TW201416203A - Breaking device of laminated brittle material substrate and breaking method of laminated brittle material substrate - Google Patents
Breaking device of laminated brittle material substrate and breaking method of laminated brittle material substrate Download PDFInfo
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本發明係關於一種將附設有由樹脂或金屬所構成之層之積層脆性材料基板裂斷的積層脆性材料基板之裂斷裝置及積層脆性材料基板之裂斷方法。 The present invention relates to a cracking device for a laminated brittle material substrate in which a laminated brittle material substrate having a layer made of a resin or a metal is cracked, and a method for cracking a laminated brittle material substrate.
半導體元件係藉由將形成於基板之元件區域於該區域之邊界位置裂斷(割斷)而製造。以此方式裂斷基板時，係使用裂斷裝置。此種裂斷裝置成為如下構成：藉由自與形成有刻劃線之主面相反側之主面利用裂斷棒於Z方向上按壓於一主面形成有刻劃線之基板，而將該基板於朝向X方向之刻劃線裂斷，且於該基板之一主面形成有藉由利用刻劃輪對基板表面進行刻劃線而形成之刻劃線、藉由金剛石切割器等切削器具將基板表面線狀地削掉之刻劃線槽、藉由雷射光使基板表面消融而線狀地除去之消融加工線、或藉由利用雷射光使基板表面局部熔融而使基板之構造線狀地變質之加工線等(於本說明書中，將該等總稱為「刻劃線」)。而且，於基板之裂斷時，基板係藉由被稱為支承刀等之於Y方向上僅相互間隔微小距離而配置之一對支承構件而抵接支承(例如參照專利文獻1)。 The semiconductor element is manufactured by breaking (cutting) the element region formed on the substrate at a boundary position of the region. When the substrate is broken in this way, a breaking device is used. The breaking device has a configuration in which a base plate on which a scribe line is formed on a main surface by a split rod in a Z direction from a main surface opposite to a main surface on which a scribe line is formed is used. The substrate is scribed by a scribe line in the X direction, and a scribe line formed by scribe the surface of the substrate by using the scribe wheel is formed on one main surface of the substrate, and a cutting tool such as a diamond cutter is formed on the main surface of the substrate. a scribed groove in which the surface of the substrate is linearly removed, an ablation line that is linearly removed by ablation of the surface of the substrate by laser light, or a partial melting of the surface of the substrate by using laser light to form a linear structure of the substrate Processing lines for ground deterioration (in the present specification, these are collectively referred to as "scribe lines"). In addition, when the substrate is broken, the substrate is placed in contact with the support member by a distance of a predetermined distance in the Y direction, which is called a support blade or the like (see, for example, Patent Document 1).
於此種脆性材料基板中，存在為了保護形成於主面之電路等，而將環氧玻璃等熱固性樹脂附設於主面者、或將金屬層附設於主面者。於藉由上述方法將此種基板裂斷之情形時，由於樹脂或金屬與基板之材質 不同，而存在即便於基板已裂斷時，由樹脂或金屬所構成之層之一部分亦並未被完全切斷而殘留之問題。 In such a brittle material substrate, a thermosetting resin such as epoxy glass is attached to the main surface or a metal layer is attached to the main surface in order to protect the circuit formed on the main surface. When the substrate is cracked by the above method, the material of the resin or the metal and the substrate Unlike the above, there is a problem that a part of a layer composed of a resin or a metal is not completely cut off even when the substrate has been broken.
因此，於專利文獻2中揭示有一種附有樹脂之脆性材料基板之分割方法，其係將於脆性材料基板之一主面附著有樹脂而成之附有樹脂之脆性材料基板垂直於主面地分割之方法，且具備：槽部形成步驟，其係於附有樹脂之脆性材料基板之樹脂側之分割預定位置形成槽部；刻劃線形成步驟，其係於附有樹脂之脆性材料基板之脆性材料基板側之分割預定位置形成刻劃線；以及裂斷步驟，其係沿刻劃線分割附有樹脂之脆性材料基板。 Therefore, Patent Document 2 discloses a method of dividing a substrate of a brittle material with a resin, which is a resin-attached brittle material substrate on which a resin is adhered to one main surface of a brittle material substrate, perpendicular to the main surface. a method of dividing, comprising: a groove forming step of forming a groove portion at a predetermined predetermined position on a resin side of a resin-attached brittle material substrate; and a scribe line forming step of attaching to a resin-containing brittle material substrate The predetermined predetermined position on the side of the brittle material substrate forms a score line; and a cracking step of dividing the substrate of the brittle material to which the resin is attached along the score line.
[專利文獻1]日本特開2004-39931號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-39931
[專利文獻2]日本特開2012-66479號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2012-66479
專利文獻2中所記載之附有樹脂之脆性材料基板之分割方法係可將附有樹脂之脆性材料基板於相對於其主面垂直之分割預定位置確實地、且以優異之尺寸精度分割之優異者，但由於在基板之裂斷步驟之前必須執行槽部形成步驟，故而存在作業步驟增加，無法有效率地執行裂斷作業之問題。 The method for dividing a resin-containing brittle material substrate described in Patent Document 2 is excellent in that the resin-containing brittle material substrate is accurately divided by a predetermined predetermined position perpendicular to the main surface thereof and excellent in dimensional accuracy. However, since the groove forming step must be performed before the cracking step of the substrate, there is a problem that the number of working steps is increased and the cracking operation cannot be performed efficiently.
本發明係為解決上述問題而成者，其目的在於提供一種對於 附設有由樹脂或金屬所構成之層之積層脆性材料基板，無需經過特別之步驟，便可確實地將由樹脂或金屬所構成之層與該積層脆性材料基板一併裂斷的積層脆性材料基板之裂斷裝置及積層脆性材料基板之裂斷方法。 The present invention has been made to solve the above problems, and an object thereof is to provide a A laminated brittle material substrate provided with a layer composed of a resin or a metal, which can reliably laminate a layer composed of a resin or a metal and a laminated brittle material substrate without a special step. Cracking device and cracking method for laminated brittle material substrate.
技術方案1之發明係藉由對在一主面附設有由樹脂或金屬所構成之層、於另一主面形成有刻劃線之積層脆性材料基板，自上述積層脆性材料基板之附設有由上述樹脂或金屬所構成之層之側之主面沿上述刻劃線抵壓裂斷棒，而將上述積層脆性材料基板裂斷之積層脆性材料基板之裂斷裝置，其特徵在於：上述裂斷棒之與上述積層脆性材料基板之抵接部具有由65度以下、較佳為45度以下之角度所構成之刀形狀。 According to a first aspect of the invention, a laminated brittle material substrate having a layer formed of a resin or a metal on one main surface and a scribed line formed on the other main surface is attached to the laminated brittle material substrate. The cracking device for the laminated brittle material substrate in which the main surface of the layer composed of the resin or the metal is pressed against the cracked bar along the scribe line and the laminated brittle material substrate is broken, characterized in that the crack is broken The abutting portion of the rod and the laminated brittle material substrate has a blade shape composed of an angle of 65 degrees or less, preferably 45 degrees or less.
技術方案2之發明係將於一主面附設有由樹脂或金屬所構成之層、於另一主面形成有刻劃線之積層脆性材料基板裂斷之積層脆性材料基板之裂斷方法，其特徵在於具備：支承步驟，其係支承上述積層脆性材料基板之形成有上述刻劃線之主面；以及裂斷步驟，其係藉由自上述積層脆性材料基板之附設有由上述樹脂或金屬所構成之層之側之主面沿上述刻劃線，抵壓其前端具有由45度以下之角度所構成之刀形狀之裂斷棒，而將由上述樹脂或金屬所構成之層切斷，並且將上述積層脆性材料基板裂斷。 According to a second aspect of the invention, there is provided a method of cracking a laminated brittle material substrate in which a layer composed of a resin or a metal is formed on one main surface and a laminated brittle material substrate having a scribed line formed on the other main surface is broken. A support step comprising: supporting a main surface of the laminated brittle material substrate on which the scribe line is formed; and a cracking step by attaching the resin or metal from the laminated brittle material substrate The main surface on the side of the layer formed along the above-mentioned scribe line is pressed against a cracked rod having a blade shape formed by an angle of 45 degrees or less at the front end thereof, and the layer composed of the above resin or metal is cut and The laminated brittle material substrate is broken.
根據技術方案1及技術方案2之發明，即便於將附設有由樹脂或金屬所構成之層之積層脆性材料基板裂斷之情形時，亦可不經過槽部之形成等特別之步驟，而確實地將積層脆性材料基板與由樹脂或金屬所構成之層一併裂斷。 According to the inventions of the first aspect and the second aspect, even when the laminated brittle material substrate having the layer made of resin or metal is broken, the special step such as the formation of the groove portion can be surely performed. The laminated brittle material substrate is cracked together with a layer composed of a resin or a metal.
10‧‧‧支承構件 10‧‧‧Support members
11‧‧‧旋轉構件 11‧‧‧Rotating components
12‧‧‧Y平台 12‧‧‧Y platform
13‧‧‧支承台 13‧‧‧Support table
14‧‧‧裂斷棒 14‧‧‧Break
15‧‧‧吊支構件 15‧‧‧ Hanging member
16‧‧‧升降台 16‧‧‧Elevator
23、31、34、36‧‧‧步進馬達 23, 31, 34, 36‧‧‧ stepper motor
25、32、33、38‧‧‧滾珠螺桿 25, 32, 33, 38‧‧‧ ball screw
35‧‧‧CCD相機 35‧‧‧CCD camera
37‧‧‧導軌 37‧‧‧rails
42‧‧‧黏著性膜 42‧‧‧Adhesive film
43‧‧‧環狀構件 43‧‧‧Annual members
61、62‧‧‧支承刀 61, 62‧‧‧ support knife
99‧‧‧刻劃線 99‧‧•marking
100‧‧‧基板 100‧‧‧Substrate
103‧‧‧由樹脂或金屬所構成之層 103‧‧‧A layer of resin or metal
圖1係本發明之脆性材料基板之裂斷裝置之立體圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a breaking device for a brittle material substrate of the present invention.
圖2係本發明之脆性材料基板之裂斷裝置之立體圖。 Figure 2 is a perspective view of a breaking device for a brittle material substrate of the present invention.
圖3係表示用以將基板100設置於上述基板之裂斷裝置之環狀構件43之俯視圖。 3 is a plan view showing an annular member 43 for providing a substrate 100 to a cracking device of the substrate.
圖4係表示將基板100裂斷之狀態之放大圖。 FIG. 4 is an enlarged view showing a state in which the substrate 100 is broken.
以下，根據圖式對本發明之實施形態進行說明。圖1及圖2係本發明之脆性材料基板之裂斷裝置之立體圖。 Hereinafter, embodiments of the present invention will be described based on the drawings. 1 and 2 are perspective views of a breaking device for a brittle material substrate of the present invention.
該脆性材料基板之裂斷裝置係用以將使用LTCC(Low Temperature Co-fired Ceramic，低溫共燒陶瓷)或HTCC(Low Temperature Co-fired Ceramic，高溫共燒陶瓷)等陶瓷、玻璃、或其他脆性材料而構成之脆性材料基板(以下，簡稱為「基板」)裂斷(割斷)者。 The brittle material substrate cracking device is used for ceramics, glass, or other brittleness such as LTCC (Low Temperature Co-fired Ceramic) or HTCC (Low Temperature Co-fired Ceramic). The brittle material substrate (hereinafter simply referred to as "substrate") formed of the material is broken (cut).
該基板之裂斷裝置具備：支承構件10(參照圖1)；旋轉構件11，其以使形成於基板之刻劃線之朝向與所需之方向對準之方式支承下述環狀構件43，並使其相對於該支承構件10旋轉；Y平台12，其支承旋轉構件11；支承台13，其支承該Y平台12；及升降台16，其相對於旋轉構件11而升降。支承台13經由4根軸18、基台17及腿部19而設置於地面。 The substrate breaking device includes a support member 10 (see FIG. 1), and a rotating member 11 that supports the annular member 43 described below so that the direction of the scribe line formed on the substrate is aligned with a desired direction. And rotating relative to the support member 10; the Y platform 12 supporting the rotating member 11; the support table 13 supporting the Y platform 12; and the lifting table 16 moving up and down with respect to the rotating member 11. The support base 13 is provided on the floor via the four shafts 18, the base 17 and the leg portions 19.
