CN109262868A - It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically - Google Patents
It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically Download PDFInfo
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- CN109262868A CN109262868A CN201811179756.1A CN201811179756A CN109262868A CN 109262868 A CN109262868 A CN 109262868A CN 201811179756 A CN201811179756 A CN 201811179756A CN 109262868 A CN109262868 A CN 109262868A
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- Prior art keywords
- fixedly connected
- school position
- rotate
- wafer processing
- wafer
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses the devices that can rotate school position in a kind of laser cutting wafer processing automatically, it is related to wafer processing techniques field, including workbench, top one end of workbench is fixedly connected with the first frame plate, the side of first frame plate is fixedly connected with the first cylinder, one end of first cylinder is fixedly connected with hydraulic stem, the top other end of workbench is fixedly connected with the second frame plate, the side of second frame plate is fixedly connected with motor, one end of shaft is fixedly connected with the second fixed block, the top two sides of workbench are fixedly connected to support plate, the side of support plate is fixedly connected with the second cylinder, one end of second cylinder is fixedly connected with telescopic rod, one end of telescopic rod is fixedly connected with school position block.The device of school position can be rotated in laser cutting wafer processing automatically, hydraulic stem can make suction inlet mobile, be fixed or unclamp to wafer, fix suction inlet to wafer, and telescopic rod can make school position block mobile, and school position slot is made to carry out school position to wafer.
Description
Technical field
The present invention relates to wafer processing techniques field, school position can be rotated automatically in specially a kind of laser cutting wafer processing
Device.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer；
It can be processed on silicon and is fabricated to various circuit component structures, and become the IC product for having specific electrical functionality.The original of wafer
Beginning material is silicon, and there is nexhaustible silica on earth's crust surface.Silica ore is refined via electric arc furnaces, hydrochloric acid chlorine
Change, and after distilling, the polysilicon of high-purity has been made.
A kind of laser wafer cutting dress disclosed in 207577693 U of Chinese invention patent application prospectus CN
It sets, the laser wafer cutter device, although the design increases stability in use of the invention, because of laser wafer cuts main body
Rear end face is equipped with heat release hole, which increases radiating efficiency of the invention, still, the laser wafer cutter device, to crystalline substance
When circle cutting, school position can not be carried out to wafer position, it is bad to wafer fixation also in wafer dicing process, it is all easy to make
There is deviation in cutting process in wafer, it is therefore proposed that can rotate the device of school position in a kind of laser cutting wafer processing automatically
It is necessary to solve the above problems.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides the dresses that can rotate school position in a kind of laser cutting wafer processing automatically
It sets, solves the problems, such as that existing laser cutting device can not carry out school position to wafer position and fix to wafer bad.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: can in a kind of processing of laser cutting wafer from
The device of dynamic rotation school position, comprising:
Workbench, top one end of the workbench are fixedly connected with the first frame plate, and the side of first frame plate is fixedly connected
There is the first cylinder, one end of first cylinder is fixedly connected with hydraulic stem, and one end of the hydraulic stem is fixedly connected with suction pipe,
One end of the suction pipe is connected with movable sleeve；
Sliding slot is offered inside one end of the suction pipe, offers annular groove on the outside of one end of the suction pipe, the annular is recessed
The inside of slot is fixedly connected with sealing ring, and one end inner wall two sides of the movable sleeve are fixedly connected to support rod, the support
One end of bar is fixedly connected with sliding block, and the other end of the movable sleeve offers thread groove, and one end of the movable sleeve is fixed to be connected
It is connected to baffle, the side of the baffle is fixedly connected with thread bush, and the other side of the baffle is fixedly connected with suction inlet；
The top other end of the workbench is fixedly connected with the second frame plate, and the side of second frame plate is fixedly connected with electricity
Machine, one end of the motor are fixedly connected with shaft, and one end of the shaft is fixedly connected with the second fixed block, and described second is solid
The side for determining block is fixedly connected with jacking block, and sucking pump is fixedly connected at the top of the workbench, and the sucking pump is located at the first frame plate
The other side；
The top two sides of the workbench are fixedly connected to support plate, and the side of the support plate is fixedly connected with the second gas
Cylinder, one end of second cylinder are fixedly connected with telescopic rod, and one end of the telescopic rod is fixedly connected with school position block, the school
School position slot is offered in the middle part of the block of position.
Optionally, support column, the bottom of the support column and workbench are provided at the bottom four corners of the workbench
It is fixedly connected.
Optionally, wafer is provided between the suction inlet and jacking block, side and the suction inlet of the wafer are fitted and connected, described
The other side of wafer is fitted and connected with jacking block.
