CN110497545A - A kind of solar silicon wafers production and processing technology - Google Patents
A kind of solar silicon wafers production and processing technology Download PDFInfo
- Publication number
- CN110497545A CN110497545A CN201910743786.9A CN201910743786A CN110497545A CN 110497545 A CN110497545 A CN 110497545A CN 201910743786 A CN201910743786 A CN 201910743786A CN 110497545 A CN110497545 A CN 110497545A
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- China
- Prior art keywords
- silicon rod
- lever
- silicon
- pushing component
- center
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
This application involves a kind of solar silicon wafers production and processing technologies, by being introduced into processing technology to middle step, the forming quality of silicon wafer can be obviously improved, and the silicon rod pushing component being circumferentially equidistantly uniformly arranged can greatly promote alignment efficiency and alignment precision, regulating part can control the motion range of lever, meet the quick centring positioning of different-diameter silicon rod in a certain range, the technical program can be obviously improved the forming quality of silicon wafer by simple process modification.
Description
Technical field
The invention belongs to silicon wafers to produce and process technical field, and in particular to a kind of solar silicon wafers production and processing technology.
Background technique
The multi-wire saw of free abrasive grain is a kind of novel silicon slice cutting technique that developed recently gets up, it passes through a series of steel
Silk ribbon, which moves silicon carbide abrasive, to carry out attrition process and cuts silicon wafer, and it is excellent to have that cutting efficiency height is at low cost, slice quality is good etc.
Point, in cutting process silicon rod be usually be fixed on substrate by modes such as gluing knot or vacuum suctions, and due to mechanical arm or
There are error conditions when person's human assistance placement silicon rod, and silicon rod placement location is caused eccentric situation occur, and cut feeding technique
It is to be made based on silicon rod accurate positioning, it is clear that the bias of above-mentioned silicon rod position is the quality-improving for being not easy to silicon wafer.
Description
For the problem of silicon rod position issuable during silicon rod cutting processing inaccuracy, the invention proposes one kind
Solar silicon wafers production and processing technology carries out centering correction to the silicon rod after placement by centralising device, solves silicon rod cutting
The inaccurate problem in silicon rod position in the process.In order to solve the above technical problems, the technical solution adopted in the present invention is as follows:
A kind of solar silicon wafers production and processing technology, which is characterized in that the processing technology includes the centering step of silicon rod, silicon
Absorption bore region is provided on stick substrate, when silicon rod is contacted with substrate surface, silicon rod is adhered on substrate by suction, works as silicon
When stick is located at center, silicon rod pushing component is not contacted with silicon rod；When silicon rod is not at center, silicon rod pushing component is pushed away
Silicon rod is simultaneously pushed into center by the edge of dynamic silicon rod.
Further, the silicon rod pushing component includes lever, the lever around horizontal axis of rotation from back to front or
Person moves from front to back；The front of the lever is equipped with curved contact portion, and when silicon rod is not at center, lever is returned
Transhipment is dynamic so that the interaction of the edge of contact portion and silicon rod, is pushed into center for silicon rod；When silicon rod is in center,
Lever is not contacted with the edge of silicon rod.
Further, the silicon rod pushing component is pneumatic operation, and silicon rod pushing component further includes connecting with the lever
Driving mechanism, the driving mechanism pushes rotation before and after lever.
Conventional silicon wafer quality-improving often pays attention to the optimization of cutting technique, often neglects the accurate positioning pair of silicon rod
The influence of quality is promoted, the application can be obviously improved silicon wafer by being added in conventional technique for processing silicon chip to middle step
Forming quality；And the silicon rod pushing component being circumferentially equidistantly uniformly arranged can greatly promote alignment efficiency and alignment precision；
Regulating part can control the motion range of lever, meet the quick centring positioning of different-diameter silicon rod in a certain range；In addition, this
To in it is not the centering of absolute sense described in application, but silicon rod is limited within the scope of certain permission position deviation,
Lever contact portion is prevented to hurt silicon rod because of location requirement top.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 the application silicon rod pushing component working state schematic representation one.
Fig. 2 the application silicon rod pushing component working state schematic representation two.
Fig. 3 the application silicon rod pushing component structural schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
In silicon rod cutting process, 3 stable position of silicon rod on a substrate 2, is provided with absorption bore region on substrate 2, when silicon rod 3
When contacting with 2 surface of substrate, silicon rod 3 is adhered on a substrate 2 by the suction of substrate, and substrate 2 is set on swift plate 4, swift
Plate 4 is mounted on Linear actuator.Silicon rod pushing component 1 is equally spaced on a substrate 2, and the silicon rod pushing component 1 can
To adjust the center for pushing silicon rod and silicon rod being made to be maintained at absorption bore region.Silicon rod pushing component 1 is since initial position
It is moved towards the direction of silicon rod 3, when location dislocation, that is, silicon rod 3 of silicon rod 3 is not at center, silicon rod pushing component 1
Until the edge of silicon rod pushing component 1 and silicon rod 3 is physically contacted, silicon rod pushing component 1 pushes silicon rod 3 simultaneously to make at silicon rod 3 for movement
In center, do not contacted with silicon rod 3 in original position silicon rod pushing component 1, silicon rod pushing component 1 is taken back by driving mechanism
To initial position.