於支承台13之上表面，4根柱狀升降導引件24豎立設置於旋轉構件11之外側之位置，以架跨該等柱狀升降導引件24之上端之方式固定有台座21。又，於支承台13與台座21之間設置有藉由柱狀升降導引件 24可升降地導引之升降台16。 On the upper surface of the support table 13, four columnar lifting guides 24 are erected on the outer side of the rotating member 11, and the pedestal 21 is fixed so as to span the upper ends of the columnar lifting guides 24. Moreover, a column-shaped lifting guide is disposed between the support base 13 and the pedestal 21 24 lifting platform 16 that can be lifted and lowered.
於台座21上，介隔支承構件22而設置有步進馬達23。於該步進馬達23之旋轉軸連結有於旋轉自如之狀態下貫通台座21之滾珠螺桿25，該滾珠螺桿25螺合於形成於升降台16之母螺紋部。因此，升降台16藉由步進馬達23之驅動而於Z方向上升降。 A stepping motor 23 is provided on the pedestal 21 with the support member 22 interposed therebetween. A ball screw 25 that passes through the pedestal 21 is rotatably coupled to a rotating shaft of the stepping motor 23, and the ball screw 25 is screwed to a female screw portion formed on the lifting table 16. Therefore, the lifting table 16 is raised and lowered in the Z direction by the driving of the stepping motor 23.
如圖2所示，於該升降台16之下表面，介隔吊支構件15而安裝有裂斷棒14。該裂斷棒14係亦被稱為刀片或裂斷刀者，係用以於基板之裂斷時，藉由沿形成於基板之刻劃線按壓基板，而將使基板裂斷之力賦予基板者。 As shown in FIG. 2, a split rod 14 is attached to the lower surface of the lifting platform 16 via the hanging member 15. The split rod 14 is also referred to as a blade or a split cutter for imparting a force to break the substrate by pressing the substrate along the scribe line formed on the substrate when the substrate is broken. By.
如圖2所示，Y平台12接收藉由步進馬達31之驅動而旋轉之滾珠螺桿32之驅動，而於支承台13上於Y方向上往返移動。又，旋轉構件11之旋轉角度位置可藉由利用步進馬達34使滾珠螺桿33旋轉而調整。 As shown in FIG. 2, the Y stage 12 receives the driving of the ball screw 32 which is rotated by the driving of the stepping motor 31, and reciprocates in the Y direction on the support table 13. Further, the rotational angle position of the rotating member 11 can be adjusted by rotating the ball screw 33 by the stepping motor 34.
如圖2所示，於支承台13之下方設置有CCD(Charge Coupled Device，電荷耦合器件)相機35。該CCD相機35可沿支承於基台17上之支承板39之一對導軌37於X方向上移動。又，CCD相機35之支承部41與藉由步進馬達36之驅動而旋轉之滾珠螺桿38螺合。因此，CCD相機35接收步進馬達36之驅動，而於X方向上往返移動。再者，該CCD相機35係用以經由形成於支承台13之開口部觀察形成於基板之刻劃線與裂斷棒14之位置關係者。 As shown in FIG. 2, a CCD (Charge Coupled Device) camera 35 is disposed below the support base 13. The CCD camera 35 is movable in the X direction with respect to the guide rail 37 along one of the support plates 39 supported on the base 17. Further, the support portion 41 of the CCD camera 35 is screwed to the ball screw 38 that is rotated by the driving of the stepping motor 36. Therefore, the CCD camera 35 receives the driving of the stepping motor 36 and reciprocates in the X direction. Further, the CCD camera 35 is configured to observe the positional relationship between the score line formed on the substrate and the split rod 14 via the opening formed in the support table 13.
圖3係表示用以將基板100設置於上述基板之裂斷裝置之環狀構件43之俯視圖。 3 is a plan view showing an annular member 43 for providing a substrate 100 to a cracking device of the substrate.
於形成於環狀構件43之中央之圓形之開口部，於使其黏著 面朝向環狀構件43側之狀態下黏貼有被稱為切割保護膠帶之黏著性膜42。而且，裂斷之基板100黏貼於黏著性膜42之黏著面。此時，下述由樹脂或金屬所構成之層103配置於與黏著性膜42相反側。經由黏著性膜42而黏貼有基板100之環狀構件43設置於圖1所示之旋轉構件11。 The circular opening formed in the center of the annular member 43 is adhered to An adhesive film 42 called a cut-off protective tape is adhered to the side of the ring-shaped member 43 side. Further, the cracked substrate 100 is adhered to the adhesive surface of the adhesive film 42. At this time, the layer 103 composed of a resin or a metal described below is disposed on the opposite side of the adhesive film 42. The annular member 43 to which the substrate 100 is adhered via the adhesive film 42 is provided in the rotating member 11 shown in Fig. 1 .
圖4係表示將基板100裂斷之狀態之放大圖。再者，於該圖中，僅圖示有形成於基板100之多個刻劃線99中之一條。 FIG. 4 is an enlarged view showing a state in which the substrate 100 is broken. Furthermore, in the figure, only one of the plurality of scribe lines 99 formed on the substrate 100 is illustrated.
圖3所示之環狀構件43介隔黏著性膜42而載置於旋轉構件11上。於此狀態下，於基板100之下表面配置有具備一對支承刀61、62之支承構件10，黏著基板100之黏著性膜42藉由此一對支承刀61、62而支承。於此狀態下，藉由CCD相機35經由一對支承刀61、62之間之區域觀察刻劃線99。而且，裂斷棒14配置於與刻劃線99相對向之位置。 The annular member 43 shown in FIG. 3 is placed on the rotating member 11 via the adhesive film 42. In this state, the support member 10 including the pair of support blades 61 and 62 is disposed on the lower surface of the substrate 100, and the adhesive film 42 of the adhesive substrate 100 is supported by the pair of support blades 61 and 62. In this state, the scribe line 99 is observed by the CCD camera 35 via the region between the pair of support knives 61, 62. Further, the split rod 14 is disposed at a position opposed to the score line 99.
該裂斷棒14係用以將由樹脂或金屬所構成之層103切斷，並且將基板100本身裂斷者，其前端由具有由45度以下之角度構成之刀形狀之超鋼合金而構成。 The split rod 14 is formed by cutting a layer 103 made of a resin or a metal and breaking the substrate 100 itself, and the tip end thereof is formed of a super-alloy having a blade shape formed by an angle of 45 degrees or less.
即，於先前之普通裂斷棒中，其前端成為90度左右之角度。因此，發現於採用利用此種裂斷棒，藉由對附設有由樹脂或金屬所構成之層103之基板100自附設有該由樹脂或金屬所構成之層103之側的主面抵壓裂斷棒，而將基板裂斷之構成之情形時，會產生如下問題：即便於基板100已裂斷時，由樹脂或金屬所構成之層103之一部分亦並未被完全切斷而殘留之問題。因此，於本發明之基板之裂斷裝置中，如圖4所放大表示般，藉由使用與基板100之抵接部具有由65度以下、較佳為45度以下之角度θ所構成之刀形狀者作為裂斷棒14，而消除上述問題。 That is, in the conventional ordinary splitting bar, the front end thereof has an angle of about 90 degrees. Therefore, it has been found that by using such a split rod, the main surface of the side of the layer 103 composed of the resin or metal is adhered to the substrate 100 to which the layer 103 made of resin or metal is attached. When the rod is broken and the substrate is broken, there is a problem that even when the substrate 100 has been broken, a part of the layer 103 composed of resin or metal is not completely cut off and remains. . Therefore, in the cracking device of the substrate of the present invention, as shown in FIG. 4, the blade having the contact portion with the substrate 100 has a blade having an angle θ of 65 degrees or less, preferably 45 degrees or less. The shape is used as the split rod 14, and the above problem is eliminated.
該裂斷棒14之前端之角度θ較佳為35度以下，進而較佳為25度以下。該角度θ越小，越能將由樹脂或金屬所構成之層103良好地切斷，但若考慮裂斷棒14之加工及耐久性，則該角度θ較佳為10度以上。又，先前，於普通裂斷棒14之前端部形成有0.1mm左右之弧形角(圓弧狀加工/R0.1mm)，但於該裂斷棒14中，僅形成有為保護裂斷棒14之前端所必須之最低之弧形角。 The angle θ of the front end of the split rod 14 is preferably 35 degrees or less, and more preferably 25 degrees or less. The smaller the angle θ, the better the layer 103 made of resin or metal can be cut. However, considering the processing and durability of the split rod 14, the angle θ is preferably 10 degrees or more. Further, in the prior art, an arcuate angle of about 0.1 mm (arc-shaped processing/R0.1 mm) is formed at the end portion of the ordinary splitting bar 14, but in the splitting bar 14, only the protective splitting bar is formed. The lowest arc angle required at the front end of 14.
於藉由具有此種構成之基板之裂斷裝置將基板100裂斷時，將介隔黏著性膜42安裝有應裂斷之基板100之環狀構件43設置於旋轉構件11。於此狀態下，如圖4所示，黏著有基板100之黏著性膜42藉由支承構件10中之一對支承刀61、62而支承。 When the substrate 100 is broken by the cracking device having the substrate having such a configuration, the annular member 43 to which the substrate 100 to be broken is attached to the adhesive film 42 is provided in the rotating member 11. In this state, as shown in FIG. 4, the adhesive film 42 to which the substrate 100 is adhered is supported by the pair of support blades 61, 62 by one of the support members 10.
然後，藉由CCD相機35對形成於基板100之刻劃線99進行拍攝。於該刻劃線99之拍攝時，藉由步進馬達36之驅動而使CCD相機35於X方向上移動，針對於X方向上延伸之刻劃線99，於其全域拍攝圖像。 Then, the scribe line 99 formed on the substrate 100 is imaged by the CCD camera 35. At the time of the photographing of the scribe line 99, the CCD camera 35 is moved in the X direction by the driving of the stepping motor 36, and an image is taken in the entire area for the scribe line 99 extending in the X direction.
其次，根據藉由CCD相機35而拍攝之圖像，使基板100與裂斷棒14相對移動，藉此執行基板100中之刻劃線99與裂斷棒14之定位。更具體而言，根據藉由CCD相機35而拍攝之刻劃線99之圖像，識別形成於基板100之刻劃線99之角度與位置。即，藉由步進馬達31之驅動而使Y平台12於Y方向上移動，並且藉由步進馬達34之驅動而調整旋轉構件11之旋轉角度位置，藉此，使基板100於Y方向及θ方向上移動，而將基板100配置於使配置於端部之刻劃線99與裂斷棒14準確地相對向之位置。 Next, the substrate 100 and the split bar 14 are relatively moved in accordance with an image taken by the CCD camera 35, whereby the positioning of the score line 99 and the split bar 14 in the substrate 100 is performed. More specifically, the angle and position of the score line 99 formed on the substrate 100 are identified based on the image of the score line 99 taken by the CCD camera 35. That is, the Y stage 12 is moved in the Y direction by the driving of the stepping motor 31, and the rotational angle position of the rotating member 11 is adjusted by the driving of the stepping motor 34, whereby the substrate 100 is placed in the Y direction and Moving in the θ direction, the substrate 100 is placed at a position where the scribe line 99 disposed at the end portion and the rupture rod 14 are accurately opposed to each other.
然後，藉由裂斷棒14而按壓基板100，而將基板100裂斷。即，藉由步進馬達23之驅動而使升降台16下降，使裂斷棒14抵接於基板 100之與刻劃線99相反側之主面後，進一步使該裂斷棒14下降。此時，由於係使用其前端具有由45度以下之角度θ所構成之刀形狀者作為裂斷棒14，故而可藉由該裂斷棒14將由樹脂或金屬所構成之層103切斷，並且將基板100本身裂斷。 Then, the substrate 100 is pressed by the split bar 14, and the substrate 100 is broken. That is, the lift table 16 is lowered by the driving of the stepping motor 23, and the split rod 14 is brought into contact with the substrate. After the main surface of the side opposite to the score line 99 is 100, the split rod 14 is further lowered. In this case, since the blade shape formed by the tip end having an angle θ of 45 degrees or less is used as the split bar 14, the layer 103 made of resin or metal can be cut by the split bar 14 and The substrate 100 itself is broken.
藉由重複進行此種動作必要之次數，若於與所有刻劃線99相對應之區域均結束基板100之裂斷作業，則將基板100搬出而結束作業。 By repeating the number of times necessary for such an operation, if the cracking operation of the substrate 100 is completed in the region corresponding to all the scribe lines 99, the substrate 100 is carried out to complete the work.
如上所述般，於本發明之基板之裂斷裝置中，尤其是使用與基板100之抵接部具有呈銳角化之刀形狀者作為裂斷棒14，故而即便於自該層103側按壓附設有由樹脂或金屬所構成之層103之基板100而將其裂斷之情形時，亦可不經過槽部之形成等特別之步驟，而將基板100與由樹脂或金屬所構成之層103一併確實地裂斷。 As described above, in the cracking device for a substrate of the present invention, in particular, a blade having an acute angle with respect to the abutting portion of the substrate 100 is used as the splitting bar 14, so that even the pressing from the layer 103 side is attached. When the substrate 100 of the layer 103 made of a resin or a metal is cracked, the substrate 100 may be laminated together with the layer 103 made of resin or metal without a special step such as formation of a groove portion. It is indeed broken.
10‧‧‧支承構件 10‧‧‧Support members
11‧‧‧旋轉構件 11‧‧‧Rotating components
14‧‧‧裂斷棒 14‧‧‧Break
35‧‧‧CCD相機 35‧‧‧CCD camera
42‧‧‧黏著性膜 42‧‧‧Adhesive film
43‧‧‧環狀構件 43‧‧‧Annual members
61、62‧‧‧支承刀 61, 62‧‧‧ support knife
99‧‧‧刻劃線 99‧‧•marking
100‧‧‧基板 100‧‧‧Substrate
103‧‧‧由樹脂或金屬所構成之層 103‧‧‧A layer of resin or metal
Claims (2)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2012237684A JP6043150B2 (en) | 2012-10-29 | 2012-10-29 | Breaking apparatus for laminated brittle material substrate and method for breaking laminated brittle material substrate |
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| TW201416203A true TW201416203A (en) | 2014-05-01 |
| TWI583521B TWI583521B (en) | 2017-05-21 |
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| TW102118210A TWI583521B (en) | 2012-10-29 | 2013-05-23 | Cracking device of laminated brittle material substrate and cracking method of laminated brittle material substrate |
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| Country | Link |
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| JP (1) | JP6043150B2 (en) |
| CN (2) | CN110405963A (en) |
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| TWI658013B (en) * | 2014-10-31 | 2019-05-01 | 日商三星鑽石工業股份有限公司 | Cracking device, method for installing cracking knife to cracking device, and box for cracking knife |
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| JP2016040079A (en) * | 2014-08-12 | 2016-03-24 | 三星ダイヤモンド工業株式会社 | Segmentation method and segmentation apparatus for brittle material substrate |
| JP2016043505A (en) * | 2014-08-20 | 2016-04-04 | 三星ダイヤモンド工業株式会社 | Dividing method and dividing device of brittle material substrate |
| JP6481465B2 (en) * | 2014-08-21 | 2019-03-13 | 三星ダイヤモンド工業株式会社 | Breaking method of composite substrate |
| KR101659454B1 (en) * | 2014-08-21 | 2016-09-23 | 한국미쯔보시다이아몬드공업(주) | Breaking apparatus for substrate |
| JP6689023B2 (en) * | 2014-08-28 | 2020-04-28 | 三星ダイヤモンド工業株式会社 | Break device |
| JP2016184650A (en) * | 2015-03-26 | 2016-10-20 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6578759B2 (en) * | 2015-06-29 | 2019-09-25 | 三星ダイヤモンド工業株式会社 | Break device |
| JP6547556B2 (en) * | 2015-09-29 | 2019-07-24 | 三星ダイヤモンド工業株式会社 | Method of dividing brittle substrate |
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| TWI632040B (en) * | 2017-07-10 | 2018-08-11 | 煜峰投資顧問有限公司 | Apparatus and method for breaking brittle substrate |
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| JP6967276B2 (en) * | 2017-12-28 | 2021-11-17 | 三星ダイヤモンド工業株式会社 | Break device |
| JP7020675B2 (en) | 2018-02-26 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | Wafer with Low-k film splitting method |
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| TWI658013B (en) * | 2014-10-31 | 2019-05-01 | 日商三星鑽石工業股份有限公司 | Cracking device, method for installing cracking knife to cracking device, and box for cracking knife |
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| Publication number | Publication date |
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| CN110405963A (en) | 2019-11-05 |
| CN103786271A (en) | 2014-05-14 |
| JP2014087937A (en) | 2014-05-15 |
| JP6043150B2 (en) | 2016-12-14 |
| TWI583521B (en) | 2017-05-21 |
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