CN102275869B - Equipment and method for bonding single chip and wafer - Google Patents
Equipment and method for bonding single chip and wafer Download PDFInfo
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- CN102275869B CN102275869B CN201110220990.6A CN201110220990A CN102275869B CN 102275869 B CN102275869 B CN 102275869B CN 201110220990 A CN201110220990 A CN 201110220990A CN 102275869 B CN102275869 B CN 102275869B
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Abstract
The invention discloses equipment and a method for bonding a single chip and a wafer. The bonding equipment comprises a wafer platform, a storage component, a manipulator, a microscopic system and a control system, wherein the wafer platform has three degrees of freedom of X and Y directions and rotation; the manipulator has three degrees of freedom of X, Y and Z directions; the microscopic system comprises a first microscopic system and a second microscopic system; the first microscopic system and the second microscopic system respectively detect positions and orientations of the single chip and the wafer and transmit pattern signals to the control system; and the control system controls the manipulator or the wafer platform to regulate the position and the orientation of a single chip or a wafer bonding region according to the single chip position and orientation pattern signal and the wafer bonding region position and orientation pattern signal. The bonding equipment with the structure has the characteristics of effectively protecting a movable structure of a wafer region along with simple operation, high instrument adaptability, high bonding precision, flexible motion and function, and can be applied more and more widely.
Description
Technical field
The present invention relates to bonding apparatus and the bonding method of a kind of single-chip and wafer, especially relate to a kind of bonding apparatus and bonding method that adapts to various chips.
Background technology
MEMS (Micro-Electro-Mechanical Systems; MEMS) different two aspects that mainly comprise of device and integrated circuit, the one, contain movable structure, the 2nd, and environmental interaction, these 2 are brought very large difficulty to encapsulation, and its packaging cost height also mainly causes by these 2.Owing to there being movable structure, in encapsulation process, must protect movable structure not damaged, therefore can not directly adopt ripe technique of integrated circuit packaging.Owing to wanting and environmental interaction, therefore encapsulation should be considered and the interaction of environment, guarantees that again device performance is unaffected, deals with difficulty very large.Meanwhile, the prealignment before encapsulation has also increased encapsulation difficulty.Prealignment under the litho machine of the main employing of encapsulation both at home and abroad, puts into the mode that sealed in unit encapsulates by hand at present, often causes final encapsulation precision and effect can not meet index request.This has increased packaging cost and difficulty virtually, and has reduced packaging efficiency.
Wafer level packaging has good market-oriented prospect, in Wafer-Level Packaging Technology and equipment research, need to recognize that the current developing stage of China's MEMS industry is mainly in many kinds, high specific, small batch industrialization the developing stage of depositing, a lot of MEMS devices form new construction after bonding.For the encapsulation of this device, wafer bonding is not competent, because the cutting fluid of using during scribing easily enters in micro-structural, and be difficult to remove, thus the destruction of causing micro-structural.And employing wafer and single-chip level encapsulation means realize the encapsulation of MEMS device, can avoid the bonding of large area region, some movable microstructures are protected, so people more and more start to have paid close attention to the packaging technology of single-chip and wafer scale.
Summary of the invention
In view of this; one object of the present invention is to provide a kind of simple to operate, device strong adaptability that has; bonding precision is high, motion and flexible function; can effectively protect the single-chip of wafer area movable structure and the bonding apparatus of wafer, another object of the present invention is to propose to utilize this bonding apparatus single-chip and wafer to be carried out to the method for bonding simultaneously.
A kind of single-chip proposing according to object of the present invention and the bonding apparatus of wafer, comprise in order to the fixing wafer platform of wafer (6), in order to place the memory module (13) of single-chip, in order to pick up the operator (4) of single-chip, microscopic system and control system, wherein: described wafer platform (6) have X-Y to rotation three degree of freedom, described operator (4) has X-Y-Z to three degree of freedom, described microscopic system comprises first microscopic system (15) of the single-chip pose after being picked up by operator in order to detection and in order to detection, is fixed on second microscopic system (5) of the wafer pose on wafer platform, described the first microscopic system (15) and described the second microscopic system (5) are connected to control system.
Optionally, described wafer platform (6) is provided with the firing equipment that para-linkage process heats.
Optionally, the bottom of described wafer platform is provided with electric rotating machine (8), wafer platform X-direction motor (9) and wafer platform Y-direction motor (11), and described electric rotating machine (8), wafer platform X-direction motor (9) and wafer platform Y-direction motor (11) are connected to control system.
