TW202117477A - Temperature control method and device for press-fit process of heat radiation fin providing a heater disposed at one side of a to-be-pressed-fit object - Google Patents

Abstract

This invention relates to a temperature control method and device for a press-fit process of a heat radiation fin. The temperature control method includes: providing a heater disposed at one side of a to-be-pressed-fit object; providing a first temperature sensor disposed at one side of the to-be-pressed-fit object; providing a second temperature sensor disposed at the other side of the to-be-pressed-fit object; providing a control unit electrically connected with the heater, the first temperature sensor and the second temperature sensor; and respectively sensing temperatures at two sides of the to-be-pressed-fit object by using the first temperature sensor and the second temperature sensor, and enabling the control unit to control the heating temperature of the heater according to the sensed temperature.

Description

Temperature control method and device for heat sink pressing process

The present invention relates to a temperature control method and device, in particular to a temperature control method and device of a heat sink pressing process for controlling the pressing temperature in the heat sink pressing process.

According to the general semiconductor packaging process, for semiconductors that need to be packaged with a heat sink, adhesive materials and thermally conductive materials are usually applied to the upper side of a substrate of a chip and the upper side of the chip, and then a heat sink is applied. Place it on the adhesive material and the heat-conducting material, and then perform a pressing process of pressure and heating to make the heat sink fixed on the substrate due to the curing of the adhesive material.

In the pressing process, the heat sink, the chip and the substrate to be pressed are placed in a matrix arrangement on a plurality of matrix-arranged hollow sections of a carrier plate, and the carrier plate can pass through the flow path. It is conveyed to between the upper and lower molds located on one of the upper and lower sides of the runner, and the upper mold and the lower mold clamp the compound to be pressed on the carrier plate for a preset time; During the clamping process, the heater in the lower mold will output heat energy so that the material to be pressed can be heated during the clamping process to facilitate the curing of the adhesive material; in order to monitor the heating temperature during the clamping process, The lower mold is equipped with a temperature sensor that can sense the temperature of the lower mold. The temperature information of the temperature sensor can be transmitted to the control unit, which can automatically or by the temperature measured by the temperature sensor. The operator manually controls the heat output of each heater.

However, the conventional heat sink pressing process is in actual use, because the lower mold transfers heat energy from the bottom to the material to be pressed, the temperature inside the material to be pressed rises slowly, and the control unit can only know the current pressing The temperature of the mold does not know the current temperature of the compound to be pressed; assuming that the viscous material in the compound to be pressed can be cured, the process conditions are to be pressed at a temperature of 145 to 147 degrees for 100 seconds, the operator or the control unit It is necessary to control the heat output of the heater to make the lower die reach a temperature of about 146 degrees, but in fact, it will be consumed during the heat transfer, so the actual temperature of the pressed compound may only be 136 degrees, and the temperature is too low and the process conditions are not reached. Need, leading to the production of defective products; if considering the problem of heat energy consumption, first increase the heat output of the heater to make the lower die reach a temperature of about 156 degrees, but the temperature of the lower die is actually not the same as the temperature of the product to be pressed The temperature has a fixed relationship between growth and decline, so the actual temperature of the material to be pressed may be 150 degrees. Too high temperature will cause damage to the material to be pressed, and also lead to the production of defective products.

The object of the present invention is to provide a temperature control method for the heat sink pressing process that can control the temperature of the material to be pressed during the heat sink pressing process.

Another object of the present invention is to provide a temperature control device for the heat sink pressing process that can control the temperature of the material to be pressed during the heat sink pressing process.

Another object of the present invention is to provide a device for performing the temperature control method as described above.

The temperature control method of the heat sink pressing process according to the object of the present invention includes: providing a heater arranged on one side of a material to be pressed; providing a first temperature sensor arranged on one of the material to be pressed Side; provide a second temperature sensor, located on the other side of the compound to be pressed; provide a control unit, electrically connect the heater, the first temperature sensor and the second temperature sensor; The first temperature sensor and the second temperature sensor respectively sense the temperature on both sides of the to-be-compressed compound, and enable the control unit to control the heating temperature of the heater according to the sensed temperature.

According to another object of the present invention, a temperature control device for a heat sink pressing process includes: a first pressing mold provided with a support, a heater and a first temperature sensor; a second pressing mold provided with a pressing Body and a second temperature sensor; a control unit electrically connected to the heater, the first temperature sensor and the second temperature sensor; the first pressing mold and the second pressing mold are set in a waiting On both sides of the pressing compound, the support body and the pressing body are used to clamp the pressing compound; the first temperature sensor and the second temperature sensor can respectively sense the temperature on both sides of the pressing compound , And use the control unit to control the heating temperature of the heater.

