CN105479020B - Engage the cutting method of substrate - Google Patents
Engage the cutting method of substrate Download PDFInfo
- Publication number
- CN105479020B CN105479020B CN201510641537.0A CN201510641537A CN105479020B CN 105479020 B CN105479020 B CN 105479020B CN 201510641537 A CN201510641537 A CN 201510641537A CN 105479020 B CN105479020 B CN 105479020B
- Authority
- CN
- China
- Prior art keywords
- glass portion
- sealing
- cutting
- cutting line
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H7/00—Marking-out or setting-out work
- B25H7/04—Devices, e.g. scribers, for marking
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention relates to a kind of cutting methods for engaging substrate, when crossing to engagement substrate etc., the useless dummy portions that the substrate for being formed with sealing can not only be removed make it narrow to the maximum extent, cut surface can also be made to smoothly carry out cutting, in for the cutting method to the engagement substrate (10) cut on the sealing (20) between the top glass portion (11a) and bottom glass portion (11b) for being formed in engagement substrate (10), comprising with the next stage: irradiating laser to the position that at least one of top glass portion (11a) and bottom glass portion (11b) are contacted with sealing (20), cutting line (13a is formed in the inner surface side of at least one of top glass portion (11a) and bottom glass portion (11b), 13b)；And stitch marker (70) are utilized, it crosses along cutting line (13a, 13b) at least one of top glass portion (11a) and bottom glass portion (11b)；Thus have the effect of being capable of forming beautiful cut surface.
Description
Technical field
The present invention relates to a kind of cutting methods for engaging substrate, in more detail, utilize laser pair the present invention relates to a kind of
When crystal liquid substrate etc. carries out scribing line cutting, the nonuseable part that can not only minimize substrate is formed with the void of sealant
If portion, and the cutting method of the engagement substrate of smooth cut surface can be obtained.
Background technique
In general, in the past when crystal liquid substrate is cut, the nonuseable part of cutting substrate is formed with the illusory of sealant
When portion, only cut using stitch marker.
Specifically, general crystal liquid substrate is between top glass portion and bottom glass portion after filling liquid crystal layer,
The frame portion point for encasing liquid crystal layer with sealant (sealing layer) in such a way that liquid crystal layer is not to external leakage is close to carry out
Envelope.
That is, this construction is to be attached to sealant in the mutual opposite surface in top glass portion and bottom glass portion, with liquid crystal
Layer does not flow to external mode and is sealed between them.
In addition, in order to improve leakproofness, selection makes the sealant sealed as described towards the wider width of base plan
The structure that ground is formed.
Moreover, actual conditions are, because of the sealant formed as described with larger width, the frame portion subpackage of crystal liquid substrate
Containing the sealant with larger width, can be used in the state that frame size is big at present, or in order to reduce frame size and
The outer peripheral portion of sealant is cut to form featheredge frame.
But also have the case where crystal liquid substrate flat against one another is linked and used recently, in the case, there is display
The rough problem of image at outer peripheral portion position connected to each other when image in sealant.
Therefore, in order to can solve problem as described above, and amplitude peak cut crystal liquid substrate sealant width,
It is deeply cut to the sealant of crystal liquid substrate using stitch marker.
But sealant has the brittleness as rubber, therefore using stitch marker to the sealant of crystal liquid substrate
When being crossed, it may appear that following problems will lose linearity or can not if touching more crisp sealant when scribing line
It moves along scribing line and is migrated towards other directions, it is bad that substrate substrate occurs when cutting off.
Especially, in the existing upper and lower scribing line wheel mode for crossing to engagement substrate, actual conditions are also to produce
Raw following problems: cutting is difficult to the sealing being deep between the top glass portion and bottom glass portion for being located at and constituting engagement substrate
Layer, even if after the completion of the scribing line operation of stitch marker, also remaining a part of sealant and incomplete cutting sealing layer, glass portion be not complete
It is fully separating.
In addition, actual conditions are to there is also following problems: the linearity decline of stitch marker due to sealant, it can not be with institute
Degree is needed to remove illusory portion from crystal liquid substrate, and the section of crystal liquid substrate is because sealant is without even surface, so that necessary
Discarded defective products increases.
