JPH05175632A - Method and device for dividing insulation board - Google Patents

Abstract

PURPOSE:To reduce the generation of stress as much as possible in loaded article connection sections on an insulation board and enhance an automatic equipment line so as to operate more suitably when dividing an electronic circuit device circuit insulation board when a division work line is formed on a main plane per circuit block. CONSTITUTION:A holding section 2 which clamps an insulation board 1 is provided with a rotary shaft 13 and installed per unit, centering on a division work line 12 on its both sides at a specified interval. The insulation board 1 is divided by applying a blade 3 to the board from its rear side in the longitudinal direction of the division work line 12 with division force. In synchronization with this division, each of the board holding sections 2 is rotated outwardly, centering on the rotary shaft 13 while the insulation board is being held so as to reduce stress which applies to the board. There is provided a faulty detection sensor 5 which decides and selects the performance of a circuit block so as to see if it is good or bad. A series of operations are carried out in automatic mode.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to division of a circuit insulating substrate for an electronic circuit device (hereinafter, simply referred to as an insulating substrate) having a division processing line, and particularly to a mounting component connecting portion on the insulating substrate during division. The present invention relates to a method and apparatus for dividing an insulating substrate, which is suitable for minimizing the generated stress and automatically converting the equipment into lines.

[0002]

2. Description of the Related Art A conventional method of dividing an insulating substrate will be described with reference to FIGS. FIG. 14 is a diagram showing a dividing method by manual work. A downward bending force is applied to both ends of the insulating substrate 1 by a hand 15 around the dividing processing line 12 to develop a crack from the dividing processing line 12 as a starting point. It is a method of dividing.

FIG. 15 is a front view showing another division method. An edge 16 is applied to the lower surface of the insulating substrate 1 so as to face the division processing line 12, and a downward bending force 17 is applied to the insulating substrate 1. Thus, the dividing force is concentrated on the upper end of the edge 16, and the crack is accurately propagated from the dividing processing line 12 as a starting point to divide the crack. As a technique related to this type of technique, for example, Japanese Patent Laid-Open No. 57-4714 can be cited.

[0004]

In the above-mentioned conventional technique, bending is applied to the insulating substrate, so that the insulating substrate is bent, and stress is applied to a connection part of mounted components (for example, electronic components such as LSI) on the insulating substrate. However, there is a problem in that the reliability of component connection is reduced. In addition, there is a problem in that it is not possible to adapt to automatic production line of equipment because the connection with the front and rear processes is not considered.

Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art, and the first object thereof is to reduce the stress generated in the connection part of the mounted parts on the insulating substrate at the time of division. It is possible to provide an improved method of dividing an insulating substrate, and a second object of the invention is to provide a dividing device in which the connection with the preceding and succeeding steps is taken into consideration by automatically dividing.

[0006]

A method and a device for dividing an insulating substrate for the above-mentioned object are to divide the divided processing line into a center line on both end faces of the insulating substrate in which the divided processing line is provided in advance on the main surface of the insulating substrate. As it is sandwiched by two or more substrate holding portions, at least one set on each side orthogonal to it, and while pressing the blade along the longitudinal direction of the split processing line from the back surface of the split processing line, This can be achieved by rotating at least one set of substrate holding portions so as to face each other in the pressing direction of the blade.

The means for achieving the object of the present invention will be specifically described below. The first object is a method of dividing an insulating substrate in which a plurality of division processing lines that divide the circuit block are provided in advance on the main surface of the insulating substrate to divide the circuit block into individual pieces. The end surface is sandwiched by at least one set on each side of the dividing machining line, which is orthogonal to the centering line, and a total of two or more sets of substrate holding parts, and the longitudinal direction of the dividing machining line from the back surface of the machining face of the dividing machining line. While pressing the blade at a predetermined pressure along, at least one set of substrate holders are rotated in opposition to the pressing direction of the blade by a method of dividing an insulating substrate,
To be achieved.

