JP2017228689A - Substrate transfer mode determination method, substrate transfer mode determination program, and component mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow a component to be effectively mounted when mounting the component by using two mounting parts to a substrate held by two transferring prats arranged in parallel.SOLUTION: A component mounter comprises: two transfer parts arranged in parallel that transfer a substrate in a predetermined substrate transfer direction; and two mounting parts that mount a component at predetermined component mounting places of the substrate held by the difference transfer parts. A substrate transfer mode determination method sets an exclusive region in accordance with a boundary part of the different substrate held by the two transfer parts, and determines a transfer mode of the substrate in the component mounter that retires one of the two mounting parts from the exclusive region while the other is entering the exclusive region. On the basis of a position relationship of each component mounting place and the excluding region in the two substrates in which the component will be mounted during an overlapping period in the component mounter, the transfer mode of the two substrates by the two transfer parts is determined.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting technique for mounting a component on a substrate transported by each of two transport units arranged in parallel.

  2. Description of the Related Art Conventionally, a component mounter that mounts a component supplied by a component supply unit on a substrate using a mounting head is known. Moreover, in such a component mounting machine, various devices are made in order to efficiently mount components on a board. For example, the component mounter of Patent Document 1 that mounts a component on a board that has been moved to a predetermined mounting position by an XY table rotates the board so that the driving distance by the XY table is shortened, thereby quickly moving the board to the mounting position. Move to. In addition, the substrate manufacturing system of Patent Document 2 in which a plurality of component mounting machines arranged in series in the substrate transport direction mount components on a substrate that is sequentially loaded in the substrate transport direction changes the rotation angle of the substrate as appropriate. In order to improve throughput, the board is carried into each component mounting machine.

JP 2001-024396 A JP 2014-032989 A JP2013-084646A

  By the way, in the component mounting machine of Patent Document 3, each of the two transport units (lanes) arranged in parallel carries in and holds the substrate, and the two mounting units (mounting heads) are held by these transport units. Components are mounted on different boards. In particular, in Patent Document 3, an exclusive area in which simultaneous entry of two mounting parts is prohibited is set in order to avoid mutual interference between two mounting parts, and one mounting part enters the exclusive area. The other mounting unit saves from the exclusive area. In a component mounting machine that continues such control, depending on the board transport mode, the other mounting unit may evacuate from the exclusive area and wait for component mounting, which may reduce component mounting efficiency. there were. However, Patent Documents 1 to 3 do not particularly consider this point.

  The present invention has been made in view of the above problems, and is intended to improve the efficiency of component mounting when component mounting is performed using two mounting portions on a board held by two transport units arranged in parallel. The purpose is to provide technology that enables

  The substrate transfer mode determination method according to the present invention includes two transfer units arranged in parallel, each transferring a substrate in a predetermined substrate transfer direction, and predetermined component mounting locations on the substrates held by different transfer units. Two mounting parts for mounting components, and setting an exclusive area corresponding to the boundary part of different boards held by the two transport parts, and setting one of the two mounting parts as an exclusive area A board transfer mode determination method for determining a board transfer mode in a component mounter that retracts the other from an exclusive area while entering, wherein each of the two boards that are scheduled to mount components in a period overlapped by the component mounter Based on the positional relationship between the component mounting location and the exclusive area, the transfer mode of the two boards by the two transfer units of the component mounter is determined.

  The substrate transport mode determination program according to the present invention causes a computer to execute the above-described substrate transport mode determination method.

  The component mounter according to the present invention mounts a component on a predetermined component mounting portion of a substrate held by two transport units arranged in parallel, each transporting a substrate in a predetermined substrate transport direction, and a different transport unit. The exclusive area is set corresponding to the boundary part of the two different mounting parts and the different substrates held by the two transport parts, and the other one of the two mounting parts is entered into the exclusive area while the other And a control unit that evacuates the substrate from the exclusive area, and the control unit is configured to transfer the two substrates on which the components are to be mounted in the overlapping period in the transport mode determined by the substrate transport mode determination method. Transport by.

  In the present invention configured as described above (board transfer mode determination method, board transfer mode determination program, and component mounter), the component mounting locations of each of the two boards that are scheduled to mount components in the overlapping period in the component mounter Based on the positional relationship with the exclusive area, the transfer mode of the two boards by the two transfer units of the component mounter is determined. Therefore, it is possible to determine the transport mode of the two boards so that the positional relationship between the component mounting location and the exclusive area of each of the two boards transported and held by the component mounter is appropriate. Thus, it is possible to improve the efficiency of component mounting.

  Further, based on the positional relationship between the component mounting location and the exclusive area of each of the two boards, the board transport mode is determined so as to determine the angle about the vertical axis when each of the two boards is held by the transport section. A determination method may be configured. In such a configuration, when each of the two substrates is held by the transfer unit so that the positional relationship between the component mounting location and the exclusive area of each of the two substrates transferred and held by the component mounting machine is appropriate. As a result, it is possible to increase the efficiency of component mounting.

  Moreover, based on the positional relationship between the component mounting locations and the exclusive area of each of the two boards, so as to determine one carry-in destination and the other carry-in destination of the two boards from the two transport units, You may comprise the board | substrate conveyance aspect determination method. In such a configuration, two transport destinations of each of the two boards are transported so that the positional relationship between the component mounting location and the exclusive area of each of the two boards transported and held by the component mounting machine is appropriate. As a result, the efficiency of component mounting can be improved.

  In addition, each of a plurality of component mounting machines arranged in series in the board transfer direction shares the component mounting to the mounting charge part among the plurality of parts mounting places on the same board transferred in the board transfer direction. When determining the transport mode of two boards on which components are to be mounted in the system during the overlapping period of each component mounter, the positional relationship between the mounting positions of each of the two boards in each component mounter and the exclusive area Based on the above, the board transfer mode determination method may be configured to determine the mode of transfer of the two boards by the two transfer units of each component mounting machine. As a result, in a component mounting system including a plurality of component mounting machines arranged in series, the positional relationship between the component mounting location and the exclusive area of each of the two boards transported and held by the component mounting machine is appropriate. In addition, it is possible to determine the conveyance mode of the two boards, and as a result, it is possible to improve the efficiency of component mounting.

