TWI717056B - Temperature control method and device for heat sink pressing process - Google Patents
Temperature control method and device for heat sink pressing process Download PDFInfo
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Abstract
本發明係一種散熱片壓合製程之溫度控制方法及裝置，包括：提供一加熱器，設於一待壓合物之下側的一第一壓模；提供一第一感溫器，設於該待壓合物之下側的該第一壓模；提供一第二感溫器，設於該待壓合物之上側的一第二壓模；提供一控制單元，電性連結該加熱器、該第一感溫器與該第二感溫器；以該第一感溫器與該第二感溫器分別感測該待壓合物兩側之溫度，該第一感溫器感測該加熱器欲對該待壓合物加熱之一第一溫度，該第二感溫器感測該第一溫度傳遞經該待壓合物後之一第二溫度，並使該控制單元依感測之溫度控制該加熱器之加熱溫度。 The present invention is a temperature control method and device for a heat sink pressing process, which includes: providing a heater, and a first pressing mold arranged on the underside of a material to be pressed; and providing a first temperature sensor arranged at The first pressing mold on the lower side of the product to be pressed; providing a second temperature sensor, and a second pressing mold on the upper side of the product to be pressed; providing a control unit electrically connected to the heater , The first temperature sensor and the second temperature sensor; the first temperature sensor and the second temperature sensor are used to sense the temperature on both sides of the compound to be pressed, the first temperature sensor senses The heater intends to heat the product to be pressed at a first temperature, and the second temperature sensor senses a second temperature after the first temperature has passed through the product to be pressed, and makes the control unit feel The measured temperature controls the heating temperature of the heater.
Description
本發明係有關於一種溫度控制方法及裝置，尤指一種在散熱片壓合製程中用來掌握壓合溫度的散熱片壓合製程之溫度控制方法及裝置。 The present invention relates to a temperature control method and device, in particular to a temperature control method and device of a heat sink pressing process for controlling the pressing temperature in the heat sink pressing process.
按，一般半導體封裝製程中，對於需要進行散熱片封裝的半導體，通常會在已置放一晶片之一基板上側周緣與該晶片上側先分別施加黏性材料與導熱材料，然後再將一散熱片置放於黏性材料與導熱材料上，接著進行加壓與加熱之壓合製程使該散熱片因黏性材料固化而固定於該基板上。 According to the general semiconductor packaging process, for semiconductors that need to be packaged with a heat sink, adhesive materials and thermally conductive materials are usually applied to the upper side of a substrate of a chip and the upper side of the chip, and then a heat sink Place it on the viscous material and the heat-conducting material, and then perform a pressing and heating process to make the heat sink fixed on the substrate due to the solidification of the viscous material.
在壓合製程中，該散熱片、該晶片與該基板所組成之待壓合物將以矩陣排列方式對應放置於一載盤之複數個矩陣排列之鏤空區間上，該載盤可經一流道輸送至位於該流道上、下兩側之一上壓模與一下壓模之間，並由該上壓模與該下壓模夾壓該載盤上之待壓合物一預設時間；在夾壓過程中，該下壓模內之加熱器將輸出熱能，使待壓合物可在夾壓之過程中受到加熱，以利黏性材料固化；為了可監控夾壓過程中之加熱溫度，該下壓模內另設有感溫器可感測該下壓模之溫度，該感溫器之溫度訊息可傳輸至控制單元，該控制單元可依感溫器所測得之溫度自動或由操作人員手動控制各加熱器輸出的熱能。 In the pressing process, the heat sink, the chip and the substrate to be pressed are placed in a matrix arrangement on the hollow space of a plurality of matrix arrangements of a carrier plate. The carrier plate can pass through It is conveyed between the upper and lower molds located on the upper and lower sides of the runner, and the upper mold and the lower mold clamp the compound to be pressed on the carrier plate for a preset time; During the clamping process, the heater in the lower mold will output heat energy so that the material to be pressed can be heated during the clamping process to facilitate the curing of the adhesive material; in order to monitor the heating temperature during the clamping process, The lower mold is additionally equipped with a temperature sensor that can sense the temperature of the lower mold, and the temperature information of the temperature sensor can be transmitted to the control unit, which can automatically or by the temperature measured by the temperature sensor The operator manually controls the heat output of each heater.
