CN101733768B

CN101733768B - Cutting method for resin film, cutting device and cutter

Info

Publication number: CN101733768B
Application number: CN2009101761988A
Authority: CN
Inventors: 阪口良太; 舩木清二郎; 前川和哉
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2008-11-19
Filing date: 2009-09-25
Publication date: 2012-09-05
Anticipated expiration: 2029-09-25
Also published as: KR20100056358A; TW201302406A; KR101247996B1; CN102756389A; EP2189259A1; EP2189259B1; TWI421159B; CN102756389B; TWI451953B; TW201021987A; CN101733768A; JP5457014B2; JP2010120119A

Abstract

The Issue of the invention is a resin film (4) laminated on a brittle material plate (3) can be finely cut by a cutter without scratching the surface of the brittle material plate (3) or chipping a cutting edge of the cutter (1a - 1c). A cutter (1a - 1c) is used that includes a lower flat surface (12) perpendicular to an edge line (11) of a cutting edge. The cutter 1a is moved relative to a brittle material plate (3) to cut a resin film (4) with the lower flat surface (12) of the cutter (1a) and the surface of the brittle material plate (3) being in contact with each other. In this configuration, from the viewpoint of finely cutting the resin film (4) and further preventing the surface of the brittle material plate (3) from being scratched, it is preferable that the hardness of the cutting edge of the cutter (1a) be lower than the brittle material plate (3), and higher than the resin film (4).

Description

The cutting-off method of resin molding and shearing device with and the cutting knife that uses

Technical field

Method and the device that the present invention relates to a slice or the resin molding more than two on a kind of wherein one side side of using cutting knife to cut off to be layered in brittle substrate with and the cutting knife that uses.

Background technology

When cut-out is layered in the resin molding on the brittle substrate, generally be to use cutting knife to cut off.Fig. 8 representes existing shearing device.In the existing shearing device shown in this figure; Be make be installed on the cutting knife fixator 2 periphery form the discoid cutting knife 1 of point of a knife '; With the state that on the thickness direction of resin molding 4, is absorbed in, relatively move with respect to brittle substrate 3 and to cut off resin molding 4 (for example patent documentation 1 etc.).

At this moment, if cutting knife 1 ' point touch the surface of brittle substrate 3, the surface of brittle substrate 3 can be impaired so sometimes, perhaps cutting knife 1 ' point of a knife can split.Therefore, can adjust cutting knife 1 ' point so that said point is in the position that separates specific range with the surface of brittle substrate 3.

[patent documentation 1] japanese patent laid-open 3-43189

The resin molding 4 that is layered on the brittle substrate 3 in order to use cutting knife to cut off gallantly, it is desirable to shorten as much as possible cutting knife 1 ' the surface of point and brittle substrate 3 between distance, deepen cutting knife 1 ' to the otch of resin molding 4.On the other hand; Exist small concavo-convex inevitably on the surface of brittle substrate 3; If therefore shorten cutting knife 1 ' the surface of point and brittle substrate 3 between distance, so cutting knife 1 ' the point possibility that touches the surface of brittle substrate 3 will raise.

The present invention develops in view of above-mentioned existing problem, and its purpose is under the surface of brittle substrate can not the not crackable condition of point of a knife impaired or cutting knife, to use cutting knife to cut off the resin molding that is layered on the brittle substrate gallantly.

Summary of the invention

The cutting-off method of the present invention of reaching said purpose is characterized in that: it is to use cutting knife to cut off to be layered in a slice or the resin molding more than two on the wherein one side side of brittle substrate; And use the cutting knife contain perpendicular to the plane of point of a knife crestal line as said cutting knife; The plane of said cutting knife is contacted with the surface of said brittle substrate or separate minim gap and almost parallel ground subtend makes said cutting knife relatively move with respect to said brittle substrate and cuts off said resin molding.

From cutting off resin molding gallantly and making the not impaired fully angle in surface of brittle substrate, preferably make the point of a knife hardness of said cutting knife be lower than said brittle substrate and be higher than said resin molding here.

According to the present invention, a kind of shearing device is provided, it is characterized in that: its use cutting knife cuts off a slice or the resin molding more than two on the wherein one side side that is layered in brittle substrate, and comprises: cutting knife, it contains the plane perpendicular to the point of a knife crestal line; Travel mechanism, it makes said cutting knife relatively move with respect to said brittle substrate; And height adjustment mechanism, it adjusts the distance between the surface of plane and said brittle substrate of said cutting knife, so that the plane of said cutting knife contacts with the surface of said brittle substrate or separates minim gap and almost parallel ground subtend; And said cutting knife is relatively moved with respect to said brittle substrate cut off said resin molding.

In addition; According to the present invention; A kind of cutting knife is provided; It is characterized in that: it is used to cut off a slice or the resin molding two slice or more of wherein one side on the side that is layered in brittle substrate, and contains and contact with the surface of said brittle substrate or separate minim gap and the plane perpendicular to the point of a knife crestal line of almost parallel ground subtend.

From preventing the angle of the splitting of point of a knife, durability etc.,, preferably use a part of removing the disk that on periphery, forms point of a knife and formed cutting knife perpendicular to the shape on the plane of point of a knife crestal line as said cutting knife.In addition, the angle of the resistance when reducing cutting knife is relatively moved also can form and said parallel plane the 2nd plane in the inside from said plane towards radial direction.

In cutting-off method of the present invention and shearing device; Be to use the cutting knife that contains perpendicular to the plane of point of a knife crestal line as cutting knife; The plane of said cutting knife is contacted with the surface of said brittle substrate or separate minim gap and almost parallel ground subtend; Said cutting knife is relatively moved with respect to said brittle substrate cut off said resin molding; Therefore can show the point of a knife surperficial impaired or cutting knife that suppresses brittle substrate and split, thereby can cut off the resin molding that is layered on the brittle substrate gallantly.

If make the point of a knife hardness of said cutting knife be lower than brittle substrate and be higher than resin molding, can cut off resin molding gallantly so and make the surface of brittle substrate not impaired fully.

Formed cutting knife perpendicular to the shape on the plane of point of a knife crestal line if use to remove the part of the disk that on periphery, has formed point of a knife as said cutting knife, the point of a knife of cutting knife is split be suppressed, and durability also has been improved.In addition, if form and said parallel plane the 2nd plane in inside from said plane towards radial direction, the resistance in the time of can reducing cutting knife is relatively moved so, thus can be along relatively move slidingly.

Description of drawings

Fig. 1 is the front view of an example of expression shearing device of the present invention.

Fig. 2 is the side view of the shearing device of Fig. 1.

Fig. 3 is the enlarged drawing of cutting knife fixator of the shearing device of Fig. 1.

Fig. 4 is another routine front view of expression cutting knife of the present invention.

Fig. 5 is the skeleton diagram of dissengaged positions of the resin molding of expression cutting knife shown in Figure 3.

Fig. 6 is another routine front view of expression cutting knife of the present invention.

Fig. 7 is the skeleton diagram of dissengaged positions of the resin molding of expression cutting knife shown in Figure 6.

Fig. 8 is the skeleton diagram of existing shearing device.

[explanation of symbol]

1a, 1b, 1c, 1 ' cutting knife

2 cutting knife fixators

3 brittle substrates

4 resin moldings

5 film cutting knife fixture heads

7a, 7b CCD camera

11,11a, 11b, 11c, 11d crestal line

12 lower planes

Plane on 13

14 side planes

15 the 2nd lower planes

21,22 pars

51 tracks

52,68 motors

61 pallets

62 slide units

63 rotating mechanisms

64 turntables

65a, 65b guide rail

66 ball screws

67 ball nuts

The d distance

The S shearing device

The specific embodiment

Below, according to accompanying drawing come further explain cutting-off method of the present invention and shearing device with and the cutting knife that uses, but the present invention is not limited by these embodiments at all.

Fig. 1 and Fig. 2 represent an embodiment of shearing device of the present invention.Fig. 1 is the front view of shearing device, and Fig. 2 is a side view.The shearing device S of Fig. 1 comprises that the Y direction of being located on the pallet 61 towards accompanying drawing moves slide unit 62 freely and is located at the rotating mechanism 63 on the slide unit 62.And, on said rotating mechanism 63, be provided with turntable 64, carry there and put and fixing the brittle substrate 3 that surperficial laminated resin molding 4 (Fig. 5 illustrates).Through comprising the travel mechanism of slide unit 62 and rotating mechanism 63, brittle substrate 3 moves in horizontal plane freely.

Slide unit 62 moves to be installed in freely and separates specific range and pair of guide rails 65a, the 65b of configured in parallel on pallet 61 is last.And, between pair of

guide rails

65a, 65b, with the positive and negative abreast rotation of

guide rail

65a, 65b ball screw 66 is being set freely through motor 68.In addition, be provided with ball nut 67 in the bottom surface of slide unit 62.This ball nut 67 is screwed on the ball screw 66.Just changeing or reverse through ball screw 66, ball nut 67 moves towards the Y direction, the slide unit 62 that ball nut 67 has been installed thus at

guide rail

65a, 65b is last moves towards the Y direction.

On slide unit 62, be provided with rotating mechanism 63.And, on this rotating mechanism 63, be provided with turntable 64.The brittle substrate 3 of range upon range of the resin molding in surface is fixed on the turntable 64 through vacuum suction.Rotating mechanism 63 makes turntable 64 round the central shaft of vertical direction and rotate.

As shown in Figure 2, above turntable 64, flatly be provided with track 51 towards directions X.Film cutting knife fixture head 5 is done to come and go through slitter shaft motor 52 and towards the directions X of accompanying drawing along this track 51 and is moved.As shown in Figure 3, be provided with cutting knife fixator 2 in the bottom of said film cutting knife fixture head 5.And, cutting knife 1a is installed on cutting knife fixator 2 replaceably.

Cutting knife 1a is and on periphery, is formed with the discoid of point of a knife, its top and bottom is removed, thereby contain perpendicular to point of a knife crestal line 11 and last plane 13 and lower plane 12 parallel to each other.Cutting knife fixator 2 is installed cutting knife 1a, is to be connected to location and installation on the par 21 of internal upper part of cutting knife fixator 2 through the last plane 13 that makes cutting knife 1a.Certainly; Cutting knife fixator 2 is installed cutting knife 1a to be not limited thereto; Also can be for example as shown in Figure 4; On the cutting knife 1b except on also form side plane 14 plane 13, make and saidly go up plane 13 and side plane 14 is connected to the internal upper part of cutting knife fixator 2 and the

par

21,22 of inside portion respectively, locate cutting knife 1b.Importantly make the surperficial almost parallel ground subtend of lower plane 12 with the brittle substrate 3 of cutting knife 1b here.

On the other hand, cutting knife fixator 2 is the direction discrepancy installations freely from film cutting knife fixture head 5 towards turntable 64.Through the overhang of counting from film cutting knife fixture head 5 of adjustment cutting knife fixator 2, adjust the notch depth of cutting knife 1a to the lip-deep resin molding 4 (in Fig. 5, illustrating) that is layered in brittle substrate 3.In cutting-off method of the present invention, contact with the surface of brittle substrate 3 or separate minim gap and the mode of almost parallel ground subtend is cut to resin molding 4 (Fig. 5 illustrates) cutting knife 1a with the lower plane 12 of cutting knife 1a.Therefore, the overhang of counting from film cutting knife fixture head 5 of cutting knife fixator 2 is the thickness of binding resin film 4 (among Fig. 5, illustrating) and take the circumstances into consideration to confirm.

In addition, as shown in Figure 2, be provided with a pair of CCD (Charge Coupled Device, charge-coupled image sensor) camera 7a, the 7b that discerns the alignment mark of mint-mark in advance on brittle substrate 3 above the turntable 64.Through these

CCD cameras

7a, 7b, the offset when detecting being provided with of brittle substrate 3.For example light clockwise direction from the center of turntable 64 to be made as+(just), counterclockwise be made as-when (bearing), when brittle substrate 3 had squinted angle+θ, turntable 64 is rotation-θ only.And, for example on turntable 64, the Y deviation in driction of brittle substrate 3 in the figure during distance+Y, slide unit 62 is mobile-Y only.

When the shearing device that utilizes this formation cuts off the resin molding 4 that is layered on the brittle substrate 3, at first, brittle substrate put on turntable 64 and utilize in 3 years attract mechanism to fix.Then, utilize

CCD camera

7a, 7b, take and be located at the alignment mark on the brittle substrate 3, and as stated,, brittle substrate 3 is positioned on the ad-hoc location according to camera data.

Then, according to the thickness that is layered in the resin molding 4 on the brittle substrate 3, confirm the overhang of counting from film cutting knife fixture head 5 of cutting knife fixator 2.That is, outstanding through making cutting knife fixator 2 from film cutting knife fixture head 5, and for example as shown in Figure 5, cutting knife 1a is cut to resin molding 4, the lower plane 12 of cutting knife 1a is contacted with the surface of brittle substrate 3.Through film cutting knife fixture head 5 and turntable 64 are moved and rotation simultaneously or alternately; And can not make the surperficial impaired of brittle substrate 3; And do not make under the condition that the cutting knife cutter head splits, the resin molding 4 that is layered on the brittle substrate 3 is cut into desired shape.In order to obtain effect of the present invention effectively; Recommendation makes cutting knife 1a ground lower plane 12 contact with the surface of brittle substrate 3; But also can in the scope that does not hinder effect of the present invention, make the lower plane 12 of cutting knife 1a and the surface of brittle substrate 3 separate minim gap.

