TWI593649B - Cutting method of composite board, glass plate cutting method - Google Patents

Cutting method of composite board, glass plate cutting method Download PDF

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Publication number
TWI593649B
TWI593649B TW102129343A TW102129343A TWI593649B TW I593649 B TWI593649 B TW I593649B TW 102129343 A TW102129343 A TW 102129343A TW 102129343 A TW102129343 A TW 102129343A TW I593649 B TWI593649 B TW I593649B
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Taiwan
Prior art keywords
resin film
glass
glass plate
glass sheet
laser light
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TW102129343A
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Chinese (zh)
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TW201418179A (en
Inventor
Junichi Kakuta
Kenichi Ebata
Atsushi Inoue
Shinjo Mitani
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Asahi Glass Co Ltd
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Publication of TW201418179A publication Critical patent/TW201418179A/en
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Publication of TWI593649B publication Critical patent/TWI593649B/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00Severing by means other than cutting; Apparatus therefor
    • B26F3/002Precutting and tensioning or breaking
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074Glass products comprising an outer layer or surface coating of non-glass material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/16Composite materials, e.g. fibre reinforced
    • B23K2103/166Multilayered materials
    • B23K2103/172Multilayered materials wherein at least one of the layers is non-metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Description

複合板之切斷方法、玻璃板之切斷方法 Cutting method of composite plate, cutting method of glass plate

本發明係關於一種複合板之切斷方法、及玻璃板之切斷方法、複合板之切斷片。 The present invention relates to a method for cutting a composite sheet, a method for cutting a glass sheet, and a cut sheet for a composite sheet.

已知一種包含玻璃板及形成於該玻璃板上之樹脂膜之複合板。該複合板兼具玻璃板之耐化學品性、耐熱性與樹脂膜之撓性,且將此特性充分地運用於例如顯示器、太陽電池等之製造。 A composite panel comprising a glass sheet and a resin film formed on the glass sheet is known. This composite sheet combines the chemical resistance and heat resistance of the glass sheet with the flexibility of the resin film, and this characteristic is sufficiently applied to the production of, for example, a display, a solar battery, or the like.

近年來,作為複合板之切斷方法,提出使用有雷射光之方法(例如,參照專利文獻1)。 In recent years, as a method of cutting a composite panel, a method of using laser light has been proposed (for example, refer to Patent Document 1).

又,作為玻璃板之切斷方法,已知利用雷射光局部地加熱玻璃板,且藉由熱應力而於玻璃板上形成裂紋之方法(例如,參照專利文獻2)。 Moreover, as a method of cutting a glass plate, a method of locally heating a glass plate by laser light and forming a crack on a glass plate by thermal stress is known (for example, refer patent document 2).

先前技術文獻 Prior technical literature 專利文獻 Patent literature

專利文獻1:日本專利特表2010-501457號公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2010-501457

專利文獻2:日本專利特開2010-90009號公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2010-90009

若玻璃板之厚度變薄,則形成於玻璃板之裂紋於厚度方向上貫通玻璃板。 When the thickness of the glass plate is thin, the crack formed in the glass plate penetrates the glass plate in the thickness direction.

如此一來,於裂紋之形成時,隔著裂紋之兩側之玻璃並未連 結,故而玻璃易變形,裂紋之位置易自所需之位置偏離。 As a result, when the crack is formed, the glass on both sides of the crack is not connected. The knot is so easy that the glass is easily deformed and the position of the crack is easily deviated from the desired position.

本發明係鑒於上述課題而完成者,其目的在於提供一種切斷精度良好之複合板之切斷方法、切斷精度良好之玻璃板之切斷方法。 The present invention has been made in view of the above problems, and an object of the invention is to provide a method for cutting a composite sheet having a high cutting precision and a method for cutting a glass sheet having a high cutting precision.

為解決上述課題,本發明之一態樣係一種複合板之切斷方法,其係包含厚度為200μm以下之玻璃板、及形成於該玻璃板上之樹脂膜之複合板之切斷方法,且包含以下步驟:對上述複合板之上述玻璃板局部地照射雷射光,以玻璃之緩冷點以下之溫度局部地加熱上述玻璃板,使上述雷射光於上述玻璃板上之照射位置移動,沿著移動軌跡,使於厚度方向上貫通上述玻璃板之裂紋伸展,於該步驟中,上述樹脂膜跨過上述裂紋,將隔著上述裂紋之兩側之玻璃連結,且於該步驟後切斷上述樹脂膜。 In order to solve the above problems, an aspect of the present invention is a method for cutting a composite panel, which comprises a method of cutting a composite panel comprising a glass sheet having a thickness of 200 μm or less and a resin film formed on the glass sheet, and The method comprises the steps of: locally irradiating the glass plate of the composite plate with laser light, locally heating the glass plate at a temperature below a slow cooling point of the glass, and moving the laser light to an irradiation position of the glass plate; Moving the trajectory to extend the crack extending through the glass sheet in the thickness direction, and in the step, the resin film crosses the crack, connects the glass across the crack, and cuts the resin after the step membrane.

又,本發明之另一態樣係一種玻璃板之切斷方法,其係厚度為200μm以下之玻璃板之切斷方法,且包含以下步驟:對包含該玻璃板及形成於該玻璃板上之樹脂膜之複合板之玻璃板局部地照射雷射光,以玻璃之緩冷點以下之溫度局部地加熱上述玻璃板,使上述雷射光於上述玻璃板上之照射位置移動,沿著移動軌跡,使於厚度方向上貫通上述玻璃板之裂紋伸展,於該步驟中,上述樹脂膜跨過上述裂紋,將隔著上述裂紋之兩側之玻璃連結。 Moreover, another aspect of the present invention is a method for cutting a glass sheet, which is a method for cutting a glass sheet having a thickness of 200 μm or less, and comprising the steps of: comprising the glass sheet and forming on the glass sheet The glass plate of the composite film of the resin film partially irradiates the laser light, and locally heats the glass plate at a temperature lower than the slow cooling point of the glass, and moves the laser light to the irradiation position of the glass plate to move along the movement track. The crack propagates through the glass sheet in the thickness direction. In this step, the resin film crosses the crack and connects the glass on both sides of the crack.

根據本發明,提供一種切斷精度良好之複合板之切斷方法、及切斷精度良好之玻璃板之切斷方法。 According to the present invention, there is provided a method for cutting a composite sheet having a high cutting precision and a method for cutting a glass sheet having a high cutting precision.

10‧‧‧複合板 10‧‧‧Composite board

12‧‧‧玻璃板 12‧‧‧ glass plate

12a‧‧‧雷射照射面 12a‧‧‧Laser illuminated surface

14‧‧‧樹脂膜 14‧‧‧ resin film

14a‧‧‧樹脂膜14之與玻璃板12接觸之面 14a‧‧‧ The surface of the resin film 14 that is in contact with the glass plate 12

20‧‧‧雷射光 20‧‧‧Laser light

30‧‧‧初期裂紋 30‧‧‧ initial crack

31‧‧‧裂紋 31‧‧‧ crack

40‧‧‧冷媒 40‧‧‧Refrigerant

50‧‧‧噴嘴 50‧‧‧ nozzle

111、112‧‧‧切斷片 111, 112‧‧‧ cut pieces

121、122‧‧‧玻璃 121, 122‧‧‧ glass

141、142‧‧‧樹脂膜 141, 142‧‧‧ resin film

143‧‧‧熱劣化部 143‧‧‧ Thermal Degradation Department

L、W‧‧‧長度 L, W‧‧‧ length

圖1係表示本發明之第1實施形態之複合板之切斷方法之第1步驟 的立體圖。 Fig. 1 is a first step showing a method of cutting a composite sheet according to a first embodiment of the present invention. Stereogram.

圖2係表示本發明之第1實施形態之複合板之切斷方法之第2步驟的立體圖。 Fig. 2 is a perspective view showing a second step of the method for cutting a composite panel according to the first embodiment of the present invention.

圖3係圖2之玻璃板之雷射照射面上之雷射光之尺寸的說明圖。 Fig. 3 is an explanatory view showing the size of the laser light on the laser irradiation surface of the glass plate of Fig. 2.

圖4係表示圖2之雷射掃描後之複合板之狀態之立體圖。 Fig. 4 is a perspective view showing the state of the composite panel after the laser scanning of Fig. 2.

圖5係表示圖4之樹脂膜之狀態之立體圖。 Fig. 5 is a perspective view showing the state of the resin film of Fig. 4.

圖6係表示圖2之雷射掃描後自支持台拆卸時之複合板之狀態的側視圖。 Fig. 6 is a side view showing the state of the composite panel when the self-supporting table is removed after the laser scanning of Fig. 2.

圖7係表示圖6之步驟後之複合板之狀態的立體圖。 Fig. 7 is a perspective view showing the state of the composite panel after the step of Fig. 6.

圖8係表示本發明之第1實施形態之複合板之切斷方法之第3步驟的側視圖。 Fig. 8 is a side view showing a third step of the method for cutting a composite sheet according to the first embodiment of the present invention.

圖9係表示圖8之第3步驟後獲得之切斷片的立體圖。 Fig. 9 is a perspective view showing a cut piece obtained after the third step of Fig. 8.

圖10係本發明之第2實施形態之玻璃板之切斷方法的說明圖。 Fig. 10 is an explanatory view showing a method of cutting a glass sheet according to a second embodiment of the present invention.

以下,參照圖式,對用以實施本發明之形態進行說明。於各圖式中,對於相同或相應之構成標註相同或相應之符號而省略說明。 Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. In the drawings, the same or corresponding reference numerals are given to the same or corresponding components, and the description is omitted.

[第1實施形態] [First Embodiment]

圖1~圖9係本發明之第1實施形態之複合板之切斷方法之說明圖。 FIG. 1 to FIG. 9 are explanatory views of a method of cutting a composite sheet according to the first embodiment of the present invention.

如圖1所示,本發明之複合板10包含玻璃板12、及形成於玻璃板12上之樹脂膜14。複合板10係兼具玻璃板12之耐化學品性、耐熱性與樹脂膜14之撓性,且將此特性充分地運用於例如顯示器、太陽電池等之製造。 As shown in FIG. 1, the composite panel 10 of the present invention comprises a glass sheet 12 and a resin film 14 formed on the glass sheet 12. The composite sheet 10 combines the chemical resistance and heat resistance of the glass sheet 12 with the flexibility of the resin film 14, and this characteristic is sufficiently applied to the production of, for example, a display, a solar battery, or the like.

玻璃板12之玻璃種類可為多種多樣,例如可為鈉鈣玻璃、無鹼玻璃等。又,玻璃板12之成形方法可為普通之方法,例如可為浮式法、融合法、再曳引法等。 The glass of the glass plate 12 can be various, and may be, for example, soda lime glass, alkali-free glass, or the like. Further, the method of forming the glass sheet 12 may be a conventional method, and may be, for example, a float method, a fusion method, a re-drawing method, or the like.

玻璃板12之0℃~300℃下之平均線膨脹係數(以下,僅稱為「平均線膨脹係數」)例如為10×10-7/℃~100×10-7/℃,較佳為10×10-7/℃~50×10-7/℃。 The average linear expansion coefficient (hereinafter, simply referred to as "average linear expansion coefficient") of the glass plate 12 at 0 ° C to 300 ° C is, for example, 10 × 10 -7 / ° C to 100 × 10 -7 / ° C, preferably 10 ×10 -7 /°C~50×10 -7 /°C.

玻璃板12之厚度為200μm以下。於玻璃板12之厚度為200μm以下之情形時,可將玻璃板12捲繞成螺旋狀,製成玻璃輥。又,於玻璃板12之厚度為200μm以下之情形時,藉由圖2所示之雷射光20之照射而形成於玻璃板12之裂紋31於厚度方向上貫通玻璃板12。玻璃板12之厚度較佳為150μm以下,更佳為100μm以下,進而更佳為50μm以下。又,玻璃板12之厚度較佳為10μm以上。 The thickness of the glass plate 12 is 200 μm or less. When the thickness of the glass plate 12 is 200 μm or less, the glass plate 12 can be wound into a spiral shape to form a glass roll. When the thickness of the glass plate 12 is 200 μm or less, the crack 31 formed on the glass plate 12 by the irradiation of the laser light 20 shown in FIG. 2 penetrates the glass plate 12 in the thickness direction. The thickness of the glass plate 12 is preferably 150 μm or less, more preferably 100 μm or less, and still more preferably 50 μm or less. Further, the thickness of the glass plate 12 is preferably 10 μm or more.

玻璃板12亦可為預先經實施表面處理者,以提昇玻璃與樹脂之密接性,。作為表面處理,可列舉底漆處理、臭氧處理、電漿蝕刻處理等。作為底漆,可例示矽烷偶合劑。作為矽烷偶合劑,可例示胺基矽烷類、環氧矽烷類、烷氧基矽烷類、矽氮烷類等。 The glass plate 12 may also be a surface treated person beforehand to improve the adhesion between the glass and the resin. Examples of the surface treatment include primer treatment, ozone treatment, plasma etching treatment, and the like. As the primer, a decane coupling agent can be exemplified. Examples of the decane coupling agent include amino decanes, epoxy decanes, alkoxy decanes, and decazanes.

於玻璃板12上形成樹脂膜14之方法並無特別限定,但例如可為將液狀之樹脂組合物塗佈於玻璃板12,使樹脂組合物固化之方法;將樹脂薄膜貼附於玻璃板12上之方法之任一者。樹脂薄膜亦可為預先經實施表面處理者,以提昇玻璃與樹脂之密接性,例如可為對與玻璃接觸之面塗佈有黏著劑者。該情形時,樹脂膜14包含作為基材之樹脂薄膜、及黏著劑。作為黏著劑,可列舉:異氰酸酯系、聚胺基甲酸酯系、聚酯系、丙烯酸系、聚乙烯亞胺系、橡膠系、矽烷偶合劑、鈦偶合劑、聚矽氧系、聚醯亞胺聚矽氧系等。 The method of forming the resin film 14 on the glass plate 12 is not particularly limited, and for example, it may be a method of applying a liquid resin composition to the glass plate 12 to cure the resin composition, and attaching the resin film to the glass plate. Any of the methods on the 12th. The resin film may be a surface treated person in advance to improve the adhesion between the glass and the resin, and for example, an adhesive may be applied to the surface in contact with the glass. In this case, the resin film 14 contains a resin film as a base material and an adhesive. Examples of the adhesive include an isocyanate type, a polyurethane type, a polyester type, an acrylic type, a polyethyleneimine type, a rubber type, a decane coupling agent, a titanium coupling agent, a polyfluorene type, and a polyfluorene type. Amine polyoxane and the like.

樹脂膜14較佳為形成於玻璃板12之切斷位置(亦即,玻璃板12中之雷射光20(參照圖2)之照射位置之移動軌跡)之至少一部分上,且形成於玻璃板12之至少切斷結束位置,更佳為遍及玻璃板12之切斷位置整體而形成。 The resin film 14 is preferably formed on at least a portion of the cut position of the glass sheet 12 (that is, the movement locus of the irradiation position of the laser light 20 (see FIG. 2) in the glass sheet 12, and is formed on the glass sheet 12. At least the cutting end position is preferably formed over the entire cutting position of the glass sheet 12.

樹脂膜14之詳情將於以下描述,其發揮如下之作用:跨過因雷 射光20之照射而形成於玻璃板12之裂紋31,將隔著裂紋31之兩側之玻璃121、122連結。因此,較佳為至少自裂紋31(亦即,玻璃板12上之雷射光之照射位置之移動軌跡之中心線)起在與裂紋31正交之兩方向上分別為2.5mm以內之區域由樹脂膜14覆蓋。又,更佳為至少自裂紋31起在與裂紋31正交之兩方向上分別為5mm以內之區域由樹脂膜14覆蓋。 The details of the resin film 14 will be described below, which serves as follows: The crack 31 formed on the glass plate 12 by the irradiation of the light 20 is connected to the glass 121 and 122 on both sides of the crack 31. Therefore, it is preferable that at least the region from the crack 31 (i.e., the center line of the movement locus of the irradiation position of the laser light on the glass plate 12) within 2.5 mm in both directions orthogonal to the crack 31 is made of resin. The film 14 is covered. Further, it is more preferable that at least the region within 5 mm from the crack 31 in the two directions orthogonal to the crack 31 is covered with the resin film 14.

樹脂膜14可大於或小於玻璃板12。尤佳為樹脂膜14具有與玻璃板12相同之大小。 The resin film 14 may be larger or smaller than the glass plate 12. It is particularly preferable that the resin film 14 has the same size as the glass plate 12.

樹脂膜14亦可由熱塑性樹脂、熱固性樹脂之任一者形成,但較佳為由熱固性樹脂形成,以於利用圖2所示之雷射光20局部地加熱玻璃板12時,不使樹脂膜14裂開而被切斷。作為熱固性樹脂,可使用例如聚醯亞胺(PI,polyimide)、環氧樹脂(EP,epoxy)等。作為熱塑性樹脂,可使用例如聚醯胺(PA,polyamide)、聚醯胺醯亞胺(PAI,polyamide-imide)、聚醚醚酮(PEEK,polyetheretherketone)、聚對苯二甲酸乙二酯(PET,polyethylene terephthalate)、聚萘二甲酸乙二酯(PEN,polyethylene naphthalate)、聚醚碸(PES,polyethersulphone)、環狀聚烯烴(COP,Cyclic Olefin Copolymer)、聚碳酸酯(PC,polycarbonate)、聚氯乙烯(PVC,polyvinylchloride)、聚乙烯(PE,polyethylene)、聚丙烯(PP,polypropylene)、丙烯酸系聚合物(PMMA,Polymethyl methacrylate)、胺基甲酸酯(PU,Polyurethane)等。再者,樹脂膜14亦可由光硬化性樹脂形成。 The resin film 14 may be formed of any one of a thermoplastic resin and a thermosetting resin, but is preferably formed of a thermosetting resin so as not to partially crack the resin film 14 when the glass plate 12 is locally heated by the laser light 20 shown in FIG. Opened and cut off. As the thermosetting resin, for example, polyimide (PI), epoxy resin (EP, epoxy), or the like can be used. As the thermoplastic resin, for example, PA, polyamide, polyamide-imide, polyetheretherketone (PEEK), polyethylene terephthalate (PET) can be used. , polyethylene terephthalate), polyethylene naphthalate (PEN), polyether sulphide (PES), cyclic polyolefin (COP, Cyclic Olefin Copolymer), polycarbonate (PC, polycarbonate), poly Vinyl chloride (PVC), polyethylene (PE), polypropylene (PP), acrylic polymer (PMMA, Polymethyl methacrylate), urethane (PU), and the like. Further, the resin film 14 may be formed of a photocurable resin.

又,為提昇耐熱性或強度、成形性等,樹脂膜14亦可包含無機填料。 Moreover, the resin film 14 may contain an inorganic filler in order to improve heat resistance, strength, moldability, and the like.

樹脂膜14較佳為形成於玻璃板12之單面,且較佳為形成於與玻璃板12之雷射光20所入射之面12a(以下,稱為玻璃板12之雷射照射面12a)為相反側之面。 The resin film 14 is preferably formed on one surface of the glass plate 12, and is preferably formed on a surface 12a (hereinafter referred to as a laser irradiation surface 12a of the glass plate 12) on which the laser light 20 of the glass plate 12 is incident. The opposite side.

樹脂膜14之厚度係取決於樹脂膜14之種類,但例如為1μm~200μm,更佳為1μm~100μm,進而更佳為1μm~50μm。若樹脂膜14之厚度過厚,則無法藉由彎折樹脂膜14而將樹脂膜14割斷。又,若樹脂膜14之厚度過薄,則於利用雷射光20局部地加熱玻璃板12時,將導致樹脂膜14裂開而被切斷。再者,於樹脂膜14包含基材與黏著劑之情形時,樹脂膜14之厚度為基材與黏著劑之合計之厚度。 The thickness of the resin film 14 depends on the kind of the resin film 14, but is, for example, 1 μm to 200 μm, more preferably 1 μm to 100 μm, still more preferably 1 μm to 50 μm. If the thickness of the resin film 14 is too thick, the resin film 14 cannot be cut by bending the resin film 14. Moreover, when the thickness of the resin film 14 is too thin, when the glass plate 12 is partially heated by the laser light 20, the resin film 14 is cracked and cut. In the case where the resin film 14 contains a substrate and an adhesive, the thickness of the resin film 14 is the total thickness of the substrate and the adhesive.

樹脂膜14之剝離強度係利用一面將玻璃板12保持平坦,一面自玻璃板12剝下樹脂膜14之180°剝離試驗(JIS K6854-2)進行測定。為了於雷射光20之照射時樹脂膜14可抑制玻璃板12之變形,樹脂膜14之剝離強度例如大於0N/25mm,較佳為0.01N/25mm以上,更佳為0.1N/25mm以上。 The peeling strength of the resin film 14 was measured by a 180° peeling test (JIS K6854-2) in which the resin film 14 was peeled off from the glass plate 12 while the glass plate 12 was kept flat. The resin film 14 can suppress deformation of the glass sheet 12 at the time of irradiation of the laser light 20, and the peeling strength of the resin film 14 is, for example, more than 0 N/25 mm, preferably 0.01 N/25 mm or more, and more preferably 0.1 N/25 mm or more.

複合板之切斷方法包含例如於玻璃板12形成初期裂紋30之第1步驟(參照圖1)、形成於厚度方向上貫通玻璃板12之裂紋31之第2步驟(參照圖2)、及切斷樹脂膜14之第3步驟(參照圖8)。 The cutting method of the composite sheet includes, for example, a first step of forming the initial crack 30 in the glass sheet 12 (see FIG. 1), a second step (see FIG. 2) of forming the crack 31 penetrating the glass sheet 12 in the thickness direction, and cutting. The third step of breaking the resin film 14 (see Fig. 8).

第1步驟係如圖1所示,於玻璃板12形成初期裂紋30。初期裂紋30係形成於玻璃板12之切斷開始位置,亦可形成於玻璃板12之端部。初期裂紋30可利用輪式刀具或切削刀具、銼刀、雷射等形成。 In the first step, as shown in FIG. 1, an initial crack 30 is formed in the glass sheet 12. The initial crack 30 is formed at the cutting start position of the glass sheet 12, and may be formed at the end of the glass sheet 12. The initial crack 30 can be formed by a wheel cutter, a cutting tool, a file, a laser, or the like.

第1步驟可於玻璃板12上形成樹脂膜14之前實施,亦可於玻璃板12上形成樹脂膜14之後實施。於後者之情形時,於初期裂紋30之形成時,玻璃板12由樹脂膜14增強,故而可抑制玻璃板12之破損。 The first step may be performed before the resin film 14 is formed on the glass plate 12, or may be performed after the resin film 14 is formed on the glass plate 12. In the latter case, when the initial crack 30 is formed, the glass sheet 12 is reinforced by the resin film 14, so that the damage of the glass sheet 12 can be suppressed.

第1步驟可為任意之步驟,亦可無第1步驟。例如,於玻璃板12之端面經磨石等研磨而成之情形時,可將藉由研磨所形成之微裂紋用作初期裂紋。 The first step may be any step or no first step. For example, when the end surface of the glass plate 12 is ground by a grindstone or the like, microcracks formed by polishing can be used as initial cracks.

第2步驟係如圖2所示,對複合板10之玻璃板12局部地照射雷射光20,以玻璃之緩冷點以下之溫度局部地加熱玻璃板12,且使玻璃板12上之雷射光20之照射位置移動。 In the second step, as shown in FIG. 2, the glass plate 12 of the composite panel 10 is partially irradiated with the laser light 20, and the glass plate 12 is locally heated at a temperature below the slow cooling point of the glass, and the laser light on the glass plate 12 is made. The illumination position of 20 moves.

為使玻璃板12上之雷射20之照射位置移動,而可使玻璃板12移動,亦可使雷射光20之光源移動,亦可使兩者移動。玻璃板12之移動係例如藉由支持玻璃板12之平台之移動、或搬送玻璃板12之搬送輥之旋轉而進行。搬送輥係以其中心線為中心而旋轉。亦可代替玻璃板12之移動,而進行玻璃板12之旋轉。玻璃板12之旋轉係藉由支持玻璃板12之平台之旋轉而進行。使平台以突設於平台之旋轉軸為中心進行旋轉。玻璃板12之旋轉係於玻璃板12上之雷射光20之照射位置之移動軌跡為曲線狀之情形時尤其有效。又,為了使玻璃板12上之雷射20之照射位置移動,亦可使將來自光源之雷射光朝向玻璃板12反射之檢流計鏡旋轉。 In order to move the irradiation position of the laser beam 20 on the glass plate 12, the glass plate 12 can be moved, and the light source of the laser light 20 can be moved or both can be moved. The movement of the glass sheet 12 is performed, for example, by the movement of the platform supporting the glass sheet 12 or the rotation of the conveying roller that transports the glass sheet 12. The conveying roller rotates centering on its center line. Instead of the movement of the glass sheet 12, the rotation of the glass sheet 12 can also be performed. The rotation of the glass sheet 12 is performed by the rotation of the platform supporting the glass sheet 12. The platform is rotated about a rotation axis that protrudes from the platform. The rotation of the glass plate 12 is particularly effective when the movement trajectory of the irradiation position of the laser light 20 on the glass plate 12 is curved. Further, in order to move the irradiation position of the laser beam 20 on the glass plate 12, the galvanometer mirror that reflects the laser light from the light source toward the glass plate 12 may be rotated.

且說,若將玻璃以超過玻璃之緩冷點之溫度進行加熱,則因玻璃之黏性流動而導致熱應力緩和。再者,進行加熱之溫度較佳為緩冷點以下之儘可能高之溫度。即,作為加熱之溫度範圍,較佳為(玻璃之緩冷點-200℃)以上且玻璃之緩冷點以下,更佳為(玻璃之緩冷點-100℃)以上且玻璃之緩冷點以下。 In addition, if the glass is heated at a temperature exceeding the slow cooling point of the glass, the thermal stress is relieved due to the viscous flow of the glass. Further, the temperature at which heating is performed is preferably as high as possible below the slow cooling point. That is, the temperature range of heating is preferably (glass slow cooling point - 200 ° C) or more and the glass slow cooling point or less, more preferably (glass slow cooling point - 100 ° C) or more and the glass slow cooling point. the following.

本實施形態係以玻璃之緩冷點以下之溫度局部地加熱玻璃板12,故而產生熱應力。於雷射光20之照射位置上產生壓縮應力,且因其反作用,而於雷射光20之照射位置之後方附近產生拉伸應力。因產生之拉伸應力而將玻璃板12切開,形成裂紋31。裂紋31係於厚度方向上貫通玻璃板12。裂紋31係追隨雷射光20之照射位置,沿雷射光20之照射位置之移動軌跡而伸展。其移動軌跡可為直線狀亦可為曲線狀,亦可包含直線狀部分與曲線狀部分之兩部分。裂紋31亦可以初期裂紋30為起點而形成。此處,所謂「後方」係指與裂紋31之伸展方向相反之方向,且表示玻璃板12上之與雷射光20之照射位置之移動方向相反之方向。 In the present embodiment, the glass sheet 12 is locally heated at a temperature lower than the slow cooling point of the glass, so that thermal stress is generated. A compressive stress is generated at the irradiation position of the laser light 20, and due to the reaction, tensile stress is generated in the vicinity of the irradiation position of the laser light 20. The glass plate 12 is cut by the tensile stress generated to form a crack 31. The crack 31 penetrates the glass sheet 12 in the thickness direction. The crack 31 follows the irradiation position of the laser light 20 and extends along the movement locus of the irradiation position of the laser light 20. The moving track may be linear or curved, and may also include two parts of a linear portion and a curved portion. The crack 31 can also be formed by starting the initial crack 30. Here, the term "rear" means a direction opposite to the direction in which the crack 31 extends, and indicates a direction opposite to the moving direction of the irradiation position of the laser light 20 on the glass plate 12.

又,一般而言,若玻璃部分地熔化,則於已熔化之部分冷卻而 凝固時,即將產生熱收縮。此時,已熔化之部分之熱收縮受到其周邊部分阻礙,從而無規地形成微裂紋。 Moreover, in general, if the glass is partially melted, it is cooled in the melted portion. When solidified, heat shrinkage is about to occur. At this time, the heat shrinkage of the melted portion is hindered by the peripheral portion thereof, thereby randomly forming microcracks.

本實施形態係以玻璃之緩冷點以下之溫度局部地加熱玻璃板12,故而玻璃不會熔融。因此,獲得光滑之玻璃切斷面,且獲得強度較高之玻璃切斷面。 In the present embodiment, the glass sheet 12 is locally heated at a temperature lower than the slow cooling point of the glass, so that the glass does not melt. Therefore, a smooth glass cut surface is obtained, and a glass cut surface having a high strength is obtained.

雷射光20係自光源出射之後,由聚光透鏡等聚光後,入射至玻璃板12之雷射照射面12a。雷射光20可垂直地入射至玻璃板12之雷射照射面12a,亦可傾斜地入射。 The laser light 20 is emitted from the light source, and is collected by a collecting lens or the like, and then incident on the laser irradiation surface 12a of the glass plate 12. The laser light 20 can be incident perpendicularly to the laser irradiation surface 12a of the glass plate 12, and can also be incident obliquely.

作為雷射光20之光源,可使用例如CO2雷射(波長10600nm)、中紅外光參數振盪器(波長2600nm~3450nm)、摻鉺釔鋁石榴石(Er:YAG,Erbium:Yttrium Aluminum Garnet)雷射(波長2940nm)、摻鈥釔鋁石榴石雷射(Ho:YAG,holmium:Yttrium Aluminum Garnet)(波長2080nm)、鐿(Yb)光纖雷射(波長1000nm~1100nm)、鐿(Yb)碟型雷射(波長1000nm~1100nm)、摻釹釔鋁石榴石雷射雷射(Nb:YAG,neodymium:Yttrium Aluminum Garnet)(波長1064nm)、高輸出半導體雷射(波長808nm~980nm)綠光雷射(波長532nm)、紫外線(UV,Ultraviolet)雷射(波長355nm)等。 As the light source of the laser light 20, for example, a CO 2 laser (wavelength 10600 nm), a mid-infrared optical parametric oscillator (wavelength 2600 nm to 3450 nm), and an Erbium-doped garnet (Er: YAG, Erbium: Yttrium Aluminum Garnet) can be used. Shot (wavelength 2940nm), yttrium aluminum garnet laser (Ho: YAG, holmium: Yttrium Aluminum Garnet) (wavelength 2080nm), ytterbium (Yb) fiber laser (wavelength 1000nm~1100nm), ytterbium (Yb) disc type Laser (wavelength 1000nm~1100nm), erbium-doped yttrium aluminum garnet (Nb: YAG, neodymium: Yttrium Aluminum Garnet) (wavelength 1064nm), high output semiconductor laser (wavelength 808nm~980nm) green laser (wavelength 532 nm), ultraviolet (UV (Ultraviolet) laser (wavelength 355 nm), and the like.

雷射光20之光源亦可為使雷射光連續振盪之CW(Continue Wave,連續波)雷射、使雷射光斷續振盪之脈衝雷射之任一者。 The light source of the laser light 20 may be any one of a CW (Continue Wave) laser that continuously oscillates the laser light and a pulsed laser that intermittently oscillates the laser light.

玻璃板12之雷射照射面12a上之雷射光20之形狀(光點形狀)係相應於雷射光20之光源種類等而適當設定。其原因在於,玻璃板12之光吸收率因雷射光20之波長而改變。例如,於光源為CO2雷射之情形時,雷射光20之波長較長,雷射光20之大部分於玻璃板12之雷射照射面12a附近作為熱被吸收。因此,於光源為CO2雷射之情形時,玻璃板12之雷射照射面12a上之雷射光20之形狀可為於雷射光20之照射位置之移動方向上較為細長之形狀。於雷射光20之照射位置移動時,可 長時間地加熱玻璃板12之切斷位置,從而可確保自玻璃板12之雷射照射面12a向內部傳遞熱之時間。由於玻璃板12之內部受到加熱,故而可形成於厚度方向上貫通玻璃板12之裂紋31。 The shape (spot shape) of the laser light 20 on the laser irradiation surface 12a of the glass plate 12 is appropriately set in accordance with the type of the light source of the laser light 20 or the like. The reason for this is that the light absorption rate of the glass plate 12 changes due to the wavelength of the laser light 20. For example, when the light source is a CO 2 laser, the wavelength of the laser light 20 is long, and most of the laser light 20 is absorbed as heat near the laser irradiation surface 12a of the glass plate 12. Therefore, when the light source is a CO 2 laser, the shape of the laser light 20 on the laser irradiation surface 12a of the glass plate 12 may be a shape that is relatively elongated in the moving direction of the irradiation position of the laser light 20. When the irradiation position of the laser beam 20 is moved, the cutting position of the glass sheet 12 can be heated for a long period of time, and the time for transferring heat from the laser irradiation surface 12a of the glass sheet 12 to the inside can be ensured. Since the inside of the glass plate 12 is heated, the crack 31 which penetrates the glass plate 12 in the thickness direction can be formed.

於玻璃板12之厚度為200μm以下之情形時,自玻璃板12之雷射照射面12a向內部傳遞熱之時間較短,故而玻璃板12之雷射照射面12a上之雷射光20之形狀例如亦可為圓形或矩形。於圓形之情形時,當雷射光20之照射位置之移動軌跡包含曲線狀部分時,移動軌跡之曲線狀部分之寬度成為固定,從而裂紋31難以自移動軌跡偏離。於橢圓形或矩形之情形時,為使移動軌跡之曲線狀部分之寬度固定,而一面使雷射光20之照射位置移動,一面使雷射光20圍繞光軸轉動即可。例如使雷射光20之光源圍繞光軸轉動即可。 When the thickness of the glass plate 12 is 200 μm or less, the time for transferring heat from the laser irradiation surface 12a of the glass plate 12 to the inside is short, and thus the shape of the laser light 20 on the laser irradiation surface 12a of the glass plate 12 is, for example, It can also be round or rectangular. In the case of a circle, when the movement locus of the irradiation position of the laser light 20 includes a curved portion, the width of the curved portion of the movement locus becomes fixed, so that the crack 31 is difficult to deviate from the movement locus. In the case of an ellipse or a rectangle, in order to fix the width of the curved portion of the movement trajectory while moving the irradiation position of the laser light 20, the laser light 20 may be rotated around the optical axis. For example, the light source of the laser light 20 can be rotated about the optical axis.

玻璃板12之雷射照射面12a上之雷射光20之移動方向長度L(參照圖3)並無特別限定,但例如為0.1mm~60mm,較佳為1mm~30mm。又,玻璃板12之雷射照射面12a上之雷射光20之移動正交方向長度W(參照圖3)並無特別限定,但例如為0.01mm~10mm,較佳為0.1mm~5mm。 The moving direction length L (see FIG. 3) of the laser light 20 on the laser irradiation surface 12a of the glass plate 12 is not particularly limited, but is, for example, 0.1 mm to 60 mm, preferably 1 mm to 30 mm. Further, the length W (see FIG. 3) of the movement orthogonal direction of the laser light 20 on the laser irradiation surface 12a of the glass plate 12 is not particularly limited, but is, for example, 0.01 mm to 10 mm, preferably 0.1 mm to 5 mm.

第2步驟係如圖2所示,可利用冷媒40局部地冷卻玻璃板12,使玻璃板12上之冷媒40之供給位置與玻璃板12上之雷射光20之照射位置連動地移動。冷媒40之供給位置可為雷射光20之照射位置之後方附近。於雷射光20之照射位置之後方產生急遽之溫度梯度,使得雷射光20之照射位置與裂紋31之前端位置之距離變短。 In the second step, as shown in FIG. 2, the glass plate 12 can be partially cooled by the refrigerant 40, and the supply position of the refrigerant 40 on the glass plate 12 can be moved in conjunction with the irradiation position of the laser light 20 on the glass plate 12. The supply position of the refrigerant 40 may be near the rear of the irradiation position of the laser light 20. An irritating temperature gradient is generated after the irradiation position of the laser light 20, so that the distance between the irradiation position of the laser light 20 and the position of the front end of the crack 31 becomes short.

冷媒40可為氣體(例如室溫之壓縮空氣)、液體(例如室溫之水)之任一者,亦可包含兩者。 The refrigerant 40 may be either a gas (for example, compressed air at room temperature) or a liquid (for example, water at room temperature), or both.

噴嘴50係例如圖2所示形成為筒狀,朝向玻璃板12噴出冷媒40。 The nozzle 50 is formed in a tubular shape as shown in FIG. 2, for example, and discharges the refrigerant 40 toward the glass plate 12.

為使玻璃板12上之冷媒40之供給位置移動,而玻璃板12可進行移動,噴嘴50亦可移動,亦可兩者移動。 In order to move the supply position of the refrigerant 40 on the glass plate 12, the glass plate 12 can be moved, and the nozzle 50 can be moved or both can be moved.

本實施形態之第2步驟係如圖2所示,於玻璃板12形成裂紋31時,不切斷樹脂膜14。因此,樹脂膜14跨過裂紋31,將隔著裂紋31之兩側之玻璃121、122連結。由於隔著裂紋31之兩側之玻璃121、122由樹脂膜14連結,故而於裂紋31之形成時,可抑制玻璃之變形,且裂紋31之位置難以自所需之位置偏離。因此,玻璃板12之切斷精度變得良好。該效果於遍及玻璃板12之切斷位置(亦即,玻璃板12上之雷射光20之照射位置之移動軌跡)整體地形成樹脂膜14之情形時較為顯著。 In the second step of the present embodiment, as shown in FIG. 2, when the crack 31 is formed in the glass sheet 12, the resin film 14 is not cut. Therefore, the resin film 14 bridges the cracks 31 and connects the glass 121 and 122 on both sides of the crack 31. Since the glass 121 and 122 on both sides of the crack 31 are connected by the resin film 14, when the crack 31 is formed, deformation of the glass can be suppressed, and the position of the crack 31 is hard to deviate from the desired position. Therefore, the cutting accuracy of the glass plate 12 becomes good. This effect is remarkable when the resin film 14 is integrally formed over the cutting position of the glass sheet 12 (that is, the movement locus of the irradiation position of the laser light 20 on the glass plate 12).

第2步驟係如圖2所示,亦可對玻璃板12自樹脂膜14側之相反側照射雷射光20。雷射光20於穿透玻璃板12之期間,將相應於玻璃板12之光吸收率而衰減,其後,入射至樹脂膜14。因此,入射至樹脂膜14之雷射光20之強度較低,樹脂膜14難以軟化、熔融。若樹脂膜14之一部分熔融,則熔融之部分因表面張力而撕裂。 In the second step, as shown in FIG. 2, the laser light 20 may be irradiated to the opposite side of the glass plate 12 from the resin film 14 side. The laser light 20 is attenuated corresponding to the light absorptivity of the glass plate 12 during the penetration of the glass plate 12, and thereafter, is incident on the resin film 14. Therefore, the intensity of the laser light 20 incident on the resin film 14 is low, and the resin film 14 is hard to soften and melt. If one of the resin films 14 is partially melted, the molten portion is torn due to surface tension.

第2步驟係如圖2所示,亦可藉由使玻璃板12上之雷射光20之照射位置移動,而沿移動軌跡於樹脂膜14形成線狀之熱劣化部143。此處,所謂「熱劣化」係指因熱而產生碳化、發泡等,以雷射照射前之樹脂膜14之拉伸強度(MPa)為基準,雷射照射後之樹脂膜14之拉伸強度降低0.01%以上。於拉伸強度試驗中,將與線狀之熱劣化部143正交之方向之拉伸應力施加至樹脂膜14。 In the second step, as shown in FIG. 2, the linear heat-degraded portion 143 is formed on the resin film 14 along the movement path by moving the irradiation position of the laser light 20 on the glass plate 12. Here, "thermal deterioration" means carbonization, foaming, or the like due to heat, and the tensile strength (MPa) of the resin film 14 before laser irradiation is used as a reference, and the stretching of the resin film 14 after laser irradiation is performed. The strength is reduced by 0.01% or more. In the tensile strength test, a tensile stress in a direction orthogonal to the linear heat-degraded portion 143 is applied to the resin film 14.

由於線狀之熱劣化部143形成於樹脂膜14,故而,樹脂膜14容易以熱劣化部143為中心彎折。雷射照射後之樹脂膜14之拉伸強度較佳為以雷射照射前之樹脂膜14之拉伸強度為基準降低0.1%以上,更佳為降低1%以上。 Since the linear heat-degraded portion 143 is formed on the resin film 14, the resin film 14 is easily bent around the heat-degraded portion 143. The tensile strength of the resin film 14 after the laser irradiation is preferably 0.1% or more, more preferably 1% or more, based on the tensile strength of the resin film 14 before the laser irradiation.

熱劣化部143係形成於樹脂膜14之與玻璃板12接觸之面14a上(參照圖5)。熱劣化部143可如圖5所示於厚度方向上不貫通或貫通樹脂膜14。再者,於熱劣化部143,亦可形成與玻璃板12之裂紋31相接之槽線(劃線)。 The thermally deteriorated portion 143 is formed on the surface 14a of the resin film 14 that is in contact with the glass sheet 12 (see FIG. 5). The thermally deteriorated portion 143 may not penetrate or penetrate the resin film 14 in the thickness direction as shown in FIG. 5 . Further, in the thermally deteriorated portion 143, a groove line (scribe line) that is in contact with the crack 31 of the glass sheet 12 may be formed.

且說,於使玻璃板12上之雷射光20之照射位置移動時,於移動軌跡之終端部即玻璃板12之端部,如圖4所示,難以形成於厚度方向上貫通玻璃板12之裂紋31。其原因在於,裂紋31基本而言將因產生於雷射光20之照射位置之後方之拉伸應力而伸展。再者,可認為該拉伸應力係藉由(i)由雷射光照射而產生之壓縮應力之反作用下之拉伸應力;(ii)由雷射光之加熱而產生之樹脂之熱膨脹引起之拉伸應力;及較佳為(iii)由冷媒之供給引起之拉伸應力相互作用而產生。又,可認為藉由該相互作用而使切斷精度變高。 In addition, when the irradiation position of the laser light 20 on the glass plate 12 is moved, it is difficult to form a crack penetrating the glass plate 12 in the thickness direction as shown in FIG. 4 at the end portion of the glass plate 12 which is the end portion of the movement track. 31. The reason for this is that the crack 31 is basically stretched due to the tensile stress generated after the irradiation position of the laser light 20. Furthermore, the tensile stress is considered to be tensile stress caused by (i) the reaction of the compressive stress generated by the irradiation of the laser light; (ii) the stretching caused by the thermal expansion of the resin generated by the heating of the laser light. The stress; and preferably (iii) is produced by the interaction of tensile stress caused by the supply of the refrigerant. Further, it is considered that the cutting accuracy is increased by the interaction.

若裂紋31之前端靠近玻璃板12之端部,則因微小之外力而使裂紋31伸展,將玻璃板12斷裂。因此,於雷射光20之照射後,自支持台拆卸複合板10時,若複合板10略微撓曲,則因其應力而將玻璃板12之端部切斷。 When the front end of the crack 31 is close to the end of the glass sheet 12, the crack 31 is stretched by a small external force, and the glass sheet 12 is broken. Therefore, when the composite panel 10 is detached from the support table after the irradiation of the laser light 20, if the composite panel 10 is slightly deflected, the end portion of the glass sheet 12 is cut by the stress.

於複合板10略微撓曲時,本實施形態如圖6所示,樹脂膜14以線狀之熱劣化部143為中心彎折,從而玻璃板12之端部相應於樹脂膜14之變形而彎折。線狀之熱劣化部143係沿雷射光20之照射位置之移動軌跡而形成,故而,玻璃板12之端部以該移動軌跡為中心而彎折。因此,可將玻璃板12之端部沿雷射光20之移動軌跡切斷,從而可進行切斷位置之控制。該效果在與玻璃板12之切斷結束位置對應之樹脂膜14之端部形成有熱劣化部143之情形時較為顯著。 When the composite sheet 10 is slightly deflected, as shown in FIG. 6, the resin film 14 is bent around the linear heat-degraded portion 143, and the end portion of the glass sheet 12 is bent corresponding to the deformation of the resin film 14. fold. Since the linear heat deterioration portion 143 is formed along the movement locus of the irradiation position of the laser light 20, the end portion of the glass plate 12 is bent around the movement locus. Therefore, the end portion of the glass plate 12 can be cut along the movement locus of the laser light 20, so that the control of the cutting position can be performed. This effect is remarkable when the heat-degraded portion 143 is formed at the end portion of the resin film 14 corresponding to the cutting end position of the glass sheet 12.

熱劣化部143較理想為形成於樹脂膜14之端(雷射照射開始點)至端(雷射照射結束點)。樹脂膜14容易以熱劣化部143為中心而彎折。 The heat-degraded portion 143 is preferably formed at the end of the resin film 14 (the laser irradiation start point) to the end (the laser irradiation end point). The resin film 14 is easily bent around the thermally deteriorated portion 143.

再者,本實施形態中,將雷射光20之照射位置之移動軌跡之終端部即玻璃板12之端部切斷之步驟係於雷射光20之照射後,在自支持台拆卸複合板10時進行,但亦可於自支持台拆卸複合板10之後進行。 Further, in the present embodiment, the step of cutting the end portion of the glass sheet 12 which is the end portion of the movement locus of the irradiation position of the laser light 20 is performed after the irradiation of the laser beam 20, and the composite board 10 is detached from the support table. This can be done, but it can also be performed after the composite panel 10 is removed from the support table.

第3步驟係如圖8所示切斷樹脂膜14,獲得複數個樹脂膜141、142。藉此,獲得複數個切斷片111、112。一切斷片111係包含玻璃板 121、及與玻璃板121結合之樹脂膜141。又,另一切斷片112係包含玻璃板122、及與玻璃板122結合之樹脂膜142。 In the third step, the resin film 14 is cut as shown in Fig. 8, and a plurality of resin films 141 and 142 are obtained. Thereby, a plurality of cut pieces 111 and 112 are obtained. A cut piece 111 includes a glass plate 121, and a resin film 141 combined with the glass plate 121. Further, the other cut piece 112 includes a glass plate 122 and a resin film 142 bonded to the glass plate 122.

本實施形態係如圖4~圖7所示,沿玻璃板12上之雷射光20之照射位置之移動軌跡,於樹脂膜14形成有線狀之熱劣化部143。因此,如圖8所示,可藉由以線狀之熱劣化部143為中心彎折樹脂膜14,而沿熱劣化部143切斷(割斷)樹脂膜14。於以線狀之熱劣化部143為中心使樹脂膜14彎折時,較佳為以避免玻璃切斷面彼此刮擦之方式,彎折樹脂膜14。 In the present embodiment, as shown in FIGS. 4 to 7, a linear heat-degraded portion 143 is formed in the resin film 14 along the movement locus of the irradiation position of the laser light 20 on the glass plate 12. Therefore, as shown in FIG. 8, the resin film 14 can be bent (cut) along the thermally deteriorated portion 143 by bending the resin film 14 around the linear heat-degraded portion 143. When the resin film 14 is bent around the linear heat-degraded portion 143, it is preferable to bend the resin film 14 so as not to scratch the glass cut surfaces.

線狀之熱劣化部143係沿雷射光20之照射位置之移動軌跡而形成。因此,如圖9所示,藉由切斷而獲得之玻璃板121之切斷面與藉由切斷而獲得之樹脂膜141之切斷面齊平。同樣地,藉由切斷而獲得之玻璃板122之切斷面與藉由切斷而獲得之樹脂膜142之切斷面齊平。與樹脂膜之切斷面相較玻璃板之切斷面凹陷之情形相比,玻璃板121、122不易劃傷,從而容易保管切斷片111、112。 The linear heat deterioration portion 143 is formed along the movement locus of the irradiation position of the laser light 20. Therefore, as shown in FIG. 9, the cut surface of the glass plate 121 obtained by cutting is flush with the cut surface of the resin film 141 obtained by cutting. Similarly, the cut surface of the glass plate 122 obtained by cutting is flush with the cut surface of the resin film 142 obtained by cutting. The glass plates 121 and 122 are less likely to be scratched than the cut surface of the resin film as compared with the case where the cut surface of the resin film is recessed, and the cut pieces 111 and 112 are easily stored.

再者,本實施形態之第3步驟係藉由彎折樹脂膜14而將樹脂膜14切斷,但樹脂膜14之切斷方法並無特別限定。例如,作為樹脂膜之切斷面與玻璃板之切斷面成齊平之樹脂膜之切斷方法,亦可使用沿線狀之熱劣化部撕裂樹脂膜之方法、利用切割器沿線狀之熱劣化部將樹脂膜切裂之方法。又,雖樹脂膜之切斷面相較玻璃板之切斷面若干地凹陷,但作為樹脂膜14之切斷方法,亦可使用以雷射使樹脂膜局部地氣化之方法。 In the third step of the present embodiment, the resin film 14 is cut by bending the resin film 14, but the method of cutting the resin film 14 is not particularly limited. For example, as a method of cutting the resin film in which the cut surface of the resin film is flush with the cut surface of the glass sheet, a method of tearing the resin film along the linear heat-degraded portion and using the heat of the cutter along the line may be used. A method of cutting a resin film by a deteriorated portion. Moreover, although the cut surface of the resin film is somewhat recessed compared to the cut surface of the glass plate, as a method of cutting the resin film 14, a method of partially vaporizing the resin film by laser may be used.

[第2實施形態] [Second Embodiment]

上述實施形態係關於包含玻璃板12及樹脂膜14之複合板10之切斷方法。 The above embodiment relates to a method of cutting the composite sheet 10 including the glass sheet 12 and the resin film 14.

另一方面,本實施形態係關於玻璃板12之切斷方法。玻璃板12之切斷方法可與複合板10之切斷方法同樣地可包含圖1~圖7之步驟, 該等步驟為相同步驟,故省略說明。 On the other hand, this embodiment relates to a method of cutting the glass sheet 12. The cutting method of the glass plate 12 can include the steps of FIGS. 1 to 7 in the same manner as the cutting method of the composite plate 10. These steps are the same steps, and the description is omitted.

圖10係本發明之第2實施形態之玻璃板之切斷方法之說明圖,且表示接著圖7之步驟所實施之步驟之圖。 Fig. 10 is an explanatory view showing a method of cutting a glass sheet according to a second embodiment of the present invention, and shows a step of performing the steps following the step of Fig. 7.

如圖10所示,玻璃板12之切斷方法包含將玻璃板12與樹脂膜14剝離之步驟。於將玻璃板12與樹脂膜14剝離之情形時,為避免剝離時玻璃板12破損,樹脂膜14之剝離強度例如為3N/25mm以下,較佳為1N/25mm以下。 As shown in FIG. 10, the cutting method of the glass plate 12 includes the step of peeling the glass plate 12 and the resin film 14. When the glass plate 12 and the resin film 14 are peeled off, in order to avoid damage of the glass plate 12 at the time of peeling, the peeling strength of the resin film 14 is, for example, 3 N/25 mm or less, preferably 1 N/25 mm or less.

玻璃板12與樹脂膜14之剝離方法並無特別限定,例如可包含以下步驟:將薄刀片插入至玻璃板12與樹脂膜14之界面而製作剝離起點;及一面將玻璃板12保持平坦,一面使樹脂膜14自剝離起點依序撓曲變形。於剝離時,可藉由平坦地保持玻璃板12而減少玻璃板12之破損。 The peeling method of the glass plate 12 and the resin film 14 is not specifically limited, For example, the following process may be performed, and the thin blade is inserted in the interface of the glass plate 12 and the resin film 14, and the peeling origin is prepared. The resin film 14 is sequentially flexed and deformed from the peeling starting point. At the time of peeling, the damage of the glass plate 12 can be reduced by holding the glass plate 12 flat.

於將玻璃板12與樹脂膜14剝離時,較佳為不切斷樹脂膜14。可以1次之作業進行複數個玻璃121、122與樹脂膜14之剝離。 When the glass plate 12 and the resin film 14 are peeled off, it is preferable not to cut the resin film 14. The peeling of the plurality of glasses 121 and 122 and the resin film 14 can be performed once.

再者,將玻璃板12與樹脂膜14之剝離之步驟既可於樹脂膜14之切斷後實施,例如亦可接著圖8之步驟實施。 Further, the step of peeling off the glass plate 12 and the resin film 14 may be performed after the resin film 14 is cut, and may be carried out, for example, in the step of FIG.

玻璃板之切斷方法亦可更包含於玻璃板12上形成樹脂膜14之步驟。 The method of cutting the glass sheet may further include the step of forming the resin film 14 on the glass sheet 12.

實施例 Example

於以下之實施例及比較例中,只要未特別記載,則使用150mm見方之玻璃板(厚度100μm,平均線膨脹係數38×10-7/℃,旭硝子公司製造無鹼玻璃,商品名:AN100)作為玻璃板。 In the following examples and comparative examples, a glass plate of 150 mm square (thickness: 100 μm, average linear expansion coefficient: 38 × 10 -7 / ° C, alkali-free glass manufactured by Asahi Glass Co., Ltd., trade name: AN100) was used unless otherwise specified. As a glass plate.

[實施例1] [Example 1]

實施例1係對玻璃板之形成樹脂膜之面進行表面處理之後,形成聚醯亞胺膜(150mm見方,厚度5μm)作為樹脂膜。玻璃板之表面處理係利用旋轉塗佈機塗佈胺基丙基三甲氧基矽烷而進行。聚醯亞胺膜係 藉由於玻璃板之表面處理面上利用旋轉塗佈機塗佈聚醯亞胺清漆(荒川化學公司製造,H851D),且以250℃進行30分鐘熱處理而形成。 In Example 1, after the surface of the glass sheet on which the resin film was formed was subjected to surface treatment, a polyimide film (150 mm square, thickness: 5 μm) was formed as a resin film. The surface treatment of the glass plate was carried out by coating a propyl propyl trimethoxy decane with a spin coater. Polyimine film system The surface of the glass plate was formed by coating a polyimide varnish (H851D manufactured by Arakawa Chemical Co., Ltd., H851D) with a spin coater, and heat-treating at 250 ° C for 30 minutes.

於實施例1中,以圖1~圖9所示之方法將製作之包含玻璃板及聚醯亞胺膜之複合板切斷。 In the first embodiment, the produced composite sheet including the glass plate and the polyimide film was cut by the method shown in Figs. 1 to 9 .

首先,切斷玻璃板。初期裂紋係以20mm間距於矩形玻璃板之4邊中之1邊上形成8條。將複合板以使聚醯亞胺膜朝下之方式載置於支持台。雷射光自CO2雷射(波長10600nm,輸出39W)局部地照射至玻璃板。雷射掃描速度設為130mm/sec。使玻璃板上之雷射光之照射位置自各初期裂紋之形成位置,與形成初期裂紋之一邊垂直地移動至與該一邊平行之另一邊為止。其之移動軌跡設為直線狀。又,將作為冷媒之霧狀液滴自噴嘴局部地供給至玻璃板。使冷媒之供給位置位於雷射光之照射位置之後方附近,且與雷射光之照射位置連動地移動。 First, the glass plate is cut. The initial cracks were formed on one of the four sides of the rectangular glass plate at a pitch of 20 mm. The composite panel was placed on a support table with the polyimide film facing downward. The laser light was locally irradiated to the glass plate from a CO 2 laser (wavelength 10600 nm, output 39 W). The laser scanning speed was set to 130 mm/sec. The irradiation position of the laser light on the glass plate is moved from the position where each of the initial cracks is formed to the other side of the initial crack to the other side parallel to the one side. The movement trajectory is set to be linear. Further, the mist droplets as a refrigerant are locally supplied from the nozzle to the glass sheet. The supply position of the refrigerant is placed in the vicinity of the irradiation position of the laser light, and is moved in conjunction with the irradiation position of the laser light.

其結果,以初期裂紋為起點,沿著雷射光之照射位置之移動軌跡,於玻璃板上形成有8條裂紋。各裂紋於板厚方向上貫通玻璃板,且未形成於雷射光之照射位置之移動軌跡之終端部。又,沿著雷射光之照射位置之移動軌跡之整體,於聚醯亞胺膜形成有直線狀之熱劣化部。聚醯亞胺膜係跨過裂紋,將隔著裂紋之兩側之玻璃連結。 As a result, eight cracks were formed on the glass plate along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass plate in the thickness direction, and is not formed at the end portion of the movement locus of the irradiation position of the laser light. Further, along the entire movement locus of the irradiation position of the laser light, a linear heat-degraded portion is formed on the polyimide film. The polyimide film crosses the crack and joins the glass on both sides of the crack.

其後,於自支持台拆卸複合板時,聚醯亞胺膜以直線狀之熱劣化部為中心略微彎折、變形。玻璃板之端部相應於該變形而彎折,從而將玻璃板之端部切斷。以此方式,切斷玻璃板。 Thereafter, when the composite sheet is detached from the support table, the polyimide film is slightly bent and deformed around the linear heat-degraded portion. The end of the glass sheet is bent corresponding to the deformation to cut the end of the glass sheet. In this way, the glass plate is cut.

繼而,以直線狀之熱劣化部為中心使聚醯亞胺膜彎折,沿著熱劣化部割斷聚醯亞胺膜。直線狀之熱劣化部係沿著玻璃板上之雷射光之照射位置之移動軌跡之整體而形成,故而,樹脂膜之切斷面與玻璃板之切斷面成為大致同一面。 Then, the polyimide film is bent around the linear heat-degraded portion, and the polyimide film is cut along the heat-degraded portion. The linear heat deterioration portion is formed along the entire movement locus of the irradiation position of the laser light on the glass plate. Therefore, the cut surface of the resin film and the cut surface of the glass plate are substantially flush with each other.

以此方式,切斷複合板。複合板之切斷精度係以玻璃板上之實際切斷位置與直線狀之目標切斷位置之間之偏離寬度(以下,稱為 「玻璃板上之切斷之偏離寬度」)進行評價。評價係分為雷射光之照射位置之移動軌跡中之終端部與除此以外之部分進行。 In this way, the composite panel is severed. The cutting precision of the composite panel is the deviation width between the actual cutting position on the glass plate and the linear target cutting position (hereinafter, referred to as The "offset width of the cut on the glass plate" was evaluated. The evaluation system is performed by dividing the end portion of the movement trajectory of the irradiation position of the laser light and other portions.

實施例1係於雷射光之照射位置之移動軌跡中之終端部與除此以外之部分之兩部分,玻璃板上之切斷之最大偏離寬度為0mm。 In the first embodiment, the end portion of the moving trajectory of the irradiation position of the laser light and the other portions are the maximum deviation width of the cutting on the glass plate of 0 mm.

[實施例2] [Embodiment 2]

實施例2係於聚醯亞胺薄膜(150mm見方,厚度38μm,荒川化學公司製造,商品名Pomiran)上附著聚醯亞胺聚矽氧黏著劑(厚度10μm,荒川化學公司製造,商品名H802),製成積層樹脂薄膜。將製成之積層樹脂薄膜之黏著劑側貼附於玻璃板上,製成複合板。 Example 2 was attached to a polyimide film (150 mm square, thickness 38 μm, manufactured by Arakawa Chemical Co., Ltd., trade name Pomiran) with a polyamidide polyoxyl adhesive (thickness 10 μm, manufactured by Arakawa Chemical Co., Ltd., trade name H802). , a laminated resin film is produced. The adhesive side of the produced laminated resin film was attached to a glass plate to prepare a composite sheet.

其次,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 Next, in the same manner as in the first embodiment, the glass plate was partially irradiated with the laser light, and the irradiation position of the laser light was moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部。又,沿雷射光之照射位置之移動軌跡之整體,於積層樹脂薄膜形成直線狀之熱劣化部。積層樹脂薄膜係跨過裂紋,將隔著裂紋之兩側之玻璃連結。 As a result, eight cracks were formed on the glass sheet along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass plate in the thickness direction and is not formed at the end portion of the movement locus of the irradiation position of the laser light. Further, the laminated resin film forms a linear heat-degraded portion along the entire movement trajectory of the irradiation position of the laser light. The laminated resin film crosses the crack and connects the glass on both sides of the crack.

其後,於自支持台拆卸複合板時,積層樹脂薄膜以直線狀之熱劣化部為中心而略微彎折、變形。玻璃板之端部相應於該變形而略微彎折,從而將玻璃板之端部切斷。以此方式,切斷玻璃板。 Then, when the composite sheet is detached from the support table, the laminated resin film is slightly bent and deformed around the linear heat-degraded portion. The end of the glass plate is slightly bent corresponding to the deformation, thereby cutting the end of the glass plate. In this way, the glass plate is cut.

繼而,以直線狀之熱劣化部為中心使積層樹脂薄膜彎折,且沿熱劣化部割斷積層樹脂薄膜。直線狀之熱劣化部係沿著玻璃板上之雷射光之照射位置之移動軌跡之整體形成,故而積層樹脂薄膜之切斷面與玻璃板之切斷面成為大致同一面。 Then, the laminated resin film is bent around the linear heat-degraded portion, and the laminated resin film is cut along the thermally deteriorated portion. The linear heat deterioration portion is formed along the entire movement locus of the irradiation position of the laser light on the glass plate. Therefore, the cut surface of the laminated resin film and the cut surface of the glass plate are substantially flush with each other.

以此方式,切斷複合板。於雷射光之照射位置之移動軌跡中之終端部與除此以外之部分之兩部分,玻璃板上之切斷之最大偏離寬度 為0mm。 In this way, the composite panel is severed. The maximum deviation width of the cut on the glass plate at the end portion of the moving track of the laser light irradiation position and the other portions It is 0mm.

[實施例3] [Example 3]

實施例3係準備包含作為基材之聚萘二甲酸乙二酯(PEN)薄膜(150mm見方,厚度50μm)、與丙烯酸黏著劑(厚度30μm)之積層樹脂薄膜(寺岡製作所製造,商品名635F)。將準備之積層樹脂薄膜之黏著劑側貼附於玻璃板上,製成複合板。 Example 3 is a laminated resin film (manufactured by Teraoka Seisakusho Co., Ltd., trade name 635F) containing a polyethylene naphthalate (PEN) film (150 mm square, thickness 50 μm) and an acrylic adhesive (thickness: 30 μm) as a substrate. . The adhesive side of the prepared laminated resin film was attached to a glass plate to prepare a composite sheet.

其次,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 Next, in the same manner as in the first embodiment, the glass plate was partially irradiated with the laser light, and the irradiation position of the laser light was moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部上。又,沿雷射光之照射位置之移動軌跡之整體,於積層樹脂薄膜形成直線狀之熱劣化部。積層樹脂薄膜係跨過裂紋,將隔著裂紋之兩側之玻璃連結。 As a result, eight cracks were formed on the glass sheet along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass sheet in the thickness direction and is not formed on the end portion of the movement locus of the irradiation position of the laser light. Further, the laminated resin film forms a linear heat-degraded portion along the entire movement trajectory of the irradiation position of the laser light. The laminated resin film crosses the crack and connects the glass on both sides of the crack.

其後,於自支持台拆卸複合板時,積層樹脂薄膜以直線狀之熱劣化部為中心而略微彎折、變形。玻璃板之端部相應於該變形而彎折,從而將玻璃板之端部切斷。以此方式,切斷玻璃板。 Then, when the composite sheet is detached from the support table, the laminated resin film is slightly bent and deformed around the linear heat-degraded portion. The end of the glass sheet is bent corresponding to the deformation to cut the end of the glass sheet. In this way, the glass plate is cut.

繼而,以直線狀之熱劣化部為中心,使積層樹脂薄膜彎折,且沿熱劣化部切斷(割斷)積層樹脂薄膜。直線狀之熱劣化部係沿玻璃板上之雷射光之照射位置之移動軌跡之整體而形成,故而積層樹脂薄膜之切斷面與玻璃板之切斷面成為大致同一面。 Then, the laminated resin film is bent around the linear heat-degraded portion, and the laminated resin film is cut (cut) along the thermally deteriorated portion. Since the linear heat-degraded portion is formed along the entire movement locus of the irradiation position of the laser light on the glass plate, the cut surface of the laminated resin film and the cut surface of the glass plate are substantially flush with each other.

以此方式,切斷複合板。於雷射光之照射位置之移動軌跡中之終端部與除此以外之部分之兩部分,玻璃板上之切斷之最大偏離寬度為0mm。 In this way, the composite panel is severed. The maximum deviation width of the cut on the glass plate is 0 mm at the end portion of the moving track of the laser light irradiation position and the other portions.

[實施例4] [Example 4]

實施例4係準備環狀聚烯烴(COP)薄膜(150mm見方,厚度50 μm,ZEON公司製造,商品名ZF14)。藉由電暈放電而將準備之COP薄膜進行活性化處理,加熱貼合至玻璃板上,製成複合板。 Example 4 is to prepare a cyclic polyolefin (COP) film (150 mm square, thickness 50) Mm, manufactured by ZEON, trade name ZF14). The prepared COP film was activated by corona discharge, and bonded to a glass plate by heating to obtain a composite sheet.

其次,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 Next, in the same manner as in the first embodiment, the glass plate was partially irradiated with the laser light, and the irradiation position of the laser light was moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部。又,沿雷射光之照射位置之移動軌跡之整體,於COP薄膜形成直線狀之熱劣化部。COP薄膜係跨過裂紋,將隔著裂紋之兩側之玻璃連結。 As a result, eight cracks were formed on the glass sheet along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass plate in the thickness direction and is not formed at the end portion of the movement locus of the irradiation position of the laser light. Further, along the entire movement locus of the irradiation position of the laser light, a linear heat-degraded portion is formed in the COP film. The COP film crosses the crack and joins the glass across the sides of the crack.

其後,於自支持台拆卸複合板時,COP薄膜以直線狀之熱劣化部為中心而略微彎折、變形。玻璃板之端部相應於該變形而彎折,從而將玻璃板之端部切斷。以此方式,切斷玻璃板。 Then, when the composite plate is detached from the support table, the COP film is slightly bent and deformed around the linear heat-degraded portion. The end of the glass sheet is bent corresponding to the deformation to cut the end of the glass sheet. In this way, the glass plate is cut.

繼而,以直線狀之熱劣化部為中心,使COP薄膜彎折,沿熱劣化部切斷(割斷)COP薄膜。直線狀之熱劣化部係沿玻璃板上之雷射光之照射位置之移動軌跡之整體而形成,故而COP薄膜之切斷面與玻璃板之切斷面成為大致同一面。 Then, the COP film is bent around the linear heat-degraded portion, and the COP film is cut (cut) along the thermally deteriorated portion. Since the linear heat deterioration portion is formed along the entire movement locus of the irradiation position of the laser light on the glass plate, the cut surface of the COP film and the cut surface of the glass plate are substantially flush with each other.

以此方式,切斷複合板。於雷射光之照射位置之移動軌跡中之終端部與除此以外之部分之兩部分,玻璃板上之切斷之最大偏離寬度為0mm。 In this way, the composite panel is severed. The maximum deviation width of the cut on the glass plate is 0 mm at the end portion of the moving track of the laser light irradiation position and the other portions.

[實施例5] [Example 5]

實施例5係準備包含作為基材之聚對苯二甲酸乙二酯(PET)薄膜(厚度125μm)與丙烯酸黏著劑(厚度16μm)之積層樹脂薄膜(150mm見方,SOMAR公司製造,商品名Somatac PS-250WA)。將所準備之積層樹脂薄膜之黏著劑側貼附於玻璃板,製成複合板。 Example 5 was prepared by laminating a resin film comprising a polyethylene terephthalate (PET) film (thickness: 125 μm) as a substrate and an acrylic adhesive (thickness: 16 μm) (150 mm square, manufactured by SOMAR, trade name Somatac PS) -250WA). The adhesive side of the prepared laminated resin film was attached to a glass plate to prepare a composite sheet.

其次,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該 雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 Next, in the same manner as in the first embodiment, the glass plate is partially irradiated with laser light, and the laser light is applied thereto. The position of the laser light is moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部。又,沿雷射光之照射位置之移動軌跡之整體,於積層樹脂薄膜形成直線狀之熱劣化部。積層樹脂薄膜係跨過裂紋,將隔著裂紋之兩側之玻璃連結。 As a result, eight cracks were formed on the glass sheet along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass plate in the thickness direction and is not formed at the end portion of the movement locus of the irradiation position of the laser light. Further, the laminated resin film forms a linear heat-degraded portion along the entire movement trajectory of the irradiation position of the laser light. The laminated resin film crosses the crack and connects the glass on both sides of the crack.

其後,於自支持台拆卸複合板時,積層樹脂薄膜以直線狀之熱劣化部為中心而略微彎折、變形。玻璃板之端部相應於該變形而彎折,從而將玻璃板之端部切斷。以此方式,切斷玻璃板。 Then, when the composite sheet is detached from the support table, the laminated resin film is slightly bent and deformed around the linear heat-degraded portion. The end of the glass sheet is bent corresponding to the deformation to cut the end of the glass sheet. In this way, the glass plate is cut.

繼而,將薄刀片插入至玻璃板與積層樹脂薄膜之界面,製成剝離起點,一面將玻璃板12保持平坦,一面使積層樹脂薄膜自剝離起點依序撓曲變形,將複數個玻璃單板短條一次性剝離。剝離強度為0.11N/25mm。 Then, a thin blade is inserted into the interface between the glass plate and the laminated resin film to form a peeling starting point, and while the glass plate 12 is kept flat, the laminated resin film is sequentially flexed and deformed from the peeling starting point, and a plurality of glass veneers are short. Strip stripped at one time. The peel strength was 0.11 N/25 mm.

以此方式,切斷玻璃板。於雷射光之照射位置之移動軌跡中之終端部與除此以外之部分之兩部分,玻璃板上之切斷之最大偏離寬度為0mm。 In this way, the glass plate is cut. The maximum deviation width of the cut on the glass plate is 0 mm at the end portion of the moving track of the laser light irradiation position and the other portions.

[實施例6] [Embodiment 6]

實施例6係準備包含作為基材之聚醯亞胺薄膜(厚度為25μm)與丙烯酸黏著劑(厚度為22μm)之積層樹脂薄膜(150mm見方,3M公司製造,商品號7414)。將所準備之積層樹脂薄膜之黏著劑側貼附於玻璃板上,製成複合板。 In Example 6, a laminated resin film (150 mm square, manufactured by 3M Company, trade name No. 7414) containing a polyimide film (thickness: 25 μm) as a substrate and an acrylic adhesive (thickness: 22 μm) was prepared. The adhesive side of the prepared laminated resin film was attached to a glass plate to prepare a composite sheet.

其次,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 Next, in the same manner as in the first embodiment, the glass plate was partially irradiated with the laser light, and the irradiation position of the laser light was moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌 跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部。又,沿雷射光之照射位置之移動軌跡之整體,於積層樹脂薄膜形成直線狀之熱劣化部。積層樹脂薄膜係跨過裂紋,將隔著裂紋之兩側之玻璃連結其後,於自支持台拆卸複合板時,積層樹脂薄膜以直線狀之熱劣化部為中心而略微彎折、變形。玻璃板之端部相應於該變形而彎折,從而將玻璃板之端部切斷。以此方式,切斷玻璃板。 As a result, the moving rail along the irradiation position of the laser light is taken as the starting point of the initial crack. Traces form 8 cracks on the glass sheet. Each of the cracks penetrates the glass plate in the thickness direction and is not formed at the end portion of the movement locus of the irradiation position of the laser light. Further, the laminated resin film forms a linear heat-degraded portion along the entire movement trajectory of the irradiation position of the laser light. In the laminated resin film, the laminated resin film is slightly bent and deformed around the linear heat-degraded portion when the composite plate is detached from the support table. The end of the glass sheet is bent corresponding to the deformation to cut the end of the glass sheet. In this way, the glass plate is cut.

繼而,將薄刀片插入至玻璃板與積層樹脂薄膜之界面,製成剝離起點,一面將玻璃板保持平坦,一面使積層樹脂薄膜自剝離起點依序撓曲變形,將複數個玻璃單板短條一次性剝離。剝離強度為0.69N/25mm。 Then, a thin blade is inserted into the interface between the glass plate and the laminated resin film to form a peeling starting point, while the glass plate is kept flat, and the laminated resin film is sequentially flexed and deformed from the peeling starting point, and a plurality of glass veneers are short. Disposable at one time. The peel strength was 0.69 N/25 mm.

以此方式,切斷玻璃板。於雷射光之照射位置之移動軌跡中之終端部與除此以外之部分之兩部分,玻璃板上之切斷之最大偏離寬度為0mm。 In this way, the glass plate is cut. The maximum deviation width of the cut on the glass plate is 0 mm at the end portion of the moving track of the laser light irradiation position and the other portions.

[比較例1] [Comparative Example 1]

比較例1係進行未附著樹脂膜之150mm見方之玻璃板之切斷。具體而言,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 In Comparative Example 1, the cutting of a 150 mm square glass plate to which a resin film was not attached was performed. Specifically, in the same manner as in the first embodiment, the glass plate is partially irradiated with the laser light, and the irradiation position of the laser light is moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部。 As a result, eight cracks were formed on the glass sheet along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass plate in the thickness direction and is not formed at the end portion of the movement locus of the irradiation position of the laser light.

其後,於自支持台拆卸玻璃板時,玻璃板撓曲,且因其之應力,裂紋在未預期之方向上伸展。 Thereafter, when the glass plate is removed from the support table, the glass plate is deflected, and due to the stress thereof, the crack extends in an unexpected direction.

比較例1係於玻璃板上之雷射光之照射位置之移動軌跡中之終端部,切斷之最大偏離寬度為1mm~3mm。又,於玻璃板上之雷射光 之照射位置之移動軌跡中之終端部以外之部分,切斷之最大偏離寬度為1mm左右。 In Comparative Example 1, the end portion of the moving trajectory of the irradiation position of the laser light on the glass plate was cut to have a maximum deviation width of 1 mm to 3 mm. Also, the laser light on the glass plate In the portion other than the end portion of the movement locus of the irradiation position, the maximum deviation width of the cutting is about 1 mm.

[比較例2] [Comparative Example 2]

比較例2係將聚醯亞胺膜之膜厚設為0.5μm,除此之外,與實施例1同樣地製成複合板。 In Comparative Example 2, a composite sheet was produced in the same manner as in Example 1 except that the film thickness of the polyimide film was 0.5 μm.

其次,與實施例1同樣地,對玻璃板局部地照射雷射光,且使該雷射光之照射位置移動。又,與實施例1同樣地,對玻璃板局部地供給冷媒,且使該冷媒之供給位置移動。 Next, in the same manner as in the first embodiment, the glass plate was partially irradiated with the laser light, and the irradiation position of the laser light was moved. Further, in the same manner as in the first embodiment, the refrigerant is partially supplied to the glass sheet, and the supply position of the refrigerant is moved.

其結果,以初期裂紋為起點,沿雷射光之照射位置之移動軌跡,於玻璃板形成8條裂紋。各裂紋係於板厚方向上貫通玻璃板,且並未形成於雷射光之照射位置之移動軌跡之終端部。另一方面,將聚醯亞胺膜沿雷射光之照射位置之移動軌跡之整體進行切斷。 As a result, eight cracks were formed on the glass sheet along the movement trajectory of the irradiation position of the laser light with the initial crack as a starting point. Each of the cracks penetrates the glass plate in the thickness direction and is not formed at the end portion of the movement locus of the irradiation position of the laser light. On the other hand, the polyimide film is cut along the entire movement locus of the irradiation position of the laser light.

其後,於自支持台拆卸複合板時,玻璃板撓曲,且因其之應力,裂紋在未預期之方向上伸展。以此方式,切斷複合板。 Thereafter, when the composite panel is removed from the support table, the glass sheet is deflected and the crack is stretched in an unexpected direction due to the stress. In this way, the composite panel is severed.

於玻璃板上之雷射光之照射位置之移動軌跡中之終端部,切斷之最大偏離寬度為1mm~3mm。又,於玻璃板上之雷射光之照射位置之移動軌跡中之終端部以外之部分,切斷之最大偏離寬度為1mm左右。 The maximum deviation width of the end portion of the moving track in the irradiation position of the laser light on the glass plate is 1 mm to 3 mm. Further, the maximum deviation width of the portion other than the end portion in the movement locus of the irradiation position of the laser light on the glass plate is about 1 mm.

[總結] [to sum up]

將實施例1~3、及比較例1~2之結果總結於表1~表3中。 The results of Examples 1 to 3 and Comparative Examples 1 and 2 are summarized in Tables 1 to 3.

根據表1~表3而明確以下情況。於進行用以切斷玻璃板之雷射掃描時,玻璃板上附著有樹脂膜且所附著之樹脂膜未切斷之實施例1~5係與比較例1~2相比,玻璃板之切斷精度良好。又,藉由移動玻璃板上之雷射光之照射位置而沿移動軌跡於樹脂膜形成線狀之熱劣化部之實施例1~5係與比較例1~2相比,雷射光之照射位置之移動軌跡之終端部即玻璃板之端部之切斷精度良好。 The following cases are clarified according to Tables 1 to 3. When performing a laser scanning for cutting a glass plate, the resin films adhered to the glass plate and the resin film adhered thereto were not cut. Examples 1 to 5 were compared with Comparative Examples 1 and 2, and the glass plate was cut. Good break accuracy. Further, in Examples 1 to 5 in which linear heat-degraded portions were formed on the resin film by moving the irradiation position of the laser light on the glass plate, the irradiation positions of the laser light were compared with those of Comparative Examples 1 and 2. The end portion of the moving track, that is, the end portion of the glass plate, has good cutting precision.

以上,透過實施形態等說明了複合板之切斷方法、及玻璃板之切斷方法,但本發明並不限定於上述實施形態等,於申請專利範圍記載之範圍內,可進行各種變形及改良。 In the above, the method of cutting the composite sheet and the method of cutting the glass sheet have been described in the embodiment, but the present invention is not limited to the above-described embodiment and the like, and various modifications and improvements can be made within the scope of the patent application. .

本申請案係主張基於2012年8月21日於日本專利廳提出申請之日本專利特願2012-182656號之優先權者,且將日本專利特願2012-182656號之全部內容引用至本申請案中。 The present application claims the priority of Japanese Patent Application No. 2012-182656, the entire disclosure of which is hereby incorporated by in.

10‧‧‧複合板 10‧‧‧Composite board

12‧‧‧玻璃板 12‧‧‧ glass plate

12a‧‧‧雷射照射面 12a‧‧‧Laser illuminated surface

14‧‧‧樹脂膜 14‧‧‧ resin film

20‧‧‧雷射光 20‧‧‧Laser light

30‧‧‧初期裂紋 30‧‧‧ initial crack

31‧‧‧裂紋 31‧‧‧ crack

40‧‧‧冷媒 40‧‧‧Refrigerant

50‧‧‧噴嘴 50‧‧‧ nozzle

121、122‧‧‧玻璃 121, 122‧‧‧ glass

143‧‧‧熱劣化部 143‧‧‧ Thermal Degradation Department

Claims (11)

一種複合板之切斷方法,其係包含厚度為200μm以下之玻璃板、及形成於該玻璃板上之樹脂膜之複合板之切斷方法,且包含以下步驟:對上述複合板之上述玻璃板局部地照射雷射光,以玻璃之緩冷點以下之溫度局部地加熱上述玻璃板,使上述雷射光於上述玻璃板上之照射位置移動,且沿著移動軌跡,使於厚度方向上貫通上述玻璃板之裂紋伸展,於該步驟中,上述樹脂膜跨過上述裂紋,將隔著上述裂紋之兩側之玻璃連結,上述步驟係於使上述雷射光於上述玻璃板上之照射位置移動時,沿著移動軌跡,於上述樹脂膜形成線狀之熱劣化部,所謂熱劣化係指以雷射照射前之上述樹脂膜之拉伸強度(MPa)為基準,雷射照射後之上述樹脂膜之拉伸強度降低0.01%以上,於該步驟後切斷上述樹脂膜。 A method for cutting a composite sheet, comprising a method for cutting a composite sheet comprising a glass sheet having a thickness of 200 μm or less and a resin film formed on the glass sheet, and comprising the steps of: forming the glass sheet of the composite sheet Locally irradiating the laser light, locally heating the glass plate at a temperature below the slow cooling point of the glass, moving the laser light at the irradiation position of the glass plate, and passing the glass in the thickness direction along the movement track The crack of the plate is stretched, and in the step, the resin film crosses the crack and connects the glass on both sides of the crack, and the step is to move the laser light to the irradiation position of the glass plate. In the thermal deterioration portion in which the resin film is formed in a linear shape, the thermal deterioration means that the resin film is pulled after the laser irradiation based on the tensile strength (MPa) of the resin film before the laser irradiation. The tensile strength was reduced by 0.01% or more, and the resin film was cut after this step. 如請求項1之複合板之切斷方法,其中藉由以上述線狀之熱劣化部為中心使上述樹脂膜彎折,而將上述移動軌跡之終端部即上述玻璃板之端部切斷。 The method of cutting a composite sheet according to claim 1, wherein the resin film is bent around the linear heat-degraded portion, and the end portion of the moving trajectory, that is, the end portion of the glass sheet is cut. 如請求項1或2之複合板之切斷方法,其中藉由以上述線狀之熱劣化部為中心使上述樹脂膜彎折,而沿上述熱劣化部將上述樹脂膜切斷。 The method of cutting a composite sheet according to claim 1 or 2, wherein the resin film is cut along the thermally deteriorated portion by bending the resin film around the linear heat-degraded portion. 如請求項1或2之複合板之切斷方法,其中於上述步驟中,對上述玻璃板自上述樹脂膜側之相反側照射上述雷射光。 A method of cutting a composite panel according to claim 1 or 2, wherein in said step, said laser sheet is irradiated with said laser light from a side opposite to said resin film side. 如請求項1或2之複合板之切斷方法,其更包含於上述玻璃板上形成作為於厚度方向上貫通上述玻璃板之裂紋之起點之初期裂紋之步驟。 The method of cutting a composite panel according to claim 1 or 2, further comprising the step of forming an initial crack as a starting point of a crack penetrating the glass sheet in the thickness direction on the glass sheet. 如請求項1或2之複合板之切斷方法,其中利用冷媒局部地冷卻上述複合板之上述玻璃板,且使冷媒於上述玻璃板上之供給位置與上述玻璃板中之雷射光之照射位置連動地移動。 The method for cutting a composite panel according to claim 1 or 2, wherein the glass sheet of the composite sheet is partially cooled by a refrigerant, and a supply position of the refrigerant on the glass sheet and an irradiation position of the laser light in the glass sheet are provided. Move in conjunction. 一種玻璃板之切斷方法,其係厚度為200μm以下之玻璃板之切斷方法,且包含以下步驟:對包含該玻璃板及形成於該玻璃板上之樹脂膜之複合板之上述玻璃板局部地照射雷射光,以玻璃之緩冷點以下之溫度局部地加熱上述玻璃板,使上述雷射光於上述玻璃板上之照射位置移動,且沿著移動軌跡,使於厚度方向上貫通上述玻璃板之裂紋伸展,於該步驟中,上述樹脂膜跨過上述裂紋,將隔著上述裂紋之兩側之玻璃連結,上述步驟係於使上述雷射光於上述玻璃板上之照射位置移動時,沿著移動軌跡,於上述樹脂膜形成線狀之熱劣化部,所謂熱劣化係指以雷射照射前之上述樹脂膜之拉伸強度(MPa)為基準,雷射照射後之上述樹脂膜之拉伸強度降低0.01%以上,於上述步驟後,藉由以上述線狀之熱劣化部為中心將上述樹脂膜彎折,而將上述移動軌跡之終端部即上述玻璃板之端部切斷。 A method for cutting a glass sheet, which is a method for cutting a glass sheet having a thickness of 200 μm or less, and comprising the steps of: partially applying the glass sheet to a composite sheet comprising the glass sheet and a resin film formed on the glass sheet Radiating the ground light, locally heating the glass plate at a temperature below the slow cooling point of the glass, moving the laser light at the irradiation position of the glass plate, and passing the glass plate in the thickness direction along the movement track The crack is stretched, and in the step, the resin film crosses the crack and connects the glass on both sides of the crack, and the step is to move the laser light at the irradiation position on the glass plate. The movement track is formed by forming a linear heat-degraded portion in the resin film, and the term "thermal deterioration" refers to stretching of the resin film after laser irradiation based on the tensile strength (MPa) of the resin film before laser irradiation. The strength is reduced by 0.01% or more. After the above step, the resin film is bent around the linear heat-degraded portion, and the end portion of the moving locus is the glass. The end of the glass plate is cut. 如請求項7之玻璃板之切斷方法,其中於未切斷上述樹脂膜之狀態下,將上述樹脂膜與上述玻璃板剝離。 The method for cutting a glass sheet according to claim 7, wherein the resin film is peeled off from the glass sheet in a state where the resin film is not cut. 如請求項7或8之玻璃板之切斷方法,其中於上述步驟中,對上述玻璃板自上述樹脂膜側之相反側照射上述雷射光。 A method of cutting a glass sheet according to claim 7 or 8, wherein in said step, said laser sheet is irradiated with said laser light from a side opposite to said resin film side. 如請求項7或8之玻璃板之切斷方法,其更包含於上述玻璃板形成作為於厚度方向上貫通上述玻璃板之裂紋之起點之初期裂紋之步驟。 The method for cutting a glass sheet according to claim 7 or 8, further comprising the step of forming an initial crack in the glass sheet as a starting point of a crack that penetrates the glass sheet in a thickness direction. 如請求項7或8之玻璃板之切斷方法,其中於上述步驟中,利用冷媒局部地冷卻上述玻璃板,且使冷媒於上述玻璃板上之供給位置與上述玻璃板中之雷射光之照射位置連動地移動。 The method for cutting a glass sheet according to claim 7 or 8, wherein in the above step, the glass sheet is partially cooled by a refrigerant, and a supply position of the refrigerant on the glass sheet and irradiation of the laser light in the glass sheet are performed. The position moves in conjunction.
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