CN108408684B - Alignment bonding device for manufacturing MEMS (micro-electromechanical system) device - Google Patents
Alignment bonding device for manufacturing MEMS (micro-electromechanical system) device Download PDFInfo
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- CN108408684B CN108408684B CN201810372288.3A CN201810372288A CN108408684B CN 108408684 B CN108408684 B CN 108408684B CN 201810372288 A CN201810372288 A CN 201810372288A CN 108408684 B CN108408684 B CN 108408684B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/002—Aligning microparts
- B81C3/004—Active alignment, i.e. moving the elements in response to the detected position of the elements using internal or external actuators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
Abstract
The invention belongs to the technical field of alignment bonding, and relates to an alignment bonding device for manufacturing an MEMS (micro-electromechanical system) device. The device comprises a base, a main two-dimensional moving platform, a supporting frame, an auxiliary three-dimensional moving platform, a leveling component, a rotating component and a CCD (charge coupled device) observation component; the base is provided with a bracket, and the bracket is detachably provided with a CCD observation assembly; the main two-dimensional moving platform is fixed on the base, and the support frame is fixed on the main two-dimensional moving platform; the auxiliary three-dimensional moving platform is fixed on the support frame, the XY-axis moving platform is a magnet type moving platform, and the Z-axis moving platform is a spiral screw rod platform; the leveling component is in spherical contact leveling and is fixed on the Z-axis moving platform; the rotating assembly is used for spherical contact leveling and is positioned above the leveling assembly, and the incomplete sphere at the bottom is in contact with the leveling assembly. The alignment bonding device integrates the functions of alignment, leveling and bonding, and solves the problem of larger error of manually aligning the chip.
Description
Technical Field
The invention belongs to the technical field of alignment bonding, and relates to an alignment bonding device for manufacturing an MEMS (micro-electromechanical system) device.
Background
The English full name of MEMS is: Micro-Electro-Mechanical Systems, also commonly referred to as Micro-electromechanical Systems, refer to high-tech devices with dimensions of several millimeters or less, have internal structures generally in the micrometer or nanometer scale, are independent intelligent Systems, and are Micro devices or Systems integrating Micro sensors, Micro actuators, Micro Mechanical structures, Micro power sources, Micro energy sources, signal processing and control circuits, high-performance electronic integrated devices, interfaces, and communication. MEMS technology is a broadening and extension of microelectronic technology. The micro-electronic technology and the precision machining technology are fused with each other, are revolutionary new technologies, are widely applied to high and new technology industries, and are key technologies related to national scientific and technological development, economic prosperity and national defense safety.
MEMS devices usually have a 3D microstructure, such as a microfluidic chip, and the conventional processing method is difficult to process the 3D microstructure, so researchers propose a method of bonding two chips with microstructures on top and bottom to fabricate the 3D microstructure. The alignment bonding apparatus generally uses a CCD camera and a fine adjustment platform to achieve precise bonding of two layers of chips, but the microstructure on the chip is usually between several micrometers and several tens of micrometers, and even with a microscope, large errors may be generated by manual adjustment.
Disclosure of Invention
The invention aims to provide an alignment bonding device for manufacturing a micro-mechanical device, which realizes high-precision bonding of two layers of chips with microstructures.
