CN1648032A - Vacuum package device for micro system - Google Patents
Vacuum package device for micro system Download PDFInfo
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- CN1648032A CN1648032A CNA2005100182180A CN200510018218A CN1648032A CN 1648032 A CN1648032 A CN 1648032A CN A2005100182180 A CNA2005100182180 A CN A2005100182180A CN 200510018218 A CN200510018218 A CN 200510018218A CN 1648032 A CN1648032 A CN 1648032A
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Abstract
The present invention discloses a kind of vacuum package device for micro system. Structurally, it includes box cover with cylinder; vacuum chamber with side port connected to vacuum pumping system; upper hot pressing head comprising successively connected transition board fixed on the central cylinder piston rod, the first upper heat insulating board, upper heating board with stretched T-shaped rod and upper pressing board, as well as compression spring between the T-shaped rod and the upper pressing board; lower hot pressing head comprising successively connected lower pressing board, lower heating board, the first lower heat insulating board and lower pressing head seat; and specially designed fixture and its positioning guide rod, opening cylinder and piston rod. The present invention may be used to complete anode bonding, cocrystallization bonding, wafer level packaging, and other packaging jobs with excellent packaging effect.
Description
Technical field
The present invention relates to a kind of packaging system, be specifically related to the packaging system of the micro-electromechanical system (MEMS) under a kind of vacuum condition.
Background technology
At present, the packaging system that uses of China is to realize that by the combination of heat, pressurizeing, adding static etc. MEMS encapsulates under atmospheric environment or nitrogen environment.This packaging system can be finished encapsulation such as anode linkage under atmospheric environment or the nitrogen environment, eutectic bonding.But for the encapsulation that requires vacuum environment, as accelerograph or gyrostatic encapsulation, if in atmosphere or nitrogen environment, encapsulate, atmosphere or nitrogen can hinder its oscillator vibration, cause accelerograph or gyrostatic quality factor to reduce greatly, thereby influence its sensitivity, therefore, existing packaging system just can not be suitable for.And, under atmospheric environment, heat the back solder of oxidation easily for those, when on the packaging system that uses at present, using, be easy to generate degradation defective under oxide skin, pore, the intensity, must just can avoid above-mentioned defective in heat fused under the vacuum environment, therefore, present packaging system can not be suitable for the easily solder bonding encapsulation of oxidation of heating back.
Summary of the invention
The objective of the invention is to overcome above-mentioned the deficiencies in the prior art part, a kind of vacuum package device for micro system is provided.This device is not only applicable to encapsulation such as solder bonding, and is applicable to the encapsulation of the vacuum Reflow Soldering of the solder of oxidation easily of heating back.
Further purpose of the present invention is that this device not only is provided in encapsulation such as traditional anode linkage, eutectic bonding, and can be used for the accelerograph or the gyrostatic encapsulation of the wafer level of requirement vacuum environment.
For realizing purpose of the present invention, the technical solution used in the present invention is a kind of vacuum package device for micro system, it is characterized in that: case lid and box sealing, form vacuum chamber, have interface in the side of vacuum chamber, door is equipped with in side at vacuum chamber, and center cylinder is housed on case lid; Last thermal head comprises thermal insulation board on the rebound, first, goes up heating plate and top board, and is fixedly connected sequentially, and rebound is fixed on the center cylinder piston rod of center cylinder, moves up and down with the center cylinder piston rod; Following thermal head comprises lower platen, plays heating plate, first time thermal insulation board and presses down headstock, and is fixedly connected sequentially, and presses down the bottom that headstock is fixed on casing.
For realizing further purpose of the present invention, the further technical scheme that the present invention adopts is: center cylinder is a multiposition cylinder; On top board, stretch out a T type bar, between top board and T type bar, be equipped with the compression spring, regulate the pretightning force of compression spring by top board; On lower platen, be equipped with anchor clamps, the structure of anchor clamps is, two covers or three cover clamping devices are housed on pallet, every cover clamps device and contains two parallelogram lindages, the structure of a parallelogram lindage is, first connecting rod is connected with an end of first follower lever by the 4th bearing pin, one end of first connecting rod is connected with an end of first driving lever by the 3rd bearing pin, fix first compressing tablet at the other end of first connecting rod, the two ends of first spring are connected on respectively on the other end and bearing of first driving lever, first driving lever is connected on the bearing by first bearing pin, and the other end of first follower lever is connected on the bearing by second bearing pin, and bearing and pallet fix; To the location guide that anchor clamps play the role of positioning, its lower end with press down headstock and be connected, the upper end puts in the locating hole on the pallet; The structure that being used for of matching with clamping device on the anchor clamps opened clamping device is, first cylinder, second cylinder are housed on case lid, and the first piston bar is corresponding with the rear end of first driving lever, and second piston rod is corresponding with the rear end of second driving lever.
The invention has the advantages that:
(1) the present invention can carry out encapsulation such as solder bonding, also can carry out the multi-functional Vacuum Package of bonding modes such as vacuum Reflow Soldering.
(2) the present invention can also carry out anode linkage, eutectic bonding, also can carry out the encapsulation of wafer level simultaneously; And utilize cylinder piston rod in vacuum chamber, to move down and open the disk anchor clamps, can take the air between two disks away, prevent that pore from appearring in bonding face.
(3) the upper and lower thermal head of employing heats, pressurizes or adds static in vacuum chamber, thus compact conformation.
(4) the pumped vacuum systems interface can prevent that in the side of vacuum chamber fragment from entering pumped vacuum systems.
(5) packaging appearance is little, package thickness is thin, in light weight, cost is low.
Description of drawings
Fig. 1 is the structure diagram of an embodiment of the present invention.
Fig. 2 is the enlarged drawing that presses down the headstock adjusting device among Fig. 1.
Fig. 3 is the structure diagram of the another kind of embodiment of the present invention.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is an enlarged drawing of going up thermal head among Fig. 3.
Fig. 6 is the enlarged drawing of following thermal head among Fig. 3.
Fig. 7 is the isometric front view of anchor clamps among Fig. 3.
Fig. 8 is the reverse side stereogram of anchor clamps among Fig. 3.
Fig. 9 is the front view of one group of cylinder and piston rod and one group parallelogram lindage corresponding with it among Fig. 3.
Figure 10 is the right view of one group of cylinder and piston rod and one group parallelogram lindage corresponding with it among Fig. 3.
The specific embodiment
By Fig. 1, shown in Figure 2, case lid 22 and casing 21 usefulness alignment pins 1 location, and can form vacuum chamber by the sealing of static seal circle, and have interface 2 in the side of vacuum chamber, can connect common vacuum-pumping system by flange, prevent that fragment from entering pumped vacuum systems.Door 12 is housed in the side of vacuum chamber, and door 12 can adopt used door for vacuum chamber usually, arranges circulating water pipe 23 at the outer wall of vacuum chamber, and vacuum chamber is cooled off, must logical cooling water before heating.
Center cylinder 4 is housed on case lid 22, movable sealing between the center cylinder piston rod 5 and the first sealing swivel nut 3, when the 5 upper and lower motions of center cylinder piston rod, seal, the assurance vacuum chamber is air tight, movable sealing can be adopted common O type circle sealing, also can adopt packing seal, bellows or diaphragm seal etc.Rebound 7 is fixed on the center cylinder piston rod 5, can move up and down with center cylinder piston rod 5, realizes going up the downward pressurization campaign of thermal head by center cylinder 4.
The installation of center cylinder 4 is: the first sealing swivel nut 3 can be connected on the case lid 22 by screw, center cylinder bearing 6 can be connected on the first sealing swivel nut 3 by screw, center cylinder 4 can be connected on the center cylinder bearing 6 by screw, and center cylinder bearing 6 plays centre of support cylinder 4.
Last thermal head comprises thermal insulation board 8 on the rebound 7, first, goes up heating plate 10 and top board 11, and is fixedly connected sequentially, and available screw connects.
Following thermal head comprises lower platen 13, down heating plate 14, first time thermal insulation board 19 and press down headstock 20, and is fixedly connected sequentially, and available screw connects, and presses down the bottom that headstock 20 can be fixed on casing 21 by screw.
In order to strengthen effect of heat insulation, between thermal insulation board on first 8 and last heating plate 10, be equipped with thermal insulation board 9 on second, be equipped with thermal insulation board 18 second time between heating plate 14 and first time thermal insulation board 19 down.
Can three cover adjusting devices be housed on the headstock 20 pressing down, preferably evenly distribute.Adjusting device is made up of screw 15, steel ball 16 and cushion block 17, and screw 15 places on the steel ball 16, and steel ball 16 places on the cushion block 17.Utilize screw 15 lower ends varying in size to steel ball 16 active forces, make cushion block 17 compressions, cushion block 17 generally can be made by elastomeric material or other elastomeric materials, degree of tightness by adjustment screw 15, just can regulate down the depth of parallelism of thermal head and last thermal head, thereby when guaranteeing pressurization, sheet glass and silicon chip can fully be fitted, and can not be crushed.
By Fig. 3 and shown in Figure 4, for wafer level packaging, on lower platen 13, be equipped with anchor clamps 29.Center cylinder 4 is a multiposition cylinder, realizes two stations that press down.Stretch out a T type bar 30 at top board 11, between top board 11 and T type bar 30, be equipped with compression spring 31, the pretightning force of regulating compression spring 31 by top board 11.T type bar 30 is used for pushing down two disks of having aimed at, and two disks produce relative motion when preventing to open anchor clamps 29.Have hole 32 in the side of top board 11.On case lid 22, peep-hole 36 can be housed.First cylinder 24 and second cylinder 35 are installed on case lid 22.
The installation of first cylinder 24 is: the second sealing swivel nut 27 can be connected on the case lid 22 by screw, first cylinder saddle 26 can be connected on the second sealing swivel nut 27 by screw, first cylinder 24 can be connected on first cylinder saddle 26 by screw, first cylinder saddle 26 works to support first cylinder 24, be movable sealing between the first piston bar 25 and the second sealing swivel nut 27, the first anchor clamps pressure head 28 is contained on the first piston bar 25.
The installation of second cylinder 35 is identical with first cylinder 24, and second cylinder saddle is connected on the second sealing swivel nut 27, and second cylinder 35 is connected on second cylinder saddle.
To the location guide 33 that anchor clamps 29 play the role of positioning, its lower end with press down headstock 20 and be connected, can be connected by screw, the upper end puts in locating hole 39 (see figure 7)s on the pallet 34, such location guide has three, also can be two etc., is preferably on the circumference evenly to distribute.
By Fig. 5 and shown in Figure 6, on top board 11, have hole 32, on lower platen 13, have hole 37, Kong Kekai is a screwed hole in the side, the two poles of the earth of the high-pressure electrostatic of needs when being used to introduce anode linkage, thus between top board 11 and lower platen 13, add high-pressure electrostatic.
Side at top board 11 and lower platen 13 also can have the thermocouple installing hole in addition.
By Fig. 7 and shown in Figure 8, the structure of anchor clamps 29 is three covers to be housed on pallet 34 to clamp device, preferably evenly distribution.
The structure of clamping device is, first connecting rod 41 is connected with an end of first follower lever 53 by the 4th bearing pin 42, one end of first connecting rod 41 is connected with an end of first driving lever 44 by the 3rd bearing pin 43, fix first compressing tablet 40 at the other end of first connecting rod 41, be used for pushing down silicon chip, the two ends of first spring 45 can be articulated in respectively on the other end and bearing 38 of first driving lever 44 by screw, first driving lever 44 is connected on the bearing 38 by first bearing pin 54, the other end of first follower lever 53 is connected on the bearing 38 by second bearing pin 55, bearing 38 fixes with pallet 34, realizes the bistable state of parallelogram lindage.
Second connecting rod 50 is connected with an end of second follower lever 52 by the 6th bearing pin 49, one end of second connecting rod 50 is connected with an end of second driving lever 47 by the 5th bearing pin 48, fix second compressing tablet 51 at the other end of second connecting rod 50, be used for pushing down sheet glass, the two ends of second spring 46 can be articulated in respectively on the other end and bearing 38 of second driving lever 47 by screw, second driving lever 47 is connected on the bearing 38 by first bearing pin 54, the other end of second follower lever 52 is connected on the bearing 38 by second bearing pin 55, realizes the bistable state of parallelogram lindage.
By Fig. 9 and shown in Figure 10, the mechanism that is used for opening anchor clamps 29 is: open three groups of cylinders and the piston rod thereof that three covers clamp devices with three covers of anchor clamps 29 being used for of clamping that devices match, every group structure is that the first anchor clamps pressure head 28 that is contained on the first piston bar 25 is corresponding with the rear end of first driving lever 44; Be movable sealing between second piston rod 57 and the second sealing swivel nut 27, the second anchor clamps pressure head 56 that is contained on second piston rod 57 is corresponding with the rear end of second driving lever 47.When 57 declines of second piston rod, when the second anchor clamps pressure head 56 was pushed down the rear end of second driving lever 47, second driving lever 47 turned clockwise, and second compressing tablet 51 breaks away from sheet glass; When 25 declines of first piston bar, when the first anchor clamps pressure head 28 was pushed down the rear end of first driving lever 44, first driving lever 44 turned clockwise, and first compressing tablet 40 breaks away from silicon chips.
The implementation step of device level vacuum reflow soldering encapsulation:
A. clean device, prefabricated weld tabs and cover plate with acetone;
B. the device after cleaned and prefabricated weld tabs and cover plate are fixed, place down on the heating plate 14;
C. close the door 12 of vacuum chamber, open vacuum-pumping system;
D. after meeting the requirements of vacuum, open center cylinder 4, make that going up thermal head moves down, and, make thermal head tightly push down cover plate, prevent that having aimed at cover plate is moved by compression spring 31;
E. go up heating plate 10 and following heating plate 14 and begin heating;
When f. waiting the temperature that is raised to technological requirement, close and close heating plate 10, rise center cylinder 4, open the vent valve venting, then, make its cooling with the nitrogen cooling;
G. after temperature lowers, open door for vacuum chamber 12, by manipulator or manual with device and cover plate taking-up.
The implementation step of anode linkage encapsulation:
A. silicon chip and sheet glass are placed on the pallet 34, first compressing tablet 40 is pushed down silicon chip earlier, and second compressing tablet 51 is pushed down sheet glass again, in order to avoid move in the load process;
B. anchor clamps 29 are placed on down on the heating plate 14 by manipulator or craft, and by three location guides location;
C. close the door 12 of vacuum chamber, open vacuum-pumping system;
D. after meeting the requirements of vacuum, open center cylinder 4, center cylinder 4 is a multiposition cylinder, make that going up thermal head moves down, and by last thermal head compression compression spring 31, make the T type bar 30 on the thermal head tightly push down two disks, prevent that two disks of having aimed at are moved in opening anchor clamps 29 processes;
E. open first cylinder 24 and second cylinder 35, make its first piston bar 25 and second piston rod 57 move down, first piston bar 25 promotes first driving lever, 44, the second piston rods 57 and promotes second driving lever 47, open anchor clamps 29, rise the first piston bar 25 and second piston rod 57 then;
F. open center cylinder 4, thermal head is further moved down, push down two disks;
G. go up heating plate 10 and following heating plate 14 and begin heating;
H. wait the temperature that is raised to technological requirement during as 430 ℃, close upper heater, add electrostatic pressure such as 1000V again, begin to carry out anode linkage, about 10 minutes sheet glass and silicon chip will be bonded together;
I. rise center cylinder 4 then, open the vent valve venting, then blow to anchor clamps 29, make its cooling with nitrogen;
J. after temperature lowers, open door for vacuum chamber 12, by manipulator or manual with anchor clamps 29 taking-ups.
Claims (10)
1. vacuum package device for micro system is characterized in that:
Case lid (22) and casing (21) sealing form vacuum chamber, have interface (2) in the side of vacuum chamber, and door (12) is housed in the side of vacuum chamber, and center cylinder (4) is housed on case lid (22);
Last thermal head comprises thermal insulation board (8) on the rebound (7), first, goes up heating plate (10) and top board (11), and be fixedly connected sequentially, rebound (7) is fixed on the center cylinder piston rod (5) of center cylinder (4), moves up and down with center cylinder piston rod (5);
Following thermal head comprises lower platen (13), plays heating plate (14), first time thermal insulation board (19) and presses down headstock (20), and is fixedly connected sequentially, and presses down the bottom that headstock (20) is fixed on casing (21).
2. vacuum package device according to claim 1 is characterized in that:
Center cylinder (4) is a multiposition cylinder;
On top board (11), stretch out a T type bar (30), between top board (11) and T type bar (30), be equipped with compression spring (31), the pretightning force of regulating compression spring (31) by top board (11);
On lower platen (13), be equipped with anchor clamps (29), the structure of anchor clamps (29) is, two covers or three cover clamping devices are housed on pallet (34), every cover clamps device and contains two parallelogram lindages, the structure of a parallelogram lindage is, first connecting rod (41) is connected with an end of first follower lever (53) by the 4th bearing pin (42), one end of first connecting rod (41) is connected with an end of first driving lever (44) by the 3rd bearing pin (43), fix first compressing tablet (40) at the other end of first connecting rod (41), the two ends of first spring (45) are connected on respectively on the other end and bearing (38) of first driving lever (44), first driving lever (44) is connected on the bearing (38) by first bearing pin (54), the other end of first follower lever (53) is connected on the bearing (38) by second bearing pin (55), and bearing (38) fixes with pallet (34);
To the location guide (33) that anchor clamps (29) play the role of positioning, its lower end with press down headstock (20) and be connected, the upper end puts in the locating hole (39) on the pallet (34);
The structure that being used for of matching with clamping device on the anchor clamps (29) opened clamping device is, first cylinder (24), second cylinder (35) are housed on case lid (22), first piston bar (25) is corresponding with the rear end of first driving lever (44), and second piston rod (57) is corresponding with the rear end of second driving lever (47).
3. vacuum package device according to claim 2 is characterized in that: have hole (32) on top board (11), have hole (37) on lower platen (13), the two poles of the earth of the high-pressure electrostatic of needs when being used to introduce anode linkage.
4. vacuum package device according to claim 2 is characterized in that: described location guide (33) is two or three.
5. vacuum package device according to claim 1 and 2, it is characterized in that: between thermal insulation board on first (8) and last heating plate (10), be equipped with thermal insulation board on second (9), between first time thermal insulation board (19) and following heating plate (14), be equipped with second time thermal insulation board (18).
6. vacuum package device according to claim 3, it is characterized in that: between thermal insulation board on first (8) and last heating plate (10), be equipped with thermal insulation board on second (9), between first time thermal insulation board (19) and following heating plate (14), be equipped with second time thermal insulation board (18).
7. vacuum package device according to claim 1 and 2, it is characterized in that: press down be equipped with on the headstock (20) three the cover adjusting devices, adjusting device is made up of screw (15), steel ball (16) and cushion block (17), screw (15) places on the steel ball (16), and steel ball (16) places on the cushion block (17).
8. vacuum package device according to claim 3, it is characterized in that: press down be equipped with on the headstock (20) three the cover adjusting devices, adjusting device is made up of screw (15), steel ball (16) and cushion block (17), and screw (15) places on the steel ball (16), and steel ball (16) places on the cushion block (17).
9. vacuum package device according to claim 1 and 2 is characterized in that: go up heating plate (10) and following heating plate (14) and adopt resistance wire heating or infrared heating.
10. vacuum package device according to claim 1 and 2 is characterized in that: peep-hole (36) is housed on case lid (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510018218 CN1277739C (en) | 2005-01-28 | 2005-01-28 | Vacuum package device for micro system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510018218 CN1277739C (en) | 2005-01-28 | 2005-01-28 | Vacuum package device for micro system |
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|---|---|
| CN1648032A true CN1648032A (en) | 2005-08-03 |
| CN1277739C CN1277739C (en) | 2006-10-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200510018218 Expired - Fee Related CN1277739C (en) | 2005-01-28 | 2005-01-28 | Vacuum package device for micro system |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007127825A2 (en) * | 2006-04-28 | 2007-11-08 | Hewlett-Packard Development Company, L.P. | Fabrication tool for bonding |
| CN101332973B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Anode bonding device |
| CN101332974B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Thermal bonding device |
| CN102683236A (en) * | 2012-04-24 | 2012-09-19 | 华中科技大学 | Hot pressing head comprising multiple groups of heating cores |
| CN102769064A (en) * | 2011-05-05 | 2012-11-07 | 中国科学院微电子研究所 | Method for manufacturing grid line electrode on front surface of solar cell |
| CN103071876A (en) * | 2013-01-05 | 2013-05-01 | 烟台睿创微纳技术有限公司 | Package welding method and device |
| CN104362107A (en) * | 2014-10-23 | 2015-02-18 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonding machine and bonding method |
| CN105277185A (en) * | 2015-11-26 | 2016-01-27 | 上海新跃仪表厂 | Metal vibration gyroscope inertia sensor and metal vibration gyroscope |
| CN105392301A (en) * | 2015-12-29 | 2016-03-09 | 南京理工大学 | PCBA packaging machine with high thermal efficiency |
| CN105565263A (en) * | 2016-02-02 | 2016-05-11 | 苏州汶颢芯片科技有限公司 | Polymer chip sealing device and polymer chip sealing method |
| CN105977172A (en) * | 2016-05-21 | 2016-09-28 | 哈尔滨工业大学 | Auxiliary hand-operated wafer bonding apparatus |
| CN110265692A (en) * | 2019-06-19 | 2019-09-20 | 十堰隆深机器人有限公司 | A kind of vacuum abutted anti-displacement device |
| CN110282598A (en) * | 2019-07-10 | 2019-09-27 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method under vacuum environment |
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| CN101697345B (en) * | 2009-10-27 | 2011-08-24 | 华中科技大学 | Hot-pressing heads and hot-pressing device consisting of same |
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- 2005-01-28 CN CN 200510018218 patent/CN1277739C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007127825A2 (en) * | 2006-04-28 | 2007-11-08 | Hewlett-Packard Development Company, L.P. | Fabrication tool for bonding |
| WO2007127825A3 (en) * | 2006-04-28 | 2008-04-10 | Hewlett Packard Development Co | Fabrication tool for bonding |
| US7866364B2 (en) | 2006-04-28 | 2011-01-11 | Hewlett-Packard Development Company, L.P. | Fabrication tool for bonding |
| CN101332973B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Anode bonding device |
| CN101332974B (en) * | 2008-07-16 | 2011-05-11 | 华中科技大学 | Thermal bonding device |
| CN102769064A (en) * | 2011-05-05 | 2012-11-07 | 中国科学院微电子研究所 | Method for manufacturing grid line electrode on front surface of solar cell |
| WO2012149692A1 (en) * | 2011-05-05 | 2012-11-08 | 中国科学院微电子研究所 | Method for manufacturing front gate line electrode of solar cell |
| CN102769064B (en) * | 2011-05-05 | 2015-04-01 | 中国科学院微电子研究所 | Method for manufacturing grid line electrode on front surface of solar cell |
| CN102683236B (en) * | 2012-04-24 | 2014-09-24 | 华中科技大学 | Hot pressing head comprising multiple groups of heating cores |
| CN102683236A (en) * | 2012-04-24 | 2012-09-19 | 华中科技大学 | Hot pressing head comprising multiple groups of heating cores |
| CN103071876A (en) * | 2013-01-05 | 2013-05-01 | 烟台睿创微纳技术有限公司 | Package welding method and device |
| CN104362107B (en) * | 2014-10-23 | 2017-03-01 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonder and bonding method |
| CN104362107A (en) * | 2014-10-23 | 2015-02-18 | 浙江中纳晶微电子科技有限公司 | Wafer vacuum bonding machine and bonding method |
| CN105277185A (en) * | 2015-11-26 | 2016-01-27 | 上海新跃仪表厂 | Metal vibration gyroscope inertia sensor and metal vibration gyroscope |
| CN105277185B (en) * | 2015-11-26 | 2018-10-23 | 上海新跃仪表厂 | Metal vibration gyroscopic inertia sensor and metal vibration gyroscope |
| CN105392301A (en) * | 2015-12-29 | 2016-03-09 | 南京理工大学 | PCBA packaging machine with high thermal efficiency |
| CN105392301B (en) * | 2015-12-29 | 2018-06-01 | 南京理工大学 | A kind of PCBA sealing machines of high thermal efficiency |
| CN105565263A (en) * | 2016-02-02 | 2016-05-11 | 苏州汶颢芯片科技有限公司 | Polymer chip sealing device and polymer chip sealing method |
| CN105977172A (en) * | 2016-05-21 | 2016-09-28 | 哈尔滨工业大学 | Auxiliary hand-operated wafer bonding apparatus |
| CN105977172B (en) * | 2016-05-21 | 2018-03-30 | 哈尔滨工业大学 | A kind of auxiliary hand-operating wafer bonding device |
| CN110265692A (en) * | 2019-06-19 | 2019-09-20 | 十堰隆深机器人有限公司 | A kind of vacuum abutted anti-displacement device |
| CN110265692B (en) * | 2019-06-19 | 2023-10-13 | 湖南隆深氢能科技有限公司 | Vacuum laminating anti-displacement device |
| CN110282598A (en) * | 2019-07-10 | 2019-09-27 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method under vacuum environment |
| CN110282598B (en) * | 2019-07-10 | 2021-12-28 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method in vacuum environment |
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| CN1277739C (en) | 2006-10-04 |
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