According to another object of the present invention, a temperature control device for a heat sink pressing process includes: a device for performing the temperature control method of the heat sink pressing process.

In the temperature control method and device of the heat sink pressing process of the embodiment of the present invention, the second temperature sensor can sense on one side of the material to be pressed, the heater on the other side of the material to be pressed is transmitted to the material to be pressed The temperature of the pressed compound allows the control unit to evaluate the temperature on both sides of the pressed compound to determine the internal temperature of the pressed compound, so as to control the temperature of the heater to meet the requirements of the pressing process conditions.

Please refer to FIGS. 1 and 2. The temperature control method and device for the heat sink pressing process of the embodiment of the present invention can be explained by using the compound W shown in the figure as an example. The compound W is composed of a substrate W1. , A chip W2 and a heat sink W3, the chip W2 is set between the substrate W1 and the heat sink W3, the four corners of the substrate W1 are respectively coated with a ∟-shaped frame-shaped adhesive W4 toward the center , In order for the lower-level frame edge W31 of the peripheral edge of the heat sink W3 to be pasted and bonded, and the upper surface of the chip W2 needs to be coated with a cross-shaped thermally conductive glue W5 (or a thermally conductive film) for the heat sink One of the central raised surfaces of W3, W32, is pasted on the inner edge.

Referring to FIG. 3, in the heat sink pressing process, the compound to be pressed W can be placed in a matrix arrangement corresponding to the hollow section T1 of a plurality of matrix arrangements of a carrier T for operation, and the compound to be pressed W supported by the periphery of the hollow section T1 can be kept on the carrier plate T so as not to fall, and the horizontal displacement is restricted by a plurality of limit pins T2 on the periphery of the hollow section T1.

Please refer to Figures 4 and 5, the temperature control method of the heat sink pressing process of the embodiment of the present invention can be illustrated as an example of the device shown in the figure, which is provided with: A frame A includes a base A1 and a top base A2, between which is supported by a plurality of pivot rods A3, and a pivot base A4 is provided between the base A1 and the top base A2, which can be supported by the top base A2. For example, the first driver A5 formed by the air pressure cylinder is driven to perform a large stroke up and down displacement between the pivot rods A3; an operation section A6 is formed between the pivot base A4 and the upper part of the base A1; A supporting mechanism B is arranged in the operating area A6 of the seat frame A, and the supporting mechanism B is arranged below the base A1; the supporting mechanism B is provided with a first die B1, which is convexly provided with a plurality of matrix arrangements The support body B11 is on a first die seat B12; A pressing mechanism C is arranged in the operating section A6 of the seat frame A. The pressing mechanism C is arranged above the pivot base A4 and can move up and down in linkage with it; the pressing mechanism C is provided with a A second press mold C1 and a pressurizing power source C2. A plurality of press bodies C11 arranged in a matrix are protrudingly provided on the second press mold C1 under a second press mold base C12. The pressurizing power source C2 is provided with A plurality of matrix arrangements correspond to the second driver C21 formed by the pressing body C11, such as a pneumatic cylinder, which can individually drive the corresponding pressing body C11 to move up and down in a small stroke relative to the second pressing mold base C12; A control unit D is arranged above the top base A2, and can be used to perform data calculations and control various functions on the device.

Please refer to Figures 5 and 6, each support B11 is provided with a first heat transfer surface B111 and a support surface B112, the first heat transfer surface B111 is provided with a heater B13, the first heat transfer surface B111 and the support A first temperature sensor B14 is arranged between the surfaces B112, and the first temperature sensor B14 is arranged on the upper side of the heater B13, and can sense that the support B11 approaches the composition to be pressed after the heater B13 outputs heat energy. Side temperature; each pressure body C11 is provided with a second heat transfer surface C111 and a pressure surface C112, the second heat transfer surface C111 is provided with a second temperature sensor C13, which can sense the heater B13 passing through the The temperature of the support body B11 and the composite W to be pressed; each support body B11 and each heater B13 on each pressing body C11, each first temperature sensor B14 and each second temperature sensor C13 are electrically connected to the The control unit D can control the heating temperature of each heater B13 according to the sensed temperature.