The technical scheme of the invention is as follows:
an alignment bonding device for manufacturing an MEMS device comprises a base 1, a main two-dimensional moving platform 2, a supporting frame 3, an auxiliary three-dimensional moving platform 4, a leveling component 5, a rotating component 6 and a CCD observation component 7;
the base 1 is provided with a bracket for dismounting and mounting the CCD observation assembly 7;
the main two-dimensional moving platform 2 is a spiral screw rod platform and is fixed on the base 1; the main two-dimensional moving platform 2 comprises a shell, a slide way, a slide block, a lead screw, a nut, a coupling and a nut seat, wherein a support frame 3 is fixed on the nut seat;
the support frame 3 is of a frame structure with a bottom plate, the bottom plate is fixed on a nut seat of the main two-dimensional moving platform 2, when a lead screw of the main two-dimensional moving platform 2 rotates, a nut is converted into linear motion along with the rotation angle of the lead screw according to a corresponding lead, the main two-dimensional moving platform 2 moves along the XY axis direction and drives the support frame 3 to move along the XY axis direction, and therefore accurate positioning of a chip and the CCD observation assembly 7 is achieved; the upper end of the support frame 3 is provided with a slot, a glass plate A32 is inserted into the slot and fixed on the support frame 3 through a bolt 31, and the lower surface of the glass plate A32 is fixed with an upper chip of a microstructure; vertical plates are arranged on two sides of the bottom plate of the support frame 3 in the X-axis direction, the vertical plate on one side is used for supporting a spiral differential head a411 of the secondary three-dimensional moving platform 4, and a strong magnet piece 412 is attached to the vertical plate on the other side; v-shaped guide rails 413 are fixed on two sides of the bottom plate of the support frame 3 in the Y-axis direction and matched with the V-shaped guide rails 413 of the X-axis moving platform 41;
the auxiliary three-dimensional moving platform 4 is a combined platform, is positioned in the support frame 3 and is fixed on the bottom plate of the support frame 3; the auxiliary three-dimensional moving platform 4 comprises an X-axis moving platform 41, a Y-axis moving platform 42 and a Z-axis moving platform 43; the X-axis moving platform 41 is positioned at the bottom, the V-shaped guide rail on the lower surface is matched with the V-shaped guide rail of the support frame 3, and relative sliding is realized through the V-shaped guide rail; the Y-axis moving platform 42 is positioned on the upper surface of the X-axis moving platform 41, the V-shaped guide rail on the lower surface of the Y-axis moving platform 42 is matched with the V-shaped guide rail on the upper surface of the X-axis moving platform 41, and relative sliding is realized through the V-shaped guide rails; the Z-axis moving platform 43 is fixed on one side of the vertical reinforcing plate of the Y-axis moving platform 42;
v-shaped guide rails 413 are respectively fixed on two sides of the lower surface of the X-axis moving platform 41 in the Y-axis direction and are matched with the V-shaped guide rails 413 on the support frame 3, a retainer 415 is arranged between the two matched V-shaped guide rails 413, balls 414 are placed in V-shaped grooves of the V-shaped guide rails 413, and the retainer 415 and the balls 414 realize relative sliding; the X-axis moving platform 41 has two sides in the X-axis direction, one side of which is provided with a spiral differential head a411 and the other side of which is adhered with a strong magnet piece 412, and the two sides correspond to the strong magnet piece 412 on the vertical plate of the bottom plate of the supporting frame 3; the upper surface of the X-axis moving platform 41 is provided with vertical plates at two sides in the Y direction, a spiral differential head a411 is arranged on the vertical plate at one side, the spiral differential head a411 is contacted with one side surface of the Y-axis moving platform 42, and a strong magnet piece 412 is attached to the vertical plate at the other side and corresponds to the strong magnet piece 412 at the side surface of the Y-axis moving platform 42; v-shaped guide rails 413 are fixed on the upper surface of the X-axis moving platform 41 at two sides in the X direction; v-shaped guide rails 413 are fixed on two sides of the lower surface of the Y-axis moving platform 42 in the X direction, and are matched with the V-shaped guide rails 413 on the upper surface of the X-axis moving platform 41 through a retainer 415 and balls 414 to realize relative sliding; the Y-axis moving platform 42 has spiral differential heads a411 mounted on one side and strong magnet pieces 412 attached to the other side on both sides in the Y-axis direction, and corresponds to the strong magnet pieces 412 on the vertical plate of the X-axis moving platform 41; two spiral differential heads a411 are respectively in close contact with the side surfaces of the X-axis moving platform 41 and the Y-axis moving platform 42 through repulsive force generated between the groups of strong magnet sheets 412, pre-compression force and repulsive force of the spiral differential heads a411 are counteracted through guidance of the spiral differential heads a411, and then the fine adjustment knob pair three-dimensional moving platform 4 of the spiral differential heads a411 is adjusted to respectively move along the direction of X, Y axes; the Y-axis moving platform 42 is provided with a vertical reinforcing plate, the vertical reinforcing plate is provided with a slide way, a slide block, a lead screw, a nut seat, a coupling and a knob, the slide way is fixed on one side of the vertical reinforcing plate, the slide block is connected with the slide way through a slide groove, and the other side of the slide block is fixed on a vertical plate of the Z-axis moving platform 43; the screw rod and the nut are provided with arc-shaped spiral grooves, the screw rod and the nut are sleeved together to form a spiral raceway, and balls are placed in the spiral raceway; one end of the screw rod is provided with a coupling, the knob is fixed on the coupling, the nut seat is of a hollow structure and is tightly matched with one end of the nut, and the upper surface of the nut seat is provided with a threaded hole for fixing the Z-axis moving platform 43; when the knob is twisted to rotate the lead screw, the nut is converted into linear motion along with the rotation angle of the lead screw according to the corresponding lead, so that the Z-axis moving platform 43 moves along the Z-axis direction; the Z-axis moving platform 43 is a gamma-shaped structural plate consisting of a vertical plate and a horizontal plate, the vertical plate is fixed on a nut seat of the Y-axis moving platform 42, and the horizontal plate is provided with a spherical groove 44 and a threaded hole;
the leveling component 5 is matched with a threaded hole in a horizontal plate of the Z-axis moving platform 43 through a bolt and is movably connected to the horizontal plate of the Z-axis moving platform 43, the leveling component 5 comprises a quick clamp 51, a ball clamp a52, a connecting piece 53 and a ball clamp b54, and the leveling component 5 is used for clamping and leveling the incomplete sphere 61; one side of each of the ball clamp a52 and the ball clamp b54 is provided with a semicircular opening, the two are symmetrically arranged, one end of each of the two is connected by a connecting piece 53, and the other end of each of the two is connected by a quick clamp 51; the rapid clamp 51 is a door buckle type clamp and is used for clamping the incomplete sphere 61;
the rotating component 6 is used for spherical contact leveling and is positioned above the leveling component 5, and the incomplete sphere 61 at the bottom is in contact with the leveling component 5; the rotating assembly 6 mainly comprises an incomplete sphere 61, a base plate 62, a carrying plate 63 and a rotating mechanism 64; the incomplete sphere 61 is fixed on the lower surface of the base plate 62, the lower hemisphere is complete, and the incomplete sphere is contacted with the spherical groove 44 on the horizontal plate of the Z-axis moving platform 43; the rotating mechanism 64 comprises a spring center 641, a moving block 642, a fixed block 643 and a spiral differential head b 644; a notch is formed in the middle of the fixed block 643, the moving block 642 is located in the notch, the fixed block 643 is fixed on the upper surface of the base plate 62, and the moving block 642 is fixed on the lower surface of the carrying plate 63; the spiral differential head b644 and the spring center 641 are respectively contacted with the two sides of the moving block 642, and the fine adjustment knob of the spiral differential head b644 is adjusted to push the moving block 642 to move towards one side of the spring center 641, so that the spring in the spring center 641 is compressed, and the moving block 642 drives the loading plate 63 to rotate around the central shaft; the upper surface of the carrying plate 63 is fixed with a glass plate B, and the upper surface of the glass plate B is fixed with a lower chip with a microstructure.
The base 1 is made of metal; the support frame 3 is made of aluminum alloy.
The frame of the support frame 3 is connected with the bottom plate through screws or is processed into a whole.
The X-axis moving stage 41, the Y-axis moving stage 42, and the Z-axis moving stage 43 are made of a non-magnetic material.
The invention has the beneficial effects that:
1. the problem of large error of manually aligning the chip is solved;
2. the spiral screw rod has a self-locking function, so that the positioning accuracy of the chip and the CCD observation assembly is improved;
3. the upper chip is fixed in position, and the lower chip and the upper chip are precisely positioned through the auxiliary three-dimensional moving platform and the rotating assembly;
4. the introduction of the leveling component solves the gap problem caused by the unparallel of the upper chip and the lower chip;
5. the method has the advantages of integration of alignment and bonding functions, simple operation and strong expandability, and can bond chips such as silicon chips/PMMA, silicon chips \ glass, glass \ PMMA and the like.
Drawings
FIG. 1 is a front view of the apparatus of the present invention.
Fig. 2 is a right side view of fig. 1.
Fig. 3 is a top view of fig. 1.
Fig. 4 is a schematic structural view of the supporting frame 3.
Fig. 5 is a schematic view of the fixing manner of the glass plate a.
Fig. 6 is a schematic perspective view of a sub three-dimensional mobile platform.
Fig. 7 is a schematic structural diagram of the X-axis moving platform.
FIG. 8 is a schematic structural diagram of a Y-axis moving stage.
FIG. 9 is a schematic diagram showing the positional relationship between the X-axis movable stage and the Y-axis movable stage.
FIG. 10 is a schematic view of the leveling and rotating assembly.
FIG. 11 is a simplified schematic view of a leveling assembly.
FIG. 12 is a view showing the structure of the quick clamp.
FIG. 13 is a schematic view of the connection between the substrate and the carrier plate.
Fig. 14 is a simplified schematic diagram of the rotating assembly.
In the figure: 1, a base; 2, a main two-dimensional mobile platform; 3, supporting a frame; 4 pairs of three-dimensional moving platforms; 5 leveling the assembly; 6, rotating the assembly; 7 a CCD observation assembly; 31 a bolt; 32 glass plates A; 41X-axis moving platform; a 42Y-axis moving platform; 43Z-axis moving platform; 44 a spherical groove; (ii) a411 helical differential head a; a 412 strong magnet piece; 413 a V-shaped rail; 414 balls; 415 a holder; 51, a quick clamp; 52 ball clamp a; 53 connecting pieces; 54 ball clips b; 511 draw the hook; 512 rivets; 513 a nut; 514 a round-head nut; 515 holding the handle; 516 pin; 517 metal plates; 518 tensioning the links; 61 incomplete spheres; 62 a substrate; 63 a loading plate; 64 a rotation mechanism; 621 disc a; 622 circular plate B; 623 fastening the screw; 641 a spring tip; 642 moving the block; 643 a fixed block; 644 spiral differential head b.
Detailed Description
The invention will be further explained in detail with reference to the drawings and technical solutions.
As shown in fig. 1-3, an alignment bonding device for manufacturing an MEMS device includes a base 1, a main two-dimensional moving platform 2, a supporting frame 3, an auxiliary three-dimensional moving platform 4, a leveling component 5, a rotating component 6 and a CCD observing component 7, wherein the base 1 is provided with a support, the support is detachably mounted with the CCD observing component 7, the main two-dimensional moving platform 2 is a spiral screw platform and is fixed on the base 1, the two-dimensional moving platform 2 is provided with the supporting frame 3, the supporting frame 3 can realize XY axis movement, and accurate positioning of a chip and the CCD observing component 7 is realized.
As shown in fig. 4-5, the upper end of the supporting frame 3 is provided with a slot, into which a glass plate a32 can be inserted, the glass plate a32 is fixed on the supporting frame 3 by six bolts 31, and the upper chip with microstructure is fixed on the lower surface of the glass plate a 32.
As shown in fig. 6, the auxiliary three-dimensional moving platform 4 is located in the supporting frame 3 and fixed on the bottom plate of the supporting frame 3, the X, Y-axis movement is magnet-type movement, so that the positioning of the lower chip and the upper chip X, Y in the axial direction is realized, the Z-axis movement is screw-type movement, and the auxiliary three-dimensional moving platform has self-locking property and accurate positioning, can not only realize the direct contact of the surfaces of the upper and lower chips, but also apply a certain bonding force.
As shown in fig. 10, the rotating component 6 is a spherical contact leveling component, is positioned above the leveling component 5 and is in contact with the leveling component 5; the glass plate B is fixed on the rotating assembly 6 in a non-exclusive way, and the lower chip with the microstructure is fixed on the upper surface of the glass plate B, and the specific operations are as follows: the relative position of the chip and the CCD observation assembly 7 can be realized by adjusting the main two-dimensional moving platform 2, and the optimal observation visual field and the optimal magnification are obtained. And adjusting a screw rod in the Z-axis direction to pre-contact the upper chip and the lower chip, loosening the quick clamp 51, enabling the incomplete sphere 61 to freely rotate around the spherical surfaces of the ball clamp a52 and the ball clamp b54, continuously lifting the screw rod until the Z-axis displacement reaches the limit, and fastening the quick clamp 51 to realize the relative fixation of the ball clamp a52, the ball clamp b54 and the incomplete sphere 61. At the moment, the lower chip is in seamless direct contact with the upper chip, then the screw rod is lowered to obtain two parallel surfaces with high precision, the X-axis moving platform 41, the Y-axis moving platform 42 and the rotating assembly 6 are adjusted to realize the accurate alignment of the microstructures of the upper chip and the lower chip, and finally the screw rod is lifted again to uniformly apply a certain bonding force. The bonding device integrates the functions of alignment, leveling and bonding, and solves the problem of larger error of manually aligning the chip.
Further, the base 1 material is preferably the metal material that intensity is higher, need process some screw holes on the base 1 to in fixed main two-dimensional formula moving platform 2, base 1 should have a basis weight, avoid the integrated device to empty. The support frame 3 is preferably made of aluminum alloy with light weight, and the frame and the bottom plate can be connected through screws or can be integrally processed.
Further, the X-axis moving platform 41, the Y-axis moving platform 42, and the Z-axis moving platform 43 are made of non-magnetic materials, as shown in fig. 9, the strong magnet piece 412 in the X-axis direction of the X-axis moving platform 41 corresponds to the strong magnet piece on the vertical plate on the bottom plate of the supporting frame 3; the strong magnet piece in the Y-axis direction of the Y-axis moving platform 42 corresponds to the strong magnet piece on the vertical plate of the X-axis moving platform 41; certain repulsive force can be generated among the groups of strong magnetic sheets, the spiral differential head a411 is tightly contacted with the sides of the X-axis moving platform 41 and the Y-axis moving platform 42, the pre-compression force and the repulsive force of the spiral differential head a411 are mutually counteracted by guiding through the spiral differential head a411, and then the fine adjustment knob is adjusted to enable the lower chip to move along the direction of the X, Y axis.
Further, the incomplete sphere 61 and the spherical groove 44 need to have a certain processing accuracy.
Further, as shown in fig. 12, the door buckle type quick clamp 51 is a commercially available product, and includes a draw hook 511, a rivet 512, a nut 513, a round nut 514, a handle 515, a pin 516, a sheet metal 517, and a tension link 518, wherein the tension link 518 is U-shaped, a closed end is fixed on the draw hook 511, and an open end is fixed on the sheet metal 517 through the nut 513, the round nut 514, and the pin 516; the handle 515 is fixedly arranged on the sheet metal 517 and is positioned in the middle of one end of the opening of the tensioning connecting rod 518; but is not limited to this manner of attachment.
Further, the carrying plate 63 of the rotating assembly is a movable member relative to the base plate 62, the connection mode is as shown in fig. 13, the circular plate a621 is connected to the upper surface of the base plate 62 through a bolt, a unidirectional cylinder structure is arranged at the center of the circular plate a621, the circular plate B622 is connected to the lower surface of the carrying plate 63 through a bolt, a unidirectional column hole structure is arranged at the center of the circular plate B622, the unidirectional cylinder structure and the unidirectional column hole structure are assembled in a clearance mode, a countersunk hole is arranged at the center of the carrying plate 63, a fastening screw 623 penetrates through the countersunk hole and contacts with the unidirectional column hole, the carrying plate 63 is kept horizontal by the connection mode, and the carrying plate 63 can rotate around the central shaft in a. The rotation mechanism 64 relatively rotates the carrier plate 63 around the central axis to a small extent with the screws 623 tightened. As shown in fig. 14, in the rotating mechanism 64, the moving block 642 is fixed to the carrier plate 63 by a bolt, the fixed block 643 is fixed to the base plate 62 by a bolt, the spiral differential head b644 and the spring tip 641 are respectively in contact with both sides of the moving block 642, the fine adjustment knob of the spiral differential head b644 is adjusted, the spring in the spring tip 641 is compressed, and the moving block 642 drives the carrier plate 63 to rotate.
Further, the glass panel must be easily removed by fastening it, as shown in fig. 5, by loosening the six bolts fastening the glass panel a32, so that the glass panel a32 can be easily removed, but the fastening of the glass panel B is not exclusive, as: a piece of square PDMS can be placed on the carrying plate 63 of the rotating component 6, and the adhesion property is realized at the bottom of the glass plate by utilizing the soft and adsorption property of the PDMS, so that the glass plate can be fixed on the carrying plate. If the chip is processed by plasma treatment, the alignment and bonding are completed at the same time, and if the chip is not processed, because the glass plate A32 and the glass plate B are easy to detach, the two glass plates and the chip can be fixed by the clamp at the same time, and then subsequent heating treatment and other treatment are carried out.
Claims (5)
1. An alignment bonding device for manufacturing an MEMS device is characterized by comprising a base (1), a main two-dimensional moving platform (2), a supporting frame (3), an auxiliary three-dimensional moving platform (4), a leveling component (5), a rotating component (6) and a CCD observation component (7);
the base (1) is provided with a bracket for dismounting and mounting the CCD observation assembly (7);
the main two-dimensional moving platform (2) is a spiral screw rod platform and is fixed on the base (1); the main two-dimensional moving platform (2) comprises a shell, a slide way, a slide block, a lead screw, a nut, a coupling and a nut seat, wherein a support frame (3) is fixed on the nut seat;
the support frame (3) is of a frame structure with a bottom plate, the bottom plate is fixed on a nut seat of the main two-dimensional moving platform (2), when a lead screw of the main two-dimensional moving platform (2) rotates, a nut is converted into linear motion along with the rotation angle of the lead screw according to a corresponding lead, the main two-dimensional moving platform (2) moves along the XY axis direction and drives the support frame (3) to move along the XY axis direction, and therefore accurate positioning of a chip and the CCD observation assembly (7) is achieved; the upper end of the support frame (3) is provided with a slot, a glass plate A (32) is inserted into the slot and fixed on the support frame (3) through a bolt (31), and an upper chip of a microstructure is fixed on the lower surface of the glass plate A (32); vertical plates are arranged on two sides of the bottom plate of the support frame (3) in the X-axis direction, the vertical plate on one side is used for supporting a spiral differential head a (411) of the secondary three-dimensional moving platform (4), and a strong magnet sheet (412) is attached to the vertical plate on the other side; v-shaped guide rails (413) are fixed on two sides of the bottom plate of the support frame (3) in the Y-axis direction and matched with the V-shaped guide rails (413) of the X-axis moving platform (41);
the auxiliary three-dimensional moving platform (4) is a combined platform, is positioned in the support frame (3) and is fixed on the bottom plate of the support frame (3); the auxiliary three-dimensional moving platform (4) comprises an X-axis moving platform (41), a Y-axis moving platform (42) and a Z-axis moving platform (43); the X-axis moving platform (41) is positioned at the bottom, the V-shaped guide rail on the lower surface is matched with the V-shaped guide rail of the support frame (3), and relative sliding is realized through the V-shaped guide rail; the Y-axis moving platform (42) is positioned on the upper surface of the X-axis moving platform (41), the V-shaped guide rail on the lower surface of the Y-axis moving platform (42) is matched with the V-shaped guide rail on the upper surface of the X-axis moving platform (41), and relative sliding is realized through the V-shaped guide rails; the Z-axis moving platform (43) is fixed on one side of the vertical reinforcing plate of the Y-axis moving platform (42);
v-shaped guide rails (413) are respectively fixed on two sides of the lower surface of the X-axis moving platform (41) in the Y-axis direction and matched with the V-shaped guide rails (413) on the supporting frame (3), a retainer (415) is arranged between the two matched V-shaped guide rails (413), balls (414) are placed in V-shaped grooves of the V-shaped guide rails (413), and relative sliding is realized through the retainer (415) and the balls (414); the X-axis moving platform (41) is provided with a spiral differential head a (411) at one side and a strong magnet piece (412) at the other side at two sides in the X-axis direction, and the spiral differential head a corresponds to the strong magnet piece (412) on the vertical plate of the bottom plate of the support frame (3); the upper surface of the X-axis moving platform (41) is provided with vertical plates on two sides in the Y direction, a spiral differential head a (411) is arranged on the vertical plate on one side, the spiral differential head a (411) is contacted with one side surface of the Y-axis moving platform (42), and a strong magnet piece (412) is attached to the vertical plate on the other side and corresponds to the strong magnet piece (412) on the side surface of the Y-axis moving platform (42); v-shaped guide rails (413) are fixed on the upper surface of the X-axis moving platform (41) at two sides in the X direction; v-shaped guide rails (413) are fixed on the lower surface of the Y-axis moving platform (42) at two sides in the X direction, and are matched with the V-shaped guide rails (413) on the upper surface of the X-axis moving platform (41) through a retainer (415) and balls (414) to realize relative sliding; the Y-axis moving platform (42) is provided with a spiral differential head a (411) at one side and a strong magnet piece (412) at the other side at two sides in the Y-axis direction, and the spiral differential head a corresponds to the strong magnet piece (412) on the vertical plate of the X-axis moving platform (41); repulsive force generated among the groups of strong magnet pieces (412), two spiral differential heads a (411) are respectively in close contact with the side surfaces of the X-axis moving platform (41) and the Y-axis moving platform (42), pre-compression force and repulsive force of the spiral differential heads a (411) are mutually counteracted through guidance of the spiral differential heads a (411), and then a fine adjustment knob pair three-dimensional moving platform (4) of the spiral differential heads a (411) is adjusted to respectively move along the direction of X, Y axis; the Y-axis moving platform (42) is provided with a vertical reinforcing plate, the vertical reinforcing plate is provided with a slide way, a slide block, a lead screw, a nut seat, a coupling and a knob, the slide way is fixed on one side of the vertical reinforcing plate, the slide block is connected with the slide way through a slide groove, and the other side of the slide block is fixed on a vertical plate of the Z-axis moving platform (43); the screw rod and the nut are provided with arc-shaped spiral grooves, the screw rod and the nut are sleeved together to form a spiral raceway, and balls are placed in the spiral raceway; one end of the screw rod is provided with a coupling, the knob is fixed on the coupling, the nut seat is of a hollow structure and is tightly matched with one end of the nut, and the upper surface of the nut seat is provided with a threaded hole for fixing the Z-axis moving platform (43); when the knob is twisted to enable the lead screw to rotate, the nut is converted into linear motion along with the rotation angle of the lead screw according to the corresponding lead, and therefore the Z-axis moving platform (43) moves along the Z-axis direction; the Z-axis moving platform (43) is a gamma-shaped structural plate consisting of a vertical plate and a horizontal plate, the vertical plate is fixed on a nut seat of the Y-axis moving platform (42), and the horizontal plate is provided with a spherical groove (44) and a threaded hole;
the leveling component (5) is matched with a threaded hole in a horizontal plate of the Z-axis moving platform (43) through a bolt and movably connected to the horizontal plate of the Z-axis moving platform (43), the leveling component (5) comprises a quick clamp (51), a ball clamp a (52), a connecting piece (53) and a ball clamp b (54), and the leveling component (5) is used for clamping and leveling an incomplete ball body (61); one side of the ball clamp a (52) and one side of the ball clamp b (54) are provided with semicircular openings which are symmetrically arranged, one ends of the ball clamp a and the ball clamp b are connected through a connecting piece (53), and the other ends of the ball clamp a and the ball clamp b are connected through a quick clamp (51); the rapid clamp (51) is a door buckle type clamp and is used for clamping the incomplete sphere (61);
the rotating component (6) is used for spherical contact leveling and is positioned above the leveling component (5), and the incomplete sphere (61) at the bottom is in contact with the leveling component (5); the rotating assembly (6) mainly comprises an incomplete sphere (61), a base plate (62), an object carrying plate (63) and a rotating mechanism (64); the incomplete sphere (61) is fixed on the lower surface of the base plate (62), the lower hemisphere is complete, and the incomplete sphere is contacted with a spherical groove (44) on a horizontal plate of the Z-axis moving platform (43); the rotating mechanism (64) comprises a spring center (641), a moving block (642), a fixed block (643) and a spiral differential head b (644); a notch is formed in the middle of the fixed block (643), the moving block (642) is located in the notch, the fixed block (643) is fixed on the upper surface of the base plate (62), and the moving block (642) is fixed on the lower surface of the carrying plate (63); the spiral differential head b (644) and the spring tip (641) are respectively contacted with two sides of the moving block (642), a fine adjustment knob of the spiral differential head b (644) is adjusted to push the moving block (642) to move towards one side of the spring tip (641), so that a spring in the spring tip (641) is compressed, and the moving block (642) drives the loading plate (63) to rotate around a central shaft; and a glass plate B is fixed on the upper surface of the carrying plate (63), and a lower chip with a microstructure is fixed on the upper surface of the glass plate B.
2. The alignment bonding apparatus for manufacturing the MEMS device as claimed in claim 1, wherein the base (1) is made of metal; the support frame (3) is made of aluminum alloy.
3. An alignment bonding apparatus for MEMS device fabrication according to claim 1 or 2, wherein the frame of the supporting frame (3) is connected with the bottom plate by screws or integrally formed.
4. An alignment bonding apparatus for MEMS device fabrication as claimed in claim 1 or 2, wherein the X-axis moving stage (41), the Y-axis moving stage (42) and the Z-axis moving stage (43) are made of non-magnetic material.
5. The alignment bonding apparatus for manufacturing MEMS device as claimed in claim 3, wherein the X-axis moving platform (41), the Y-axis moving platform (42) and the Z-axis moving platform (43) are made of non-magnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810372288.3A CN108408684B (en) | 2018-04-17 | 2018-04-17 | Alignment bonding device for manufacturing MEMS (micro-electromechanical system) device |
Applications Claiming Priority (1)
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| CN2665694Y (en) * | 2003-03-27 | 2004-12-22 | 北京大学 | Aligning bonding precision detection apparatus |
| CN1834601A (en) * | 2006-02-27 | 2006-09-20 | 哈尔滨工业大学 | Automatic bonding method of MEMS high temp pressure sensor |
| CN203715270U (en) * | 2014-01-10 | 2014-07-16 | 苏州大学 | Sensor assembling and packaging system |
| CN105413769A (en) * | 2015-12-22 | 2016-03-23 | 苏州汶颢芯片科技有限公司 | Microfluidic chip aligning and bonding apparatus |
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| US20030071269A1 (en) * | 2001-10-15 | 2003-04-17 | Tseng Ampere A. | Apparatus and method for laser selective bonding technique for making sealed or enclosed microchannel structures |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2665694Y (en) * | 2003-03-27 | 2004-12-22 | 北京大学 | Aligning bonding precision detection apparatus |
| CN1834601A (en) * | 2006-02-27 | 2006-09-20 | 哈尔滨工业大学 | Automatic bonding method of MEMS high temp pressure sensor |
| CN203715270U (en) * | 2014-01-10 | 2014-07-16 | 苏州大学 | Sensor assembling and packaging system |
| CN105413769A (en) * | 2015-12-22 | 2016-03-23 | 苏州汶颢芯片科技有限公司 | Microfluidic chip aligning and bonding apparatus |
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