惟，習知散熱片壓合製程在實際使用上，因為下壓模由下方朝待壓合物傳遞熱能，待壓合物內部之溫度係緩慢地上升，而控制單元僅可得知當前下壓模之溫度，並無法得知待壓合物當前之溫度；假設待壓合物 內之黏性材料可固化之製程條件為需在溫度145~147度下壓合100秒，操作人員或控制單元需先控制加熱器輸出的熱能使下壓模到達約146度之溫度，但實際上因熱能傳遞時會被消耗，故待壓合物實際之溫度可能僅136度，溫度過低沒有達到製程條件所需，導致不良品之產生；若考慮熱能消耗之問題而先調高加熱器輸出的熱能使下壓模到達約156度之溫度，但下壓模之溫度實際上並非與待壓合物之溫度存在固定之消長關係，故待壓合物實際之溫度可能係150度，溫度過高將造成待壓合物損壞，同樣導致不良品之產生。 However, the conventional heat sink pressing process is actually used, because the lower mold transfers heat energy from the bottom to the pressed compound, the temperature inside the pressed compound rises slowly, and the control unit can only know the current pressing The temperature of the mold does not know the current temperature of the compound to be pressed; suppose the compound to be pressed The process conditions for the curing of the viscous material inside are that it needs to be pressed for 100 seconds at a temperature of 145 to 147 degrees. The operator or control unit must first control the heat output of the heater to make the lower mold reach a temperature of about 146 degrees. Because the heat energy is consumed during the transfer, the actual temperature of the pressed compound may only be 136 degrees. The temperature is too low to meet the requirements of the process conditions, resulting in the production of defective products; if the heat energy consumption is considered, the heater should be increased first The output heat energy makes the lower mold reach a temperature of about 156 degrees, but the temperature of the lower mold does not actually have a fixed relationship with the temperature of the material to be pressed, so the actual temperature of the material to be pressed may be 150 degrees. Too high will cause damage to the compound to be pressed, and also lead to defective products.
爰是，本發明的目的，在於提供一種在散熱片壓合製程中可掌握待壓合物之溫度的散熱片壓合製程之溫度控制方法。 The object of the present invention is to provide a temperature control method for the heat sink pressing process that can control the temperature of the to-be-pressed compound during the heat sink pressing process.
本發明的另一目的，在於提供一種在散熱片壓合製程中可掌握待壓合物之溫度的散熱片壓合製程之溫度控制裝置。 Another object of the present invention is to provide a temperature control device for the heat sink pressing process that can control the temperature of the material to be pressed during the heat sink pressing process.
本發明的又一目的，在於提供一種用以執行如所述溫度控制方法的裝置。 Another object of the present invention is to provide a device for performing the temperature control method as described above.
依據本發明目的之散熱片壓合製程之溫度控制方法，包括：提供一加熱器，設於一待壓合物之下側的一第一壓模；提供一第一感溫器，設於該待壓合物之下側的該第一壓模；提供一第二感溫器，設於該待壓合物之上側的一第二壓模；提供一控制單元，電性連結該加熱器、該第一感溫器與該第二感溫器；以該第一感溫器與該第二感溫器分別感測該待壓合物兩側之溫度，該第一感溫器感測該加熱器欲對該待壓合物加熱之一第一溫度，該第二感溫器感測該第一溫度傳遞經該待壓合物後之一第二溫度，並使該控制單元依感測之溫度控制該加熱器之加熱溫度。 The temperature control method of the heat sink pressing process according to the object of the present invention includes: providing a heater and a first pressing mold arranged on the underside of a material to be pressed; and providing a first temperature sensor arranged on the The first press mold on the lower side of the product to be pressed; provide a second temperature sensor, and a second press mold on the upper side of the product to be pressed; provide a control unit, which is electrically connected to the heater, The first temperature sensor and the second temperature sensor; the first temperature sensor and the second temperature sensor respectively sense the temperature on both sides of the product to be pressed, and the first temperature sensor senses the The heater intends to heat the product to be pressed at a first temperature, and the second temperature sensor senses a second temperature after the first temperature has passed through the product to be pressed, and makes the control unit sense The temperature controls the heating temperature of the heater.
依據本發明另一目的之散熱片壓合製程之溫度控制裝置，包括：一第一壓模，設有一支撐體、一加熱器與一第一感溫器；一第二壓模， 設有一壓體與一第二感溫器；一控制單元，電性連結該加熱器、該第一感溫器與該第二感溫器；該第一壓模與該第二壓模設於一待壓合物之兩側，分別以該支撐體與該壓體夾壓該待壓合物；該待壓合物以矩陣排列方式對應放置於一載盤之複數個矩陣排列之鏤空區間上；該第一感溫器與該第二感溫器可分別感測該待壓合物兩側之溫度，並以該控制單元控制該加熱器之加熱溫度。 According to another object of the present invention, a temperature control device for a heat sink pressing process includes: a first pressing mold provided with a support, a heater, and a first temperature sensor; and a second pressing mold, A pressure body and a second temperature sensor are provided; a control unit is electrically connected to the heater, the first temperature sensor and the second temperature sensor; the first pressure mold and the second pressure mold are arranged at On both sides of a composition to be pressed, the support body and the pressure body are used to clamp the composition to be pressed; the composition to be pressed is placed in a matrix arrangement on the hollow space of a plurality of matrix arrangements of a carrier plate ; The first temperature sensor and the second temperature sensor can respectively sense the temperature on both sides of the compound to be pressed, and the control unit controls the heating temperature of the heater.
依據本發明又一目的之散熱片壓合製程之溫度控制裝置，包括：用以執行如所述散熱片壓合製程之溫度控制方法的裝置。 According to another object of the present invention, a temperature control device for a heat sink pressing process includes: a device for performing the temperature control method of the heat sink pressing process.
本發明實施例之散熱片壓合製程之溫度控制方法及裝置，該第二感溫器可在該待壓合物一側感測該待壓合物另一側之該加熱器傳遞至該待壓合物之溫度，使該控制單元可評估該待壓合物兩側之溫度判斷該待壓合物內部之溫度，以控制該加熱器之溫度達到符合壓合製程條件所需。 In the temperature control method and device of the heat sink pressing process of the embodiment of the present invention, the second temperature sensor can sense on one side of the material to be pressed and the heater on the other side of the material to be pressed and transfer to the material to be pressed. The temperature of the pressing compound enables the control unit to evaluate the temperature on both sides of the pressing compound to determine the temperature inside the pressing compound, so as to control the temperature of the heater to meet the requirements of the pressing process.
A:座架 A: Seat frame
A1:底座 A1: Base
A2:頂座 A2: Top seat
A3:樞桿 A3: Pivot
A4:樞座 A4: Pivot
A5:第一驅動器 A5: The first drive
A6:操作區間 A6: Operating range
B:支撐機構 B: Supporting mechanism
B1:第一壓模 B1: The first die
B11:支撐體 B11: Support
B111:第一傳熱面 B111: The first heat transfer surface
B112:支撐面 B112: Support surface
B12:第一壓模座 B12: The first die seat
B13:加熱器 B13: heater
B14:第一感溫器 B14: The first temperature sensor
C:加壓機構 C: Pressure mechanism
C1:第二壓模 C1: The second die
C11:壓體 C11: pressure body
C111:第二傳熱面 C111: second heat transfer surface
C112:壓面 C112: Pressed surface
C12:第二壓模座 C12: The second die seat
C13:第二感溫器 C13: Second temperature sensor
C2:加壓動力源 C2: Pressurized power source
C21:第二驅動器 C21: second drive
D:控制單元 D: Control unit
T:載盤 T: Disk
T1:鏤空區間 T1: hollow interval
T2:限位銷 T2: Limit pin
TC1:第一溫度變化曲線 TC1: The first temperature change curve
TC2:第二溫度變化曲線 TC2: Second temperature change curve
TC3:第三溫度變化曲線 TC3: The third temperature change curve
TC3':第三溫度變化曲線 TC3': The third temperature curve
W:待壓合物 W: To be pressed
W1:基板 W1: substrate
W2:晶片 W2: chip
W3:散熱片 W3: heat sink
W31:框緣 W31: Frame edge
W32:中央隆設面 W32: Central bulging surface
W4:黏膠 W4: viscose
W5:導熱膠 W5: Thermal conductive glue
W6:第三感溫器 W6: The third temperature sensor
圖1係本發明實施例中待壓合物之立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the composition to be pressed in an embodiment of the present invention.
圖2係本發明實施例中基板、晶片與散熱片之立體分解示意圖。 Fig. 2 is a three-dimensional exploded schematic diagram of the substrate, the chip and the heat sink in the embodiment of the present invention.
圖3係本發明實施例中待壓合物放置於載盤上之立體示意圖。 Fig. 3 is a three-dimensional schematic diagram of the compound to be pressed placed on the tray in the embodiment of the present invention.
圖4係本發明實施例中執行散熱片壓合之裝置之立體示意圖。 Fig. 4 is a three-dimensional schematic diagram of a device for performing heat sink pressing in an embodiment of the present invention.
圖5係本發明實施例中執行散熱片壓合之裝置之側面示意圖。 Fig. 5 is a schematic side view of a device for performing heat sink pressing in an embodiment of the present invention.
圖6係本發明實施例中載盤置放於第一壓模上之示意圖。 FIG. 6 is a schematic diagram of placing the tray on the first pressing mold in the embodiment of the present invention.
圖7係本發明實施例中待壓合物夾壓於第一壓模與第二壓模之間之示意圖。 FIG. 7 is a schematic diagram of the compound to be pressed between the first pressing mold and the second pressing mold in an embodiment of the present invention.
圖8係本發明實施例中第一感溫器與第二感溫器所感測之溫度變化之示意圖。 FIG. 8 is a schematic diagram of the temperature changes sensed by the first temperature sensor and the second temperature sensor in the embodiment of the present invention.
圖9係本發明實施例中待壓合物內設置第三感溫器之示意圖。 Fig. 9 is a schematic diagram of a third temperature sensor set in the composition to be pressed in an embodiment of the present invention.
圖10係本發明實施例中第一感溫器、第二感溫器與第三感溫器所感測之溫度變化之示意圖。 10 is a schematic diagram of temperature changes sensed by the first temperature sensor, the second temperature sensor and the third temperature sensor in the embodiment of the present invention.
請參閱圖1、2，本發明實施例散熱片壓合製程之溫度控制方法及裝置，可使用如圖所示之待壓合物W為例作說明，該待壓合物W由一基板W1、一晶片W2與一散熱片W3所組成，該晶片W2設於該基板W1與該散熱片W3之間，該基板W1上四角落處分別各塗覆∟型朝中央框設狀之黏膠W4，以供該散熱片W3周緣低階之一框緣W31貼覆黏設，另需在該晶片W2上表面塗覆呈交叉狀之導熱膠W5(或貼附導熱膠片)，以供該散熱片W3之一中央隆設面W32內緣貼覆黏設。 Please refer to FIGS. 1 and 2. The temperature control method and device of the heat sink pressing process of the embodiment of the present invention can be illustrated by using the compound W as shown in the figure as an example. The compound W is composed of a substrate W1 , A chip W2 and a heat sink W3, the chip W2 is set between the substrate W1 and the heat sink W3, the four corners of the substrate W1 are respectively coated with ∟-shaped adhesive W4 framed toward the center , In order for the lower-level frame edge W31 of the periphery of the heat sink W3 to be pasted and bonded, and the upper surface of the chip W2 needs to be coated with a cross-shaped thermally conductive glue W5 (or a thermally conductive film) for the heat sink One of the central raised surfaces of W3, W32, is pasted on the inner edge.
請參閱圖3，在散熱片壓合製程中，該待壓合物W可以矩陣排列方式對應放置於一載盤T之複數個矩陣排列之鏤空區間T1上進行操作，並使該待壓合物W受該鏤空區間T1周緣支撐可保持於該載盤T上不至於墜落，並受該鏤空區間T1周緣之複數個限位銷T2限制水平位移。 Referring to FIG. 3, in the heat sink pressing process, the compound to be pressed W can be placed in a matrix arrangement corresponding to the hollow section T1 of a plurality of matrix arrangements of a carrier T for operation, and the compound to be pressed W supported by the periphery of the hollow section T1 can be kept on the carrier T so as not to fall, and the horizontal displacement is restricted by a plurality of limit pins T2 on the periphery of the hollow section T1.
請參閱圖4、5，本發明實施例散熱片壓合製程之溫度控制方法可以如圖中所示裝置為例作說明，其設有：一座架A，包括一底座A1及一頂座A2，其間以複數個樞桿A3形成支撐，並於該底座A1及該頂座A2間設一樞座A4，其可受該頂座A2上一例如汽壓缸所構成之第一驅動器A5驅動，而在各樞桿A3間進行大行程之上、下位移；該樞座A4下方與該底座A1上方間形成一操作區間A6；一支撐機構B，設於該座架A之該操作區間A6中，該支撐機構B下方設於該底座A1上方；該支撐機構B設有一第一壓模B1，其凸設有複數個矩陣排列之支撐體B11於一第一壓模座B12上； 一加壓機構C，設於該座架A之該操作區間A6中，該加壓機構C上方設於該樞座A4下方並與其連動地可作上、下位移；該加壓機構C設有一第二壓模C1與一加壓動力源C2，該第二壓模C1上凸設有複數個矩陣排列之壓體C11於一第二壓模座C12下方，該加壓動力源C2內設有複數個矩陣排列對應該壓體C11例如氣壓缸所構成之第二驅動器C21，可各別驅動對應之壓體C11相對該第二壓模座C12進行小行程之上、下位移；一控制單元D，設於該頂座A2上方，可用以執行數據運算並進行裝置上各功能控制。 4 and 5, the temperature control method of the heat sink pressing process of the embodiment of the present invention can be illustrated by the device shown in the figure as an example, which is provided with: a frame A including a base A1 and a top base A2, A plurality of pivot rods A3 are used to form a support, and a pivot seat A4 is provided between the base A1 and the top seat A2, which can be driven by a first driver A5 formed by, for example, a pneumatic cylinder on the top seat A2, and A large-stroke up and down displacement is performed between each pivot rod A3; an operating section A6 is formed between the pivot seat A4 and the upper side of the base A1; a support mechanism B is arranged in the operating section A6 of the seat frame A, The supporting mechanism B is arranged below the base A1; the supporting mechanism B is provided with a first pressing mold B1 on which a plurality of matrix-arranged supports B11 are protrudingly arranged on a first pressing mold base B12; A pressing mechanism C is arranged in the operating section A6 of the seat frame A. The pressing mechanism C is arranged above the pivot base A4 and can move up and down in linkage with it; the pressing mechanism C is provided with a A second press mold C1 and a pressurizing power source C2. A plurality of press bodies C11 arranged in a matrix are protrudingly provided on the second press mold C1 under a second press mold base C12. The pressurizing power source C2 is provided with A plurality of matrix arrangements correspond to the second driver C21 formed by the pressing body C11 such as a pneumatic cylinder, which can individually drive the corresponding pressing body C11 to move up and down in a small stroke relative to the second pressing mold base C12; a control unit D , Located above the top base A2, can be used to perform data calculations and control various functions on the device.
請參閱圖5、6，各支撐體B11皆設有一第一傳熱面B111與一支撐面B112，該第一傳熱面B111上設有一加熱器B13，該第一傳熱面B111與該支撐面B112之間設有一第一感溫器B14，該第一感溫器B14設於該加熱器B13上側，可感測該加熱器B13輸出熱能後該支撐體B11靠近該待壓合物W一側之溫度；各壓體C11皆設有一第二傳熱面C111與一壓面C112，該第二傳熱面C111上設有一第二感溫器C13，可感測該加熱器B13傳遞經該支撐體B11、該待壓合物W後之溫度；各支撐體B11與各壓體C11上之各加熱器B13、各第一感溫器B14與各第二感溫器C13分別電性連結該控制單元D，該控制單元D可依感測之溫度控制各加熱器B13之加熱溫度。 Please refer to Figures 5 and 6, each support B11 is provided with a first heat transfer surface B111 and a support surface B112, the first heat transfer surface B111 is provided with a heater B13, the first heat transfer surface B111 and the support A first temperature sensor B14 is arranged between the surface B112, and the first temperature sensor B14 is arranged on the upper side of the heater B13, and can sense that the support B11 approaches the composition to be pressed after the heater B13 outputs heat energy. The temperature of the side; each pressure body C11 is provided with a second heat transfer surface C111 and a pressure surface C112, the second heat transfer surface C111 is provided with a second temperature sensor C13, which can sense the heater B13 passing through the The temperature of the support body B11 and the composite to be pressed W; each support body B11 and each heater B13 on each pressing body C11, each first temperature sensor B14 and each second temperature sensor C13 are electrically connected to the The control unit D can control the heating temperature of each heater B13 according to the sensed temperature.
請參閱圖5、6、7，在進行散熱片壓合製程時，承載該待壓合物W之該載盤T可經一搬送機構(圖未示)水平搬送至該第一壓模B1與該第二壓模C1之間，並將該載盤T置放於該第一壓模B1上；當該載盤T置放於該第一壓模B1上時，該支撐體B11穿經該載盤T之鏤空區間T11，以該支撐面B112支撐該待壓合物W之該基板W1，使該待壓合物W與該載盤T分離；接著該第二壓模C1受驅動進行大行程之向下位移，使該第二壓模C1上之壓體C11靠近但不碰觸該待壓合物W，然後該加壓動力源C2之第二驅 動器C21再驅動該壓體C11相對該第二壓模座C12進行小行程之向下位移，使該壓體C11之壓面C112碰觸該待壓合物W，並由上側對該待壓合物W之該散熱片W3施加壓力；當該第一壓模B1與該第二壓模C1夾壓該待壓合物W時，該加熱器B13輸出之熱能可先傳遞至該支撐體B11，再傳遞至該待壓合物W，使該待壓合物W內之黏膠W4可因熱而固化。 Please refer to Figures 5, 6, and 7, during the heat sink pressing process, the carrier plate T carrying the to-be-pressed compound W can be horizontally conveyed to the first pressing mold B1 and the first pressing mold B1 through a conveying mechanism (not shown) Between the second pressing mold C1, and placing the tray T on the first pressing mold B1; when the tray T is placed on the first pressing mold B1, the support B11 passes through the In the hollow section T11 of the carrier plate T, the support surface B112 supports the substrate W1 of the compound W to be pressed, so that the compound to be pressed W is separated from the carrier plate T; then the second pressing mold C1 is driven to expand The downward displacement of the stroke causes the pressing body C11 on the second pressing mold C1 to approach but not touch the to-be-pressed compound W, and then the second drive of the pressurizing power source C2 The actuator C21 then drives the pressing body C11 to make a small stroke downward displacement relative to the second pressing mold base C12, so that the pressing surface C112 of the pressing body C11 touches the to-be-pressed compound W, and presses the body W from the upper side. The heat sink W3 of the compound W applies pressure; when the first press mold B1 and the second press mold C1 press the compound W to be pressed, the heat energy output by the heater B13 can be first transferred to the support B11 , And then transferred to the composition W to be pressed, so that the adhesive W4 in the composition W to be pressed can be cured by heat.
本發明實施例散熱片壓合製程之溫度控制方法在實施上，當該第一壓模B1與該第二壓模C1夾壓該待壓合物W時，該第一感溫器B14與該第二感溫器C13分別感測該待壓合物W上下兩側之溫度，並以該控制單元D紀錄單位時間內溫度之變化，該第一感溫器B14感測該加熱器B13欲對該待壓合物W加熱之一第一溫度，該第二感溫器C13感測該第一溫度傳遞經該支撐體B11、該待壓合物W後之一第二溫度，因該待壓合物W位於該第一感溫器B14與該第二感溫器C13之間，故在相同時間點該待壓合物W之一第三溫度最高不會高於該第一溫度，最低不會低於該第二溫度，使該控制單元D可藉由如圖8所示之一對應該第一溫度之第一溫度變化曲線TC1與一對應該第二溫度之第二溫度變化曲線TC2，模擬運算出該待壓合物W之一可能對應該第三溫度之第三溫度變化曲線TC3(該第三溫度變化曲線TC3之模擬運算方式可取相同時間點之該第一溫度與該第二溫度之中間值相連接而成)，且該控制單元D可依感測之溫度變化控制該加熱器B13之加熱溫度。 In the implementation of the temperature control method of the heat sink pressing process of the embodiment of the present invention, when the first pressing mold B1 and the second pressing mold C1 clamp the to-be-pressed compound W, the first temperature sensor B14 and the The second temperature sensor C13 respectively senses the temperature of the upper and lower sides of the composition W to be pressed, and uses the control unit D to record the temperature change per unit time. The first temperature sensor B14 senses that the heater B13 wants to The compound W to be pressed is heated to a first temperature, and the second temperature sensor C13 senses a second temperature after the first temperature is transmitted through the support B11 and the compound W to be pressed. The composition W is located between the first temperature sensor B14 and the second temperature sensor C13. Therefore, at the same time point, the third temperature of the composition W to be pressed will not be higher than the first temperature at the highest and the lowest Is lower than the second temperature, so that the control unit D can use a first temperature change curve TC1 corresponding to the first temperature and a second temperature change curve TC2 corresponding to the second temperature as shown in FIG. It is calculated by simulation that one of the compound W to be pressed may correspond to the third temperature change curve TC3 of the third temperature (the simulation calculation method of the third temperature change curve TC3 can be the first temperature and the second temperature at the same time point The intermediate value is connected together), and the control unit D can control the heating temperature of the heater B13 according to the sensed temperature change.
為了可以更明確得知該第三溫度與該第一溫度、該第二溫度間之消長關係，如圖9、10所示，待壓合物W內可另埋設有一第三感溫器W6於該散熱片W3與該晶片W2之間並與該控制單元D電性連結，可直接感測該第一溫度傳遞至該待壓合物W內之該第三溫度而獲得一實際對應該第三溫度之第三溫度變化曲線TC3'，並提供給該控制單元D作為模擬運算該第 三溫度變化曲線TC3時之參考；其中，該第三感溫器W6主要使用於調機校正時。 In order to more clearly know the relationship between the third temperature, the first temperature, and the second temperature, as shown in FIGS. 9 and 10, a third temperature sensor W6 can be embedded in the composite W to be pressed. The heat sink W3 and the chip W2 are electrically connected to the control unit D, and can directly sense the third temperature transferred from the first temperature to the to-be-compressed compound W to obtain an actual corresponding third temperature The third temperature change curve TC3' of temperature is provided to the control unit D as an analog operation for the first Reference for the temperature change curve TC3; among them, the third temperature sensor W6 is mainly used for adjustment and calibration.
本發明實施例之散熱片壓合製程之溫度控制方法及裝置，該第二感溫器C13可在該待壓合物W一側感測該待壓合物W另一側之該加熱器B13傳遞至該待壓合物W之溫度，使該控制單元D可評估該待壓合物W兩側之溫度判斷該待壓合物W內部之溫度，以控制該加熱器B13之加熱溫度使該待壓合物W之溫度達到符合壓合製程條件所需。 In the temperature control method and device of the heat sink pressing process of the embodiment of the present invention, the second temperature sensor C13 can sense the heater B13 on one side of the material to be pressed W on the other side of the material to be pressed W The temperature transmitted to the composition W to be pressed enables the control unit D to evaluate the temperature on both sides of the composition W to determine the temperature inside the composition W to control the heating temperature of the heater B13 so that the The temperature of the compound W to be pressed meets the requirements of the pressing process conditions.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the foregoing are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent.
B11:支撐體 B11: Support
B111:第一傳熱面 B111: The first heat transfer surface
B112:支撐面 B112: Support surface
B12:第一壓模座 B12: The first die seat
B13:加熱器 B13: heater
B14:第一感溫器 B14: The first temperature sensor
C11:壓體 C11: pressure body
C111:第二傳熱面 C111: second heat transfer surface
C112:壓面 C112: Pressed surface
C13:第二感溫器 C13: Second temperature sensor
T:載盤 T: Disk
T1:鏤空區間 T1: hollow interval
W:待壓合物 W: To be pressed
W1:基板 W1: substrate
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| TWI787036B (en) * | 2022-01-04 | 2022-12-11 | 萬潤科技股份有限公司 | Heat sink pressing method and device |
| TWI790865B (en) * | 2021-12-20 | 2023-01-21 | 萬潤科技股份有限公司 | Heat sink pressing method and device |
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