CN2665694Y - Aligning bonding precision detection apparatus - Google Patents
Aligning bonding precision detection apparatus Download PDFInfo
- Publication number
- CN2665694Y CN2665694Y CN 03242701 CN03242701U CN2665694Y CN 2665694 Y CN2665694 Y CN 2665694Y CN 03242701 CN03242701 CN 03242701 CN 03242701 U CN03242701 U CN 03242701U CN 2665694 Y CN2665694 Y CN 2665694Y
- Authority
- CN
- China
- Prior art keywords
- microscope
- eyepiece
- spiral
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model relates to an aligned-bonding precision detecting and measuring device which comprises a microscope, a spiral cursor measurement eyepiece, a CCD camera, an image display and an infrared source. The spiral cursor measurement eyepiece is connected to the interface of the vertical eyepiece of the microscope. The CCD camera is connected on the spiral cursor measurement eyepiece, while the image display is connected with the CCD camera by video cable, and the infrared source is arranged under the platform of the microscope. The utility model makes use of the characters that the silicon wafer has strong ability to let infrared light to pass through in the near-infrared area, the CCD camera has good imaging quality of infrared light and the spiral cursor measurement eyepiece has relatively accurate measure effect of bonding errors; combing the characters with the microscope as a whole provides an effective measuring method for the processing technology of MEMS. The utility model is widely used in the quality monitoring of machining process of various silicon MEMS devices, and can also be used as a video-measuring microscope of visual light black-white images.
Description
Technical field
The utility model relates to a kind of pick-up unit, particularly aims at the bonding accuracy detecting device about silicon chip in a kind of microelectromechanical systems and silicon chip, silicon chip and glass or other material.
Background technology
Microelectromechanical systems (hereinafter to be referred as MEMS) plays an important role to the quality of life of improving people, the living standard that improves people and enhancing national power as the interdisciplinary advanced manufacturing technology that originates from the nineties in last century.Because MEMS has the feature of multidisciplinary intersection, each subject development is very uneven, although silicon technology has developed into the main flow of MEMS technology in recent years, various new processes and process equipment also continue to bring out, but in the process results context of detection of using new equipment and process to finish, tangible deficiency but occurred, and then the development of MEMS technology has been formed certain obstruction.For example, silicon chip is with after silicon chip is aimed at bonding, because the picture surface of two silicon chips is bonded on together, can't detect with common microscope, though infraed microscope can be used for checking silicon one silicon and aim at the precision of bonding, its price very expensive (tens thousand of dollars, approximately be the bonding system cost 1/3～1/4), purposes is more single again, therefore has the process unit of technological ability generally to be difficult to bear.
The utility model content
At the problems referred to above, the purpose of this utility model provides a kind of accuracy of detection height, and infrastructure cost is low, easy to operate aligning bonding accuracy detecting device
For achieving the above object, the utility model is taked following technical scheme: a kind of aligning bonding accuracy detecting device, it is characterized in that: it comprises a microscope, one spiral vernier measuring eyepiece, one ccd video camera, one image display, one infrared light supply, described spiral vernier measuring eyepiece is connected on the described microscopical vertical eyepiece interface, described ccd video camera is connected on the described spiral vernier measuring eyepiece, described image display is connected with described ccd video camera by vision cable, and described infrared light supply is arranged on described microscopical wafer-supporting platform below.
Described infrared light supply can adopt halogen spot.
Described microscope can adopt three ocular microscopes.
Can comprise 5 times, 10 times, 25 times, 40,100 times a plurality of object lens in the described microscope.
The utility model is owing to take above technical scheme, it has the following advantages: 1, the utility model utilization has infrared preferably handling capacity at the near-infrared region silicon chip, ccd video camera has image quality preferably to infrared light, and spiral vernier measuring eyepiece para-linkage error has characteristics such as more accurate measurement effect, below microscopical wafer-supporting platform, be provided with an infrared light supply, on microscopical vertical eyepiece, be provided with a spiral vernier measuring eyepiece and a ccd video camera, and connect an image display by vision cable, thereby realized the utility model with simple microscope to silicon chip and silicon chip, silicon chip is aimed at the purpose of bonding accuracy detection with glass or other material.2, the utility model is owing to be provided with an infrared light supply, its visible light source with the original configuration of microscope cooperates, both can use infrared light supply that aspectant aligning bonding is carried out accuracy detection, also can use visible light source that the image of exposed surface is carried out accuracy detection, two kinds of light sources can also be used with, realization has greatly increased dirigibility and usable range that system uses to the image of each measured surface and the detection of bonding precision.3, all basic components of the utility model all are to select commercially available common components for use, so technical feature mature and reliable of total system, on making and assembling, there is not difficulty, and equipment cost is low again, particularly adopt common halogen spot, though it is not real infrared light supply, experiment shows that its ultrared brightness enough makes system of the present utility model demonstrate the good infrared image of signal to noise ratio (S/N ratio), thereby the cost of the utility model total system is further reduced.Though 4, the utility model is simple in structure, for the MEMS process technology provides a kind of effective measurement means.The utility model uses under 25 times of object lens and the situation that 10 times of spiral vernier measuring eyepieces cooperate, no matter machinery still is that the resolution of optics can both reach 0.5 micron accuracy of detection, therefore it can be widely used in the quality monitoring of various silicon MEMS device manufacturing process processes, in the processes such as MEMS devices such as little silicon accelerometer, pressure gauge, gyros.In addition, the utility model can also use as the videographic measurment microscope of visible light black white image.
Below in conjunction with drawings and Examples the utility model is described in detail.
Description of drawings
Fig. 1 is the utility model structural representation
Fig. 2 is the width of cloth infrared image that bonding aim detecting figure shows on display
Fig. 3 is another width of cloth infrared image that bonding aim detecting figure shows on display
Embodiment
As shown in Figure 1, the utility model comprises an Olympus (Olympus BHM) three ocular microscopes 1, and it is the main body of the utility model microoptic measuring system, and three eyepieces of microscope 1 comprise the vertical eyepiece 3 with of two eyepieces that be arranged in parallel 2.Connecting a brand on the interface of vertical eyepiece 3 is the spiral vernier measuring eyepiece 4 of Union, and connecting a resolution again on spiral vernier measuring eyepiece 4 is that 480 line brands are 1/3 inch black-white CCD video camera 5 of Honeywell.Auspicious 600 computing machines of upright literary composition as infrared view display 6, and are connected ccd video camera 5 by a vision cable 7 with image display 6.One 20W halogen spot is set as infrared light supply 9 below the wafer-supporting platform 8 of microscope 1.
In the foregoing description, microscope 1 can also adopt the product of other brand, also can only have a vertical eyepiece 3 on it, and its structure is simpler, but uses not as having three eyepieces conveniently.Object lens on the microscope 1 can comprise a plurality of object lens 10 such as 5 times, 10 times, 25 times, 40 times, 100 times, and wherein 40 times and 100 times of camera lenses is not owing to there is the sufficiently long object distance can only be as the bonding aim detecting of thin silicon sheet.Originally just be furnished with a visible light source 11 on the general microscope 1, therefore can use infrared respectively and visible light source 9,11 detects, also can use simultaneously by two light sources 9,11.
In the foregoing description, auspicious 600 computing machines of upright literary composition itself just dispose video frequency collection card, if adopt other display, the video frequency collection card between ccd video camera 4 and the image display 5 can adopt other various existing products.If as image display 5, it can directly connect ccd video camera 4, and does not use video frequency collection card with a televisor.The brand of ccd video camera 4 and model also can be changed, but its resolution should be not less than 480 lines.
In the foregoing description, though halogen spot is not real infrared light supply, but experiment shows that its ultrared brightness enough makes system of the present utility model demonstrate the good infrared image of signal to noise ratio (S/N ratio), and cost is than general infrared lamp low price, certainly, infrared light supply 9 also can adopt other infrared lamp.
Spiral vernier measuring eyepiece 4 in the foregoing description also can be selected the product of other brand for use.
When the utility model uses, at first tested article 12 (is example with two silicon chips of aiming at bonding) are placed on the wafer-supporting platform 8 of microscope 1, open infrared light supply 9, infrared light is by light hole (not shown), object lens 10 and spiral vernier measuring eyepiece 4 on the wafer-supporting platform 8, bond graph on the silicon chip is looked like to project on the ccd video camera 5, and be presented on the image display 6.Vernier on the adjustable screw vernier measuring eyepiece 4 just can be measured the aligning bonding precision of (reading) upper and lower two silicon chip images.
As shown in Figure 2, the infrared image that shows at image display 6 from bonding aim detecting figure as can be seen, through 25 times of object lens, 10 times of spiral measuring eyepieces, behind 4 millimeters camera lens and the 1/3 inch CCD video camera, alignment mark 14 stand outs on alignment mark 13 on first and second are 10 microns, and the vernier cross hair 15 on the spiral vernier measuring eyepiece 4 is wide 0.4 micron; As shown in Figure 3, the alignment mark 14 on the alignment mark 13 on first and second at upper and lower to differing from 2 microns approximately.
What above-mentioned measurement image was used is 10 times of object lens 4, if use 25 times of its better effects if of object lens.
Claims (5)
1, a kind of aligning bonding accuracy detecting device, it is characterized in that it comprises: a microscope, one spiral vernier measuring eyepiece, one ccd video camera, an image display, an infrared light supply, described spiral vernier measuring eyepiece is connected on the interface of described microscopical vertical eyepiece, described ccd video camera is connected on the described spiral vernier measuring eyepiece, and described image display is connected with described ccd video camera by vision cable, and described infrared light supply is arranged on described microscopical wafer-supporting platform below.
2, aligning bonding accuracy detecting device as claimed in claim 1, it is characterized in that: described infrared light supply is a halogen spot.
3, aligning bonding accuracy detecting device as claimed in claim 1 or 2, it is characterized in that: described microscope is three ocular microscopes.
4, aligning bonding accuracy detecting device as claimed in claim 1 or 2 is characterized in that: described microscope comprises 5 times, 10 times, 25 times, 40 times, 100 times a plurality of object lens.
5, aligning bonding accuracy detecting device as claimed in claim 3 is characterized in that: described microscope comprises 5 times, 10 times, 25 times, 40 times, 100 times a plurality of object lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03242701 CN2665694Y (en) | 2003-03-27 | 2003-03-27 | Aligning bonding precision detection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03242701 CN2665694Y (en) | 2003-03-27 | 2003-03-27 | Aligning bonding precision detection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2665694Y true CN2665694Y (en) | 2004-12-22 |
Family
ID=34326942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03242701 Expired - Lifetime CN2665694Y (en) | 2003-03-27 | 2003-03-27 | Aligning bonding precision detection apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2665694Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107063643A (en) * | 2017-04-26 | 2017-08-18 | 昆明荣者光电科技发展有限公司 | Optical system comprehensive measurement device |
| CN108408684A (en) * | 2018-04-17 | 2018-08-17 | 大连理工大学 | A kind of alignment bonding apparatus made for MEMS device |
| CN110767590A (en) * | 2019-10-31 | 2020-02-07 | 长春长光圆辰微电子技术有限公司 | Method for aligning and bonding two silicon wafers by using silicon wafer notches |
-
2003
- 2003-03-27 CN CN 03242701 patent/CN2665694Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107063643A (en) * | 2017-04-26 | 2017-08-18 | 昆明荣者光电科技发展有限公司 | Optical system comprehensive measurement device |
| CN108408684A (en) * | 2018-04-17 | 2018-08-17 | 大连理工大学 | A kind of alignment bonding apparatus made for MEMS device |
| CN108408684B (en) * | 2018-04-17 | 2020-06-16 | 大连理工大学 | Alignment bonding device for manufacturing MEMS (micro-electromechanical system) device |
| CN110767590A (en) * | 2019-10-31 | 2020-02-07 | 长春长光圆辰微电子技术有限公司 | Method for aligning and bonding two silicon wafers by using silicon wafer notches |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101509878B (en) | Part vision detection device | |
| JP7339643B2 (en) | Systems and methods for testing the refractive power and thickness of ophthalmic lenses immersed in solutions | |
| WO1997013140A9 (en) | Technique for determining defect positions in three dimensions in a transparent structure | |
| JP2001519890A (en) | Techniques for detecting three-dimensional defect locations in transparent structures | |
| WO2014169516A1 (en) | Detection device and detection method | |
| CN2898765Y (en) | Digital image inspector | |
| CN102095736B (en) | Dual-optical-magnification image acquisition device and image acquisition control and process system | |
| CN107884414B (en) | System and method for detecting surface defects of mirror surface object by eliminating influence of dust | |
| WO2000039568B1 (en) | Machine vision system and method for non-contact container inspection | |
| CN107132030A (en) | A kind of mirrors focal distance detecting method and device | |
| CN1233985C (en) | Aligning linkage precision detecting system | |
| CN2665694Y (en) | Aligning bonding precision detection apparatus | |
| CN115015112A (en) | Defect detection device and method | |
| CN2698097Y (en) | On-line circle optical projection detection device for tobacco industry | |
| CN101408520A (en) | Detection method and system for discriminating flaws of inner and outer layers | |
| CN107607050A (en) | Laser thickness measuring apparatus | |
| CN108760746A (en) | A kind of micro-nano defect detecting device based on machine vision | |
| TW200303410A (en) | Method and apparatus for measuring a line width | |
| CN110470250B (en) | Detection device and detection method for surface flatness of part | |
| CN112924472A (en) | Mini LED wafer appearance defect detection system and method | |
| CN2463847Y (en) | Optical fibre of CCD micro-imaging and optical fibre device geometric sense detector | |
| CN206944930U (en) | A kind of pcb board hole location detecting device | |
| CN102661902B (en) | Portable device for measuring heat resistance of thermoplastic material as well as method for measuring heat resistance of thermoplastic material | |
| CN207439649U (en) | AR optical surface eyeglass detection devices | |
| KR20110088628A (en) | Denting inspecting system having 3d surface measuring instrument |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20051222 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |