JPH09307293A - Substrate positioning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To position a substrate whose size in a substrate transportation direction differs by clamping the surface/back of an end part along the rail of the substrate by means of the descending shift of the rail and releasing clamping with the ascending shift of the rail. SOLUTION: The substrate is pushed and moves in a transportation chute 11 being the substrate transportation rail, a groove 14 and the groove of the other transportation chute, and it stops at a position where it is to be positioned. When the transportation chute 11 and the other transportation chute descend, the flange 19 of a restricted rod 18 removes from a restriction part 20, the end part of the substrate is sandwiched by a plate face 14 and an upper/lower plate 15. Then, it is pressed down and fixed by the energization of a spring. When electronic parts are installed and installation terminates, the transportation chute 11 and the other transportation chute ascend. On a transportation chute 11-side, the flange 19 of the restriction rod 18 is restricted by the restriction part 20 and the clamping of the substrate is released until the transportation chute 11 reaches an ascending position.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board positioning device comprising a horizontally movable XY table and a pair of board carrying rails for positioning a printed board on the XY table.

[0002]

2. Description of the Related Art As a substrate positioning device of this type, a device described in Japanese Patent Application Laid-Open No. 7-212097 is known. According to this conventional technique, the printed circuit board sent from the supply conveyor is transferred onto a substrate transfer rail (chute) provided on the XY table so as to be able to move up and down, and the chute is lowered onto the XY table. At this time, the lever is engaged with the front surface and the rear end surface which are orthogonal to the substrate transport direction to perform positioning.

Further, in this technique, levers are provided at two positions so that positioning can be performed corresponding to different sizes of substrates in the carrying direction.

[0004]

However, in the above-mentioned prior art, if an attempt is made to position a substrate having a different size in the substrate transfer direction, more levers must be provided or the lever positions must be changed. However, there is a problem that it takes time to change the position. Further, if many levers are provided or their positions are automatically changed, there is a problem that the mechanism becomes large.

Therefore, an object of the present invention is to make it possible to easily position substrates having different sizes in the substrate transport direction.

[0006]

Therefore, according to the present invention, a horizontally movable XY table and a printed circuit board are conveyed and positioned to receive the board from a board supply conveyor and to discharge the board. A pair of substrates provided on the XY table so as to be able to move up and down between a height position at which the XY table can be horizontally discharged for a predetermined work on the substrate. A board positioning device comprising a transfer rail, wherein board lowering means is provided for clamping the front and back sides of an end portion of the board along the rail by downward movement of the rail and releasing the clamp by upward movement of the rail. Is.

With this configuration, the end portion in the substrate transport direction is clamped and positioned, so that the size of the substrate in the transport direction can be changed when positioning is performed by sandwiching the surface orthogonal to the transport direction with the lever. Since there is no need to change it, the mechanism is simple. Further, according to the present invention, the clamp means according to claim 1 is provided with a top surface for locking the clamping means on the front surface of the substrate, and a vertical movement member capable of vertically moving with respect to the rail and contacting the rear surface of the substrate. A biasing member for biasing the vertical moving member upward with respect to the rail, and the vertical movement against the biasing force of the biasing member provided on the XY table when the transport rail is raised. And a regulating member that regulates the upward movement of the vertical moving member so as to lower the moving member with respect to the rail.

With this structure, the regulation of the regulation member can be immediately released when the descent is started, so that the substrate is immediately fixed by the biasing member, and the position of the substrate does not shift due to the descent. Further, according to the present invention, an XY table that is movable in the horizontal direction, a board transfer rail that is provided on the XY table and that transfers and positions a printed circuit board, and a relatively high position relative to the board transfer rail. Board feed conveyor rail for sending a substrate to the board transport rail whose position can be changed, and a board discharge conveyor for receiving a board from the board transport rail whose height position can be changed relative to the board transport rail In a board positioning device having a rail, a clamping means provided on at least one of the board carrying rails for clamping the front and back of an end portion of the board along the carrying rail, and the board supply conveyor rail or the board discharge conveyor rail. The substrate transfer rail provided at the substrate transfer rail is at a height position where the substrate can be transferred from the conveyor rail. Those having a driving source for driving the clamping operation.

With this structure, since the board transport rail does not move up and down, the XY table can be clamped without forming a structure for clamping the XY table, and the weight of the XY table is reduced. It can be prevented from increasing. Further, according to the present invention, the substrate carrying rail in claim 3 moves in a direction orthogonal to the substrate carrying direction for changing the substrate width.

Further, according to the present invention, in claim 3 or 4, the top surface for locking the clamp means to the front surface of the board provided on the board transport rail, and the clamp means are moved up and down with respect to the rail to the back surface of the board. An up-and-down moving member capable of abutting, an urging member for urging the up-and-down moving member upward with respect to the rail, and an abutting surface formed on the up-and-down moving member swinging around a horizontal axis. And a swing lever that abuts and vertically moves the vertical movement member.

With this structure, the space of the clamp means attached to the rail can be reduced in the vertical direction.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. In FIG. 2, reference numeral 1 is a base of the electronic component automatic mounting apparatus, and 2 is a rotary table having a mounting head 3 on the periphery. The mounting head 3 takes out a chip-shaped electronic component (not shown) from a component supply unit (not shown) and conveys the component by intermittent rotation of the rotary table 2. Four
Is an X table that moves in the X direction with respect to the base 1 in the horizontal plane by driving the X motor 5, and 6 is driven by the Y motor 7 in the Y direction orthogonal to the X direction on the X table 4. XY that moves and consequently moves in the XY directions in the horizontal plane
It is a table. The electronic components carried by the head 3 are positioned and fixed on a pair of carrying chutes 11, 12 as substrate carrying rails on the XY table 6 and fixed at desired positions on a printed circuit board 8 described later.
It is installed by moving. Reference numeral 9 is a supply conveyor as a board supply conveyor rail for conveying the printed circuit board 8 from the upstream device and supplying it to the transfer chutes 11 and 12, and 10 is the discharge and transfer of the substrate 8 on the transfer chutes 11 and 12 to the downstream device. It is a discharge conveyor as a board discharge conveyor rail for performing.

The transfer chute 1 shown in FIGS. 3 and 5.
Reference numerals 1 and 12 are provided so as to be movable up and down with respect to the XY table 6, so that the substrate 8 can be received from the supply conveyor 9 in the raised position, and the discharge conveyor 10 can receive the substrate 8. It is made possible.
Further, the XY table 6 is horizontally moved XY at the position where the transport chutes 11 and 12 are lowered on the XY table 6, and predetermined work such as mounting of electronic components is performed on the substrate 8.

One of the transfer chutes 11 and 12 is a fixed chute and moves up and down, but XY
It is fixed in the horizontal direction with respect to the table 6. The transfer chute 12 is a movable chute that moves so that it can approach and separate from the chute 11, and its position is changed according to the size (size) of the substrate 8 in the width direction.

Next, a clamp mechanism for positioning the substrate on each of the transfer chutes 11 and 12 will be described with reference to FIGS. 1, 3, 4, 11 and 12. The fixed chute 11 is provided with a groove 14 for guiding and conveying the substrate 8. However, a part of the substrate mounting surface, which is the lower surface of the groove 14, is cut out, and the cutout is formed. Two upper and lower plates 15 move up and down so as to be engageable with the lower surface of the substrate 8 guided by the groove 14 at a portion. The vertical movement is the shoot 11.
Is guided by a guide rod 16 provided upright on the lower surface of the. A flange is formed at the lower end portion of the guide rod 16, and a compression spring 17 is wound between the flange and the upper and lower plates 15 as vertical moving members. It is urged to rise.

The substrate 8 includes the top surface 22 of the groove 14 and the plate 15
It is fixed by being sandwiched between. Further, a regulated rod 18 is erected from the lower portion of the upper and lower plates 15,
A flange 19 is formed at 8. XY table 6
Below the rod 18, a regulating portion 20 is fixed as a regulating member that engages with the flange 19 and regulates the rise of the rod 18, that is, the upper and lower plates 15.

A board which clamps the substrate by downward movement of the transfer chute 11 which is a substrate transfer rail while the upper and lower plates 15, the guide rod 16, the compression spring 17, the regulated rod 18, and the restricting portion 20 lift the clamp to release the clamp. It constitutes a clamp means. Next, the clamp mechanism of the movable chute 12 will be described with reference to FIGS.

Similarly, a notch is also formed in the groove 21 for guiding the conveyance of the substrate 8 of the chute 12, and an upper and lower plate 23 as a vertically moving member that moves up and down in the notch is slidable on the chute 12. It is installed. The upper and lower plates 23 are urged so as to rise by a compression spring 24 provided between the upper and lower plates 23 and a portion extended from the chute 12, and the substrate 8 guided in the groove 21 has the plate 23 and the groove 21. It is fixed by being sandwiched between it and the top surface 25.

A taper surface 27 is formed on the upper and lower plates 23, and the taper surface 27 is provided with a rocking lever 29 that can rock about a shaft 28 extending horizontally in the longitudinal direction of the chute 12 (the substrate transport direction). A cam follower 30 rotatably attached to one end of the cam follower 30 is capable of abutting. A steel ball 3 is rotatably attached to the lower surface of the other end of the swing lever 29.
1 is attached and the tip of the ball is a chute 1
It is in contact with a tapered surface 33 formed on a slide rod 32 which is slidably mounted in parallel with 2. A rod 38 of a substrate clamp cylinder 36 attached to a discharge rail 35 forming the discharge conveyor 10 adjacent to the chute 12 is engageable with the end of the rod 32.

The discharge rail 35 is also movable and is moved in accordance with the movement of the transfer chute 12. Although the rod 38 of the substrate clamp cylinder 36 projects from the position shown in FIGS. 5 and 7 to the position shown in FIG. 8 in the horizontal direction, the rod 32 moves toward the tapered surface 33 which descends in the moving direction. Since the ball 31 of the moving lever 29 is in contact, the coil spring 37 and the spring 2 are moved along with the movement.
The urging force of 4 swings counterclockwise from the state of FIGS. 10 to 9 to lower the upper and lower plates 23.

The upper and lower plates 23, the compression spring 24, the swing lever 29 and the slide rod 32 constitute a clamping means. The operation of the substrate clamp cylinder 36 as a drive source for driving the substrate clamping operation by the clamping means is performed by a signal from a sensor (not shown) that detects the rise of the transfer chutes 11, 12.

A backup plate 40 is provided on the XY table 6 to stand up a backup pin that abuts the back surface (lower surface) of the substrate 8 and prevents the substrate 8 from warping downward. A guide 41 guides the table 6 so that the table 6 can move up and down. The operation of the above configuration will be described below.

First, when the printed circuit board 8 is supplied from the upstream device by the supply conveyor 9, it is moved by the transfer arm (not shown) to the transfer chutes 11, 12 which are elevated to the same height position as the conveyor 9 by the cylinder (not shown). The large substrate 8 is pushed and transferred, moved in the grooves 14 and 21 of the chutes 11 and 12, and stopped at a position to be positioned.

At this time, on the transport chute 11 side, as shown in FIGS.
Since 8 is regulated by the regulation portion 20, it is in a position where it is lowered with respect to the chute 11, and the groove 14 is in an open state. Further, on the chute 12 side, as shown in FIG.
Is caused by the protrusion of the rod 38 of the cylinder 36.
It is in a state of descending against the bias of 7.

Next, on the transport chute 12 side, the cylinder 3
6, the rod 38 is retracted, and the slide rod 3 is urged toward the discharge conveyor 10 by a spring (not shown).
2 moves to the state shown in FIGS. 5 and 7, the steel ball 31 of the swing lever 29 is moved along the tapered surface 33.
9, the swing lever 29 swings clockwise from the state shown in FIG. 9 to the state shown in FIG. 10, and the upper and lower plates 23 rise due to the urging force of the spring 24. It is sandwiched between 23 and fixed.

Next, when the transport chutes 11, 12 are lowered by the operation of a cylinder (not shown), the upper and lower plates 15 which are regulated by the regulating portion 20 against the spring 17 by the lowering of the chute 11 immediately urge the spring 17. 11 rises with respect to the chute 11 as shown in FIG. 11, and the end portion of the substrate 8 is sandwiched between the top surface 14 and the plate 15 and is pressed and fixed by the biasing force of the spring 17 (however, in FIG.
There is no). In this way, both ends of the substrate 8 are clamped and fixed. Since the size of the substrate 8 is large, the chute 1 has two plates 15 and two plates 23.
It is clamped to 1 and 12. The substrate 8 is also fixed by being pushed by the spring 39 from the lateral direction.

Thus, the flange 19 of the regulated rod 18
And the chute 11 descends away from the regulating portion 20. Next, the substrate 8 is lowered to a position where it comes into contact with a backup pin (not shown). Next, the electronic components (not shown) conveyed to the mounting head 3 by the intermittent rotation of the rotary table 2 are mounted on the printed circuit board 8 at a desired position by moving the XY table 6. Since the chute 11 is located at a position lower than the conveyors 9 and 10, the chute 11 does not collide with the conveyor even if it moves horizontally.

Next, when the mounting of the parts is completed, the chutes 11 and 12 are raised and the regulated rod 1 on the chute 11 side.
The flange 19 of No. 8 is regulated by the regulation unit 20, and the plate 2
3 maintains its height position against the urging force of the compression spring 17 (that is, descends with respect to the chute 12), and the chute 1
By the time 1 reaches the raised position, the clamping of the substrate 8 is released.

Next, the rise of the chutes 11 and 12 is detected by a sensor (not shown), and the substrate clamp cylinder 36 is driven by a control device (not shown) based on the detection signal to move and swing the slide rod 32. Two
The swing of 9 lowers the upper and lower plates 23 to release the clamp of the substrate 8. Next, the substrate 8 is discharged and conveyed to the discharge conveyor 10 by a transfer arm (not shown), and a new substrate 8 is transferred onto the transfer chutes 11 and 12.

In this way, the transfer of the substrate 8 is repeated. Next, when it comes to producing a substrate 8 having a different size from the conventional one, if the width is different, the movable transfer chute 12 is moved. At this time, the movable rails (for example, the rails 35) on the same side of the discharge conveyor 10 and the supply conveyor 9 are also moved.

The moving chute 12 can move because there is no projecting portion below the chute 11 under the chute 12. Next, substrates 8 of different sizes
When the substrate 8 is transported, the upper and lower plates 15 and 23 are each two and have a certain length. Therefore, even if the substrates 8 having different sizes in the substrate transport direction are clamped without changing anything. It becomes possible to fix it.

In this embodiment, the clamp system is changed between the fixed and movable chutes 11 and 12.
The shoot 12 may be similar to the shoot 11.
However, the guide rod 16 needs a certain length in order to move the plate up and down without being caught, and the regulated rod 18 also needs a length, and the backup plate 40 is provided with a recess for escaping these. Or, the space between the chute and the backup plate 40 must be widened. If the space is provided in this way, the accuracy of the movement of the substrate 8 with respect to the movement of the XY table is also a problem. Alternatively, when the backup plate 40 having the back-up pins mounted thereon can be moved up and down (whether automatically or manually) depending on the substrate thickness, etc., the backup plate 40 is provided with the restriction portion 20 as in the present embodiment. However, when the backup plate 40 is provided, the vertical movement of the plate for clamping changes depending on the height of the backup plate 40. In the case of the chute 11 on the fixed side as in the present embodiment, since this restricting portion 20 is not a backup plate 40 but is provided on a part of the XY table 6 outside thereof, such a problem does not occur. It is a thing.

As a mechanism for raising and lowering the plate for clamping the substrate 8 by using the vertical movement of the chute 11 as a driving source, other than the method of constantly urging the spring 17 in the closing direction as in the present embodiment, When the chute descends, the vertically moving plate comes into contact with the restricting portion protruding from the XY table and ascends to clamp the board (the weight of the chute clamps the plate, but this weight is not enough. If not, you may urge it with a spring in the pressing direction.),
The clamp may be released when the chute rises. In this case, when the chute is not lowered to the lower end, the substrate 8 is not clamped immediately after the descent starts, and thus the substrate may be displaced during that time. There is an advantage that the rod 18 may not be provided.

Alternatively, both the chutes 11 and 12 may use the cylinder 36. Further, in this embodiment, the chutes 11 and 12 move up and down with respect to the XY table 6, but the chutes 11 and 12 do not move up and down with respect to the XY table 6, and the discharge conveyor 10 and Even when the supply conveyor 9 does not move up and down to obstruct the movement of the XY table 6, the cylinder 36 is provided on the rail of the discharge conveyor 10 or the supply conveyor 9 side like the chute 12 side. It is conceivable that the substrate 6 is clamped by using a clamp, and it is possible to avoid an increase in weight and a need to perform air piping and electric wiring as compared with the case where a drive source for the clamp is provided on the XY table 6. . If air piping or electric wiring is used, it will be attached to a movable part called an XY table, which may interfere with its movement. Also, abrasion due to movement will cause it to have a life and must be replaced.

In the present embodiment, the device for mounting the electronic component on the printed circuit board has been described. However, an XY tape is used to apply an adhesive for temporarily fixing the electronic component to the substrate at a predetermined position on the substrate. The same can be applied to a coating apparatus that moves a substrate by moving a glass. Further, in the present embodiment, the XY table 6 can be moved in all the horizontal directions, but the substrate positioning mechanism of the present embodiment can be applied to a table that moves only in the position direction. It is possible.

[0036]

As described above, according to the present invention, since the end portion in the substrate transport direction is clamped and positioned, the size in the substrate transport direction is reduced when the surface orthogonal to the substrate transport direction is clamped and positioned. Since there is no need to change even if there is a change, it is possible to reduce the labor and simplify the mechanism.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a clamp mechanism when a fixed-side transfer chute is viewed from a substrate transfer direction.

FIG. 2 is a perspective view of an electronic component automatic mounting device to which the present invention is applied.

FIG. 3 is a plan view showing a fixed-side transport chute.

FIG. 4 is a side view showing a clamp mechanism of a fixed-side transfer chute.

FIG. 5 is a plan view showing a movable chute on the movable side.

FIG. 6 is a side view of a transfer chute on the movable side as viewed from the substrate transfer side.

FIG. 7 is a side view of the transfer chute on the movable side as viewed from the side opposite to the substrate transfer side.

FIG. 8 is a side view of the movable-side transfer chute viewed from the opposite side to the substrate-transfer side.

FIG. 9 is a cross-sectional view showing a clamp mechanism of a movable-side transfer chute as seen from the substrate transfer direction.

FIG. 10 is a cross-sectional view showing a clamp mechanism of a movable-side transfer chute as seen from the substrate transfer direction.

FIG. 11 is a cross-sectional view showing a clamp mechanism in which the fixed-side transfer chute is viewed from the substrate transfer direction.

FIG. 12 is a cross-sectional view showing a clamp mechanism when a fixed-side transfer chute is viewed from the substrate transfer direction.

[Explanation of symbols]

 8 Printed Circuit Board 11 Conveying Chute 15 Upper and Lower Plate 16 Guide Rod 17 Compression Spring 18 Regulated Rod 19 Flange 20 Regulator 23 Upper and Lower Plate 24 Compression Spring 27 Tapered Surface 28 Shaft 29 Swing Lever 32 Slide Rod 36 Board Clamp Cylinder

Claims (5)

[Claims] 1. An XY table which is horizontally movable,
The printed board is conveyed and positioned, and the XY table is horizontally moved for receiving the board from the board supply conveyor and at a height position where it can be discharged to the board discharge conveyor and for a predetermined work on the board. In a substrate positioning device comprising a pair of substrate transfer rails provided on the XY table so as to be able to move up and down from a height position, a downward movement of the rails causes an end portion of the substrate along the rails to move. A substrate positioning device is provided, which is provided with substrate clamping means for clamping the front and back sides and releasing the clamp by upward movement of the rail. 2. The clamp means includes a top surface that is provided on the board transport rail and that engages with the board surface, and a vertically moving member that can move up and down with respect to the rail and contact the back surface of the board.
An urging member that urges the vertical moving member upward with respect to the rail, and the vertical moving member that resists the urging force of the urging member that is provided in the XY table when the transport rail rises. The board positioning device according to claim 1, further comprising: a restricting member that restricts an ascending / descending movement of the vertically moving member so as to lower the board relative to the rail. 3. An XY table which is horizontally movable,
A board carrying rail for carrying and positioning a printed board provided on the XY table, and a board for sending the board to the board carrying rail whose height position can be changed relative to the board carrying rail. In a substrate positioning device having a supply conveyor rail and a substrate discharge conveyor rail that receives a substrate from the substrate transfer rail whose height position can be changed relative to the substrate transfer rail, at least one of the substrate transfer rails Clamping means that is provided and clamps the front and back sides of the ends of the board along the transfer rail, and the board transfer rail provided on the board supply conveyor rail or the board discharge conveyor rail can transfer the board from the conveyor rail. A driving source for driving the substrate clamping operation by the clamping means at various height positions. Board positioning device. 4. The substrate positioning device according to claim 3, wherein the substrate transfer rail moves in a direction orthogonal to the substrate transfer direction for changing the substrate width. 5. The clamp means includes a top surface provided on the board transport rail, the top surface being engaged with the board surface, and a vertically moving member that can move up and down with respect to the rail and contact the back surface of the board.
A biasing member that biases the vertical moving member upward with respect to the rail, and a vertical movement of the vertical moving member by rocking around a horizontal axis and contacting a contact surface formed on the vertical moving member. The substrate positioning device according to claim 3 or 4, further comprising: