JP2020121407A - Fragmentation system for resin sheet single body - Google Patents

Abstract

To accurately fragment a resin sheet single body.SOLUTION: A resin sheet single body 33 is held on an adhesive tape 32 stuck to a dicing ring 31 and is fixed to a table 16 of a fragmentation device. A scribe head 27 is moved relative to the table 16, and a scribing wheel 28 is rolled onto the resin sheet single body 33, the resin sheet single body 33 is fragmented by scribing, and the adhesive tape 32 is pushed and expanded from an under surface, thereby separating the fragmented resin sheet single body. Thus, with the use of the scribing wheel, the resin sheet single body can be accurately fragmented into a desired shape.SELECTED DRAWING: Figure 4

Description

The present invention relates to cutting system for separating the resin sheet alone a silicone sheet or the like.

Patent Document 1 discloses a method of cutting a thermoplastic resin sheet using a cutting blade. At the time of cutting, the blade is heated and reciprocated in the biting direction of the cutting blade for cutting. Further, when cutting one resin sheet, Patent Document 2 discloses a method of cutting with two upper and lower blades in order to remove burrs at the time of cutting.

Japanese Patent Publication No. 61-10280 Japanese Patent No. 3625146

When cutting a conventional resin sheet, there is a problem that it is difficult to cut the resin sheet with high accuracy because the cutting blade is used to reciprocate in the biting direction to perform cutting. Further, in the method of cutting with the upper and lower blades, there is a problem that it is difficult to accurately match the upper and lower cutting blades.

An object of the present invention is to provide a cutting method capable of cutting a resin sheet alone with high accuracy.

In order to solve this problem, the cutting system of the resin sheet alone of the present invention is a resin sheet by holding the resin sheet alone on a table and rolling the scribing wheel by applying a load to the resin sheet alone . It divides a single body.

In order to solve this problem, the cutting system of the resin sheet simple substance of the present invention is such that the resin sheet simple substance is adhered and held on the upper surface of the adhesive tape stretched inside the frame-shaped body, and the frame-shaped body holds, divided by divided the resin sheet alone, pushing the lower surface of the adhesive tape by rolling scribing wheel with a load to the resin sheet alone held in the frame-like body on The resin sheet alone is separated.

To solve this problem, cutting system of the present invention is a cutting system used for cutting the resin sheet alone, a frame-like body holding the resin sheet alone to be scribed eligible on the adhesive tape, the A table for holding the frame-like body, a scribing head for raising and lowering a scribing wheel with respect to the resin sheet alone held on the table, and a relative moving means for relatively moving the scribing head and the table are provided. Then, a dividing device that divides the resin sheet single body by rolling the scribing wheel on the resin sheet single body, and a means for separating the resin sheet single body by spreading the adhesive tape from the lower surface, ..

Here, the resin sheet alone may be a silicone resin sheet.

Here, the scribing wheel may have a cutting edge angle of 100° or less.

According to the present invention having such a feature, divided by scribing in a state fixed on holding the resin sheet alone on the adhesive tape table, they are separated by extending the adhesive tape. Therefore, the effect that the resin sheet alone can be accurately divided into a predetermined shape is obtained.

FIG. 1 is a schematic perspective view of a cutting device according to an embodiment of the present invention. FIG. 2 is a perspective view showing details of the table and a single resin sheet held on the table. FIG. 3 is a side view showing a state in which the dicing ring is held on the table. FIG. 4 is a perspective view showing a state in which the dicing ring is held on the table. FIG. 5 is a perspective view and a side view showing a state in which the pressure-sensitive adhesive tape is pressed from below and expanded after scribing.

Next, a cutting device according to an embodiment of the present invention will be described. As shown in FIG. 1, in the cutting device 10 according to the present embodiment, a movable table 11 is held along a pair of guide rails 12a and 12b so as to be movable in the y-axis direction. The ball screw 13 is screwed onto the moving base 11. The ball screw 13 is rotated by the drive of the motor 14, and moves the moving base 11 in the y-axis direction along the guide rails 12a and 12b. A motor 15 is provided on the upper surface of the moving table 11. The motor 15 rotates the table 16 in the xy plane and positions it at a predetermined angle. As will be described later, a substrate to be scribed is placed on the table 16 and held by a vacuum suction means (not shown) or the like.

In the dividing device 10, a bridge 20 is installed by pillars 21a and 21b along the x-axis direction so as to straddle the movable table 11 and the table 16 above it. The bridge 20 is provided with a beam 22 in the lateral direction, and the beam 22 is provided with a driving unit 23. The drive unit 23 moves the slide base 24 along the x-axis direction, and is composed of a motor 25 and a feed screw 26 connected to the motor 25 and rotatably held at the center of the side surface of the beam 22. As shown in FIG. 1, a scribe head 27 is attached to the slide base 24. A tip holder is attached to the lower end of the scribe head 27. The tip holder rotatably holds a disc-shaped scribing wheel 28 at the bottom. Inside the scribing head 27, there is provided an elevating part that allows the chip holder to elevate and lower, such as an air cylinder whose air pressure is controlled and a linear motor which is electrically controlled. In this embodiment, a scribing wheel having an apex angle of 100° is used as the scribing wheel 28. The moving mechanism for the table 16 and the drive unit for moving the slide base 24 constitute relative moving means for moving the scribe head relative to the table.

2 is a perspective view showing the details of the table 16 and the resin sheet alone held on the table 16, and FIG. 3 is a side view thereof. In the present embodiment, the object of division is a silicone resin sheet, and in order to hold this sheet, a dicing ring 31 which is a ring-shaped frame body used when separating a semiconductor wafer into chips is used. .. As shown in the figure, an adhesive tape 32 having an adhesive material is attached upward inside the dicing ring 31. The adhesive tape 32 is a tape having a two-layer structure having a base material layer such as vinyl chloride and an adhesive material layer on the upper surface thereof. The base material layer has a thickness of, for example, 80 μm, the adhesive layer has a thickness of 20 μm, and the total thickness is 100 μm. Then, on the center of the upper surface of the adhesive tape 32, a resin sheet unit 33 to be divided, for example, a silicone resin sheet is attached. The resin sheet unit 33 has elasticity, and it has not been conventionally considered that the resin sheet 33 can be divided by scribe. In the present embodiment, the resin sheet unit 33 is a substantially square silicone resin sheet having a thickness of 0.005 to 1 mm, here 0.1 mm, for example. This resin sheet unit 33 is highly accurately divided into a number of square microsheets of 1×1 mm square.

A thin glass plate 34 for protection having a thickness of, for example, about 0.3 mm is placed on the table 16 of the cutting device 10 as shown in FIG. Then, the dicing ring 31 is arranged on the table 16 so that the resin sheet unit 33 is located above the glass plate 34. Then, the resin sheet unit 33 is held from below the table 16 by a vacuum suction means or the like (not shown). Then, since the lower surface of the adhesive tape 32 is adsorbed as shown in FIG. 3, the glass plate 34, the adhesive tape 32, and the resin sheet unit 33 on the upper surface thereof can be held on the table 16.

Next, a method of dividing the resin sheet 33 will be described. First, the slide base 24 and the table 16 are moved so that the resin sheet unit 33 is located immediately below the scribing wheel 28. Then, the scribing head 27 is lowered so that the scribing wheel 28 reaches a position slightly outside the upper surface of the resin sheet single body 33 on the outside of the resin sheet single body 33. By moving the slide base 24 in the x-axis direction in this state, the scribing wheel 28 can be rolled and scribed while applying a load to the resin sheet single body 33. By doing so, the resin sheet simple substance 33 such as a silicone resin can be divided by scribing.

Next, the scribe head 27 is raised, the table 16 is slightly moved in the y-axis direction at a predetermined pitch, the scribe head 27 is lowered, and the scribing wheel 28 is further moved in the x-axis direction along the beam 22. Repeat scribe in the same way. When all the scribing is completed in the x-axis direction, the table 16 is rotated by the motor 15 to change the cutting direction, and the scribing is repeated in the same manner. Then, by rotating and rolling the scribing wheel from above, the resin sheet unit 33 is divided into a lattice shape as shown in FIG.

Then, as shown in FIGS. 5A and 5B, the dicing ring 31 and the resin sheet single body 33 above the table 16 are removed from the table 16, and the adhesive tape 32 is held from the lower part in the center while holding the dicing ring 31. As shown in (b), the push-up member 35 is used to push up from below. At this time, a wafer expansion device may be used. In this way, the adhesive tape 32 is spread and the already divided square-shaped resin pieces are separated on the adhesive tape 32, individualization can be confirmed, and each chip can be easily taken out.

In this embodiment, since the adhesive tape is stretched around the annular dicing ring and the resin sheet alone is adhered and held on the upper portion thereof, the resin sheet alone can be easily handled. Even after the division, the separated resin piece can be easily taken out by pushing up the adhesive tape. Thus the dicing ring to be used in the semiconductor manufacturing process can be effectively utilized for cutting the resin sheet alone.

In this embodiment, the resin sheet simple substance to be divided is explained as a sheet made of a silicone resin, but the present invention is similarly applied to another resin sheet simple substance , for example, a urethane resin sheet. be able to.

In this embodiment, a thin glass plate 34 is placed on the table 16 and the resin sheet unit 33 stretched in the dicing ring 31 is held thereon, but the glass plate 34 simply protects the table 16. Therefore, it is not always necessary to use it.

In this embodiment, a wheel having an apex angle of 100° is used as the scribing wheel, but a scribing wheel having a smaller apex angle may be used. The larger the apex angle, the longer the life of the scribing wheel, but the smaller the apex angle, the greater the accuracy. For example the apex angle can be divided resin sheet alone by scribing in the same manner by using a scribing wheel 30 °. Therefore, within the range of at least 30 to 100°, the scribing wheel having any apex angle can be used to divide the resin sheet alone .

Further, in this embodiment, the resin sheet alone is held on the adhesive tape stretched on the frame-shaped dicing ring, but a frame-shaped body is sufficient, and the invention is not limited to the dicing ring. Further, the resin sheet alone can be divided by holding the resin sheet alone on the table and scribing without using the frame-shaped body.

Since the present invention can accurately separate the resin sheet alone using cutting device is suitable for cutting apparatus to precisely divide the resin sheet alone.

10 Cutting device 14, 15, 25 Motor 16 Table 24 Slide base 26 Feed screw 27 Scribing head 28 Scribing wheel 31 Dicing ring 32 Adhesive tape 33 Resin sheet alone 34 Glass plate

Claims (3)

A cutting system used for cutting a resin sheet alone ,
Wherein the table holding the frame-shaped body holding the resin sheet alone to be scribed eligible on the adhesive tape, and the scribing head raising and lowering the scribing wheel against the resin sheet alone, which is held on the table, and the scribing head A relative movement means for relatively moving the table, and a dividing device that divides the resin sheet single body by rolling the scribing wheel on the resin sheet single body, and spreads the adhesive tape from the lower surface. means for separating the resin sheet alone by,
A cutting system for a single resin sheet. 2. The cutting system according to claim 1, wherein the cutting device includes a table protection plate placed on the table, and the resin sheet single body is a resin sheet single body held on the table protection plate . The cutting system according to claim 1 or 2, wherein the scribing wheel has a cutting edge angle of 100° or less.