CN101486202B - Cutting method for laminated body and cutting knife used therein - Google Patents
Cutting method for laminated body and cutting knife used therein Download PDFInfo
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- CN101486202B CN101486202B CN2008101849157A CN200810184915A CN101486202B CN 101486202 B CN101486202 B CN 101486202B CN 2008101849157 A CN2008101849157 A CN 2008101849157A CN 200810184915 A CN200810184915 A CN 200810184915A CN 101486202 B CN101486202 B CN 101486202B
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Abstract
The invention provides a cutting off method of a laminated body and a cutting tool used therein. In the cutting process of the laminated body in which fragile material and resin films are laminated, no waste, such as stripped pieces or broken pieces, is generated, and the surface of the fragile material substrate will not be damaged. From the surface of the glass substrate (3), which is contrary to the resin film, cracks (31) with thickness of between 10% and 100% of the thickness of the glass substrate (3), which is substantial perpendicular to the glass substrate surface, are formed. Then, the cutting tool (2) is pressed at or near the position of the resin film (41) surface corresponding to the cracks (31), the cutting tool (2) moves corresponding to the laminated body (S1), thereby a cut (43) is formed on the resin film (41), the cut (43) has a thickness of more than 90% of the thickness of the resin film (41) and does not reach the range of the glass substrate (3).
Description
Technical field
The cutting-off method of the duplexer that the present invention relates to brittle substrate and resin molding range upon range of and the cutting knife that adopts in the method.
Background technology
Because brittle substrates such as glass, pottery enbrittle on engineering properties; So the cut-out of brittle substrate is for example through making cutting wheel (cutter wheel) roll and on substrate surface, form line of cut (Scribe Line) in crimping on the substrate; Generate the crackle (cutting action) of vertical direction thus from substrate surface; Then make this vertical crack grow into substrate back (breaking step of breaking), thereby cut off substrate the substrate stress application.
On the other hand; Resin molding generally has flexibility or ductility; Therefore the cut-out of resin molding is for example cut off effect through the phase mutual friction of 2 sharp hard metal blades of blade, perhaps through using the very sharp cutting off tool or the shear strength of cut off wheel to cut off.
As stated, because brittle substrate and resin molding difference on physical property are very big, therefore as the method for cutting off the range upon range of duplexer of brittle substrate and resin molding; Following method is arranged: for example; Between brittle substrate and resin molding, insert scraper plate (Scraper), with predetermined compression power butt surface resin film, and scraper plate and cutting knife are moved relative to duplexer cutting knife; Thereby resin molding is peeled off from brittle substrate with band shape; Form line of cut on the brittle substrate surface that cutting wheel is connected to expose, apply external stress then and cut off duplexer (for example, the referenced patent document 1,2).
Patent documentation 1:JP spy opens the 2003-335536 communique
Patent documentation 2:JP spy opens the 2007-45656 communique
But, in above-mentioned cutting-off method, unavoidably understand the stripping film of generation tree adipose membrane.In addition, when the insertion scraper plate relatively moves between brittle substrate and resin molding, might cause the surperficial impaired of brittle substrate because of scraper plate.
Summary of the invention
The present invention proposes in view of aforesaid problem in the past; Its purpose is in the cut-out of the duplexer of range upon range of brittle substrate and resin molding is handled; Can not generate stripping film or cut off machine the like waste, and can not cause the surperficial impaired of brittle substrate.
In addition, the present invention also aims to that a kind of long service life is provided and can prevent the cutting knife of the action such as rotation in the use really.
According to the present invention; Provide a kind of one side side at brittle substrate range upon range of the cutting-off method of duplexer of the resin molding more than 1 or 2; It is characterized in that; With the opposite face side of said resin molding one side side, to the direction formation crackle of said brittle substrate face with approximate vertical, the scope of this crackle is more than 10% and less than 100% of said brittle substrate thickness from said brittle substrate; Then; The position of corresponding with said crackle (extended position of crackle) of outermost surface resin film or near crimping cutting knife it relatively move said cutting knife and said duplexer in said resin molding, cut make the otch of incision reach near the thick resin film of brittle substrate side more than 90% and do not reach in the scope of said brittle substrate.
Here,, also may further include after forming above-mentioned crackle and otch from the reliable consideration of cutting off duplexer, from the outside to the operation of above-mentioned duplexer stress application.
In addition; Carry out range upon range of occasion at above-mentioned brittle substrate and above-mentioned resin molding more than 1 or 2 via adhesive layer; Preferably whole above-mentioned resin moldings are cut off fully, and otch reaches more than 10% and less than 100% of above-mentioned adhesive layer thickness by above-mentioned cutting knife.
