CN109003915A - Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique - Google Patents
Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique Download PDFInfo
- Publication number
- CN109003915A CN109003915A CN201810646020.4A CN201810646020A CN109003915A CN 109003915 A CN109003915 A CN 109003915A CN 201810646020 A CN201810646020 A CN 201810646020A CN 109003915 A CN109003915 A CN 109003915A
- Authority
- CN
- China
- Prior art keywords
- pallet
- sheet
- material sheet
- bubble
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique, including flat air bag (1), pallet (2), adhesive sheet (3), material sheet (4), heating platform (5), vacuum evacuation device (6) and closed cavity (7) the invention discloses a kind of.Technique is to carry out the pallet on pedestal to be heated to 80 ~ 100 DEG C first, and heat transfer to material sheet, paraffin thin slice and pallet, the paraffin thin slice between being allowed to melt；Then, compress material sheet and pallet well the vacuum action of chamber interior using vacuum pump apparatus；When being spent to certain vacuum, flat air bag is inflated, is pressurizeed to material sheet, paraffin thin slice and pallet, is filled outward after making the intermediate olefin material being melted along material sheet, cool down Slow cooling.It can make in subsequent reduction process in this way, material sheet uniform force, reduce fragment, while other viscous glutinous technological operations that compare are simple, it is at low cost.
Description
Technical field
It is especially a kind of by very thin friable material and smooth pallet bubble-free the invention belongs to technical field of semiconductors
Glue glutinous equipment and technique.
Background technique
In field of semiconductor processing, wafer level semiconductor material or smaller incomplete semiconductor crystal wafer, corresponding
Front process after, require to carry out back thinning technique piece be thinned to very thin thickness.It is good thinned in order to realize,
It usually requires through all kinds of bonding methods, wafer thin slice is so good that be fixed on and set off.In general, can be by semiconductor die roundwood
Expect thin slice and a hard and the material pallet of smooth surface passes through Electrostatic Absorption, viscous and glue (such as special photoresist), light
The methods of quick adhesive tape, high temperature failure adhesive tape or paraffin will consolidate between the two and the bonding of uniform ground.
The wherein method of Electrostatic Absorption, it is at high cost and easily cause material sheet adsorb and dissociate pallet when by
Big stress and be crushed, in addition, causing material there is also occurring the phenomenon that electrostatic force does not completely eliminate during desorption
Expect the discontinuity of thin slice, and equipment cost is high.Bonding agent scheme is numerous, and dedicated lysate is needed to carry out separation solution key
It closes；And use photosensitive or high temperature failure adhesive tape method, easily occur in viscous adhesive tape out-of-flatness and material sheet and
Sticking between adhesive tape or pallet is uneven, increases fragment rate.And solid-state thin slice paraffin is used to make viscous glutinous agent, if choose
Paraffin thickness is too big, is easy to appear during viscous glutinous and makes due to dissolving the uneven wax that partially lacks in solid paraffin course of dissolution
At bubble and hole, if the paraffin sheet thickness chosen is too thin, will appear it is viscous stick insecure, the phenomenon that edge lacks wax,
There is greatly adverse effect to subsequent reduction process.Furthermore if primary property is viscous on a pallet sticks a few sheet material thin slices,
The bubble and hole being then easier inside occurring.Thin slice with bubble is easy to break during bottom sheet, forms massive losses.
Summary of the invention
Easily there is edge the technical problem to be solved by the present invention is to existing pallet attachment sheet technique and lacks wax, bubble and hole
Phenomenon is serious, fragment rate and technical problem at high cost, to provide very thin friable material and smooth pallet bubble-free
Glue glutinous equipment and technique.The present invention makees adhesive using low temperature paraffin thin slice, during material sheet and pallet are viscous glutinous
Not only wax can be lacked to avoid edge but also can subtract least a portion of bubble and hole phenomenon.Material sheet can be additionally reduced to be detached from
With the stress condition in transfer process, fragment rate is significantly reduced, and easy to operate, it is low in cost.
In order to solve the above technical problems, the technical solution adopted in the present invention is as follows:
It is a kind of that very thin friable material and smooth pallet bubble-free are glued into glutinous equipment, including flat air bag, pallet, binder
Thin slice, material sheet, heating platform, vacuum evacuation device and closed cavity；Flat air bag is mounted on closed cavity top and external
Air compressor machine；Heating platform is mounted on closed cavity lower end, is equipped with pallet in heating platform upper surface, is provided at least on pallet
One adhesive sheet, is placed with a material sheet on each adhesive sheet, and vacuum evacuation device is mounted on closed cavity
Side.
The planar dimension of the flat air bag bottom be greater than pallet size, and the material of flat air bag can be rubber or
Other suitable materials.This flat air bag and the heating platform of inside can be the various shapes such as triangle, rectangle, ellipse
Shape；And heating platform can be other materials such as stainless steel, ceramics, quartz.
Mark line for determining material sheet position or raised important actor or groove, material are provided on the pallet
Material can be other hard smooth materials such as smooth glass, sapphire, and it is various that shape can be triangle, rectangle, ellipse etc.
Shape.
The material sheet is III-V group semi-conductor material, for example the substrates such as InP, GaAs, InGaAs or extension material
Material.
It is a kind of that very thin friable material and smooth pallet bubble-free are glued into glutinous technique, it is to carry out heating platform first
Heating, heating temperature change in the range of 80 ~ 100 DEG C depending on the size of hot material to be added and the difference of binder；Heating passes
It is directed at pallet, adhesive sheet and material sheet, the adhesive sheet between pallet and material sheet melts；Followed by flat
Air bag is inflated, and flat air bag pressurizes to material sheet, adhesive sheet and pallet, makes the adhesive sheet edge melted
Material sheet fill outward；It is vacuum evacuation device again to the vacuum action inside closed cavity, makes material sheet and support
Disk compresses well；Finally after completing the viscous glutinous technique inside closed cavity, with liquid adhesive to pallet and material sheet
Between unfilled peripheral gap carry out secondary bonding.
Vacuum evacuation device is to the vacuum action inside closed cavity, and vacuum degree is in negative 0.12mbar.
The pressure that flat air bag adds material sheet, adhesive sheet and pallet is big by adhesive sheet and material sheet
Depending on small.Pressure is different with adhesive sheet depending on the size of material sheet and change usually in 2bar.
The adhesive sheet is paraffin thin slice, can be the various shapes such as triangle, rectangle, ellipse；The paraffin
Thin slice is the paraffin of single sheet paraffin or paraffin-paraffin paper-paraffin sandwich sheet combination or material sheet spin coating production
Overlay.
Moreover, the pressurization of flat air bag, heating platform and vacuum pumping in the present invention, the parametric interaction shadow of three
It rings.
The present invention is pressed using air bag and material sheet and pallet is sticked together by binders such as the paraffin of thawing, and
Under the cooperation of evacuator, the bubble and hole during viscous glutinous can be substantially reduced, is made viscous glutinous more smooth.The present invention
Design is simple, low, easy to operate, the visual concrete condition of preparation cost optimizes and flexibly improves.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of present device.
Fig. 2 is the schematic diagram of the invention glued during sticking.
Fig. 3 is the birds-eye perspective of pallet, paraffin thin slice, material sheet.
Fig. 4 is that the primary multi-disc that carries out glues glutinous birds-eye perspective.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under that premise of not paying creative labor
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1: as shown in Figure 1, a kind of glue glutinous equipment, packet for very thin friable material and smooth pallet bubble-free
Include flat air bag 1, pallet 2, adhesive sheet 3, material sheet 4, heating platform 5, vacuum evacuation device 6 and closed cavity 7；It is described
Material sheet is III-V group semi-conductor material, for example the substrates such as InP, GaAs, InGaAs or epitaxial material.
Flat air bag 1 is mounted on 7 top of closed cavity and external air compressor machine；Heating platform 5 is mounted under closed cavity 7
End, is equipped with pallet 2 in 5 upper surface of heating platform, at least one adhesive sheet 3 is provided on pallet 2, in each binder
A material sheet 4 is placed on thin slice 3, vacuum evacuation device 6 is mounted on 7 side of closed cavity.
The planar dimension of 1 bottom of flat air bag is greater than the size of pallet 2, and the material of flat air bag can be rubber
Or other suitable materials.It is each that this flat air bag 1 and the heating platform 5 of inside can be triangle, rectangle, ellipse etc.
Kind shape；And heating platform can be other materials such as stainless steel, ceramics, quartz.
Mark line for determining material sheet position or raised important actor or groove are provided on the pallet 2,
Material can be other hard smooth materials such as smooth glass, sapphire, and it is each that shape can be triangle, rectangle, ellipse etc.
Kind shape.
