CN203715270U - Sensor assembling and packaging system - Google Patents
Sensor assembling and packaging system Download PDFInfo
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- CN203715270U CN203715270U CN201420016028.XU CN201420016028U CN203715270U CN 203715270 U CN203715270 U CN 203715270U CN 201420016028 U CN201420016028 U CN 201420016028U CN 203715270 U CN203715270 U CN 203715270U
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- manipulator
- sensor
- assembling
- chip
- microscope
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Abstract
The utility model discloses a sensor assembling and packaging system. The sensor assembling and packaging system is integrated with equipment such as microscopes, a manipulator and a bonding process platform. A charging mechanism comprises a bracket and the manipulator which is positioned on the bracket; a rotary shaft which is used for adjusting the pose of a workpiece is arranged at the front end of the manipulator; a detection mechanism comprises a first microscope and a second microscope; the first microscope is used for confirming an identifier position on a tube seat to determine the pose of the tube seat; the second microscope is positioned on a shell and is used for confirming the pose of a chip; the first microscope is positioned at the front end of the manipulator; the detection mechanism is electrically connected with a control mechanism. By confirming the poses of the tube seat and the chip by the two microscopes, respectively, the chip and the tube seat can be automatically aligned and assembled, requirements on an operator in a sensor manufacturing process are lowered, and the working efficiency is improved; meanwhile, the chip and the tube seat can be relatively effectively positioned, and the rate of finished products is improved.
Description
Technical field
The utility model belongs to MEMS assembling encapsulation technology field, is specifically related to a kind of sensor assembling package system.
Background technology
MEMS sensor is to adopt microelectronics and the produced novel sensor of micromachining technology.Compared with traditional sensor, it has, and volume is little, lightweight, cost is low, low in energy consumption, reliability is high, be suitable for mass production, be easy to integrated and realize intelligentized feature.Meanwhile, the characteristic size of micron dimension makes it can complete the irrealizable function of some traditional mechanical pick-up device.
MEMS sensor, in manufacturing process, need to assemble sensor chip and base (or substrate), then encapsulates.Current assembling commonly chip plane to base (or substrate) plane, does not generally relate to the assembling of the on-plane surface such as axis hole, step, and therefore assembly precision is less demanding.Along with the lifting of sensor function, its structure is also day by day complicated, and on-plane surface assembling displays gradually.For the making of this class MEMS sensor, present solution is: first under vision system support, manually complete contraposition assembling, then transfer on sealed in unit and encapsulate.Because MEMS sensor production is different from general micro-assembling, be the integrated of two kinds of techniques of micro-assembling and encapsulation, there are problems in this method therefore, specific as follows:
One, very high to operator requirement, operating efficiency is low.
Two, the MEMS sensor having assembled is not due to fixing in transfer process, and contraposition assembly quality cannot ensure, reduce yield rate.
Therefore, in view of above problem, be necessary to propose a kind of assembling and equipment and assembling method for packing of being packaged in one of collecting, realize the integrated of micro-assembling in MEMS sensor production process and packaging technology, on same station, realize contraposition assembling and the packaging operation of MEMS sensor chip and base (or substrate), realize the automatic operation of contraposition, assembling and encapsulation, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base, promote yield rate.
Utility model content
In view of this, the utility model provides a kind of sensor assembling package system, this system integrates the equipment such as microscope, manipulator, bonding technology platform, applying this system can realize complicated MEMS micro-structural and carry out the integrated operation of the techniques such as contraposition, assembling and encapsulation, realize the automation of sensor production, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.
A kind of sensor assembling package system proposing according to the purpose of this utility model, for the assembling encapsulation of base and chip, described system comprises housing, be positioned at charging tray on described housing, feed mechanism, the testing agency of detection workpiece pose, the controlling organization operating for bonding technology platform and the control system of workpiece bonding packaging;
Described feed mechanism comprise support be positioned at the manipulator on described support, described manipulator front end is provided with the rotating shaft for adjusting workpiece pose;
Described testing agency comprises for confirming on base that flag is to determine the first microscope of described base pose, and be positioned on described housing for confirming the second microscope of described chip pose, described the first microscope is positioned at described manipulator front end, and described testing agency is electrically connected with described controlling organization.
Preferably, described manipulator is four-degree-of-freedom manipulator.
Preferably, described manipulator comprises four-degree-of-freedom series connection mechanical arm and is positioned at the connect operation hand of mechanical arm front end of described four-degree-of-freedom and grabs, described operation hand is grabbed and is fixedly installed insulation board, described rotating shaft is arranged at described four-degree-of-freedom series connection mechanical arm front end, and is fixedly connected with described insulation board.
Preferably, the packet capturing of described operation hand is drawn together absorption hand and is grabbed and/or clamp hand and grab.
Preferably, described bonding technology platform comprise heating furnace that bonding uses, for the clamp mechanism of fixing base and adjust the elevating mechanism of described bonding technology podium level.
Preferably, described clamp mechanism comprise be arranged at the fixture of described heating furnace top, with the power part that drives described fixture action, described power part is electrically connected with described controlling organization.
Preferably, described power part is for driving cylinder.
Compared with prior art, the advantage of the disclosed sensor assembling of the utility model package system is: this system integrates the equipment such as microscope, manipulator, bonding technology platform, operate by controlling organization control manipulator, first base is positioned on bonding technology platform fixing, then chip is installed on base, finally realizes bonding packaging.Respectively the pose of base and chip is confirmed by adopting two microscopes, realize automatic aligning, assembling between chip and base, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.Apply this system and can realize complicated MEMS micro-structural and on a machine, realize the assembling of sensor cluster and the integrated operation of bonding packaging simultaneously, realize the automation of sensor production.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the disclosed a kind of sensor assembling package system of the utility model.
Fig. 2 is the top view of the disclosed a kind of sensor assembling package system of the utility model.
Fig. 3 is the structural representation that operation hand is grabbed.
Fig. 4 is the structural representation of bonding technology platform.
Fig. 5 is assembling encapsulation flow chart.
The title of the numeral in figure or the corresponding component of alphabetical representative:
1, housing 2, charging tray 3, feed mechanism 4, testing agency 5, bonding technology platform
31, support 32, four-degree-of-freedom series connection mechanical arm 33, operation hand are grabbed
331, insulation board 332, cylinder 333, suction nozzle 334, electric jaw 335, electrode
41, the first microscope 42, the second microscope
51, heating furnace 52, fixture 53, handle 54, driving cylinder 55, elevating mechanism
Detailed description of the invention
The preparation method of MEMS sensor on-plane surface assembling is: first under vision system support, manually complete contraposition assembling, then transfer on sealed in unit and encapsulate.Because MEMS sensor production is different from general micro-assembling, be the integrated of two kinds of techniques of micro-assembling and encapsulation, very high to operator requirement, operating efficiency is low.The MEMS sensor having assembled is not due to fixing in transfer process, and contraposition assembly quality cannot ensure, reduce yield rate.
The utility model is for deficiency of the prior art, a kind of sensor assembling package system is provided, this system integrates the equipment such as microscope, manipulator, bonding technology platform, applying this system can realize complicated MEMS micro-structural and carry out the integrated operation of the techniques such as automatic aligning, assembling and encapsulation, realize the automation of sensor production, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.
To be clearly and completely described the technical solution of the utility model by detailed description of the invention below.Obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Please also refer to Fig. 1 to Fig. 5, a kind of sensor assembling package system, for the assembling encapsulation of base and chip, this system comprises housing 1, be positioned at charging tray 2 on housing 1, feed mechanism 3, detect the testing agency 4 of workpiece pose, bonding technology platform 5 for workpiece bonding packaging, and the controlling organization of control system running.Feed mechanism 3 comprises support 31 and is positioned at the manipulator on support 31; Manipulator is four-degree-of-freedom manipulator.
Manipulator comprises four-degree-of-freedom series connection mechanical arm 32 and is positioned at the connect operation hand of mechanical arm 32 front ends of four-degree-of-freedom and grabs 33, operation hand is grabbed and on 33, is fixedly installed insulation board 331, four-degree-of-freedom series connection mechanical arm 32 front ends are provided with rotating shaft (not shown), and rotating shaft is fixedly connected with insulation board 331.Driving operation hand to grab 33 by rotating shaft moves or rotates.
Operation hand is grabbed 33 and is comprised that absorption hand grabs and/or clamp hand and grab.Cylinder 332 and suction nozzle 333 are drawn together in absorption hand packet capturing, and absorption hand is grabbed for adsorbing chip class workpiece, electric jaw 334 and electrode 335 are drawn together in the packet capturing of clamping hand, and clamping hand is grabbed for clamping larger-size workpiece as base etc.Operation hand is grabbed the absorption that can realize chip or base or clamping operation, and applies voltage and carry out electrostatic bonding.
Testing agency 4 comprises for confirming on base that flag is to determine the first microscope 41 of base pose, and be positioned at housing 1 for confirming the second microscope 42 of chip pose, the first microscope 41 is positioned at the front end of four-degree-of-freedom series connection mechanical arm 32, and testing agency 4 is electrically connected with controlling organization.Controlling organization is according to the signal controlling feed mechanism 3 of testing agency's feedback and the work of bonding technology platform 5.
The running of controlling organization control manipulator, first pick up base, base is positioned on bonding technology platform fixing, on the first microscopic examination base, flag is to determine base pose, for chip contraposition provides pose benchmark, then manipulator pick-up chip, and adjust chip pose according to the second microscopical feedback signal, after chip correspondence is installed on base, finally realize bonding packaging.
Bonding technology platform 5 comprises heating furnace 51 that bonding uses, for the clamp mechanism of fixing base and adjust the elevating mechanism 55 of bonding technology platform 5 height.Clamp mechanism comprise be arranged at the fixture 52 of heating furnace 51 tops, with drive the power part that moves of fixture 52, power part is electrically connected with controlling organization.
Wherein, power part is for driving cylinder 54.Or directly manually pulling handle 53 to drive fixture to move clamps or unclamp etc., specifically do not limit.
A kind of sensor assembling method for packing, adopts sensor assembling package system, and concrete steps are as follows:
(1), first technological parameter is set: comprise position relationship parameter, bonding parameter between the speed of service, bonding position and the equipment initial point of manipulator; Bonding mode comprises anode linkage (bonding voltage DC900-1200V, bonding time 50-2000s, bonding pressure 0.1-50g, bonding temperature 250-550 DEG C), thermocompression bonding (bonding time 50-2000s, bonding pressure 0.1-500g, bonding temperature 250-550 DEG C) or viscose glue bonding (bonding time 50-2000s, bonding pressure 0.1-500g) etc.;
(2), put into workpiece in charging tray, workpiece comprises base and chip;
(3), base is picked up in the operation of controlling organization control manipulator, mobile being positioned on bonding technology platform, its clamping is fixed in clamp mechanism action simultaneously, simultaneously the flag on the first microscopic examination base, confirm the pose of base, for chip contraposition provides pose benchmark;
(4), controlling organization control manipulator operation pick-up chip, the pose of the second microscopic examination chip, manipulator is adjusted chip pose according to detection signal and is calculated the movement locus of manipulator, manipulator drives chip operation that chip is assemblied on base;
(5), adopt the Z axis corrective action of manipulator, adjust the pressure between chip and base;
(6), start heating furnace and carry out bonding packaging;
(7), after bonding completes, manipulator picks up workpiece mobile being positioned in charging tray after bonding.
Because testing agency can not adjust in Z-direction, therefore, adjust bonding technology position of platform by elevating mechanism, be located in the job area of testing agency.Before step 3, also comprise the step of adjusting bonding technology podium level.
The utility model discloses a kind of sensor assembling package system, this system integrates the equipment such as microscope, manipulator, bonding technology platform, operate by controlling organization control manipulator, first base is positioned on bonding technology platform fixing, then chip is installed on base, finally realizes bonding packaging.Respectively the pose of base and chip is confirmed by adopting two microscopes, realize automatic aligning, assembling between chip and base, reduce the requirement to operator in sensor production process, increase work efficiency, ensure the effective location between chip and base simultaneously, promote yield rate.Apply this system and can realize complicated MEMS micro-structural and on a machine, realize the assembling of sensor cluster and the integrated operation of bonding packaging simultaneously, realize the automation of sensor production.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a sensor assembling package system, for the assembling encapsulation of base and chip, it is characterized in that, described system comprises housing, be positioned at charging tray on described housing, the testing agency of feed mechanism, detection workpiece pose, for the bonding technology platform of workpiece bonding packaging and the controlling organization of control system running;
Described feed mechanism comprise support be positioned at the manipulator on described support, described manipulator front end is provided with the rotating shaft for adjusting workpiece pose;
Described testing agency comprises for confirming on base that flag is to determine the first microscope of described base pose, and be positioned on described housing for confirming the second microscope of described chip pose, described the first microscope is positioned at described manipulator front end, and described testing agency is electrically connected with described controlling organization.
2. sensor assembling package system as claimed in claim 1, is characterized in that, described manipulator is four-degree-of-freedom manipulator.
3. sensor assembling package system as claimed in claim 2, it is characterized in that, described manipulator comprises four-degree-of-freedom series connection mechanical arm and is positioned at the connect operation hand of mechanical arm front end of described four-degree-of-freedom and grabs, described operation hand is grabbed and is fixedly installed insulation board, described rotating shaft is arranged at described four-degree-of-freedom series connection mechanical arm front end, and is fixedly connected with described insulation board.
4. sensor as claimed in claim 3 assembling package system, is characterized in that, the packet capturing of described operation hand is drawn together absorption hand and grabbed and/or clamp hand and grab.
5. sensor as claimed in claim 1 assembling package system, is characterized in that, described bonding technology platform comprises heating furnace that bonding uses, for the clamp mechanism of fixing base and adjust the elevating mechanism of described bonding technology podium level.
6. sensor as claimed in claim 5 assembling package system, is characterized in that, described clamp mechanism comprise be arranged at the fixture of described heating furnace top, with the power part that drives described fixture action, described power part is electrically connected with described controlling organization.
7. sensor assembling package system as claimed in claim 6, is characterized in that, described power part is for driving cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420016028.XU CN203715270U (en) | 2014-01-10 | 2014-01-10 | Sensor assembling and packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420016028.XU CN203715270U (en) | 2014-01-10 | 2014-01-10 | Sensor assembling and packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203715270U true CN203715270U (en) | 2014-07-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420016028.XU Expired - Fee Related CN203715270U (en) | 2014-01-10 | 2014-01-10 | Sensor assembling and packaging system |
Country Status (1)
| Country | Link |
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| CN (1) | CN203715270U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108408684A (en) * | 2018-04-17 | 2018-08-17 | 大连理工大学 | A kind of alignment bonding apparatus made for MEMS device |
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
-
2014
- 2014-01-10 CN CN201420016028.XU patent/CN203715270U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108408684A (en) * | 2018-04-17 | 2018-08-17 | 大连理工大学 | A kind of alignment bonding apparatus made for MEMS device |
| CN108408684B (en) * | 2018-04-17 | 2020-06-16 | 大连理工大学 | Alignment bonding device for manufacturing MEMS (micro-electromechanical system) device |
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20170110 |