JP4832281B2 - Substrate transfer device - Google Patents

Description

  The present invention relates to a substrate transport device that presses and positions a printed circuit board from below to a locking portion formed on the transport chute at a position where the printed circuit board is transported along a pair of transport chutes and stopped.

This type of substrate transfer apparatus is known from, for example, Patent Document 1. Then, when it is necessary to convey two printed boards and position the two simultaneously, it is necessary to prevent the first and second printed boards from overlapping.
JP 2004-31469 A

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate transport apparatus that can transport a first printed board and a second printed board so as not to overlap each other and can simultaneously position the two printed boards in the vertical direction.

Therefore, according to the first aspect of the present invention, the printed circuit board is pressed and positioned from below to a locking portion formed on the conveyance chute at a position where the printed circuit board is conveyed by the conveyance belt and stopped along the pair of conveyance chutes. A conveying device, wherein the first printed circuit board conveyed by the conveying belt comes into contact with a regulating member for regulating the position of the first printed circuit board, and at the time of conveying the second printed circuit board A substrate overlap prevention member that keeps the second printed circuit board that is transported at a distance from the transport belt so as not to overlap the first printed circuit board, and a first print that is regulated by the regulating member The substrate, the first printed circuit board, and the second printed circuit board conveyed so as not to overlap each other by the substrate overlap preventing member are raised by a driving source, and The locking portion in which the substrate overlap preventing member also a pressing member provided to raise through the printed boards, was formed on the pair of conveying chutes while pressing from below the engaging portion formed on the chute feed A part of the substrate overlap prevention member is prevented from being lifted by the drive source so as not to be hindered .

  According to a second aspect of the present invention, in the first aspect, the board overlap prevention member is configured such that when the second printed circuit board is transported, the second printed circuit board transported at a distance from the transport belt is the first printed circuit board. It is biased downward so as to keep a distance so as not to overlap the printed circuit board.

In the present invention, the first and second printed circuit boards are transported so as not to overlap each other, and the two sheets can be simultaneously positioned in the vertical direction, and the board overlap prevention member is not hindered from being raised by the drive source. It is possible to provide a substrate transfer device that can be used.

  Embodiments according to the substrate transfer apparatus of the present invention will be described below with reference to the drawings. 1 to 3, reference numeral 1 denotes a pair of substrate transfer shunts (only one is shown for convenience) supported by a shout support (not shown). A conveyor belt 4 is stretched around the provided sprockets 2 and 3 to form a conveyor 1A. Each conveyor belt 4 of each substrate conveyance chute 1 rotates the sprockets 2 and 3 by a drive source such as a drive motor to place both front and rear ends of the printed circuit board P, and from left to right in FIG. Transport to.

  A table (not shown) is arranged below the printed circuit board P, and a plurality of holes are formed on the surface of the table facing the printed circuit board P so as to match the size of the printed circuit board P. Then, backup pins that are in contact with the back surface of the substrate P and horizontally support the substrate P are inserted into appropriate positions of the holes.

  As disclosed in Japanese Utility Model Laid-Open No. 6-52197 filed by the present applicant, a shoe having a roller attached to the tip of a bearing fixed to the XY table (not shown). A lifting / lowering lever is pivotally mounted, and the roller of the lifting / lowering lever is moved up and down by a cylinder so that it is supported by the two substrate transporting shunts 1 together with the shout support. The printed circuit board P is moved up and down, and the shout support is moved up and down while being guided by each guide shaft passing through the XY table.

  Reference numeral 5 denotes a regulating member that regulates the position of the first printed circuit board P by abutting the tip of the first printed circuit board P conveyed by the conveying belt 4, and 6 denotes the second printed circuit board P. A substrate overlap prevention member that is biased downward so that the second printed circuit board P that is transported is kept at a distance that does not overlap the first printed circuit board P during transport. is there.

  The substrate overlap prevention member 6 is provided at an intermediate position between the upstream position and the downstream position of each substrate transport shunt 1, and a base 7 fixed to each substrate transport shunt 1, and penetrates the base 7. An interval forming body 8 comprising a shaft portion 8A, an overlap preventing plate 8B fixed to the upper end of the shaft portion 8A, and a retaining member 8C fixed to the lower end of the shaft portion 8A in a state of passing through the base body 7; The gap forming body 8 is composed of a spring 9 that urges the gap forming member 8 downward to abut the upper surface of the base 7 with the overlap prevention plate 8B. As a result, when the second printed board P is conveyed, the second printed board P is conveyed. The distance between the upper surface of the conveyor belt 4 and the lower surface of the overlap prevention plate 8B is maintained at an interval such that the substrate P does not overlap the first printed circuit board P. This interval is larger than the thickness of one printed board P and smaller than the thickness of two.

  Reference numeral 10 denotes a pressing member, which is provided along the substrate transport chute 1 so as to press the printed circuit board P from below into a locking portion 11 formed on each substrate transport chute 1. That is, the first printed circuit board P regulated by the regulating member 5, the first printed circuit board P, and the second printed circuit board P conveyed so as not to overlap by the board overlap prevention member 6 It is raised by the air cylinder 12 and pressed from below onto the locking portion 11 formed on each of the transport chutes 1 and the board overlap prevention member 6 is also raised via both the printed boards P.

  The lower end of the rod 12A of the air cylinder 12 penetrates the base 7 and sandwiches the bottom surface 10A of the pressing member 10 with the retaining piece 12B at the lower end.

  Note that a guide member (not shown) is provided in the substrate transport shunt 1 to guide the ascending and descending of the pressing member 10 operated by the air cylinder 12. A coil spring (not shown) as an urging member is disposed between the bottom surface 10A of the pressing member 10 and the lower portion of the base body 7 so that the pressing member 10 moves away from the lower portion of the substrate transport shunt 1. That is, the pressing member 10 is urged downward. However, although the pressing member 10 is urged downward by the coil spring in this way, the lowering of the pressing member 10 is restricted by the retaining piece 12B at the lower end of the rod 12A of the air cylinder 12.

  In addition, a part of the intermediate position between the upstream position and the downstream position of the locking portion 11 formed on the pair of substrate transport chutes 1 is cut out, and the overlap prevention plate 8B of the substrate overlap prevention member 6 by the air cylinder 12 is removed. So that it does not hinder the rise.

  With the above configuration, the operation will be described below. First, the first printed circuit board P is inherited from the upstream conveyor 20 and is transported by the pair of substrate transport shunts 1 to, for example, the regulating member 5 that is a positioning reference, and is locked and stopped. In this case, the first printed board P is transported by the transport conveyor 4 without coming into contact with the overlap prevention plate 8B of the board overlap prevention member 6, and is stopped by being locked to the restriction member 5 (FIG. 1). reference).

  Since the speed of the conveyor 1A is faster than that of the upstream conveyor 20, it is between the first printed board P carried into the conveyor 1A and the second printed board P moved from the upstream conveyor 20 to the conveyor 1A. An interval is formed.

  At this time, the spring 9 keeps the distance between the lower surface of the overlap prevention plate 8B and the upper surface of the conveyor belt 4 so that the second printed board P to be conveyed does not overlap the first printed board P. Since it is biased downward and the overlap prevention plate 8B is formed in contact with the upper surface of the base body 7 (see FIG. 2), it is conveyed to the first printed board P locked to the regulating member 5 later. The second printed circuit board P does not get on and the overlap is surely prevented, and the second upstream side surface comes into contact with the downstream side surface of the first printed circuit board P. Stop in state.

  Thereafter, the rod of the cylinder (not shown) is lowered, and the shunt raising / lowering lever is rotated downward accordingly, and the printed circuit board P supported by the two conveying shunts 1 by the guide shaft is Both the substrate transport chute 1 and the shout support are lowered.

  By this lowering, a backup pin is inserted into a hole opened in the XY table. When the both substrate transport shunts 1 are lowered, the backup pin comes into contact with the back surface of the print base P, and the substrate P is Push up and support to hold horizontally. Further, the warp is pushed up by the backup pins even on the substrate P having a warp downstream, and the substrate P is supported horizontally.

  Further, when both transport chutes 1 finish lowering, the state shown in FIG. 3 is changed to the state shown in FIG. 4, that is, the air cylinder 12 is actuated to pull the rod 12A and raise the pressing member 10 to transport the substrate. The printed circuit board P is pressed from below by the locking portion 11 formed on the chute 1 to position the printed circuit board P in the vertical direction.

  In this case, the pressing member 10 that rises simultaneously by the operation of the air cylinder 12 presses the first printed circuit board P and the second printed circuit board P against the engaging portions 11 formed on both conveying chutes 1 from below. At the same time, the overlap prevention plate 8B of the board overlap prevention member 6 is also lifted through the both printed boards P (see FIGS. 5 and 6). In this way, the two printed circuit boards P can be transported so as not to overlap, and then positioned in the vertical direction at the same time.

  Next, the operation of mounting electronic components on both printed circuit boards P thus positioned is started. That is, the component suction nozzle that sucks the electronic component from the component supply device is lowered onto both printed circuit boards P, and the electronic component is mounted at a predetermined position.

  After all the electronic components are mounted, the air cylinder 12 is operated to extend the rod 12A to lower the pressing member 10, and the regulating member 5 is lowered by a driving source (not shown). Thereafter, both printed circuit boards P are transported further downstream by the transport conveyor 4 and the downstream conveyor 21 and delivered to the downstream conveyor 21 (see FIG. 7).

  In the above-described embodiment, an XY table that can be moved to an arbitrary position in the XY direction in the horizontal plane is used and the suction nozzle that moves up and down at a predetermined position is used. However, the suction nozzle can be moved up and down. When a suction nozzle that can move in the XY direction in the horizontal plane is used, a table that does not move in the horizontal direction may be used instead of the XY table.

  Furthermore, in the present embodiment, the present invention is applied to an electronic component automatic mounting apparatus, but various modifications can be made without departing from the gist of the present invention. For example, a coating apparatus that applies a coating agent such as an adhesive to a substrate ( The present invention can also be applied to a so-called dispenser device).

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a front view of one conveyance chute in the state where the 1st printed circuit board was locked to the regulation member. It is a vertical side view in the board overlap prevention member provided in one conveyance chute. It is a vertical side view in the press member before operation provided in one conveyance chute. It is a vertical side view in the pressing member after the operation | movement provided in one conveyance chute. It is a front view of one conveyance chute of the state which has positioned the up-down direction of two printed circuit boards. It is a vertical side view in the board overlap prevention member of the state which has positioned the up-down direction of two printed circuit boards. It is a front view of one conveyance chute in the middle of conveyance of a printed circuit board in the state where a regulating member fell.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate conveyance chute 4 Conveyance belt 5 Restriction member 6 Substrate overlap prevention member 8 Overlap prevention plate 10 Press member 11 Locking part 12 Air cylinder P Printed circuit board

Claims (2)

A substrate transport apparatus that presses and positions the printed circuit board from below to a locking portion formed on the transport chute at a position where the printed circuit board is transported along a pair of transport chutes and stopped. A distance between the regulating member that restricts the position of the first printed circuit board by the contact of the tip of the first printed circuit board conveyed by the belt and the conveying belt is conveyed when the second printed circuit board is conveyed. A substrate overlap prevention member that keeps the second printed circuit board so as not to overlap the first printed circuit board, the first printed circuit board regulated by the regulating member, and the first printed circuit board A substrate and a second printed circuit board conveyed so as not to overlap by the substrate overlap prevention member are raised by a driving source and formed on the conveyance chute Serial locking portion and a pressing member raising through the printed boards also the substrate overlap preventing member while pressing from below provided, cut to part said pair the locking portion formed on the conveying chute The substrate transport apparatus is characterized in that it does not hinder the rise of the substrate overlap prevention member by the drive source .   The board overlap prevention member keeps the distance between the second printed circuit board and the first printed circuit board so that the second printed circuit board is not overlapped with the first printed circuit board when the second printed circuit board is conveyed. The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus is biased downward.

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