TW202019656A - Resin molding device and method of manufacturing resin molded product - Google Patents

Abstract

This invention provides a resin molding device (100) which improves the quality of resin molded product and applies granular resin (J) to perform resin molding. The resin molding device (100) includes a resin capturing part (23) for shooting the scatter condition of the granular resin (J) and a controlling part (26) for performing feedback control on resin molding conditions based on the resin image data obtained by the resin capturing part (23).

Description

Resin molding device and method for manufacturing resin molded product

The invention relates to a resin molding device and a method of manufacturing a resin molded product.

As a resin molding apparatus that performs resin molding using a resin material, an apparatus shown in Patent Document 1 is conceivable.

The resin molding apparatus of Patent Document 1 supplies liquid resin from a nozzle of a dispenser to a product to be molded, and performs resin sealing of a semiconductor wafer of the product to be molded. In order to reduce the unevenness of the molded product, the resin molding apparatus measures the presence or absence of the semiconductor wafer mounted on the molded product, the thickness of the semiconductor wafer, and the thickness of the resin molded product, and adjusts the amount of resin supplied to the molded product. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2006-315184

[Problems to be solved by the invention] However, since the liquid resin used for the resin sealing of the semiconductor wafer has a high viscosity, even if it is supplied from the nozzle of the dispenser to the planar molding range, it is difficult to supply it uniformly within the range. This may cause uneven thickness in one molded product.

Therefore, the present invention is made to solve the above-mentioned problems, and its main subject is to reduce the thickness unevenness of the resin molded product. [Technical means to solve the problem]

That is, the resin molding apparatus of the present invention is a resin molding apparatus that performs resin molding using granular resin, and includes: a resin imaging unit that photographs the state in which the granular resin is dispersed; and a control unit based on imaging by the resin Feedback control of the resin molding conditions by the resin image data obtained by the department. [Effect of invention]

According to the present invention configured as described above, the quality of the resin molded product can be improved.

Next, the present invention will be described in further detail with examples. However, the present invention is not limited by the following description.

As described above, the resin molding apparatus of the present invention is a resin molding apparatus that performs resin molding using granular resin, and includes: a resin imaging unit that photographs the state in which the granular resin is dispersed; and a control unit based on The resin image data obtained by the resin imaging unit is used for feedback control of the resin molding conditions.

In the case of resin molding using a granular resin, unevenness of the granular resin in a dispersed state may adversely affect the quality of the molded product such as the thickness. According to the resin molding apparatus of the present invention, the resin molding conditions are feedback-controlled based on the resin image data obtained by photographing the state in which the granular resin is dispersed, so that the quality of the molded product, such as the thickness, can be improved. In addition, since the liquid resin is not used as before, it is not necessary to consider its viscosity, and by using the granular resin, it is easy to arrange uniformly within the molding range.

Here, the resin molding conditions include, for example, at least one of the following items (1) to (7). In addition, the resin molding conditions may include other conditions if they affect the quality of the resin molded product. (1) Amount of resin: the amount of granular resin required for the resin molded product (2) Resin dispersion operation: specifically, the amount per unit time supplied from the resin material input mechanism and/or the moving speed of the mobile station (3) