CN103723677B - A kind of sensor assembling package system and assembling method for packing - Google Patents
A kind of sensor assembling package system and assembling method for packing Download PDFInfo
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- CN103723677B CN103723677B CN201410012281.2A CN201410012281A CN103723677B CN 103723677 B CN103723677 B CN 103723677B CN 201410012281 A CN201410012281 A CN 201410012281A CN 103723677 B CN103723677 B CN 103723677B
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Abstract
The invention discloses a kind of sensor assembling package system and assembling method for packing, this system integrates the equipment such as microscope, manipulator, bonding technology platform, manipulator running is controlled by controlling organization, first base is positioned on bonding technology platform fixing, then chip is installed on base, finally realizes bonding packaging.Respectively the pose of base and chip is confirmed by adopting two microscopes, realize the automatic aligning between chip and base, assembling, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.Apply this system can realize complicated MEMS micro-structural on a machine, realize the assembling of sensor cluster and the integrated operation of bonding packaging simultaneously, realize the automation of sensor production.
Description
Technical field
The invention belongs to MEMS and assemble encapsulation technology field, be specifically related to a kind of sensor assembling package system and assembling method for packing.
Background technology
MEMS sensor adopts microelectronics and the produced novel sensor of micromachining technology.Compared with traditional sensor, it has, and volume is little, lightweight, cost is low, low in energy consumption, reliability is high, be suitable for mass production, be easy to integrated and realize intelligentized feature.Meanwhile, the characteristic size of micron dimension makes it can complete the irrealizable function of some traditional mechanical pick-up device.
MEMS sensor, in manufacturing process, needs sensor chip and base (or substrate) to assemble, then encapsulates.Commonly chip plane is to base (or substrate) plane in current assembling, and generally do not relate to the assembling of the on-plane surface such as axis hole, step, therefore assembly precision is less demanding.Along with the lifting of sensor function, its structure is also day by day complicated, and on-plane surface assembling displays gradually.For the making of this kind of MEMS sensor, present solution is: under vision system support, first manually complete contraposition assembling, then transfer on sealed in unit and encapsulate.Because MEMS sensor makes and is different from general micro assemby, be the integrated of micro assemby and encapsulation two kinds of techniques, therefore there are problems in this method, specific as follows:
One, require very high to operator, operating efficiency is low.
The MEMS sensor of two, having assembled is not due to fixing in transfer process, and contraposition assembly quality cannot ensure, reduces yield rate.
Therefore, in view of above problem, be necessary that proposing a kind of collection assembles and be packaged in the equipment of one and assemble method for packing, realize the integrated of micro assemby in MEMS sensor manufacturing process and packaging technology, same station realizes contraposition assembling and the packaging operation of MEMS sensor chip and base (or substrate), realize the automatic operation of contraposition, assembling and encapsulation, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base, promote yield rate.
Summary of the invention
In view of this, the invention provides a kind of sensor assembling package system and assembling method for packing, this system integrates the equipment such as microscope, manipulator, bonding technology platform, apply this system and can realize the integrated operation that complicated MEMS micro-structural carries out the techniques such as contraposition, assembling and encapsulation, realize the automation of sensor production, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.
A kind of sensor assembling package system that object according to the present invention proposes, assembling for base and chip encapsulates, described system comprises housing, the testing agency of the charging tray be positioned on described housing, feed mechanism, detection workpiece pose, controlling organization for the bonding technology platform of workpiece bonding packaging and control system running;
Described feed mechanism comprises support and the manipulator be positioned on described support, and described manipulator front end is provided with the rotating shaft for adjusting workpiece pose;
Described testing agency comprises for confirming that on base, flag is to determine the first microscope of described base pose, and be positioned on described housing for confirming the second microscope of described chip pose, described first microscope is positioned at described manipulator front end, and described testing agency is electrically connected with described controlling organization;
Described controlling organization controls the running of described manipulator, first pick up base, according to the first microscopical feedback signal Correctional tube seat appearance, for chip contraposition provides pose benchmark, after base is positioned on bonding technology platform fixing, then manipulator pick-up chip, and according to the second microscopical feedback signal adjustment chip pose, after chip correspondence is installed on base, finally realize bonding packaging.
Preferably, described manipulator is four-degree-of-freedom manipulator.
Preferably, described manipulator comprises four-degree-of-freedom cascade machine mechanical arm and grabs with the operation hand being positioned at described four-degree-of-freedom cascade machine mechanical arm front end, described operation hand is grabbed and is fixedly installed insulation board, described rotating shaft is arranged at described four-degree-of-freedom cascade machine mechanical arm front end, and is fixedly connected with described insulation board.
