CN104362107A - Wafer vacuum bonding machine and bonding method - Google Patents
Wafer vacuum bonding machine and bonding method Download PDFInfo
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- CN104362107A CN104362107A CN201410570392.5A CN201410570392A CN104362107A CN 104362107 A CN104362107 A CN 104362107A CN 201410570392 A CN201410570392 A CN 201410570392A CN 104362107 A CN104362107 A CN 104362107A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer vacuum bonding machine and a wafer vacuum bonding method. The wafer vacuum bonding method includes: limiting the position of a first wafer after a positioning block moves forwards for the first time, and then placing a second wafer, performing vacuum pumping, enabling the second wafer to fall onto the first wafer under vacuum status when the positioning block is retreated, and afterwards, simultaneously limiting the position of the second wafer and the first wafer by moving the positioning block forwards, pressing the first wafer and the second wafer together, and finally retreating the positioning block after pressing the first wafer and the second wafer together. Accordingly, the wafer vacuum bonding machine and the wafer vacuum bonding method can guarantee that the positions of the two wafers are perfectly corresponding when the two wafers are pressed together. The wafer vacuum bonding machine is simple in structure, convenient to operate, low in cost, and capable of achieving perfect bonding for the wafers.
Description
Technical field
The present invention relates to microelectronics technology, is specifically a kind of wafer vacuum bonder and bonding method.
Background technology
It is enough tight that wafer bonding refers to two panels wafer contacts, and they can firmly be combined, and current wafer bond techniques all needs special wafer bonding system to realize.Due to the material requirements of wafer itself, very high to the requirement of wafer bonding, require that two wafer can bubble-freely perfectly fit together, if bubble-free when requiring wafer bonding, so just must complete bonding under vacuum conditions, but require again in the process of wafer bonding that two pieces of wafers can be perfect corresponding, existing wafer bonding system is generally the position correspondence adopting manipulator to realize two pieces of wafers in vacuum environment, complex structure, cost is higher.
Summary of the invention
Technical problem to be solved by this invention is, overcomes the defect of prior art, provides that a kind of location is simple, cost is lower, and can make the wafer vacuum bonder of the perfect bondings of two pieces of wafers.
For solving the problems of the technologies described above, the present invention proposes a kind of wafer vacuum bonder, it comprises casing, vacuum generator is provided with in described casing, described casing is provided with the press of enclose inside, described press comprises the fixture be located on casing and to be located on fixture and to make the lid of enclose inside when covering, pressing plate is provided with in described lid, the lower surface of described pressing plate is provided with heating plate, thermal insulation layer is provided with between described pressing plate and heating plate, the pallet for placing wafer is provided with in described fixture, the below of described pallet is provided with heater, the surrounding of described pallet is provided with multiple locating piece in diametric(al) movement, described each locating piece is driven by the cylinder be arranged on fixture outer wall, the head of described each locating piece is also provided with support.
After adopting said structure, move forward and backward for twice by locating piece, make two pieces of wafers perfect corresponding, then make two pieces of wafer bondings by pressing plate to pressing down, first piece of wafer is contact under vacuum conditions with second piece of wafer, therefore bubble-free between the two, then make two pieces of wafer position correspondences by operation locating piece, the operation of locating piece has been come by cylinder, and structure is simple, easy to operate, cost is lower, and can realize the perfect bonding of wafer.
Described support is that the wire being connected to locating piece head is bent outwardly and makes.Adopt this structure, the comparison of support is simple, and less with the frictional force of wafer, and during wafer landing, large variation can not occur in position, makes follow-up operation fairly simple, and due to structure simple, be convenient to the work of cleaning below or replacing.
The multiple contour guide vane end stop perpendicular to clamp base is also provided with in described fixture.Adopt this structure, guide vane end stop can offset with the pressing plate on lid, enables pressing plate arrive desired location when pressing, thus ensure that the distance between two pieces of wafers of two pieces of wafers when bonding is consistent, and bonding effect is better.
Described locating piece has three, and described three locating pieces are evenly arranged around pallet.Adopt three locating pieces just the position of wafer on pallet can be positioned, structure is simple, and cost is lower.
Described casing is at least provided with " C " clevis head driven by pushing mechanism, when lid covers on fixture, described chuck is inwardly promoting the edge can clamping fixture and lid, makes fixture and lid clamping.Adopt this structure, when lid covers on fixture, can make to seal between lid and fixture, adopt chuck clamping, can bonding strength be ensured, and the tightness of press inside, thus press inside can be made to keep vacuum.
Described lid is connected on casing by a bracing frame, and described casing is provided with a supporting seat, and one end and the supporting seat of support frame as described above are hinged, and the hinged lid that makes in the middle part in the other end of bracing frame and the outside of lid can rotate relative to bracing frame.Adopt this structure, when lid relative to fixture rotate come time, again can rotate lid, thus make lid can rotate larger angle relative to fixture, even can rotate upward, so can ingress of air better, radiating effect is better.
Described lid and bracing frame is hinged refers to, support frame as described above is provided with rotation hole and pin-and-hole, and lid to be connected with bracing frame through rotation hole by a rotating shaft and can to rotate relative to bracing frame, and lid passes through a pin and passes pin-and-hole and be connected with bracing frame.Adopt this structure, when pin is plugged, lid can not rotate relative to bracing frame, when pin is taken away, lid just can relative to bracing frame rotate, prevent lid cover compress on fixture time, lid rotate.
Described rotation hole is waist-shaped hole, and described rotating shaft can move left and right in waist-shaped hole, and described fixture is provided with gathering sill, and described lid is provided with the guide protrusions coordinated with this gathering sill, and when described lid covers on fixture, guide protrusions embeds in gathering sill.Adopt this structure, coordinate with guide protrusions and gathering sill, can ensure centering when lid covers on fixture, the precision of centering is very high, thus makes the alignment effect of wafer when bonding very good, ensures the quality of wafer bonding.
The present invention also provides a kind of wafer bonding method, and it comprises the following steps:
S1, the first piece of wafer being coated with bonding glue is put on pallet above;
S2, to be controlled multiple locating piece by cylinder and advance to pallet direction, by first piece of wafer location;
S3, on locating piece support place second piece of wafer, then cover lid closes press, and vacuumizes;
S4, when vacuum degree arrives set point, control multiple locating piece and retreat, second piece of wafer drops to above first piece of wafer from locating piece support;
S5, controls multiple locating piece by cylinder and again advances to pallet direction, position two pieces of wafers;
S6, to control pressing plate by press downward, makes first piece of wafer and second piece of wafer pressing, maintain t minute;
S7, control multiple locating piece and again retreat, then control heating plate and heater and carry out heating and make bonding adhesive curing;
After S8, bonding complete, open press, the wafer after bonding is taken out.
In described step S4, the set point of vacuum degree is: 5 ~ 15 handkerchiefs, and the time t of pressing in described step S6 is 2 ~ 10 minutes, and in described step S7, heating-up temperature is: 200 ~ 300 degree, and the time is 5 ~ 15 minutes.Adopt above-mentioned parameter, the better effects if of wafer bonding, efficiency is higher.
After adopting said method, the present invention has the following advantages: the position of first piece of wafer just limits by the present invention after first time locating piece advance, then second piece of wafer is put into, and then vacuumize, when locating piece is return, second piece of wafer is just write in the state of vacuum and is dropped on first piece of wafer, and then by the advance of locating piece, the position of second piece of wafer and first piece of wafer is limited simultaneously, and then carry out pressing, locating piece is recalled again after pressing, can ensure like this when pressing, the position of two pieces of wafers is perfect corresponding, namely two pieces of wafers overlap in the plane, and there is no bubble between two pieces of wafers yet, heating cure is carried out again after pressing.Adopt said method, step is simple, and PLC can be adopted automatically to control, and bonding effect is better, and cost is lower, and efficiency is higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of wafer bonding machine;
Fig. 2 is the structural representation of press;
Fig. 3 is the enlarged diagram of part A in Fig. 1.
Fig. 4 is the structural representation of another embodiment of wafer bonding machine;
Fig. 5 is the structural representation of the lid open mode of another embodiment of wafer bonding machine;
Fig. 6 is the syndeton schematic diagram of lid and fixture in wafer bonding machine.
As shown in the figure: 1, casing, 2, press, 2.1, lid, 2.2, fixture, 3, pallet, 4, locating piece, 5, cylinder, 6, guide vane end stop, 7, pressing plate, 8, thermal insulation layer, 9, heating plate, 10, press cylinder, 11, pushing mechanism, 12, chuck, 13, bracing frame, 13.1, rotation hole, 13.2, pin-and-hole, 14, supporting seat, 15, rotating shaft, 16, gathering sill, 17, guide protrusions.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation:
As Figure 1-3: the present invention proposes a kind of wafer vacuum bonder, it comprises casing 1, vacuum generator is provided with in described casing 1, described casing 1 is provided with the press 2 of enclose inside, described press 2 comprises the fixture 2.2 be located on casing 1 and to be located on fixture 2.2 and to make the lid 2.1 of enclose inside when covering, pressing plate 7 is provided with in described lid 2.1, the lower surface of described pressing plate 7 is provided with heating plate 9, thermal insulation layer 8 is provided with between described pressing plate 7 and heating plate 9, the pallet 3 for placing wafer is provided with in described fixture 2.2, the below of described pallet 3 is provided with heater, the surrounding of described pallet 3 is provided with multiple locating piece 4 in diametric(al) movement, described each locating piece 4 is driven by the cylinder 5 be arranged on fixture 2.2 outer wall, the head of described each locating piece 4 is also provided with support 4.1.
Described press 2 has the chamber of enclose inside, chamber is connected with vacuum generator, vacuum generator can vacuumize in chamber, the outside of the upper cover of press 2 is provided with press cylinder 10, the output shaft of press cylinder 10 is connected with the pressing plate of press 2, band dynamic pressure plate moves up and down, described lid 2.1 is connected on fixture 2.2 by two cylinders, when lid 2.1 covers on fixture 2.2, constitute the enclosure space of press 2 inside, in the present embodiment, pallet 3 is circular, the below of pallet 3 is provided with heater and can heats pallet 3, after pressing plate 7 compresses wafer downwards, heating plate on pressing plate 7 and pallet 3 heat wafer simultaneously.Described locating piece 4 is driven by the cylinder 5 be located on fixture 2.2 outer wall, along in the diametric(al) of pallet 3, can move towards pallet or away from the direction of pallet, by the stroke setting cylinder 5, locating piece 4 can be offseted with the limit of wafer after advance, thus the position of wafer is positioned.Adopt three locating pieces just can realize the location of circular wafers.The head of locating piece is provided with support, and support 4.1 is located at the position of the upper end of locating piece, and the locating piece below support and wafer offset, and are provided with distance between support and wafer.The present embodiment medium-height trestle 4.1 is made for the wire being connected to locating piece 4 head is bent outwardly.In the present embodiment, wire bends to arc, because wafer has the existence of bonding glue when bonding, therefore for keeping the effect of bonding, locating piece 4 needs timing to clean in the process used, make wire be pressed on locating piece 4 by pressing plate in the present embodiment, remove more convenient during cleaning.Certain described locating piece also can be 4,5 or more, but it is still within the application's protection range.
The multiple contour guide vane end stop perpendicular to clamp base is also provided with in described fixture.In the process of wafer bonding, the thickness of bonding glue needs to control, and that is two pieces of wafers after bonding, distance between the two needs within setting range, adopts this structure, during pressing plate pressing, arrive to guide vane end stop and just stop pressing, the distance between two pieces of wafers is determined.For the wafer bonding that difference requires, only need the guide vane end stop changing differing heights.In the embodiment shown in fig. 1, described guide vane end stop 6 is located at the outside of pallet, is column.In the embodiment shown in fig. 5, described guide vane end stop, is located at the periphery of the upper surface of pallet, is sheet, though the guide vane end stop of above-mentioned two embodiments is difformity, be all guide vane end stop, its object is all the thickness in order to operating key rubber alloy.
As shown in Figure 4, Figure 5, described casing 1 is at least provided with " C " clevis head 12 driven by pushing mechanism 11, when lid 2.1 covers on fixture 2.2, described chuck 12, inwardly promoting the edge can clamping fixture 2.2 and lid 2.1, makes fixture 2.2 and lid 2.1 clamp.Described pushing mechanism is cylinder in the present embodiment, also can be by the straight-line motion mechanism of driven by motor, or other straight-line motion mechanism.
Described lid 2.1 is connected on casing 1 by a bracing frame 13, described casing 1 is provided with a supporting seat 14, one end and the supporting seat 14 of support frame as described above 13 are hinged, and the hinged lid 2.1 that makes in the middle part in the other end of bracing frame 13 and the outside of lid 2.1 can rotate relative to bracing frame 13.Support frame as described above 13 is provided with rotation hole 13.1 and pin-and-hole 13.2, and lid 2.1 to be connected with bracing frame 13 through rotation hole 13.1 by a rotating shaft and also can to rotate relative to bracing frame 13, and lid 2.1 passes pin-and-hole 13.2 by a pin and is connected with bracing frame 13.When pin is inserted, lid can not rotate relative to bracing frame, and when pin pulls out, lid can rotate relative to bracing frame.
Described rotation hole 13.1 is waist-shaped hole, described rotating shaft can move left and right in waist-shaped hole, and described fixture 2.2 is provided with gathering sill 16, and described lid 2.1 is provided with the guide protrusions 17 coordinated with this gathering sill 16, when described lid 2.1 covers on fixture 2.2, guide protrusions 17 embeds in gathering sill 16.As shown in Figure 6, the lower surface of lid is provided with guide protrusions, and the outside of the upper surface of fixture is provided with gathering sill, when guide protrusions enters gathering sill downwards, can ensure the center line alignment of lid and fixture.When ensureing that press moves downward, the involutory precision of upper and lower two pieces of wafers.
The present invention also provides a kind of wafer bonding method, and it comprises the following steps:
S1, the first piece of wafer being coated with bonding glue is put on pallet above;
S2, to be controlled multiple locating piece by cylinder and advance to pallet direction, by first piece of wafer location;
S3, on locating piece support place second piece of wafer, then cover lid closes press, and vacuumizes;
S4, when vacuum degree arrives set point, control multiple locating piece and retreat, second piece of wafer drops to above first piece of wafer from locating piece support;
S5, controls multiple locating piece by cylinder and again advances to pallet direction, position two pieces of wafers;
S6, to control pressing plate by press downward, makes first piece of wafer and second piece of wafer pressing, maintain t minute;
S7, control multiple locating piece and again retreat, then control heating plate and heater and carry out heating and make bonding adhesive curing;
After S8, bonding complete, open press, the wafer after bonding is taken out.
In described step S4, the set point of vacuum degree is: 5 ~ 15 handkerchiefs, and the time t of pressing in described step S6 is 2 ~ 10 minutes, and in described step S7, heating-up temperature is: 200 ~ 300 degree, and the time is 5 ~ 15 minutes.
Embodiment: adopt two panels thickness at more than 0.3mm in the present embodiment, diameter is the wafer of 200mm, and its bonding steps is as follows:
S1, the first piece of wafer being coated with bonding glue is put on pallet above;
S2, to be controlled multiple locating piece by cylinder and advance to pallet direction, first piece of wafer is positioned at center;
S3, on locating piece support place second piece of wafer, then cover lid closes press, and vacuumizes;
S4, when vacuum degree arrives 10 handkerchief, control multiple locating piece and retreat, second piece of wafer drops to above first piece of wafer from locating piece support;
S5, controls multiple locating piece by cylinder and again advances to pallet direction, position the edge of two pieces of wafers overlapped completely to two pieces of wafers;
S6, to control pressing plate by press downward, makes first piece of wafer and second piece of wafer pressing, maintain 15 minutes;
S7, again retreat by controlling multiple locating piece, then control heating plate and heater and carry out heating and make bonding adhesive curing, heating-up temperature is 300 degree, and heating time is 10 minutes;
After S8, bonding complete, open press, the wafer after bonding is taken out.
Claims (10)
1. a wafer vacuum bonder, it is characterized in that: it comprises casing (1), described casing is provided with vacuum generator in (1), described casing (1) is provided with the press (2) of enclose inside, described press (2) comprises the fixture (2.2) be located on casing (1) and is located at fixture (2.2) upper and make the lid (2.1) of enclose inside when covering, pressing plate (7) is provided with in described lid (2.1), the lower surface of described pressing plate (7) is provided with heating plate (9), thermal insulation layer (8) is provided with between described pressing plate (7) and heating plate (9), the pallet (3) for placing wafer is provided with in described fixture (2.2), the below of described pallet (3) is provided with heater, the surrounding of described pallet (3) is provided with multiple locating piece in diametric(al) movement (4), described each locating piece (4) is driven by the cylinder (5) be arranged on fixture (2.2) outer wall, the head of described each locating piece (4) is also provided with support (4.1).
2. wafer vacuum bonder according to claim 1, is characterized in that: described support (4.1) is made for the wire being connected to locating piece (4) head is bent outwardly.
3. wafer vacuum bonder according to claim 1, is characterized in that: be also provided with the multiple contour guide vane end stop (6) perpendicular to fixture (2.2) bottom in described fixture (2.2).
4. wafer vacuum bonder according to claim 1, is characterized in that: described locating piece (4) has three, and described three locating pieces (4) are evenly arranged around pallet (3).
5. wafer vacuum bonder according to claim 1, it is characterized in that: described casing (1) is at least provided with " C " clevis head (12) driven by pushing mechanism (11), when lid (2.1) covers when fixture (2.2) is upper, described chuck (12) is inwardly promoting the edge can clamping fixture (2.2) and lid (2.1), makes fixture (2.2) and lid (2.1) clamping.
6. wafer vacuum bonder according to claim 1, it is characterized in that: described lid (2.1) is connected on casing (1) by a bracing frame (13), described casing (1) is provided with a supporting seat (14), one end and the supporting seat (14) of support frame as described above (13) are hinged, and the hinged lid (2.1) that makes in the middle part in the other end of bracing frame (13) and the outside of lid (2.1) can rotate relative to bracing frame (13).
7. wafer vacuum bonder according to claim 6, it is characterized in that: described lid (2.1) refers to bracing frame (13) is hinged, support frame as described above (13) is provided with rotation hole (13.1) and pin-and-hole (13.2), lid (2.1) to be connected with bracing frame (13) through rotation hole (13.1) by a rotating shaft (15) and can to rotate relative to bracing frame (13), and lid (2.1) passes pin-and-hole (13.2) by a pin and is connected with bracing frame (13).
8. wafer vacuum bonder according to claim 6, it is characterized in that: described rotation hole (13.1) is waist-shaped hole, described rotating shaft (15) can move left and right in waist-shaped hole, described fixture (2.2) is provided with gathering sill (16), described lid (2.1) is provided with the guide protrusions (17) coordinated with this gathering sill (16), described lid (2.1) covers when fixture (2.2) is upper, and guide protrusions (17) embeds in gathering sill (16).
9. a wafer bonding method, is characterized in that: it comprises the following steps:
S1, the first piece of wafer being coated with bonding glue is put on pallet above;
S2, to be controlled multiple locating piece by cylinder and advance to pallet direction, by first piece of wafer location;
S3, on locating piece support place second piece of wafer, then cover lid closes press, and vacuumizes;
S4, when vacuum degree arrives set point, control multiple locating piece and retreat, second piece of wafer drops to above first piece of wafer from locating piece support;
S5, controls multiple locating piece by cylinder and again advances to pallet direction, position two pieces of wafers;
S6, to control pressing plate by press downward, makes first piece of wafer and second piece of wafer pressing, maintain t minute;
S7, control multiple locating piece and again retreat, then control heating plate and heater and carry out heating and make bonding adhesive curing;
After S8, bonding complete, open press, the wafer after bonding is taken out.
10. wafer bonding method according to claim 9, it is characterized in that: in described step S4, the set point of vacuum degree is: 5 ~ 15 handkerchiefs, and the time t of pressing in described step S6 is 2 ~ 10 minutes, in described step S7, heating-up temperature is: 200 ~ 300 degree, and the time is 5 ~ 15 minutes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410570392.5A CN104362107B (en) | 2014-10-23 | 2014-10-23 | Wafer vacuum bonder and bonding method |
| PCT/CN2014/094300 WO2016061889A1 (en) | 2014-10-23 | 2014-12-19 | Wafer vacuum bonding machine and bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410570392.5A CN104362107B (en) | 2014-10-23 | 2014-10-23 | Wafer vacuum bonder and bonding method |
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| Publication Number | Publication Date |
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| CN104362107A true CN104362107A (en) | 2015-02-18 |
| CN104362107B CN104362107B (en) | 2017-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410570392.5A Active CN104362107B (en) | 2014-10-23 | 2014-10-23 | Wafer vacuum bonder and bonding method |
Country Status (2)
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| CN (1) | CN104362107B (en) |
| WO (1) | WO2016061889A1 (en) |
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| CN105977172A (en) * | 2016-05-21 | 2016-09-28 | 哈尔滨工业大学 | Auxiliary hand-operated wafer bonding apparatus |
| TWI575586B (en) * | 2016-04-26 | 2017-03-21 | Zhejiang Microtech Material Co Ltd | Wafer junction bonding equipment and methods |
| CN109003915A (en) * | 2018-06-21 | 2018-12-14 | 河南仕佳光子科技股份有限公司 | Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique |
| CN110053289A (en) * | 2019-05-14 | 2019-07-26 | 苏州美图半导体技术有限公司 | Vacuum glue bonder |
| CN110282598A (en) * | 2019-07-10 | 2019-09-27 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method under vacuum environment |
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| CN117524897A (en) * | 2023-12-29 | 2024-02-06 | 苏州芯睿科技有限公司 | Wafer bonding alignment device |
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| CN105977172A (en) * | 2016-05-21 | 2016-09-28 | 哈尔滨工业大学 | Auxiliary hand-operated wafer bonding apparatus |
| CN105977172B (en) * | 2016-05-21 | 2018-03-30 | 哈尔滨工业大学 | A kind of auxiliary hand-operating wafer bonding device |
| CN109003915A (en) * | 2018-06-21 | 2018-12-14 | 河南仕佳光子科技股份有限公司 | Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique |
| CN110053289A (en) * | 2019-05-14 | 2019-07-26 | 苏州美图半导体技术有限公司 | Vacuum glue bonder |
| CN110053289B (en) * | 2019-05-14 | 2024-04-16 | 苏州美图半导体技术有限公司 | Vacuum adhesive bonding machine |
| CN110282598A (en) * | 2019-07-10 | 2019-09-27 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method under vacuum environment |
| CN110282598B (en) * | 2019-07-10 | 2021-12-28 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method in vacuum environment |
| CN110527946A (en) * | 2019-09-04 | 2019-12-03 | 苏州沃盾纳米科技有限公司 | Coating apparatus |
| CN110527946B (en) * | 2019-09-04 | 2024-03-19 | 立讯电子科技（昆山）有限公司 | Coating device |
| CN117524897A (en) * | 2023-12-29 | 2024-02-06 | 苏州芯睿科技有限公司 | Wafer bonding alignment device |
| CN117524897B (en) * | 2023-12-29 | 2024-03-19 | 苏州芯睿科技有限公司 | Wafer bonding alignment device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104362107B (en) | 2017-03-01 |
| WO2016061889A1 (en) | 2016-04-28 |
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