The above-mentioned insulating substrate is generally a mounting substrate on which electronic components such as semiconductor devices are mounted and connected on a circuit, but in some cases, a circuit substrate on which no electronic components are mounted may be used. .. As the material of the substrate, not only a ceramic substrate but also a printed circuit board made of a glass epoxy substrate and the like are targeted, but a material having poor flexibility such as a ceramic substrate is preferable in terms of easy cutting.

A rotating shaft parallel to the division processing line is connected to the substrate holding portion, and the substrate is held by pressing the shaft against the end face of the substrate. Then, when holding the substrate, the intervals of the rotary shafts are arbitrarily set so that one division processing line to be divided is present between at least two sets of substrate holding portions, and preferably, they are separated from the division processing line, respectively. Hold the end of the circuit block. That is, at the time of division, the blade is pressed against the back surface along the longitudinal direction of the division processing line, the axes of the holding portions are mutually rotated outward with the blade as a fulcrum, and the lever principle is applied. Regarding the rotation of the shaft, it is desirable to rotate the shafts of the holding portions on both sides of the split machining line at the same time, but it is also possible to rotate only one side and fix the other set without rotating. The timing of rotating this shaft is preferably synchronized with the time when the blade is pressed against the substrate and a dividing force is applied. In addition, when the blade is pressed against the substrate to apply the dividing force, it is necessary to take care not to apply an excessive pressure that may damage the substrate.

A second object is to hold the circuit block by holding both end faces of an insulating substrate, which is provided on the main surface of the insulating substrate, with a plurality of division processing lines that divide the circuit block in advance. A device for dividing an insulating substrate, which is cut out into individual pieces in a state of being held by, wherein at least one set is formed on each of both end surfaces of the insulating substrate orthogonal to the dividing processing line as a center line, and two or more sets in total. At least one set of substrate holding means, which holds the substrate holding means sandwiched by the substrate holding portion, a means for pressing a blade along the longitudinal direction of the dividing processing line from the back surface of the processing surface of the dividing processing line to apply a predetermined dividing force. And a means for rotating the blades facing each other in the pressing direction of the blade.

Further, preferably, a rotating shaft parallel to the division processing line is connected to the holding portion, and when the blade is pressed and a dividing force is applied, the holding portion synchronizes with the division and the center of the axis is the axis. And a mechanism for rotating against each other against the dividing force of the blade, the substrate holding means and a means for applying a predetermined dividing force by pressing the blade together to smoothly divide the insulating substrate. To do so.

Further, the sectional shape of the holding portion in contact with the insulating substrate is not limited to the straight type, but rather it is desirable to make the holding of the substrate more stable by V-shaped, U-shaped or inverted L-shaped. In addition, the contact portion of the holding portion with the insulating substrate can be formed of a material such as an appropriate elastic body, for example, a hard rubber such as urethane or a material such as plastic, so that the end face is not damaged by the holding portion when the substrate is divided. It is possible to prevent it in advance.

Further, in the device of the present invention, after the circuit block is cut out into individual pieces by the dividing means, a judging means (read by the defect detecting sensor) for judging whether the divided circuit block is a good product or a defective product, and these are used. It is possible to provide a sorting mechanism for sorting and a control device for automatically controlling these series of operations, which makes it possible to completely automate the process from division to sorting.

As a concrete example of the determination means of the non-defective product and the defective product, for example, detection of a defective portion such as a chip or a projection in a division processing line portion of a circuit block cut into pieces, and mounting on an insulating substrate. The detection of the presence / absence of a component (whether or not the component is mounted at a predetermined position) and the detection of the presence / absence of a marking previously attached to a circuit block of the insulating substrate as having a defective circuit in an inspection process at the time of forming the insulating substrate are performed.

Further, in the device of the present invention, it is possible to cut unnecessary portions such as the peripheral portion of the insulating substrate where the circuit block is not formed, and these are discarded to the discharging mechanism provided along with the dividing means. .. Further, based on the determination result of the non-defective products and defective products of the divided circuit blocks, the defective products are dumped to the defective product discharge portion provided accompanying the determination means, and the non-defective products are provided with a mechanism to be conveyed to the next process. be able to.

Although the above division is performed in the division stage,
As a means for transporting the substrate to this stage, a transport mechanism capable of rotating the insulating substrate in units of 90 degrees can be provided. It is also possible to provide a mechanism for rotating the divided pieces in units of 90 degrees and aligning them in the same direction.

Further, it is desirable that the interval between the plurality of division processing lines provided on the insulating substrate is set to be larger than the thickness of the insulating substrate. Further, when a plurality of orthogonal division processing lines are provided on the insulating substrate, two division means are installed independently to enable division in two directions, and each division stage is performed. It is desirable to do.

In addition, in the next step, a control device that can perform the division and stop in synchronization with a device for further processing, for example, terminal insertion, visual inspection, packing, etc., in the next step, is provided. It can be provided. Further, it is also possible to provide an abnormality detection function of detecting whether or not the division processing line has been machined to a depth equal to or more than a predetermined value before starting the division operation.

As another example of the abnormality detecting function, a pressure sensor for measuring the pressing force of the blade pressing the back surface of the insulating substrate at the time of division is provided, and when the pressing pressure exceeds a specified value, the blade pressing force is measured. It is also possible to provide means that can be released.

[0020]

In the method and apparatus for dividing an insulating substrate according to the present invention, the insulating substrate is sandwiched by the holding portions having at least two sets of rotating shafts on both sides of the dividing processing line, and the blade is pressed from the back surface of the dividing processing line to divide the insulating substrate. When a force is applied, the holding unit rotates about the rotation axis in synchronization with the division, so that the stress generated at the connecting portion between the electronic component mounted on the insulating substrate and the insulating substrate can be reduced. Since the insulating substrate dividing apparatus according to the present invention has a mechanism for determining whether the circuit block is non-defective or defective, and a sorting (selecting) mechanism, it can be operated in conjunction with an apparatus in the next step for performing other processing.

Further, since the insulating substrate dividing apparatus according to the present invention has the unnecessary portion discharging mechanism, it can be automatically operated even if the circuit block is formed in the peripheral portion of the insulating substrate. Further, the insulating substrate dividing device according to the present invention is
Since the insulating substrate can be rotated in units of 90 degrees before or after dividing the insulating substrate, the insulating substrate can be supplied to the apparatus for the next step in the same direction. Further, the device for dividing an insulating substrate according to the present invention is highly versatile because it can be divided into any size larger than the thickness of the insulating substrate.

Further, in the insulating substrate dividing apparatus according to the present invention, the dividing operation along the dividing processing lines in two orthogonal directions is performed by the two stages separately installed, so that the working time is short. Further, since the insulating substrate dividing apparatus according to the present invention is synchronized with the apparatus for processing in the next step, the facility can be easily lined up. Furthermore, the insulating substrate dividing apparatus according to the present invention has a function of detecting an abnormality in the division processing line, and therefore does not cause the insulating substrate to be defective.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. <Embodiment 1> FIGS. 2 to 4 show an embodiment of a method of holding and dividing an insulating substrate according to the present invention.
3 is a perspective view showing a method of holding an insulating substrate, FIG. 3 is a side view showing a method of dividing an insulating substrate, and FIG.
3 is a side view showing the holding state of the insulating substrate holding portion. The method of holding the insulating substrate will be described with reference to FIG. 2. First, the division processing line 12 is arranged on the main surface in advance,
For example, a ceramic insulating substrate 1 on which electronic components are mounted is prepared, and both sides of the insulating substrate 1 are sandwiched and held by holding portions 2 orthogonal to a division processing line 12 that divides the circuit block of the insulating substrate 1. As this holding method, two holding units 2 each having a rotary shaft 13 parallel to the split machining line 12 are provided, one set on each side of the split machining line 12 at the position to be divided as a center line, and a total of two sets thereof are provided. The shafts 13 of the holder 2 are pressed against each other toward the insulating substrate 1 to hold the insulating substrate 1.

Next, the insulating substrate 1 held in this manner
The dividing method will be described with reference to FIG. As shown in FIG. 3A, with respect to the insulating substrate 1 held by the substrate holding portion 2 connected to the two sets of rotating shafts 13, with the surface on which the division processing line 12 is provided on the upper side, the division processing is performed. The insulating substrate 1 is divided by pressing the blade 3 in the direction of arrow A along the longitudinal direction of the division processing line 12 from the back surface of the processing surface of the line 12 and applying a division force. In synchronism with this division, as shown in FIG. 2B, the substrate holding part 2 rotates around the rotation axis 13 in the direction of the arrow B while holding the insulating substrate 1 so that the stress applied to the substrate during the division. Can be reduced. It is desirable that the length of the blade 3 can be supported over the entire length of the back surface of the substrate in accordance with the length of the division processing line to be almost divided.

As shown in FIG. 4, the shape of the contact portion of the substrate holder 2 connected to the rotary shaft 13 with the insulating substrate 1 may be a straight shape as shown in FIG. The V-shape shown in FIG. 9B, the U-shape shown in FIG. 7C, or the inverted L-shape shown in FIG. Further, as shown in FIG. 1E, the material of the contact portion 14 of the substrate holding portion 2 with the insulating substrate 1 may be a urethane having an appropriate elasticity regardless of whether it is a straight type or another shape. It is also possible to form it with an elastic body such as a hard rubber or a plastic, etc., which makes it possible to deform the contact portion 14 and further improve the holding force, and since the contact is soft through the elastic body, the insulating substrate 1 It can be divided without causing a defect such as a substrate chip. In this embodiment, all the shafts 13 of the two sets of holding portions 2 are rotated, but only one of the sets is rotated and the shafts of the other sets are fixed without being rotated. It is also possible.

<Embodiment 2> FIG. 1 is a perspective view showing the essential structure of an insulating substrate dividing apparatus for automatically dividing an insulating substrate according to an embodiment of the present invention. .. From the magazine 6, a so-called multi-cavity insulating substrate 1 in which a plurality of division processing lines 12 are arranged orthogonally to the two directions of XY (indicated by broken lines 12) is taken out by a transport mechanism (not shown). , And is positioned on the pedestal 7-1. Next, it is rotated in a designated direction by a rotary transfer mechanism 4-1 which can rotate in 90 degree units, and is transferred to a first division stage (not shown). Here, two sets of substrate holders 2-1
Then, the end portions of the insulating substrate 1 are fixed at a predetermined interval with the division processing line 12 as a center line, and the blade 3-1 divides in the same direction (for example, the Y direction). Substrate holding and dividing operations are sequentially repeated to perform all dividing in the Y direction.

An upper limit is set for the pressing pressure of the blade so that an excessive pressure is not applied to the insulating substrate, and the substrate is prevented from being broken so that reliability and yield can be improved. ing. This pressing pressure will be described later in detail with reference to FIG. Further, the distance between the two sets of substrate holding portions 2-1 is configured so that it can be arbitrarily set by adjusting the distance between the shafts 13 of each set.

Next, the insulating substrate 1 which has been divided in one direction is conveyed to the next cradle 7-2. Furthermore, the rotary transport mechanism 4-2 capable of rotating in 90 degree units rotates in a designated direction,
It is transported to another second division stage (not shown). As shown in the figure, the substrate holding portion 2-2 and the blade 3-2 of the second split stage are the same as the first
Although they are arranged at positions orthogonal to those of the divided stages, they have the same function. The reason for making them orthogonal is to make it convenient for the subsequent conveying direction, and it is also possible to set them in the same direction without making them orthogonal.

After the insulating substrate 1 transferred to the second split stage is fixed by the substrate holding portion 2-2, the blade 3-2 is used.
The remaining one direction (for example, the X direction) is divided by to divide the circuit block into individual pieces. In each division stage,
The unnecessary portion where the circuit block around the insulating substrate is not formed is also divided, and this unnecessary portion is disposed as a waste product dropping hole 8-2.
(Pitfall 8-1 of the first split stage is not shown). The circuit block 10 divided into individual pieces is conveyed by the discharge conveyor 11 in the next process, which is transferred at the same time as the division. The defect detection sensor 5 is provided on a part of the discharge conveyor 11.
Is installed, troubles around the board (chips, protrusions, etc.),
The presence / absence of a component is determined, and the defective product is discarded in the discarded product drop hole 8-3 by the defective product discharge unit 9. As described above, only the non-defective circuit block 10 is aligned in the direction of the apparatus for the next step and discharged to the apparatus for the next step.

Note that the series of operations are automatically operated by a control device (not shown) in this device. That is, this control device is configured so that the insulating substrate 1 is conveyed and the insulating substrate 1 is held by the substrate holding unit 2 in the division stage.
Of the divided circuit blocks 10 based on the detection information of the first control unit that controls the holding and dividing operations of the defective products and the defective product detection sensor 5, conveys the good products to the next process, and discards the defective products. And a second control unit that controls the operations such as.

FIG. 13 is a characteristic diagram for explaining changes in the pressing pressure of the blade against the insulating substrate of the present invention. In the figure, the vertical axis represents the pressing pressure of the blade, and the horizontal axis represents the elapsed time from the start of blade ascent. In the case of the normal division processing line in FIG. 7A, the pressure gradually rises after the blade comes into contact with the substrate, and the substrate is divided by the pressure P1 and the pressure returns to 0 at the same time. On the other hand, if the split machining line in FIG. 6B is abnormal (for example, the depth of the line is too shallow), the pressure is P1.
Even if it becomes, the substrate is not divided, so the pressure further increases, and eventually the substrate is broken. Therefore, P2, which is slightly higher than P1, is set as a limit, and when the pressure exceeds P2, it is determined to be abnormal, and the blade that has been raised is lowered, and the division is stopped. According to the present invention, since the pressing pressure is set to the upper limit, excessive pressure is not applied to the insulating substrate and the substrate is not broken.

<Embodiment 3> In FIG. 1, the judgment and selection for separating the circuit block 10 in which the insulating substrate 1 is automatically divided by the control device based on the detection information of the defective product detection sensor 5 into a good product and a defective product. The work flow of the method will be described with reference to FIGS. First, in FIG. 5, an insulating substrate for dividing the circuit block 10 into which the division is completed is divided into a good product and a defective product, and a sorting mechanism for discarding the defective product and discharging only the good product to the next process. By incorporating this into a substrate dividing device, it becomes possible to form a line with the next process. Determining good and defective products,
A specific example of the selection method will be described below.

FIG. 6 shows the circuit block 1 by the division operation.
Insulation with a mechanism that checks the peripheral part of the insulating substrate classified into 0, judges the occurrence of chips and protrusions around the substrate, discards the generated ones by the sorting mechanism, and conveys only good products to the next process 3 illustrates a substrate dividing device. This determination mechanism is performed based on the detection information of the defective product detection sensor 5 in FIG.
It consists of an image reading device such as a CD sensor or an industrial imaging camera. The read image information is carried out by a control device having a built-in comparison circuit which stores the correct image information of the circuit block 10 in a memory in advance if necessary and compares the image information with the image information.

FIG. 7 is for detecting the presence / absence of mounted electronic components in the insulating substrate divided into the circuit blocks 10. If there is no mounted component, it is discarded as a defective product, and if there is a mounted component, it is conveyed to the next process as a good product. 2 shows a device for dividing an insulating substrate having a quality determination mechanism. Usually, an electronic component is mounted on the correct circuit block 10, and a defective mark is formed on the circuit block 10 that has become defective in the board inspection process so that the component is not mounted.

FIG. 8 is a pass / fail judgment mechanism for detecting, in an insulating substrate divided into circuit blocks 10, a circuit block in which a marking process for indicating a defective product is previously applied to a part of the circuit block 10 and discarding it as a defective product. 3 shows a device for dividing an insulating substrate having a. In many cases, the board to be divided usually has electronic components mounted on it, but it is also possible to use a board on which no component is mounted as a division target, and this device is effective in that case.

