JP2011044569A - Electrode machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrode machining apparatus capable of machining to uniformize lengths of a plurality of bumps (electrodes) formed on respective devices even if there is variations in top surface elevations among a plurality of semiconductor devices formed on a semiconductor wafer. <P>SOLUTION: The electrode machining apparatus measures the lengths of the respective bumps 4, which are cut totally in a first process, in a second process, and sets a necessary cut amount in an X-coordinate and Y-coordinate respectively so as to uniformize the lengths. Tips of the bumps 4 are cut by a second cutting tool 203 of a second cutting means 200 on the respective X and Y coordinates to uniformize the lengths of all bumps 4. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention provides, for example, an electrode for performing processing such as cutting the tips of protruding electrodes protruding from the surfaces of a plurality of devices formed on the surface of a plate-like workpiece such as a semiconductor wafer to align the height of the electrodes It relates to a processing apparatus.

  A semiconductor device (semiconductor chip) on which an electronic circuit such as an IC or LSI is formed is widely used in various electric and electronic devices such as a mobile phone and a personal computer. The semiconductor chip is obtained by dividing a semiconductor wafer on which a large number of semiconductor chips are formed by a dicing apparatus or the like.

  In recent years, in order to reduce the weight and size of electronic and electrical equipment, bumps with a protrusion of 50 to 100 μm are formed as electrodes on the electrodes of semiconductor devices, and the bumps are directly applied to the electrodes formed on the mounting substrate. A semiconductor device technology called flip chip that has been joined has been developed and put into practical use. In addition, a technology for reducing the size by arranging or stacking a plurality of semiconductor devices on a substrate called an interposer has been developed and put into practical use. Since each of such techniques joins substrates through the plurality of bumps formed on the surface of the semiconductor device, it is necessary to make the heights of the bumps uniform.

  On the other hand, as a technique for forming a plurality of bumps on the surface of a semiconductor device, a ball formed by heating and melting the tip of a wire such as gold is thermocompression bonded with an ultrasonic wave to an electrode formed in advance on the semiconductor device. A method of breaking the head of the ball is known (Patent Document 1: FIG. 2). In addition, a method of growing bumps by plating, a method of joining small spheres made of metal with ultrasonic waves, and the like have been put into practical use. However, in these bump forming methods, it is difficult to form a plurality of bumps with the same height. In view of this, there has been proposed a processing device that cuts and removes the tip of the bump with a rotating cutting tool (bite) so as to align the height (Patent Documents 1 and 2).

JP 2005-347464 A JP 2004-319697 A

  However, even if the tips of the plurality of bumps are evenly arranged, if the surface height of each device formed on the wafer varies, the length of each bump varies. If the lengths of the bumps are different, there is a problem that the quality related to the electrical performance such as the electrical resistance, the capacitance, or the conduction speed is not stable in a device such as a memory or LED.

  The present invention has been made in view of the above circumstances, and the main technical problem thereof is that even if the surface height of a plurality of devices formed on a wafer varies, a plurality of bumps ( It is an object of the present invention to provide an electrode processing apparatus capable of processing the length of the electrode) uniformly.

  The present invention provides a chuck table having a holding surface parallel to the X-axis direction and a Y-axis direction orthogonal to the X-axis direction, and a rotation shaft extending in parallel to the Z-axis direction orthogonal to the holding surface. 1 spindle, a cutting bit mounting substrate mounted on the lower end of the first spindle, and a first cutting bit disposed at an eccentric position from the rotational axis of the cutting bit mounting substrate, First cutting means for cutting with the first cutting tool rotating the tips of a plurality of protruding electrodes provided in a plurality of devices formed on the surface of the work held on the holding surface of the chuck table. A first cutting means for feeding the first cutting means in the Z-axis direction; a first cutting means for detecting the moving position of the first cutting means in the Z-axis direction; Position detecting means and the chuck A second spindle having a rotation axis extending in parallel with a Z-axis direction orthogonal to the holding surface of the chuck table; And a second cutting tool provided on an extension line of the rotational axis of the second spindle, and a second cutting tool that selectively cuts the tip of the electrode cut by the first cutting means. Cutting means, second cutting means for sending the second cutting means in the Y-axis direction, Y-axis direction feeding means, and second cutting means for sending the second cutting means in the Z-axis direction Z-axis direction feeding means A chuck table X-axis direction position detecting means for detecting the movement position of the chuck table in the X-axis direction, and a second cutting means Y-axis direction position for detecting the movement position of the second cutting means in the Y-axis direction. Detection means; The second cutting means for detecting the movement position in the Z-axis direction of the second cutting means, the position detection means for the Z-axis direction, the surface height position of the device and the electrodes at the X and Y coordinates of the surface of the workpiece A height detecting means for detecting the tip height position of the head, a chuck table X-axis direction position detecting means, the second cutting means Y-axis direction position detecting means, and the second cutting means Z-axis direction position detecting means. The chuck table X-axis based on each detected position information and the surface height position information of the device and the tip height position information of the electrode at each X · Y coordinate detected by the height detection means It comprises a direction feeding means, a second cutting means, a Y-axis direction feeding means, and a control means for controlling the second cutting means Z-axis direction feeding means.

  According to the present invention, after the tip of the electrode is cut by the first cutting means, the control means obtains the surface height position information of the device and the tip height position information of each electrode after the cutting in each XY coordinate. By comparing, it is possible to recognize the length of the electrode after cutting and to determine whether or not there is variation in the length of the electrode. When there is variation in the length of the electrodes, the control means performs control such as cutting the necessary amount of the tip of the electrode that needs to be cut by the second cutting means in order to make the lengths of all the electrodes uniform. . As a result, even if the surface height of the device varies, the lengths of all the electrodes are uniform.

  According to the present invention, even if the surface height of a plurality of devices formed on a workpiece such as a semiconductor wafer varies, the length of a plurality of bumps (electrodes) formed on each device can be processed uniformly. There is an effect that can be.

(A) is a perspective view of a semiconductor wafer on which bumps are processed in one embodiment of the present invention, (b) is a plan view of a semiconductor device formed on the surface of the semiconductor wafer, and (c) is a side view of the semiconductor wafer. FIG. 1 is an overall perspective view of an electrode processing apparatus according to an embodiment. It is a whole perspective view of the same apparatus, and is a figure which clarifies the composition of the 1st cutting means. It is a perspective view which shows the lower end part of a 1st cutting means. It is a side view which shows a mode that a bump is cut by the 1st cutting means at a primary process. It is a perspective view which shows the height detection means which the electrode processing apparatus of one Embodiment comprises. It is a side view which shows a mode that the length of a bump is detected with a height detection means at a secondary process. It is a perspective view which shows the 2nd cutting means with which the electrode processing apparatus of one Embodiment comprises. It is a side view which shows a mode that a bump is cut by the 2nd cutting means at a secondary process. It is a block diagram of the control system which the electrode processing apparatus of one Embodiment comprises. It is a flowchart which shows the procedure of a secondary process.

(1) Semiconductor Wafer FIG. 1A shows a disk-shaped semiconductor wafer (hereinafter abbreviated as a wafer) which is a workpiece according to an embodiment. The wafer 1 is a silicon wafer or the like, and a large number of semiconductor devices 2 are formed on the surface. These semiconductor devices 2 are configured by forming an electronic circuit (not shown) such as an IC or LSI on the surface of a rectangular area partitioned in a grid by the division lines 3.

  As shown in FIGS. 1B and 1C, each semiconductor device 2 is provided with a plurality of protruding electrodes (hereinafter referred to as bumps) 4 protruding from the surface by means of forming means such as plating. . These bumps 4 have a height (length) from the surface of the semiconductor device 2 of, for example, about 150 μm, but are not formed as shown in FIG. Uniform and the tip (top) is not aligned. The wafer 1 is finally cut and divided along the division line 3 and is divided into a large number of semiconductor devices (semiconductor chips) 2.

  The separated semiconductor device 2 is mounted by mounting each bump 4 directly on an electrode such as a mounting substrate by a mounting technique such as flip chip. For this purpose, the height of each bump 4 is uniform. The top must be aligned. Hereinafter, an embodiment of an electrode processing apparatus that processes the height of the bump 4 uniformly will be described.

(2) Electrode processing apparatus FIG.2 and FIG.3 has shown the electrode processing apparatus 10 which concerns on one Embodiment. In this apparatus 10, a primary process for aligning the heights of the bumps 4 as a whole and a secondary process for making the lengths of the bumps 4 uniform after the primary process are performed. Reference numerals 200 and 300 in FIG. 2 denote a second cutting means and a height detecting means that operate in a secondary process, respectively, and FIG. 3 illustrates the first cutting means 100 that operates in a primary process. The second cutting means 200 and the height detection means 300 are retracted upward. Hereinafter, the configuration and operation related to the primary process, the secondary process, and the post-processing process after the secondary process will be described in order. In the device 10, each operation is automatically controlled by the control means 50.