Silicon rod pushing component 1 includes silicon rod pushing mechanism 11, the tentering in the region where silicon rod 3 of silicon rod pushing mechanism 11
The rotation of degree.The structure that silicon rod pushing mechanism 11 can be lever class includes lever 13, lever can behind portion and front it
The axis of rotation of spaced winding level rotates, and front refers to the rotation of lever 13 institute energy reach adsorption hole regional center linear distance most
At short position, rear portion is position corresponding with front, when silicon rod pushing mechanism 11 does not work, after lever 13 is in normal
The position in portion.When silicon rod pushing mechanism 11 works, lever 13 is rotated towards front, and silicon rod 3 regulates rear lever 13 and just released
It puts back to rear portion.
Due to lever 13 around axis of rotation in the region where silicon rod 3 from rear portion to front or from front to rear portion
Rotational motion is restriction amplitude, and this limitation can be realized by installation and adjustment screw.When silicon rod 3 at the over center position
When, except the motion range of lever, lever can't contact when mobile from rear portion with silicon rod 3 at the edge of silicon rod 3.
The front of the lever 13 is equipped with contact portion 12, the EDGE CONTACT and phase of contact portion 12 and silicon rod 3 when silicon rod 3 misplaces
Interaction inwardly pushes silicon rod 3.Contact portion 12 is curved irregular curved surface, including eccentric part, the eccentric part have
Raised profile, the raised profile push silicon rod 3 in lever motion.
The silicon rod pushing component 1 is uniformly and equidistantly arranged in adsorb bore region as on the circumference in the center of circle, in order to
The EDGE CONTACT of contact portion 12 and silicon rod 3 when promotion.
As shown in figure 3, silicon rod pushing component 1 includes lever 13, the front of the lever 13 is equipped with contact portion 12, and lever
13 rotate around axis of rotation to the direction close to or far from silicon rod 3.Axis of rotation passes through returning for the middle part of lever 13
Turning point 14, the promotion range of lever 13 adjust the angle that lever 13 rotates by rotation regulating part 16 to change.
The silicon rod pushing component 1 and regulating part 16 are flexibly connected with pedestal 15, and pedestal 15 plays support silicon rod promotion group
The axis of rotation of the effect of part 1, lever 13 is determined by the pivoting point that lever 13 is connected with the connection frame on 15 top of pedestal, that is, is turned round
Axis passes through the tie point of lever 13 and connection frame；The regulating part 16 is located at turn around the lower part of axis；The regulating part 16 with
The bottom of 13 rear side of lever matches, and regulating part 16 is to adjust screw, and screw is mounted on the support frame of pedestal 15, in order to spiral shell
The screw thread adjustment axis of nail is perpendicular to axis of rotation；Pass through position restriction lever 13 bottom of the rotary screw in screw thread adjustment axis
The motion range in portion, and then limit the largest motion range at 13 top of lever, the i.e. motion range of silicon rod pushing component 1.It adjusts
The relative position of part 16 is provided with driving mechanism, and driving mechanism 17 is connect with lever 13, and 17 activation lever 13 of driving mechanism surrounds
Axis of rotation revolution, the driving mechanism 17 is cylinder 17, before 17 activation lever 13 of cylinder is turned back to around axis of rotation from rear portion
Portion.
To prevent the contact portion 12 of lever 13 from damaging silicon rod 3, it is certain that the setting of 13 forward position of lever allows silicon rod 3 to exist
Alignment deviation, i.e., the distance of lever forward position to adsorption hole regional center line be greater than silicon rod 3 tolerance radius, i.e.,
It is only limited within the scope of certain tolerance with by silicon rod 3, the top of contact portion 12 is prevented to hurt silicon rod 13.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (3)
1. a kind of solar silicon wafers production and processing technology, which is characterized in that the processing technology includes the centering step of silicon rod, silicon rod
Absorption bore region is provided on substrate, when silicon rod is contacted with substrate surface, silicon rod can be adhered on substrate by suction, work as silicon
When stick is located at center, silicon rod pushing component is not contacted with silicon rod；When silicon rod is not at center, silicon rod pushing component is pushed away
Silicon rod is simultaneously pushed into center by the edge of dynamic silicon rod.
2. a kind of solar silicon wafers production and processing technology as described in claim 1, which is characterized in that the silicon rod pushing component
Including lever, the lever moves from back to front or from front to back around horizontal pivot axis；The top of the lever is equipped with
Curved contact portion, when silicon rod is not at center, lever is pivoted movement so that the edge of contact portion and silicon rod is mutual
Effect, is pushed into center for silicon rod；When silicon rod is in center, lever is not contacted with the edge of silicon rod.
3. a kind of solar silicon wafers production and processing technology as claimed in claim 2, which is characterized in that the silicon rod pushing component
For pneumatic operation, silicon rod pushing component further includes the driving mechanism connecting with the lever, before the driving mechanism pushes lever
After rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910743786.9A CN110497545B (en) | 2019-08-13 | 2019-08-13 | Production and processing technology of solar silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910743786.9A CN110497545B (en) | 2019-08-13 | 2019-08-13 | Production and processing technology of solar silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110497545A true CN110497545A (en) | 2019-11-26 |
| CN110497545B CN110497545B (en) | 2021-06-08 |
Family
ID=68587386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910743786.9A Active CN110497545B (en) | 2019-08-13 | 2019-08-13 | Production and processing technology of solar silicon wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN110497545B (en) |
Citations (15)
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|---|---|---|---|---|
| JP3088327B2 (en) * | 1997-03-24 | 2000-09-18 | 鹿児島日本電気株式会社 | Glass substrate cutting method |
| CN1788917A (en) * | 2004-10-25 | 2006-06-21 | 斯奈克玛 | Nose-piece for a laser-beam drilling or machining head |
| US7897007B2 (en) * | 2000-07-31 | 2011-03-01 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
| CN202241660U (en) * | 2011-09-05 | 2012-05-30 | 镇江大成新能源有限公司 | Fixture for cutting silicon wafer |
| JP5283911B2 (en) * | 2008-01-11 | 2013-09-04 | 株式会社ディスコ | Cutting equipment |
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| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
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| CN204585580U (en) * | 2015-04-09 | 2015-08-26 | 何淑琼 | A kind of stone material cutting equipment |
| CN107230657A (en) * | 2016-03-24 | 2017-10-03 | 沈阳芯源微电子设备有限公司 | A kind of wafer centering body |
| CN206639787U (en) * | 2017-03-08 | 2017-11-14 | 浙江卓晶科技有限公司 | A kind of self-positioning centering body of semiconductor wafer |
| CN107457921A (en) * | 2017-08-24 | 2017-12-12 | 天津市环欧半导体材料技术有限公司 | A kind of silicon chip preparation technology |
| CN108407115A (en) * | 2018-01-18 | 2018-08-17 | 浙江晶盛机电股份有限公司 | It is a kind of for the centering testing agency of silicon single crystal rod and detection method |
| CN207757896U (en) * | 2017-12-29 | 2018-08-24 | 重庆万盛福耀玻璃有限公司 | Glass base adsorbent equipment |
| CN207983743U (en) * | 2018-03-08 | 2018-10-19 | 重庆市远铃玻璃有限公司 | Negative pressure mechanism for glass container positioning |
-
2019
- 2019-08-13 CN CN201910743786.9A patent/CN110497545B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3088327B2 (en) * | 1997-03-24 | 2000-09-18 | 鹿児島日本電気株式会社 | Glass substrate cutting method |
| US7897007B2 (en) * | 2000-07-31 | 2011-03-01 | Ebara Corporation | Substrate holding apparatus and substrate polishing apparatus |
| CN1788917A (en) * | 2004-10-25 | 2006-06-21 | 斯奈克玛 | Nose-piece for a laser-beam drilling or machining head |
| JP5283911B2 (en) * | 2008-01-11 | 2013-09-04 | 株式会社ディスコ | Cutting equipment |
| CN202241660U (en) * | 2011-09-05 | 2012-05-30 | 镇江大成新能源有限公司 | Fixture for cutting silicon wafer |
| CN103730400A (en) * | 2012-10-16 | 2014-04-16 | 沈阳芯源微电子设备有限公司 | Centring device for wafers of various sizes |
| CN103722629A (en) * | 2014-01-14 | 2014-04-16 | 金坛正信光伏电子有限公司 | Silicon rod multi-angle locating mechanism |
| CN103878489A (en) * | 2014-04-02 | 2014-06-25 | 温州职业技术学院 | Laser hand carving device |
| CN204585580U (en) * | 2015-04-09 | 2015-08-26 | 何淑琼 | A kind of stone material cutting equipment |
| CN107230657A (en) * | 2016-03-24 | 2017-10-03 | 沈阳芯源微电子设备有限公司 | A kind of wafer centering body |
| CN206639787U (en) * | 2017-03-08 | 2017-11-14 | 浙江卓晶科技有限公司 | A kind of self-positioning centering body of semiconductor wafer |
| CN107457921A (en) * | 2017-08-24 | 2017-12-12 | 天津市环欧半导体材料技术有限公司 | A kind of silicon chip preparation technology |
| CN207757896U (en) * | 2017-12-29 | 2018-08-24 | 重庆万盛福耀玻璃有限公司 | Glass base adsorbent equipment |
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| Publication number | Publication date |
|---|---|
| CN110497545B (en) | 2021-06-08 |
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