Please refer to Figures 5, 6, and 7, during the heat sink pressing process, the carrier plate T carrying the to-be-pressed compound W can be horizontally conveyed to the first pressing mold B1 and the first pressing mold B1 through a conveying mechanism (not shown) Between the second pressing mold C1, and placing the tray T on the first pressing mold B1; when the tray T is placed on the first pressing mold B1, the support body B11 passes through the In the hollow section T11 of the tray T, the support surface B112 supports the substrate W1 of the composition W to be pressed, so that the composition W to be pressed is separated from the tray T; Then the second pressing mold C1 is driven to move downward with a large stroke, so that the pressing body C11 on the second pressing mold C1 is close to but not touching the to-be-pressed compound W, and then the second pressing power source C2 The second driver C21 then drives the pressing body C11 to move downward with a small stroke relative to the second pressing mold base C12, so that the pressing surface C112 of the pressing body C11 touches the compound W to be pressed, and the pressing body C11 is pressed from the upper side. The heat sink W3 of the compound W exerts pressure; When the first press mold B1 and the second press mold C1 clamp the product W, the heat energy output by the heater B13 can be first transferred to the support B11, and then to the product W, The adhesive W4 in the composition W to be pressed can be cured by heat.

In the implementation of the temperature control method of the heat sink pressing process of the embodiment of the present invention, when the first pressing mold B1 and the second pressing mold C1 clamp the to-be-pressed compound W, the first temperature sensor B14 and the The second temperature sensor C13 respectively senses the temperature of the upper and lower sides of the composition W to be pressed, and the control unit D records the temperature change per unit time. The first temperature sensor B14 senses that the heater B13 intends to The compound W to be pressed is heated to a first temperature, and the second temperature sensor C13 senses a second temperature after the first temperature is transmitted through the support B11 and the compound W to be pressed. The composition W is located between the first temperature sensor B14 and the second temperature sensor C13, so at the same time point, the third temperature of the composition W to be pressed will not be higher than the first temperature at the highest and the lowest Will be lower than the second temperature, so that the control unit D can use a first temperature change curve TC1 corresponding to the first temperature and a second temperature change curve TC2 corresponding to the second temperature as shown in FIG. The third temperature variation curve TC3 of the third temperature variation curve TC3 that one of the to-be-compressed compound W may correspond to the simulation operation is calculated (the simulation operation method of the third temperature variation curve TC3 can be the first temperature and the second temperature at the same time point The intermediate value is connected together), and the control unit D can control the heating temperature of the heater B13 according to the temperature change sensed.

In order to more clearly know the relationship between the third temperature and the first temperature and the second temperature, as shown in Figures 9 and 10, a third temperature sensor W6 can be embedded in the composite W to be pressed. The heat sink W3 and the chip W2 are electrically connected to the control unit D, and can directly sense the third temperature transferred from the first temperature to the to-be-compressed compound W to obtain an actual corresponding third temperature. The third temperature change curve TC3' of the temperature is provided to the control unit D as a reference when the third temperature change curve TC3 is simulated; wherein, the third temperature sensor W6 is mainly used for adjustment and calibration.

According to the temperature control method and device of the heat sink pressing process of the embodiment of the present invention, the second temperature sensor C13 can sense the heater B13 on one side of the material to be pressed W on the other side of the material to be pressed W The temperature transmitted to the material to be pressed W, so that the control unit D can evaluate the temperature on both sides of the material to be pressed W to determine the temperature inside the material to be pressed W, so as to control the heating temperature of the heater B13 so that the The temperature of the compound W to be pressed meets the requirements of the pressing process conditions.

However, the above are only the preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent.

A: Seat frame A1: Base A2: Top seat A3: Pivot A4: Pivot A5: First drive A6: Operating range B: Supporting mechanism B1: The first die B11: Support B111: The first heat transfer surface B112: Support surface B12: The first die seat B13: heater B14: The first temperature sensor C: Pressure mechanism C1: The second die C11: pressure body C111: second heat transfer surface C112: Pressed surface C12: The second die seat C13: Second temperature sensor C2: Pressurized power source C21: second drive D: Control unit T: Disk T1: hollow interval T2: Limit pin TC1: The first temperature change curve TC2: Second temperature change curve TC3: The third temperature change curve TC3': The third temperature change curve W: To be pressed W1: substrate W2: chip W3: heat sink W31: Frame edge W32: Central bulging surface W4: viscose W5: Thermal conductive glue W6: The third temperature sensor

Fig. 1 is a three-dimensional schematic diagram of the composition to be pressed in an embodiment of the present invention. Fig. 2 is a three-dimensional exploded schematic diagram of the substrate, the chip and the heat sink in the embodiment of the present invention. Fig. 3 is a three-dimensional schematic diagram of the compound to be pressed placed on the tray in the embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of a device for performing heat sink pressing in an embodiment of the present invention. Fig. 5 is a schematic side view of a device for performing heat sink pressing in an embodiment of the present invention. FIG. 6 is a schematic diagram of placing the tray on the first pressing mold in the embodiment of the present invention. FIG. 7 is a schematic diagram of the compound to be pressed between the first pressing mold and the second pressing mold in an embodiment of the present invention. FIG. 8 is a schematic diagram of temperature changes sensed by the first temperature sensor and the second temperature sensor in the embodiment of the present invention. Fig. 9 is a schematic diagram of a third temperature sensor set in the composition to be pressed in an embodiment of the present invention. 10 is a schematic diagram of temperature changes sensed by the first temperature sensor, the second temperature sensor, and the third temperature sensor in the embodiment of the present invention.

B11: Support

B111: The first heat transfer surface

B112: Support surface

B12: The first die seat

B13: heater

B14: The first temperature sensor

C11: pressure body

C111: second heat transfer surface

C112: Pressed surface

C13: Second temperature sensor

T: Disk

T1: hollow interval

W: To be pressed

W1: substrate

Claims (13)

A temperature control method of heat sink pressing process, including: Provide a heater on one side of a compound to be pressed; Provide a first temperature sensor, which is arranged on one side of the compound to be pressed; Provide a second temperature sensor, which is arranged on the other side of the compound to be pressed; Providing a control unit electrically connected to the heater, the first temperature sensor and the second temperature sensor; The first temperature sensor and the second temperature sensor are used to sense the temperature on both sides of the compound to be pressed, and the control unit controls the heating temperature of the heater according to the sensed temperature. For the temperature control method of the heat sink pressing process described in claim 1, wherein, the first temperature sensor senses a first temperature that the heater intends to heat the material to be pressed, and the second sensor The thermostat senses a second temperature after the first temperature has passed through the to-be-compressed compound. For the temperature control method of the heat sink pressing process described in item 2 of the scope of patent application, wherein the heater and the first temperature sensor are arranged in a first mold, and the second temperature sensor is arranged in a second mold. A pressing mold, the first pressing mold and the second pressing mold are separately provided with a lower side and an upper side of the to-be-pressed compound. As described in item 3 of the scope of patent application, the temperature control method of the heat sink pressing process, wherein, when the first pressing mold and the second pressing mold clamp the to-be-pressed compound, the first temperature sensor and the The second temperature sensor respectively senses the temperature on both sides of the compound to be pressed. As described in item 4 of the scope of patent application, the temperature control method of the heat sink pressing process, wherein the material to be pressed is supported by the first pressing mold, and the second pressing mold is placed on the first pressing mold from top to bottom. Apply pressure to the compound to be pressed. For example, the temperature control method of the heat sink pressing process described in the scope of the patent application, wherein a third temperature sensor is provided in the compound to be pressed and is electrically connected to the control unit, which can sense the transmission of the first temperature To a third temperature in the compound to be pressed. For example, the temperature control method of the heat sink pressing process described in the scope of patent application, wherein the compound to be pressed is composed of a heat sink, a chip and a substrate, and the chip is arranged between the heat sink and the substrate In between, the third temperature sensor is arranged between the heat sink and the chip. A temperature control device for heat sink pressing process, including: A first pressing mold provided with a support, a heater and a first temperature sensor; A second pressure mold, provided with a pressure body and a second temperature sensor; A control unit electrically connected to the heater, the first temperature sensor and the second temperature sensor; The first pressing mold and the second pressing mold are arranged on both sides of a product to be pressed, and the support body and the pressing body are used to clamp the product to be pressed respectively; The first temperature sensor and the second temperature sensor can respectively sense the temperature on both sides of the compound to be pressed, and the control unit controls the heating temperature of the heater. For example, the temperature control device for the heat sink pressing process described in item 8 of the scope of patent application, wherein the support body is provided with a first heat transfer surface and a support surface, the first heat transfer surface is provided with a heater, and the first heat transfer surface is provided with a heater, and the first heat transfer surface is provided with a heater. The first temperature sensor is arranged between a heat transfer surface and the supporting surface; the pressure body is provided with a second heat transfer surface and a pressing surface, and the second heat transfer surface is provided with the second temperature sensor. For example, the temperature control device for the heat sink pressing process described in item 8 of the scope of patent application, wherein the to-be-compressed compound is composed of a heat sink, a chip and a substrate; the support body supports the to-be-compressed on one side For the substrate of the object, the pressure body applies pressure from the other side to the heat sink to be laminated. For example, the temperature control device of the heat sink pressing process described in item 8 of the scope of patent application, wherein the compound to be pressed is correspondingly placed in a matrix arrangement on the hollow space of a plurality of matrix arrangements of a carrier plate. For example, the temperature control device for the heat sink pressing process described in claim 11, wherein the carrier plate is transported between the first die and the second die via a transport mechanism. A temperature control device for the heat sink pressing process includes: a device for performing the temperature control method for the heat sink pressing process as described in any one of items 1 to 7 of the scope of patent application.

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