FIG. 9 shows an insulating substrate divided into circuit blocks 10, in which a defect in shape when a chip or a protrusion is generated around the substrate in the process of division, presence / absence of a component mounted on the substrate, and presence / absence of a defective product display mark. It shows all the inspection items such as, etc., and discards defective products.It shows an insulating substrate dividing device equipped with a quality judgment mechanism.This device can be operated in conjunction with the next process that performs other processing. And

<Embodiment 4> With respect to the entire apparatus shown in FIG.
Regarding the processing method of the unnecessary portion, the division stage, and the connection with the next process apparatus, the flow of the work will be described more specifically with reference to FIGS. In the example of the dividing device shown in the block diagram of FIG. 10, the dividing processing line 1 of the insulating substrate 1 is shown for easy understanding.
This is a case where 2 is in one direction (for example, the X direction). Therefore, the case where only the second division stage is used among the first and second division stages in FIG. 1 will be described. First, the insulating substrate 1 discharged from the magasin 6 is aligned with the direction of the division processing line 12 before division,
It is rotated and positioned in an arbitrary direction by the transport mechanism 4 which can rotate in 90 degree units. Next, it is divided into individual pieces on the division stage. At this time, unnecessary portions such as the peripheral portion of the insulating substrate 1 where the circuit block 10 is not formed are discarded by the unnecessary portion discharging mechanism into the waste product drop hole 8, and only the insulating substrate forming the circuit block 10 is moved to the next rotary stage. Transport.

On the rotating stage, the substrate on which the circuit block 10 is formed is positioned in an arbitrary direction by a rotating mechanism capable of rotating in 90 degree units, and for example, a device in the next step for performing processing such as terminal insertion, visual inspection, and packaging, Supply in the same direction. At this time, the quality of the substrate is selected by the method shown in the third embodiment, and only non-defective products are discharged to the next step.

FIG. 11 shows a work flow in the case of dividing a so-called multi-cavity substrate in which the insulating substrate 1 has a plurality of division processing lines 12 orthogonal to each other in the XY direction. In the case of FIG. 7A, the dividing stages are combined into one place, and after the division in one direction (for example, the Y direction) is completed, the divided substrate is rotated by 90 degrees in the rotary transfer unit, and again in the same dividing stage, The circuit block 10 is cut into pieces by dividing the circuit block 10 in the other direction (X direction). In the case of FIG. 2B, the dividing device is composed of two sets of dividing stages that are independently arranged, and after the division in one direction (for example, the Y direction) is completed in the first dividing stage, It is conveyed to the division stage of No. 1 and divided in the remaining one direction (X direction).

In the case of FIG. 6A, since the division is performed in two directions on the same stage, there is a disadvantage that the division time is somewhat long, but there is an advantage that the equipment cost is low. On the other hand, in the case of FIG.
Since independent separate stages are provided for division, there is an advantage in that division can be performed in parallel and the division time can be shortened, but the device becomes slightly larger.

FIG. 12 shows an embodiment in the case of interlocking with a next process apparatus for performing processing other than division. From the device to be processed in the next step (for example, a terminal insertion device, a visual inspection device, a packing device, etc.), a synchronization signal indicating that the device is in operation or stopped is extracted and input to the dividing device, the determining device, and the selecting device of the dividing device, It is possible to sequentially divide an insulating substrate, determine pass / fail, and perform and stop a sorting operation. As a result, it becomes possible to form a line with the next process device. The series of operations is automatically controlled by the control device described in the second embodiment.

[0042]

According to the method of dividing the insulating substrate and the dividing device of the present invention, the intended object can be achieved.
That is, the stress applied to the substrate at the time of division can be reduced, and when mounted on an insulating substrate, the connection reliability of components can be greatly improved. Further, the insulating substrate dividing apparatus according to the present invention may be, for example, a circuit block non-defective / defective product judging mechanism and a sorting mechanism, an insulating substrate unnecessary portion discharging mechanism, and an insulating substrate after division in a direction suitable for the next process device. Since it has a rotary conveyance mechanism that supplies the components in parallel and a mechanism that enables synchronization with the next process equipment, the equipment can be lined up and the cost of the insulating substrate can be reduced by saving labor. Furthermore, since the upper limit of the pressing pressure of the blade is set in the dividing operation and an excessive pressure is not applied to the insulating substrate, it is possible to prevent the destruction of the substrate and improve the reliability and the yield. It was

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a main part of an embodiment of a dividing device according to the present invention.

FIG. 2 is a perspective view of a substrate holding portion in the device of the present invention.

FIG. 3 is a front view illustrating a dividing method of the present invention.

FIG. 4 is a side view of FIG. 2 showing a substrate holding portion of the device of the present invention.

FIG. 5 is a flowchart showing a division work of the device of the present invention.

FIG. 6 is a flowchart showing a division work of the device of the present invention.

FIG. 7 is a flowchart showing a division work of the device of the present invention.

FIG. 8 is a flowchart showing a division work of the device of the present invention.

FIG. 9 is a flowchart showing a division work of the device of the present invention.

FIG. 10 is a flowchart showing a division work of the device of the present invention.

FIG. 11 is a flowchart showing a division work of the device of the present invention.

FIG. 12 is a flowchart showing a division work of the device of the present invention.

FIG. 13 is a characteristic diagram showing the relationship between the pressing time and the elapsed time from the start of rising the blade.

FIG. 14 is an explanatory diagram of a conventional division method.

FIG. 15 is an explanatory diagram of another conventional division method.

[Explanation of symbols]

1 ... Insulating substrate, 2 ... Substrate holding part,
3 ... Blade, 4 ... Rotary transport unit, 5 ... Defective detection sensor, 6 ... Magazine, 7 ... Cradle,
8 ... Waste product pit, 9 ... Defective product discharge part, 10 ... Circuit block, 11 ... Next process discharge conveyor, 12 ... Dividing processing line, 13 ... Substrate holding part rotating shaft, 14 ... Contact part elastic body, 15 ... Hand,
16 ... Edge, 17 ... Direction of splitting force.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Sumio Hayashida 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. Information & Communication Division (72) Inventor Koji Tonai 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Address Company Hitachi Ltd., Information & Communication Division (72) Inventor Yukio Takahashi 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Information & Communications Division Hitachi, Ltd. (72) Saburo Umeda Totsuka, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture 216, Machi Incorporated Information Technology Division, Hitachi, Ltd. (72) Inventor, Yuhei Miyamoto 216 Totsuka, Totsuka-ku, Yokohama, Kanagawa Prefecture Inside Hitachi Advanced Systems, Inc.

Claims (18)

[Claims] 1. A method of dividing an insulating substrate in which a plurality of division processing lines for preliminarily dividing a circuit block are provided on the main surface of the insulating substrate, and the circuit block is cut into individual pieces. , With at least one pair on each side of the split machining line, which is orthogonal to the centerline, and is sandwiched by a total of two or more substrate holders, and from the back side of the machining surface of the split machining line, along the longitudinal direction of the split machining line. A method of dividing an insulating substrate in which at least one set of substrate holding portions is rotated so as to face each other in the pressing direction of the blade while pressing the blade with a predetermined pressure. 2. When holding a substrate, the interval between the rotary shafts connected to the substrate holding portion is arbitrarily set so that one division processing line to be divided exists between at least two sets of substrate holding portions. 2. The insulating substrate according to claim 1, wherein the insulating substrate is held, and when divided, the axes of the holding portions are rotated outwardly with respect to each other with a blade pressed from the back surface thereof along the longitudinal direction of the division processing line as a fulcrum. Split method. 3. At the time of division, the timing of rotating the shaft of the substrate holder and the timing of pressing the blade against the substrate to apply the dividing force are synchronized with each other, and the blade is pressed against the substrate to give the dividing force. 3. The method for dividing an insulating substrate according to claim 1, wherein the pressure is set within a pressure that does not destroy the substrate, which is obtained by measuring in advance. 4. The method for dividing an insulating substrate according to claim 1, 2 or 3, wherein the insulating substrate is an insulating substrate having a circuit incorporated therein, and is a mounting substrate on which electronic components are mounted and connected in advance. 5. The method for dividing an insulating substrate according to claim 4, wherein the insulating substrate is a ceramic substrate. 6. A plurality of division processing lines that divide the circuit block in advance are sandwiched by holding portions on both end surfaces of an insulating substrate provided on the main surface of the insulating substrate, and the circuit blocks are individually held by the holding portion. A device for dividing an insulating substrate, which is cut out into two pieces, in which at least one set is formed on each of both end faces of the insulating substrate, which is orthogonal to the dividing processing line as a center line and is on each side thereof.
At least one set of substrate holding means that is sandwiched by more than one set of substrate holding parts, a means that applies a predetermined dividing force by pressing a blade along the longitudinal direction of the division processing line from the back side of the processing surface of the division processing line. A device for dividing an insulating substrate, which comprises means for rotating the substrate holding portion so as to face the blade pressing direction. 7. A holding shaft is connected to a rotary shaft parallel to the split machining line, and when a splitting force is applied by pressing a blade, the holding pipe is synchronized with the split, and the rotary shaft is centered on the rotary shaft. And a mechanism for rotating against the dividing force of the blade, wherein the substrate holding means and the means for applying a predetermined dividing force by pressing the blade together perform the division of the insulating substrate. 7. A device for dividing an insulating substrate according to claim 6. 8. The cross-sectional shape of the holding portion that contacts the insulating substrate,
The device for dividing an insulating substrate according to claim 6 or 7, which has a straight type, a V-shape, a U-shape, or an inverted L-shape. 9. The insulating substrate dividing device according to claim 6, wherein the contact portion of the holding portion with the insulating substrate is made of an elastic body. 10. A circuit for dividing a circuit block into individual pieces by a dividing means, a judging means for judging whether the divided circuit block is a good product or a defective product, a selecting means for separating them, and a series of these operations are automatically controlled. 10. The device for dividing an insulating substrate according to claim 6, further comprising: 11. A structure in which a cut piece obtained by cutting an unnecessary portion where a circuit block is not formed in the peripheral portion of the insulating substrate is dumped to a discharge mechanism provided in association with the dividing means. The insulating substrate dividing device described. 12. A defective product is thrown to a defective product discharge section provided in association with the judging means based on the judgment result of the non-defective product and defective product of the divided circuit blocks, and the non-defective product is conveyed to the next step. The device for dividing an insulating substrate according to claim 6, further comprising a mechanism. 13. The method according to claim 6, further comprising a dividing stage for dividing, and a conveying mechanism capable of rotating the insulating substrate by 90 degrees as a means for conveying the insulating substrate to the dividing stage. Insulating board dividing device. 14. An apparatus for dividing an insulating substrate according to claim 6, further comprising a conveying mechanism for rotating the divided pieces in units of 90 degrees and aligning them in the same direction. 15. In order to divide an insulating substrate provided with a plurality of orthogonal division processing lines, two independent division means are provided corresponding to the division processing lines in two directions, and each division is performed. The device for dividing an insulating substrate according to any one of claims 6 to 9, which is configured to be divided at a stage. 16. The insulating substrate according to claim 6, further comprising a control device capable of carrying out and stopping the division of the insulating substrate divided into individual pieces in synchronism with a processing device for the next step. Splitting device. 17. The insulating substrate according to claim 6, further comprising an abnormality detecting mechanism for detecting whether or not the division processing line has been processed to a depth equal to or more than a predetermined value before starting the dividing operation. Dividing device. 18. A pressure sensor for measuring the pressing force of a blade for pressing the back surface of an insulating substrate at the time of division, comprising means for releasing the pressing force of the blade when the pressing pressure exceeds a specified value. Item 10. An insulating substrate dividing device according to any one of items 6 to 9.