CN102275869A - Equipment and method for bonding single chip and wafer - Google Patents
Equipment and method for bonding single chip and wafer Download PDFInfo
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- CN102275869A CN102275869A CN2011102209906A CN201110220990A CN102275869A CN 102275869 A CN102275869 A CN 102275869A CN 2011102209906 A CN2011102209906 A CN 2011102209906A CN 201110220990 A CN201110220990 A CN 201110220990A CN 102275869 A CN102275869 A CN 102275869A
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Abstract
The invention discloses equipment and a method for bonding a single chip and a wafer. The bonding equipment comprises a wafer platform, a storage component, a manipulator, a microscopic system and a control system, wherein the wafer platform has three degrees of freedom of X and Y directions and rotation; the manipulator has three degrees of freedom of X, Y and Z directions; the microscopic system comprises a first microscopic system and a second microscopic system; the first microscopic system and the second microscopic system respectively detect positions and orientations of the single chip and the wafer and transmit pattern signals to the control system; and the control system controls the manipulator or the wafer platform to regulate the position and the orientation of a single chip or a wafer bonding region according to the single chip position and orientation pattern signal and the wafer bonding region position and orientation pattern signal. The bonding equipment with the structure has the characteristics of effectively protecting a movable structure of a wafer region along with simple operation, high instrument adaptability, high bonding precision, flexible motion and function, and can be applied more and more widely.
Description
Technical field
The present invention relates to the bonding apparatus and the bonding method of a kind of single-chip and wafer, especially relate to a kind of bonding apparatus and bonding method that adapts to various chips.
Background technology
MEMS (Micro-Electro-Mechanical Systems; MEMS) different two aspects that mainly comprise of device and integrated circuit, the one, contain movable structure, the 2nd, and environmental interaction, these 2 are brought very big difficulty to encapsulation, and its packaging cost height also mainly causes by these 2.Because movable structure is arranged, in encapsulation process, must protect movable structure not to be damaged, therefore can not directly adopt ripe technique of integrated circuit packaging.Owing to want and environmental interaction, therefore encapsulation should be considered and the interaction of environment, guarantees that again device performance is unaffected, and it is very big to deal with difficulty.Simultaneously, the prealignment before the encapsulation has also increased encapsulation difficulty.Prealignment under the litho machine of the main employing of encapsulation is both at home and abroad put into the mode that sealed in unit encapsulates by hand at present, often causes final encapsulation precision and effect can not satisfy index request.This has increased packaging cost and difficulty virtually, and has reduced packaging efficiency.
Wafer level packaging has good market-oriented prospect, in Wafer-Level Packaging Technology and equipment research, need recognize the developing stage that the present developing stage of China's MEMS industry mainly is in many kinds, high specific, small batch industrialization and deposits, a lot of MEMS devices constitute new construction behind bonding.For the encapsulation of this device, wafer bonding is not competent, because the cutting fluid of using during scribing enters in the micro-structural easily, and be difficult to remove, thus the destruction of causing micro-structural.And employing wafer and single-chip level encapsulation means realize the encapsulation of MEMS device, then can avoid the bonding of large area region, make some movable microstructures be protected, and therefore people more and more begins to have paid close attention to the packaging technology of single-chip and wafer scale.
Summary of the invention
In view of this; one object of the present invention be to provide a kind of have simple to operate, device adaptability is strong; bonding precision height, motion and flexible function; can effectively protect the single-chip of wafer area movable structure and the bonding apparatus of wafer, another object of the present invention is to simultaneously propose to utilize this bonding apparatus single-chip and wafer to be carried out the method for bonding.
According to a kind of single-chip of purpose proposition of the present invention and the bonding apparatus of wafer, comprise in order to the fixing wafer platform (6) of wafer, in order to place the memory module (13) of single-chip, in order to the operator (4) that picks up single-chip, microscopic system and control system, wherein: described wafer platform (6) have X-Y to the rotation three degree of freedom, described operator (4) has X-Y-Z to three degree of freedom, described microscopic system comprises first microscopic system (15) of the single-chip pose after being operated hand and picking up in order to detection and is fixed on second microscopic system (5) of the wafer pose on the wafer platform in order to detection that described first microscopic system (15) and described second microscopic system (5) are connected to control system.
Optionally, described wafer platform (6) is provided with the firing equipment that the para-linkage process heats.
Optionally, the bottom of described wafer platform be provided with electric rotating machine (8), wafer platform X to motor (9) and wafer platform Y to motor (11), described electric rotating machine (8), wafer platform X are connected to control system to motor (9) and wafer platform Y to motor (11).
Optionally, the afterbody of described operator (4) be provided with operator X to motor (1), operator Y to motor (2) and operator Z to motor (3), described operator X is connected to control system to motor (2) and operator Z to motor (3) to motor (1), operator Y.
Optionally, described first microscopic system connects a Z who focuses to motor (12).
Optionally, described second microscopic system connects a Z who focuses to motor (10).
Optionally, described operator further comprises operator main body (4-8), clamping plate (4-4), connecting plate (4-6) and in order to draw the suction pipe (4-2) and the suction nozzle (4-1) of single-chip, described operator main body (4-8) flexibly connects on connecting plate (4-6) by a reed (4-7), be rigidly connected with clamping plate (4-4) simultaneously, described suction pipe (4-2) is connected a vacuum equipment with suction nozzle (4-1).
Optionally, further dynamometry magnet of described operator (4-3) and phase magnet (4-5), this dynamometry magnet (4-3) and phase magnet (4-5) are fixed in the both sides that described clamping plate (4-4) gone up and be distributed in to described connecting plate (4-6).
Optionally, when described dynamometry magnet (4-3) and described clamping plate (4-4) adhesive, described phase magnet (4-5) disconnects with described clamping plate (4-4); When described dynamometry magnet (4-3) disconnects with described clamping plate (4-4), described phase magnet (4-5) and described clamping plate (4-4) adhesive.
According to a kind of single-chip of another object of the present invention proposition and the bonding method of wafer, use the bonding apparatus of aforementioned single-chip and wafer, wherein: after described first microscopic system (15) detects the single-chip pose, send single-chip pose figure signal to described control system, after described second microscopic system (5) detects wafer bonding position appearance, send wafer bonding position appearance figure signal to described control system, described control zone is according to this single-chip pose figure signal and wafer bonding position appearance figure signal, in operator (4) or wafer platform (6) one or two sends synchronous conditioning signal, and described operator (4) or wafer platform (6) are regulated the pose in single-chip or wafer bonding district according to this synchronous conditioning signal.
The above-mentioned single-chip and the bonding apparatus of wafer, adopt the motor module of a plurality of frees degree to realize accurately location, by microscopic system the single-chip pose is discerned detection, and carry out the judgement of power by magnet, when power during greater than the magnet absorption affinity magnet throw off, operator stops to move downward, and guarantees performance accuracy in the single-chip operating process and applies suitable bonding pressure thereby make.
Simultaneously, cooperate, respectively figure on figure on the wafer and the single-chip is discerned automatically and detected, and adjust automatically, thereby need on the wafer to guarantee the structure graph of bonding and aiming at of single-chip figure according to testing result by two cover microscopic systems.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, to do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structure chart of single-chip of the present invention and wafer bonding equipment;
Fig. 2 is the operator structural representation of bonding apparatus of the present invention.
The specific embodiment
Because wafer level packaging is a very complicated technology, and for the MEMS device, uses wafer level packaging that some micro-structurals are destroyed, influence the function of entire device.So people have proposed to use single-chip and wafer to carry out the technology of Direct Bonding, avoid large-area bonding zone, thereby improve the production yield of MEMS device.
The present invention has proposed the bonding apparatus of a kind of high efficiency, high accuracy, high-quality single-chip and wafer just on this basis.The high efficiency of this bonding apparatus is embodied in, and from the bonding of selecting of single-chip, whole flow process all adopts automation mechanized operation to carry out, the mode of comparing and manually picking up, its service speed improves greatly, and bonding technology can be incorporated in the whole packaging technology and go, thereby enhances productivity.The high accuracy of this bonding apparatus is embodied in, in single-chip picks up process on the wafer, adopt two cover microscopic systems respectively the pose of single-chip and wafer to be detected, and regulate both position orientation relation, guarantee bonding region contraposition accurately together by control system.The high quality bulk of this checkout equipment is present, and the operator of pick-up chip is provided with the power monitoring system, can guarantee that operator can not damage single-chip because contact force is excessive when bonding single-chip and wafer, thereby guarantee the quality of bonding.
Below, will elaborate to the specific embodiment of the present invention in conjunction with the accompanying drawings.
See also Fig. 1, Fig. 1 is the structure chart of single-chip of the present invention and wafer bonding equipment.As shown in the figure, this bonding apparatus is installed on the base plate 14, comprises wafer platform 6, memory module 13, operator 4, microscopic system and is arranged at outside control system (not shown in figure 1).Described wafer platform 6 is in order to fix a wafer, and the working material when also being bonding simultaneously is provided with firing equipment on this wafer platform 6, and this firing equipment is in order to be heated to the required temperature of bonding to single-chip and wafer in bonding process.Described memory module 13 is in order to place a plurality of single-chips, and these a plurality of chips can be the identical chips of model, also can be dissimilar chips.Described operator 4 is in order to picking up a single-chip from memory module 13, and this single-chip transferred to the enterprising line unit of wafer close, and this operator 4 can discharge the voltage of 0-1500V simultaneously, can ensure the needed bonding voltage of different chips.Described microscopic system comprises first microscopic system 15 and second microscopic system 5.Single-chip pose after first microscopic system 15 is operated hand 4 and picks up in order to detection, and send single-chip pose figure signal to described control system, second microscopic system 16 is fixed on wafer pose on the wafer platform in order to detection, sends wafer pose figure signal to described control system.
Further, the bottom of this wafer platform 6 also be provided with electric rotating machine 8, wafer platform X to motor 9 and wafer platform Y to motor 11, these three motors have been formed the group of motors of wafer platform 6, make wafer platform 6 have X-Y to the rotation three degree of freedom.Described electric rotating machine 8, wafer platform X are connected to control system to motor 9 and wafer platform Y to motor 11, and according to the instruction that this control system is sent wafer platform 6 are regulated, thereby reach the effect of control wafer pose.
Further, the afterbody of this operator 4 also be provided with operator X to motor 1, operator Y to motor 3 and operator Z to motor 2, these three motors are formed the group of motors of operators 4, make operator 4 have X-Y-Z to three degree of freedom.Described operator X is connected to control system to motor 3 and operator Z to motor 2 to motor 1, operator Y, and moves this operator 4 according to the instruction that this control system is sent, thereby realizes picking up and shifting the effect of single-chip.
Further, this first microscopic system 15 connects a Z to motor 12, and this Z is to motor 12 connection control system, and drives first microscopic system 15 move upward at Z under the control of this control system, realizes the automatic focusing to this first microscopic system 15.
Further, this second microscopic system 5 connects a Z to motor 10 by pillar 7, and this Z is to motor 10 connection control system, and drives second microscopic system 5 move upward at Z under the control of this control system, realizes the automatic focusing to this second microscopic system 5.
It is as follows to use the bonding apparatus of single-chip of the present invention and wafer to carry out the method for bonding:
Operator 4 is under the driving of group of motors, move to the top of memory module 13, and select a single-chip to carry out picking action, move on first microscopic system 15 after picking up single-chip, first microscopic system 15 herein can be arranged on the place that differs from memory module 13, also can be arranged on memory module 13 belows.When being arranged on memory module 13 belows, need be provided with on the interface of memory module can be for the through hole of first microscopic system, 15 observations.
After operator 4 carried single-chip and comes the observation area of first microscopic system 15, first microscopic system 15 was carried out automatic focusing at Z under the driving of motor 12, up to exporting to one of control system single-chip pose figure signal clearly.Single-chip pose herein can be the pose of whole single-chip, also can be the pose of a certain special symbol in the single-chip, and another special symbol of this special symbol and wafer correspondence position forms the required alignment mark of bonding.
Need this moment the zone of bonding to carry out pose on second microscopic system 5 pairs of wafers and detect, after the automatic adjusting of motor 10, export to one of control system wafer pose figure signal clearly by Z equally.Wafer pose herein can be the pose of whole wafer, also can be the pose of another special symbol corresponding with special symbol on the single-chip.
After control system receives figure signal from two microscopic systems, begin to compare and analyze the synchronous needs that whether satisfy bonding between two figure signals, and in operator 4 or wafer platform 6 one or two sends synchronous conditioning signal, operator 4 or wafer platform 6 are regulated the pose of single-chip or wafer after receiving this synchronous conditioning signal, both can be matched each other, realize the high accuracy contraposition.
After finishing contraposition, operator 4 is transferred to the bonding region position of wafer correspondence with single-chip, comes into effect the bonding operation.It is pointed out that for the displacement between operator 4 and the wafer platform 6 herein and can carry out, do not need to consider that operator 4 is because of moving the bit errors of bringing according to pre-set circuit.
When carrying out the bonding operation, 4 pairs of single-chips of operator and wafer apply a bonding voltage, and simultaneously, the wafer platform begins to wafer and single-chip heating, up to reaching the needed temperature of bonding.
Below, again the detailed structure of operator 4 is done introduction, so that being described, bonding apparatus of the present invention how can ensure the quality of single-chip in pick process.
See also Fig. 2, Fig. 2 is the operator structural representation of bonding apparatus of the present invention.As shown in the figure, this operator comprises operator main body 4-8, connecting plate 4-6, intermediate plate 4-4, dynamometer spring 4-3, phase magnet 4-5, suction pipe 4-2 and suction nozzle 4-1.Wherein, suction pipe 4-2 is connected vacuum air-channel with suction nozzle 4-1, and chip is drawn; Operator main body 4-8 is connected on the group of motors by connecting plate 4-6, and operator main body 4-8 itself then flexibly connects by a reed 4-7 and connecting plate 4-6; Simultaneously, operator main body 4-8 also is rigidly connected with clamping plate 4-4; Dynamometry magnet 4-3 and phase magnet 4-5 are fixed on the connecting plate 4-6, and these two magnets are distributed in the clamping plate both sides simultaneously.When operator is not in when pushing stressed state, dynamometry magnet 4-3 and clamping plate 4-4 adhesive play a part to keep the operator pose, and phase magnet 4-5 then is in off-state.And when operator 4 carries single-chip and puts into the bonding region of wafer downwards, produce a contact force between operator 4 and the single-chip, this contact force is during greater than the suction of dynamometry magnet 4-3, dynamometry magnet 4-3 is disconnected by force, and provide motor a feedback signal that decommissions, operator stop motion this moment; Phase magnet 4-5 and clamping plate 4-4 adhesive simultaneously, stable operation hand 4 poses, thus carry out subsequent operation.It should be noted that herein, can select by demand by the suction that dynamometry magnet 4-3 provides, with the maximum pressure that can bear less than single-chip and crystal column surface is prerequisite, so just can avoid operator when pushing single-chip downwards, to destroy the micro-structural of single-chip and crystal column surface, the integrity of the various movable microstructures of MEMS device behind the assurance bonding, thus the yield of MEMS device encapsulation improved.
In sum, the bonding apparatus of single-chip provided by the invention and wafer has following characteristics:
To guarantee performance accuracy in the single-chip operating process and apply suitable bonding pressure in order to make, adopt the motor module of a plurality of frees degree to realize accurately location in the design, by microscopic system the single-chip pose is discerned detection, and carry out the judgement of power by magnet, when power during greater than the magnet absorption affinity magnet throw off, operator stops to move downward.
In order to guarantee to need the structure graph of bonding and aiming at of single-chip figure on the wafer, cooperate by two cover microscopic systems, respectively figure on figure on the wafer and the single-chip is discerned automatically and detected, and adjust automatically according to testing result.
The wafer platform can be realized automatic temperature-adjusting control, requires to regulate according to different bonding temperatures, to adapt to different bonding chips.
Operator output 0-1500V voltage can apply according to different bonding voltage requests.
The invention has the beneficial effects as follows: the equipment of this kind structure have simple to operate, device adaptability is strong; bonding precision height, motion and flexible function; can effectively protect the characteristics of wafer area movable structure, so the application meeting of the bonding apparatus of this kind structure more and more widely.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined herein General Principle can realize under the situation that does not break away from the spirit or scope of the present invention in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.
Claims (10)
1. the bonding apparatus of single-chip and wafer, comprise in order to the fixing wafer platform (6) of wafer, in order to place the memory module (13) of single-chip, in order to the operator (4) that picks up single-chip, microscopic system and control system, it is characterized in that: described wafer platform (6) have X-Y to the rotation three degree of freedom, described operator (4) has X-Y-Z to three degree of freedom, described microscopic system comprises first microscopic system (15) of the single-chip pose after being operated hand and picking up in order to detection and is fixed on second microscopic system (5) of the wafer pose on the wafer platform in order to detection that described first microscopic system (15) and described second microscopic system (5) are connected to control system.
2. single-chip according to claim 1 and wafer bonding equipment is characterized in that: described wafer platform (6) is provided with the firing equipment that the para-linkage process heats.
3. single-chip according to claim 1 and wafer bonding equipment, it is characterized in that: the bottom of described wafer platform be provided with electric rotating machine (8), wafer platform X to motor (9) and wafer platform Y to motor (11), described electric rotating machine (8), wafer platform X are connected to control system to motor (9) and wafer platform Y to motor (11).
4. single-chip according to claim 1 and wafer bonding equipment, it is characterized in that: the afterbody of described operator (4) be provided with operator X to motor (1), operator Y to motor (2) and operator Z to motor (3), described operator X is connected to control system to motor (2) and operator Z to motor (3) to motor (1), operator Y.
5. single-chip according to claim 1 and wafer bonding equipment is characterized in that: described first microscopic system connects a Z who focuses to motor (12).
6. single-chip according to claim 1 and wafer bonding equipment is characterized in that: described second microscopic system connects a Z who focuses to motor (10).
7. single-chip according to claim 1 and wafer bonding equipment, it is characterized in that: described operator further comprises operator main body (4-8), clamping plate (4-4), connecting plate (4-6) and in order to draw the suction pipe (4-2) and the suction nozzle (4-1) of single-chip, described operator main body (4-8) flexibly connects on connecting plate (4-6) by a reed (4-7), be rigidly connected with clamping plate (4-4) simultaneously, described suction pipe (4-2) is connected a vacuum equipment with suction nozzle (4-1).
8. single-chip according to claim 7 and wafer bonding equipment, it is characterized in that: have dynamometry magnet (4-3) and phase magnet (4-5) on the described operator, this dynamometry magnet (4-3) and phase magnet (4-5) are fixed in the both sides that described clamping plate (4-4) gone up and be distributed in to described connecting plate (4-6).
9. single-chip according to claim 8 and wafer bonding equipment is characterized in that: when described dynamometry magnet (4-3) and described clamping plate (4-4) adhesive, described phase magnet (4-5) disconnects with described clamping plate (4-4); When described dynamometry magnet (4-3) disconnects with described clamping plate (4-4), described phase magnet (4-5) and described clamping plate (4-4) adhesive.
10. the bonding method of single-chip and wafer, this bonding method uses the bonding apparatus of single-chip as claimed in claim 1 and wafer, it is characterized in that: after described first microscopic system (15) detects the single-chip pose, send single-chip pose figure signal to described control system, after described second microscopic system (5) detects wafer bonding position appearance, send wafer bonding position appearance figure signal to described control system, described control zone is according to this single-chip pose figure signal and wafer bonding position appearance figure signal, in operator (4) or wafer platform (6) one or two sends synchronous conditioning signal, and described operator (4) or wafer platform (6) are regulated the pose in single-chip or wafer bonding district according to this synchronous conditioning signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110220990.6A CN102275869B (en) | 2011-08-03 | 2011-08-03 | Equipment and method for bonding single chip and wafer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110220990.6A CN102275869B (en) | 2011-08-03 | 2011-08-03 | Equipment and method for bonding single chip and wafer |
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| CN102275869A true CN102275869A (en) | 2011-12-14 |
| CN102275869B CN102275869B (en) | 2014-04-09 |
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| CN201110220990.6A Expired - Fee Related CN102275869B (en) | 2011-08-03 | 2011-08-03 | Equipment and method for bonding single chip and wafer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102659072A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Bonding equipment for chips and wafers |
| CN102658551A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Chip transfer manipulator |
| CN103723677A (en) * | 2014-01-10 | 2014-04-16 | 苏州大学 | Assembling and packaging system and method of sensor |
| CN105531809A (en) * | 2013-09-13 | 2016-04-27 | 豪锐恩科技私人有限公司 | System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method |
| WO2023115612A1 (en) * | 2021-12-24 | 2023-06-29 | 湖北三维半导体集成创新中心有限责任公司 | Bonding system and bonding method |
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| CN202193612U (en) * | 2011-08-03 | 2012-04-18 | 苏州大学 | Bonding device of single chip and wafer |
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| CN1834601A (en) * | 2006-02-27 | 2006-09-20 | 哈尔滨工业大学 | Automatic bonding method of MEMS high temp pressure sensor |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659072A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Bonding equipment for chips and wafers |
| CN102658551A (en) * | 2012-05-18 | 2012-09-12 | 山东理工大学 | Chip transfer manipulator |
| CN102658551B (en) * | 2012-05-18 | 2014-04-16 | 山东理工大学 | Chip transfer manipulator |
| CN102659072B (en) * | 2012-05-18 | 2014-08-06 | 山东理工大学 | Bonding equipment for chips and wafers |
| CN105531809A (en) * | 2013-09-13 | 2016-04-27 | 豪锐恩科技私人有限公司 | System and method for positioning a semiconductor chip with a bond head, thermal bonding system and method |
| CN103723677A (en) * | 2014-01-10 | 2014-04-16 | 苏州大学 | Assembling and packaging system and method of sensor |
| CN103723677B (en) * | 2014-01-10 | 2016-04-20 | 苏州大学 | A kind of sensor assembling package system and assembling method for packing |
| WO2023115612A1 (en) * | 2021-12-24 | 2023-06-29 | 湖北三维半导体集成创新中心有限责任公司 | Bonding system and bonding method |
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| CN102275869B (en) | 2014-04-09 |
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