JP3872840B2 - Substrate positioning device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate positioning apparatus including an XY table movable in a horizontal direction and a pair of substrate transport rails for positioning a printed circuit board on the XY table.
[0002]
[Prior art]
As this kind of substrate positioning device, one described in Japanese Patent Laid-Open No. 7-212097 is known. According to this prior art, the printed circuit board sent from the supply conveyor is transferred onto a board transport rail (chute) provided on the XY table so as to be movable up and down, and the chute is lowered onto the XY table. Then, the lever is engaged with the front surface and the rear end surface orthogonal to the substrate transport direction, and positioning is performed.
[0003]
In this technique, levers are provided at two positions so that positioning can be performed corresponding to different sizes in the substrate transport direction.
[0004]
[Problems to be solved by the invention]
However, in the prior art, when trying to position a substrate with a different size in the substrate transport direction, it is necessary to provide more levers or change the positions of the levers. There was a problem that it took. Also, if a large number of levers are provided or their positions are automatically changed, there is a problem that the mechanism becomes large.
[0005]
Therefore, an object of the present invention is to enable easy positioning of substrates having different sizes in the substrate transport direction.
[0006]
[Means for Solving the Problems]
For this reason, the present invention provides an XY table that can be moved in the horizontal direction, a printed board that is transported and positioned, a height position at which the board can be received from the board supply conveyor and discharged to the board discharge conveyor. In a substrate positioning apparatus comprising a pair of substrate transport rails provided on the XY table so as to be movable up and down between a height position where the XY table moves horizontally for a predetermined operation on the substrate. A board clamping means for clamping the front and back of the end of the board along the rail with the rail by the lowering movement of the rail and releasing the clamp by the raising movement of the rail , the clamping means, A top surface that is engaged with the substrate surface provided on the substrate transport rail, and can move up and down with respect to the rail and come into contact with the back surface of the substrate. An upper and lower plate, a biasing member provided at a plurality of intervals with respect to the upper and lower plates, and biasing the upper and lower plates upward with respect to the rail, and the transport rail provided on the XY table And a regulating member that regulates the raising and lowering of the upper and lower plates so that the upper and lower plates are lowered with respect to the rail against the urging force of the urging member .
[0007]
With this configuration, the end in the substrate transport direction is clamped and positioned by the substrate clamping means having long upper and lower plates along the rail, so when positioning with the lever perpendicular to the transport direction. In addition, since there is no need to change even if the size of the substrate in the transport direction is changed, there is no labor and the mechanism is simple.
Further, since the restriction of the restriction member can be released immediately when the descent is started, the substrate is immediately fixed by the urging member, and the position of the substrate is not shifted by the descent.
Further, biasing members provided at a plurality of intervals with respect to the upper and lower plates bias the upper and lower plates upward with respect to the rail.
The present invention also provides an XY table that can be moved in the horizontal direction, a printed board that is transported and positioned, a height position at which the board can be received from the board supply conveyor and discharged to the board discharge conveyor, and In a substrate positioning apparatus comprising a pair of substrate transport rails provided on the XY table so as to be movable up and down with respect to a height position where the XY table moves horizontally for a predetermined operation on the substrate, The substrate includes clamp means for clamping the front and back of the substrate along the rail with the rail by the downward movement of the rail, and releasing the clamp by the upward movement of the rail. a top surface for engaging the substrate surface provided on the transfer rail, long along the rails can contact the back surface of the substrate to move vertically with respect to the rail A lower plate, a guide bar standing on the lower surface of the rail and provided at a plurality of intervals with respect to the upper and lower plates, and a flange formed at the lower end of the guide bar It said compression spring when said carrier rails provided on the table is raised - the compression spring the vertical plate against wound has been the rails between the upper and lower plates are biased to rise, the XY Te and And a regulating member that regulates the raising and lowering of the upper and lower plates so that the upper and lower plates are lowered with respect to the rail against the urging force.
[0008]
With this configuration, the regulation member can be immediately released when the descent starts, so that the substrate is immediately fixed by the compression spring , and the position of the substrate is not shifted by the descent. Further, the vertical movement of the upper and lower plates is guided by a guide bar provided at a plurality of intervals with respect to the upper and lower plates.
The present invention also provides an XY table movable in the horizontal direction, a board transport rail provided on the XY table for transporting and positioning a printed circuit board, and a relative height relative to the board transport rail. A substrate supply conveyor rail that sends a substrate to the substrate transfer rail whose height position can be changed, and a substrate discharge conveyor that receives a substrate from the substrate transfer rail whose height position can be changed relative to the substrate transfer rail In the substrate positioning apparatus having a rail, a clamp having a long plate along the rail that is provided on at least one of the substrate transport rails and clamps the front and back of the end of the substrate along the transport rail with the rail Means and the substrate supply conveyor rail or the substrate discharge conveyor rail, and the substrate transport rail is based on the conveyor rail. In which the at delivery is possible height positions including a driving source for driving the clamping operation of the substrate by the clamping means.
[0009]
With this configuration, the end in the substrate transport direction is clamped and positioned by the substrate clamping means having a plate, so that when the surface perpendicular to the transport direction is sandwiched between the levers, the substrate transport direction is Since there is no need to change even if the size of the board changes, the mechanism can be simplified and the board can be clamped on the XY table side because the board is not moved up and down by the board transport rail. Even if the above structure is not formed, it is possible to clamp and to prevent the weight of the XY table from increasing.
According to the present invention, the substrate transport rail according to claim 3 is moved in a direction orthogonal to the substrate transport direction in order to change the substrate width.
[0010]
According to a third aspect of the present invention, in the third or fourth aspect, the clamp means can be brought into contact with the back surface of the substrate by moving up and down relative to the top surface of the substrate transport rail provided on the substrate surface. A vertical movement member, an urging member for urging the vertical movement member upward with respect to the rail, and an abutting surface formed on the vertical movement member by swinging about a horizontal axis, It has a rocking lever for moving the vertical movement member up and down.
[0011]
Since it comprised in this way, it becomes possible to make the space of the clamp means attached to a rail small up and down.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
In FIG. 2, 1 is a base of an electronic component automatic mounting apparatus, and 2 is a rotary table having a mounting head 3 on the periphery. The mounting head 3 takes out a chip-shaped electronic component (not shown) from a component supply unit (not shown) and conveys the component by intermittent rotation of the rotary table 2. Reference numeral 4 denotes an X table that moves in the X direction relative to the base 1 in the horizontal plane by driving the X motor 5, and reference numeral 6 denotes a drive of the Y motor 7 in the Y direction orthogonal to the X direction on the X table 4. Is an XY table that moves in the horizontal plane as a result. The electronic component transported by the head 3 is positioned at a desired position on a printed circuit board 8 (described later) which is positioned and fixed on a pair of transport chutes 11 and 12 as substrate transport rails on the XY table 6. It is mounted by moving. 9 is a supply conveyor as a substrate supply conveyor rail for conveying the printed circuit board 8 from the upstream apparatus and supplying it to the conveyance chutes 11 and 12, and 10 is for discharging and conveying the substrate 8 on the conveyance chutes 11 and 12 to the downstream apparatus. It is the discharge conveyor as a board | substrate discharge conveyor rail for performing.
[0013]
The transport chutes 11 and 12 shown in FIGS. 3 and 5 are provided so as to be movable up and down with respect to the XY table 6, and can receive the substrate 8 from the supply conveyor 9 at the raised position. The discharge conveyor 10 can receive the substrate 8.
Further, the XY table 6 moves XY in the horizontal direction at a position where the transport chutes 11 and 12 are lowered on the XY table 6, and a predetermined operation such as mounting of electronic components is performed on the substrate 8.
[0014]
One of the conveyance chutes 11 and 12 is a fixed chute and moves up and down, but is fixed in the horizontal direction with respect to the XY table 6.
The transport chute 12 is a movable chute and moves so as to be able to approach and separate from the chute 11, and its position is changed in accordance with the dimension (size) in the width direction of the substrate 8.
[0015]
Next, a clamp mechanism for positioning the substrate in each of the transport chutes 11 and 12 will be described with reference to FIGS. 1, 3, 4, 11, and 12.