The pallet, which can be, only adheres to a material sheet, and the specific structure is shown in FIG. 3, can also adhere to simultaneously multiple
Material sheet, it is specific as shown in Figure 4.
Embodiment 2: it is a kind of that very thin friable material and smooth pallet bubble-free are glued into glutinous technique, it is that will heat first
Platform 5 is heated, and heating temperature changes in the range of 80 ~ 100 DEG C depending on the size of hot material to be added and the difference of binder
Become；To pallet 2, adhesive sheet 3 and material sheet 4, the adhesive sheet 3 between pallet 2 and material sheet 4 melts heat transfer
Change；Followed by flat air bag 1 is inflated, flat air bag 1 pressurizes to material sheet 4, adhesive sheet 3 and pallet 2,
Fill the adhesive sheet 3 melted outward along material sheet 4, as shown in Figure 2；It is vacuum evacuation device 6 again to closing chamber
The vacuum action in internal portion compresses material sheet 4 and pallet 2 well；It is finally viscous glutinous inside completion closed cavity
After technique, secondary bonding is carried out to the unfilled peripheral gap between pallet 2 and material sheet 4 with liquid adhesive.
Vacuum evacuation device 6 is to the vacuum action inside closed cavity, and vacuum degree is in negative 0.12mbar.
The pressure that flat air bag 1 adds material sheet 4, adhesive sheet 3 and pallet 2 is by adhesive sheet 3 and material
Depending on 4 size of thin slice.Pressure is different with adhesive sheet depending on the size of material sheet 4 and change usually in 2bar.
The adhesive sheet 3 is paraffin thin slice, can be the various shapes such as triangle, rectangle, ellipse；The paraffin
Thin slice is the paraffin of single sheet paraffin or paraffin-paraffin paper-paraffin sandwich sheet combination or material sheet spin coating production
Overlay.
Moreover, the pressurization of flat air bag, heating platform and vacuum pumping in the present invention, the parametric interaction shadow of three
It rings.
The present invention is told about by the process flow of the material to disposable viscous glutinous three pieces material sheet, and support holder structure is such as
Shown in Fig. 4, to illustrate its specific working principle.There are the label determined to material sheet position or small protrusion on pallet
It is used as detent on important actor, paraffin thin slice and material sheet to be glued is fixed on specific position respectively and move it into vacuum
Chamber.There are following several effects during viscous glutinous while being applied on material sheet, paraffin thin slice and pallet, to ensure
The viscous of uniform and smooth bubble-free sticks.
It is to heat heating platform 5 first, heat transfer to material sheet, paraffin thin slice and pallet, between being allowed to
Paraffin thin slice melt；Followed by flat air bag 1 is inflated, is pressurizeed to material sheet, paraffin thin slice and pallet,
It is filled outward after making the intermediate olefin material being melted along material sheet.There are also vacuum pump apparatus to vacuumize chamber interior
Effect, during vacuumizing, chamber interior compresses material sheet and pallet well due to the effect that vacuumizes,
Flow the paraffin melted gradually to the periphery, until the gap between packing material thin slice and pallet.It completes in chamber
After the viscous glutinous technique in portion, the unfilled peripheral gap between pallet and material sheet can also be carried out with liquid paraffin secondary
Wax is mended, can be made in subsequent reduction process in this way, material sheet uniform force, fragment is reduced, while comparing that other are viscous glutinous
Technological operation is simple, at low cost.
Described is only presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of glue glutinous equipment for very thin friable material and smooth pallet bubble-free, it is characterised in that: including flat gas
Capsule (1), pallet (2), adhesive sheet (3), material sheet (4), heating platform (5), vacuum evacuation device (6) and closed cavity
(7)；Flat air bag (1) is mounted on closed cavity (7) top and external air compressor machine；Heating platform (5) is mounted on closed cavity (7)
Lower end is equipped with pallet (2) in heating platform (5) upper surface, at least one adhesive sheet (3) is provided on pallet (2),
A material sheet (4) is placed on each adhesive sheet (3), vacuum evacuation device (6) is mounted on closed cavity (7) side.
2. according to claim 1 glue glutinous equipment, feature for very thin friable material and smooth pallet bubble-free
Be: the planar dimension of flat air bag (1) bottom is greater than the size of pallet (2).
3. according to claim 1 glue glutinous equipment, feature for very thin friable material and smooth pallet bubble-free
It is: is provided with mark line for determining material sheet position or raised important actor or groove on the pallet (2).
4. according to claim 1 glue glutinous equipment, feature for very thin friable material and smooth pallet bubble-free
Be: the material sheet is III-V group semi-conductor material.
5. a kind of glue glutinous technique for very thin friable material and smooth pallet bubble-free, it is characterised in that: be that will add first
Hot platform (5) is heated, heat transfer to pallet (2), adhesive sheet (3) and material sheet (4), pallet (2) and material
Adhesive sheet (3) between thin slice (4) melts；Followed by flat air bag (1) is inflated, flat air bag (1) is to material
Thin slice (4), adhesive sheet (3) and pallet (2) pressurize, make melt adhesive sheet (3) along material sheet (4) to
Outer filling；It is vacuum evacuation device (6) again to the vacuum action inside closed cavity, makes material sheet (4) and pallet (2) very
Good compression；Finally after completing the viscous glutinous technique inside closed cavity, with liquid adhesive to pallet (2) and material sheet
(4) the unfilled peripheral gap between carries out secondary bonding.
6. according to claim 5 glue glutinous technique, feature for very thin friable material and smooth pallet bubble-free
Be: vacuum evacuation device (6) is to the vacuum action inside closed cavity, and vacuum degree is in negative 0.12mbar.
7. according to claim 5 glue glutinous technique, feature for very thin friable material and smooth pallet bubble-free
Be: the pressure that flat air bag (1) adds material sheet (4), adhesive sheet (3) and pallet (2) is by adhesive sheet (3)
Depending on material sheet (4) size.
8. according to claim 5 glue glutinous technique, feature for very thin friable material and smooth pallet bubble-free
Be: the adhesive sheet (3) is paraffin thin slice, and the paraffin thin slice is single sheet paraffin or paraffin-paraffin paper-paraffin
Sandwich sheet combination or the paraffin overlay of material sheet spin coating production.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810646020.4A CN109003915A (en) | 2018-06-21 | 2018-06-21 | Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810646020.4A CN109003915A (en) | 2018-06-21 | 2018-06-21 | Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109003915A true CN109003915A (en) | 2018-12-14 |
Family
ID=64602000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810646020.4A Pending CN109003915A (en) | 2018-06-21 | 2018-06-21 | Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109003915A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113345A (en) * | 2021-03-11 | 2021-07-13 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
| CN114643651A (en) * | 2022-03-21 | 2022-06-21 | 北京晶格领域半导体有限公司 | Silicon carbide wafer wax pasting method and auxiliary wax pasting device |
| CN114643651B (en) * | 2022-03-21 | 2024-05-14 | 北京晶格领域半导体有限公司 | Silicon carbide wafer waxing method and auxiliary waxing device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490439A (en) * | 2011-12-15 | 2012-06-13 | 天津中环领先材料技术有限公司 | Waxy surface mount device process adopting zone-melt single crystal silicon double-side polished chip for IGBT (insulated gate bipolar transistor) |
| CN104362107A (en) * | 2014-10-23 | 2015-02-18 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonding machine and bonding method |
| CN105479327A (en) * | 2015-12-29 | 2016-04-13 | 中国科学院上海硅酸盐研究所 | Air sac type wafer bonding pressure assisting handle |
-
2018
- 2018-06-21 CN CN201810646020.4A patent/CN109003915A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490439A (en) * | 2011-12-15 | 2012-06-13 | 天津中环领先材料技术有限公司 | Waxy surface mount device process adopting zone-melt single crystal silicon double-side polished chip for IGBT (insulated gate bipolar transistor) |
| CN104362107A (en) * | 2014-10-23 | 2015-02-18 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonding machine and bonding method |
| CN105479327A (en) * | 2015-12-29 | 2016-04-13 | 中国科学院上海硅酸盐研究所 | Air sac type wafer bonding pressure assisting handle |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113345A (en) * | 2021-03-11 | 2021-07-13 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
| CN113113345B (en) * | 2021-03-11 | 2023-08-01 | 湖南奥赛瑞智能科技有限公司 | Bundling thimble system for semiconductor packaging adhesive sheet |
| CN114643651A (en) * | 2022-03-21 | 2022-06-21 | 北京晶格领域半导体有限公司 | Silicon carbide wafer wax pasting method and auxiliary wax pasting device |
| CN114643651B (en) * | 2022-03-21 | 2024-05-14 | 北京晶格领域半导体有限公司 | Silicon carbide wafer waxing method and auxiliary waxing device |
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Application publication date: 20181214 |
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| RJ01 | Rejection of invention patent application after publication |