Optionally, arc groove is offered in the middle part of the block of the school position, school position slot, the school position is offered in the middle part of arc groove
Slot is in arc-shaped.
Optionally, the inner wall other end of the movable sleeve offers slideway, and slideway is internally provided with sealing ring, described close
The side of seal is flexibly connected with the inner wall of slideway.
Optionally, school position slot is internally provided with elastic cushion, and elastic cushion is fixedly connected with the inner wall of school slot.
Optionally, one end of the jacking block is provided with foam-rubber cushion, and foam-rubber cushion is fixedly connected with one end of jacking block, the sponge
It pads and is fitted and connected with the other side of wafer.
Optionally, it is fixedly connected with connecting leg at the top of the sucking pump, the side of suction pipe is fixedly connected with interface, and the one of connecting leg
End is fixedly connected with interface.
Optionally, the thread groove is internally provided with thread bush, and the outside of the thread bush and inner wall be threadedly coupled
The inner wall of thread groove.
Optionally, the sliding slot is internally provided with sliding block, and the surface of the sliding block is flexibly connected with the inner wall of sliding slot.
(3) beneficial effect
The present invention provides it is a kind of laser cutting wafer processing in can rotate automatically school position device, have it is following the utility model has the advantages that
(1), the device that can rotate school position in laser cutting wafer processing automatically can make suction inlet mobile by hydraulic stem, right
Wafer is fixed or loosens wafer, is connect convenient for suction inlet with suction pipe by movable sleeve, passes through the cooperation energy of sliding slot and sliding block
It is enough rotated convenient for movable sleeve, can prevent the suction in suction pipe from letting out by sealing ring causes wafer to loosen, and passes through spiral shell
The cooperation of groove and thread bush can be convenient for the disassembly of suction inlet, can be adsorbed to wafer by suction inlet, make suction inlet to wafer
It is fixed.
(2), the device that can rotate school position in laser cutting wafer processing automatically, can be such that jacking block rotates by motor,
Jacking block drives wafer rotation, cuts convenient for laser knife to wafer, can be carried out to wafer by the cooperation of suction inlet and jacking block
It is fixed, suction can be provided to suction pipe by sucking pump, school position block can be made mobile by telescopic rod, carry out school position slot to wafer
School position, can increase the precision that laser knife cuts wafer.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is movable sleeve schematic structural cross-sectional view of the present invention；
Fig. 3 is structure of the invention schematic top plan view；
Fig. 4 is structure of the invention schematic side view.
In figure: workbench 1, the first cylinder 3, hydraulic stem 4, the first fixed plate 5, suction pipe 6, movable sleeve 7, is slided first frame plate 2
Slot 8, annular groove 9, sealing ring 10, support rod 11, sliding block 12, thread groove 13, baffle 14, thread bush 15, suction inlet 16, the second frame
Plate 17, motor 18, shaft 19, the second fixed block 20, jacking block 21, sucking pump 22, support plate 23, the second cylinder 24, telescopic rod 25, school
Position block 26, school position slot 27, wafer 28, support column 29.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In the present invention unless specifically defined or limited otherwise, term " setting ", " installation ", " connected ", " connection ",
Terms such as " fixations " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection；It can be mechanical connect
It connects；It can be directly connected, it can also be indirectly connected through an intermediary.For the ordinary skill in the art, may be used
To understand the concrete meaning of above-mentioned term in the present invention as the case may be.
In addition, term " first ", " second ", are used for description purposes only, it is not understood to indicate or imply relatively important
Property or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Person implicitly includes one or more of the features.In the description of the present invention, the meaning of " plurality " is two or two with
On, unless otherwise specifically defined.
Fig. 1-4 is please referred to, the present invention provides a kind of technical solution: school can be rotated automatically in a kind of processing of laser cutting wafer
The device of position, comprising:
Workbench 1, top one end of workbench 1 are fixedly connected with the first frame plate 2, and the side of the first frame plate 2 is fixedly connected with
One cylinder 3, one end of the first cylinder 3 are fixedly connected with hydraulic stem 4, and hydraulic stem 4 can make suction inlet 16 mobile, carry out to wafer 28
It fixes or loosens wafer 28, one end of hydraulic stem 4 is fixedly connected with suction pipe 6, and one end of suction pipe 6 is connected with movable sleeve 7,
Movable sleeve 7 connect convenient for suction inlet 16 with suction pipe 6；
Sliding slot 8 is offered inside one end of suction pipe 6, offers annular groove 9, the inside of annular groove 9 on the outside of one end of suction pipe 6
It is fixedly connected with sealing ring 10, sealing ring 10 can prevent the suction in suction pipe 6 from letting out and wafer 28 is caused to loosen, activity
One end inner wall two sides of set 7 are fixedly connected to support rod 11, and one end of support rod 11 is fixedly connected with sliding block 12, sliding slot 8 with
The cooperation of sliding block 12 can rotate convenient for movable sleeve 7, and the other end of movable sleeve 7 offers thread groove 13, and one end of movable sleeve 7 is solid
Surely it is connected with baffle 14, the side of baffle 14 is fixedly connected with thread bush 15, and the cooperation of thread groove 13 and thread bush 15 can be just
In the disassembly of suction inlet 16, the other side of baffle 14 is fixedly connected with suction inlet 16, and suction inlet 16 can adsorb wafer 28, make to inhale
16 pairs of wafers 28 of mouth are fixed；
The top other end of workbench 1 is fixedly connected with the second frame plate 17, and the side of the second frame plate 17 is fixedly connected with motor 18,
Motor 18 can be such that jacking block 21 rotates, and jacking block 21 drives wafer 28 to rotate, and cut convenient for laser knife to wafer 28, motor 18
One end be fixedly connected with shaft 19, one end of shaft 19 is fixedly connected with the second fixed block 20, the side of the second fixed block 20
It is fixedly connected with jacking block 21, wafer 28 can be fixed in the cooperation of suction inlet 16 and jacking block 21, and the top of workbench 1 is fixed to be connected
It is connected to sucking pump 22, sucking pump 22 can provide suction to suction pipe 6, and sucking pump 22 is located at the other side of the first frame plate 2；
The top two sides of workbench 1 are fixedly connected to support plate 23, and the side of support plate 23 is fixedly connected with the second cylinder 24,
One end of second cylinder 24 is fixedly connected with telescopic rod 25, and one end of telescopic rod 25 is fixedly connected with school position block 26, telescopic rod 25
School position block 26 can be made mobile, school position slot 27 is made to carry out school position to wafer 28, the middle part of school position block 26 offers school position slot 27, inhales
One end of mouth 16 is provided with sucker, and sucker is fixedly connected with one end of suction inlet 16, and suction inlet 16 is elastic suction inlet, the middle part of baffle 14
Leak hole is offered, leak hole is corresponding with one end of suction pipe 6, and sucker can be improved the fastness to wafer 28, prevents wafer 28 from moving
It moves and causes cutting deviation, leak hole can be fixed wafer 28 by suction inlet 16 convenient for suction.
As a kind of optional technical solution of the invention: being provided with support column 29 at the bottom four corners of workbench 1, support
Column 29 is fixedly connected with the bottom of workbench 1, and support column 29 can increase the stability of workbench 1.
As a kind of optional technical solution of the invention: wafer 28 is provided between suction inlet 16 and jacking block 21, wafer 28
Side is fitted and connected with suction inlet 16, and the other side and the jacking block 21 of wafer 28 are fitted and connected, and the cooperation of suction inlet 16 and jacking block 21 can
Wafer 28 is fixed.
As a kind of optional technical solution of the invention: the middle part of school position block 26 offers arc groove, the middle part of arc groove
Offer school position slot 27, school position slot 27 be in arc-shaped, school position slot 27 can the position to wafer 28 carry out school position, can increase sharp
The precision that light-knife cuts wafer 28.
As a kind of optional technical solution of the invention: the inner wall other end of movable sleeve 7 offers slideway, the inside of slideway
It is provided with sealing ring 10, the side of sealing ring 10 is flexibly connected with the inner wall of slideway, and slideway can rotate convenient for sealing ring 10.
As a kind of optional technical solution of the invention: school position slot 27 is internally provided with elastic cushion, elastic cushion and school position
The inner wall of slot 27 is fixedly connected, and elastic cushion can prevent school position slot 27 from damaging to the edge of wafer 28.
As a kind of optional technical solution of the invention: one end of jacking block 21 is provided with foam-rubber cushion, foam-rubber cushion and jacking block 21
One end be fixedly connected, the other side of foam-rubber cushion and wafer 28 is fitted and connected, and foam-rubber cushion can prevent jacking block 21 to wafer 28
Surface damages.
As a kind of optional technical solution of the invention: the top of sucking pump 22 is fixedly connected with connecting leg, and the side of suction pipe 6 is solid
Surely it is connected with interface, one end of connecting leg is fixedly connected with interface, and connecting leg can connect convenient for sucking pump 22 with suction pipe 6.
As a kind of optional technical solution of the invention: thread groove 13 is internally provided with thread bush 15, thread bush 15
Outside and inner wall are threadedly coupled the inner wall of thread groove 13, and the cooperation of thread groove 13 and thread bush 15 being capable of tearing open convenient for suction inlet 16
It unloads.
As a kind of optional technical solution of the invention: sliding slot 8 is internally provided with sliding block 12, the surface of sliding block 12 and cunning
The inner wall of slot 8 is flexibly connected, and the cooperation of sliding slot 8 and sliding block 12 can rotate convenient for movable sleeve 7.
The electric elements occurred in this article are electrically connected with extraneous main controller and 220V alternating current, and main controller can be meter
Calculation machine etc. plays the conventionally known equipment of control.
In conclusion the device of school position can be rotated in laser cutting wafer processing automatically, cut to wafer 28
When, first wafer 28 is placed between suction inlet 16 and jacking block 21, starts the first cylinder 3, the first cylinder 3 drives hydraulic stem 4 mobile,
Hydraulic stem 4 drives the first fixed plate 5 mobile, and the first fixed plate 5 drives movable sleeve 7 mobile, and movable sleeve 7 drives suction inlet 16 mobile,
Suction inlet 16 is fixed to wafer 28, starts sucking pump 22, sucking pump 22 adsorbs suction inlet 16 to wafer 28, improves to wafer 28
Fixation, then start the second cylinder 24, the second cylinder 24 drives telescopic rod 25 mobile, and telescopic rod 25 drives school position block 26 to move
It is dynamic, so that school position slot 27 is carried out school position to the position of wafer 28, after the completion of the position of school, starts motor 18, motor 18 drives 19 turns of shaft
Dynamic, shaft 19 drives fixed block 20 to rotate, and fixed block 20 drives jacking block 21 to rotate, and jacking block 21 drives wafer 28 to rotate, wafer 28
Suction inlet 16 is driven to rotate, suction inlet 16 drives movable sleeve 7 to rotate, to cut to wafer 28.
It should be noted that in the present invention unless specifically defined or limited otherwise, fisrt feature is in second feature
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact "up" or "down".
Moreover, fisrt feature can be above the second feature " above ", " above " and " above " fisrt feature right above second feature or tiltedly
Top, or first feature horizontal height is merely representative of higher than second feature.Fisrt feature second feature " under ", " lower section " and
" following " can be fisrt feature and be directly under or diagonally below the second feature, or be merely representative of first feature horizontal height less than
Two features.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (10)
1. the device of school position can be rotated in a kind of laser cutting wafer processing automatically characterized by comprising
Top one end of workbench (1), the workbench (1) is fixedly connected with the first frame plate (2), first frame plate (2)
Side is fixedly connected with the first cylinder (3), and one end of first cylinder (3) is fixedly connected with hydraulic stem (4), the hydraulic stem
(4) one end is fixedly connected with suction pipe (6), and one end of the suction pipe (6) is connected with movable sleeve (7)；
It is offered sliding slot (8) inside one end of the suction pipe (6), offers annular groove on the outside of one end of the suction pipe (6)
(9), the inside of the annular groove (9) is fixedly connected with sealing ring (10), and one end inner wall two sides of the movable sleeve (7) are solid
Surely be connected with support rod (11), one end of the support rod (11) is fixedly connected with sliding block (12), the movable sleeve (7) it is another
End offers thread groove (13), and one end of the movable sleeve (7) is fixedly connected with baffle (14), and the side of the baffle (14) is solid
Surely it is connected with thread bush (15), the other side of the baffle (14) is fixedly connected with suction inlet (16)；
The top other end of the workbench (1) is fixedly connected with the second frame plate (17), and the side of second frame plate (17) is solid
Surely it is connected with motor (18), one end of the motor (18) is fixedly connected with shaft (19), and one end of the shaft (19) is fixed
It is connected with the second fixed block (20), the side of second fixed block (20) is fixedly connected with jacking block (21), the workbench (1)
Top be fixedly connected with sucking pump (22), the sucking pump (22) is located at the other side of the first frame plate (2)；
The top two sides of the workbench (1) are fixedly connected to support plate (23), and the side of the support plate (23) is fixed to be connected
It is connected to the second cylinder (24), one end of second cylinder (24) is fixedly connected with telescopic rod (25), the telescopic rod (25)
One end is fixedly connected with school position block (26), offers school position slot (27) in the middle part of the school position block (26).
2. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: it is provided with support column (29) at the bottom four corners of the workbench (1), the bottom of the support column (29) and workbench (1)
Portion is fixedly connected.
3. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: it is provided with wafer (28) between the suction inlet (16) and jacking block (21), the side of the wafer (28) is bonded with suction inlet (16)
Connection, the other side and the jacking block (21) of the wafer (28) are fitted and connected.
4. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: arc groove is offered in the middle part of the school position block (26), school position slot (27), school position slot are offered in the middle part of arc groove
It (27) is in arc-shaped.
5. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: the inner wall other end of the movable sleeve (7) offers slideway, and slideway is internally provided with sealing ring (10), the sealing ring
(10) side is flexibly connected with the inner wall of slideway.
6. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: the school position slot (27) is internally provided with elastic cushion, and elastic cushion is fixedly connected with the inner wall of school position slot (27).
7. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: one end of the jacking block (21) is provided with foam-rubber cushion, and foam-rubber cushion is fixedly connected with the one end of jacking block (21), the foam-rubber cushion with
The other side of wafer (28) is fitted and connected.
8. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: be fixedly connected with connecting leg at the top of the sucking pump (22), the side of suction pipe (6) is fixedly connected with interface, one end of connecting leg with
Interface is fixedly connected.
9. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: the thread groove (13) is internally provided with thread bush (15), and the outside of the thread bush (15) and inner wall are threadedly coupled
The inner wall of thread groove (13).
10. can rotate the device of school position in a kind of laser cutting wafer processing according to claim 1 automatically, feature exists
In: the sliding slot (8) is internally provided with sliding block (12), and the surface of the sliding block (12) is flexibly connected with the inner wall of sliding slot (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811179756.1A CN109262868A (en) | 2018-10-10 | 2018-10-10 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811179756.1A CN109262868A (en) | 2018-10-10 | 2018-10-10 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
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| Publication Number | Publication Date |
|---|---|
| CN109262868A true CN109262868A (en) | 2019-01-25 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811179756.1A Pending CN109262868A (en) | 2018-10-10 | 2018-10-10 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
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| CN (1) | CN109262868A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116652423A (en) * | 2023-06-02 | 2023-08-29 | 德兴市德芯科技有限公司 | Automatic rotation and alignment equipment in laser cutting wafer processing |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090072793A (en) * | 2007-12-28 | 2009-07-02 | 주식회사 하이닉스반도체 | Spin chuck |
| CN102601429A (en) * | 2012-03-26 | 2012-07-25 | 台州市好帮手眼镜设备有限公司 | Fast cutter |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| CN203943805U (en) * | 2014-07-11 | 2014-11-19 | 武文明 | Otology suction pump |
| WO2016061889A1 (en) * | 2014-10-23 | 2016-04-28 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonding machine and bonding method |
| CN107230657A (en) * | 2016-03-24 | 2017-10-03 | 沈阳芯源微电子设备有限公司 | A kind of wafer centering body |
| CN206761662U (en) * | 2016-12-05 | 2017-12-19 | 嘉兴职业技术学院 | A kind of mechanical linkage dish washer |
| CN209533883U (en) * | 2018-10-10 | 2019-10-25 | 镇江市高等专科学校 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
-
2018
- 2018-10-10 CN CN201811179756.1A patent/CN109262868A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090072793A (en) * | 2007-12-28 | 2009-07-02 | 주식회사 하이닉스반도체 | Spin chuck |
| CN102601429A (en) * | 2012-03-26 | 2012-07-25 | 台州市好帮手眼镜设备有限公司 | Fast cutter |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| CN203943805U (en) * | 2014-07-11 | 2014-11-19 | 武文明 | Otology suction pump |
| WO2016061889A1 (en) * | 2014-10-23 | 2016-04-28 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonding machine and bonding method |
| CN107230657A (en) * | 2016-03-24 | 2017-10-03 | 沈阳芯源微电子设备有限公司 | A kind of wafer centering body |
| CN206761662U (en) * | 2016-12-05 | 2017-12-19 | 嘉兴职业技术学院 | A kind of mechanical linkage dish washer |
| CN209533883U (en) * | 2018-10-10 | 2019-10-25 | 镇江市高等专科学校 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
Non-Patent Citations (1)
| Title |
|---|
| 张文斌;孟宪俊;孟凡辉;杨松涛;: "激光加工中自动旋转校位切割的研究", 电子工业专用设备, no. 07, pages 9 - 12 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116652423A (en) * | 2023-06-02 | 2023-08-29 | 德兴市德芯科技有限公司 | Automatic rotation and alignment equipment in laser cutting wafer processing |
| CN116652423B (en) * | 2023-06-02 | 2024-04-16 | 德兴市德芯科技有限公司 | Automatic rotation and alignment equipment in laser cutting wafer processing |
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