The chute 11 on the fixed side is provided with a groove 14 for guiding and transporting the substrate 8, but a part of the substrate mounting surface which is the lower surface of the groove 14 is notched, and the notch At the portion, the two upper and lower plates 15 move up and down so as to be engageable with the lower surface of the substrate 8 guided by the groove 14. The vertical movement is guided by a guide bar 16 standing on the lower surface of the chute 11. A flange is formed at the lower end of the guide bar 16, and a compression spring 17 is wound between the flange and an upper and lower plate 15 as a vertical movement member. Energized to rise.
[0016]
The substrate 8 is fixed between the top surface 22 of the groove 14 and the plate 15.
Further, a regulated rod 18 is erected from the lower part of the upper and lower plates 15, and a flange 19 is formed on the rod 18.
Below the rod 18 of the XY table 6, a restricting portion 20 is fixed as a restricting member that engages with the flange 19 and restricts the ascent of the rod 18, that is, the upper and lower plates 15.
[0017]
Substrate clamping means for clamping the substrate by the lowering movement of the transport chute 11 as the substrate transport rail and releasing the clamp by the upward movement of the upper and lower plates 15, the guide rod 16, the compression spring 17, the regulated rod 18 and the restricting portion 20. Constitute.
Next, a clamp mechanism for the movable chute 12 will be described with reference to FIGS.
[0018]
Similarly, a notch is formed in the groove 21 for guiding the conveyance of the substrate 8 of the chute 12, and an upper and lower plate 23 as a vertically moving member that moves up and down in the notch is slidably attached to the chute 12. Yes. The upper and lower plates 23 are urged so as to rise by a compression spring 24 provided between a portion extending from the chute 12, and the substrate 8 guided in the groove 21 is formed between the plate 23 and the groove 21. It is sandwiched between the top surface 25 and fixed.
[0019]
A taper surface 27 is formed on the upper and lower plates 23, and the taper surface 27 rotates around one end of a swing lever 29 that can swing around a shaft 28 that extends horizontally in the longitudinal direction of the chute 12 (substrate transport direction). A cam follower 30 that is movably attached is configured to be able to abut.
A steel ball 31 is rotatably attached to the lower surface of the other end of the swing lever 29, and the tip of the ball is formed on a slide rod 32 that is slidably attached in parallel to the chute 12. It abuts on the tapered surface 33. A rod 38 of a substrate clamp cylinder 36 attached to a discharge rail 35 that forms the discharge conveyor 10 adjacent to the chute 12 can be engaged with the end of the rod 32.
[0020]
The discharge rail 35 is also movable and is moved in accordance with the movement of the conveyance chute 12. When the rod 38 of the substrate clamp cylinder 36 protrudes, the rod 32 moves in the horizontal direction from the position shown in FIGS. 5 and 7 to the position shown in FIG. Since the ball 31 of the moving lever 29 is in contact, the upper and lower plates 23 are moved downward by swinging counterclockwise from the state shown in FIGS. 10 to 9 by the urging force of the coil spring 37 and the spring 24 with the movement. Has been made.
[0021]
The upper and lower plates 23, the compression spring 24, the swing lever 29 and the slide rod 32 constitute a clamping means.
The operation of the substrate clamp cylinder 36 as a drive source for driving the substrate clamping operation by the clamping means is performed by a signal from a sensor (not shown) that detects the raising of the transport chutes 11 and 12.
[0022]
Further, on the XY table 6, a backup plate 40 is provided on the table 6 for erecting a backup pin that contacts the back surface (lower surface) of the substrate 8 and prevents the substrate 8 from warping downward. On the other hand, the guide 41 is guided so as to be movable up and down.
The operation will be described below with the above configuration.
[0023]
First, when the printed circuit board 8 is supplied from the upstream apparatus by the supply conveyor 9, the transfer board (not shown) transfers the larger board 8 to the transfer chutes 11 and 12 which are raised to the same height as the conveyor 9 by a cylinder (not shown). Is pushed, transferred, moved in the grooves 14 and 21 of the chutes 11 and 12, and stopped at a position to be positioned.
[0024]
At this time, on the conveying chute 11 side, as shown in FIGS. 1 and 12, the upper and lower plates 15 are in a position lowered with respect to the chute 11 because the regulated rod 18 is regulated by the regulating portion 20, and the groove 14 is opened. It is in the state.
On the chute 12 side, as shown in FIG. 9, the upper and lower plates 23 are lowered against the bias of the springs 24 and 37 due to the protrusion of the rod 38 of the cylinder 36.
