JP2002231623A - Cooling device and substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device which is capable of keeping a substrate high in temperature uniformity, while subjecting the substrate to cooling and improving the throughput. SOLUTION: A substrate W as a work is placed on a mounting plate 31. A Peltier module 40 is laminated under the mounting plate 31 through the intermediary of a silicone grease film 32 of high thermal conductivity, and a cooling plate 34 is laminated under the Peltier module 40 through the intermediary of a silicone grease film 33. Electrical energy supplied to the Peltier module 40 is adjusted by a power supply/control unit 37, on the basis of the measurement result of a temperature sensor 38 embedded in the mounting plate 31. Since the Peltier module 40 has the same planar shape as that of the mounting plate 31, and Peltier elements are arranged in the module 40 to be uniform in number per unit area in a plan view, the mounting plate 31 can be kept uniform in temperature distribution, even if it is reduced in thickness, the substrate W can be kept high in temperature uniformity, when it undergoes a cooling, and this cooling device can obtain high throughput.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling apparatus for cooling a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk (hereinafter, referred to as a "substrate") and the like. The present invention relates to a substrate processing apparatus incorporating a cooling processing apparatus.

[0002]

2. Description of the Related Art As is well known, products such as semiconductors and liquid crystal displays are subjected to a series of processes such as cleaning, resist coating, exposure, development, etching, formation of an interlayer insulating film, heat treatment, and dicing. It is manufactured by applying. Among these various treatments, the heat treatment includes a heat treatment and a cooling treatment. Usually, the cooling treatment is performed immediately after the heat treatment as part of the heat treatment before and after the resist coating treatment and the development treatment. The cooling process not only lowers the temperature of the heated substrate but also regulates the temperature of the substrate to a constant temperature, and is an important process indispensable in today's semiconductor manufacturing technology. .

FIG. 8 is a plan view showing a main part of a conventional cooling processing apparatus. In the past, the substrate was cooled by circulating constant-temperature water. However, in recent years, a direct electronic cooling type cooling processing apparatus using a Peltier element has been widely used to improve throughput. The cooling processing apparatus shown in FIG. 8 is also of a direct electronic cooling and heating type, in which seven Peltier modules 102 are arranged under a mounting plate 101 made of a metal disk.

FIG. 9 shows a conventional Peltier module 102.
It is a side view which shows the structure of. The conventional Peltier module 102 has a configuration in which a number of Peltier elements 106 are sandwiched between two ceramic plates 105. As is well known, the Peltier element 106 is an element that realizes the transfer of heat in a predetermined direction by energization. A pattern circuit for energization is formed on each of the two ceramic plates 105, and a power supply is provided. A power supply line for conduction to either the anode or the cathode is connected. Further, by using the ceramic plate 105, a large number of Peltier elements 106 are fixed to give strength to the Peltier module 102 itself, and electrical insulation between the Peltier elements 106 and the outside is insulated.

When the Peltier module 102 moves heat from above to below by energization,
The mounting plate 101 is cooled, and thus the substrate mounted on the mounting plate 101 is cooled.

[0006]

As shown in FIG. 8, a mounting plate 101 on which a substrate is mounted is a metal (generally aluminum) disk having a diameter of 200 mm.
It is about 220 mm for a substrate with a diameter of mm and about 320 mm for a substrate with a diameter of 300 mm. On the other hand, the Peltier module 102 has a rectangular shape with one side of about 40 mm to 70 mm. In the conventional cooling processing device, the circular mounting plate 10
A square Peltier module 102 is arranged under one, and the arrangement pattern is such that six Peltier modules 102 are arranged radially around one Peltier module 102. The arrangement pattern is not limited to the embodiment shown in FIG. 8. However, in any arrangement pattern, as long as a plurality of square Peltier modules 102 are arranged under the circular mounting plate 101, the Peltier module must be arranged. There was a gap between the 102, that is, an area where the Peltier module 102 did not exist in the plane area of the mounting plate 101. Further, such a gap is necessary for arranging the power supply line connected to each Peltier module 102.

If there is a gap between the Peltier modules 102 as shown in FIG. 8, the area just above the Peltier module 102 is sufficiently cooled, but the area just above the gap is not cooled at all. The distribution becomes non-uniform, resulting in temperature unevenness in the substrate cooling process. Such temperature unevenness of the cooling process is not preferable in terms of the process, and becomes a serious problem particularly in a situation where pattern miniaturization has progressed remarkably in recent years.

The above problem can be solved by making the Peltier module 102 itself as large as the mounting plate 101. However, when the Peltier module 102 is made large, the ceramic plate 105 also becomes large. It is not realistic because the Peltier module 102 itself becomes remarkably expensive while being easily broken by thermal stress.

For this reason, in the conventional cooling processing apparatus, the thickness of the mounting plate 101 is increased so as to reduce the temperature difference immediately above the Peltier module 102 and immediately above the gap, thereby maintaining the temperature uniformity during the cooling processing. Was.

However, when the thickness of the mounting plate 101 is increased, the heat capacity thereof is also increased, so that a long time is required for the cooling process, and the throughput is reduced. In addition, when the heat capacity of the mounting plate 101 is increased, a large amount of energy is required for the cooling process, and there is a problem that the running cost is increased. further,
Since the thermal conductivity of the ceramic plate 105 itself constituting the Peltier module 102 is low, there has been a problem that the throughput is further reduced and the energy consumption is further increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a cooling processing apparatus and a substrate processing apparatus capable of maintaining high temperature uniformity of a substrate during cooling processing and obtaining high throughput. Aim.

[0012]

According to a first aspect of the present invention, there is provided a cooling apparatus for cooling a substrate, comprising: a mounting plate on which a substrate is mounted on an upper surface; A Peltier module having the same planar shape and disposed below the mounting plate, wherein the Peltier module makes the number of Peltier elements arranged per unit area in the planar shape substantially uniform. .

According to a second aspect of the present invention, in the cooling processing apparatus according to the first aspect of the present invention, the mounting plate is laminated with the Peltier module with a thermally conductive material film interposed therebetween.

According to a third aspect of the present invention, in the cooling processing apparatus according to the second aspect of the present invention, the Peltier module has an end face in contact with the heat conductive material film formed of a heat resistant insulating film. The Peltier element is held by a holding member arranged at a portion other than the end face.

According to a fourth aspect of the present invention, in the cooling apparatus according to the second or third aspect, the heat conductive material film is a silicone gel sheet.

According to a fifth aspect of the present invention, there is provided a cooling processing apparatus according to any one of the first to fourth aspects,
The Peltier module is divided into a plurality of parts, and each of the divided Peltier modules is connected to a different power supply control unit.

According to a sixth aspect of the present invention, in the cooling apparatus according to the fifth aspect of the present invention, the mounting plate is a circular flat plate, and the Peltier module is located below a central portion of the mounting plate. And a ring region located below the periphery of the mounting plate.

According to a seventh aspect of the present invention, in the cooling processing apparatus for cooling a substrate, a mounting plate on which the substrate is mounted on the upper surface, and a uniform plate over the entire surface of the mounting plate below the mounting plate. A Peltier element arranged at a high density.

According to a further aspect of the present invention, there is provided a substrate processing apparatus for performing a predetermined process on a substrate.
Of the invention.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

<1. First Embodiment> First, the overall configuration of a substrate processing apparatus incorporating a cooling processing apparatus according to the present invention will be described. FIG. 1 is a perspective view illustrating an example of the overall configuration of the substrate processing apparatus. The substrate processing apparatus 1 is an apparatus that performs a resist coating process and a developing process on a substrate, and has six heat treatment boxes BX mounted on a base unit 10.

The base unit 10 includes two spin coaters (rotary coating units) and two spin developers (rotary developing units) (not shown).
It has. The spin coater applies a uniform resist by dripping a photoresist onto the main surface of the substrate while rotating the substrate. In addition, spin developers
The developing process is performed by supplying a developing solution onto the exposed substrate. A transfer robot is provided at the center of the concave portion of the base portion 10.

