KR20130096133A - Laminating device - Google Patents

Laminating device Download PDF

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Publication number
KR20130096133A
KR20130096133A KR1020120038229A KR20120038229A KR20130096133A KR 20130096133 A KR20130096133 A KR 20130096133A KR 1020120038229 A KR1020120038229 A KR 1020120038229A KR 20120038229 A KR20120038229 A KR 20120038229A KR 20130096133 A KR20130096133 A KR 20130096133A
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KR
South Korea
Prior art keywords
base plate
carrier
support surface
laminating apparatus
module
Prior art date
Application number
KR1020120038229A
Other languages
Korean (ko)
Inventor
친-태 추
Original Assignee
탑 레인지 머시너리 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 탑 레인지 머시너리 컴퍼니 리미티드 filed Critical 탑 레인지 머시너리 컴퍼니 리미티드
Publication of KR20130096133A publication Critical patent/KR20130096133A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers

Abstract

The laminating device according to the invention comprises a carrier and a crimping module. The carrier has a support surface.
The compression module is movable in the direction of the carrier or away from the carrier and has a base plate, a compression film and a heater.
The compressed film is arranged on one side of the base plate facing the support surface of the carrier.
A deformable air chamber is formed between the base plate and the press film.
The heater is housed in the deformable air chamber and spaced apart from the press film.

Description

Laminating device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminating device, and more particularly, to a laminating device for manufacturing a hybrid wafer laminate.

The conventional laminating apparatus 9 for manufacturing a hybrid wafer stack is a carrier (91), a metal pressing plate that can be driven in a direction closer to or farther away from the carrier 91 as shown in FIG. Clamp members 93 are fluidly mounted on the carrier 91 to fix the pressing plate 92 and the target wafer 94.

Specifically, the carrier 91 has a support surface 911 for supporting the target wafer 94, the metal crimp plate 92 is located on the outer edge of the lower surface of the metal crimp plate 92, the clamp An annular groove 921 corresponding to the member 93 is provided.

A driving member 95 is connected to the metal pressing plate 92 to drive the metal pressing plate 92.

When using the conventional laminating device 9, the conventional laminating device 9 had to be installed in a room capable of releasing indoor air to form a low pressure environment.

In the operation of the conventional laminating apparatus 9, first, the clamp member 93 is a target wafer (911) on the support surface 911 so that the target wafer 94 is located between the carrier 91 and the metal pressing plate 92 94), then the separation pad separating the two layers of the target wafer 94 is removed.

Next, after releasing room air to expel bubbles in the adhesive 941 between the two layers to create a low pressure environment, the drive member 95 follows the metal crimp plate 92 in the direction of the arrow shown in FIG. The metal crimp plate 92 is driven toward the target wafer 94 until it is adjacent to the target wafer 94 and the annular groove 921 covers the clamp member 93.

Finally, the carrier 91 and the metal crimp plates 92 are heated to heat the upper and lower layers of the target wafer 94 so that the adhesive 941 is melted, and then the two layers adhere to each other and are laminated. The metal crimp plate 92 may further squeeze the target wafer 94 so that sieve production can be terminated.

However, in this operation, various problems have arisen as will be described later.

First, as shown in FIG. 2, since the contact surface 922 of the metal crimp plate 92 facing the carrier 91 and adjacent to the target wafer 94 is nonuniform, the metal crimp plate 92 has the contact surface. The target wafer 94 may not be uniformly pressed through the 922. As a result, the pressure exerted on the upper layer of the target wafer 94 also becomes uneven, resulting in deterioration of the quality of the laminate and damage of the target wafer 94.

Second, since the target wafer 94 pressed by the contact surface 922 of the metal pressing plate 92 should be heated to 500 ° C. or higher for the manufacture of the laminate, the metal pressing plate 92 is heated to 500 ° C. or higher. It should be noted that the non-uniform contact surface 92 caused non-uniform heat transfer, resulting in poor lamination and yield of the stacked target wafer 94.

In addition, the expansion of the metal crimp plate 92 by heating may further weaken the uneven state of the contact surface 922.

Third, because there is an annular groove 921 arranged on the metal crimp plate 92 to correspond to the clamp member 93 to prevent the metal crimp plate 92 from damaging the clamp member during the lamination process, the clamp The portion of the target wafer 94 fixed (condensed) between the member 93 and the support surface 911 was not reliably pressed by the metal crimp plate 92.

Accordingly, there is a need to develop a laminating device for manufacturing a hybrid wafer laminate that can uniformly transmit pressure and heat applied to a target wafer in a laminating process.

A first object of the present invention is to provide a laminating device capable of uniformly transmitting the laminating pressure on the pressing surface of the target plate.

Another object of the present invention is to provide a laminating device capable of uniform heat transfer toward the target plate.

In order to achieve the above object, the laminating apparatus according to the present invention includes a carrier and a crimping module. The carrier has a support surface. The crimp module is driveable toward the carrier direction or towards the direction away from the carrier and includes a base plate, a press film and a heater.

The compressed film is arranged on one side of the base plate facing the carrier support surface.

A deformable air chamber is formed between the base plate and the press film.

The heater is housed in a deformable air chamber and spaced apart from the compressed film.

The invention further comprises an axis extending through the base plate of the compaction module to move into the deformable air chamber.

The present invention further includes an axis passing through the center of the base plate to face the center of the support surface.

The present invention further includes an opening communicating with the deformable air chamber, and an air inlet tube and an air discharge tube connected to the opening by a control valve.

The present invention further includes two air pumps connected to the air inlet tube and the air discharge tube, respectively.

The invention further includes a configuration in which the compaction module is coupled with a drive member for driving the compaction module.

The present invention further includes a configuration in which the shaft is connected to another drive member, that is, two drive members, that is, the drive member connected to the shaft and the drive member coupled to the crimping module, simultaneously drive the crimp module and the shaft in the same direction. .

The present invention further includes a configuration in which a support wall is provided between the base plate and the press film to maintain the position of the press film relative to the base plate.

The present invention further includes a configuration in which the carrier further includes a buffer member in the form of an O-ring on the support surface, and the buffer member is mounted at an outer edge of the support surface.

The laminating apparatus according to the present invention can uniformly transmit the pressure and heat applied during the laminating process on the pressing surface of the target plate when the hybrid wafer laminate is manufactured.

Therefore, the present invention has the effect of improving the quality of the hybrid wafer stack, preventing damage to the target wafer, and improving yield.

1 is a cross-sectional view of a conventional laminating device.
Figure 2 is a cross-sectional view of the target plate during the laminating process with a conventional laminating device.
3 is a cross-sectional view of a laminating apparatus according to a preferred embodiment of the present invention.
4 is a cross-sectional view of the laminating apparatus according to the present invention showing the crimping module and the axes before driving.
5 is a cross-sectional view of the laminating apparatus according to the present invention showing a state in which the crimping film presses the target plate.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 3, the laminating apparatus according to the preferred embodiment of the present invention includes a carrier 1 and a pressing module 2. The crimping module 2 can be driven closer to or away from the carrier 1.

The carrier 1 is a support that is heatable and has a temperature range that can completely melt the adhesive between the two target plates or directly bond the two target plates without the adhesive, depending on the material of the target plate.

In this embodiment, a heater is arranged inside the carrier 1 for heating.

Specifically, the carrier 1 has a support surface 11 facing the crimping module 2 to support the target plates.

In addition, the carrier 1 further comprises a buffer member 12 which surrounds the area of the support surface 11 on the support surface 11, whereby the target plates are wrapped by the buffer member 12. Supported in the region of the support surface 11, the buffer member 12 is to mitigate the impact of the pressing module 2 applied toward the carrier (1).

The buffer member 12 preferably surrounds the support surface 11 supporting the target plate as an elastic ring at the outer edge of the support surface 11.

As shown in FIG. 4, the crimping module 2 is connected to the driving member M1 to drive toward the carrier 1 by a driving member M1 or to move away from the carrier 2. have.

The pressing module 2 has a base plate 21 and a pressing film 22, the pressing film 22 is arranged on the side of the base plate 21 facing the carrier 1, There is an air room (R) deformable on the base plate 21 and the press film 22. Specifically, the base plate 21 is made of a material capable of withstanding a high temperature of the heater, and the crimping film 22 is made of an elastic material such as a special fiber that can maintain normal performance even at a temperature higher than 150 ℃. .

In this embodiment, the base plate 21 has an opening 211 in communication with the deformable air chamber R. The air inlet tube (T1) and the air discharge tube (T2) is the opening 211 by a control valve (V) that determines whether to block the air inlet tube (T1) or the air discharge tube (T2) from the opening. Connected with.

In addition, when the control valve (V) communicates the air inlet tube (T1) and the opening 211, the air pump (P1) and the air inlet tube (T1) so as to introduce air into the deformable air chamber (R) Connected.

On the other hand, when the control valve (V) communicates the air discharge tube (T2) and the opening 11, the air pump (P2) to discharge the air out of the deformable air chamber (R) to the air discharge tube (T2) Connected with.

The crimping module 2 also includes a heater 23 arranged between the base plate 21 and the crimping film 22 and housed apart from the crimping film 22 in the deformable room R.

The distance between the heater 23 and the compressed film 22 is preferably less than 5 mm for the desired thermal conductivity between the heater 23 and the compressed film 22 through the air in the deformable air chamber R.

In addition, a support wall 24 is formed between the base plate 21 and the press film 22 to maintain the position of the press film 22 associated with the base plate 21.

In other words, the deformable air chamber R is partitioned by the base plate 21, the press film 22 and the support wall 24.

The laminating device according to the invention may further comprise a shaft 3 which is operably extended through the base plate 21 of the crimping module 2 and into the deformable air chamber R.

In this embodiment, the shaft 3 penetrates the center of the base plate 21 and faces the target plate, facing the center of the support surface 11.

Another driving member M2 is connected to the shaft 3 to adjust the movement of the shaft (3).

Preferably, the driving members M1 and M2 drive the crimping module 2 and the shaft 3 in the same direction at the same time.

The shaft 3 is preferably a rod of metal, pottery or heat dissipation plastic material.

The laminating apparatus is first installed in a chamber (Chamber) 4 in use, and two adjacent target plates such as two wafers 5 shown in FIG. 4 separate pads of each of these wafers 5. It is mounted on the support surface 11 provided with).

Specifically, the chamber 4 includes a vacuum room 41, a plating opening 42, and a pumping opening 43, which accommodates a laminating device, and includes the layout opening 42 and All of the pumping openings 43 communicate with the vacuum room 41, and the pumping opening 43 is connected with the air pump P3.

Prior to the lamination process, the wafers 5 are positioned on the support surface 11 by the following steps.

One of the two wafers 5 is first put into the vacuum room 41 through the placement opening 42 and then installed on the support surface 11. Next, the pad 6 and, if necessary, adhesives are placed on the wafer 5 installed on the support surface 11. Finally, the other of the two wafers 5 is placed on the pad 6.

In addition, when the wafer 5 and the pads 6 are installed, the placement opening 42 is covered to seal the vacuum room 41, and the heater of the carrier 1 causes the wafer 5 to be brought to a suitable temperature before the laminating step. It can also be heated.

In the lamination step, the air pump P3 is operated to lower the ambient pressure of the vacuum room 41, and the control valve V is configured to lower the ambient pressure of the deformable air room R by the air pump P2. The discharge tube (T2) and the changeable air chamber (R) is in communication with each other.

After the ambient pressure of each of the vacuum room 41 and the deformable air chamber R reaches a desired state, the driving member M1 drives the pressing module 2 toward the wafer 5 and at the same time the driving member M2 Drive the shaft 3 only toward the wafer 5 until the shaft 3 is adjacent to the top of the wafer 5 to prevent unwanted movement of the wafer 5). Remove

The other end of the compressed film 22 may be replaced with a wafer 5 to prevent unwanted movement of the wafer 5 by a portion different from the portion of the compressed film 22 corresponding to the end of the shaft. Prior to contacting the top of the c), it is preferred to contact the wafer 5 via a portion of the compressed film 22 corresponding to the distal end of the shaft.

As shown in FIG. 5, the compaction module 2 is further driven toward the carrier 1 such that the lower edge of the support wall 24 contacts the buffer member 12 through the compaction film 22.

As a result, the compressed film 22 is brought closer to the wafer 5 as a whole.

Finally, the control valve (V) is the air inlet tube (T1) and the deformable air so that the air pump (P1) injects air into the deformable air chamber (R) through the air inlet tube (T1) and the opening 211 The room (R) to communicate with each other. Therefore, since the pressure in the vacuum room 41, that is, the pressure outside the deformable air chamber R is low, and the pressure inside the deformable air chamber R is high, the crimping film 22 can lift the wafer 5. It can be pressed evenly and strongly.

On the other hand, in order to uniformly transfer the heat of the heater 22 to the wafer 5 so that lamination of the wafer 5 is completed, the heater 3 raises the temperature inside the deformable air chamber R.

Therefore, compared to the conventional laminating apparatus which presses the target plate by the metal plate, the press film 22 is pressurized to uniformly press the wafer 5 because the press force of the press film 22 is provided by the flowing air. It is possible.

In addition, since the heat of the heater 23 is transmitted by the flowing air, the heat in the changeable air chamber R can be uniformly dispersed quickly.

As a result, the yield of the wafer 5 laminated by the laminating apparatus according to the present invention is greatly improved.

Although the present invention describes only preferred embodiments in detail, those skilled in the art will understand various modification embodiments without departing from the spirit of the invention.

9: conventional laminating apparatus 91: carrier
92: metal crimp plate 94: target wafer
93: clamp member 911: support surface
921: annular groove 95: drive member
941 Adhesive 922 Contact Surface
1: carrier 2: crimp module
11 support surface 12 buffer member
M1, M2: drive member 21: base plate
22: crimp film R: air room
211: opening T1: air inlet tube
T2: Air exhaust tube V: Control valve
P1, P2, P3: air pump 23: heater
24: support wall 3: shaft
4: chamber 6: pad
5: wafer 41: vacuum room
42: arrangement opening 43: pumping opening

Claims (9)

(Iii) a carrier having a support surface and (ii) a crimp module having a base plate, a press film and a heater, the press module being operable towards or away from the carrier, the press film facing the support surface of the carrier A laminating apparatus, arranged on one side of the base plate, wherein a deformable air chamber is formed between the base plate and the compressed film, and a heater is accommodated in the deformable air chamber and spaced apart from the compressed film. The laminating apparatus according to claim 1, further comprising an axis extending through the base plate of the crimping module to move into the deformable air chamber. 3. The laminating apparatus according to claim 2, wherein the shaft passes through the center of the base plate and faces the center of the support surface. 2. The laminating apparatus according to claim 1, wherein the base plate has an opening communicating with the deformable air chamber, and an air inlet tube and an air discharge tube connected to the opening by a control valve. 5. The laminating apparatus according to claim 4, wherein two air pumps are connected to an air inlet tube and an air discharge tube, respectively. The laminating apparatus according to claim 1, wherein the crimping module is connected to a driving member for driving the crimping module. 7. The shaft of claim 6, wherein the shaft is connected to a drive member for driving the crimping module and another drive member, wherein the drive member for driving the crimping module and the drive member for driving the shaft drive the crimp module and the shaft simultaneously in the same direction. Laminating device characterized in that. 2. The laminating apparatus according to claim 1, wherein a supporting wall is formed between the base plate and the press film to maintain the position of the press film relative to the base plate. 9. The laminating apparatus according to claim 8, wherein the carrier has an O-ring shape on a support surface and has a buffer member disposed at an outer edge of the support surface.
KR1020120038229A 2012-02-21 2012-04-13 Laminating device KR20130096133A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101203100 2012-02-21
TW101203100U TWM432918U (en) 2012-02-21 2012-02-21 Composite sheet pressing device

Publications (1)

Publication Number Publication Date
KR20130096133A true KR20130096133A (en) 2013-08-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
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JP (1) JP3175999U (en)
KR (1) KR20130096133A (en)
CN (1) CN202573217U (en)
TW (1) TWM432918U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10500820B2 (en) 2016-09-26 2019-12-10 Samsung Display Co., Ltd. Laminating apparatus and laminating method using the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103273720B (en) * 2013-05-14 2015-03-04 深圳市宝德自动化精密设备有限公司 Precise OCA (optical clear adhesive) full-laminating machine and laminated production technology thereof
CN103755161B (en) * 2013-12-31 2016-03-30 深圳市华星光电技术有限公司 The rigging machine mounting structure of sheet material mounting block and top board, rigging machine
CN104309263A (en) * 2014-10-20 2015-01-28 中山市亚泰机械实业有限公司 Upper cavity positioning and clamping mechanism of vacuum laminating machine
TWI717056B (en) * 2019-10-15 2021-01-21 萬潤科技股份有限公司 Temperature control method and device for heat sink pressing process
CN111605206B (en) * 2020-05-26 2022-03-25 歌尔股份有限公司 Press fit structure and press fit equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10500820B2 (en) 2016-09-26 2019-12-10 Samsung Display Co., Ltd. Laminating apparatus and laminating method using the same

Also Published As

Publication number Publication date
TWM432918U (en) 2012-07-01
CN202573217U (en) 2012-12-05
JP3175999U (en) 2012-06-07

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