[0025]
Next, on the conveyance chute 12 side, the rod 38 is retracted by the operation of the cylinder 36, and the slide rod 32 biased toward the discharge conveyor 10 by a spring (not shown) moves to the state shown in FIGS. The steel ball 31 side of the swing lever 29 descends along the taper surface 33 and the swing lever 29 swings clockwise from the state of FIG. 9 to the state of FIG. 10, and the upper and lower plates 23 are moved by the urging force of the spring 24. The end of the substrate 8 is sandwiched between the top surface 25 and the plate 23 and fixed.
[0026]
Next, when the conveyance chutes 11 and 12 are lowered by the operation of a cylinder (not shown), the upper and lower plates 15 that are regulated by the regulating portion 20 against the spring 17 by the descent of the chute 11 are immediately caused by the urging force of the spring 17. 11, the end of the substrate 8 is sandwiched between the top surface 14 and the plate 15 and pressed and fixed by the urging force of the spring 17 (however, FIG. 11 shows the state where the substrate 8 is not present). Is). Thus, both ends of the substrate 8 are clamped and fixed. Since the size of the substrate 8 is large, it is clamped to the chutes 11 and 12 by the two plates 15 and the two plates 23. The substrate 8 is also fixed by being pushed by the spring 39 from the lateral direction.
[0027]
Thus, the flange 19 of the regulated rod 18 is separated from the regulating portion 20 and the chute 11 is lowered.
Next, the substrate 8 is lowered to a position where it contacts a backup pin (not shown).
Next, an electronic component (not shown) conveyed to the mounting head 3 by intermittent rotation of the rotary table 2 is mounted at a desired position on the printed circuit board 8 by moving the XY table 6. Since the chute 11 is located at a position lower than the conveyors 9 and 10, it does not collide with the conveyor even if it moves in the horizontal direction.
[0028]
Next, when the mounting of the parts is finished, the chutes 11 and 12 are raised, and the flange 19 of the regulated rod 18 is regulated by the regulating part 20 on the side of the chute 11, and the plate 23 resists the urging force of the compression spring 17. The height position is maintained (that is, the chute 12 is lowered), and the clamp of the substrate 8 is released until the chute 11 reaches the raised position.
[0029]
Next, the rise of the chutes 11 and 12 is detected by a sensor (not shown), and the substrate clamp cylinder 36 is driven by a control device (not shown) based on the detection signal, and the slide rod 32 is moved and the swing lever 29 is swung. By movement, the upper and lower plates 23 are lowered, and the clamping of the substrate 8 is released.
Next, the substrate 8 is discharged and conveyed to the discharge conveyor 10 by a transfer arm (not shown), and a new substrate 8 is transferred to the conveyance chutes 11 and 12.
[0030]
In this way, the transfer of the substrate 8 is repeated.
Next, when producing a substrate 8 having a different size from the conventional one, if the width is different, the movable conveyance chute 12 is moved. At this time, the movable rail (for example, rail 35) on the same side is also moved for the discharge conveyor 10 and the supply conveyor 9.
[0031]
Further, the moving chute 12 can move because there is no protruding portion below the chute 11 as compared with the chute 11.
Next, when the substrates 8 of different sizes are transported, there are two upper and lower plates 15 and 23, respectively, and there are some lengths, so there is nothing even if the substrates 8 have different sizes in the substrate transport direction. It is possible to fix by clamping without changing.
[0032]
In this embodiment, the clamping method is changed between the fixed and movable chutes 11 and 12, but the shoot 12 may be the same as the shoot 11. However, the guide rod 16 needs to have a certain length in order to move the plate up and down without catching, and the regulated rod 18 also needs to have a length, and the backup plate 40 is provided with a recess for escaping these. Alternatively, the gap between the chute and the backup plate 40 must be widened. If the interval is thus increased, the accuracy of the movement of the substrate 8 with respect to the movement of the XY table is also problematic. Alternatively, when the backup plate 40 on which the backup pins are mounted is movable up and down (regardless of whether it is automatic or manual) according to the thickness of the substrate, the restricting portion 20 as in this embodiment is provided on the backup plate 40. If there is provided, there is a problem that the vertical movement of the plate for clamping changes depending on the height of the backup plate 40. In the case of the fixed-side chute 11 as in the present embodiment, the restricting portion 20 is a backup plate and is not provided at 40 but is provided at a part of the XY table 6 outside thereof, so that such a problem does not occur. Is.
[0033]
Further, as a mechanism for moving the plate for clamping the substrate 8 up and down by using the vertical movement of the chute 11 as a driving source, the mechanism moves up and down with respect to the chute other than the method of constantly urging the spring 8 in the closing direction as in the present embodiment. When the chute is lowered, the plate comes into contact with the restricting portion protruding from the XY table and rises to clamp the substrate (clamping by the weight of the chute, but if this weight is not enough, the spring And the clamp may be released when the chute is raised. In this case, if the chute is not lowered to the lower end, the substrate 8 is not clamped immediately even if the chute starts to descend, and there is a possibility that the substrate will be displaced in the meantime. There is an advantage that the rod 18 need not be provided.
[0034]
Further, both the chutes 11 and 12 may use a cylinder 36. In this embodiment, the chutes 11 and 12 move up and down with respect to the XY table 6. However, the chutes 11 and 12 do not move up and down with respect to the XY table 6, and the discharge conveyor 10 and Even when the supply conveyor 9 moves up and down so as not to obstruct the movement of the XY table 6, the cylinder 36 is provided on the rail on the discharge conveyor 10 or the supply conveyor 9 side like the chute 12 side. It is conceivable to clamp the substrate 6, and it is possible to avoid an increase in weight and the need for air piping and electrical wiring as compared with the case where the driving source of the clamp is provided on the XY table 6. . If air piping or electrical wiring is used, it will be attached to a movable part called an XY table, which may interfere with the movement, and wear due to movement will occur and there will be a life span that must be replaced.
[0035]
In the present embodiment, the apparatus for mounting the electronic component on the printed board has been described. However, the XY table is moved in order to apply an adhesive for temporarily fixing the electronic component to the board at a predetermined position on the board. The same applies to a coating apparatus that moves the substrate.
In this embodiment, the XY table 6 can move in all horizontal directions, but the substrate positioning mechanism of this embodiment can be applied even to a table that moves only in the position direction. Is possible.
[0036]
【The invention's effect】
As described above, the invention according to claims 1, 2, and 3 of the present application clamps and positions the end in the substrate transport direction by the substrate clamping means having the long upper and lower plates along the substrate transport rail. When positioning by sandwiching the surface orthogonal to the lever, there is no need to change the size in the substrate transport direction, so that the mechanism can be simplified and the mechanism can be simplified.
Further , according to the first and second aspects of the present invention, since the restriction of the restriction member can be released immediately when the vertical movement member starts to descend, the substrate is immediately fixed by the biasing member, and the substrate is lowered by the lowering. Can be prevented from shifting.
Furthermore, according to the invention according to claim 3 of the present application, since the front and back clamps of the substrate are not caused by the vertical movement of the substrate transport rail, a structure for clamping on the XY table side is not formed. In addition, the front and back of the substrate end can be clamped and the weight of the XY table can be prevented from increasing.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating a clamp mechanism when a conveyance chute on a fixed side is viewed from a substrate conveyance direction.
FIG. 2 is a perspective view of an electronic component automatic mounting apparatus to which the present invention is applied.
FIG. 3 is a plan view showing a conveyance chute on the fixed side.
FIG. 4 is a side view showing a clamp mechanism for a conveyance chute on the fixed side.
FIG. 5 is a plan view showing a movable conveyance chute.
FIG. 6 is a side view of the movable conveyance chute as viewed from the substrate conveyance side.
FIG. 7 is a side view of the movable conveyance chute as viewed from the opposite side with respect to the substrate conveyance side.
FIG. 8 is a side view of the movable conveyance chute as viewed from the opposite side with respect to the substrate conveyance side.
FIG. 9 is a cross-sectional view showing a clamping mechanism for a movable conveyance chute as viewed from the substrate conveyance direction.
FIG. 10 is a cross-sectional view of the movable-side conveyance chute clamping mechanism as seen from the substrate conveyance direction.
FIG. 11 is a cross-sectional view showing a clamping mechanism when a fixed-side transport chute is viewed from the substrate transport direction.
FIG. 12 is a cross-sectional view showing a clamp mechanism when a fixed-side transport chute is viewed from the substrate transport direction.
[Explanation of symbols]
8 Printed circuit board 11 Conveying chute 15 Upper / lower plate 16 Guide rod 17 Compression spring 18 Restricted rod 19 Flange 20 Restricting portion 23 Upper / lower plate 24 Compression spring 27 Tapered surface 28 Shaft 29 Swing lever 32 Slide rod 36 Substrate clamp cylinder

Claims (5)

An XY table movable in the horizontal direction and a printed board are transported and positioned, and a height position at which the board can be received from the board supply conveyor and discharged to the board discharge conveyor, and a predetermined position to the board can be obtained. In a substrate positioning apparatus comprising a pair of substrate transport rails provided on the XY table so as to be movable up and down with respect to a height position where the XY table moves horizontally for work,
The substrate includes clamp means for clamping the front and back of the substrate along the rail with the rail by the downward movement of the rail, and releasing the clamp by the upward movement of the rail. A top surface provided on the surface of the substrate provided on the transport rail, a top and bottom plate that can move up and down with respect to the rail and can be brought into contact with the back surface of the substrate, and a plurality of the top and bottom plates along the rail. An urging member that urges the upper and lower plates upward with respect to the rails with an interval between them, and an urging force of the urging member provided on the XY table when the transport rail is raised. A board positioning apparatus comprising: a regulating member that regulates the raising and lowering of the upper and lower plates so that the upper and lower plates are lowered relative to the rail . An XY table movable in the horizontal direction and a printed board are transported and positioned, and a height position at which the board can be received from the board supply conveyor and discharged to the board discharge conveyor, and a predetermined position to the board can be obtained. In a substrate positioning apparatus comprising a pair of substrate transport rails provided on the XY table so as to be movable up and down with respect to a height position where the XY table moves horizontally for work,
The substrate includes clamp means for clamping the front and back of the substrate along the rail with the rail by the downward movement of the rail, and releasing the clamp by the upward movement of the rail. A top surface that is provided on the transport rail and that is engaged with the front surface of the substrate, is vertically movable with respect to the rail, can be brought into contact with the back surface of the substrate , and is long along the rail, and is erected on the lower surface of the rail. A guide rod provided at a plurality of intervals with respect to the upper and lower plates to guide the vertical movement of the upper and lower plates, and is wound between a flange formed at a lower end of the guide rod and the upper and lower plates. said compression bar when the transfer rail provided Bull rises - a compression spring biasing so that the upper and lower plates is increased, the XY Te with respect to the rail Te Board positioning device, characterized in that the top and bottom plate against the urging force and a regulating member for regulating the rise in the upper and lower plates so that operated to lower relative to the rail. An XY table that can be moved in the horizontal direction, a board transport rail that is provided on the XY table and that is used to transport and position the printed circuit board, and the height position can be changed relative to the board transport rail. A substrate having a substrate supply conveyor rail for sending a substrate to the substrate transfer rail, and a substrate discharge conveyor rail for receiving a substrate from the substrate transfer rail whose height position can be changed relative to the substrate transfer rail. In the positioning device,
Clamping means having a long plate along the rail, which is provided on at least one of the substrate transport rails, and clamps the front and back of the end of the substrate along the transport rail with the rail; and the substrate supply conveyor rail, A substrate provided on the substrate discharge conveyor rail, comprising a drive source for driving the substrate clamping operation by the clamping means at a height position at which the substrate transport rail can transfer the substrate from the conveyor rail. Positioning device.   4. The substrate positioning apparatus according to claim 3, wherein the substrate transport rail moves in a direction orthogonal to the substrate transport direction for changing the substrate width.   The clamp means includes a top surface that is engaged with a substrate surface provided on the substrate transport rail, a vertically moving member that can move up and down relative to the rail and come into contact with the back surface of the substrate, and the vertically moving member. A biasing member that biases upward with respect to the rail; and a swinging lever that swings around a horizontal axis and abuts against a contact surface formed on the vertical movement member to move the vertical movement member up and down. The substrate positioning apparatus according to claim 3, wherein the substrate positioning apparatus is provided.

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