In addition, the face side opposite of above-mentioned brittle substrate with above-mentioned resin molding one side side range upon range of the occasion of diaphragm, be preferably in diaphragm and above-mentioned brittle substrate forms above-mentioned crackle.
Moreover, in order on above-mentioned brittle substrate, to form crackle, preferably utilize cutting wheel to cut or irradiating laser.
The crimp force of above-mentioned cutting knife is 0.01～0.4MPa scope preferably.
In addition, through forming otch near the resin molding of brittle substrate side, make said crackle expand to the said resin face side of said brittle substrate, said brittle substrate becomes the state that cuts off or almost cut off.
As above-mentioned cutting knife, also can on knife-edge is formed in the disk of neighboring, remove the part of the periphery that comprises blade and form a plurality of planes in periphery.
In addition; According to the present invention; A kind of cutting knife that in above-mentioned cutting-off method, adopts is provided, and this cutting knife can be supported on the bearing with freely loading and unloading, it is characterized in that; Be formed in knife-edge and remove the part of the periphery that comprises blade on the disk of neighboring and form a plurality of planes in periphery; Any 2 planes through 2 planes of change with the cutting knife of said bearing surface butt, change the blade position of the cutting knife that is crimped on the resin molding through being maintained on the said bearing with 2 bearing surface butts that are formed on the said bearing in said a plurality of plane.
Here, the consideration from effectively using the whole blade that is formed at the neighboring is preferably in a side semicircle and forms a plurality of planes, forms blade at the opposite side semicircle.
In addition, also can make one of bearing surface of being formed on the above-mentioned bearing form horizontal plane.
For reduce and resin molding between friction and cut off with less crimp force, knife edge angular is preferably 20 °～80 ° scope.
In order to make the life-span elongated, material preferably adopts superhard alloy or sintered diamond.
The invention effect
In cutting-off method of the present invention; After brittle substrate forms the crackle of desired depth, cutting knife is crimped near correspondence position or its of above-mentioned crackle of resin molding, cut to desired depth; Cut off duplexer thus, therefore in cutting off processing, can not produce discarded object.And, cut off the contact-making surface that contacts with resin molding that can not touch brittle substrate with parts, can not cause the substrate surface damage.
In cutting knife of the present invention,, therefore,, can increase the service life, and can effectively prevent the problems such as rotation in the use with compared with techniques in the past because the blade position that when loss, can change with the resin molding crimping reuses.
Description of drawings
Fig. 1 is the process chart of one of expression cutting-off method of the present invention example.
The skeleton diagram of the cut-out example of the duplexer of Fig. 2 is expression glass substrate laminated diaphragm.
Fig. 3 be the expression glass substrate a side laminated skeleton diagram of cut-out example of duplexer of 2 resin moldings.
Fig. 4 is the skeleton diagram of expression with the cut-out example of the duplexer of adhesive layer junction of glass substrate and resin molding.
Fig. 5 is the skeleton diagram of expression with the cut-out example of the duplexer of adhesive layer junction of glass substrate and resin molding peripheral part.
Fig. 6 is front view and the side view that expression is fit to an example of the cutting knife that cutting-off method of the present invention uses.
Fig. 7 is that the cutting knife of presentation graphs 6 is installed on the stereogram on the bearing.
Fig. 8 is the front view and the side view of base plate.
Fig. 9 is the front view and the side view of cover plate.
Figure 10 is the skeleton diagram of expression one routine cutter.
Figure 11 is the front view of expression another routine cutting knife of being fit to use among the present invention.
Symbol description: 1-cutting wheel, 2-cutting knife, 3-glass substrate (brittle substrate), 11, the 12-adhesive layer, 13-diaphragm, 21-cutting knife, 21c, 21d-plane, 31-crackle, 41, the 42-resin molding, 43-otch, 75-first bearing surface, 76-second bearing surface, S
1, S
2, S
3, S
4, S
5-duplexer.
The specific embodiment
Below, explain in more detail about cutting-off method of the present invention, but the present invention is not limited in these embodiments.
Fig. 1 is the process chart of one of expression cutting-off method of the present invention embodiment.The figure shows be glass substrate 3 that brittle substrate is constituted a side laminated duplexer S of resin molding 41
1Situation about cutting off.In addition, the figure in left side is the profile on the vertical direction of relative crackle 31 in the (a) and (b) of Fig. 1, and the figure on right side is the profile along the crack surface on crackle 31 parallel directions.In (a) of Fig. 1, the cutting wheel 1 relative glass substrate 3 that at first will apply predetermined load relatively moves, and on glass substrate 3, forms line of cut.At this moment, the surface of glass substrate 3 is formed the crackle 31 of vertical direction.At this importantly, the depth D scope of formed crackle 31 is at more than 10% and less than 100% of glass substrate 3 thickness.If the depth D of crackle 31 is shallower than above-mentioned scope, then can not cut off duplexer S
1On the other hand, if the depth D of crackle 31 is deeper than above-mentioned scope, then probably cause the surperficial impaired of resin face side.
For the depth D with crackle 31 is controlled at above-mentioned scope, can adjust cutting wheel 1 material or cutting edge shape, put on load on the cutting wheel 1 etc.For example, in order to add the depth D of deep torn grain 31, cutting wheel 1 can form the cutter that section slightly is in the shape of the letter V at the circumferential part of discoid wheel body, is to form a plurality of grooves with predetermined space on the blade at the crest line as this cutter.As the external diameter of above-mentioned cutting wheel, recommend to adopt 1mm～10mm scope; As the degree of depth of above-mentioned groove, recommend to adopt more than the 25 μ m; As the crest line length between above-mentioned groove, recommend to adopt more than the 25 μ m.
In addition, as the method that on glass substrate 3, forms the crackle 31 of desired depth, except cutting method, also can adopt irradiating laser to form the method for crackle 31 with cutting wheel 1.As laser, CO for example
2Gas laser, YAG laser instrument or titanium sapphire laser device etc.
Then, shown in Fig. 1 (b), the outer surface of resin molding 41 with the corresponding position of above-mentioned crackle or its near, make cutting knife 2 apply the predetermined load crimping, cutting knife 2 relative resin moldings 41 are relatively moved, form otch 43 at resin molding 41.Here one of material particular is to form otch 43 through cutting knife 2 being crimped on the resin molding 41 at resin molding 41.Thus, the crackle 31 that on glass substrate 3, forms in the operation in front extends to resin face one side (like illustrated D ' in Fig. 1 (b)) of glass substrate 3, and glass substrate 3 becomes and cuts off or dissengaged positions almost.The load that puts on cutting knife 2 can wait suitably according to the shape of the material of resin molding 41 or glass substrate 3, cutting knife 2 and determine, but usually load preferably in 0.1～0.8MPa scope.
Another material particular is, the scope of the depth d of otch 43 be located at resin molding 41 thickness more than 90% and do not reach in the scope of glass substrate 3 (this moment is less than 100%).Thus, can realize reliably that the crackle 31 that is formed at glass substrate 3 extends to resin face one side, and not damage the cut-out of carrying out resin molding 41 under the situation of resin face one side of glass substrate 3.
Though in the embodiment of Fig. 1, used fixed cutter as cutting knife 2, be not limited to this, also can adopt rotary cutting knife.And according to the difference of the material of resin molding, load is disperseed and can not slick and slyly be formed otch 43 sometimes when blade rotates, and therefore recommends the cutting knife 2 that adopts blade fixing usually.Further for the cutting knife that is fit to use among the present invention of the back.
Then, shown in Fig. 1 (c), from glass substrate one side along line of cut to duplexer S
1Apply extruding force, glass substrate 3 is cut off (Fig. 1 (d)) with resin molding 41 in the part of crackle 31 and otch 43 thus.In above-mentioned operation (b), the crackle 31 of glass substrate 3 does not also reach under the situation of resin face side, and through applying above-mentioned extruding force, crackle 31 reaches resin face side.In addition, be formed with the otch more than 90% 43 of its thickness in the resin molding 41, therefore utilize above-mentioned extruding force to be easy to cut off.
As from the outside to duplexer S
1The method of stress application except the method that applies above-mentioned extruding force, for example can adopt along line of cut and give duplexer S
1Temperature difference produces the method for thermal stress.In addition, as duplexer S
1Thin thickness the time, sometimes naturally separately, therefore at this moment need not apply the operation of external stress along line of cut.
In the above-described embodiment, apply extruding force, but also can apply extruding force, perhaps apply extruding force from glass substrate side and these both sides of resin molding side from the resin molding side from the glass substrate side.In addition, according to the difference of resin molding 41 materials, when the resin molding side applies extruding force,, therefore recommend usually to apply extruding force from the glass substrate side sometimes at the section producd fibers shape thing of resin molding 41.