Utilize existing film cutting knife; Can't under the condition of not damaging brittle substrate 3, cut out the otch that runs through resin molding 4; Therefore must brittle substrate 3 sides residual slightly under the state of layer of resin molding 4 of non-incision; Brittle substrate 3 is implemented the fracture step, and then the layer of the resin 4 of non-incision is separated with the mode of tearing along the vertical slight crack of brittle substrate 3.But; When using cutting knife 1a; Then can cut out the otch that runs through resin molding 4 not making under the impaired condition of brittle substrate 3, therefore, use cutting knife 1a on resin molding 4, to cut out otch only through the surface of brittle substrate 3 being rotated after stitch marker or irradiating laser form vertical slight crack; In the fracture step, along said vertical slight crack and dividing brittle material substrate 3, can obtain the film-stack substrate of desired size.Therefore, can obtain the good film-stack substrate of quality of divisional plane.

As the shape of employed cutting knife 1a among the present invention, so long as contain shape as stated, just not special the qualification perpendicular to the plane 12 of point of a knife crestal line 11.Cutting knife 1a shown in Figure 3 contains lower plane 12 and last plane 13 and becomes a pair of crestal line 11 of point of a knife, and is connected to par 21 and the location and installation of the internal upper part of cutting knife fixator 2 through the last plane 13 that makes cutting knife 1a.When the wherein part of a crestal line 11 (with resin molding 4 contacted parts) or lower plane 12 have worn and torn or have damaged; Can be through the direction about the reaching up and down of conversion cutting knife 1a; And as shown in Figure 5, with among the figure of cutting knife 1a everywhere each position of crestal line 11a, 11b, 11c, 11d be used separately as point of a knife.

The crestal line 11 that cutting knife 1b shown in Figure 4 contains lower plane 12 and last plane 13, side plane 14 and becomes point of a knife, and the par 22 of the par 21 of the last plane 13 through making cutting knife 1b and side plane 14 internal upper part that is connected to cutting knife fixator 2 respectively and inside portion and location and installation.When the wherein part of a crestal line 11 (with resin molding 4 contacted parts) or lower plane 12 have worn and torn or have damaged, can be through the above-below direction of conversion cutting knife 1b, and with the other end of the crestal line 11 of cutting knife 1b as point of a knife.

Material about cutting knife 1a does not have special qualification, but never makes the surperficial impaired of brittle substrate 3, and along sliding and angle that cut off resin molding 4 is gallantly set out, it is desirable to its hardness and be lower than brittle substrate 3 and be higher than resin molding 4.For example, if brittle substrate 3 is glass substrates, its Vickers hardness is 5000N/mm so ²About.In addition, if tree adipose membrane 4 is polycarbonate resin adipose membrane or polyethylene terephthalate resin film, and the most Vickers hardness of these resin moldings is all less than 500N/mm so ²Therefore, when cut-out is layered in the said resin molding on the glass substrate, use Vickers hardness to be 500N/mm ²More than and less than 5000N/mm ²Cutting knife get final product.

As cutting knife raw material, for example can enumerate superhard alloy (1500N/mm with this Vickers hardness ²～2000N/mm ²) or hard chromium (700N/mm ²～2500N/mm ²), hardened steel (500N/mm ²～1000N/mm ²), SUS 304 (3200N/mm ²), SKH (790N/mm ²～820N/mm ²), the pottery (1000N/mm ²) etc.

Another embodiment of the cutting knife that Fig. 6 representes to use in the present invention.The cutting knife 1b of Fig. 6 be from the lower plane 12 of cutting knife 1a shown in Figure 3 towards radial direction only the inside of standoff distance d formed the cutting knife of 2nd lower plane 15 parallel with lower plane 12.Saidly form thickness greater than resin molding 4 apart from d.Through forming this 2nd lower plane 15, can be as shown in Figure 7, reduce to be absorbed in volume to the cutting knife 1b of resin molding 4, thus the resistance that relatively moves of cutting knife 1b can reduce to cut off resin molding 4 time.

Resin molding 4 as method of the present invention capable of using is cut off does not have special qualification, and existing well-known resin molding all can cut off.For example can enumerate PET (PET; Polyethylene terephthalate), polyester based resin, the polyimides of the fluorine resin of the acetate fiber prime system resin of Triafol T (TAC, Triacetate cellulose) etc., acrylic resin, tetrafluoroethylene/hexafluoropropylene based copolymer and so on, polycarbonate resin, PET etc. are that resin, polysulfones are that resin, polyether sulfone are that the process of resin of resin, polystyrene resin, polyvinyl alcohol resin, polyvinyl chloride resin, vistanex or polyamide-based resin etc. is configured as membranaceous resin molding.Resin molding 4 also can be at brittle substrate 3 surperficial range upon range of more than two, at this moment these resin moldings 4 both can be identical also can be different.Thickness to a slice resin molding 4 does not have special qualification, but normally in the scope below 500 μ m.

In the present invention, as the brittle substrate 3 of laminated resin film 4, can enumerate existing well-known brittle substrate.For example can enumerate the brittle substrate of glass, pottery, silicon, sapphire etc.According to cutting-off method of the present invention,, cut off being layered in its surperficial resin molding 4 even the brittle substrate of soft material also can positively not make under the impaired condition of substrate.

The cutting-off method of resin molding of the present invention can be suitable for for example being layered in cut-out of the resin molding on the glass substrate of liquid crystal panel etc.Particularly, can be suitable in the glass substrate laminated cut-out of the object etc. of Polarizer.As Polarizer, typically use bonding the Polarizer of support membrane on the two sides of polarization element.As polarization element; For example can enumerate: make dichroic dye or iodine adsorb the polarization element on the polarization element substrate that is oriented in polyvinyl alcohol resin, vinylite, Ethylene/vinyl acetate (EVA, Ethylene Vinyl Acetate) resin, polyamide, mylar etc.; In the polyvinyl alcohol film of molecular orientation, contain polyvinyl alcohol dichroism dehydration product (polyethylene) through the polyvinyl alcohol polyethylene copolymer of directed strand etc.Thickness to polarization element does not have special qualification, but usually is made as the scope below the 50 μ m for the slimming of Polarizer etc.On the other hand, as the support membrane that supports, protects polarization element, for example can enumerate TAC film or ENB mesentery etc.Thickness to support membrane does not have special qualification, but is made as the scope below the 300 μ m usually.

[industrial utilization possibility]

Utilize cutting-off method of the present invention, can under the surface of brittle substrate can not the not crackable condition of point of a knife impaired or cutting knife, use cutting knife to cut off the resin molding that is layered on the brittle substrate gallantly, thus useful.

Claims

1. cutting-off method is characterized in that: it uses cutting knife to cut off to be layered in a slice or the resin molding more than two on the wherein one side side of brittle substrate, and

Use contains cutting knife perpendicular to the plane of point of a knife crestal line as said cutting knife,

The plane of said cutting knife is contacted with the surface of said brittle substrate or separate minim gap and almost parallel ground subtend makes said cutting knife relatively move with respect to said brittle substrate and cuts off said resin molding; As said cutting knife, be to use removal on periphery, formed point of a knife disk a part and formed cutting knife perpendicular to the shape on the plane of point of a knife crestal line.

2. cutting-off method according to claim 1 is characterized in that: the point of a knife hardness of said cutting knife is lower than said brittle substrate, and is higher than said resin molding.

3. shearing device is characterized in that: it uses cutting knife to cut off to be layered in a slice or the resin molding more than two on the wherein one side side of brittle substrate, and comprises:

Cutting knife, it contains the plane perpendicular to the point of a knife crestal line;

Travel mechanism, it makes said cutting knife relatively move with respect to said brittle substrate; And

Height adjustment mechanism, it adjusts the distance between the surface of plane and said brittle substrate of said cutting knife, so that the plane of said cutting knife contacts with the surface of said brittle substrate or separates minim gap and almost parallel ground subtend; And

Said cutting knife is relatively moved with respect to said brittle substrate cut off said resin molding; And

Said cutting knife have removal on periphery, formed point of a knife disk a part and formed shape perpendicular to the plane of point of a knife crestal line.

4. cutting knife is characterized in that: it is used to cut off a slice or the resin molding more than two on the wherein one side side that is layered in brittle substrate; And

Contain and contact with the surface of said brittle substrate or separate minim gap and the plane perpendicular to the point of a knife crestal line of almost parallel ground subtend; And

It has removal on periphery, formed point of a knife disk a part and formed shape perpendicular to the plane of point of a knife crestal line.

5. cutting knife according to claim 4 is characterized in that: in the inside from said plane towards radial direction, formed and said parallel plane the 2nd plane.