(2-1) Primary Step In FIG. 2, reference numeral 11 denotes a rectangular parallelepiped base 11, and a plurality of wafers 1 are provided in a supply-side cassette 12 </ b> A that is detachably set at a predetermined location on the base 11. Stacked and stored. The wafer 1 stored in the cassette 12A on the supply side is pulled out by a transfer robot 13 having a revolving arm that can move up and down, and a positioning table 14 with the surface side on which the semiconductor device 2 is formed facing upward. It is placed on and positioned here at a predetermined transfer start position.

  Next, the wafer 1 is picked up from the positioning table 14 by the supply arm 15 and placed concentrically on the disk-like chuck table 16 which is operated in vacuum with the front side facing up. The chuck table 16 has a circular holding surface 16a made of a porous material having a size corresponding to the wafer 1 on the upper surface, and the wafer 1 is held by adsorbing the back surface to the holding surface 16a. The chuck table 16 is disposed such that the holding surface 16a is orthogonal to the Z-axis direction (vertical direction).

  As shown in FIG. 4, the chuck table 16 is supported by a table base (chuck table X-axis direction feeding means) 17 provided on the base 11 so as to be movable in the X-axis direction. 17 and the chuck table 16 are sent to the machining position on the inner side in the X-axis direction (X1 direction side in FIGS. 2 and 3). A first cutting means 100 shown in FIG. 3 is disposed above the processing position. On the base 11, a bellows-like cover 18 is provided so as to be stretchable so as to block the moving path of the table base 17 and prevent the cutting waste and the like from falling into the base 11.

  The movement position in the X-axis direction of the table base 17 moving in the X-axis direction is detected by the chuck table X-axis direction position detecting means 175 (see FIG. 10). Position information in the X-axis direction of the chuck table 16 detected by the detection means 175 is supplied to the control means 50. Then, based on the position information in the X-axis direction supplied to the control means 50, the control means 50 controls the movement amount and position in the X-axis direction of the chuck table 16 supported by the table base 17.

  As shown in FIG. 3, the first cutting means 100 is provided on a column 131 erected at the end on the back side of the base 11 so as to be movable up and down along the Z-axis direction. That is, the column 131 is provided with a guide 132 extending in the Z-axis direction, and the first cutting means 100 is slidably mounted on the guide 132 via the slider 133. The first cutting means 100 is operated by the ball screw type Z-axis direction feeding means 110 (first cutting means Z-axis direction feeding means) 110 driven by the servo motor 111 to operate the Z through the slider 133. Move up and down in the axial direction.

  As shown in FIGS. 3 and 4, the first cutting means 100 includes a first spindle 101 whose rotation axis extends in a direction parallel to the Z-axis direction, and a cutting tool attached to the lower end of the first spindle 101. A mounting substrate 102 and a first cutting tool 103 disposed on the cutting tool mounting substrate 102 are provided. As shown in FIG. 3, the first spindle 101 is supported in a housing 104 fixed to a slider 133, and is driven to rotate by a spindle motor 105 fixed to the upper end portion.

  As shown in FIG. 4, the cutting tool mounting substrate 102 has a disc shape and is concentrically fixed to the lower end of the first spindle 101. A first cutting tool 103 is provided on the outer periphery of the lower surface of the cutting tool mounting substrate 102 via a mount 106. That is, the first cutting tool 103 is disposed at an eccentric position from the rotation axis of the first spindle 101.

  The blade of the first cutting tool 103 is formed of diamond or the like, and the first cutting tool 103 is detachably attached to the mount 106 with the blade facing down. In the first cutting means 100, the Y-axis direction position of the rotation axis of the first spindle 101 coincides with the Y-axis direction position of the center of the chuck table 16. The first cutting tool 103 rotates integrally with the first spindle 101 (the first spindle 101 rotates, for example, in the direction B shown in FIG. 4). It is set larger than the diameter of 1.

  In the primary process, the tip of the bump 4 is cut by the first cutting means 100 as follows. First, the first cutting means 100 is sent downward by the Z-axis direction feeding means 110 to a position where the cutting edge of the first cutting bit 103 reaches a predetermined processing height at which the tip of the bump 4 is cut. The spindle 101 is driven to rotate by a spindle motor 105.

  The Z-axis direction feeding means 110 of the first cutting means 100 is accompanied by a first cutting means Z-axis direction position detecting means 150 for detecting the movement position, that is, the height position of the first cutting means 100 in the Z-axis direction. (See FIG. 10). The height position information of the first cutting means 100 detected by the detection means 150 is supplied to the control means 50. Based on the height position information supplied to the control means 50 by the control means 50 at the time of bump cutting. The feed amount of the first cutting means 100 by the Z-axis direction feed means 110 is controlled.

  When the first cutting tool 103 of the first cutting means 100 is set at a predetermined processing height position and the first spindle 101 is operated, the table base 17 is moved to the inner side in the X-axis direction, and the wafer 1 is moved. It is sent toward the machining position that is below the first cutting means 100. As the wafer 1 is processed and fed, the tips of the bumps 4 are cut by the first cutting tool 103 from the back side in the X-axis direction toward the front side (X2 direction side in FIGS. 2 and 3). When the wafer 1 moves until it is covered with the cutting tool mounting substrate 102, the tips of all the bumps 4 are cut.

  When all the bumps 4 on the surface of the wafer 1 are cut, the first cutting means 100 is lifted and retracted from the wafer 1, while the table base 17 is moved to the front side in the X-axis direction, and the wafer 1 is fed to the supply arm. 15 is temporarily returned to the attaching / detaching position placed on the chuck table 16.

  Now, when all the bumps 4 are cut by the first cutting means 100, the heights of the tips of the respective bumps 4 are aligned in parallel with the holding surface 16a of the chuck table 16, as shown in FIG. . FIG. 5 is a view of the state in which the bumps 4 are cut by the first cutting tool 103 as viewed from the front side of the apparatus (X1 side in FIG. 2), in which the arrow corresponds to the B direction in FIG. The rotation direction of one cutting tool 103 is shown. However, as shown in the figure, when the thickness of the wafer 1 is not uniform (the thickness of the wafer 1 is gradually reduced from the left side to the right side), the bumps 4 of the semiconductor device 2 The height from the surface to the tip, that is, the length is different, and variation occurs. As described above, when the lengths of the bumps 4 are not uniform as described above, there is a problem that the quality relating to the electrical performance such as the electrical resistance, the electrical capacity, or the conduction speed is not stable. Therefore, in the electrode processing apparatus 10 of the present embodiment, a secondary process for making the lengths of the bumps 4 uniform is performed as follows.

(2-2) Secondary Step On the movement path of the table base 17 between the above attachment / detachment position and the machining position, the height detection means 300 and the second cutting means 200 are from the near side in the X-axis direction. It arrange | positions in this order toward the back side. The height detecting means 300 is a non-contact distance measuring means, and for example, an optical one that calculates a distance based on reflection when a measurement object is irradiated with light is preferably used. As shown in FIG. 6, the height detection means 300 is provided so as to be movable in the Y-axis direction along a guide rail 333 provided on a beam portion 332 of the gate-type frame 331 that straddles the movement path of the table base 17. ing.

  In the height detection means 300, as shown in FIG. 7, a measurement wave 300 a such as light emitted to the surface of the semiconductor device 2 of the wafer 1 held on the chuck table 16 and measurement emitted to the tip of the bump 4. The height position of each semiconductor device 2 and the tip height position of each bump 4 are detected by the wave 300b. The surface height of each semiconductor device 2 and the tip height of each bump 4 are detected by moving the chuck table 16 in the X-axis direction and moving the height detection means 300 to the Y-axis after the primary process is completed. It is done while moving in the direction. Thus, the surface height position of each semiconductor device 2 and the tip height position of each bump 4 at each X / Y coordinate on the surface of the wafer 1 are detected. Then, the surface height position information of the semiconductor device 2 and the tip height position information of the bump 4 at each detected X / Y coordinate are supplied to the control means 50.

  The control means 50 stores the surface height position information of the semiconductor device 2 and the tip height position information of each bump 4 at each X / Y coordinate. Further, the control means 50 recognizes the length of each bump 4 by comparing the surface height position information of the semiconductor device 2 and the tip height position information of the bump 4, and the bump 4 in each X · Y coordinate. The degree of length variation is grasped. Thereafter, the tip of the bump 4 is selectively cut by the second cutting means 200, and the lengths of all the bumps 4 are processed uniformly.

  As shown in FIG. 8, the second cutting means 200 includes a second spindle 201 having a rotation axis extending in parallel with the Z-axis direction, and a second cutting bit 203 provided at the lower end of the second spindle 201. have. The second spindle 201 is supported in a rectangular parallelepiped housing 204 and is rotated by a spindle motor (not shown). The second cutting bit 203 has a round bar shape concentrically fixed to the lower end of the second spindle 201, and a circular lower end surface is formed on the blade surface. The area of the blade surface of the second cutting bit 203 is set to a size (for example, about φ several mm) such that the tips of a plurality of adjacent bumps 4 can be cut together.

  2 and 3, the second cutting means 200 can move up and down along the Z-axis direction and along the Y-axis direction on the portal frame 231 that straddles the moving path of the table base 17. It is provided to be movable. That is, a slider 233 is mounted on the portal frame 231 via a guide 232 so as to be movable up and down in the Z-axis direction. The housing 204 of the second spindle 201 is attached to the slider 233 via the guide 234 in the Y-axis direction. It is mounted so that it can move.

  The slider 233 moves up and down in the Z-axis direction when a ball screw type Z-axis direction feeding means (second cutting means Z-axis direction feeding means) 210 driven by the servomotor 211 is operated. . Further, the housing 204 is moved in the Y-axis direction by the operation of a ball screw type Y-axis direction feeding means (second cutting means Y-axis direction feeding means) 220 driven by the servo motor 221. ing. Therefore, the second cutting means 200 can be moved up and down in the Z-axis direction together with the slider 233, and the second cutting means 200 itself can move in the Y-axis direction.

  According to the second cutting means 200, the second spindle 201 is operated to rotate the second cutting tool 203 while cutting downward by the Z-axis direction feeding means 210, so that the tip of the bump 4 is moved to the second position. The cutting tool 203 is crushed so as to be crushed.

  The Z-axis direction feeding means 210 of the second cutting means 200 is accompanied by a second cutting means Z-axis direction position detecting means 250 for detecting the movement position, that is, the height position of the second cutting means 200 in the Z-axis direction. (See FIG. 10). Further, the Y-axis direction feeding means 220 of the second cutting means 200 is accompanied by a second cutting means Y-axis direction position detecting means 260 for detecting the movement position of the second cutting means 200 in the Y-axis direction. Is provided.

  The height position information of the second cutting means 200 detected by the second cutting means Z-axis direction position detecting means 250 is supplied to the control means 50, and is supplied to the control means 50 by the control means 50 at the time of bump cutting. The feed amount of the second cutting means 200 by the Z-axis direction feed means 210 is controlled based on the height position information.

  The position information in the Y-axis direction of the second cutting means 200 detected by the second cutting means Y-axis direction position detecting means 260 is also supplied to the control means 50 and supplied to the control means 50 by the control means 50. Based on the position information in the Y-axis direction, the movement amount and position of the second cutting means 200 in the Y-axis direction by the Y-axis direction feeding means 220 are controlled.

  The secondary process proceeds as shown in FIG. First, the height detection means 300 detects the lengths of all the bumps 4 and grasps the variation in the lengths of the bumps 4 (step S1). Next, how long the current bump 4 is with respect to the target length of the bump 4 is recognized, and the cutting amount necessary to achieve the target length is set in each X / Y coordinate ( Step S2).

  Next, the tip of each bump 4 is cut with the second cutting tool 203 of the second cutting means 200 according to the set cutting amount (step S3). For this purpose, the second cutting tool 203 is moved to the X and Y coordinates where the bump 4 to be cut exists by moving the chuck table 16 in the X-axis direction and moving the second cutting means 200 in the Y-axis direction. Subsequently, the rotated second cutting bit 203 is sent downward, and the blade surface of the cutting bit 203 is pressed against the tip of the bump 4 for cutting. The feed amount of the second cutting tool 203 is controlled so that the length of the bump 4 becomes the target length. Then, the adjustment of the bump length by the second cutting tool 203 is repeatedly performed for each of the X and Y coordinates until all the bumps 4 are adjusted.

  FIG. 9 shows a state in which the bump 4 is selectively cut by the second cutting bit 203 by moving the second cutting bit 203 in the direction of the arrow. Plural pieces corresponding to are simultaneously cut. The amount of cutting of the bumps 4 depends on the target length, and is, for example, about several μm to several tens of μm in total including the primary process.

(2-3) Post-processing step When the above secondary step is completed, the wafer 1 is returned to the above-mentioned attachment / detachment position, and the vacuum operation of the chuck table 16 is stopped. Next, the wafer 1 is transferred to the spinner type cleaning device 22 by the recovery arm 21, cleaned and dried, and then accommodated in the recovery-side cassette 12 </ b> B by the transfer robot 13.

(3) Effect of Embodiment According to the electrode processing apparatus 10 of the above embodiment, the length of the bump 4 is obtained by cutting the bump 4 by the second cutting means 200 for each X / Y coordinate in the secondary process. By adjusting the thickness, even if the thickness of the wafer 1 is non-uniform and the surface height of the semiconductor device 2 varies, the lengths of all the bumps 4 can be made uniform. Therefore, in the obtained individual semiconductor device 2, the quality relating to the electrical performance such as the electric resistance, the electric capacity, or the conduction speed becomes stable.

DESCRIPTION OF SYMBOLS 1 ... Wafer 2 ... Semiconductor device 4 ... Bump (electrode)
16 ... Chuck table 16a ... Holding surface 17 ... Table base (Chuck table X-axis direction feed means)
DESCRIPTION OF SYMBOLS 50 ... Control means 100 ... 1st cutting means 101 ... 1st spindle 102 ... Cutting tool mounting board 103 ... 1st cutting tool 110 ... Z-axis direction feed means (1st cutting means Z-axis direction feed means)
150 ... first cutting means Z-axis direction position detecting means 175 ... chuck table X-axis direction position detecting means 200 ... second cutting means 201 ... second spindle 203 ... second cutting tool 210 ... Z-axis direction feeding means (Second cutting means Z-axis direction feeding means)
220... Y-axis direction feeding means (second cutting means Y-axis direction feeding means)
250 ... second cutting means Z-axis direction position detection means 260 ... second cutting means Y-axis direction position detection means 300 ... height detection means

Claims (1)

A chuck table having a holding surface parallel to the X-axis direction and the Y-axis direction orthogonal to the X-axis direction;
A first spindle having a rotation axis extending in parallel with a Z-axis direction orthogonal to the holding surface; a cutting bit mounting substrate mounted on a lower end of the first spindle; and a rotation axis of the cutting bit mounting substrate A first cutting tool disposed at an eccentric position from a plurality of protrusion-shaped projections respectively provided on a plurality of devices formed on a surface of a work held on the holding surface of the chuck table. First cutting means for cutting with the first cutting tool rotating the tip of the electrode;
First cutting means for feeding the first cutting means in the Z-axis direction; Z-axis direction feeding means;
First cutting means Z-axis direction position detecting means for detecting a movement position of the first cutting means in the Z-axis direction;
A chuck table X-axis direction feeding means for feeding the chuck table in the X-axis direction;
In an electrode processing apparatus comprising:
A second spindle having a rotation axis extending in parallel with a Z-axis direction orthogonal to the holding surface of the chuck table, and a second cutting bit provided on an extension line of the rotation axis of the second spindle; And a second cutting means for selectively cutting the tip of the electrode cut by the first cutting means,
Second cutting means for feeding the second cutting means in the Y-axis direction; Y-axis direction feeding means;
Second cutting means for feeding the second cutting means in the Z-axis direction; Z-axis direction feeding means;
Chuck table X-axis direction position detecting means for detecting the movement position of the chuck table in the X-axis direction;
Second cutting means Y-axis direction position detecting means for detecting a movement position of the second cutting means in the Y-axis direction;
Second cutting means Z-axis direction position detecting means for detecting a movement position of the second cutting means in the Z-axis direction;
A height detection means for detecting the surface height position of the device and the tip height position of the electrode at each of the X and Y coordinates of the surface of the workpiece;
Each position information detected by the chuck table X-axis direction position detection means, the second cutting means Y-axis direction position detection means, and the second cutting means Z-axis direction position detection means, and the height detection means The chuck table X-axis direction feeding means, the second cutting means Y-axis direction feeding, based on the detected surface height position information of the device and tip end height position information of the electrode at each detected X / Y coordinate Control means for controlling the means and the second cutting means Z-axis direction feed means;
An electrode processing apparatus comprising:

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