CN108214593A - A kind of break bar, cutter device and cutting method - Google Patents
A kind of break bar, cutter device and cutting method Download PDFInfo
- Publication number
- CN108214593A CN108214593A CN201810002689.XA CN201810002689A CN108214593A CN 108214593 A CN108214593 A CN 108214593A CN 201810002689 A CN201810002689 A CN 201810002689A CN 108214593 A CN108214593 A CN 108214593A
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- CN
- China
- Prior art keywords
- break bar
- laser
- knife
- point
- cutting object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
- B26D7/10—Means for treating work or cutting member to facilitate cutting by heating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The present invention provides a kind of break bar, cutter device and cutting method, including:Cutter shaft, break bar body, point of a knife and laser generator;The laser generator is used to crack output laser at position in the point of a knife cutting object, the cutting object at the crack position is melted, to fill the crackle, so as to solve the problems, such as that current substrate cut is bad.
Description
Technical field
The present invention relates to technical field of display panel, more particularly to a kind of break bar, cutter device and cutting method.
Background technology
At present, when manufacture shows the display panel of equipment, the large-size substrate of whole is usually prepared first, at whole
After the completion of prepared by large-size substrate, then the large-size substrate of whole cut by several small size substrates by break bar.
In the prior art, break bar is as shown in Figure 1, the break bar includes:Cutter shaft 2, break bar body 3 and point of a knife 1, when in use, knife
Wheel body 3 obtains the pressure of cutting substrate 4 at point of a knife 1, and base is cut by rotation and under the action of the pressure of the offer of break bar body 3
Plate can generate longitudinal crack and transversal crack during cutting substrate 4 on substrate, the transversal crack as shown in Fig. 2, by
In there are transversal crack and longitudinal crack, therefore in the making of substrate subsequent technique, transversal crack can further be expanded by external force,
As shown in figure 3, fragmentation even occurs when serious.
Invention content
The present invention provides a kind of break bar, cutter device and cutting methods, and to solve, current substrate cut is undesirable to ask
Topic.
To solve the above-mentioned problems, the invention discloses a kind of break bar, including:Cutter shaft, break bar body, point of a knife and laser occur
Device;
The laser generator for cracking output laser at position in the point of a knife cutting object, is split to described
Cutting object at line position is melted, to fill the crackle.
Optionally, the laser generator is arranged in the break bar body.
Optionally, it is provided with the laser channeling connected with the laser generator in the point of a knife.
Optionally, the laser channeling has a plurality of, is symmetrically distributed in the point of a knife.
Optionally, the laser channeling inner wall is provided with high reflexed material.
Optionally, the high reflexed material is phosphorus pentoxide or silica.
Optionally, the cutting object is glass substrate.
Optionally, the point of a knife is using wolfram steel material or diamond or alloy material.
To solve the above-mentioned problems, the invention also discloses a kind of cutter device, including any one of claim 1 to 8
The break bar.
To solve the above-mentioned problems, the invention also discloses a kind of cutting method, including:
Laser generator cracks output laser at position in point of a knife cutting object;
The cutting object at crack position is melted using the laser, to fill the crackle.
Compared with prior art, the present invention includes advantages below:
Break bar of the present invention includes:Cutter shaft, break bar body, point of a knife and laser generator, by setting laser in break bar
Device, which is used to crack output laser at position in point of a knife cutting object, to being cut at the crack position
It cuts object to be melted, glass colloidal sol is made to be expressed in crackle by point of a knife, it is intact so as to which crackle be filled, so as to solve substrate
Cut the problem of bad.
Certainly, it implements any of the products of the present invention and is not necessarily required to reach all the above advantage simultaneously.
Description of the drawings
Fig. 1 is cutting wheel structure schematic diagram of the prior art;
Fig. 2 is the schematic diagram that transversal crack is generated in cutting process;
Fig. 3 is the schematic diagram after transversal crack stress;
Fig. 4 is a kind of structure diagram of break bar described in the embodiment of the present invention one;
Fig. 5 is a kind of structure diagram of break bar described in the embodiment of the present invention two;
Fig. 6 is a kind of flow chart of cutting method described in the embodiment of the present invention four.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is described in further detail.
Embodiment one
Referring to Fig. 4, it illustrates cutting wheel structure schematic diagram a kind of described in the embodiment of the present invention one, which specifically includes:
Cutter shaft 2, break bar body 3, point of a knife 1 and laser generator 5.
Cutter shaft 2 is arranged on 3 with the break bar, and the laser generator 5 is arranged in break bar body 3, and the laser occurs
Device 5 is connect with the point of a knife 1, for cracking output laser at position in 1 cutting object of point of a knife, to the crackle position
The cutting object at the place of putting is melted, to fill the crackle.
Cutter shaft 2 is arranged on the break bar body 3, and the point of a knife 1, the laser generator 5 are driven by the rotation of cutter shaft 2
With the break bar body 3, the point of a knife 1, the laser generator 5 and the break bar body 3 is made, which to be moved to cutting object, to be needed to cut
Position at.
It should be noted that the present embodiment is arranged on the explanation that break bar carries out as example with laser generator, actually should
In, laser generator may be set there are a variety of, such as:Laser generator is arranged on outside break bar body, will be swashed by optical fiber
The laser of optical generator output is output to cracks.
The laser generator 5 is connected by optical fiber with break bar body 3, and the laser is occurred by optical fiber for laser generator
The laser that device 5 exports is used to crack output laser at position in 1 cutting object of point of a knife, by laser to the crackle
Cutting object at position is melted, and colloidal sol is made to be expressed in crackle by point of a knife, complete so as to which crackle is filled.
The present embodiment, break bar include:Cutter shaft, break bar body, point of a knife and laser generator, by laser being set to send out in break bar
Raw device, which is used to crack output laser at position in point of a knife cutting object, at the crack position
Cutting object is melted, and glass colloidal sol is made to be expressed in crackle by point of a knife, intact so as to which crackle be filled, so as to solve base
The problem of plate cutting is bad.
Embodiment two
Referring to Fig. 5, it illustrates cutting wheel structure schematic diagram a kind of described in the embodiment of the present invention two, which specifically includes:
Cutter shaft 2, break bar body 3, point of a knife 1, laser generator 5 and laser channeling 6.
Cutter shaft 2 is arranged on the break bar body 3, and the laser generator 5 is arranged in break bar body 3, and the laser occurs
Device 5 is connect with the laser channeling 6 set in the point of a knife 1, is exported at position for being cracked in 1 cutting object of point of a knife
Laser melts the cutting object at the crack position, to fill the crackle.
Optionally, the cutting object is glass substrate or other substrates, such as plastic base is not this present invention
Concrete restriction.
In Figure 5, when the break bar glass-cutting substrate for using the present invention, when point of a knife 1 streaks glass, it can generate and laterally split
Line, the laser exported at this time from laser generator 5 are had an effect by laser channeling 6 with glass, and the side of glass is melt into
Glass colloidal sol, the glass colloidal sol are expressed to by point of a knife 1 in the crackle of glass side, complete so as to which crackle is filled, while in glass
Glass side forms one layer of glassivation.
Optionally, the laser channeling 6 has a plurality of, is symmetrically distributed in the point of a knife.
Optionally, 6 inner wall of laser channeling is provided with high reflexed material, and the laser exported in this way passes through laser channeling 6
With it photochemical and thermal reaction occurs for Shi Buhui, will not generate temperature, and then damages break bar in itself or laser channeling.
In practical applications, the high reflexed material is phosphorus pentoxide or silica, or other materials.
Generally using wolfram steel material or diamond or alloy material etc., laser generator 5 generally uses point of a knife 1
Miniature laser generator need to only meet after laser focuses on and reach glass melting point in this way, and without reaching glass gasification, power is relatively general
Logical laser cutter is relatively low, is content with very little, and cost is relatively low,
The present embodiment, break bar include:Cutter shaft, break bar body, point of a knife and laser generator, by laser being set to send out in break bar
Raw device, which is used to crack output laser at position in point of a knife cutting object, at the crack position
Cutting object is melted, and glass colloidal sol is made to be expressed in crackle by point of a knife, intact so as to which crackle be filled, so as to solve base
The problem of plate cutting is bad.
Embodiment three
The invention also discloses a kind of cutter device, including the break bar described in embodiment one and embodiment two.
The cutter device has the advantages that all of break bar in above-described embodiment one, two, and details are not described herein.
Example IV
Referring to Fig. 6, it illustrates the flow charts of cutting method a kind of described in the embodiment of the present invention four, specifically include:
Step 601:Laser generator cracks output laser at position in point of a knife cutting object.
Step 602:The cutting object at crack position is melted using the laser, to fill the crackle.
The present embodiment cracks output laser at position in point of a knife cutting object by laser generator, is split to described
Cutting object at line position is melted, and glass colloidal sol is made to be expressed in crackle by point of a knife, intact so as to which crackle be filled, from
And solve the problems, such as that substrate cut is bad.
It should be noted that for aforementioned embodiment of the method, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement, because according to
According to the present invention, certain steps may be used other sequences or be carried out at the same time.Secondly, those skilled in the art should also know,
Embodiment described in this description belongs to preferred embodiment, and involved action is not necessarily essential to the invention.
Each embodiment in this specification is described by the way of progressive, the highlights of each of the examples are with
The difference of other embodiment, just to refer each other for identical similar part between each embodiment.
It would have readily occurred to a person skilled in the art that be:The arbitrary combination application of above-mentioned each embodiment is all feasible, therefore
Arbitrary combination between above-mentioned each embodiment is all embodiment of the present invention, but this specification exists as space is limited,
This is not just detailed one by one.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this practical relationship or sequence.Moreover, term " comprising ", "comprising", not only including those elements, but also are wrapped
Include other elements that are not explicitly listed or further include for this process, method, article or equipment it is intrinsic will
Element.In the absence of more restrictions, the element limited by sentence " including ... ", it is not excluded that including the element
Also there are other identical elements in process, method, article or equipment.
Moreover, "and/or" expression above both contained herein " and " relationship, also contain the relationship of "or",
In:If option A and option b be " and " relationship, then it represents that option A and option b can be included in certain embodiment simultaneously;If
Option A and the relationship that option b is "or", then it represents that can individually include option A in certain embodiment or individually include option b.
Although preferred embodiments of the present invention have been described, but those skilled in the art once know basic creation
Property concept, then can make these embodiments other change and modification.So appended claims be intended to be construed to include it is excellent
It selects embodiment and falls into all change and modification of the scope of the invention.
It above to a kind of break bar provided by the present invention, cutter device and cutting method, is described in detail, herein
In apply specific case the principle of the present invention and embodiment be expounded, the explanation of above example is only intended to sides
Assistant solves the method and its core concept of the present invention;Meanwhile for those of ordinary skill in the art, think of according to the present invention
Think, in specific embodiments and applications there will be changes, in conclusion the content of the present specification should not be construed as pair
The limitation of the present invention.
Claims (10)
1. a kind of break bar, which is characterized in that including:Cutter shaft, break bar body, point of a knife and laser generator;
The laser generator, for cracking output laser at position in the point of a knife cutting object, to the crackle position
The cutting object at the place of putting is melted, to fill the crackle.
2. break bar according to claim 1, which is characterized in that the laser generator is arranged in the break bar body.
3. break bar according to claim 1, which is characterized in that be provided in the point of a knife and connected with the laser generator
Laser channeling.
4. break bar according to claim 3, which is characterized in that the laser channeling has a plurality of, is symmetrically distributed in the knife
In point.
5. break bar according to claim 3, which is characterized in that the laser channeling inner wall is provided with high reflexed material.
6. break bar according to claim 5, which is characterized in that the high reflexed material is phosphorus pentoxide or titanium dioxide
Silicon.
7. according to claim 1-6 any one of them break bars, which is characterized in that the cutting object is glass substrate.
8. according to claim 1-6 any one of them break bars, which is characterized in that the point of a knife uses wolfram steel material or Buddha's warrior attendant
Stone material or alloy material.
9. a kind of cutter device, which is characterized in that including break bar described in any item of the claim 1 to 8.
10. a kind of cutting method, which is characterized in that including:
Laser generator cracks output laser at position in point of a knife cutting object;
The cutting object at crack position is melted using the laser, to fill the crackle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810002689.XA CN108214593B (en) | 2018-01-02 | 2018-01-02 | A kind of break bar, cutter device and cutting method |
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CN201810002689.XA CN108214593B (en) | 2018-01-02 | 2018-01-02 | A kind of break bar, cutter device and cutting method |
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CN108214593A true CN108214593A (en) | 2018-06-29 |
CN108214593B CN108214593B (en) | 2019-11-29 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112428327A (en) * | 2020-10-23 | 2021-03-02 | Oppo广东移动通信有限公司 | Processing method, processing equipment, display panel and electronic equipment |
Citations (9)
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CN1271646A (en) * | 1998-11-06 | 2000-11-01 | 肖特玻璃制造厂 | Method and apparatus for cutting laminated products made of hard brittle material and plastics |
CN1473354A (en) * | 2001-09-10 | 2004-02-04 | ������������ʽ���� | Apparatus for repairing defect of substrate |
CN1703770A (en) * | 2002-12-03 | 2005-11-30 | 浜松光子学株式会社 | Method for cutting semiconductor substrate |
CN200991967Y (en) * | 2006-12-19 | 2007-12-19 | 劲钻科技股份有限公司 | Cutter wheel for fragile board material |
CN101486202A (en) * | 2008-01-15 | 2009-07-22 | 三星钻石工业股份有限公司 | Cutting method for laminated body and cutting knife used therein |
CN101709468A (en) * | 2009-12-10 | 2010-05-19 | 南昌航空大学 | Method for rapidly preparing gradient metal ceramic composite material by laser induction hybrid cladding |
CN101734850A (en) * | 2008-11-26 | 2010-06-16 | 株式会社日本制钢所 | Knife wheel |
CN102403466A (en) * | 2011-11-18 | 2012-04-04 | 上海大学 | Laser bonding method for packaging of photoelectric device |
CN106735587A (en) * | 2016-12-27 | 2017-05-31 | 重庆市永川区益锐机械有限责任公司 | Connecting rod cutter sweep |
-
2018
- 2018-01-02 CN CN201810002689.XA patent/CN108214593B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1271646A (en) * | 1998-11-06 | 2000-11-01 | 肖特玻璃制造厂 | Method and apparatus for cutting laminated products made of hard brittle material and plastics |
CN1473354A (en) * | 2001-09-10 | 2004-02-04 | ������������ʽ���� | Apparatus for repairing defect of substrate |
CN1703770A (en) * | 2002-12-03 | 2005-11-30 | 浜松光子学株式会社 | Method for cutting semiconductor substrate |
CN200991967Y (en) * | 2006-12-19 | 2007-12-19 | 劲钻科技股份有限公司 | Cutter wheel for fragile board material |
CN101486202A (en) * | 2008-01-15 | 2009-07-22 | 三星钻石工业股份有限公司 | Cutting method for laminated body and cutting knife used therein |
CN101734850A (en) * | 2008-11-26 | 2010-06-16 | 株式会社日本制钢所 | Knife wheel |
CN101709468A (en) * | 2009-12-10 | 2010-05-19 | 南昌航空大学 | Method for rapidly preparing gradient metal ceramic composite material by laser induction hybrid cladding |
CN102403466A (en) * | 2011-11-18 | 2012-04-04 | 上海大学 | Laser bonding method for packaging of photoelectric device |
CN106735587A (en) * | 2016-12-27 | 2017-05-31 | 重庆市永川区益锐机械有限责任公司 | Connecting rod cutter sweep |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112428327A (en) * | 2020-10-23 | 2021-03-02 | Oppo广东移动通信有限公司 | Processing method, processing equipment, display panel and electronic equipment |
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CN108214593B (en) | 2019-11-29 |
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