Each of the heat treatment boxes BX is configured by laminating a two-stage heating processing unit 11 on a cooling processing unit 20 as a cooling processing apparatus according to the present invention. The heat treatment unit 11 includes a hot plate therein, and heats the substrate to a predetermined temperature. The cooling processing unit 20 includes a cool plate therein, and has a function of cooling the substrate to lower the temperature to a predetermined temperature and maintaining the substrate at the predetermined temperature. The details of the cooling processing unit 20 will be described later.

When substrate processing is performed in the substrate processing apparatus 1, a substrate is circulated and transported between a spin coater, a spin developer, a heating processing unit 11, and a cooling processing unit 20 according to a predetermined process by a transport robot provided on a base unit 10. I do. As an example of the predetermined process, for example, a resist coating process is performed on a substrate that has been subjected to a heating process and a cooling process for strengthening adhesion, and a heating process and a cooling process are performed again. The substrate is carried out to an apparatus (stepper), and the exposed substrate that has returned is subjected to post-exposure bake processing and cooling processing, and then subjected to development processing, and further subjected to heat processing and cooling processing. Among these processes, the heating process of the substrate is performed by the heating process unit 11, the cooling process is performed by the cooling process unit 20, the resist coating process is performed by the spin coater, and the developing process is performed by the spin developer.

Next, the cooling processing unit 20 will be described in more detail. FIG. 2 is a diagram illustrating a configuration of the cooling processing unit 20. The cooling processing unit 20 includes a cool plate 30, a cover 21, a lift pin 22, a lift pin driving unit 25, and a connecting member 23 inside a housing (see FIG. 1) provided with a loading / unloading port for the substrate W. ing.

The cover 21 is for improving the temperature uniformity by covering the upper part of the substrate W during the cooling process. The cover 21 can be moved up and down in the vertical direction by an elevating mechanism (not shown). When the substrate W is carried into and out of the cooling processing unit 20 by the above-described transfer robot, the cover 21 is raised. It descends and covers the upper part of the substrate W.

The lift pins 22, the connecting member 23, and the lift pin driving section 25 are for raising and lowering the substrate W on the cool plate 30. Lift pin 22
Are a plurality of rod-shaped members erected on the connecting member 23 along the vertical direction. The lift pins 22 can freely pass through through holes provided in the cool plate 30. It should be noted that one cooling processing unit 20 has lift pins 2
2 are provided, for example, six, but FIG. 2 shows only two for convenience of illustration.

The lift pin driving section 25 is constituted by using, for example, an air cylinder, and its piston and a plurality of lift pins 22 are connected by a connecting member 23. Accordingly, the lift pin 22 also performs the vertical movement along the vertical direction in accordance with the vertical movement of the lift pin drive unit 25. When the substrate W is carried into the cooling processing unit 20 by the transfer robot, or when the substrate W is carried out of the cooling processing unit 20, the lift pins 22 rise and the tips project from the cool plate 30, and the lift pins 22 Delivery of the substrate W is performed. On the other hand, when performing cooling processing of the substrate W in the cooling processing unit 20, the lift pins 22 descend and their tips enter the through holes of the cool plate 30, and the substrate W
Is placed on the cool plate 30 (FIG. 2).
State).

The cool plate 30 is a main part of the cooling unit 20 and performs a cooling process on the mounted substrate W. FIG. 3 is a side sectional view showing the configuration of the cool plate 30. Cool plate 30 of the present embodiment
Are, in order from the top, the mounting plate 31, the silicone grease film 3
2. Peltier module 40, silicone grease film 33
And a cooling plate 34.

The mounting plate 31 is an aluminum disk on which the substrate W is mounted. The planar shape of the mounting plate 31 is defined according to the substrate to be processed.
For example, a substrate W having a diameter of 200 mm may have a circular shape with a diameter of about 220 mm, and a substrate W having a diameter of 300 mm may have a circular shape with a diameter of about 320 mm. Mounting plate 31
Is embedded with a temperature sensor 38 for temperature measurement. As the temperature sensor 38, for example, a thermocouple may be used.

The silicone grease film 32 is a heat conductive material film formed of gel silicone grease, and is sandwiched between the mounting plate 31 and the Peltier module 40. Similarly, the silicone grease film 33 is also a thermally conductive material film formed of gel silicone grease,
It is sandwiched between the cooling plate 34 and the Peltier module 40. The silicone grease films 32 and 33 have both high thermal conductivity and stress absorption performance, enable quick heat conduction between the mounting plate 31 or the cooling plate 34 and the Peltier module 40, and
Can absorb thermal stress from Note that, instead of the silicone grease films 32 and 33, another heat conductive material film having both high heat conductivity and stress absorption performance may be used. For example, a heat conductive material obtained by laminating an aluminum foil and a polyimide may be used. A compound laminate material film may be used.

The cooling plate 34 is a heat radiating plate for releasing the heat transmitted from the Peltier module 40 to the outside, and has the same planar shape as the mounting plate 31. A cooling pipe is disposed in the entire inside of the cooling plate 34, and the cooling pipe is connected to a cooling water supply pipe 39 and a cooling water distribution pipe (not shown). The cooling water supplied from the cooling water supply pipe 39 circulates through the cooling pipe to absorb the heat received by the cooling plate 34 from the Peltier module 40. Then, when the cooling water is discharged to the cooling water distribution pipe, the heat received by the cooling plate 34 from the Peltier module 40 is carried out of the apparatus. That is, the cooling plate 34 is a water-cooled radiator plate,
The material is preferably a metal material having high thermal conductivity.

The Peltier module 40 is an electronic cooling and heating module in which a large number of Peltier elements are integrated, and receives electric power from the mounting plate 31 to the cooling plate 34.
Move heat towards. Expressed more precisely, the Peltier module 40 that has been supplied with power cools the mounting plate 31 by removing heat from the mounting plate 31 via the silicone grease film 32, and transfers the removed heat to the silicone grease film. The cooling plate 34 is heated by giving it to the cooling plate 34 via 33.

FIG. 4 is a side view showing the configuration of the Peltier module 40 of the present embodiment. FIG. 5 is a perspective view showing the internal structure of the Peltier module 40. As is well known, the Peltier element utilizes the Peltier effect that occurs when a current flows through the contact portion between different types of conductors.
1a and an N-type element 41b. In the following, when there is no need to particularly distinguish the P-type element 41a and the N-type element 41b, these are collectively referred to simply as a Peltier element 41. The Peltier device provided in the Peltier module 40 is a single-crystal device with high efficiency.

In this embodiment, the P-type elements 41a and the N-type elements 41b form a checkerboard pattern in which the P-type elements 41a and the N-type elements 41b are alternately arranged. N-type element 41b is 1
It penetrates through the holding plates 42 and is held by the holding plates 42. Conversely, the holding plate 42 is arranged in a portion excluding the end face of the Peltier module 40, and integrally includes all the P-type elements 41a and the N-type elements 41b arranged in the Peltier module 40 in a checkered pattern. By holding, the Peltier module 4
The strength of 0 itself is maintained. The holding plate 4
As the material of 2, for example, glass epoxy or the like may be used.

As shown in FIGS. 4 and 5, the adjacent P-type element 41a and N-type element 41b are
3 are electrically connected. The electrode 43 realizes electrical connection between different types of elements, and exhibits a function as a Peltier element.

Further, as shown in FIG. 4, a polyimide film 45 is provided on both upper and lower ends of the Peltier element 41 fixed and held by a glass epoxy holding plate 42 and having electrodes 43 attached thereto. In other words, the end face of the Peltier module 40 that is in contact with the silicone grease films 32 and 33 is formed of the polyimide film 45. The polyimide film 45 is a heat-resistant insulating film and has a role of insulating electrical conduction between the Peltier element 41 and the outside of the module without breaking its insulation up to about 200 ° C. Instead of the polyimide film 45, another insulating film capable of maintaining the insulating property up to 60 ° C., preferably another insulating film capable of maintaining the insulating property up to 80 ° C. may be used. For example, a polyester film may be used. You may do it.

As described above, the conventional ceramic plate 105
In the Peltier module 40 of the present embodiment, the holding plate 42 made of glass epoxy and the polyimide film 45 share the role of fixing the Peltier element 106 and insulating it from the outside. That is, the glass epoxy holding plate 42 fixes and holds all the Peltier elements 41, and the polyimide film 45 insulates the electrical conduction between the Peltier elements 41 and the outside. Therefore, the polyimide film 45 only needs to have insulation properties with respect to the outside, so that its thickness can be significantly reduced as compared with the conventional ceramic plate 105.

The Peltier module 4 of the present embodiment
0, a ceramic plate 1 is provided by providing a glass epoxy holding plate 42 and a polyimide film 45.
Since there is no need to use the material 05, there is no possibility of the ceramic plate 105 cracking due to thermal stress and a sharp rise in price due to the increase in size, and the degree of freedom of the shape that can be taken is high. Therefore, it is possible to easily increase the plane size of the Peltier module 40 to obtain a desired shape. In the present embodiment, the planar shape of the Peltier module 40 is made the same as the planar shape of the mounting plate 31, and when the substrate W to be processed is φ200 mm, the diameter is 220 mm.
It is about circular, and in case of φ300mm, diameter is 320m
m.

In the Peltier module 40, the Peltier elements 41 are arranged according to a checkerboard pattern so that the number of arrangements per unit area is equal. Therefore, if the planar shape of the Peltier module 40 is made the same as the planar shape of the mounting plate 31, the number of Peltier elements 41 per unit area within the planar shape of the mounting plate 31 becomes uniform.

Returning to FIG. 3, the Peltier module 40 incorporated in the cool plate 30 is electrically connected to the power supply control unit 37 by wiring. More specifically, each of the anode and the cathode of the power supply control unit 37 is connected to a different electrode 43 via a wiring. At this time, wiring connection is performed so that power is supplied to all Peltier elements 41 provided in the Peltier module 40. The power supply controller 37 is also electrically connected to a temperature sensor 38 embedded in the mounting plate 31.

When the cooling process of the substrate W is performed in the cooling unit 20 described above, the substrate W carried in by the transfer robot is received by the lift pins 22, descends, and is mounted on the mounting plate 31. Thereafter, the power supply controller 37 adjusts the amount of power supply to the Peltier module 40 based on the temperature measurement result of the temperature sensor 38 so that the mounting plate 31 has a predetermined target temperature. As a result, the substrate W is cooled to the target temperature. After the cooling process is completed, the lift pins 22 move up, and the transfer robot receives the processed substrate W from the lift pins 22 and carries it out of the cooling processing unit 20.

In this manner, the number of Peltier elements 41 per unit area in the plane shape of the mounting plate 31 becomes uniform, so that the entire surface of the mounting plate 31 is cooled to the same extent. Therefore, even if the thickness of the mounting plate 31 is made significantly thinner than the conventional mounting plate 101, the temperature distribution of the mounting plate 31 during the cooling process becomes uniform, and as a result, the temperature uniformity of the substrate W is maintained. be able to. And the mounting plate 3
If the thickness of the substrate 1 can be reduced, its heat capacity will also be reduced, so that the tact time (processing time) required for the cooling process will be shortened, and as a result, a high throughput can be obtained.

In other words, the plane shape of the Peltier module 40 is made the same as the plane shape of the
By equalizing the number of Peltier elements 41 per unit area in one planar shape, even if the thickness of the mounting plate 31 is reduced, the temperature distribution can be made uniform, and the It is possible to maintain both the temperature uniformity of the substrate W and high throughput.

Further, since the thickness of the mounting plate 31 is reduced and the heat capacity is reduced, the energy required for the cooling process can be reduced. Furthermore, if the tact time required for the cooling process is equal to or shorter than the predetermined time, the number of the cooling processing units 20 provided in the substrate processing apparatus 1 can be reduced, and further energy saving and space saving can be achieved.

In this embodiment, the mounting plate 31
The silicone grease film 32 is sandwiched between the Peltier module 40 and the Peltier module 40. This silicone grease film 32
Has both high thermal conductivity and stress absorbing performance, absorbs thermal stress due to thermal expansion of the Peltier element 41, prevents the Peltier element 41 from being damaged, and allows the Peltier module 40 to As a result, it is possible to increase the cooling processing efficiency and obtain a higher throughput.

In this embodiment, the glass epoxy holding plate 42 fixes and holds all the Peltier elements 41, and the polyimide film 45 insulates the electrical connection between the Peltier elements 41 and the outside. Therefore,
As described above, the thickness of the polyimide film 45 can be significantly reduced as compared with the conventional ceramic plate 105, and there is no possibility that the polyimide film 45 will hinder heat conduction from the mounting plate 31 to the Peltier module 40. . As a result, the cooling processing efficiency is further increased, and higher throughput can be obtained.

<2. Second Embodiment> Next, the second embodiment of the present invention
An embodiment will be described. FIG. 6 is a plan view illustrating a main part of the cooling processing unit according to the second embodiment. FIG.
FIG. 4 is a side cross-sectional view illustrating a configuration of a cool plate of a cooling processing unit according to a second embodiment. The difference between the cooling processing unit of the second embodiment and the cooling processing unit 20 of the first embodiment is that the Peltier module 40 is divided into a plurality of parts and they are connected to different power supply control units. . The remaining points are the same as in the first embodiment, and a description thereof will be omitted.

In the first embodiment, one Peltier module 40 is provided. On the other hand, as shown in FIGS. 6 and 7, in the second embodiment, two Peltier modules 6 are provided.
1, 71 are provided. Peltier module 61 inside
Defines a circular area located below the center of the mounting plate 31. On the other hand, the outer Peltier module 71 forms a ring region located below the periphery of the mounting plate 31. The Peltier modules 61 and 71 themselves are electronic cooling and heating modules in which a number of Peltier elements similar to those in the first embodiment are integrated and arranged, and have the same structure as that shown in FIGS. Therefore, also in the second embodiment, it is possible to obtain the same effects as in the first embodiment. In FIGS. 6 and 7, a gap is formed between the inner Peltier module 61 and the outer Peltier module 71 for convenience of illustration, but from the viewpoint of maintaining the temperature uniformity of the substrate W, this gap is formed. The smaller is the more preferable.

The inner Peltier module 61 is electrically connected to the power supply controller 65 by wiring. The power supply controller 65 is electrically connected to the temperature sensor 62 embedded in the mounting plate 31. The temperature sensor 62 is disposed immediately above the Peltier module 61 of the mounting plate 31, that is, below the center of the substrate W.
The power supply control unit 65 adjusts the amount of power supply to the Peltier module 61 based on the temperature measurement result of the temperature sensor 62 so that the center of the mounting plate 31 has a predetermined target temperature.

On the other hand, the outer Peltier module 71 is electrically connected to the power supply controller 75 by wiring. The power supply controller 75 is electrically connected to the temperature sensor 72 embedded in the mounting plate 31. The temperature sensor 72 is disposed immediately above the Peltier module 71 of the mounting plate 31, that is, below the peripheral portion of the substrate W. The power supply control unit 75 adjusts the amount of power supplied to the Peltier module 71 based on the temperature measurement result of the temperature sensor 72 so that the peripheral portion of the mounting plate 31 has a predetermined target temperature.

As described above, in the second embodiment, the Peltier module is divided into two, and the two divided Peltier modules 61 and 71 are connected to different power supply controllers 65 and 75, respectively. The power supply control units 65 and 75 respectively include a temperature sensor 62 and a substrate W disposed below the center of the substrate W.
The power supply amount to the Peltier modules 61 and 71 is adjusted based on the temperature measurement result of the temperature sensor 72 disposed below the periphery of the Peltier module. Therefore, the amount of power supplied to the Peltier modules 61 and 71 is adjusted separately and independently.

In general, at the time of cooling processing in the cooling processing unit 20, the peripheral portion of the substrate W is cooled more quickly because the heat radiation efficiency is higher than that of the central portion. Therefore, if the amount of power supplied to the Peltier module 61 is made larger than the amount of power supplied to the Peltier module 71 to increase the cooling efficiency of the central portion of the substrate W, the overall cooling processing efficiency will be higher than in the first embodiment, Higher throughput can be obtained.

<3. Modifications> The embodiments of the present invention have been described above, but the present invention is not limited to the above examples. For example, in the second embodiment, the Peltier module is divided into two parts. However, this is not limited to two parts, and may be three or more parts. Each of the divided Peltier modules is connected to a different power supply control unit. When the number of divisions increases, finer control of the cooling process becomes possible, but costs such as equipment costs increase. Therefore, the number of divisions may be determined in consideration of the balance between them.

In each of the above embodiments, the space between the mounting plate 31 and the Peltier module 40 and the cooling plate 3
Although a silicone grease film formed of gel-like silicone grease was used as the heat conductive material film sandwiched between the Peltier module 4 and the Peltier module 40, a silicone gel sheet was used as the heat conductive material film instead. You may do it. The silicone gel sheet is a sheet-like member having elasticity and is elastically deformed by stress, but has a restoring property of returning to an original shape when the stress is removed. As the silicone gel sheet, for example, Sircon GR-n series (product name of Fuji Polymer Co., Ltd.) can be used.

Gel silicone grease expands by applying stress but does not have a restoring property of returning to its original shape. Therefore, when a silicone grease film is used as a heat conductive material film, a Peltier module is used. The silicone grease film between the mounting plate 31 and the Peltier module 40 (or between the cooling plate 34 and the Peltier module 40) is cracked due to thermal stress such as thermal expansion and contraction from the air 40, and air enters and heat conduction occurs. May be reduced. However, since the silicone gel sheet has an elastic force, even if it receives a thermal stress, it restores its original shape. Therefore, the joining state between the mounting plate 31 and the Peltier module 40 (or between the cooling plate 34 and the Peltier module 40) is stable, and there is no possibility that the thermal conductivity is reduced.

Moreover, the silicone gel sheet is electrically insulative and safe, and has a higher thermal conductivity than silicone grease. Specifically, the silicone grease has a thermal conductivity of 0.8 to 0.5. 9 W / m · K, and the thermal conductivity of the silicone gel sheet is 7.9 W / m · k. Therefore, the use of the silicone gel sheet as the heat conductive material film improves the heat transfer efficiency.

Further, in the Peltier module of each of the above embodiments, the Peltier elements 41 are arranged according to the checkerboard pattern so that the number of arrangement per unit area is equal, but the arrangement pattern is limited to this. Instead, another arrangement pattern such that the number of arrangements per unit area becomes uniform, for example, a honeycomb-shaped arrangement pattern may be adopted.

Further, the substrate processing apparatus incorporating the cooling processing apparatus according to the present invention is not limited to the one shown in FIG. 1, and a configuration different from that of FIG. 1 may be appropriately adopted according to the purpose and contents of the whole processing. it can.

[0060]

As described above, according to the first aspect of the present invention, the Peltier module has substantially the same planar shape as the mounting plate, and the Peltier element arrangement per unit area in the planar shape. Since the numbers are approximately equal, even if the thickness of the mounting plate is reduced, the temperature distribution can be made uniform. As a result, the temperature uniformity of the substrate during the cooling process can be maintained, and the high throughput can be achieved. Can be obtained.

According to the second aspect of the present invention, since the mounting plate is laminated with the Peltier module and the heat conductive material film interposed therebetween, rapid heat conduction from the mounting plate to the Peltier module is possible. As a result, the cooling processing efficiency is increased and higher throughput can be obtained.

According to the third aspect of the present invention, the end surface of the Peltier module in contact with the heat conductive material film is formed of a heat-resistant insulating film, and the Peltier element is mounted on the holding member disposed at a portion other than the end surface. As a result, the thickness of the heat-resistant insulating film can be significantly reduced, and the heat-resistant insulating film does not obstruct the heat conduction from the mounting plate to the Peltier module. Can be further increased to obtain higher throughput.

According to the fourth aspect of the present invention, since the heat conductive material film is a silicone gel sheet, it can withstand thermal stress from the Peltier module and can have high heat conduction efficiency. .

According to the fifth aspect of the present invention, the Peltier module is divided into a plurality of parts, and each of the divided Peltier modules is connected to a different power supply control unit. By performing individual control, the cooling processing efficiency as a whole can be increased, and higher throughput can be obtained.

According to the invention of claim 6, the Peltier module is divided into a circular area located below the center of the mounting plate and a ring area located below the peripheral edge of the mounting plate. Therefore, if the cooling processing efficiency in the circular region is increased, the central portion of the substrate having low heat radiation efficiency is also quickly cooled, and as a result, the cooling processing efficiency as a whole is increased, and higher throughput can be obtained. .

According to the seventh aspect of the present invention, the Peltier elements are arranged under the mounting plate at a uniform density over the entire surface of the mounting plate. Can be obtained.

According to an eighth aspect of the present invention, the substrate processing apparatus includes the cooling processing apparatus according to any one of the first to seventh aspects. The same effect as the invention described in (1) can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an example of an overall configuration of a substrate processing apparatus.

FIG. 2 is a diagram illustrating a configuration of a cooling processing unit of the substrate processing apparatus of FIG. 1;

FIG. 3 is a side sectional view showing a configuration of a cool plate of the cooling processing unit of FIG. 2;

FIG. 4 is a side view showing the configuration of the Peltier module of the embodiment.

FIG. 5 is a perspective view showing the internal structure of the Peltier module of FIG.

FIG. 6 is a plan view illustrating a main part of a cooling processing unit according to a second embodiment.

FIG. 7 is a side sectional view showing a configuration of a cool plate of the cooling processing unit of FIG. 6;

FIG. 8 is a plan view showing a main part of a conventional cooling processing device.

FIG. 9 is a side view showing a configuration of a conventional Peltier module incorporated in the cooling processing device of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 20 Cooling processing unit 30 Cool plate 31 Mounting plate 32, 33 Silicone grease film 34 Cooling plate 37, 65, 75 Power supply control unit 38, 62, 72 Temperature sensor 40, 61, 71 Peltier module 41 Peltier element 42 holding plate 45 polyimide film W substrate

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigeru Sasada 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto Inside Dainippon Screen Mfg. Co., Ltd. (72) Inventor Yasuo Hatanaka Kamigyo, Kyoto-shi 1-4-1 Tenjin Kita-machi, Horikawa-dori-Terunouchi-ku, Tokyo Dainippon Screen Mfg. Co., Ltd. (72) Inventor Hamasaki Dai 4-chome Tenjin, Kita-machi, 1-chome, Tenjin-Kitacho, Kamigyo-ku, Kyoto-shi Dainippon F-term in the screen manufacturing company (reference) 3L045 AA01 BA06 CA02 DA04 LA12 MA01 MA20 PA04 5F046 KA10

Claims (8)

[Claims] 1. A cooling processing apparatus for cooling a substrate, comprising: a mounting plate on which an upper surface of the substrate is mounted; and a planar shape substantially the same as the mounting plate, and disposed below the mounting plate. And a Peltier module, wherein the number of Peltier elements arranged per unit area in the planar shape is substantially equalized. 2. The cooling processing apparatus according to claim 1, wherein the mounting plate is stacked on the Peltier module with a thermally conductive material film interposed therebetween. 3. The cooling device according to claim 2, wherein the Peltier module has an end surface that is in contact with the thermally conductive material film formed of a heat-resistant insulating film and is disposed at a portion other than the end surface. A cooling processing device characterized by holding a Peltier element in the cooling device. 4. The cooling processing apparatus according to claim 2, wherein the heat conductive material film is a silicone gel sheet. 5. The cooling processing device according to claim 1, wherein the Peltier module is divided into a plurality of Peltier modules, and each of the divided Peltier modules is provided to a different power supply control unit. A cooling processing device being connected. 6. The cooling processing apparatus according to claim 5, wherein the placing plate is a circular flat plate, and wherein the Peltier module includes a circular region located below a center of the placing plate and the placing plate. And a ring region located below a peripheral portion of the cooling device. 7. A cooling apparatus for cooling a substrate, comprising: a mounting plate on which a substrate is mounted on an upper surface; and a uniform density over the entire surface of the mounting plate below the mounting plate. And a Peltier device. 8. A substrate processing apparatus for performing a predetermined process on a substrate, comprising the cooling processing apparatus according to claim 1. Description: