TW201536497A - Resin sheet breaking method and breaking device - Google Patents
Resin sheet breaking method and breaking device Download PDFInfo
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- TW201536497A TW201536497A TW103140866A TW103140866A TW201536497A TW 201536497 A TW201536497 A TW 201536497A TW 103140866 A TW103140866 A TW 103140866A TW 103140866 A TW103140866 A TW 103140866A TW 201536497 A TW201536497 A TW 201536497A
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- resin sheet
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- scribing
- adhesive tape
- breaking
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
- B26D1/141—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter for thin material, e.g. for sheets, strips or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
本發明係關於一種用於分斷矽酮片材等樹脂片材之分斷方法及分斷裝置。 The present invention relates to a breaking method and a breaking device for separating a resin sheet such as an anthrone sheet.
於專利文獻1中揭示有一種使用切斷刀片來切斷熱塑性樹脂片材之方法。切斷時將刀片加熱，並使切斷刀片於咬入方向往返運動而進行切斷。又，於專利文獻2中揭示有一種方法，切斷一塊樹脂片材時，為了除去切斷時之毛邊而利用上下兩個刀片進行切斷。 Patent Document 1 discloses a method of cutting a thermoplastic resin sheet using a cutting blade. When the cutting is performed, the blade is heated, and the cutting blade is reciprocated in the biting direction to be cut. Further, Patent Document 2 discloses a method of cutting a piece of a resin sheet by cutting the burrs at the time of cutting by using the upper and lower blades.
[專利文獻1]日本專利特公昭61-10280號公報 [Patent Document 1] Japanese Patent Publication No. Sho 61-10280
[專利文獻2]日本專利3625146號公報 [Patent Document 2] Japanese Patent No. 3625146
先前於分斷樹脂片材時，係使切斷刀片於咬入方向往返運動而進行切斷，因此，有如難以高精度地準確進行分斷之問題。又，利用上下兩個刀片進行切斷之方法中，有如難以使上下之切斷刀片準確地一致之問題。 When the resin sheet is separated, the cutting blade is reciprocated in the biting direction to be cut. Therefore, there is a problem that it is difficult to accurately perform the cutting with high precision. Further, in the method of cutting by the upper and lower blades, there is a problem that it is difficult to accurately match the upper and lower cutting blades.
本發明之目的在於提供一種能夠高精度地分斷樹脂片材之分斷方法。 An object of the present invention is to provide a breaking method capable of separating a resin sheet with high precision.
為了解決上述問題，本發明之樹脂片材之分斷方法係藉由於平台上保持樹脂片材，對上述樹脂片材施加荷重並使劃線輪轉動，而分斷樹脂片材。 In order to solve the above problem, the resin sheet of the present invention is separated by a resin sheet, a load is applied to the resin sheet, and the scribing wheel is rotated to break the resin sheet.
為了解決上述問題，本發明之樹脂片材之分斷方法係藉由於張貼於框狀體內側之黏著帶上表面黏著並保持樹脂片材，於平台上保持上述框狀體，對保持於上述框狀體上之上述樹脂片材施加荷重並使劃線輪轉動，而分斷樹脂片材，並藉由自下表面擴開上述黏著帶而使分斷後之樹脂片材分離。 In order to solve the above problems, the resin sheet of the present invention is separated by adhering to the upper surface of the adhesive tape attached to the inside of the frame body and holding the resin sheet, and the frame body is held on the platform, and is held in the above frame. The resin sheet on the shape is loaded with a load and the scribing wheel is rotated, and the resin sheet is separated, and the separated resin sheet is separated by expanding the adhesive tape from the lower surface.
為了解決上述問題，本發明之分斷裝置係用於分斷樹脂片材者，且包括：框狀體，其於黏著帶上保持成為劃線對象之樹脂片材；平台，其保持上述框狀體；劃線頭，其使劃線輪相對於上述平台上保持之樹脂片材而升降；及相對移動器件，其使上述劃線頭與上述平台相對移動；且藉由使上述劃線輪於上述樹脂片材上轉動，而分斷樹脂片材。 In order to solve the above problems, the breaking device of the present invention is used for breaking a resin sheet, and includes: a frame-shaped body which holds a resin sheet which becomes a scribing object on an adhesive tape; and a platform which holds the above-mentioned frame shape a scribing head that raises and lowers the scribing wheel relative to the resin sheet held on the platform; and a relative moving device that moves the scribing head relative to the platform; and by causing the scribing wheel to The above resin sheet is rotated to break the resin sheet.
此處，上述樹脂片材可為矽酮樹脂片材。 Here, the above resin sheet may be an fluorenone resin sheet.
此處，上述劃線輪可具有100°以下之刀尖角度。 Here, the scribing wheel may have a tool nose angle of 100 or less.
根據具有此種特徵之本發明，藉由於將樹脂片材保持於黏著帶上並固定於平台上之狀態下劃線而進行分斷，並使黏著帶擴張而進行分離。因此，可獲得能夠以特定形狀準確地分斷樹脂片材之效果。 According to the present invention having such a feature, the resin sheet is separated by streaking while holding the resin sheet on the adhesive tape and fixed to the stage, and the adhesive tape is expanded to separate. Therefore, an effect capable of accurately breaking the resin sheet in a specific shape can be obtained.
10‧‧‧分斷裝置 10‧‧‧ Breaking device
11‧‧‧移動台 11‧‧‧Mobile Station
12a、12b‧‧‧導軌 12a, 12b‧‧‧ rails
13‧‧‧滾珠螺桿 13‧‧‧Ball screw
14、15、25‧‧‧馬達 14, 15, 25‧ ‧ motor
16‧‧‧平台 16‧‧‧ platform
20‧‧‧橋體 20‧‧‧ Bridge body
21a、21b‧‧‧支柱 21a, 21b‧‧ ‧ pillar
22‧‧‧橋樑 22‧‧‧ Bridge
23‧‧‧驅動部 23‧‧‧ Drive Department
24‧‧‧滑座 24‧‧‧Slide
26‧‧‧進給螺桿 26‧‧‧feed screw
27‧‧‧劃線頭 27‧‧‧Drawing head
28‧‧‧劃線輪 28‧‧‧marking wheel
31‧‧‧切割環 31‧‧‧ cutting ring
32‧‧‧黏著帶 32‧‧‧Adhesive tape
33‧‧‧樹脂片材 33‧‧‧Resin sheet
34‧‧‧玻璃板 34‧‧‧ glass plate
35‧‧‧上推構件 35‧‧‧ Push-up components
圖1係本發明之實施形態之分斷裝置之概略立體圖。 Fig. 1 is a schematic perspective view of a breaking device according to an embodiment of the present invention.
圖2係表示平台及保持於平台上部之樹脂片材之詳情之立體圖。 Fig. 2 is a perspective view showing details of the platform and the resin sheet held on the upper portion of the platform.
圖3係表示平台上保持切割環之狀態之側視圖。 Figure 3 is a side elevational view showing the state in which the cutting ring is held on the platform.
圖4係表示平台上保持有切割環之狀態之立體圖。 Fig. 4 is a perspective view showing a state in which a cutting ring is held on the platform.
圖5(a)、(b)係表示劃線後自下方按壓黏著帶而擴開黏著帶之狀態之立體圖及側視圖。 Figs. 5(a) and 5(b) are a perspective view and a side view showing a state in which the adhesive tape is pressed from below and the adhesive tape is expanded from the lower side.
其次，說明本發明之實施形態之分斷裝置。如圖1所示，本實施形態之分斷裝置10中，將移動台11保持為沿著一對導軌12a、12b而於y軸方向上移動自如。滾珠螺桿13與移動台11螺合。滾珠螺桿13藉由馬達14之驅動而旋轉，使移動台11沿著導軌12a、12b於y軸方向上移動。於移動台11之上表面設有馬達15。馬達15使平台16於xy平面旋轉，並定位成特定角度。如下所述，於上述平台16上載置成為劃線對象之基板，並利用未圖示之真空吸附器件等予以保持。 Next, a breaking device according to an embodiment of the present invention will be described. As shown in Fig. 1, in the breaking device 10 of the present embodiment, the moving table 11 is held movably in the y-axis direction along the pair of guide rails 12a and 12b. The ball screw 13 is screwed to the moving table 11. The ball screw 13 is rotated by the driving of the motor 14, and the moving table 11 is moved in the y-axis direction along the guide rails 12a and 12b. A motor 15 is provided on the upper surface of the mobile station 11. Motor 15 rotates platform 16 in the xy plane and is positioned at a particular angle. As described below, the substrate to be scribed is placed on the stage 16 and held by a vacuum suction device or the like (not shown).
於分斷裝置10中，以橫跨移動台11及其上部之平台16之方式，利用支柱21a、21b而沿著x軸方向架設橋體20。橋體20上橫向設有橋樑(beam)22，橋樑22上設有驅動部23。驅動部23使滑座24沿著x軸方向移動，且包含馬達25及進給螺桿26，該進給螺桿26連結於馬達25且被旋轉自如地保持於橋樑22之側面中央。而且，如圖1所示，於滑座24上安裝有劃線頭27。於劃線頭27之下端部安裝有晶座。晶座將圓板狀劃線輪28旋轉自如地保持於下部。於劃線頭27之內部，設有可使晶座升降之升降部，例如氣壓控制之氣缸或電動控制之線性馬達等。本實施形態中，使用頂角為100°之劃線輪作為劃線輪28。再者，平台16之移動機構及使滑座24移動之驅動部構成相對移動器件，該相對移動器件使劃線頭相對於平台而相對移動。 In the breaking device 10, the bridge body 20 is bridged in the x-axis direction by the pillars 21a and 21b so as to straddle the platform 16 of the moving table 11 and its upper portion. A bridge 22 is disposed laterally on the bridge body 20, and a drive portion 23 is disposed on the bridge 22. The drive unit 23 moves the carriage 24 in the x-axis direction, and includes a motor 25 and a feed screw 26 that is coupled to the motor 25 and rotatably held at the center of the side surface of the bridge 22 . Further, as shown in FIG. 1, a scribing head 27 is attached to the carriage 24. A crystal holder is attached to the lower end of the scribing head 27. The crystal holder holds the disk-shaped scribing wheel 28 rotatably in the lower portion. Inside the scribing head 27, there is provided a lifting portion for lifting and lowering the crystal seat, for example, a pneumatically controlled cylinder or an electrically controlled linear motor. In the present embodiment, a scribing wheel having a vertex angle of 100 is used as the scribing wheel 28. Further, the moving mechanism of the platform 16 and the driving portion that moves the slider 24 constitute a relative moving device that relatively moves the scribing head relative to the platform.
圖2係表示平台16及保持於平台16上部之樹脂片材之詳情之立體圖，圖3係圖2之側視圖。本實施形態中，分斷對象為矽酮樹脂片材，為了保持該樹脂片材，使用切割環31，該切割環31係將半導體晶圓分離成晶片時使用之圓環框狀體。如圖所示，於切割環31之內側朝上地貼附有具有黏著材料之黏著帶32。該黏著帶32為雙層結構之黏著帶，具有氯乙烯等基材層、及其上表面之黏著材料層。基材層例如厚度為80μm、黏著材料層為20μm，合計厚度為100μm。而且， 該黏著帶32之上表面中央貼附成為分斷對象之樹脂片材33、例如矽酮樹脂片材。樹脂片材33具有彈性，先前並不認為能藉由劃線進行分斷。本實施形態中，樹脂片材33為厚度0.005~1mm，此處為例如厚度0.1mm之大致正方形狀之矽酮樹脂片材。將該樹脂片材33高精度地分斷成1×1mm見方之多個正方形微小片材。 2 is a perspective view showing details of the platform 16 and the resin sheet held on the upper portion of the platform 16, and FIG. 3 is a side view of FIG. In the present embodiment, the object to be separated is an oxime resin sheet, and in order to hold the resin sheet, a dicing ring 31 is used, which is a ring-shaped frame body used for separating a semiconductor wafer into a wafer. As shown in the figure, an adhesive tape 32 having an adhesive material is attached to the inside of the cutting ring 31 upward. The adhesive tape 32 is an adhesive tape having a two-layer structure, and has a base material layer such as vinyl chloride and an adhesive material layer on the upper surface thereof. The base material layer has a thickness of, for example, 80 μm, an adhesive material layer of 20 μm, and a total thickness of 100 μm. and, A resin sheet 33 to be separated, for example, an anthrone resin sheet, is attached to the center of the upper surface of the adhesive tape 32. The resin sheet 33 has elasticity and has not previously been considered to be separable by scribing. In the present embodiment, the resin sheet 33 has a thickness of 0.005 to 1 mm, and is, for example, a substantially square crepe resin sheet having a thickness of 0.1 mm. This resin sheet 33 is accurately divided into a plurality of square micro sheets of 1 × 1 mm square.
如圖2所示，於上述分斷裝置10之平台16上載置例如厚度0.3mm左右之保護用薄玻璃板34。而且，於平台16上，以樹脂片材33位於玻璃板34之上部之方式配置切割環31。而且，自平台16下方利用未圖示之真空吸附器件等保持樹脂片材33。如此，如圖3所示，黏著帶32之下表面被吸附，因此可將玻璃板34、黏著帶32及其上表面之樹脂片材33保持於平台16上。 As shown in FIG. 2, a protective thin glass plate 34 having a thickness of about 0.3 mm is placed on the stage 16 of the breaking device 10, for example. Further, on the stage 16, the cutting ring 31 is disposed such that the resin sheet 33 is located above the glass plate 34. Further, the resin sheet 33 is held from below the platform 16 by a vacuum suction device or the like (not shown). Thus, as shown in FIG. 3, the lower surface of the adhesive tape 32 is adsorbed, so that the glass plate 34, the adhesive tape 32, and the resin sheet 33 on the upper surface thereof can be held on the stage 16.
其次，說明樹脂片材33之分斷方法。首先，以樹脂片材33位於劃線輪28之正下方之方式移動滑座24及平台16。然後，使劃線頭27下降，使劃線輪28於樹脂片材33之外側到達較樹脂片材33之上表面略靠下之位置。該狀態下使滑座24沿著x軸方向移動，藉此可使劃線輪28一面對樹脂片材33施加荷重一面轉動而進行劃線。如此，可藉由劃線來分斷矽酮樹脂等樹脂片材33。 Next, a method of breaking the resin sheet 33 will be described. First, the carriage 24 and the stage 16 are moved such that the resin sheet 33 is located directly below the scribing wheel 28. Then, the scribing head 27 is lowered, so that the scribing wheel 28 reaches the position slightly lower than the upper surface of the resin sheet 33 on the outer side of the resin sheet 33. In this state, the carriage 24 is moved in the x-axis direction, whereby the scribing wheel 28 can be rotated while being applied to the resin sheet 33 to perform scribing. In this manner, the resin sheet 33 such as an fluorenone resin can be separated by scribing.
繼而，使劃線頭27上升，使平台16以特定間距沿著y軸方向略微移動後，使劃線頭27下降，進一步使劃線輪28沿著橋樑22於x軸方向移動，以同樣之方式重複劃線。若x軸方向之劃線全部結束，便利用馬達15使平台16旋轉而轉變切斷方向，同樣地重複劃線。然後，自上部使劃線輪旋轉並轉動，藉此如圖4所示格子狀地分斷樹脂片材33。 Then, the scribing head 27 is raised, and the platform 16 is slightly moved in the y-axis direction at a specific pitch, and then the scribing head 27 is lowered, and the scribing wheel 28 is further moved along the bridge 22 in the x-axis direction, in the same manner. Repeat the line. When all the scribe lines in the x-axis direction are completed, the motor 15 is conveniently rotated by the motor 15 to change the cutting direction, and the scribe line is repeated in the same manner. Then, the scribing wheel is rotated and rotated from the upper portion, whereby the resin sheet 33 is separated in a lattice shape as shown in FIG.
而且，如圖5(a)、(b)所示，自平台16取出切割環31及其上部之樹脂片材33，保持切割環31並自其中央下部起，如圖5(b)所示利用上推構件35自下方朝上上推黏著帶32。此時亦可使用晶圓擴張裝置。 如此，黏著帶32被擴開，經分斷之各正方形狀之樹脂片材自黏著帶32上分離而可確認個片化，且容易取出各晶片。 Further, as shown in Figs. 5(a) and (b), the cutting ring 31 and the resin sheet 33 on the upper portion thereof are taken out from the stage 16, and the cutting ring 31 is held and opened from the lower portion thereof as shown in Fig. 5(b). The adhesive tape 32 is pushed upward from the lower side by the push-up member 35. A wafer expansion device can also be used at this time. In this manner, the adhesive tape 32 is expanded, and the divided square-shaped resin sheets are separated from the adhesive tape 32 to confirm the chip formation, and it is easy to take out the respective wafers.
本實施形態中，係於環狀切割環上伸展貼附黏著帶，於其上部黏著並保持樹脂片材，因此，樹脂片材之處理變得容易。又，分斷後亦可藉由將黏著帶上推而容易地取出分離後之樹脂片材。如此，可將用於半導體製造步驟之切割環有效地利用於樹脂片材分斷。 In the present embodiment, the adhesive tape is stretched and attached to the annular cutting ring, and the resin sheet is adhered and held on the upper portion thereof. Therefore, the handling of the resin sheet is facilitated. Further, after the breaking, the separated resin sheet can be easily taken out by pushing up the adhesive tape. Thus, the cutting ring for the semiconductor manufacturing step can be effectively utilized for the resin sheet to be broken.
再者，本實施形態中，係以成為分斷對象之樹脂片材為包含矽酮樹脂之片材而進行說明，但其他樹脂片材，例如胺基甲酸酯樹脂片材亦同樣可適用於本發明。 In the present embodiment, the resin sheet to be separated is a sheet containing an fluorenone resin, but other resin sheets such as a urethane resin sheet are also applicable to the same. this invention.
本實施形態中，係於平台16上載置較薄之玻璃板34，並於玻璃板34上保持張貼於切割環31內之樹脂片材33，但由於玻璃板34僅係用於保護平台16，故而並非必須使用玻璃板34。 In the present embodiment, the thin glass plate 34 is placed on the stage 16, and the resin sheet 33 attached to the cutting ring 31 is held on the glass plate 34. However, since the glass plate 34 is only used to protect the stage 16, Therefore, it is not necessary to use the glass plate 34.
又，本實施形態中，係使用頂角為100°之刀輪作為劃線輪，但亦可使用頂角更小之劃線輪。若頂角大則劃線輪之壽命長，但若頂角小便可增加準確性。例如使用頂角為30°之劃線輪可同樣地藉由劃線來分斷樹脂片材。因此，於至少30~100°之範圍內，使用哪種頂角之劃線輪均可分斷樹脂片材。 Further, in the present embodiment, a cutter wheel having a apex angle of 100 is used as the scribing wheel, but a scribing wheel having a smaller apex angle may be used. If the apex angle is large, the life of the scribing wheel is long, but if the apex angle is small, the accuracy can be increased. For example, using a scribing wheel having a apex angle of 30°, the resin sheet can be similarly cut by scribing. Therefore, the resin sheet can be separated by using the scribe wheel of the top angle in the range of at least 30 to 100°.
進而，本實施形態中，係將樹脂片材保持於張貼在框狀切割環之黏著帶上，但只要為框狀體便可，故而並不限定於切割環。又，可不使用框狀體，藉由將樹脂片材保持於平台上進行劃線來分斷樹脂片材。 Further, in the present embodiment, the resin sheet is held by the adhesive tape attached to the frame-shaped cutting ring. However, the resin sheet is not limited to the cutting ring as long as it is a frame-shaped body. Further, the resin sheet can be separated by scribing the resin sheet while holding the resin sheet on the stage without using a frame-like body.
本發明可使用分斷裝置準確地分斷樹脂片材，因此適用於精密地分斷樹脂片材之分斷裝置。 The present invention can accurately separate the resin sheet using the breaking device, and is therefore suitable for a breaking device that precisely separates the resin sheet.
16‧‧‧平台 16‧‧‧ platform
31‧‧‧切割環 31‧‧‧ cutting ring
32‧‧‧黏著帶 32‧‧‧Adhesive tape
33‧‧‧樹脂片材 33‧‧‧Resin sheet
34‧‧‧玻璃板 34‧‧‧ glass plate
Claims (6)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-067662 | 2014-03-28 | ||
| JP2014067662A JP6528356B2 (en) | 2014-03-28 | 2014-03-28 | Cutting method of resin sheet |
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| Publication Number | Publication Date |
|---|---|
| TW201536497A true TW201536497A (en) | 2015-10-01 |
| TWI676539B TWI676539B (en) | 2019-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW103140866A TWI676539B (en) | 2014-03-28 | 2014-11-25 | Resin sheet breaking method and breaking device |
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| Country | Link |
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| JP (1) | JP6528356B2 (en) |
| KR (1) | KR20150112738A (en) |
| CN (1) | CN104942858B (en) |
| TW (1) | TWI676539B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665070B (en) * | 2016-01-22 | 2019-07-11 | 三星鑽石工業股份有限公司 | Breaking device |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49119883U (en) * | 1973-02-12 | 1974-10-14 | ||
| JPS53146185U (en) * | 1977-04-22 | 1978-11-17 | ||
| JPS6110280A (en) * | 1984-06-26 | 1986-01-17 | Nec Corp | Junction type fet |
| JPH0518075Y2 (en) * | 1987-07-27 | 1993-05-13 | ||
| JPH0215999A (en) * | 1988-06-30 | 1990-01-19 | Komatsu Ltd | Cutter blade receiving face for cutting plotter |
| US5243890A (en) * | 1992-11-03 | 1993-09-14 | Frank Ober | Cutter assembly |
| JP4249809B2 (en) * | 1997-08-07 | 2009-04-08 | 三菱電機株式会社 | Manufacturing method of semiconductor device |
| JP3625146B2 (en) * | 1999-02-09 | 2005-03-02 | 朝日松下電工株式会社 | Cutting method of resin sheet |
| JP2005199414A (en) * | 2004-01-19 | 2005-07-28 | Nippon Sheet Glass Spacia Co Ltd | Method for cutting resin plate |
| CN100428418C (en) * | 2004-02-09 | 2008-10-22 | 株式会社迪斯科 | Method for cutting wafer |
| JP2007075903A (en) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | Cutting method for sheet member |
| JP2007251098A (en) * | 2006-03-20 | 2007-09-27 | Seiko Epson Corp | Manufacturing method of semiconductor chip |
| JP2008280447A (en) * | 2007-05-11 | 2008-11-20 | Bridgestone Corp | Polyurethane foam and electroconductive roller using the same |
| JP5122911B2 (en) * | 2007-10-25 | 2013-01-16 | 株式会社ディスコ | Manufacturing method of semiconductor device |
| JP4918064B2 (en) * | 2008-05-23 | 2012-04-18 | 三星ダイヤモンド工業株式会社 | Laminate cutting method |
| JP5457014B2 (en) * | 2008-11-19 | 2014-04-02 | 三星ダイヤモンド工業株式会社 | Resin film cutting method and apparatus, and cutter used therefor |
| JP2010186879A (en) * | 2009-02-12 | 2010-08-26 | Fuji Xerox Co Ltd | Device and method for forming conductive or semiconductive film |
| JP5067457B2 (en) * | 2010-07-29 | 2012-11-07 | 三星ダイヤモンド工業株式会社 | Scribing wheel, scribing device, and scribing method |
| JP2013033801A (en) * | 2011-08-01 | 2013-02-14 | Disco Abrasive Syst Ltd | Method of cutting workpiece |
| JP5548172B2 (en) * | 2011-08-26 | 2014-07-16 | 三星ダイヤモンド工業株式会社 | Brittle material substrate breaker |
| JP5783873B2 (en) * | 2011-10-04 | 2015-09-24 | 三星ダイヤモンド工業株式会社 | Glass substrate scribing method |
-
2014
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|---|---|---|---|---|
| TWI665070B (en) * | 2016-01-22 | 2019-07-11 | 三星鑽石工業股份有限公司 | Breaking device |
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| CN104942858B (en) | 2019-11-29 |
| JP6528356B2 (en) | 2019-06-12 |
| JP2015188969A (en) | 2015-11-02 |
| TWI676539B (en) | 2019-11-11 |
| KR20150112738A (en) | 2015-10-07 |
| CN104942858A (en) | 2015-09-30 |
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