  At this time, in one component mounting machine among the plurality of component mounting machines, the transfer mode of the two boards by the two transfer units is determined based on the positional relationship between the mounting positions of the two boards and the exclusive area. By executing the processing to be performed for each component mounter, the substrate transport mode determination method may be configured to determine the transport mode of two substrates for each component mounter.

  Alternatively, when one of the two transfer units in the component mounting unit is set as one transfer unit and the other transfer unit is set as the other transfer unit, each of the plurality of component mounting machines includes one transfer unit. The first transfer lane and the second transfer lane are loaded without switching the board between the first transfer lane and the second transfer lane configured by the other transfer unit of each of the plurality of component mounting machines. The two mounting parts of each component mounting machine are used to transfer two sheets based on the positional relationship between the mounting area of each of the two boards in each component mounting machine and the exclusive area under the condition that the angle of the board is maintained. The substrate transport mode determination method may be configured to determine the substrate transport mode.

  As described above, according to the present invention, two boards are transported so that the positional relationship between the component mounting location and the exclusive area of each of the two boards transported and held by the component mounter is appropriate. As a result, it is possible to improve the efficiency of component mounting.

It is a top view which shows typically the structure of the component mounting system provided with the component mounting machine used as the application object of the board | substrate conveyance aspect determination method which concerns on this invention. It is a block diagram which shows the main electrical structures of the component mounting system shown in FIG. It is a flowchart which shows the example of the optimization process of the board | substrate conveyance aspect which can be performed with respect to the component mounting machine of FIG. It is a figure which shows the estimated mounting time calculated | required about the some conveyance aspect in a table format. It is a figure which shows typically an example of the execution result of the flowchart of FIG. It is a top view which shows typically the structure of the other example of the component mounting system provided with the component mounting machine used as the application object of the board | substrate conveyance mode determination method which concerns on this invention. It is a top view which shows typically the structure of another example of the component mounting system provided with the component mounting machine used as the application object of the board | substrate conveyance aspect determination method which concerns on this invention. It is a flowchart which shows the example of the optimization process of the board | substrate conveyance aspect which can be performed with respect to the component mounting machine with which the component mounting system of FIG. It is a figure which shows typically another example of a conveyance aspect adjustment apparatus.

  FIG. 1 is a plan view schematically showing a configuration of a component mounting system including a component mounter that is an application target of a substrate transport mode determining method according to the present invention. FIG. 2 is a block diagram showing the main electrical configuration of the component mounting system shown in FIG. In FIG. 1, XYZ orthogonal coordinate axes in which the Z direction is the vertical direction and the X direction and the Y direction are horizontal directions are shown. As shown in both drawings, the component mounting system 1 includes a component mounter 10 and a server computer 9.

  As shown in FIG. 1, the component mounter 10 includes a first component supply unit 2 a provided on one side in the Y direction and a second component supply unit 2 b provided on the other side in the Y direction. In each component supply unit 2a, 2b, a plurality of feeders 21 are attached side by side in the X direction, and each feeder 21 supplies a component E to the component extraction unit 22 at the tip. The component E includes small electronic components such as a semiconductor integrated circuit device, a transistor, a capacitor, and a resistor.

  The component mounting machine 10 includes a first transport unit 3a and a second transport unit 3b arranged in parallel between the first component supply unit 2a and the second component supply unit 2b. Thus, of the first transport unit 3a and the second transport unit 3b adjacent in the Y direction, the first transport unit 3a is arranged on the first component supply unit 2a side, and the second transport unit 3b is the second component supply unit 2b. Arranged on the side. In other words, the first component supply unit 2a is disposed on the opposite side of the second conveyance unit 3b across the first conveyance unit 3a in the Y direction, and the second component supply unit 2b is the second conveyance unit in the Y direction. Arranged on the opposite side of the first transport unit 3a across 3b. Each of the transfer units 3a and 3b includes a first conveyor unit 31, a second conveyor unit 32, and a third conveyor unit 33 arranged in this order in the X direction, which is the substrate transfer direction, and supports the substrate B substantially horizontally. Then, it is conveyed in the X direction. Each of these conveyor units 31, 32, 33 has a pair of conveyors 35, 35 arranged at intervals in the Y direction, and the intervals in the Y direction of the conveyors 35, 35 correspond to the width of the substrate B in the Y direction. Can be changed.

  In the first transport unit 3a, when the first conveyor unit 31 carries the substrate B from the upstream side in the X direction, the second conveyor unit 32 receives the substrate B from the first conveyor unit 31 and receives a predetermined work position (see FIG. (B substrate B brain position in 1). Further, when the first head unit 4a described later completes the component mounting on the board B at the work position, the second conveyor unit 32 conveys the board B from the work position to the downstream side in the X direction, and the third conveyor unit 33 The substrate B is received from the second conveyor unit 32 and carried out downstream in the X direction. In this way, the first transport unit 3a carries in the substrate B into the work position, holds the substrate B at the work position, and carries out the substrate B from the work position. Similarly, the second transport unit 3b also carries the substrate B into the work position, holds the substrate B at the work position, and carries out the substrate B from the work position.

  Further, the component mounter 10 includes a first head unit 4a provided corresponding to the first component supply unit 2a, and a second head unit 4b provided corresponding to the second component supply unit 2b. In addition, the component mounter 10 includes a first support portion 5a and a second support portion 5b extending in the X direction in order to support the first head unit 4a and the second head unit 4b. Each of the first support portion 5a and the second support portion 5b includes a ball screw 51 extending in the X direction and an X-axis motor 52 that rotates the ball screw 51. The first support portion 5a rotates the ball screw 51 by the X-axis motor 52 to drive the first head unit 4a attached to the nut 511 of the ball screw 51 in the X direction, and the second support portion 5b By rotating the ball screw 51 by the shaft motor 52, the second head unit 4b attached to the nut 511 of the ball screw 51 is driven in the X direction.

  The first support portion 5a and the second support portion 5b are movable in the Y direction along the Y-axis rail 54 by a Y-axis motor 53 (linear motor). That is, field coils are attached to both end portions of the first support portion 5a and the second support portion 5b as movers of the linear motor. On the other hand, in the Y-axis rail 54, a plurality of permanent magnets are arranged along the Y direction and function as a stator of the linear motor. When a current is supplied to the mover of the first support portion 5a, the first support portion 5a moves in the Y direction with the first head unit 4a, and a current is supplied to the mover of the second support portion 5b. Then, the second support portion 5b moves in the Y direction with the second head unit 4b. Thus, each of the first head unit 4a and the second head unit 4b can move in the XY directions above the first transport unit 3a and the second transport unit 3b.

  Each of the first head unit 4a and the second head unit 4b has eight mounting heads 41 arranged in the X direction. Of the first head unit 4a and the second head unit 4b, the first head unit 4a on the first component supply unit 2a side adsorbs the component E supplied by the first component supply unit 2a, and the first transport unit 3a is transferred to the substrate B held at the working position. On the other hand, the second head unit 4b on the second component supply unit 2b side adsorbs the component E supplied by the second component supply unit 2b and transfers it to the substrate B held at the work position by the second transport unit 3b. .

  And in order to control said mechanical structure, the component mounting machine 10 is provided with the control part 100 which controls each part of an apparatus (FIG. 2). The control unit 100 includes an arithmetic processing unit 110 that is a computer composed of a CPU (Central Processing Unit), a RAM (Random Access Memory), and the like, a storage unit 120 that stores a mounting program Pm and various data, and a motor for each motor. It has a motor control unit 130 that controls driving and a communication control unit 140 that communicates with the outside. And the arithmetic processing part 110 controls the drive of the conveyor units 31, 32, and 33 of the 1st conveyance part 3a and the 2nd conveyance part 3b by making the motor control part 130 perform predetermined control operation according to the mounting program Pm. Or driving of the motors 52 and 53 of the first support part 5a and the second support part 5b is controlled. Thereby, the control unit 100 executes component mounting of the board B.

  Incidentally, the substrate B held by the first transfer unit 3a at the work position and the substrate B held by the second transfer unit 3b at the work position are adjacent to each other in the Y direction, and the first head unit 4a and the second head unit 4b are In this way, component mounting is performed on each of two adjacent boards B. Therefore, in order to prevent mutual interference between the first head unit 4a and the second head unit 4b, the control unit 100 sets an exclusive area Re for the boundary portion Bb of these substrates B, and the first head unit 4a and Simultaneous entry of the second head unit 4b into the exclusive area Re is prohibited. The exclusive area Re is set so as to overlap the boundary portion between the substrate B held by the first transfer unit 3a and the substrate B held by the second transfer unit 3b. The exclusive area Re thus set is held by the end on the second transfer unit 3b side of the substrate B held by the first transfer unit 3a and the second transfer unit 3b held by the second transfer unit 3b. It overlaps with the end of the substrate B on the first transfer unit 3a side. Then, the control unit 100 retracts the other of the first head unit 4a and the second head unit 4b from the exclusive area Re during the period during which one of the first head unit 4a and the second head unit 4b is entered into the exclusive area Re. This prevents mutual interference between the first head unit 4a and the second head unit 4b.

  In addition, the control unit 100 receives a mounting program Pm that defines the mounting procedure of components on the board B from the server computer 9 via the communication control unit 140 and stores the mounting program Pm in the storage unit 120. The server computer 9 includes an arithmetic processing unit 910 that is a computer configured with a CPU, a RAM, and the like, a storage unit 920 that stores board data Db and a board transfer mode optimization program Pb described later, and communication between the component mounter 10. A communication control unit 930 that performs communication with the control unit 140. Based on the board data Db indicating the position of each component mounting location on the surface of the board B, the type of component mounted on the component mounting location, etc., the arithmetic processing unit 910 of the server computer 9 creates a mounting program Pm, The data is transmitted to the control unit 100 of the component mounter 10 via the control unit 930.

  Furthermore, the server computer 9 optimizes the substantially horizontal board B transfer mode by the first transfer unit 3a and the second transfer unit 3b included in the component mounter 10, and displays the result on the user interface 94. Accordingly, the user can execute a setup for carrying the board B into the component mounting system 1 in accordance with the display result on the user interface 94. Subsequently, the process of optimizing the substrate transport mode by the server computer 9 will be described.

  FIG. 3 is a flowchart showing an example of optimization processing of the board conveyance mode that can be executed for the component mounting machine of FIG. This flowchart is for optimizing the transport mode of the first transport unit 3a and the second transport unit 3b for the two boards B on which components are to be mounted in the overlapping period in the component mounting system 1, and the calculation of the server computer 9 It is executed by the processing unit 910 performing a calculation based on the substrate transport mode optimization program Pb. In the flowchart of FIG. 3, the first transport unit 3a is shown as a first transport lane, and the second transport unit 3b is shown as a second transport lane.

Here, the conveyance mode of the substrate B is:
The angle at which the first transport unit 3a holds the substrate B at the work position (substrate angle θa (m))
The angle at which the second transport unit 3b holds the substrate B at the work position (substrate angle θb (n))
-It is a concept including the loading destination of each board | substrate B among the 1st conveyance parts 3a and the 2nd conveyance parts 3b. Here, the substrate angles θa (m) and θb (n) are rotation angles around an axis parallel to the normal line of the substrate B (in other words, a vertical axis parallel to the vertical direction Z). There are four substrate angles θa (m), θa (1) = 0 degrees, θa (2) = 90 degrees, θa (3) = 180 degrees, and θa (4) = 270 degrees. There are four types of θb (n): θb (1) = 0 degrees, θb (2) = 90 degrees, θb (3) = 180 degrees, and θb (4) = 270 degrees. Of the postures that can be taken by the substrate B, which one of the postures the substrate angles θa (m) and θb (n) are 0 degrees is set in the server computer 9 in advance by, for example, the user's work. Has been.

  In step S101, the substrate angle θb (n) in the second transport unit 3b is set to the initial angle θb (1), and in step S102, the substrate angle θa (m) in the first transport unit 3a is set to the initial angle θa ( 1). Of the two boards B on which components are to be mounted in the overlapping period in the component mounting system 1, one carry-in destination is set in the first transport unit 3a, and the other transport-in destination is set in the second transport unit 3b. (Step S103). When the transport mode of the board B is thus set in steps S101 to S103, the arithmetic processing unit 910 performs a simulation in which the component mounting system 1 performs component mounting on each board B transported in the transport mode according to the mounting program Pm. The calculation is executed (step S104). In particular, in this simulation, during the period when one of the first head unit 4a and the second head unit 4b is in the exclusive area Re, the other is withdrawn from the exclusive area Re. In this step S104, the expected mounting time required to complete component mounting on both of the two boards B is obtained from the simulation result and stored in the storage unit 920.

  Thus, when the expected mounting time is obtained for one transport mode, the transport mode is changed and a similar simulation is performed to determine the predicted mounting time. That is, in step S105, the transport mode of the substrate B is changed by switching the transport destination of each substrate B between the first transport unit 3a and the second transport unit 3b. Thereby, it is set that each of the two substrates B is transported to the transport destination opposite to the transport destination set in step S103. In step S106, a simulation is performed in the same manner as in step S104 described above, and the expected mounting time required to complete the mounting of both components of the two boards B transported in the transport mode changed in step S105 is obtained. And stored in the storage unit 920.

  In step S107, it is determined whether or not the parameter m for identifying the four substrate angles θa (m) when the first transport unit 3a holds the substrate B is the maximum value (= 4). If it is less than the value (“NO” in step S107), the process proceeds to step S108. On the other hand, if the parameter m is the maximum value (“YES” in step S107), the process proceeds to step S109. Here, since the parameter m is less than the maximum value, the process proceeds to step S108, and the parameter m is incremented. That is, in step S108, the transport mode of the substrate B is changed by changing the substrate angle θa (m) in the first transport unit 3a. Then, by repeatedly executing steps S103 to S106 in the same manner as described above until the parameter m reaches the maximum value, the substrate angle θa (m) in the first transport unit 3a and the loading destination of each substrate B are different from each other. For the transport mode, the expected mounting time is obtained.

  When the parameter m reaches the maximum value (“YES” in step S107), the parameter n for identifying the four substrate angles θb (n) at which the second transport unit 3b holds the substrate B is the maximum value (= 4). If the parameter n is less than the maximum value (“NO” in step S109), the process proceeds to step S110. On the other hand, if the parameter n is the maximum value (“YES” in step S109), the process proceeds to step S111. Here, since the parameter n is less than the maximum value, the process proceeds to step S110 and the parameter n is incremented. That is, in step S110, the transport mode of the substrate B is changed by changing the substrate angle θb (n) in the second transport unit 3b. Then, by repeatedly executing steps S103 to S108 in the same manner as described above until the parameter n reaches the maximum value, the substrate angle θa (m) at the first transport unit 3a and the substrate angle θb at the second transport unit 3b. For (n) and a plurality of transport modes in which the destinations of the respective substrates B are different from each other, an expected mounting time is obtained (FIG. 4).

  Here, FIG. 4 is a diagram showing the expected mounting times obtained for a plurality of transport modes in a table format. The data shown in FIG. 4 is stored in the storage unit 920 by performing the above calculation. Then, the parameter n becomes the maximum value (“YES” in step S109), and when all the data shown in FIG. 4 are prepared, the process proceeds to step S111. In step S111, the transport mode corresponding to the shortest expected mounting time among the predicted mounting times shown in FIG. 4 obtained for each of the plurality of transport modes is the first transport unit 3a and the second transport of the component mounter 10. This is adopted in the substrate transport mode when each substrate B is actually transported by the section 3b. When the flowchart of FIG. 3 is completed in this way, the server computer 9 displays on the user interface 94 so as to execute the setup work for transporting the substrate B in the substrate transport mode adopted in step S111.

  FIG. 5 is a diagram schematically showing an example of the execution result of the flowchart of FIG. In the figure, a component mounting location L where a component E is to be mounted is shown on the surface of the substrate B. In the “worst mode” shown in the figure, all component mounting locations L of the substrate B held by the first transfer unit 3a are included in the exclusive area Re, and all components of the substrate B held by the second transfer unit 3b are included. The mounting location L is included in the exclusive area Re. For this reason, the first head unit 4a and the second head unit 4b cannot enter the exclusive area Re at the same time, and each of them enters the exclusive area Re individually at different times, and these are the exclusive areas Re. There is a tendency that the time for waiting for the mounting of the parts becomes longer. On the other hand, in the “best mode” shown in the figure, all component mounting locations L of the substrate B held by the first transfer unit 3a are located outside the exclusive area Re, and the substrate held by the second transfer unit 3b. All component mounting locations L of B are located outside the exclusive area Re. Thus, since the positional relationship between the component mounting location L of each board B and the exclusive area Re is appropriate, each of the first head unit 4a and the second head unit 4b needs to enter the exclusive area Re with a time lag. The head units 4a and 4b are not allowed to wait for component mounting in the exclusive area Re at the same time. As described above, according to the board transfer mode optimization process of FIG. 3, the transfer mode of the board B is determined so that the number of component mounting locations L included in the exclusive area Re is suppressed. Among the modes, one transport mode in which the number of component mounting locations L included in the exclusive area Re is minimized is selected and adopted.

  In the embodiment described above, a case is simulated in which component mounting is performed on two substrates B transported in each transport mode for each of a plurality of transport modes different from each other. In particular, in this simulation, during the period when one of the first head unit 4a and the second head unit 4b enters the exclusive area Re, the other retreats from the exclusive area Re. And based on the simulation result performed about each conveyance aspect, it determines with conveying the two board | substrates B by the conveyance aspect which becomes the shortest estimated mounting time.

  That is, in this method, the first of the component mounter 10 is based on the positional relationship between the component mounting location L and the exclusive area Re of each of the two boards B on which the component E is to be mounted in the overlapping period of the component mounter 10. The transport mode of the two substrates B by the transport unit 3a and the second transport unit 3b is determined. Therefore, it is possible to determine the transport mode of the two substrates B so that the positional relationship between the component mounting location L and the exclusive area Re is appropriate for each of the two substrates B transported and held by the component mounter 10. As a result, it is possible to improve the efficiency of component mounting.

  Further, based on the positional relationship between the component mounting locations L of the two substrates B and the exclusive region Re, the substrates when the two substrates B are held by the first transport unit 3a and the second transport unit 3b, respectively. The angles θa (m) and θb (n) are determined. Therefore, each of the two substrates B is held by the first transport unit 3a and the second transport unit 3b so that the positional relationship between the component mounting location L and the exclusive area Re of each of the two substrates B is appropriate. Board angles θa (m) and θb (n) can be determined, and as a result, the efficiency of component mounting can be improved.

  Further, in the simulation of steps S104 and S106 of the substrate transfer mode optimization processing shown in FIG. 3, the other is exclusive during the period when one of the first head unit 4a and the second head unit 4b enters the exclusive area Re. Evacuate from area Re. The board transfer mode employed based on the result of such a simulation is based on the positional relationship between the component mounting locations L of the two boards B and the exclusive area Re, and the first transfer unit 3a and the second transfer unit. One carry-in destination and the other carry-in destination of the two substrates B are determined from 3b. That is, as shown in a specific example in FIG. 5, the best mode without the component mounting locations L included in the exclusive region Re is selected instead of the worst mode in which the component mounting locations L included in the exclusive region Re are many. Thus, the first transport unit 3a and the second transport unit 3b are transported to the respective transport destinations of the two substrates B so that the positional relationship between the component mounting locations L and the exclusive regions Re of the two substrates B is appropriate. As a result, the efficiency of component mounting can be improved.

  By the way, in the said embodiment, the component mounting system 1 provided with the one component mounting machine 10 was mentioned as an example, and it demonstrated. However, when determining the transport mode of the substrate B in the component mounting system 1 including the plurality of component mounters 10 arranged in series in the X direction, the above-described substrate transport mode optimization process can be used.

  FIG. 6 is a plan view schematically showing the configuration of another example of a component mounting system provided with a component mounting machine to which the substrate transfer mode determining method according to the present invention is applied. As shown in the figure, in this component mounting system 1, three component mounters 10 are arranged in series in the X direction, and the three component mounters 10 have a plurality of component mounting locations on the same board B. The component mounting to L is shared. In the figure, in order to distinguish these three component mounting machines 10, different symbols 10A, 10B, and 10C are given from the upstream side in the X direction. Moreover, the white component mounting location L shown on the surface of the substrate B held in the component mounting machines 10A to 10C indicates the component mounting location L in which the corresponding component mounting machines 10A to 10C are responsible for component mounting. . That is, the component mounter 10A is in charge of component mounting at the component mounting location La, the component mounter 10B is in charge of component mounting at the component mounting location Lb, and the component mounter 10c is in charge of component mounting at the component mounting location Lc. Handle. A hatched component mounting location L indicates a component mounting location L on which components have been mounted by the upstream component mounting machine 10 in the X direction.

  The component mounting system 1 includes a transport mode adjusting device 7 between two component mounters 10 and 10 adjacent in the X direction. Each conveyance mode adjustment device 7 includes a first conveyance unit 71a and a second conveyance unit 71b adjacent to the first conveyance unit 71a in the Y direction. Each of the first transport unit 71a and the second transport unit 71b arranged in parallel in this way has a pair of conveyors 72 and 72 arranged at intervals in the Y direction, and these conveyors 72 and 72 move in the X direction. The substrate B is transferred. And in each conveyance mode adjustment apparatus 7, after the 1st conveyance part 71a temporarily hold | maintains the board | substrate B received from the 1st conveyance part 3a of the upstream component mounting machine 10 of a X direction, it is a downstream of a X direction. After the second transfer unit 71b temporarily holds the substrate B received from the second transfer unit 3b of the component mounting machine 10 on the upstream side in the X direction. , And transported to the second transport unit 3b on the downstream side in the X direction.

  Further, each transport mode adjusting device 7 includes a scalar robot 74 that can pick up and rotate the substrate B from the first transport unit 71a or the second transport unit 71b. The scalar robot 74 has the same configuration as the scalar robot described in Japanese Patent Application Laid-Open No. 2014-032989 (Patent Document 2). That is, the scalar robot 74 has a base portion 741, a first arm 742 whose base end portion is rotatably attached to the base portion 741 and extending in the horizontal direction, and a tip portion of the first arm 742 that is rotatably attached. And a second arm 743 extending in the horizontal direction. Further, the scalar robot 74 has a suction head 744 at the tip of the second arm 743, and the suction head 744 moved right above the target substrate B by adjusting the rotation angles of the first arm 742 and the second arm 743. The substrate B is picked up by suction.

  Each such transport mode adjusting device 7 uses the first transport unit 71 a, the second transport unit 71 b, and the scalar robot 74 to change the rotation angle of the substrate B, and the first transport lane 8 a and the second transport lane. The substrate B can be exchanged with 8b. In other words, the rotation angle of the substrate B is changed by rotating the suction head 744 of the scalar robot 74 that picks up the substrate B and then rotating the substrate B, and then transferring the substrate B to the first transport unit 71a or the second transport unit 71b. It can be executed by placing it on. In addition, the replacement of the substrate B is performed by changing the substrate B picked up from one side by the scalar robot 74 while one of the first transfer unit 71a and the second transfer unit 71b holds the substrate B and the other is empty. It can be executed by transferring.

  Thus, in the component mounting system 1, the first transport units 3a, 71a, 3a, 71a, 3a arranged in series in the X direction constitute the first transport lane 8a, and the second transport units arranged in series in the X direction. The conveyance units 3b, 71b, 3b, 71b, and 3b constitute a second conveyance lane 8b. Then, the component mounting system 1 mounts the component E on the substrate B by each component mounter 10 while transporting the substrate B in the X direction in each of the first transport lane 8a and the second transport lane 8b arranged in parallel. . At this time, the component mounting system 1 sets the board angles θa (m) and θb (n) of the board B and the first transport unit 3a and the first destination to be carried in before the board B is carried into each component mounter 10. 2 The conveyance part 3b can be suitably adjusted with the conveyance aspect adjustment apparatus 7. FIG.

  Therefore, the server computer 9 included in the component mounting system 1 optimizes the transport mode of the board B in each component mounter 10 by the board transport mode optimization process shown in FIG. Specifically, in each of the component mounting machines 10A to 10C, two sheets by the first transport unit 3a and the second transport unit 3b based on the positional relationship between the mounting positions La to Lc of the two substrates B and the exclusive area Re. The process for determining the transport mode of the board B (board transport optimization process) is individually performed for each of the component mounting machines 10A to 10C. As a result, the conveyance mode of the two boards B is determined for each component mounter 10 and displayed on the user interface 94.

  Thus, as a result of optimizing the transfer mode of the two substrates B by the first transfer unit 3a and the second transfer unit 3b in each component mounter 10, each component mounter 10A, 10B, 10C is in charge of mounting. The positional relationship between the locations La, Lb, and Lc and the exclusive area Re is optimized. Specifically, in the component mounting machine 10A, all the mounting positions La that the mounting machine 10A is in charge of mounting out of the component mounting positions L of the board B held by the first transfer unit 3a and the second transfer unit 3b. It is out of the exclusive area Re. Similarly, in the component mounters 10B and 10C, the mounting positions Lb and Lc are out of the exclusive area Re. As described above, also in the example illustrated in FIG. 6, the transport mode of the board B is determined so that the number of component mounting locations L included in the exclusive region Re is suppressed. One conveyance mode in which the number of component mounting locations L included in the exclusive area Re is minimized is selected and adopted.

  As described above, in the example illustrated in FIG. 6, the component mounters 10 </ b> A to 10 </ b> A to 10 </ b> C are based on the positional relationship between the mounting positions La, Lb, and Lc of the two boards B and the exclusive area Re. The transfer mode of the substrate B by the first transfer unit 3a and the second transfer unit 3b of 10C is determined. As a result, in the component mounting system 1 including a plurality of component mounting machines 10A to 10C arranged in series, the component mounting locations L and the exclusive areas of the two boards B transported and held by the component mounting machines 10A to 10C. The transfer mode of the two boards B can be determined so that the positional relationship with Re is appropriate, and as a result, the efficiency of component mounting can be improved.

  FIG. 7 is a plan view schematically showing the configuration of another example of a component mounting system provided with a component mounting machine to which the substrate transfer mode determining method according to the present invention is applied. FIG. 8 is a flowchart showing an example of the optimization process of the board transfer mode that can be executed for the component mounter provided in the component mounting system of FIG. In FIG. 8, steps that are the same as those in FIG.

  The example of FIG. 7 is different from the example of FIG. 6 in that the conveyance mode adjusting device 7 is not provided. Thus, in the example of FIG. 7, since the conveyance mode adjustment device 7 is not provided, the angle of the board B cannot be changed before being loaded into the component mounters 10 </ b> B and 10 </ b> C. However, the angle of the board B can be changed before carrying into the component mounting machine 10A, in other words, before carrying into the first transport lane 8a and the second transport lane 8b. Therefore, the server computer 9 executes the substrate transfer mode optimization process of FIG.

  By executing steps S101 and S102 in the same manner as described above, the substrate angle θb (n) of the substrate B carried in and held in the second transport lane 8b and the substrate B carried in and held in the first transport lane 8a A substrate angle θa (m) is set. When the transport mode of the substrate B is set in this way, there is a case where component mounting is performed by each of the component mounting machines 10A to 10C while transporting the substrate B by the first transport lane 8a and the second transport lane 8b in the transport mode. Simulation is performed (step S201). Thus, in step S201, the expected mounting times of the step component mounting machines 10A to 10C are obtained and stored in the storage unit 920. In step S202, the expected cycle time in the entire component mounting system 1 is calculated from the expected mounting times of the component mounting machines 10A to 10C obtained in step S201.

  Then, steps S201 and S202 are repeated while incrementing the parameter m until the substrate angle θa (m) reaches the maximum value (steps S107 and S108), and the parameter n is incremented until the substrate angle θb (n) reaches the maximum value. However, steps S201, S202, S107, and S108 are repeated (steps S109 and S110). As a result, the expected cycle time is obtained for a plurality of transfer modes in which the substrate angle θa (m) in the first transfer lane 8a and the substrate angle θb (n) in the second transfer lane 8b are different from each other. In step S203, the transport mode corresponding to the shortest expected cycle time among the predicted cycle times obtained for each of the plurality of transport modes is the first transport lane 8a and the second transport lane 8b of the component mounting system 1. This is adopted for the substrate transfer mode when each substrate B is actually transferred. When the flowchart of FIG. 8 is completed in this way, the server computer 9 displays on the user interface 94 so as to execute the setup work for transporting the substrate B in the substrate transport mode adopted in step S203.

  As described above, in the component mounting system 1 of FIG. 7, the first transport lane 8 a and the second transport lane 8 b do not interchange the board B loaded into each other, and the board B of the board B loaded into each other. There is a constraint that the angles θa (m) and θb (n) are maintained. Therefore, in the board transfer mode optimization processing of FIG. 8, under this restriction condition, the mounting positions La, Lb, Lc of the two boards B in each of the component mounting machines 10A, 10B, 10C and the exclusive area Re Based on the positional relationship, the transfer mode of the two substrates B by the first transfer unit 3a and the second transfer unit 3b of each of the component mounting machines 10A, 10B, and 10C is determined.

  Thus, as a result of optimizing the transport mode of the two boards B by the first transport lane 8a and the second transport lane 8b, the positional relationship between the component mounting location L and the exclusive region Re is optimized. That is, as shown in FIG. 7, in the component mounting machines 10 </ b> A and 10 </ b> B, the mounting machines 10 </ b> A and 10 </ b> B are mounted among the component mounting locations L of the board B held by the first transport unit 3 a and the second transport unit 3 b. All the mounting positions La in charge are out of the exclusive area Re. However, since the above-described constraint conditions exist, in the component mounting machine 10C, the mounting area Lc that the mounting machine 10C is responsible for mounting is included in the exclusive area Re. However, in the entire component mounting system 1, the number of component mounting locations L located in the exclusive area Re is reduced, and the cycle time is shortened. That is, in the example shown in FIGS. 7 and 8, the board is arranged so that the number of component mounting places L included in the exclusive area Re is suppressed in the entire component mounting system 1, in other words, in all the component mounting machines 10 </ b> A to 10 </ b> B. The transport mode of B is determined. More specifically, among the multiple transport modes, one transport mode in which the number of component mounting locations L included in the exclusive area Re is minimized is selected and adopted.

  As described above, in the example shown in FIGS. 7 and 8, each component mounting is performed based on the positional relationship between the mounting positions La, Lb, Lc of the two boards B and the exclusive area Re in each of the component mounting machines 10A to 10C. The transport mode of the substrate B by the first transport unit 3a and the second transport unit 3b of the machines 10A to 10C is determined. As a result, in the component mounting system 1 including a plurality of component mounting machines 10A to 10C arranged in series, the component mounting locations L and the exclusive areas of the two boards B transported and held by the component mounting machines 10A to 10C. The transfer mode of the two boards B can be determined so that the positional relationship with Re is appropriate, and as a result, the efficiency of component mounting can be improved.

  Thus, in the above embodiment, the component mounting machine 10 corresponds to an example of the “component mounting machine” of the present invention, and the first transport unit 3a and the second transport unit 3b are the “two transport units” of the present invention. It corresponds to an example, the first head unit 4a and the second head unit 4b correspond to an example of "two mounting parts" of the present invention, the control unit 100 corresponds to an example of "control part" of the present invention, The component mounting system 1 shown in FIG. 6 or 7 corresponds to an example of the “component mounting system” of the present invention, the first transport unit 3a corresponds to an example of the “one transport unit” of the present invention, and the second transport. The section 3b corresponds to an example of the “other transport section” of the present invention, the first transport lane 8a corresponds to an example of the “first transport lane” of the present invention, and the second transport lane 8b corresponds to the “second transport lane” of the present invention. It corresponds to an example of “transport lane”, and the substrate transport mode optimization program Pb is the “substrate The server computer 9 corresponds to an example of the “computer” of the present invention, the substrate B corresponds to an example of the “substrate” of the present invention, and the X direction corresponds to the “substrate” of the present invention. The boundary portion Bb corresponds to an example of the “boundary portion” of the present invention, the exclusive area Re corresponds to an example of the “exclusive area” of the present invention, and the component E corresponds to the “transport direction”. The component mounting location L corresponds to an example of the “component mounting location” of the present invention, and each of the mounting positions La, Lb, and Lc corresponds to an example of the “mounting location” of the present invention. The Z axis shown as appropriate in the figure corresponds to an example of the “vertical axis” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the substrate transfer mode optimization process of FIG. 3, a plurality of transfer modes with different substrate angles θa (m) and θb (n) and the transfer destinations of the substrate B are set, and the optimal transfer mode is selected from these transfer modes. One transport mode was selected and adopted. However, in setting a plurality of transfer modes, it is not always necessary to combine both the substrate angles θa (m), θb (n) and the substrate B destination, and the other is fixed while changing one of them. May be. That is, a plurality of transport modes, one of which is different from the substrate angles θa (m), θb (n), and the substrate B, are set, and one optimal transport mode is selected and adopted from these transport modes. In addition, the substrate transfer mode optimization processing may be executed.

  Further, in the component mounting system 1 shown in FIG. 6, when the board angles θa (m) and θb (n) are fixed and the transfer mode is changed only by changing the transfer destination of the board B, the transfer mode adjustment is performed. The device 7 may be configured as shown in FIG. Here, FIG. 9 is a diagram schematically illustrating another example of the transport mode adjusting device. In the transport mode adjusting apparatus 7 in the figure, the first robot 71a and the second transport 71b can move in the Y direction while maintaining the interval between the conveyors 72 and 72, instead of being provided with the scalar robot 74. ing. Then, the following operation is executed when the loading destination of the board B is replaced in the first transport unit 3a and the second transport unit 3b of the component mounting machine 10 on the downstream side in the X direction.

  First, the first transport unit 71a is aligned with the first transport unit 3a of the upstream component mounter 10 (not shown in FIG. 9) in the X direction, and the second transport unit 71b is upstream in the X direction. It is arranged in a row in the X direction with the second transport section 3b of the component mounting machine 10 on the side. Then, as the two substrates B are unloaded from the component mounting machine 10 on the upstream side in the X direction, the first transport unit 71a receives the substrate B from the first transport unit 3a of the component mounting machine 10, and The second transport unit 71 b receives the board B from the second transport unit 3 b of the component mounting machine 10.

  Subsequently, as shown in the column (A) of FIG. 9, the first transport unit 71 a and the second transport unit 71 b move to one side in the Y direction, and the second transport unit 71 b is a downstream component in the X direction. The first transfer unit 3a of the mounting machine 10 is aligned with the first transfer unit 3a in the X direction, and the substrate B is transferred from the second transfer unit 71b to the first transfer unit 3a. Subsequently, as shown in the column (B) of FIG. 9, the first transport unit 71a and the second transport unit 71b move to the other side in the Y direction, and the first transport unit 71a is a downstream component in the X direction. The second transfer unit 3b of the mounting machine 10 is arranged in a row in the X direction, and the substrate B is transferred from the first transfer unit 71a to the second transfer unit 3b. In this way, the loading destination of the substrate B can be switched.

  Further, when setting a plurality of transport modes having different substrate angles θa (m) and θb (n), the values that can be taken by the substrate angles θa (m) and θb (n) are not limited to the above four types, but four types. It may be less or more.

  In the example shown in FIG. 5, the mode without the component mounting location L included in the exclusive area Re is selected as the best mode. However, in any of the plurality of transport modes, there may be a case where one or more component mounting locations L are included in the exclusive area Re. In such a case, a mode in which the number of component mounting locations L included in the exclusive area Re is minimized among the plurality of transport modes may be selected as the best mode.

  Moreover, in said board | substrate conveyance aspect optimization process, the conveyance aspect of the board | substrate B was determined based on the result of having simulated the estimated mounting time. However, for example, the number of component mounting locations L included in the exclusive area Re is confirmed in each of the plurality of transfer modes, and the board transfer mode optimization process is executed so as to select and adopt the transfer mode that minimizes the number. May be.

1 ... Component mounting system,
8a ... 1st conveyance lane,
8b ... the second transport lane,
10: Component mounting machine,
3a ... 1st conveyance part,
3b ... the second transport unit,
4a ... 1st head unit,
4b ... the second head unit,
100 ... control unit,
9 ... Server computer,
Pb: substrate transport mode optimization program,
B ... Substrate,
Bb ... boundary part,
Re ... Exclusive area,
L ... Part mounting location,
La, Lb, Lc ... place in charge of mounting,
X ... X direction,
Z ... Z direction (vertical axis),
E ... Parts

Claims (8)

Two transport units arranged in parallel for transporting a substrate in a predetermined substrate transport direction, and two mounting units for mounting a component at a predetermined component mounting position of a substrate held by each of the different transport units; An exclusive area corresponding to a boundary portion between different substrates held by each of the two transport sections, and while one of the two mounting sections enters the exclusive area, the other is A board transfer mode determination method for determining a board transfer mode in a component mounter that is retracted from an exclusive area,
The two sheets by the two transport units of the component mounter based on the positional relationship between the component mounting location and the exclusive area of each of the two boards on which components are to be mounted in the overlapping period of the component mounter. Substrate transport mode determination method for determining the transport mode of the substrate.   The angle about a vertical axis when each of the two boards is held by the transport unit is determined based on a positional relationship between the component mounting location of each of the two boards and the exclusive area. A method for determining a substrate transfer mode according to the above.   Based on the positional relationship between the component mounting location of each of the two boards and the exclusive area, one of the two boards and one of the two boards are determined from the two transport sections. The substrate transfer mode determination method according to claim 1 or 2. Each of the plurality of component mounting machines arranged in series in the board conveying direction shares component mounting to a mounting charge part among the plurality of component mounting parts of the same board conveyed in the board conveying direction. 4. The board transfer mode determination method according to claim 1, wherein a transfer mode of the two boards on which components are scheduled to be mounted is determined in a component mounting system in a period overlapped by each of the component mounting machines. And
Based on the positional relationship between the mounting area and the exclusive area of each of the two boards in each of the component mounters, the transport mode of the two boards by the two transport units of the component mounters A substrate transfer mode determination method to be determined.   In the component mounter of the plurality of component mounters, the two substrates are transported by the two transport units based on the positional relationship between the mounting area and the exclusive area of each of the two substrates. The board | substrate conveyance aspect determination method of Claim 4 which determines the conveyance aspect of the said 2 board | substrate for every said component mounting machine by performing the process which determines an aspect about each said component mounting machine.   Of the two transport units in the component mounting unit, when one transport unit is one transport unit and the other transport unit is the other transport unit, the one transport unit of each of the plurality of component mounting machines The first transfer lane and the second transfer are not performed between the first transfer lane that is configured and the second transfer lane that is configured by the other transfer unit of each of the plurality of component mounting machines. Each component mounting is based on the positional relationship between the mounting area and the exclusive area of each of the two boards in each of the component mounting machines under the condition that each of the lanes maintains the angle of the board that has been loaded. The substrate transport mode determination method according to claim 4, wherein a transport mode of the two substrates by the two transport units of the machine is determined.   A substrate transfer mode determination program for causing a computer to execute the substrate transfer mode determination method according to claim 1. Two transport units arranged in parallel, each transporting a substrate in a predetermined substrate transport direction;
Two mounting parts for mounting components at predetermined component mounting positions on the board held by the different transport parts;
An exclusive area is set corresponding to a boundary portion between different substrates held by each of the two transport units, and one of the two mounting units is moved from the exclusive area while entering the exclusive area. A control unit for evacuation,
The said control part carries two said board | substrates by the conveyance aspect determined by the board | substrate conveyance aspect determination method as described in any one of Claim 1 thru | or 6 by which two board | substrates which are going to mount components in the overlap period. Component mounter that transports by part.

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