CN107230657A - A kind of wafer centering body - Google Patents
A kind of wafer centering body Download PDFInfo
- Publication number
- CN107230657A CN107230657A CN201610174095.8A CN201610174095A CN107230657A CN 107230657 A CN107230657 A CN 107230657A CN 201610174095 A CN201610174095 A CN 201610174095A CN 107230657 A CN107230657 A CN 107230657A
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- CN
- China
- Prior art keywords
- plunger
- centering
- mounting blocks
- wafer
- spring
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to the wafer centering body in semiconductor equipment wafer transmit process, including suction cup support and the sucker on the suction cup support；The lower section of sucker is provided with gripper cylinder, and the output end of gripper cylinder both sides is connected in centering block, the centering block of both sides is evenly equipped with multiple plunger spring centering components respectively；Plunger spring centering component includes plunger cover plate, spring-loaded plunger, contact, plunger mounting blocks and contact gland, plunger mounting blocks are arranged in centering block, spring-loaded plunger is contained in plunger mounting blocks and by the plunger cover plate bound position on plunger mounting blocks, and plunger cover plate is provided with the fixing device spacing to spring-loaded plunger telescopic direction；The side of contact is placed in plunger mounting blocks and abutted with spring-loaded plunger, and opposite side is located at outside and the wafer contacts of plunger mounting blocks, is provided with and is arranged on plunger mounting blocks, to contact gland spacing above and below contact above contact.The centering of wafer when the present invention is changed suitable for diameter wafer.
Description
Technical field
It is specifically a kind of the present invention relates to the equipment in semiconductor equipment wafer transmit process
Wafer centering body.
Background technology
At present, mechanical centering structure usually used in semiconductor equipment wafer transmit process is being adjusted
It is whole it is good after adaptable diameter wafer size be all fixed, once diameter wafer size has change
Change cannot realize alignment function well.If diameter wafer diminishes, it can not realize that centering is imitated
Really.If diameter wafer becomes big, wafer may be caught broken.
The content of the invention
It is an object of the invention to provide a kind of wafer centering body.The wafer centering body can
Adapt to wafer centering when diameter wafer size is changed, when wafer size is changed, spring
The external part of plunger can stretch with the change of wafer size, not interfere with the effect of centering,
Wafer will not more be destroyed.
The purpose of the present invention is achieved through the following technical solutions：
The present invention includes suction cup support and the sucker on the suction cup support；The sucker
Lower section is provided with gripper cylinder, and the output end of the gripper cylinder both sides is connected to centering block, two
Multiple plunger spring centering components are evenly equipped with the centering block of side respectively；Each plunger bullet
Spring centering modular construction is identical, is installed including plunger cover plate, spring-loaded plunger, contact, plunger
Block and contact gland, the plunger mounting blocks are arranged in the centering block, and the spring-loaded plunger holds
Put in plunger mounting blocks and by the plunger cover plate on plunger mounting blocks above and below
Spacing, the plunger cover plate is provided with the fixing device spacing to spring-loaded plunger telescopic direction；Institute
The side for stating contact is placed in plunger mounting blocks and abutted with the spring-loaded plunger, opposite side
Positioned at the outside of the plunger mounting blocks and wafer contacts, it is provided with and is arranged on above the contact
On plunger mounting blocks, to contact gland spacing above and below contact；Each plunger spring centering group
Contact in part is connected to the crystal round fringes of different-diameter, passes through the flexible reality of the spring-loaded plunger
Now to the centering of the wafer of different-diameter.
Wherein：The fixing device is jackscrew fixed structure, i.e., be provided with the plunger cover plate
The jackscrew abutted with the spring-loaded plunger is installed in top wire hole, the top wire hole, passes through the top
Along telescopic direction play occurs for spring-loaded plunger described in the power restriction that silk is applied on spring-loaded plunger；Institute
State and multiple adjusting holes are provided with plunger mounting blocks, each plunger mounting blocks are respectively by respective
On adjusting hole adjustment be arranged on position in the centering block, and then adjust each contact
With the contact position of wafer；
Groove A is provided with the plunger mounting blocks, the side of the contact is contained in groove A
Interior, the inner side of the plunger mounting blocks is provided with the gap connected with the groove A, the contact
The bottom of opposite side outside plunger mounting blocks is located at the lower section of the gap bottom；The plunger
The inner side of mounting blocks is arc, and the opposite side of the contact and wafer contacts is arc；It is described to touch
Point gland is arranged on the upper surface of plunger mounting blocks, positioned at the top of the groove A；
Bar hole and groove C are had on the plunger mounting blocks, the spring-loaded plunger is housed
In in bar hole, the groove C is located at the top of spring-loaded plunger, and the plunger cover plate is arranged on
In the groove C, upper surface and the upper surface and the upper surface of centering block of the plunger mounting blocks
It is coplanar；The centering block of the sucker both sides is symmetrical arranged, and the inner side of each centering block is equal
For arc, it is provided with each centering block solid in multiple groove B, each groove B
Surely there are plunger mounting blocks；The output end phase that the centering block passes through centering linking arm and gripper cylinder
Connection；The centering linking arm includes centering linking arm A and centering linking arm B, and the centering connects
Arm A is met for " L " shape, side is connected with the output end of the gripper cylinder, opposite side and institute
The B connections of centering linking arm are stated, the centering linking arm B is fixed in the centering block.
Advantages of the present invention is with good effect：
1. the present invention allows each contact to be connect with different-diameter wafer by the flexible of spring-loaded plunger
Touch, adapt to the change of diameter wafer size；Resilient plunger and contact pass through plunger cover plate respectively
And it is spacing above and below the gland of contact, prevent above and below play, centering has good stability.
2. the present invention machined top wire hole on plunger cover plate, prevent spring-loaded plunger from moving forward and backward.
3. multiple adjusting holes are opened up on the plunger mounting blocks of the present invention, for plunger mounting blocks
The adjustment of installation site in centering block, and then can be to each independent with wafer contacts contacts
Adjustment.
4. the side that contact of the present invention is located at outside plunger mounting blocks is arc, bottom is located at gap
The lower section of bottom, it is to avoid wafer is contacted after contact is pressed into groove with plunger mounting blocks, influence pair
Middle effect.
5. the present invention is simple in construction, cost is low.
Brief description of the drawings
Fig. 1 is structural front view of the invention；
Fig. 2 is structure top view of the invention；
Fig. 3 is 3-D view of the invention；
Fig. 4 is the explosive view of centering block of the present invention and plunger spring centering component；
Fig. 5 be Fig. 4 in A at plunger spring centering component enlarged drawing；
Fig. 6 is one of dimensional structure diagram of plunger mounting blocks of the present invention；
Fig. 7 is the two of the dimensional structure diagram of plunger mounting blocks of the present invention；
Fig. 8 is the structural front view of plunger mounting blocks of the present invention；
Wherein：1 is wafer, and 2 be sucker, and 3 be gripper cylinder, and 4 be suction cup support, and 5 are
Centering linking arm A, 6 be centering linking arm B, and 7 be centering block, and 8 be plunger cover plate, and 9 are
Spring-loaded plunger, 10 be contact, and 11 be plunger mounting blocks, and 12 be contact gland, and 13 be jackscrew
Hole, 14 be bar hole, and 15 be groove A, and 16 be gap, and 17 be groove B, and 18 be groove
C, 19 be adjusting hole.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
As shown in Figures 1 to 3, the present invention include sucker 2, gripper cylinder 3, suction cup support 4,
Centering block 7 and plunger spring centering component, wherein suction cup support 4 and gripper cylinder 3 are pacified respectively
Dress on the table, sucker 2 is fixed on suction cup support 4, positioned at gripper cylinder 3 just on
Side；The output end of the both sides of gripper cylinder 3 is connected to centering block 7, pair of the both sides of sucker 2
It is symmetrical arranged for middle piece 7, the inner side of each centering block 7 is arc.In each centering block 7
Multiple groove B17 are provided with, the present embodiment is opened at the two ends of each centering block 7 and center
If being respectively and fixedly provided with plunger spring centering component in groove B17, each groove B17.Centering block 7
It is connected by centering linking arm with the output end of gripper cylinder 3, centering linking arm includes centering
Linking arm A5 and centering linking arm B6, centering linking arm A5 are " L " shape, side and folder
The output end for holding cylinder 3 is connected, and the lower surface of opposite side and centering linking arm B6 is affixed, right
Middle linking arm B6 is fixed in centering block 7.Between centering block 7 and gripper cylinder 3 using pair
Middle linking arm A5 is connected with centering linking arm B6, is easy to dismounting.
As shown in Fig. 4~8, each plunger spring centering modular construction is identical, including cover of plunger
Plate 8, spring-loaded plunger 9, contact 10, plunger mounting blocks 11 and contact gland 12, the plunger
Mounting blocks 11 is in a groove B17 that is square, being fixed in centering block 7, plunger are installed
The upper surface of block 11 and the upper surface of centering block 7 are coplanar；The inner side of plunger mounting blocks 11 is (i.e.
Towards the side of wafer 1) it is arc.Offer what is be connected respectively on plunger mounting blocks 11
Bar hole 14 and groove A15, and be provided with and groove A15 companies in the inner side of plunger mounting blocks 11
Logical gap 16.Spring-loaded plunger 9 is contained in bar hole 14, is opened on plunger mounting blocks 11
Fluted C18, groove C18 are located at the top of bar hole 14, and plunger cover plate 8 is arranged on
In groove C18, spring-loaded plunger play, the upper surface of plunger cover plate 8 and post about 9 can be prevented
The upper surface for filling in mounting blocks 11 is coplanar.Multiple adjusting holes 19 are also provided with plunger mounting blocks 11,
The present embodiment is to be respectively arranged two adjusting holes 19 in the both sides of the length direction of bar hole 14；Often
Individual plunger mounting blocks 11 respectively by each on adjusting hole 19 adjustment be arranged on centering block 7 on
Position, and then adjust each contact 10 and the contact position of wafer 1.In plunger cover plate 8
The fixing device spacing to the telescopic direction of spring-loaded plunger 9 is provided with, the fixing device is solid for jackscrew
Determine structure, i.e., top wire hole 13 be provided with plunger cover plate 8, be provided with the top wire hole 13 with
The jackscrew that spring-loaded plunger 9 is abutted, the power restriction spring on spring-loaded plunger 9 is applied to by jackscrew
Along telescopic direction play occurs for plunger 9.
The side of contact 10 is placed in groove A15, abutted with spring-loaded plunger 9, opposite side
Contacted positioned at the outside of plunger mounting blocks 11, with wafer 1；Contact 10 is contacted with wafer 1
Opposite side is arc, and the bottom of the side is located at the lower section of the bottom of gap 16, to avoid wafer
Contact 10 is pressed into groove 15 and causes to contact with plunger mounting blocks 11 by 1, influence centering effect
Really.Contact gland 12 is fixed on the upper surface of plunger mounting blocks 11, positioned at the upper of groove A15
Side, prevents contact play about 10.
The present invention operation principle be：
When initial, centering block 7 is in open configuration in the presence of gripper cylinder 3.Sucker 2
On suction cup support 4, wafer 1 is sent to the top of sucker 2 and then fallen on sucker 2.
Centering block 7 is closed in the presence of gripper cylinder 3, each tactile in the both sides centering block 7 of sucker 2
The EDGE CONTACT of 10 (the present embodiment has six contacts 10) of point respectively with wafer 1, wafer
1 is centered.
Because spring-loaded plunger 9 has stroke in itself, when the diameter dimension of wafer 1 is changed
When, by the flexible of spring-loaded plunger 9 each contact 10 can be made to be contacted with the wafer 1 of different-diameter,
The centering to wafer 1 can be still realized, is failed without centering or destruction wafer 1
Phenomenon.
Claims (10)
1. a kind of wafer centering body, including suction cup support and on the suction cup support
Sucker；It is characterized in that：The lower section of the sucker (2) is provided with gripper cylinder (3), the folder
The output end for holding cylinder (3) both sides is connected to centering block (7), the centering of both sides
Multiple plunger spring centering components are evenly equipped with block (7) respectively；Each plunger spring centering
Modular construction is identical, including plunger cover plate (8), spring-loaded plunger (9), contact (10),
Plunger mounting blocks (11) and contact gland (12), the plunger mounting blocks (11) are arranged on institute
State in centering block (7), the spring-loaded plunger (9) is contained in plunger mounting blocks (11),
And it is spacing up and down by the plunger cover plate (8) on plunger mounting blocks (11),
The plunger cover plate (8) is provided with the fixing device spacing to spring-loaded plunger (9) telescopic direction；
The side of the contact (10) be placed in plunger mounting blocks (11) and with the spring stack
Fill in (9) to abut, opposite side is located at outside and the wafer (1) of the plunger mounting blocks (11)
Contact, is provided with above the contact (10) and is arranged on plunger mounting blocks (11), to contact
(10) spacing contact gland (12) above and below；Touching in each plunger spring centering component
Point (10) is connected to wafer (1) edge of different-diameter, passes through the spring-loaded plunger (9)
Centering of the flexible realization to the wafer (1) of different-diameter.
2. the wafer centering body as described in claim 1, it is characterised in that：The fixation
Device is jackscrew fixed structure, i.e., top wire hole (13) is provided with the plunger cover plate (8),
The jackscrew abutted with the spring-loaded plunger (9) is installed in the top wire hole (13), passes through institute
Spring-loaded plunger (9) described in the power restriction that jackscrew is applied on spring-loaded plunger (9) is stated along flexible side
To generation play.
3. the wafer centering body as described in claim 2, it is characterised in that：The plunger
Multiple adjusting holes (19) are provided with mounting blocks (11), each plunger mounting blocks (11)
Respectively by each on adjusting hole (19) adjustment be arranged on the centering block (7) on position
Put, and then adjust each contact (10) and the contact position of wafer (1).
4. the wafer centering body as described in claim 1, it is characterised in that：The plunger
Groove A (15) is provided with mounting blocks (11), the side of the contact (10) is contained in this
In groove A (15), the inner side of the plunger mounting blocks (11) is provided with and the groove A (15)
The gap (16) of connection, the contact (10) is located at plunger mounting blocks (11) outside another
The bottom of side is located at the lower section of gap (16) bottom.
5. the wafer centering body as described in claim 4, it is characterised in that：The plunger
The inner side of mounting blocks (11) is arc, and it is another that the contact (10) contacts with wafer (1)
Side is arc.
6. the wafer centering body as described in claim 4, it is characterised in that：The contact
Gland (12) is arranged on the upper surface of plunger mounting blocks (11), positioned at the groove A (15)
Top.
7. the wafer centering body as described in claim 1, it is characterised in that：The plunger
Bar hole (14) and groove C (18), the spring stack are had on mounting blocks (11)
Plug (9) is placed in bar hole (14), and the groove C (18) is located at spring-loaded plunger (9)
Top, the plunger cover plate (8) be arranged on the groove C (18) in, upper surface with
The upper surface of the plunger mounting blocks (11) and the upper surface of centering block (7) are coplanar.
8. the wafer centering body as described in claim 1, it is characterised in that：The sucker
(2) centering block (7) of both sides is symmetrical arranged, and the inner side of each centering block (7) is equal
For arc, multiple groove B (17) are provided with each centering block (7), it is each recessed
Plunger mounting blocks (11) are respectively and fixedly provided with groove B (17).
9. the wafer centering body as described in claim 1 or 8, it is characterised in that：It is described
Centering block (7) is connected by centering linking arm with the output end of gripper cylinder (3).
10. the wafer centering body as described in claim 9, it is characterised in that：The centering
Linking arm includes centering linking arm A (5) and centering linking arm B (6), centering linking arm A
(5) it is " L " shape, side is connected with the output end of the gripper cylinder (3), opposite side
It is connected with the centering linking arm B (6), the centering linking arm B (6) is fixed in described
In centering block (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610174095.8A CN107230657B (en) | 2016-03-24 | 2016-03-24 | A kind of wafer centering body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610174095.8A CN107230657B (en) | 2016-03-24 | 2016-03-24 | A kind of wafer centering body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107230657A true CN107230657A (en) | 2017-10-03 |
| CN107230657B CN107230657B (en) | 2019-07-02 |
Family
ID=59932892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610174095.8A Active CN107230657B (en) | 2016-03-24 | 2016-03-24 | A kind of wafer centering body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107230657B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109262868A (en) * | 2018-10-10 | 2019-01-25 | 镇江市高等专科学校 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
| CN110497545A (en) * | 2019-08-13 | 2019-11-26 | 安徽晶天新能源科技有限责任公司 | A kind of solar silicon wafers production and processing technology |
| CN112466808A (en) * | 2021-02-01 | 2021-03-09 | 西安奕斯伟硅片技术有限公司 | Wafer clamping component and mechanism |
| WO2022007204A1 (en) * | 2020-07-07 | 2022-01-13 | 北京京仪自动化装备技术有限公司 | Material positioning and gripping device, and turning manipulator |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335599A (en) * | 1994-06-03 | 1995-12-22 | Dainippon Screen Mfg Co Ltd | Apparatus and method for treatment of substrate |
| CN1627141A (en) * | 2003-12-10 | 2005-06-15 | Lg.菲利浦Lcd株式会社 | Aligning apparatus |
| CN101436563A (en) * | 2007-11-16 | 2009-05-20 | 沈阳芯源微电子设备有限公司 | Self-centering mechanism for semiconductor chip |
| CN101494188A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Centering unit |
| CN101494187A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Centering system |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
-
2016
- 2016-03-24 CN CN201610174095.8A patent/CN107230657B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335599A (en) * | 1994-06-03 | 1995-12-22 | Dainippon Screen Mfg Co Ltd | Apparatus and method for treatment of substrate |
| CN1627141A (en) * | 2003-12-10 | 2005-06-15 | Lg.菲利浦Lcd株式会社 | Aligning apparatus |
| CN101436563A (en) * | 2007-11-16 | 2009-05-20 | 沈阳芯源微电子设备有限公司 | Self-centering mechanism for semiconductor chip |
| CN101494188A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Centering unit |
| CN101494187A (en) * | 2008-01-25 | 2009-07-29 | 沈阳芯源微电子设备有限公司 | Centering system |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109262868A (en) * | 2018-10-10 | 2019-01-25 | 镇江市高等专科学校 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
| CN110497545A (en) * | 2019-08-13 | 2019-11-26 | 安徽晶天新能源科技有限责任公司 | A kind of solar silicon wafers production and processing technology |
| WO2022007204A1 (en) * | 2020-07-07 | 2022-01-13 | 北京京仪自动化装备技术有限公司 | Material positioning and gripping device, and turning manipulator |
| CN112466808A (en) * | 2021-02-01 | 2021-03-09 | 西安奕斯伟硅片技术有限公司 | Wafer clamping component and mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107230657B (en) | 2019-07-02 |
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| CB02 | Change of applicant information |
Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Applicant after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Applicant before: Shenyang Siayuan Electronic Equipment Co., Ltd. |
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