Preferably, the packet capturing of described operation hand is drawn together absorption hand and to be grabbed and/or holding hand is grabbed.
Preferably, described bonding technology platform comprise bonding heating furnace, for fixing base clamp system and adjust the elevating mechanism of described bonding technology podium level.
Preferably, described clamp system comprise be arranged at fixture above described heating furnace, with the power part driving described fixture action, described power part is electrically connected with described controlling organization.
Preferably, described power part is for driving cylinder.
A kind of sensor assembling method for packing, the sensor assembling package system described in employing, concrete steps are as follows:
(1), first technological parameter is set: comprise the speed of service of manipulator, the position relationship parameter between bonding position and equipment initial point, bonding parameter;
(2), put into workpiece in charging tray, workpiece comprises base and chip;
(3), controlling organization controls manipulator and runs pickup base, the flag simultaneously on the first microscopic examination base, confirms the pose of base, for chip contraposition provides pose benchmark; Manipulator is according to detection signal Correctional tube seat appearance, and movement is positioned on bonding technology platform, and its clamping is fixed by clamp system action simultaneously;
(4), controlling organization controls manipulator and runs pick-up chip, the pose of the second microscopic examination chip, and manipulator is according to detection signal adjustment chip pose and calculate the movement locus of manipulator, and manipulator drives chip to run to be assemblied on base by chip;
(5), the Z axis corrective action of manipulator is adopted, the pressure between adjustment chip and base;
(6), start heating furnace and carry out bonding packaging;
(7), after bonding completes, the workpiece after manipulator pickup bonding to be also mobilely positioned in charging tray.
Preferably, before step 3, also comprise the step of adjustment bonding technology podium level.
Compared with prior art, the advantage of sensor assembling package system disclosed by the invention and assembling method for packing is: this system integrates the equipment such as microscope, manipulator, bonding technology platform, manipulator running is controlled by controlling organization, first base is positioned on bonding technology platform fixing, then chip is installed on base, finally realizes bonding packaging.Respectively the pose of base and chip is confirmed by adopting two microscopes, realize the automatic aligning between chip and base, assembling, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.Apply this system can realize complicated MEMS micro-structural on a machine, realize the assembling of sensor cluster and the integrated operation of bonding packaging simultaneously, realize the automation of sensor production.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of sensor assembling package system disclosed by the invention.
Fig. 2 is the top view of a kind of sensor assembling package system disclosed by the invention.
Fig. 3 is the structural representation that operation hand is grabbed.
Fig. 4 is the structural representation of bonding technology platform.
Fig. 5 is assembling encapsulation flow chart.
The title of the numeral in figure or the corresponding component representated by letter:
1, housing 2, charging tray 3, feed mechanism 4, testing agency 5, bonding technology platform
31, support 32, four-degree-of-freedom cascade machine mechanical arm 33, operation hand are grabbed
331, insulation board 332, cylinder 333, suction nozzle 334, electric jaw 335, electrode
41, the first microscope 42, second microscope
51, heating furnace 52, fixture 53, handle 54, driving cylinder 55, elevating mechanism
Detailed description of the invention
The preparation method of MEMS sensor on-plane surface assembling is: under vision system support, first manually complete contraposition assembling, then transfer on sealed in unit and encapsulate.Because MEMS sensor makes and is different from general micro assemby, be the integrated of micro assemby and encapsulation two kinds of techniques, require very high to operator, operating efficiency is low.The MEMS sensor of having assembled is not due to fixing in transfer process, and contraposition assembly quality cannot ensure, reduces yield rate.
The present invention is directed to deficiency of the prior art, provide a kind of sensor assembling package system and assembling method for packing, this system integrates the equipment such as microscope, manipulator, bonding technology platform, apply this system and can realize the integrated operation that complicated MEMS micro-structural carries out the techniques such as automatic aligning, assembling and encapsulation, realize the automation of sensor production, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.
To be clearly and completely described technical scheme of the present invention by detailed description of the invention below.Obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Please also refer to Fig. 1 to Fig. 5, a kind of sensor assembling package system, assembling for base and chip encapsulates, this system comprises housing 1, be positioned at the charging tray 2 on housing 1, feed mechanism 3, the testing agency 4 of detection workpiece pose, the bonding technology platform 5 for workpiece bonding packaging, and the controlling organization of control system running.Feed mechanism 3 comprises support 31 and the manipulator be positioned on support 31; Manipulator is four-degree-of-freedom manipulator.
Manipulator comprises four-degree-of-freedom cascade machine mechanical arm 32 and grabs 33 with the operation hand being positioned at four-degree-of-freedom cascade machine mechanical arm 32 front end, operation hand is grabbed on 33 and is fixedly installed insulation board 331, four-degree-of-freedom cascade machine mechanical arm 32 front end is provided with rotating shaft (not shown), and rotating shaft is fixedly connected with insulation board 331.Drive operation hand to grab 33 by rotating shaft to move or rotate.
Operation hand is grabbed 33 and is comprised absorption hand and to grab and/or holding hand is grabbed.Cylinder 332 and suction nozzle 333 are drawn together in absorption hand packet capturing, and absorption hand is grabbed for adsorbing chip class workpiece, and electric jaw 334 and electrode 335 are drawn together in holding hand packet capturing, and holding hand is grabbed for clamping dimension larger workpiece as base etc.Operation hand grabs the absorption or clamping operation that can realize chip or base, and applies voltage and carry out electrostatic bonding.
Testing agency 4 comprises for confirming that on base, flag is to determine the first microscope 41 of base pose, and be positioned at housing 1 for confirming the second microscope 42 of chip pose, first microscope 41 is positioned at the front end of four-degree-of-freedom cascade machine mechanical arm 32, and testing agency 4 is electrically connected with controlling organization.Controlling organization controls the work of feed mechanism 3 and bonding technology platform 5 according to the signal that testing agency feeds back.
Controlling organization controls manipulator running, first pick up base, according to the first microscopical feedback signal Correctional tube seat appearance, for chip contraposition provides pose benchmark, after base is positioned on bonding technology platform fixing, then manipulator pick-up chip, and according to the second microscopical feedback signal adjustment chip pose, after chip correspondence is installed on base, finally realize bonding packaging.
Bonding technology platform 5 comprise bonding heating furnace 51, for the clamp system of fixing base and the elevating mechanism 55 of adjustment bonding technology platform 5 height.Clamp system comprise be arranged at fixture 52 above heating furnace 51, with the power part driving fixture 52 action, power part is electrically connected with controlling organization.
Wherein, power part is for driving cylinder 54.Or directly manually pull handle 53 to drive fixture move clamping or unclamp, specifically do not limit.
A kind of sensor assembling method for packing, adopt sensor assembling package system, concrete steps are as follows:
(1), first technological parameter is set: comprise the speed of service of manipulator, the position relationship parameter between bonding position and equipment initial point, bonding parameter; Bonding pattern comprises anode linkage (bonding voltage DC900-1200V, bonding time 50-2000s, bonding pressure 0.1-50g, bonding temperature 250-550 DEG C), thermocompression bonding (bonding time 50-2000s, bonding pressure 0.1-500g, bonding temperature 250-550 DEG C) or viscose glue bonding (bonding time 50-2000s, bonding pressure 0.1-500g) etc.;
(2), put into workpiece in charging tray, workpiece comprises base and chip;
(3), controlling organization controls manipulator and runs pickup base, the flag simultaneously on the first microscopic examination base, confirms the pose of base, for chip contraposition provides pose benchmark; Manipulator is according to detection signal Correctional tube seat appearance, and movement is positioned on bonding technology platform, and its clamping is fixed by clamp system action simultaneously;
(4), controlling organization controls manipulator and runs pick-up chip, the pose of the second microscopic examination chip, and manipulator is according to detection signal adjustment chip pose and calculate the movement locus of manipulator, and manipulator drives chip to run to be assemblied on base by chip;
(5), the Z axis corrective action of manipulator is adopted, the pressure between adjustment chip and base;
(6), start heating furnace and carry out bonding packaging;
(7), after bonding completes, the workpiece after manipulator pickup bonding to be also mobilely positioned in charging tray.
Because testing agency can not adjust in the Z-axis direction, therefore, by elevating mechanism adjustment bonding technology position of platform, be located in the job area of testing agency.The step of adjustment bonding technology podium level was also comprised before step 3.
The invention discloses a kind of sensor assembling package system and assembling method for packing, this system integrates the equipment such as microscope, manipulator, bonding technology platform, manipulator running is controlled by controlling organization, first base is positioned on bonding technology platform fixing, then chip is installed on base, finally realizes bonding packaging.Respectively the pose of base and chip is confirmed by adopting two microscopes, realize the automatic aligning between chip and base, assembling, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.Apply this system can realize complicated MEMS micro-structural on a machine, realize the assembling of sensor cluster and the integrated operation of bonding packaging simultaneously, realize the automation of sensor production.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. a sensor assembling package system, it is characterized in that, on-plane surface for base and chip assembles and encapsulates, described system comprises housing, the testing agency of the charging tray be positioned on described housing, feed mechanism, detection workpiece pose, for the bonding technology platform of workpiece bonding packaging and the controlling organization of control system running;
Described feed mechanism comprises support and the manipulator be positioned on described support, and described manipulator front end is provided with the rotating shaft for adjusting workpiece pose;
Described testing agency comprises for confirming that on base, flag is to determine the first microscope of described base pose, and be positioned on described housing for confirming the second microscope of described chip pose, described first microscope is positioned at described manipulator front end, and described testing agency is electrically connected with described controlling organization;
Described controlling organization controls the running of described manipulator, first pick up base, according to the first microscopical feedback signal Correctional tube seat appearance, for chip contraposition provides pose benchmark, after base is positioned on bonding technology platform fixing, then manipulator pick-up chip, and according to the second microscopical feedback signal adjustment chip pose, after chip correspondence is installed on base, finally realize bonding packaging.
2. sensor assembling package system as claimed in claim 1, it is characterized in that, described manipulator is four-degree-of-freedom manipulator.
3. sensor assembling package system as claimed in claim 2, it is characterized in that, described manipulator comprises four-degree-of-freedom cascade machine mechanical arm and grabs with the operation hand being positioned at described four-degree-of-freedom cascade machine mechanical arm front end, described operation hand is grabbed and is fixedly installed insulation board, described rotating shaft is arranged at described four-degree-of-freedom cascade machine mechanical arm front end, and is fixedly connected with described insulation board.
4. sensor assembling package system as claimed in claim 3, is characterized in that, the packet capturing of described operation hand is drawn together absorption hand and to be grabbed and/or holding hand is grabbed.
5. sensor assembling package system as claimed in claim 1, is characterized in that, described bonding technology platform comprise bonding heating furnace, for fixing base clamp system and adjust the elevating mechanism of described bonding technology podium level.
6. sensor assembling package system as claimed in claim 5, is characterized in that, described clamp system comprise be arranged at fixture above described heating furnace, with the power part driving described fixture action, described power part is electrically connected with described controlling organization.
7. sensor assembling package system as claimed in claim 6, it is characterized in that, described power part is for driving cylinder.
8. a sensor assembling method for packing, is characterized in that, adopt the sensor assembling package system described in any one of claim 1-7, concrete steps are as follows:
(1), first technological parameter is set: comprise the speed of service of manipulator, the position relationship parameter between bonding position and equipment initial point, bonding parameter;
(2), put into workpiece in charging tray, workpiece comprises base and chip;
(3), controlling organization controls manipulator and runs pickup base, the flag simultaneously on the first microscopic examination base, confirms the pose of base, for chip contraposition provides pose benchmark; Manipulator is according to detection signal Correctional tube seat appearance, and movement is positioned on bonding technology platform, and its clamping is fixed by clamp system action simultaneously;
(4), controlling organization controls manipulator and runs pick-up chip, the pose of the second microscopic examination chip, manipulator adjusts chip pose according to detection signal and calculates the movement locus of manipulator, and manipulator drives chip operation to be assemblied on base by chip;
(5), the Z axis corrective action of manipulator is adopted, the pressure between adjustment chip and base;
(6), start heating furnace and carry out bonding packaging;
(7), after bonding completes, the workpiece after manipulator pickup bonding to be also mobilely positioned in charging tray.
9. sensor assembling method for packing as claimed in claim 8, is characterized in that, also comprise the step of adjustment bonding technology podium level before step 3.
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104051318B (en) * | 2014-07-04 | 2017-02-01 | 格科微电子（上海）有限公司 | Automatic packaging system and automatic packaging method of image sensor chip |
| CN107438357B (en) * | 2016-05-25 | 2020-04-07 | 富泰华工业（深圳）有限公司 | Automatic assembling device |
| CN110893999A (en) | 2018-09-12 | 2020-03-20 | 泰科电子(上海)有限公司 | Image acquisition system and image acquisition method |
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
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Effective date of registration: 20180810 Address after: 215100 202, room 2, International Science Park, Yangcheng Lake, 116 Chengyang Road, Xiangcheng District, Suzhou, Jiangsu. Patentee after: Suzhou Su robot intelligent equipment Co., Ltd. Address before: 215123 199 Ren Yan Road, Suzhou Industrial Park, Jiangsu Patentee before: Soochow University |