Optionally, the afterbody of described operator (4) is provided with operator X-direction motor (1), operator Y-direction motor (2) and operator Z-direction motor (3), and described operator X-direction motor (1), operator Y-direction motor (2) and operator Z-direction motor (3) are connected to control system.
Optionally, described the first microscopic system connects a Z-direction motor (12) of focusing.
Optionally, described the second microscopic system connects a Z-direction motor (10) of focusing.
Optionally, described operator further comprises operator main body (4-8), clamping plate (4-4), connecting plate (4-6) and in order to draw suction pipe (4-2) and the suction nozzle (4-1) of single-chip, described operator main body (4-8) flexibly connects on connecting plate (4-6) by a reed (4-7), be rigidly connected with clamping plate (4-4), described suction pipe (4-2) is connected a vacuum equipment with suction nozzle (4-1) simultaneously.
Optionally, the further dynamometry magnet of described operator (4-3) and phase magnet (4-5), this dynamometry magnet (4-3) and phase magnet (4-5) are fixed on the both sides that described clamping plate (4-4) gone up and be distributed in to described connecting plate (4-6).
Optionally, when described dynamometry magnet (4-3) and described clamping plate (4-4) adhesive, described phase magnet (4-5) disconnects with described clamping plate (4-4); When described dynamometry magnet (4-3) disconnects with described clamping plate (4-4), described phase magnet (4-5) and described clamping plate (4-4) adhesive.
A kind of single-chip proposing according to another object of the present invention and the bonding method of wafer, use the bonding apparatus of aforementioned single-chip and wafer, wherein: described the first microscopic system (15) detects after single-chip pose, to described control system, send single-chip pose figure signal, described the second microscopic system (5) detects after the appearance of wafer bonding position, to described control system, send wafer bonding position appearance figure signal, described control zone is according to this single-chip pose figure signal and wafer bonding position appearance figure signal, to one or two in operator (4) or wafer platform (6), send synchronous conditioning signal, described operator (4) or wafer platform (6) regulate the pose in single-chip or wafer bonding district according to this synchronous conditioning signal.
Above-mentioned single-chip and the bonding apparatus of wafer, adopt the motor module of a plurality of frees degree to realize accurately location, by microscopic system, single-chip pose is carried out to recognition detection, and by magnet, carry out the judgement of power, when power is greater than magnet adsorption power, magnet is thrown off, operator stops moving downward, thereby makes to guarantee performance accuracy and apply suitable bonding pressure in single-chip operating process.
, by two cover microscopic systems, coordinate meanwhile, respectively figure on figure on wafer and single-chip automatically identified and detected, and automatically adjusting according to testing result, thereby guarantee to need the structure graph of bonding and aiming at of single-chip figure on wafer.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structure chart of single-chip of the present invention and wafer bonding equipment;
Fig. 2 is the operator structural representation of bonding apparatus of the present invention.
The specific embodiment
Because wafer level packaging is a very complicated technique, and for MEMS device, use wafer level packaging easily to make some micro-structurals be destroyed, affect the function of whole device.So people have proposed to use single-chip and wafer to carry out the technique of Direct Bonding, avoid large-area bonding region, thereby improve the production yield of MEMS device.
The present invention just on this basis, has proposed the bonding apparatus of a kind of high efficiency, high accuracy, high-quality single-chip and wafer.The high efficiency of this bonding apparatus is embodied in, and from the bonding of selecting of single-chip, whole flow process all adopts automation mechanized operation to carry out, the mode of comparing and manually picking up, its service speed improves greatly, and bonding technology can be incorporated in whole packaging technology and go, thereby enhances productivity.The high accuracy of this bonding apparatus is embodied in, at single-chip, pick up in the process on wafer, adopt two cover microscopic systems respectively the pose of single-chip and wafer to be detected, and regulate both position orientation relations by control system, guarantee bonding region contraposition accurately together.The high quality bulk of this checkout equipment is present, and the operator of pick-up chip is provided with power monitoring system, can guarantee that operator can not damage because contact force is excessive single-chip when bonding single-chip and wafer, thereby guarantee the quality of bonding.
Below, in connection with accompanying drawing, the specific embodiment of the present invention is elaborated.
Refer to Fig. 1, Fig. 1 is the structure chart of single-chip of the present invention and wafer bonding equipment.As shown in the figure, this bonding apparatus is arranged on base plate 14, comprises wafer platform 6, memory module 13, operator 4, microscopic system and is arranged at outside control system (not shown in figure 1).Described wafer platform 6 is in order to fix a wafer, and the working material while being also bonding, is provided with firing equipment simultaneously on this wafer platform 6, and this firing equipment in order to be heated to the required temperature of bonding single-chip and wafer in bonding process.Described memory module 13 is in order to place a plurality of single-chips, and the plurality of chip can be the chip that model is identical, can be also dissimilar chip.Described operator 4 is in order to pick up a single-chip from memory module 13, and this single-chip transferred to the enterprising line unit of wafer and close, and this operator 4 can discharge the voltage of 0-1500V simultaneously, can ensure the needed bonding voltage of different chips.Described microscopic system comprises the first microscopic system 15 and the second microscopic system 5.The first microscopic system 15 is in order to detect the single-chip pose after being picked up by operator 4, and send single-chip pose figure signal to described control system, the second microscopic system 16 is fixed on the wafer pose on wafer platform in order to detect, and to described control system, sends wafer pose figure signal.
Further, the bottom of this wafer platform 6 is also provided with electric rotating machine 8, wafer platform X-direction motor 9 and wafer platform Y-direction motor 11, and these three motors have formed the group of motors of wafer platform 6, make wafer platform 6 have X-Y to rotation three degree of freedom.Described electric rotating machine 8, wafer platform X-direction motor 9 and wafer platform Y-direction motor 11 are connected to control system, and the instruction of sending according to this control system regulates wafer platform 6, thereby reach the effect of controlling wafer pose.
Further, the afterbody of this operator 4 is also provided with operator X-direction motor 1, operator Y-direction motor 3 and operator Z-direction motor 2, and these three motors form the group of motors of operator 4, make operator 4 have X-Y-Z to three degree of freedom.Described operator X-direction motor 1, operator Y-direction motor 3 and operator Z-direction motor 2 are connected to control system, and the instruction of sending according to this control system moves this operator 4, thereby realize the effect of picking up and shift single-chip.
Further, this first microscopic system 15 connects a Z-direction motor 12, these Z-direction motor 12 connection control system, and under the control of this control system, drive the first microscopic system 15 to move in Z-direction, realize the automatic focusing to this first microscopic system 15.
Further, this second microscopic system 5 connects a Z-direction motor 10 by pillar 7, these Z-direction motor 10 connection control system, and under the control of this control system, drive the second microscopic system 5 to move in Z-direction, realize the automatic focusing to this second microscopic system 5.
Use the bonding apparatus of single-chip of the present invention and wafer to carry out the method for bonding as follows:
Operator 4 is under the driving of group of motors, move to the top of memory module 13, and select a single-chip to carry out picking action, after picking up single-chip, move in the first microscopic system 15, the first microscopic system 15 herein can be arranged on the place that differs from memory module 13, also can be arranged on memory module 13 belows.When being arranged on memory module 13 below, need on the interface of memory module, arrange can be for the through hole of the first microscopic system 15 observations.
When operator 4 carries single-chip, come behind the observation area of the first microscopic system 15, the first microscopic system 15 is carried out automatic focusing under the driving of Z-direction motor 12, until export to one of control system single-chip pose figure signal clearly.Single-chip pose herein can be the pose of whole single-chip, can be also the pose of a certain special symbol in single-chip, and another special symbol of this special symbol and wafer correspondence position forms the required alignment mark of bonding.
Now on 5 pairs of wafers of the second microscopic system, need the region of bonding to carry out pose detection, after the same automatic adjusting by Z-direction motor 10, export to one of control system wafer pose figure signal clearly.Wafer pose herein can be the pose of whole wafer, can be also the pose of another special symbol corresponding with special symbol on single-chip.
Control system receives after the figure signal from two microscopic systems, start comparison and analyze the synchronous needs that whether meet bonding between two figure signals, and send synchronous conditioning signal to one or two in operator 4 or wafer platform 6, operator 4 or wafer platform 6 regulate the pose of single-chip or wafer after receiving this synchronous conditioning signal, both can be matched each other, realize high accuracy contraposition.
Complete after contraposition, operator 4 transfers to by single-chip the bonding region position that wafer is corresponding, comes into effect bonding operation.It is pointed out that for the displacement between operator 4 and wafer platform 6 herein and can carry out according to pre-set circuit, do not need to consider that operator 4 is because of the mobile bit errors of bringing.
When carrying out bonding operation, 4 pairs of single-chips of operator and wafer apply a bonding voltage, and meanwhile, wafer platform starts to wafer and single-chip heating, until reach the needed temperature of bonding.
Below, then the detailed structure of operator 4 is introduced, to illustrate how bonding apparatus of the present invention can ensure the quality of single-chip in pick process.
Refer to Fig. 2, Fig. 2 is the operator structural representation of bonding apparatus of the present invention.As shown in the figure, this operator comprises operator main body 4-8, connecting plate 4-6, intermediate plate 4-4, dynamometer spring 4-3, phase magnet 4-5, suction pipe 4-2 and suction nozzle 4-1.Wherein, suction pipe 4-2 is connected vacuum air-channel with suction nozzle 4-1, and chip is drawn; Operator main body 4-8 is connected in group of motors by connecting plate 4-6, and operator main body 4-8 itself flexibly connects by a reed 4-7 and connecting plate 4-6; Meanwhile, operator main body 4-8 is also rigidly connected with clamping plate 4-4; It is upper that dynamometry magnet 4-3 and phase magnet 4-5 are fixed on connecting plate 4-6, and these two magnets are distributed in clamping plate both sides simultaneously.When operator is not when pressing stressed state, dynamometry magnet 4-3 and clamping plate 4-4 adhesive, play a part to keep operator pose, and phase magnet 4-5 is in off-state.And when operator 4 carries single-chip and puts into the bonding region of wafer downwards, between operator 4 and single-chip, produce a contact force, when this contact force is greater than the suction of dynamometry magnet 4-3, dynamometry magnet 4-3 is disconnected by force, and provide motor the feedback signal decommissioning, now operator stop motion; Phase magnet 4-5 and clamping plate 4-4 adhesive simultaneously, stable operation hand 4 poses, thus carry out subsequent operation.It should be noted that herein, the suction being provided by dynamometry magnet 4-3 can be selected by demand, take that to be less than the maximum pressure that single-chip and crystal column surface can bear be prerequisite, so just can avoid operator when pressing single-chip downwards, to destroy the micro-structural of single-chip and crystal column surface, guarantee the integrity of the various movable microstructures of MEMS device after bonding, thereby improve the yield of MEMS device package.
In sum, the bonding apparatus of single-chip provided by the invention and wafer, has following features:
In order to make to guarantee performance accuracy and apply suitable bonding pressure in single-chip operating process, in design, adopt the motor module of a plurality of frees degree to realize accurately location, by microscopic system, single-chip pose is carried out to recognition detection, and by magnet, carry out the judgement of power, when power is greater than magnet adsorption power, magnet is thrown off, and operator stops moving downward.
In order to guarantee to need the structure graph of bonding and aiming at of single-chip figure on wafer, by two cover microscopic systems, coordinate, respectively figure on figure on wafer and single-chip automatically identified and detected, and automatically adjusting according to testing result.
Wafer platform can be realized automatic temperature-adjusting and control, and requires to regulate, to adapt to different bonding chips according to different bonding temperatures.
Operator output 0-1500V voltage, can apply according to different bonding voltage requests.
The invention has the beneficial effects as follows: the equipment of this kind of structure has simple to operate, device strong adaptability; bonding precision is high, motion and flexible function; can effectively protect the feature of wafer area movable structure, so the application meeting of the bonding apparatus of this kind of structure is more and more extensive.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the present invention.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. the bonding apparatus of a single-chip and wafer, comprise in order to the fixing wafer platform of wafer (6), in order to place the memory module (13) of single-chip, in order to pick up the operator (4) of single-chip, microscopic system and control system, it is characterized in that: described wafer platform (6) have X-Y to rotation three degree of freedom, described operator (4) has X-Y-Z to three degree of freedom, described microscopic system comprises first microscopic system (15) of the single-chip pose after being picked up by operator in order to detection and in order to detection, is fixed on second microscopic system (5) of the wafer pose on wafer platform, described the first microscopic system (15) and described the second microscopic system (5) are connected to control system.
2. single-chip according to claim 1 and wafer bonding equipment, is characterized in that: described wafer platform (6) is provided with the firing equipment that para-linkage process heats.
3. single-chip according to claim 1 and wafer bonding equipment, it is characterized in that: the bottom of described wafer platform is provided with electric rotating machine (8), wafer platform X-direction motor (9) and wafer platform Y-direction motor (11), described electric rotating machine (8), wafer platform X-direction motor (9) and wafer platform Y-direction motor (11) are connected to control system.
4. single-chip according to claim 1 and wafer bonding equipment, it is characterized in that: the afterbody of described operator (4) is provided with operator X-direction motor (1), operator Y-direction motor (2) and operator Z-direction motor (3), described operator X-direction motor (1), operator Y-direction motor (2) and operator Z-direction motor (3) are connected to control system.
5. single-chip according to claim 1 and wafer bonding equipment, is characterized in that: described the first microscopic system connects a Z-direction motor (12) of focusing.
6. single-chip according to claim 1 and wafer bonding equipment, is characterized in that: described the second microscopic system connects a Z-direction motor (10) of focusing.
7. single-chip according to claim 1 and wafer bonding equipment, it is characterized in that: described operator further comprises operator main body (4-8), clamping plate (4-4), connecting plate (4-6) and in order to draw suction pipe (4-2) and the suction nozzle (4-1) of single-chip, described operator main body (4-8) flexibly connects on connecting plate (4-6) by a reed (4-7), be rigidly connected with clamping plate (4-4), described suction pipe (4-2) is connected a vacuum equipment with suction nozzle (4-1) simultaneously.
8. single-chip according to claim 7 and wafer bonding equipment, it is characterized in that: on described operator, have dynamometry magnet (4-3) and phase magnet (4-5), this dynamometry magnet (4-3) and phase magnet (4-5) are fixed on the both sides that described clamping plate (4-4) gone up and be distributed in to described connecting plate (4-6).
9. single-chip according to claim 8 and wafer bonding equipment, is characterized in that: when described dynamometry magnet (4-3) and described clamping plate (4-4) adhesive, described phase magnet (4-5) disconnects with described clamping plate (4-4); When described dynamometry magnet (4-3) disconnects with described clamping plate (4-4), described phase magnet (4-5) and described clamping plate (4-4) adhesive.
10. the bonding method of a single-chip and wafer, this bonding method is used the bonding apparatus of single-chip as claimed in claim 1 and wafer, it is characterized in that: described the first microscopic system (15) detects after single-chip pose, to described control system, send single-chip pose figure signal, described the second microscopic system (5) detects after the appearance of wafer bonding position, to described control system, send wafer bonding position appearance figure signal, described control system is according to this single-chip pose figure signal and wafer bonding position appearance figure signal, to one or two in operator (4) or wafer platform (6), send synchronous conditioning signal, described operator (4) or wafer platform (6) regulate the pose in single-chip or wafer bonding district according to this synchronous conditioning signal.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110220990.6A CN102275869B (en) | 2011-08-03 | 2011-08-03 | Equipment and method for bonding single chip and wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110220990.6A CN102275869B (en) | 2011-08-03 | 2011-08-03 | Equipment and method for bonding single chip and wafer |
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| CN102275869A CN102275869A (en) | 2011-12-14 |
| CN102275869B true CN102275869B (en) | 2014-04-09 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102658551B (en) * | 2012-05-18 | 2014-04-16 | 山东理工大学 | Chip transfer manipulator |
| CN102659072B (en) * | 2012-05-18 | 2014-08-06 | 山东理工大学 | Bonding equipment for chips and wafers |
| WO2015038074A1 (en) * | 2013-09-13 | 2015-03-19 | Orion Systems Integration Pte Ltd | System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method |
| CN103723677B (en) * | 2014-01-10 | 2016-04-20 | 苏州大学 | A kind of sensor assembling package system and assembling method for packing |
| CN113990790B (en) * | 2021-12-24 | 2022-03-18 | 湖北三维半导体集成创新中心有限责任公司 | Bonding system and bonding method |
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|---|---|---|---|---|
| CN1834601A (en) * | 2006-02-27 | 2006-09-20 | 哈尔滨工业大学 | Automatic bonding method of MEMS high temp pressure sensor |
| JP4282379B2 (en) * | 2003-06-06 | 2009-06-17 | オリンパス株式会社 | Wafer inspection equipment |
| CN102074541A (en) * | 2010-11-26 | 2011-05-25 | 天水华天科技股份有限公司 | Carrier-free pin-free grid-array IC (Integrated Circuit) chip packaging part and production method thereof |
| CN202193612U (en) * | 2011-08-03 | 2012-04-18 | 苏州大学 | Bonding device of single chip and wafer |
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2011
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4282379B2 (en) * | 2003-06-06 | 2009-06-17 | オリンパス株式会社 | Wafer inspection equipment |
| CN1834601A (en) * | 2006-02-27 | 2006-09-20 | 哈尔滨工业大学 | Automatic bonding method of MEMS high temp pressure sensor |
| CN102074541A (en) * | 2010-11-26 | 2011-05-25 | 天水华天科技股份有限公司 | Carrier-free pin-free grid-array IC (Integrated Circuit) chip packaging part and production method thereof |
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