部品実装装置に対し当該電子部品実装装置の生産情報を示す他装置生産情報を要求する指令を生成する他装置生産情報要求指令生成手段と、前記通信部を介して受信した前記他装置生産情報を記憶する他装置生産情報記憶部とを備えた電子部品実装装置を複数台連結し、それぞれの電子部品実装装置の制御部をネットワークで相互に接続して構成された電子部品実装システムによる電子部品実装方法であって、特定された複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付処理の実行に際し、これらの複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の前記生産情報の更新を、電子部品実装システムを構成する複数の電子部品実装装置のうちのいずれか1つによって実行する。
【0012】
請求項4記載の電子部品実装方法は、請求項3記載の電子部品実装方法であって、前記装置別実装作業割付処理の実行に際し、前記複数の電子部品実装装置の生産情報を表示手段によって同一表示画面に表示させ、前記設備間シフトの対象となる特定部分の部品供給情報を前記表示手段の表示に基づいて指定し、指定された部品供給情報の移動に伴ってこの部品供給情報と対応関係にある実装情報を移動リンク手段によって追従移動させる。
【0013】
本発明によれば、特定された複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付処理の実行に際し、これらの複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の生産情報の更新を、電子部品実装システムを構成する複数の電子部品実装装置のうちのいずれか1つで実行可能な構成とすることにより、実装作業割付の際のデータ移動処理の操作性を向上させることができる。
【0014】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図1は本発明の一実施の形態の電子部品実装システムの構成図、図2は本発明の一実施の形態の電子部品実装システムの制御系の構成を示すブロック図、図3は本発明の一実施の形態の電子部品実装システムにおけるフィーダ移動処理のフロー図、図4は本発明の一実施の形態の電子部品実装システムの表示画面を示す図、図5は本発明の一実施の形態の電子部品実装システムにおけるフィーダ移動処理時のデータ編集処理を示す説明図である。
【0015】
まず、図1を参照して電子部品実装システムの構成を説明する。図1において、電子部品実装システム1は、3台の電子部品実装装置2A,2B,2C(以下、単に装置A,装置B、装置Cと略記する。)を直列に接続して構成されており、装置A,装置B、装置Cの制御部(図2参照)は、LANシステム9によって相互に接続されている。
【0016】
装置A,装置B、装置Cは、いずれも中央部に水平方向に配列された搬送コンベア3を備えており、これらの装置を直列に接続することにより、各装置の搬送コンベア3は連通した一連の搬送路を形成する。電子部品実装作業時には、上流側から搬入された基板4は装置A,装置B、装置Cの順にこの搬送路を搬送され、各装置において基板4への実装作業が行われる。
【0017】
各装置は、いずれも搬送コンベア3の両側に複数のパーツフィーダ6を並列状態で装着した部品供給部5が設けられている。部品供給部5には、部品(電子部品)を供給するフィーダであるパーツフィーダ6が装着される位置を特定するアドレス1,2,3・・が設定されている。実装作業においては、後述するフィーダデータに基づいてアドレスが指定され、このアドレスによって特定されるパーツフィーダ6から、機構部7の搭載ヘッド8によって電子部品を取り出し、搬送コンベア3に位置決めされた基板4に移送搭載する。機構部7は、後述する制御部によって制御される。
【0018】
次に図2を参照して、電子部品実装システムの制御系の構成を説明する。電子部品実装システムを構成する装置A,装置B、装置Cは、いずれも独立した制御機能を備えており、図2に示すように、各装置ごとに、制御部10、記憶部11、操作・入力部13、表示部14を備えている。これらの各部は通信部15を介してLANシステム9に接続されており、後述するように各装置相互間で指令信号の授受ができるようになっている。なお、図2においては、装置A、装置Bについてのみ図示している
【0019】
まず記憶部11の構成および記憶されるデータの内容について説明する。記憶部11は、接続構成情報記憶部11a、自己生産情報記憶部11b、他装置生産情報記憶部11cより構成される。接続構成情報記憶部11aは、電子部品実装システム1を構成する複数の電子部品実装装置、すなわちここでは装置A,装置B、装置Cの接続構成情報を記憶する。この接続構成情報により、各装置は電子部品実装システムにおける自装置の位置付けおよび他装置の存在を認識することができ、他装置との通信が可能となる。
【0020】
自己生産情報記憶部11bは、部品供給情報12a(部品供給部5におけるパーツフィーダ6の配列を示すフィーダデータ)と、実装情報12b(基板4における電子部品の実装位置を示す実装データ)とを関連づけた生産データ(生産情報)のうち、自装置で実行される実装作業範囲についての生産データである自己生産情報を記憶する。
【0021】
フィーダデータは、図4に示すように、各装置の部品供給部に設定されたアドレス、すなわちテープフィーダなどのパーツフィーダの装着位置と、各アドレスに割り付けられる部品の種類を示すパーツ名および当該部品の供給に用いられるフィーダタイプを示すデータである。他装置生産情報記憶部11cは、他の電子部品実装装置で実行される実装作業についての生産情報である他装置生産情報を記憶する。他装置生産情報も同様に、部品供給情報12aと実装情報12bを組み合わせて構成される。
【0022】
次に制御部10の構成について説明する。制御部10は、排他制御手段10a、他装置生産情報要求指令生成手段10b、他装置生産情報編集手段10c、他装置生産情報更新指令生成手段10d、自己生産情報更新手段10eを含んだ構成となっている。排他制御手段10aは電子部品実装システムを構成する他の電子部品実装装置に対し、排他要求指令信号を出力する。これにより、特定処理操作については他の電子部品実装装置による処理実行が禁止され、排他要求指令信号を出力した装置のみが特定処理操作を実行することができる。
【0023】
他装置生産情報要求指令生成手段10bは、他の電子部品実装装置に対し当該電子部品実装装置で実行される実装作業についての生産情報である他装置生産情報を自装置に送信するよう要求する指令を生成する。この指令を受信した電子部品実装装置は、自装置の自己生産情報記憶部11bに記憶された生産データを、この指令を発信した電子部品実装装置に送る。そして受信した生産データは、当該装置の他装置生産情報記憶部11cに記憶される(図2に示す矢印a参照)。
【0024】
他装置生産情報編集手段10cは他装置生産情報に対して必要な編集処理を行う。すなわち、編集処理の対象となる他装置において生産情報の追加・削除を行う編集処理を、自装置の操作・入力部13からの入力指令に従って自動的に行う。他装置生産情報更新指令生成手段10dは、編集後の他装置生産情報に基づき、他の電子部品実装装置における自己生産情報を更新すべき旨の指令である他装置生産情報更新指令を生成する。自己生産情報更新手段10eは、自己生産情報に対して必要な編集処理、すなわち編集処理の対象となる自装置において生産情報の追加・削除を行う編集処理を、自装置の操作・入力部13からの入力指令に従って行う。
【0025】
このような処理機能を備えた制御部10は、後述するように、特定された複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフト処理、当該装置間シフト後の生産情報の更新処理をそれぞれを実行することにより、当該複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付手段として機能する。
【0026】
操作・入力部13はキーボードやマウスなどの入力手段であり、制御部10に対して各種操作指令やデータの入力を行う。表示部14は表示パネルなどの表示手段であり、操作・入力部13による操作入力時の案内画面や、データ表示を行う。通信部15は通信手段であり、接続構成情報記憶部11aに記憶された接続構成情報に基づいて、各装置間の信号やデータの授受を行う。
【0027】
次に図3を参照して、この電子部品実装システム稼働中におけるフィーダ移動処理について説明する。このフィーダ移動処理は、作業開始前に予め作成され各装置の記憶部に記憶されている生産データに含まれるフィーダデータを変更する操作を行うものであり、作業実行途中において各装置毎のタクトタイムがバランスしていないと判定された場合のラインバランス作業や、突発的な部品切れなどによって実装作業の割付を変更する際などに、必要に応じて随時実行される処理である。
【0028】
本実施の形態に示す電子部品実装システムにおいては、このフィーダ移動処理を電子部品実装システムを構成するいずれの装置によっても実行することが可能となっており、図3に示すフローでは、フィーダの装置間シフトの対象となっている装置Aによってこの処理を実行する例を示している。すなわち、この例では装置Aがデータのシフト元であり、装置Bがデータがシフトされるシフト先となっている。
【0029】
まず図3において、装置Aにおいて、操作者が操作・入力部13を操作してフィーダ移動画面を開く(ST1)(図4参照)。そして、排他制御手段10aにより他の全装置に対して排他要求指令を送信する(ST2)。これにより、装置A以外の他の装置による生産データの改変処理が禁止される。次いで、他装置生産情報要求指令生成手段10bにより指令を生成し、通信部15を介して、装置Aから装置Bに対して他装置生産情報を要求する指令であるフィーダデータ要求指令を送信する(ST3)。このフィーダデータ要求指令を受けて、装置Bは自己生産情報記憶部11bに記憶されているフィーダデータを、通信部15を介して装置Aへ送信する(ST4)。受信した装置Aでは、受信したフィーダデータを他装置生産情報記憶部11cに記憶する(ST5)。
【0030】
次にデータ編集処理が実行される。まず装置Aにおいて、自己生産情報記憶部11bおよび他装置生産情報記憶部11cから読み取った装置Aと装置Bのフィーダデータを、表示部14の1画面に表示する(ST6)。すなわち、図4に示すように、フィーダ移動画面を表す表示画面20には、それぞれ装置A、装置Bのフィーダデータを示すデータウインドウ21A,21Bが開かれる。ここでは表示部14は、特定された複数の電子部品実装装置の生産情報を同一表示画面に表示する表示手段として機能している。
【0031】
そしてこの表示画面上において、操作者がフィーダデータ(部品供給情報)の一部を装置Aから装置Bへマウス操作によって画面上で移動させ、確認ボタンをクリックする(ST7)。すなわち、ウインドウ21A上で装置Aにおいて移動対象となる特定部分のフィーダデータを指定し、次いでこのフィーダデータをウインドウ21Bまでドラッグして装置Bの特定アドレスに貼付ける操作を行う。ここでは、当初装置Aに割り付けられていた部品名bの部品を装置Bのアドレス10に移動させる例を示している。
【0032】
そして装置Aは、装置Bへ移動されたフィーダに関する情報およびこれに関する実装位置のデータ(実装情報12b)を、自己生産情報記憶部11bから読み取り送信する(ST8)。この実装位置についてのデータの送信は、操作者の画面操作を要することなく他装置生産情報編集手段10cによって自動的に行われる。すなわち図5に例示するように、装置Aから装置Bに部品bをシフトする操作を行うことにより、予め部品bに対応して装置Aに記憶されていた実装情報(実装位置のX,Y、θ座標やノズル種類を示す実装データ)が、部品bの移動にリンクして装置Bに移動する。
【0033】
したがって装置別実装作業割付手段としての制御部10は、装置間シフトの対象となる特定部分の部品供給情報を表示手段の表示に基づいて指定する入力手段と、指定されたフィーダデータの移動に伴って、このフィーダデータと対応関係にある実装位置のデータを追従移動させる移動リンク手段とを有するものとなっている。
【0034】
すなわち、電子部品実装システムによる電子部品実装方法においては、装置別実装作業割付処理の実行に際し、複数の電子部品実装装置の生産情報を表示手段によって同一表示画面に表示させ、装置間シフトの対象となる特定部分の部品供給情報を表示手段の表示に基づいて指定し、指定された部品供給情報の移動に伴ってこの部品供給情報と対応関係にある実装情報を移動リンク手段によって追従移動させる形態となっている。
【0035】
データを受信した装置Bは、受信した移動対象のフィーダに関するデータを、自己生産情報更新手段10eによって新たな自己生産情報として自己生産情報記憶部11bに記憶する(ST9)。これにより、装置Bの自己生産情報が更新される。そして装置Bは、他装置生産情報更新指令生成手段10dによって指令を生成し、通信部15を介して装置Aへ他装置生産情報更新指令であるフィーダデータ更新指令を送信する(ST10)。このフィーダデータ更新指令を受信すると、装置Aは移動したフィーダに関するフィーダデータを、自己生産情報更新手段10eによって自己生産データから削除する(ST11)。これにより、装置Aの自己生産情報が更新される。
【0036】
すなわち上記処理により、フィーダの移動元の装置A、移動先の装置Bのいずれにおいても、フィーダの移動に伴うデータの装置間シフトおよび対応する生産データの更新が完了する。ここでは、データのシフト先の装置から先に更新処理が行われるようになっている。そして、装置Aにおいて操作者がフィーダ移動画面を閉じ(ST12)、さらに装置Aから他の全装置に排他解除指令を送信して(ST13)、フィーダ移動処理を終了する。
【0037】
なお図3では、フィーダの移動元の装置Aにおいてフィーダ移動処理のデータ操作を行う例を示しているが、このデータ操作はフィーダの移動先である装置Bで行ってもよいし、またはフィーダの移動に直接関係しない装置Cによってこのデータ操作を行ってもよい。すなわち、本電子部品実装システムによる電子部品実装方法は、特定された複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付処理の実行に際し、これらの複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の生産情報の更新を、電子部品実装システムを構成する複数の電子部品実装装置のうちのいずれか1つによって実行する形態となっている。
【0038】
上記説明したように、本実施の形態に示す電子部品実装システムは、特定された複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付処理の実行に際し、これらの複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の生産情報の更新を、電子部品実装システムを構成する複数の電子部品実装装置のうちのいずれか1つで実行可能な構成としたものである。
【0039】
これにより、作業実行過程において各装置間の実装タクトタイムのばらつきを修正する目的や、部品切れなど突発的な事態に対応する目的で行われる実装作業の割付変更作業において、必要とされるデータ移動作業を操作性よく実行することができる。
【0040】
【発明の効果】
本発明によれば、特定された複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付処理の実行に際し、これらの複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の前記生産情報の更新を、電子部品実装システムを構成する複数の電子部品実装装置のうちのいずれか1つで実行可能な構成としたので、実装作業割付の際のデータ移動処理の操作性を向上させることができる。
【図面の簡単な説明】
【図1】本発明の一実施の形態の電子部品実装システムの構成図
【図2】本発明の一実施の形態の電子部品実装システムの制御系の構成を示すブロック図
【図3】本発明の一実施の形態の電子部品実装システムにおけるフィーダ移動処理のフロー図
【図4】本発明の一実施の形態の電子部品実装システムの表示画面を示す図
【図5】本発明の一実施の形態の電子部品実装システムにおけるフィーダ移動処理時のデータ編集処理を示す説明図
【符号の説明】
1 電子部品実装システム
2A,2B,2C 電子部品実装装置
4 基板
5 部品供給部
6 パーツフィーダ
7 機構部
9 LANシステム
10 制御部
11 記憶部
13 操作・入力部
14 表示部
15 通信部
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting system and an electronic component mounting method for mounting an electronic component on a substrate.
[0002]
[Prior art]
In an electronic component mounting line, generally, a plurality of electronic component mounting apparatuses are connected to form an electronic component mounting system. In such an electronic component mounting system, the board sequentially passes through these electronic component mounting devices, and in each electronic component mounting device, only a predetermined amount of electronic components previously allocated to the device are mounted. According to this method, there is an advantage that the mounting time in one electronic component mounting apparatus can be reduced, and the tact time can be significantly reduced (for example, see Patent Document 1).
[0003]
In the electronic component mounting system as described above, the allocation of the mounting operation between the devices is not necessarily fixed or invariable, and the allocation may need to be changed in the process of performing the mounting operation. For example, if the initial assignment set in advance during the data preparation work before the start of production for one board type is inappropriate, a variation in the mounting tact time between devices occurs in the work execution process. An operation of correcting the assignment of the mounting operation is performed for the purpose of minimizing the variation.
[0004]
In this work, a part feeder accommodating an electronic component to be changed in accordance with a change in the work range is moved between electronic component mounting apparatuses, and data corresponding to the mounting work, that is, each part feeder is moved. It is necessary to perform a data transfer operation for exchanging data necessary for the component mounting operation, such as feeder data indicating the array information and mounting data indicating the position of the mounting point on the board.
[0005]
[Patent Document 1]
JP 2000-49498 A
[Problems to be solved by the invention]
Data used in the electronic component mounting system, such as feeder data and mounting data, is generally stored in a common database. When performing the above-described data movement work, conventionally, data is read from the database each time and necessary editing processing is performed. After that, a method has been used in which each electronic component mounting apparatus takes in the data as work execution data.
[0007]
However, in such a conventional method, the data editing work for adapting the data to be moved to each electronic component mounting apparatus becomes complicated, and the data moving work requires time and effort, and data for performing these processes is required. Special equipment such as a processing terminal was required. For this reason, when it becomes necessary to correct the work assignment in the course of performing the mounting work, it is difficult to quickly perform the data movement processing, and the electronic component mounting can perform this work with a simple configuration and good operability. A system was desired.
[0008]
Therefore, an object of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can improve the operability of data movement processing at the time of mounting work allocation.
[0009]
[Means for Solving the Problems]
The electronic component mounting system according to claim 1, wherein the electronic component mounting system is configured by connecting a plurality of electronic component mounting apparatuses and connecting control units of the respective electronic component mounting apparatuses to each other via a network. A component supply unit in which a plurality of parts feeders for supplying electronic components are arranged, a mechanism unit that is controlled by the control unit, takes out the electronic components from the component supply unit, and transfers and mounts the electronic components on a substrate; A connection configuration information storage unit that stores connection configuration information of the electronic component mounting apparatus, a communication unit that communicates with another electronic component mounting apparatus that configures the electronic component mounting system based on the connection configuration information, and the component supply unit Of the production information in which the component supply information indicating the arrangement of the parts feeder of the electronic component and the mounting information indicating the mounting position of the electronic component on the board are associated with each other. That is, a self-production information storage unit that stores self-production information that is production information on a range of a mounting operation performed by the own device, and a mounting operation performed by the electronic component mounting device with respect to the another electronic component mounting device. Other device production information request command generating means for generating a command for requesting other device production information, which is production information about, and another device production information storage unit for storing the other device production information received via the communication unit By performing the inter-device shift of a specific portion of the production information of the specified plurality of electronic component mounting devices and updating the production information after the inter-device shift, mounting on the plurality of electronic component mounting devices is performed. A device-specific mounting work allocating means for setting and updating the work allocation is provided.
[0010]
An electronic component mounting system according to a second aspect is the electronic component mounting system according to the first aspect, wherein the electronic component mounting apparatus displays production information of the specified plurality of electronic component mounting apparatuses on the same display screen. Display means, the device-specific mounting work allocating means, input means for designating, based on the display of the display means, component supply information of a specific portion to be shifted between the devices, And moving link means for following and moving the mounting information corresponding to the component supply information with the movement.
[0011]
4. The electronic component mounting method according to claim 3, wherein the component supply unit includes a plurality of component feeders that supply the electronic components, and a mechanism that takes out the electronic component from the component supply unit, transfers and mounts the electronic component on a substrate, and is controlled by the control unit. A connection configuration information storage unit that stores connection configuration information of the plurality of electronic component mounting apparatuses, and a communication unit that communicates with another electronic component mounting apparatus that configures the electronic component mounting system based on the connection configuration information. Among the production information in which the component supply information indicating the arrangement of the parts feeders of the electronic components in the component supply unit and the mounting information indicating the mounting positions of the electronic components on the board, the mounting work range executed by the own device. A self-production information storage unit for storing self-production information indicating production information of the electronic component mounting apparatus; An electronic component mounting comprising: another device production information request command generating means for generating a command for requesting other device production information; and another device production information storage unit for storing the other device production information received via the communication unit. An electronic component mounting method using an electronic component mounting system configured by connecting a plurality of devices and interconnecting the control units of the respective electronic component mounting devices via a network, and to a plurality of specified electronic component mounting devices. In performing the mounting operation allocation process for each device for setting / updating the allocation of the mounting operation of the plurality of electronic component mounting devices, the shift of the specific portion of the production information of the plurality of electronic component mounting devices and the production information after the shift between the devices are performed. Is executed by any one of the plurality of electronic component mounting apparatuses constituting the electronic component mounting system.
[0012]
An electronic component mounting method according to a fourth aspect is the electronic component mounting method according to the third aspect, wherein the production information of the plurality of electronic component mounting apparatuses is made the same by a display unit when the device-specific mounting work allocation processing is performed. A part display information is displayed on a display screen, and the part supply information of the specific part to be shifted between the equipments is designated based on the display of the display means. Is moved by the moving link means.
[0013]
According to the present invention, when executing the device-specific mounting work allocation process of setting / updating the allocation of the mounting work to the specified plurality of electronic component mounting devices, the production information of the plurality of electronic component mounting devices is included. The configuration is such that the inter-device shift of the specific part and the update of the production information after the inter-device shift can be performed by any one of the plurality of electronic component mounting apparatuses constituting the electronic component mounting system, thereby realizing mounting. The operability of the data movement processing at the time of work assignment can be improved.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram of an electronic component mounting system according to one embodiment of the present invention, FIG. 2 is a block diagram illustrating a configuration of a control system of the electronic component mounting system according to one embodiment of the present invention, and FIG. FIG. 4 is a flowchart of a feeder moving process in the electronic component mounting system according to one embodiment; FIG. 4 is a diagram illustrating a display screen of the electronic component mounting system according to one embodiment of the present invention; FIG. 9 is an explanatory diagram showing a data editing process at the time of a feeder moving process in the electronic component mounting system.
[0015]
First, the configuration of the electronic component mounting system will be described with reference to FIG. In FIG. 1, an electronic component mounting system 1 is configured by connecting three electronic component mounting apparatuses 2A, 2B, and 2C (hereinafter simply referred to as apparatuses A, B, and C) in series. The control units of the devices A, B and C (see FIG. 2) are interconnected by a LAN system 9.
[0016]
Each of the devices A, B, and C has a transport conveyor 3 arranged in the center in the horizontal direction. By connecting these devices in series, the transport conveyor 3 of each device is connected to a series of connected units. Is formed. At the time of the electronic component mounting operation, the substrate 4 loaded from the upstream side is transported on the transport path in the order of the device A, the device B, and the device C, and the mounting operation on the substrate 4 is performed in each device.
[0017]
Each device is provided with a component supply unit 5 on each side of the transport conveyor 3 on which a plurality of parts feeders 6 are mounted in a parallel state. In the component supply unit 5, addresses 1, 2, 3,... For specifying a position where a parts feeder 6, which is a feeder for supplying components (electronic components), are mounted are set. In the mounting operation, an address is specified based on feeder data to be described later, and the electronic component is taken out from the parts feeder 6 specified by the address by the mounting head 8 of the mechanical unit 7 and the substrate 4 positioned on the transport conveyor 3. To be mounted. The mechanism unit 7 is controlled by a control unit described later.
[0018]
Next, a configuration of a control system of the electronic component mounting system will be described with reference to FIG. Each of the devices A, B, and C constituting the electronic component mounting system has an independent control function. As shown in FIG. 2, a control unit 10, a storage unit 11, an operation An input unit 13 and a display unit 14 are provided. These units are connected to the LAN system 9 via the communication unit 15 so that command signals can be transmitted and received between the devices as described later. In FIG. 2, only the apparatus A and the apparatus B are shown.
First, the configuration of the storage unit 11 and the contents of stored data will be described. The storage unit 11 includes a connection configuration information storage unit 11a, a self-production information storage unit 11b, and another device production information storage unit 11c. The connection configuration information storage unit 11a stores connection configuration information of a plurality of electronic component mounting apparatuses constituting the electronic component mounting system 1, that is, apparatuses A, B, and C in this case. Based on this connection configuration information, each device can recognize the position of its own device in the electronic component mounting system and the presence of another device, and can communicate with other devices.
[0020]
The self-production information storage unit 11b associates the component supply information 12a (feeder data indicating the arrangement of the part feeders 6 in the component supply unit 5) with the mounting information 12b (mounting data indicating the mounting position of the electronic component on the board 4). Of the production data (production information), self-production information that is production data on a mounting work range executed by the own device is stored.
[0021]
As shown in FIG. 4, the feeder data includes an address set in the component supply unit of each apparatus, that is, a mounting position of a parts feeder such as a tape feeder, a part name indicating a type of a part allocated to each address, and a corresponding part. Is the data indicating the feeder type used for the supply. The other device production information storage unit 11c stores other device production information that is production information on a mounting operation performed by another electronic component mounting device. Similarly, other device production information is configured by combining the component supply information 12a and the mounting information 12b.
[0022]
Next, the configuration of the control unit 10 will be described. The control unit 10 includes an exclusive control unit 10a, another device production information request command generation unit 10b, another device production information editing unit 10c, another device production information update command generation unit 10d, and a self-production information update unit 10e. ing. The exclusion control means 10a outputs an exclusion request command signal to other electronic component mounting apparatuses constituting the electronic component mounting system. As a result, the execution of the specific processing operation by another electronic component mounting apparatus is prohibited, and only the apparatus that has output the exclusion request command signal can execute the specific processing operation.
[0023]
The other device production information request command generation means 10b is a command for requesting another electronic component mounting apparatus to transmit the other device production information, which is production information about a mounting operation performed by the electronic component mounting apparatus, to the own device. Generate The electronic component mounting apparatus that has received this instruction sends the production data stored in the self-production information storage unit 11b of the own apparatus to the electronic component mounting apparatus that has transmitted this instruction. The received production data is stored in the other device production information storage unit 11c of the device (see arrow a shown in FIG. 2).
[0024]
The other device production information editing means 10c performs necessary editing processing on the other device production information. That is, an editing process for adding / deleting production information in another device to be edited is automatically performed according to an input command from the operation / input unit 13 of the own device. The other device production information update command generating means 10d generates another device production information update command which is a command to update the self-production information in another electronic component mounting apparatus based on the edited other device production information. The self-production information updating means 10e executes an editing process required for the self-production information, that is, an editing process for adding / deleting production information in the own device to be edited, from the operation / input unit 13 of the self-device. Perform according to the input command of
[0025]
As described later, the control unit 10 having such a processing function performs an inter-device shift process of a specific portion of the production information of the plurality of specified electronic component mounting devices, and a process of the production information after the inter-device shift. By executing the update processing, the update function functions as a device-specific mounting work allocating unit that sets and updates the allocation of the mounting work to the plurality of electronic component mounting devices.
[0026]
The operation / input unit 13 is an input unit such as a keyboard and a mouse, and inputs various operation commands and data to the control unit 10. The display unit 14 is a display means such as a display panel, and displays a guidance screen at the time of operation input by the operation / input unit 13 and data display. The communication unit 15 is a communication unit, and exchanges signals and data between the devices based on the connection configuration information stored in the connection configuration information storage unit 11a.
[0027]
Next, the feeder moving process during the operation of the electronic component mounting system will be described with reference to FIG. This feeder moving process is an operation for changing feeder data included in production data created in advance and stored in the storage unit of each device before the start of work, and the tact time of each device during execution of the work. This is a process that is executed as needed, for example, when it is determined that the balance is not balanced, when the allocation of the mounting operation is changed due to sudden component shortage, or the like.
[0028]
In the electronic component mounting system shown in the present embodiment, the feeder moving process can be executed by any device constituting the electronic component mounting system. In the flow shown in FIG. An example is shown in which this processing is executed by the device A to be shifted. That is, in this example, the device A is a data shift source, and the device B is a shift destination to which data is shifted.
[0029]
First, in FIG. 3, in the device A, the operator operates the operation / input unit 13 to open the feeder moving screen (ST1) (see FIG. 4). Then, the exclusion control unit 10a transmits an exclusion request command to all other devices (ST2). As a result, a process of modifying the production data by a device other than the device A is prohibited. Next, a command is generated by the other device production information request command generation means 10b, and a feeder data request command, which is a command for requesting other device production information, is transmitted from the device A to the device B via the communication unit 15 ( ST3). In response to the feeder data request command, the device B transmits the feeder data stored in the self-production information storage unit 11b to the device A via the communication unit 15 (ST4). The receiving apparatus A stores the received feeder data in the other apparatus production information storage unit 11c (ST5).
[0030]
Next, data editing processing is performed. First, in the device A, the feeder data of the devices A and B read from the self-production information storage unit 11b and the other device production information storage unit 11c are displayed on one screen of the display unit 14 (ST6). That is, as shown in FIG. 4, data windows 21A and 21B showing feeder data of the apparatuses A and B are opened on the display screen 20 representing the feeder moving screen. Here, the display unit 14 functions as a display unit that displays the production information of the specified electronic component mounting apparatuses on the same display screen.
[0031]
Then, on this display screen, the operator moves a part of the feeder data (component supply information) from the apparatus A to the apparatus B on the screen by operating the mouse, and clicks a confirmation button (ST7). That is, the user specifies the feeder data of the specific portion to be moved in the device A on the window 21A, and then drags the feeder data to the window 21B and pastes the data to the specific address of the device B. Here, an example is shown in which a component having a component name b initially assigned to the device A is moved to the address 10 of the device B.
[0032]
Then, the apparatus A reads information on the feeder moved to the apparatus B and data on the mounting position (mounting information 12b) relating to the information from the self-production information storage unit 11b and transmits it (ST8). The transmission of the data on the mounting position is automatically performed by the other apparatus production information editing means 10c without requiring the operator to operate the screen. That is, as illustrated in FIG. 5, by performing an operation of shifting the component b from the device A to the device B, the mounting information (X, Y, The θ coordinate and the mounting data indicating the nozzle type move to the device B in link with the movement of the component b.
[0033]
