CN102683236B - Hot pressing head comprising multiple groups of heating cores - Google Patents
Hot pressing head comprising multiple groups of heating cores Download PDFInfo
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- CN102683236B CN102683236B CN201210123170.XA CN201210123170A CN102683236B CN 102683236 B CN102683236 B CN 102683236B CN 201210123170 A CN201210123170 A CN 201210123170A CN 102683236 B CN102683236 B CN 102683236B
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- thermal head
- heating platen
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Abstract
The invention discloses a hot pressing head comprising multiple groups of heating cores. The hot pressing head is composed of a hot pressing plate, a heat insulating plate and a patching plate which are sequentially laminated, wherein a vacuum cavity respectively communicated with an air inlet/outlet hole and multiple vacuum suction holes on a hot pressing surface is arranged inside the hot pressing plate, multiple grooves are arranged at the periphery of the vacuum cavity in an array manner, the multiple groups of heating cores are respectively installed in the grooves and pressed by a pressing plate, a sealing element is arranged at the periphery of the vacuum cavity and pressed by a sealing cover plate; the heat insulating plate is laminated on the hot pressing plate and is used for preventing the heat of the hot pressing plate from transferring upward; and the patching plate is laminated on the heat insulating plate and is used for being connected with a movement driving mechanism. According to the invention, the hot pressing head has the advantages of compact structure, clean and efficient heat source, high temperature control precision, simple control method, wide range of application and the like, and is suitable for laminating production for hot pressing of heterogeneous sheet and thin film of flexible electronic components.
Description
Technical field
The invention belongs to hot pressing processing technique field, more specifically, relate to a kind of thermal head device for the manufacture of plural layers composite laminate.
Background technology
The compound hot-pressing technique of plural layers is widely used, especially in flexible electronic device packaging technology, as manufacturing technologies such as fuel cell, RFID, electronics skin, thin-film solar cells, relate to the hot pressing combination process of the plural layers strict to temperature control or sheet material, need to meet and under flexible electronic assembly aligned condition, carry out the pressurize of exerting pressure of even constant temperature, require certain temperature, pressure uniformity.
Publication number is the hot-press arrangement that the Chinese patent literature of CN101697345A discloses a kind of flexible electronic device manufacturing and encapsulation, this invention adopts a kind of thermal head design that uses electric heating and spring control and keep steady pressure, belong to single heating core, do not there is the function of material of crawl, therefore can only be used for that hot pressing area is little, hot pressing pressure is little, do not need the raw-material occasion of self-retaining.
Summary of the invention
For defect and the technical need of prior art, the object of the present invention is to provide a kind of thermal heads that comprise many group heat generating cores, the sufficient supplies that this thermal head is simple in structure, can ensure thermal source possesses Incision Machine's simultaneously.
According to the present invention, a kind of thermal head that comprises many group heat generating cores is provided, this thermal head is made up of jointly the heating platen being superimposed together successively, thermal insulation board and keyset, it is characterized in that:
The one side of described heating platen is the hot pressing face for processing object being carried out to heating pressurization, other one side is corresponding thereto for being superimposed with described thermal insulation board, the inside of heating platen is provided with vacuum chamber, and this vacuum chamber is connected with the multiple vacuum suction hole being located on air inlet/outlet and the hot pressing face of being located at of heating platen side respectively; In the surrounding of described vacuum chamber, be and be furnished with in array multiple grooves, to organize heat generating core more and be arranged on respectively in described groove and by pressing plate and compress, the periphery of described vacuum chamber has potted component and compresses by seal cover board;
Described thermal insulation board is superimposed on heating platen, upwards transmits for the heat that prevents heating platen;
Described keyset is superimposed on thermal insulation board, for being connected with motion driving mechanism.
As further preferably, described thermal head also comprises temperature sensor, this temperature sensor arranges corresponding to heat generating core described in each, be arranged in the hole of described heating platen side near hot pressing face, and its point for measuring temperature is positioned at the position of each heat generating core center near hot pressing face.
As further preferably, described temperature sensor is arranged in the hole of described heating platen side by mechanical fit system.
As further preferably, described temperature sensor is directly installed in the hole of described heating platen side by the bonding mode of hot curing colloid.
As further preferably, the cylindrical structure of described temperature sensor.
As further preferably, the quantity of described heat generating core is four, and is provided with heat-resisting cushion pad between each heat generating core and described pressing plate.
As further preferably, the multiple vacuum suction hole on described hot pressing face is array and arranges.
As further preferably, the power mode of described thermal head comprises hydraulic pressure, air pressure or screw rod transmission etc.
As further preferably, adopt inner membrance PID control method to realize the temperature control to described hot pressing face.
According to another aspect of the present invention, also provide the above-mentioned thermal head that comprises many group heat generating cores manufacturing the application in compound of multi-layer sheet and flexible membrane composite laminate or multi-layer flexible film.
Compared with prior art, technique effect major embodiment of the present invention is in the following areas:
1, organize heat generating core heat supplies simultaneously according to thermal head of the present invention owing to comprising more, can ensure the sufficient supplies of thermal source, possess in addition Incision Machine's, be therefore specially adapted to multi-layer sheet or the film hot-pressing complex conditions of self-retaining material to be processed;
2, by hot pressing pressure head side arrangement many groups temperature sensor detect and feed back many group heat generating cores the temperature of corresponding heating region, can ensure the accuracy of hot pressing surface temperature and good temperature homogeneity;
3, thermal head of the present invention is generally using, and compact conformation, thermal source clean and effective, temperature control precision is high, control method is simple, therefore possesses application widely.
Brief description of the drawings
Fig. 1 is according to the perspective view of the thermal head of the preferred embodiments of the present invention;
Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of thermal head shown in Fig. 1;
Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of the element of heating platen shown in Fig. 1;
Fig. 4 is thermal head temperature inner membrance PID control method block diagram of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Fig. 1 is according to the perspective view of the thermal head of the preferred embodiments of the present invention, and Fig. 2 is the STRUCTURE DECOMPOSITION schematic diagram of thermal head shown in Fig. 1.As shown in Figures 1 and 2, mainly comprise heating platen 10, thermal insulation board 30 and keyset 40 according to the thermal head of the preferred embodiment of the present invention.
As shown in Figure 2, the one side of heating platen 10 is hot pressing face, and for processing object being carried out to heating pressurized operation, other one side is corresponding thereto for being superimposed with thermal insulation board 30.In the inside of heating platen 10, be provided with the vacuum chamber 1013 of right quantity, in Fig. 2, be shown as and comprise 2 vacuum chambers.Vacuum chamber 1013 is connected with the vacuum suction hole that the multiple arrays that are located on the air inlet/outlet 1014 of heating platen side and the hot pressing face of being located at are arranged respectively, for realizing the vacuum suction to material.Consider in thermal head and arrange vacuum chamber, simultaneously due to larger hot pressing area, the heat radiations such as convection current, radiation can cause the non-uniform temperature of hot pressing face, improve temperature controlled difficulty, therefore, the present invention improves by the quantity to heater element and set-up mode, overcomes the problems referred to above.Particularly, thermal head, around vacuum chamber 1013, for example can be provided with by the mode of arranged in arrays multiplely for groove 1011 or the cavity of heat generating core are installed, and in these grooves or cavity, is separately installed with heat generating core 102 and compresses by pressing plate 104.Thus, by adopting the mode of heating of many group heat generating cores heat supply simultaneously, ensured the sufficient supplies of thermal source.In addition,, in order to ensure the effect of vacuum suction, there is such as be the potted component 106 of sealing ring in the periphery of vacuum chamber 1013, and compress by seal cover board 105.Thermal insulation barriers 30 is arranged between heating platen 10 and keyset 40, upwards transmits for the heat that prevents heating platen 10; Keyset 40 also can be designed to other versions, is convenient to and power drive element and other element interconnections.
For the heating properties of thermal head is better monitored and fed back, can also comprise temperature sensor 20 according to the thermal head of the preferred embodiment of the present invention.Temperature sensor 20 is for example cylindrical to be arranged corresponding to each heat generating core, is arranged on respectively in the hole of heating platen 10 sides near hot pressing face.Described temperature sensor 20 points for measuring temperature are positioned at the position of each heat generating core center near hot pressing face, can monitor preferably and feed back like this temperature of each heat generating core heating region.
Fig. 3 is the STRUCTURE DECOMPOSITION schematic diagram of the element of heating platen shown in Fig. 1.As shown in Figure 3, heating platen 10 can comprise face 101, heat generating core 102, cushion pad 103, pressing plate 104, seal cover board 105 and the sealing ring 106 etc. that form vacuum chamber and heat generating core groove for giving that.On face 101, be for example processed with 2 vacuum chambers 1013, corresponding each vacuum suction cavity 1013 is arranged 1 air inlet/outlet 1014, is processed with multiple array vacuum suction hole of straight-through hot pressing face in vacuum suction cavity; In the surrounding of two vacuum suction cavitys 1013, four groups of arranged in arrays are for installing the groove 1011 of described heat generating core 102; Face 101 sides also arrange that many groups for installing the hole 1012 of described temperature sensor 20, and the end in described installation of sensors hole is positioned at the center of described heat generating core cavity.
In a preferred embodiment, multiple heat generating cores 102 are arranged in respectively in groove 1013, and use pressing plate 104 to compress, and between heat generating core 102 and cover plate 104, also arrange cushion pad 103; In addition, there is such as be the potted component 106 of sealing ring in vacuum chamber 1013 periphery, and compressed by seal cover board 105, realize thus the sealing in vacuum suction chamber.
In another preferred embodiment, described transducer 20 coordinates the close contact of realizing temperature element and hole 1012 inwalls by mechanical dimension; Also can adopt other supplementary mounting meanss, as bonding in employing hot curing colloid etc., described transducer 20 is directly installed in described hole 1012.
Described temperature sensor 20 comprises temperature-sensing element 201, and this arrangements of elements, in hole 1012, is arranged in the lead-in wire of described sensor element 201 in the wire casing of compression leg 202 simultaneously, and draws in breach via holder 204; Spring-loaded plunger 205 is arranged in the screwed hole of holder 204, and for compressing catch 203 and compression leg 202, thereby jam sensor element 201 makes temperature element contact thermography point.
Fig. 4 is thermal head temperature inner membrance PID control method block diagram of the present invention.As shown in Figure 4, thermal head of the present invention can use inner membrance PID control method to control the hot pressing surface temperature of thermal head.Because described many group heat generating cores 102 are arranged symmetrically with in face 101, organize heat generating core correspondence more and organize the hot-pressed surface temperature regime that its heating region of transducer Real-Time Monitoring is corresponding more, be a typical multi-input multi-output system.
The present invention is generally using, need to complete hot pressing object in conjunction with corresponding dynamical element, operable power has the modes such as hydraulic pressure, air pressure or screw rod transmission, coordinates thermal head of the present invention can complete multi-layer sheet under certain pressure, uniform temperature or target is closed in the hot pressing of film admittedly.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (6)
1. one kind for carrying out the thermal head of plural layers compound hot pressing to flexible electronic device, it is characterized in that, this thermal head is made up of jointly the heating platen being superimposed together successively (10), thermal insulation board (30) and keyset (40), and include the heat supply simultaneously of many group heat generating cores, wherein:
The one side of described heating platen (10) is the hot pressing face for processing object being carried out to heating pressurization, other one side is corresponding thereto for being superimposed with described thermal insulation board (30), the inside of heating platen is provided with two vacuum chambers (1013), these two vacuum chambers (1013) respectively be located at multiple on the air inlet/outlet (1014) of heating platen (10) side and the hot pressing face of being located at and be the vacuum suction holes that array arranges and be connected; In the surrounding of described vacuum chamber (1013), be and be furnished with in array multiple grooves (1011), many group heat generating cores (102) are arranged on respectively in described groove (1011) and by pressing plate (104) and compress, and the periphery of described vacuum chamber (1013) has potted component (106) and compresses by seal cover board (105); In addition, also be provided with temperature sensor (20) corresponding to heat generating core described in each (102), these temperature sensors (20) are arranged on respectively in the hole of described heating platen (10) side near hot pressing face, and its point for measuring temperature is positioned at the position of each heat generating core center near hot pressing face;
It is upper that described thermal insulation board (30) is superimposed on heating platen (10), upwards transmits for the heat that prevents heating platen (10); And
It is upper that described keyset (40) is superimposed on thermal insulation board (30), for being connected with motion driving mechanism.
2. thermal head as claimed in claim 1, is characterized in that, described temperature sensor (20) is arranged in the hole of described heating platen side by mechanical fit system.
3. thermal head as claimed in claim 1 or 2, it is characterized in that, the cylindrical structure of described temperature sensor (20), and comprise temperature-sensing element (201), the lead-in wire of this temperature-sensing element (201) is arranged in the wire casing of compression leg (202), and draws via the breach of holder (204); In addition, spring-loaded plunger (205) is also installed in described holder (204), this spring-loaded plunger is used for compressing catch (203) and described compression leg (202), makes its contact thermography point thereby compress described temperature-sensing element (201).
4. thermal head as claimed in claim 1 or 2, is characterized in that, the quantity of described heat generating core (102) is four, and is provided with heat-resisting cushion pad (103) between each heat generating core and described pressing plate (104).
5. thermal head as claimed in claim 1 or 2, is characterized in that, the power mode of described thermal head comprises hydraulic pressure, air pressure or screw rod transmission.
6. thermal head as claimed in claim 1 or 2, is characterized in that, adopts inner membrance PID control method to realize the temperature control to described hot pressing face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210123170.XA CN102683236B (en) | 2012-04-24 | 2012-04-24 | Hot pressing head comprising multiple groups of heating cores |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210123170.XA CN102683236B (en) | 2012-04-24 | 2012-04-24 | Hot pressing head comprising multiple groups of heating cores |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102683236A CN102683236A (en) | 2012-09-19 |
| CN102683236B true CN102683236B (en) | 2014-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210123170.XA Active CN102683236B (en) | 2012-04-24 | 2012-04-24 | Hot pressing head comprising multiple groups of heating cores |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121323B (en) * | 2017-06-23 | 2021-05-18 | 众达光通科技(苏州)有限公司 | Pressing machine for QSFP built-in PCB and flexible circuit board |
| CN111739833B (en) * | 2020-07-06 | 2022-04-08 | 颀中科技（苏州）有限公司 | Chip crimping joint vacuum hole through hole device |
| CN111951686A (en) * | 2020-08-26 | 2020-11-17 | 京东方科技集团股份有限公司 | Flexible display panel attaching device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5019200A (en) * | 1988-12-15 | 1991-05-28 | Murata Manufacturing Co., Ltd. | Method of fabricating multilayer capacitor |
| CN2702336Y (en) * | 2004-06-18 | 2005-05-25 | 陈栋栋 | Location identification apparatus and hot compression equipment |
| CN1648032A (en) * | 2005-01-28 | 2005-08-03 | 华中科技大学 | Vacuum package device for micro system |
| CN101697345A (en) * | 2009-10-27 | 2010-04-21 | 华中科技大学 | Hot-pressing heads and hot-pressing device consisting of same |
| CN202079783U (en) * | 2011-01-21 | 2011-12-21 | 上海华培胶带有限公司 | Hot-pressing forming system and mold group thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2540530B2 (en) * | 1987-01-23 | 1996-10-02 | 東芝ケミカル株式会社 | Multi-stage depressurization molding device |
-
2012
- 2012-04-24 CN CN201210123170.XA patent/CN102683236B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5019200A (en) * | 1988-12-15 | 1991-05-28 | Murata Manufacturing Co., Ltd. | Method of fabricating multilayer capacitor |
| CN2702336Y (en) * | 2004-06-18 | 2005-05-25 | 陈栋栋 | Location identification apparatus and hot compression equipment |
| CN1648032A (en) * | 2005-01-28 | 2005-08-03 | 华中科技大学 | Vacuum package device for micro system |
| CN101697345A (en) * | 2009-10-27 | 2010-04-21 | 华中科技大学 | Hot-pressing heads and hot-pressing device consisting of same |
| CN202079783U (en) * | 2011-01-21 | 2011-12-21 | 上海华培胶带有限公司 | Hot-pressing forming system and mold group thereof |
Non-Patent Citations (1)
| Title |
|---|
| JP昭63-182112A 1988.07.27 |
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| CN102683236A (en) | 2012-09-19 |
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