In addition, making the mutual frame contact of multiple crystal liquid substrate plane earths recently and showing the image device on sale of large screen not
It is disconnected to increase, the other portions that can be shown other than the liquid crystal layer of picture in the frame for making crystal liquid substrate are just actively studied in the case
Divide, such as sealant becomes minimum.
Summary of the invention
[problem to be solved by the invention]
Therefore, the present invention is created to solve existing issue, and its purpose is to provide a kind of cutting for engagement substrate
Segmentation method can not only reduce base when the engagement substrate such as crystal liquid substrate being crossed and cut using laser to the maximum extent
The useless illusory portion of plate, additionally it is possible to obtain smooth cut surface.
[technical means to solve problem]
The cutting method for the engagement substrate that one embodiment of the present invention is related to is used for the top for being formed in engagement substrate
Cut on sealing between glass portion and bottom glass portion, and include with the next stage: to the top glass portion and under
Laser is irradiated in the position that at least one of portion's glass portion is contacted with the sealing, in the top glass portion and bottom glass portion
The inner surface side of at least one formed cutting line；And utilize stitch marker, along the cutting line to the glass portion and under
At least one of portion's glass portion is crossed.
In addition, in the stage for forming the cutting line, it can be in the top glass portion contacted with the sealing
And the inner surface side in bottom glass portion forms the cutting line, and in the scribing line stage, it can be to the top glass portion
And bottom glass portion crosses.
In addition, in the stage for forming the cutting line, it can be in the top glass portion contacted with the sealing
And the inner surface side in either one or two of bottom glass portion forms the cutting line, and in the scribing line stage, it can be to being formed with
The bottom glass portion or top glass of the top glass portion of the cutting line or bottom glass portion and opposite opposite side
Glass portion crosses.
In addition, also may include with the next stage: after the scribing line stage, along the cutting line, using disconnect roller or
Item is disconnected to turn off.
[invention effect]
According to the present invention, it has the effect that when being cut on the sealant to the engagement substrate with sealant, no
's sealant as cutting part can only be easily separated, additionally it is possible to form beautiful cut surface.
Detailed description of the invention
Fig. 1 is the figure for indicating the plane of general engagement substrate.
Fig. 2 is to form cutting line using laser in the cutting method of engagement substrate for indicate one embodiment of the present invention
Stage figure.
Fig. 3 is to indicate in the cutting method of the engagement substrate of one embodiment of the present invention, forms benefit after cutting line
With the figure in the stage that stitch marker is crossed.
Fig. 4 is to indicate in the cutting method of the engagement substrate of one embodiment of the present invention, is drawn to engagement substrate
The figure in the section cut after line.
Fig. 5 is formed and is cut using laser in the cutting method of engagement substrate for indicate another embodiment of the present invention
The figure of line.
Fig. 6 is the figure for indicating the stage crossed after the cutting line of Fig. 5 is formed using stitch marker.
Fig. 7 is the figure in the section of cut engagement substrate after indicating to cross in Fig. 6.
Specific embodiment
Referring to attached drawing, the cutting method of the engagement substrate of one embodiment of the present invention is illustrated.
As shown in Figures 1 and 2, the engagement substrate 10 of present embodiment includes top glass portion 11a and bottom glass portion
11b is formed with the liquid crystal portion 30 of display image between the top glass portion 11a and bottom glass portion 11b.Moreover, with institute
Liquid crystal portion 30 is stated not to the mode of the external leakage of engagement substrate 10, is carried out using periphery of the sealing 20 to liquid crystal portion 30 close
Envelope.
The frame portion of engagement substrate 10 through the sealing 20 sealing, exists to form top glass portion 11a and bottom glass
It is the illusory portion 14 of nonuseable part when portion 11b.It is equivalent to the top glass portion 11a and bottom glass portion 11b in this illusory portion 14
Frame portion between also include sealing 20.
Illusory portion 14 positioned at the frame side of the engagement substrate 10 preferably minimizes its size, passes through engagement to improve
The area of substrate 10 is come the quality of the image shown.Therefore, shown in part A as shown in Figure 1, cutting is formed along the direction of the arrow
When having the illusory portion 14 of sealing 20, it is necessary to make 14 minimum limit of sealing 20 and illusory portion in the range of no leakage in liquid crystal portion
Cut to residual.
For this purpose, in the cutting method of the engagement substrate of present embodiment, first as shown in Fig. 2, on engagement substrate 10
A laser 1 is irradiated, the depths of the thickness of top glass portion 11a and bottom glass portion 11b is infiltrated into, is contacted with sealing 20
Top glass portion 11a and bottom glass portion 11b formed cutting line 13a, 13b.
That is, the cutting line 13a of top glass portion 11a and the cutting line 13b of bottom glass portion 11b are respectively formed at, with shape
At the position of the inner surface of the top glass portion 11a of the contact of sealing 20 between top glass portion 11a and bottom glass portion 11b
Set on the position of the inner surface of bottom glass portion 11b.
Then, inner surface side and bottom glass portion using laser, in the top glass portion 11a contacted with sealing 20
The inner surface side of 11b when being respectively formed cutting line 13a and cutting line 13b, is formed with the position periphery of cutting line 13a, 13b
Sealing 20 is also contained in the region that stimulated light irradiation influences, and thus has the hardening of sealing 20 compared with brittleness matter and becomes to hold
The property easily cut.
That is, being glued in order to when top glass portion 11a and bottom glass portion 11b formation cutting line 13a, 13b irradiates laser
20 20 harden(ing)by itself of sealing by influence of laser irradiation of sealing between engagement substrate 10 is tied, becomes frangible or easy
The physical property of cutting.
In this way, using laser formed top glass portion 11a cutting line 13a and bottom glass portion 11b cutting line 13b it
Afterwards, as shown in Figures 3 and 4, using stitch marker 70, along the cutting line 13a of top glass portion 11a and bottom glass portion 11b,
13b, until scribing line is formed with the depths of thickness of sealing 20 to the thickness of each glass portion, i.e..
In this way, using laser formed top glass portion 11a cutting line 13a and bottom glass portion 11b cutting line 13b it
Afterwards, when being crossed using stitch marker along cutting line 13a, 13b, the periphery institute of preformed described cutting line 13a, 13b
The sealing 20 of bonding hardens in advance because of laser, in the state cut, frangible property is promoted, therefore can be with good section
Face quality easily cuts top glass portion 11a and bottom glass portion 11b.
In addition, sealing 20, which is also contained in, is excited when using laser irradiation top glass portion 11a and bottom glass portion 11b
The irradiation area that shadow is rung, thus sealing 20 hardens and itself cohesive force weakens, and mutual tensile stress is reduced, when stitch marker 70 migrates
Direction will not change because of sealing 20, the linearity of stitch marker 70 can be assigned.
On the other hand, it can also follow the steps below certainly: using stitch marker 70, to top glass portion 11a and lower part glass
After glass portion 11b is crossed, substrate disconnection will be engaged using disconnecting roller or disconnecting item.
Hereinafter, illustrating another embodiment of the present invention referring to Fig. 5 to Fig. 7.
It in another embodiment of the present invention, is to be irradiated on substrate 10 to engaging with the embodiment difference
Laser 1, in the inner surface side of the top glass portion 11a and any of bottom glass portion 11b that are contacted with sealing 20
Form cutting line 13a.
It indicates to form cutting line 13a in the position of the inner surface of the top glass portion 11a contacted with sealing 20 in Fig. 5.
It is formed with by this method using laser in the case where the inner surface side of top glass portion 11a forms cutting line 13a
The sealing 20 on the position periphery of cutting line 13a is also contained in the region of stimulated light influence, and thus sealing 20 hardens and physical property
Become the property easily cut.
Then, after the cutting line 13a for forming top glass portion 11a using laser as described, as shown in fig. 6,
On the glass portion i.e. bottom glass portion 11b of the opposite side with the glass portion opposite direction for being formed with cutting line 13a, stitch marker 70 is utilized
Migrated along the cutting line 13a, cross to bottom glass portion 11b thickness, i.e. be formed with sealing 20 joint surface depth
Until degree.
That is, in another embodiment of the present invention, being cut along the cutting line 13a to being formed with using stitch marker 70
The opposite side of the top glass portion 11a of secant 13a, that is, bottom glass portion 11b crosses.Then, the week of the cutting line 13a
The sealing 20 that side is bonded is hardened by influence of laser irradiation, becomes the physical property with easy incision or frangible property, because
This in another embodiment of the present invention, only crossed to bottom glass portion 11b just can easily cut comprising sealing
The engagement substrate in portion 20.
In addition, can also be followed the steps below certainly to realize more complete cutting: utilizing 70 scribing line of stitch marker
Afterwards, it using disconnecting roller or disconnecting item to the engagement application impact of substrate 1, thus turns off.
In addition, in another embodiment of the present invention, opposite with the top glass portion 11a that is formed with cutting line 13a
Bottom glass portion 11b on crossed using stitch marker 70, but can also be in the top glass portion for being formed with cutting line 13a
It is crossed on 11a using stitch marker 70.
[symbol description]
1 laser
10 engagement substrates
11a top glass portion
11b bottom glass portion
13a, 13b cutting line
20 sealings
30 liquid crystal portions
70 stitch markers
Claims (4)
1. a kind of cutting method for engaging substrate is for being formed in the top glass portion (11a) for engaging substrate (10) under
The cutting method of the engagement substrate (10) cut on sealing (20) between portion's glass portion (11b), it is characterised in that packet
Containing with the next stage:
The position that at least one of the top glass portion (11a) and bottom glass portion (11b) are contacted with the sealing (20)
Irradiation laser is set, is formed and is cut in the inner surface side of at least one of the top glass portion (11a) and bottom glass portion (11b)
Line (13a, 13b)；And
Using stitch marker (70), along the cutting line (13a, 13b), to the top glass portion (11a) and bottom glass portion
At least one of (11b) is crossed；
When forming cutting line (13a, 13b), the irradiation of sealing (20) stimulated light influences and hardens and become the property for being easy incision
Matter.
2. the cutting method of engagement substrate according to claim 1, it is characterised in that: formed the cutting line (13a,
In stage 13b), in the interior of the top glass portion (11a) and bottom glass portion (11b) contacted with the sealing (20)
Surface side forms the cutting line (13a, 13b),
In the scribing line stage, cross to the top glass portion (11a) and bottom glass portion (11b).
3. the cutting method of engagement substrate according to claim 1, it is characterised in that: formed the cutting line (13a,
In stage 13b), in appointing for the top glass portion (11a) and bottom glass portion (11b) contacted with the sealing (20)
One inner surface side forms the cutting line,
In the scribing line stage, to the top glass portion (11a) or bottom glass portion (11b) for being formed with the cutting line
It crosses with the bottom glass portion (11b) of opposite opposite side or top glass portion (11a).
4. the cutting method of engagement substrate according to any one of claim 1 to 3, it is characterised in that: also comprising following
Stage, that is, after the scribing line stage, along the cutting line (13a, 13b), broken using disconnecting roller or disconnecting item
It opens.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140134231A KR101623026B1 (en) | 2014-10-06 | 2014-10-06 | Method for cutting of bonded substrate |
| KR10-2014-0134231 | 2014-10-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105479020A CN105479020A (en) | 2016-04-13 |
| CN105479020B true CN105479020B (en) | 2019-10-18 |
Family
ID=55666479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510641537.0A Expired - Fee Related CN105479020B (en) | 2014-10-06 | 2015-09-30 | Engage the cutting method of substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6565544B2 (en) |
| KR (1) | KR101623026B1 (en) |
| CN (1) | CN105479020B (en) |
| TW (1) | TWI671267B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7020660B2 (en) * | 2016-11-29 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | Brittle material Substrate fragmentation method and fragmentation device |
| KR102633196B1 (en) * | 2016-12-01 | 2024-02-05 | 주식회사 탑 엔지니어링 | Scribing apparatus and scribing method |
| WO2018131602A1 (en) * | 2017-01-10 | 2018-07-19 | 大日本印刷株式会社 | Light control cell, light control member, moving body and method for producing light control cell |
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| CN1621895A (en) * | 2003-11-29 | 2005-06-01 | Lg.菲利浦Lcd株式会社 | Method for cutting liquid crystal display panel |
| CN101844275A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Method for dividing substrate |
| CN102067017A (en) * | 2008-09-12 | 2011-05-18 | 夏普株式会社 | Method of manufacturing display panel |
| CN103779200A (en) * | 2012-10-25 | 2014-05-07 | 三星钻石工业股份有限公司 | Breaking method for lamination ceramic substrate |
| CN103819082A (en) * | 2014-02-20 | 2014-05-28 | 北京京东方光电科技有限公司 | Cutting method of liquid crystal panel, and liquid crystal panel |
| CN104028898A (en) * | 2014-05-23 | 2014-09-10 | 广东工业大学 | Machining method and device for laser forming cutting of sapphire substrate |
| TW201435434A (en) * | 2013-03-05 | 2014-09-16 | hui-xin Sun | Cutting and reproducing method of liquid crystal panel module |
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| JP2003215551A (en) * | 2002-01-28 | 2003-07-30 | Matsushita Electric Ind Co Ltd | Manufacturing method of liquid crystal display |
| JP2007137699A (en) * | 2005-11-16 | 2007-06-07 | Epson Imaging Devices Corp | Cutting method for glass substrate |
| CN101131519A (en) * | 2006-08-24 | 2008-02-27 | 精工爱普生株式会社 | Circuit board for electro-optical device, electro-optical device, and electronic apparatus |
| JP5299730B2 (en) * | 2006-10-13 | 2013-09-25 | Ｎｌｔテクノロジー株式会社 | Display device |
| JP2008276057A (en) | 2007-05-02 | 2008-11-13 | Active Inc | Method for processing transparent electrode film of liquid crystal display device |
| JP2009006334A (en) * | 2007-06-26 | 2009-01-15 | Seiko Epson Corp | Laser beam machining method and laser beam irradiating apparatus |
| WO2010044217A1 (en) * | 2008-10-17 | 2010-04-22 | 株式会社リンクスタージャパン | Method for cutting mother glass substrate for display and brittle material substrate and method for manufacturing display |
| KR101818449B1 (en) * | 2010-12-15 | 2018-01-16 | 엘지디스플레이 주식회사 | Method of cutting liquid crystal display panel and fabricating liquid crystal display device |
| JP2014048432A (en) * | 2012-08-31 | 2014-03-17 | Mitsuboshi Diamond Industrial Co Ltd | Processing method of cell substrate |
| JP5648160B2 (en) * | 2013-04-05 | 2015-01-07 | Ｔｏｗａ株式会社 | Processing apparatus and processing method |
-
2014
- 2014-10-06 KR KR1020140134231A patent/KR101623026B1/en active IP Right Grant
-
2015
- 2015-09-25 JP JP2015188717A patent/JP6565544B2/en not_active Expired - Fee Related
- 2015-09-30 CN CN201510641537.0A patent/CN105479020B/en not_active Expired - Fee Related
- 2015-10-01 TW TW104132440A patent/TWI671267B/en not_active IP Right Cessation
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1621895A (en) * | 2003-11-29 | 2005-06-01 | Lg.菲利浦Lcd株式会社 | Method for cutting liquid crystal display panel |
| CN102067017A (en) * | 2008-09-12 | 2011-05-18 | 夏普株式会社 | Method of manufacturing display panel |
| CN101844275A (en) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | Method for dividing substrate |
| CN103779200A (en) * | 2012-10-25 | 2014-05-07 | 三星钻石工业股份有限公司 | Breaking method for lamination ceramic substrate |
| TW201435434A (en) * | 2013-03-05 | 2014-09-16 | hui-xin Sun | Cutting and reproducing method of liquid crystal panel module |
| CN103819082A (en) * | 2014-02-20 | 2014-05-28 | 北京京东方光电科技有限公司 | Cutting method of liquid crystal panel, and liquid crystal panel |
| CN104028898A (en) * | 2014-05-23 | 2014-09-10 | 广东工业大学 | Machining method and device for laser forming cutting of sapphire substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105479020A (en) | 2016-04-13 |
| JP2016074583A (en) | 2016-05-12 |
| TWI671267B (en) | 2019-09-11 |
| KR101623026B1 (en) | 2016-05-20 |
| JP6565544B2 (en) | 2019-08-28 |
| KR20160040825A (en) | 2016-04-15 |
| TW201619080A (en) | 2016-06-01 |
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