Therefore, the control unit 10 as a device-specific mounting work allocating unit includes an input unit that specifies, based on the display on the display unit, component supply information of a specific portion to be shifted between the devices, and a movement of the specified feeder data. And moving link means for following and moving the data of the mounting position corresponding to the feeder data.
[0034]
That is, in the electronic component mounting method by the electronic component mounting system, when performing the mounting work allocation process for each device, display the production information of a plurality of electronic component mounting devices on the same display screen by the display means, and set the A form in which the component supply information of a specific part is designated based on the display of the display means, and the mounting information in correspondence with the component supply information is moved by the movement link means in accordance with the movement of the designated component supply information. Has become.
[0035]
The device B that has received the data stores the received data regarding the feeder to be moved as new self-production information in the self-production information storage unit 11b by the self-production information updating unit 10e (ST9). Thereby, the self-production information of the device B is updated. Then, the device B generates a command by the other device production information update command generation means 10d, and transmits a feeder data update command, which is another device production information update command, to the device A via the communication unit 15 (ST10). Upon receiving this feeder data update command, the apparatus A deletes the feeder data relating to the moved feeder from the self-production data by the self-production information updating means 10e (ST11). Thereby, the self-production information of the device A is updated.
[0036]
That is, by the above-described processing, in each of the source device A and the destination device B of the feeder, the shift of the data between the devices due to the movement of the feeder and the update of the corresponding production data are completed. Here, the updating process is performed first from the device to which the data is shifted. Then, in the apparatus A, the operator closes the feeder movement screen (ST12), transmits an exclusion release command from the apparatus A to all other apparatuses (ST13), and ends the feeder movement processing.
[0037]
Note that FIG. 3 shows an example in which the data operation of the feeder moving process is performed in the device A that is the source of the feeder. However, this data operation may be performed in the device B that is the destination of the feeder, or This data manipulation may be performed by the device C not directly related to the movement. That is, the electronic component mounting method according to the present electronic component mounting system performs the device-specific mounting work allocation process of setting / updating the allocation of the mounting work to the specified electronic component mounting devices. An inter-device shift of a specific portion of the production information of the mounting device and an update of the post-device shift production information are executed by any one of the plurality of electronic component mounting devices included in the electronic component mounting system. It has a form.
[0038]
As described above, the electronic component mounting system according to the present embodiment performs the device-specific mounting operation allocation process for setting and updating the allocation of the mounting operation to the specified electronic component mounting devices. The inter-device shift of a specific portion of the production information of the plurality of electronic component mounting apparatuses and the update of the production information after the inter-device shift are performed by any one of the plurality of electronic component mounting apparatuses included in the electronic component mounting system. It is configured to be executable by one.
[0039]
As a result, the data movement required for the purpose of correcting the variation of the mounting tact time between the devices during the work execution process and the change of the mounting work assignment performed for the purpose of responding to a sudden situation such as running out of parts. Work can be executed with good operability.
[0040]
【The invention's effect】
According to the present invention, when executing the device-specific mounting work allocation process of setting / updating the allocation of the mounting work to the specified plurality of electronic component mounting devices, the production information of the plurality of electronic component mounting devices is included. Since the shift of the specific part between the devices and the update of the production information after the shift between the devices can be executed by any one of the plurality of electronic component mounting apparatuses constituting the electronic component mounting system, the mounting is performed. The operability of the data movement processing at the time of work assignment can be improved.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of an electronic component mounting system according to one embodiment of the present invention; FIG. 2 is a block diagram illustrating a configuration of a control system of the electronic component mounting system according to one embodiment of the present invention; FIG. 4 is a flowchart of a feeder moving process in the electronic component mounting system according to one embodiment of the present invention. FIG. 4 is a diagram showing a display screen of the electronic component mounting system according to one embodiment of the present invention. Diagram showing data editing processing at the time of feeder moving processing in the electronic component mounting system of FIG.
REFERENCE SIGNS LIST 1 electronic component mounting system 2A, 2B, 2C electronic component mounting device 4 board 5 component supply unit 6 parts feeder 7 mechanism unit 9 LAN system 10 control unit 11 storage unit 13 operation / input unit 14 display unit 15 communication unit

Claims (4)

複数の電子部品実装装置を連結しそれぞれの電子部品実装装置の制御部をネットワークで相互に接続して構成された電子部品実装システムであって、前記電子部品実装装置が、電子部品を供給するパーツフィーダが複数配列された部品供給部と、前記制御部によって制御され前記部品供給部から電子部品を取り出して基板に移送搭載する機構部と、前記複数の電子部品実装装置の接続構成情報を記憶する接続構成情報記憶部と、前記接続構成情報に基づいて前記電子部品実装システムを構成する他の電子部品実装装置と通信する通信部と、前記部品供給部における電子部品のパーツフィーダの配列を示す部品供給情報と前記基板における電子部品の実装位置を示す実装情報とを関連づけた生産情報のうち、自装置で実行される実装作業範囲についての生産情報である自己生産情報を記憶する自己生産情報記憶部と、前記他の電子部品実装装置に対し当該電子部品実装装置で実行される実装作業についての生産情報である他装置生産情報を要求する指令を生成する他装置生産情報要求指令生成手段と、前記通信部を介して受信した前記他装置生産情報を記憶する他装置生産情報記憶部と、特定された複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の前記生産情報の更新を実行することにより、当該複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付手段とを備えたことを特徴とする電子部品実装システム。An electronic component mounting system configured by connecting a plurality of electronic component mounting apparatuses and interconnecting control units of the respective electronic component mounting apparatuses via a network, wherein the electronic component mounting apparatus supplies an electronic component. A component supply unit in which a plurality of feeders are arranged, a mechanism unit which is controlled by the control unit, takes out electronic components from the component supply unit, transfers the electronic components to a substrate, and stores connection configuration information of the plurality of electronic component mounting apparatuses. A connection configuration information storage unit, a communication unit that communicates with another electronic component mounting device that configures the electronic component mounting system based on the connection configuration information, and a component that indicates an arrangement of a part feeder of the electronic component in the component supply unit. Among the production information in which the supply information and the mounting information indicating the mounting position of the electronic component on the board are associated with the mounting work range executed by the own device. A self-production information storage unit that stores self-production information that is production information of the other electronic component mounting apparatus, and stores other device production information that is production information about mounting work performed by the electronic component mounting apparatus with respect to the other electronic component mounting apparatus. Another device production information request command generation means for generating a request command, another device production information storage unit for storing the other device production information received via the communication unit, and a plurality of specified electronic component mounting apparatuses. Device-specific mounting for setting / updating the assignment of the mounting operation to the plurality of electronic component mounting devices by executing the inter-device shift of a specific portion of the production information and updating the production information after the inter-device shift. An electronic component mounting system, comprising: a work allocating unit. 前記電子部品実装装置は前記特定された複数の電子部品実装装置の生産情報を同一表示画面に表示する表示手段を備え、前記装置別実装作業割付手段は、前記装置間シフトの対象となる特定部分の部品供給情報を前記表示手段の表示に基づいて指定する入力手段と、指定された部品供給情報の移動に伴ってこの部品供給情報と対応関係にある実装情報を追従移動させる移動リンク手段とを有することを特徴とする請求項1記載の電子部品実装システム。The electronic component mounting apparatus includes display means for displaying the production information of the specified plurality of electronic component mounting apparatuses on the same display screen, and the apparatus-specific mounting work allocating means includes a specific part to be subjected to the inter-device shift. Input means for designating the component supply information based on the display of the display means, and movement link means for following and moving the mounting information in correspondence with the component supply information with the movement of the designated component supply information. The electronic component mounting system according to claim 1, further comprising: 電子部品を供給するパーツフィーダが複数配列された部品供給部と、部品供給部から電子部品を取り出して基板に移送搭載し前記制御部によって制御される機構部と、前記複数の電子部品実装装置の接続構成情報を記憶する接続構成情報記憶部と、前記接続構成情報に基づいて前記電子部品実装システムを構成する他電子部品実装装置と通信する通信部と、前記部品供給部における電子部品のパーツフィーダの配列を示す部品供給情報と前記基板における電子部品の実装位置を示す実装情報とを関連づけた生産情報のうち、自装置で実行される実装作業範囲についての生産情報を示す自己生産情報を記憶する自己生産情報記憶部と、前記他の電子部品実装装置に対し当該電子部品実装装置の生産情報を示す他装置生産情報を要求する指令を生成する他装置生産情報要求指令生成手段と、前記通信部を介して受信した前記他装置生産情報を記憶する他装置生産情報記憶部とを備えた電子部品実装装置を複数台連結し、それぞれの電子部品実装装置の制御部をネットワークで相互に接続して構成された電子部品実装システムによる電子部品実装方法であって、
特定された複数の電子部品実装装置への実装作業の割付を設定・更新する装置別実装作業割付処理の実行に際し、これらの複数の電子部品実装装置の生産情報のうちの特定部分の装置間シフトおよび当該装置間シフト後の前記生産情報の更新を、電子部品実装システムを構成する複数の電子部品実装装置のうちのいずれか1つによって実行することを特徴とする電子部品実装方法。
A component supply unit in which a plurality of parts feeders for supplying electronic components are arranged, a mechanical unit that takes out the electronic component from the component supply unit, transfers the electronic component to a substrate, and is controlled by the control unit; A connection configuration information storage unit that stores connection configuration information, a communication unit that communicates with another electronic component mounting apparatus that configures the electronic component mounting system based on the connection configuration information, and a part feeder for electronic components in the component supply unit Out of the production information in which the component supply information indicating the arrangement of the electronic component and the mounting information indicating the mounting position of the electronic component on the board are stored. A self-production information storage unit and a command for requesting the other electronic component mounting apparatus to request other apparatus production information indicating production information of the electronic component mounting apparatus are generated. A plurality of electronic component mounting apparatuses, each of which includes an other device production information request command generating means for performing the operation and an other device production information storage unit that stores the other device production information received via the communication unit, and An electronic component mounting method using an electronic component mounting system configured by interconnecting control units of a component mounting apparatus via a network,
When performing the mounting operation allocation process for each device that sets and updates the allocation of the mounting operation to the specified plurality of electronic component mounting devices, a shift between the devices of a specific portion of the production information of the plurality of electronic component mounting devices is performed. And updating the production information after the shift between the devices by one of a plurality of electronic component mounting apparatuses constituting the electronic component mounting system.
前記装置別実装作業割付処理の実行に際し、前記複数の電子部品実装装置の生産情報を表示手段によって同一表示画面に表示させ、前記設備間シフトの対象となる特定部分の部品供給情報を前記表示手段の表示に基づいて指定し、指定された部品供給情報の移動に伴ってこの部品供給情報と対応関係にある実装情報を移動リンク手段によって追従移動させることを特徴とする請求項3記載の電子部品実装方法。In performing the device-specific mounting work allocation processing, display information on the production information of the plurality of electronic component mounting devices on the same display screen by a display unit, and display the component supply information of the specific part to be shifted between the facilities by the display unit. 4. The electronic component according to claim 3, wherein the electronic component is designated based on the display of the electronic component, and the mounting information corresponding to the component supply information is moved by the moving link means in accordance with the movement of the designated component supply information. Implementation method.
JP2003075689A 2003-03-19 2003-03-19 Electronic component mounting system and electronic component mounting method Expired - Fee Related JP4127086B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003075689A JP4127086B2 (en) 2003-03-19 2003-03-19 Electronic component mounting system and electronic component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003075689A JP4127086B2 (en) 2003-03-19 2003-03-19 Electronic component mounting system and electronic component mounting method

Publications (2)

Publication Number Publication Date
JP2004288691A true JP2004288691A (en) 2004-10-14
JP4127086B2 JP4127086B2 (en) 2008-07-30

Family

ID=33290941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003075689A Expired - Fee Related JP4127086B2 (en) 2003-03-19 2003-03-19 Electronic component mounting system and electronic component mounting method

Country Status (1)

Country Link
JP (1) JP4127086B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339388A (en) * 2005-06-01 2006-12-14 Yamaha Motor Co Ltd Method for managing packaging work, packaging line and packaging machine
JP2008066361A (en) * 2006-09-05 2008-03-21 Juki Corp Part mounting machine and part mounting machine production line system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07136876A (en) * 1993-11-24 1995-05-30 Sanyo Electric Co Ltd Part mounting device
JPH10335894A (en) * 1997-05-28 1998-12-18 Matsushita Electric Ind Co Ltd Method of mounting component
JP2000049498A (en) * 1998-07-30 2000-02-18 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component
JP2000322108A (en) * 1999-05-11 2000-11-24 Sony Corp Electronic parts packaging device
JP2002185200A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Method for mounting electronic component

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07136876A (en) * 1993-11-24 1995-05-30 Sanyo Electric Co Ltd Part mounting device
JPH10335894A (en) * 1997-05-28 1998-12-18 Matsushita Electric Ind Co Ltd Method of mounting component
JP2000049498A (en) * 1998-07-30 2000-02-18 Matsushita Electric Ind Co Ltd Apparatus and method for mounting electronic component
JP2000322108A (en) * 1999-05-11 2000-11-24 Sony Corp Electronic parts packaging device
JP2002185200A (en) * 2000-12-15 2002-06-28 Matsushita Electric Ind Co Ltd Method for mounting electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339388A (en) * 2005-06-01 2006-12-14 Yamaha Motor Co Ltd Method for managing packaging work, packaging line and packaging machine
JP2008066361A (en) * 2006-09-05 2008-03-21 Juki Corp Part mounting machine and part mounting machine production line system

Also Published As

Publication number Publication date
JP4127086B2 (en) 2008-07-30

Similar Documents

Publication Publication Date Title
KR100722697B1 (en) Control system, display device, control-use host computer, and data transmission method
EP2899605B1 (en) Production system and program switching method used for same
CN204644604U (en) A kind of sewing device update device
WO2015029244A1 (en) Data processing device to be used by substrate working machine, and substrate working system having same
JP4127086B2 (en) Electronic component mounting system and electronic component mounting method
CN104790128A (en) Sewing-device upgrading device
CN107786367B (en) Virtual network element configuration method and device
JP2009135177A (en) Component mounting system and method of changing data in component mounting system
US7246184B2 (en) Method for configuring and/or operating an automation device
JP7422282B2 (en) Production control device, production data creation method, and production data creation program
JPH04362783A (en) Cad system having simultaneous concurrent processing function at plural terminals
KR20140049837A (en) Apparatus and method for sharing devices for robot software components
JP6529680B1 (en) Data management system, data management method and data management program
JP6120676B2 (en) Board production management device
EP1082644B1 (en) A control system for controlling process equipment
US20190064780A1 (en) Setting device, fa system, non-transitory computer-readable medium, and control method of setting device
KR20160071036A (en) Apparatus and method for managing data
JP2006301729A (en) Picture preparation method and picture preparation device
WO2023047547A1 (en) Display device and display system
WO2022124153A1 (en) Robot control device, robot control system, and robot control method
CN114072739B (en) Control system, support device, and machine-readable storage medium
WO2020026906A1 (en) Support apparatus, setting method, and setting program
JP5230364B2 (en) Equipment management apparatus and display control method for equipment management apparatus
JP2002341906A (en) Program formula display device and data communication system using the same
JP2024116753A (en) Component mounting system, component mounting device, production data transmission method, and production data reception method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050106

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050708

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070703

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070821

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070925

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20071204

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080122

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080219

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080303

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080422

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080505

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110523

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120523

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120523

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130523

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130523

Year of fee payment: 5

LAPS Cancellation because of no payment of annual fees