As the brittle substrate of cutting method object of the present invention, for example can enumerate out glass, pottery, silicon, sapphire brittle substrates such as (Sapphire).For the not special restriction of the thickness of brittle substrate, be generally 500～1000 mu m ranges.
In addition; As resin molding 41; Can enumerate out and be processed to form membranaceous following ester moulding; Said resin for example, polyester based resins such as fluorine resin, polycarbonate resin, PET, polyimides such as PET (PET), triacetyl cellulose acetate fibers such as (TAC) prime system resin, acrylic resin, hexafluoropropylene (HFP)/tetrafluoroethylene (TFE) based copolymer are that resin, polysulfones are that resin, polyether sulfone are resin, polystyrene resin, polyvinyl alcohol resin, polyvinyl chloride resin, vistanex or polyamide-based resin etc.Thickness of resin film is not special to be limited, but is generally the following scope of 500 μ m.
Fig. 2 representes another embodiment of relevant cutting-off method of the present invention.Cut-out object among Fig. 2 is duplexer S
2Glass substrate 3 with resin face side opposing face side range upon range of diaphragm 13.At this moment, the cutting wheel that applies predetermined load 1 is crimped on diaphragm 13 surfaces relatively moves, cutting diaphragm 13, thus on diaphragm 13 and glass substrate 3, form crackle 31.Diaphragm 13 used herein for example is PET film or TAC film etc.
Fig. 3 representes an embodiment again of relevant cutting-off method of the present invention.Cut-out object duplexer S among Fig. 3
3Be range upon range of 2 resin moldings 41,42 in a side of glass substrate 3.At this moment, the degree of depth of the otch 43 that cutting knife 2 is produced does, the resin molding 42 in the outside is broken off fully, and its degree of depth reaches resin molding 41 thickness more than 90% and do not reach glass substrate 3 in the resin molding 41 of glass substrate one side.Thus, as previously mentioned, when the crackle 31 that is formed at glass substrate 3 extends to the resin molding side, under the situation of not damaging resin face side, can cut off the resin molding 41,42 of glass substrate 3.The material of resin molding 41 and resin molding 42 can be identical, also can be inequality.In addition, the number of the resin molding of a side laminated of glass substrate 3 is restriction not, can certainly be for more than 3.
Fig. 4 representes the another embodiment of relevant cutting-off method of the present invention.Cut-out object duplexer S among Fig. 4
4Range upon range of adhesive layer 11 between glass substrate 3 and resin molding 41.At the duplexer S that cuts off this spline structure
4The time, the otch 43 that cutting knife 2 produces breaks off resin molding 41 fully, make adhesive layer 11 be disconnected to relative its thickness more than 90% and do not reach the scope of glass substrate 3.Thus, as previously mentioned, when the crackle 31 that is formed at glass substrate 3 extends to the resin molding side, under the situation of not damaging resin face side, can cut off the adhesive layer 11 of glass substrate 3.
As the material of adhesive layer 11, for example uv-hardening resin or thermmohardening type resin, or act on the resin etc. of down sclerosis both sides.Concrete example as, hexenoic acid anhydride copolymer (epoxy resin binding agent), polyurethane resin are that binding agent, phenolic resin are UV cured cohesive agent such as thermosetting binding agent, silicone resin, cyanoacrylate, acrylic resin such as binding agent etc.In addition, the thickness of adhesive layer 11 is not special to be limited, but is generally 0.1 μ m～50 mu m ranges.
Fig. 5 representes an embodiment again of relevant cutting-off method of the present invention.Cut-out object duplexer S among Fig. 5
5Be that glass substrate 3 cascades through the adhesive layer 12 in the peripheral part setting with resin molding 41, both central portions are formed with the space.At the duplexer S that cuts off this structure
5The time, the otch 43 that cutting knife 2 produces also can break off resin molding 41 fully, but must make cutting knife 2 not reach glass substrate 3.On the other hand, when the otch 43 that produces when cutting knife 2 not exclusively broke off resin molding 41, the degree of depth of otch 43 need be the thickness of resin molding 41 more than 90%.In addition, replace adhesive layer 12 and use isolated part such as particulate to make the duplexer that forms the space between glass substrate 3 and the resin molding 41, also can cut off through method shown in this Fig equally.
Cutting-off method of the present invention for example is applicable to the cut-out etc. of the glass substrate of liquid crystal panel.Specifically, applicable to the glass substrate laminated cut-out of substrate etc. of polarizer.Usually paste support membrane on the two sides of polariton (for example, polariscope) as polarizer.As polarizer; For example; The polarizer of directed absorption dichroic dye or iodine on polariton substrates such as polyvinyl alcohol resin, polyvinyl acetate resins, ethylene-vinyl acetate (EVA) resin, polyamide, mylar contains the dichroism dehydration product (polyvinylene: the poly-vinylene) polyvinyl alcohol-polyvinylene copolymer of directed strand etc. of polyvinyl alcohol in the polyvinyl alcohol film of molecular orientation.For the not special restriction of the thickness of polariton, but, be generally the following scope of 50 μ m for the purposes such as slimming of polarizer.On the other hand, as supporting and protection polariton support membrane, for example adopt TAC film or ENB (norbornene) mesentery etc.The thickness of support membrane is not special to be limited, but is generally the following scope of 300 μ m.
One of the cutting knife that is suitable for cutting-off method of the present invention example has been shown in Fig. 6.(a) of this Fig. 6 is that the front view of cutting knife 21, (b) of Fig. 6 are right side view.Cutting knife 21 is formed by superhard alloy or sintered diamond, is formed with blade 21b in the neighboring.In addition, be formed with through hole 21a, insert pin 77 (shown in Fig. 7) as bolster at this at the center of cutting knife 21.In the neighboring of cutting knife 21, a part is removed blade and is formed with plane 21c and plane 21d.Plane 21c and plane 21d for example through discoid cutting knife is carried out line cutting or cut, grinding forms.
Fig. 7 is the assembling stereogram of the bearing 22 of supporting cutting knife 21.Bearing 22 has base plate 71 and cover plate 72.At the front view and the right hand view of base plate shown in Fig. 8 71, at the front view and the right hand view of cover plate shown in Fig. 9 72.Below, according to Fig. 7～Fig. 9 the bearing 22 of supporting cutting knife 21 is described.
In Fig. 7 and Fig. 8, near the bottom of base plate 71, be formed with the notch part 73 that is used to install cutting knife 21.Notch part 73 is surrounded by side 74, first bearing surface 75, second bearing surface, 76 these 3 planes.Side 74 is formed with the hole 78 of the pin 77 of the bolster that is used to be mounted for cutting knife 21.In this hole 78, insert pin 77 and when cutting knife 21 was installed, the part of blade was outstanding laterally from the bottom of base plate 71.
In addition, when cutting knife 21 was installed on base plate 71, the plane 21c of cutting knife 21 and plane 21d were connected to first bearing surface 75 and second bearing surface 76 of base plate 71 respectively, and cutting knife 21 is not installed on base plate 71 revolvably.In addition, when cutting knife 21 counter-rotatings are installed, first bearing surface, 75 butts of the plane 21d of cutting knife 21 and base plate 71, plane 21c and second bearing surface, 76 butts are changed from the knife edge part that the bottom of base plate 71 is outstanding laterally.
As shown in Figure 8, be formed with the screw 80,81 that is used for fixing cover plate 72 in the central authorities of base plate 71.Be formed with the hole 28 that is used for fixing on the elevating mechanism 23 near the top of base plate 71.The protuberance 83 that is formed with lid plate 72 butts on the left side of base plate 71 and positions.
As shown in Figure 9, be formed for installing and fixing the hole 85,86 of the screw on the base plate 71 in the central authorities of cover plate 72, be formed with the hole 87 that is used for fixing on the elevating mechanism 23 (shown in Fig. 7) near on top.
Shown in figure 10, the bearing 22 of the cutting knife 21 that installation can not be rotated is installed on the elevating mechanism 23 of cutter CM.The cutter of Figure 10 comprises: the sliding stand 52 that relative paper vertical direction (Y direction) moves freely in pallet 51 upper edges; The pedestal 59 that moves freely at the left and right directions (directions X) of sliding stand upper edge figure; The rotating mechanism 65 that on pedestal 59, is provided with, carry and be fixed in the turntable 66 that is provided with on this rotating mechanism 65 and surface range upon range of the glass substrate of resin molding (brittle substrate) 3 move freely in horizontal plane through these mechanisms that move.
Sliding stand 52 is installed on the pair of guide rails 54,55 with the mode that moves freely, and this pair of guide rails 54,55 is the preset distance configured in parallel at pallet 51 upper surfaces interval.And, in pair of guide rails 54, be provided with motor-driven by the not shown positive and negative ball-screw that rotate freely 53 parallel between 55 with guide rail 54,55.In addition, be provided with ball nut 56 in the bottom surface of sliding stand 52.This ball nut 56 screws togather with ball-screw 53.Through the positive rotation and the despining of ball-screw 53, ball nut 56 moves on the Y direction, and the sliding stand 52 that ball nut 56 has been installed thus moves in guide rail 54,55 upper edge Y directions.
In addition, pedestal 59 is bearing on a pair of guiding part 61 movably, and this a pair of guiding part 61 is interval preset distance configured in parallel on sliding stand 52.And, be provided with between a pair of guiding part 61 and parallel with guiding part 61 driven the positive and negative ball-screw that rotates freely 62 by motor 63.In addition, be provided with ball nut 64, screw togather with ball-screw 62 in the bottom surface of pedestal 59.Through the positive rotation or the despining of ball-screw 62, ball nut 64 moves on directions X, and pedestal 59 moves on directions X along a pair of guiding part 61 with ball nut 64 thus.
On pedestal 59, be provided with rotating mechanism 65.And on this rotating mechanism 65, be provided with turntable 66.The glass substrate 3 of the range upon range of resin molding in surface is fixed on the turntable 66 through vacuum suction.Rotating mechanism 65 makes the central shaft rotation of turntable 66 around vertical direction.
Be equipped with the cutting knife 21 that does not remain in revolvably on the bearing 22 above the turntable 66.On pallet 51, vertically be provided with framework 25, extend to horizontal direction from the upper end of this framework 25 arm 24 is installed.In the end of arm 24 elevating mechanism 23 is installed, on this elevating mechanism 23 bearing 22 is installed.Moved along the Z direction by elevating mechanism 23 through bearing 22, cutting knife 21 is moved to position and the non-contacting position with glass substrate 3 crimping.
Below, the action of cutter CM is described.Cutting knife 21 is installed on bearing 22, on turntable 65, carry glass substrate 3 and glass substrate 3 surfaces range upon range of resin molding (not shown).Since the plane 21c of cutting knife 21 and plane 21d respectively with first bearing surface 75 and second bearing surface, 76 butts of base plate, so cutting knife 21 is not installed on bearing 22 revolvably.And, through the position of adjustment sliding stand 52, the position of decision Y direction, the position of directions X is decided in the position of adjustment pedestal 59.Then, make cutting knife 21 be crimped on glass substrate 3 through operation elevating mechanism 23.Through making pedestal 59 in the enterprising line scanning of directions X, the resin molding on glass substrate 3 surfaces forms otch.In the process of the action that repeats this formation otch,, then get into blade and change operation if when the blade loss of cutting knife 21, sharpness variation.
The replacing operation of the blade that is crimped on resin molding of cutting knife 21 is specific as follows: at first, unload the cover plate 72 of undersetting 22, take out the cutting knife 21 on the base plate 71.Then, make cutting knife 21 counter-rotatings, be installed on base plate 71 once more.Thus, the position of conversion blade, the outside, below of base plate 71 demonstrates untapped knife edge part.With this state cover plate 72 is fixed in base plate 71.Be installed on the cutting knife 21 on the base plate 71, its plane 21c and plane 21d are respectively with second bearing surface 76 of base plate and first bearing surface, 75 butts and limit its rotation.Like this, the installation through changing cutting knife 21 towards, a cutting knife 21 can use 2 times, thereby increases the service life.
In the above-described embodiment; The cutting knife 21 and bearing 22 that can use 2 times have been used; But through the angle of 2 bearing surfaces of formation on the base plate 71 that changes bearing 22, and the quantity and the angle on the plane that forms on the periphery of change cutting knife 21, access times can further be increased.
For example, Figure 11 is the front view of expression another embodiment of the present invention, is to be illustrated in the figure that the state of cutting knife 92 has been installed on the base plate 91 of bearing 22.Be formed with two bearing surfaces 93,94 that are in the hexagonal angle degree at base plate 91.On the other hand, cutting knife 92 is formed with 3 planes 95,96,97 that are in the hexagonal angle degree.
As the form that cutting knife 92 is installed on base plate 91, at first, following two kinds of forms are arranged: in bearing surface 93 and the plane 95 of bearing surface 94 difference butt cutting knifes 92 and the form on plane 96 of base plate 91; And the form of butt bearing surface 96 and bearing surface 97.Then, following two kinds of forms are arranged after making cutting knife 92 counter-rotatings: in bearing surface 93 and the plane 96 of bearing surface 94 difference butt cutting knifes 92 and the form on plane 95 of base plate 91; And the form of butt bearing surface 97 and bearing surface 96.Therefore, a cutting knife can use 4 times.
Equally, if further increase the quantity that is formed at the plane on the cutting knife, then a cutting knife can use more times.
Embodiment
Below, the present invention will be described in more detail through embodiment, but the present invention is not limited to these examples of implementation.
Be a side of the glass substrate of 1.1mm by receiving the thickness that lime glass (soda lime) forms; Stack gradually a PET (polyethylene terephthalate) film that thickness is 0.3mm, the 2nd PET film that thickness is 0.2mm from glass substrate, constitute duplexer thus, for such duplexer; At first; Cutting wheel is applied 0.14MPa load be crimped on the glass substrate, 300mm/sec moves relative to glass substrate with cutting speed, on glass substrate, forms line of cut.This moment, the degree of depth of formed vertical crack was 50% of a thickness of glass substrate.In addition, the specification of employed cutting wheel is as follows.
The specification of cutting wheel:
External diameter: 2mm
Thickness: 0.65mm
Internal diameter: 0.8mm
Knife edge angular: 115 °
Groove depth: 25 μ m
Crest line length between the groove: 25 μ m
Then, the load that the cutting knife of 45 ° of knife edge angulars is applied 0.8MPa is crimped on the 2nd PET film, and cutting knife is moved relative to duplexer, cuts off the 2nd PET film fully, cuts a PET film.The degree of depth of otch is 90% of a PET film thickness.
Then, along line of cut duplexer is applied extruding force, duplexer is cut off at crackle and notch portion from the glass substrate side.
For the thickness except glass substrate is that the thickness of 0.55mm, a PET film is that the thickness of 0.2mm, the 2nd PET film is all identical with embodiment 1 duplexer of other structures the 0.05mm; The cutting wheel of specification as follows is applied 0.1MPa load to be crimped on the glass substrate; 300mm/sec moves relative to glass substrate with cutting speed, on glass substrate, forms line of cut.This moment, the degree of depth of formed vertical crack was 10% of a thickness of glass substrate.
The specification of cutting wheel:
External diameter: 3mm
Thickness: 0.65mm
Internal diameter: 0.8mm
Knife edge angular: 130 °
Groove depth: 3 μ m
Crest line length between the groove: 15 μ m
Then, the load that the cutting knife of 30 ° of knife edge angulars is applied 0.4MPa is crimped on the 2nd PET film, and cutting knife is moved relative to duplexer, cuts off the 2nd PET film fully, cuts a PET film.The degree of depth of otch is 90% of a PET film thickness.
Then, along line of cut duplexer is applied extruding force, duplexer is cut off at crackle and notch portion from the glass substrate side.
Claims (9)
1. the cutting-off method of a duplexer, this duplexer the one side side of brittle substrate range upon range of resin molding more than 1 or 2, it is characterized in that:
With the opposite face side of said resin molding one side side, to the direction formation crackle of said brittle substrate face with approximate vertical, the scope of this crackle is more than 10% and less than 100% of said brittle substrate thickness from said brittle substrate,
Then; Cutting knife is crimped on outermost surface resin film in the said resin molding with the corresponding position of said crackle or its near; Said cutting knife and said duplexer are relatively moved, cut make the scope of otch of incision reach near the thick resin film of brittle substrate side more than 90% and do not reach said brittle substrate.
2. cutting-off method as claimed in claim 1 is characterized in that:
After forming said crackle and otch, also comprise from the outside the operation of said duplexer stress application.
3. according to claim 1 or claim 2 cutting-off method is characterized in that:
Via adhesive layer said brittle substrate and said resin molding more than 1 or 2 are carried out range upon range of,
By said cutting knife all said resin moldings are cut off fully, and otch reaches more than 10% and less than 100% of said adhesive layer thickness.
4. according to claim 1 or claim 2 cutting-off method is characterized in that:
Said brittle substrate with the opposite face side stacked guard film of said resin molding one side side, form said crackle at said diaphragm and said brittle substrate.
5. according to claim 1 or claim 2 cutting-off method is characterized in that:
Utilize cutting wheel cutting, on said brittle substrate, form crackle.
6. according to claim 1 or claim 2 cutting-off method is characterized in that:
Irradiating laser forms crackle on said brittle substrate.
7. according to claim 1 or claim 2 cutting-off method is characterized in that:
The crimp force of said cutting knife is 0.01～0.4MPa scope.
8. according to claim 1 or claim 2 cutting-off method is characterized in that:
Through forming otch, make of the said resin face side expansion of said crackle, and said brittle substrate becomes the state that cuts off or almost cut off to said brittle substrate near the resin molding of brittle substrate side.
9. according to claim 1 or claim 2 cutting-off method is characterized in that:
Said cutting knife is employed in a part of removing the periphery that comprises blade on the disk that the neighboring forms blade and forms the cutting knife on a plurality of planes in periphery.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008006181A JP2009166169A (en) | 2008-01-15 | 2008-01-15 | Cutter device |
| JP2008006181 | 2008-01-15 | ||
| JP2008-006181 | 2008-01-15 | ||
| JP2008-134887 | 2008-05-23 | ||
| JP2008134887 | 2008-05-23 | ||
| JP2008134887A JP4918064B2 (en) | 2008-05-23 | 2008-05-23 | Laminate cutting method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210116466.9A Division CN102672741B (en) | 2008-01-15 | 2008-12-23 | Cutting blade |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101486202A CN101486202A (en) | 2009-07-22 |
| CN101486202B true CN101486202B (en) | 2012-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101849157A Expired - Fee Related CN101486202B (en) | 2008-01-15 | 2008-12-23 | Cutting method for laminated body and cutting knife used therein |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2009166169A (en) |
| CN (1) | CN101486202B (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5244202B2 (en) * | 2011-01-27 | 2013-07-24 | 三星ダイヤモンド工業株式会社 | Method for scribing a brittle material substrate |
| CN103313946B (en) | 2011-06-08 | 2016-11-23 | 日本电气硝子株式会社 | The cutting-off method of plate glass |
| CN104487391B (en) * | 2012-08-21 | 2017-08-25 | 旭硝子株式会社 | The cutting-off method of composite sheet, the cutting-off method of sheet glass |
| JP6019999B2 (en) * | 2012-09-26 | 2016-11-02 | 三星ダイヤモンド工業株式会社 | Method for dividing laminated ceramic substrate |
| JP6043150B2 (en) * | 2012-10-29 | 2016-12-14 | 三星ダイヤモンド工業株式会社 | Breaking apparatus for laminated brittle material substrate and method for breaking laminated brittle material substrate |
| JP6142771B2 (en) * | 2013-10-25 | 2017-06-07 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6268917B2 (en) * | 2013-10-25 | 2018-01-31 | 三星ダイヤモンド工業株式会社 | Break device |
| EP2910326B1 (en) * | 2014-02-25 | 2020-12-23 | Seco Tools Ab | Stacked material tool and method for machining |
| US10029941B2 (en) * | 2014-03-31 | 2018-07-24 | Corning Incorporated | Machining methods of forming laminated glass structures |
| JP6299405B2 (en) * | 2014-05-13 | 2018-03-28 | 旭硝子株式会社 | Method for producing composite and method for producing laminate |
| CN106457776B (en) * | 2014-05-14 | 2018-09-28 | Ａｇｃ株式会社 | Complex, laminated body and electronic device and their manufacturing method |
| TWI542457B (en) | 2014-10-17 | 2016-07-21 | 三星國際機械股份有限公司 | Film cutting tool and film cutting apparatus |
| JP6578759B2 (en) * | 2015-06-29 | 2019-09-25 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6582743B2 (en) | 2015-08-27 | 2019-10-02 | 三星ダイヤモンド工業株式会社 | Cutting tools and cutlery |
| JP6888808B2 (en) * | 2017-03-30 | 2021-06-16 | 三星ダイヤモンド工業株式会社 | Brittle material substrate with resin layer Dividing method and dividing device |
| CN107363877B (en) * | 2017-07-25 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | A kind of cutter device and cutting method |
| CN108214593B (en) * | 2018-01-02 | 2019-11-29 | 京东方科技集团股份有限公司 | A kind of break bar, cutter device and cutting method |
| US10809422B2 (en) | 2018-09-26 | 2020-10-20 | Innolux Corporation | Method for manufacturing electronic device |
| JP2019081252A (en) * | 2019-01-10 | 2019-05-30 | 三星ダイヤモンド工業株式会社 | Parting system of resin sheet |
| CN113580264B (en) * | 2021-07-03 | 2022-08-05 | 盐城市华森机械有限公司 | Side cutter taking device for cutting machine |
| CN114506710A (en) * | 2022-01-19 | 2022-05-17 | 吴江能晨经编针纺有限公司 | Coiling device with tension adjusting function for knitted fabric production workshop |
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| JP2009166169A (en) | 2009-07-30 |
| CN101486202A (en) | 2009-07-22 |
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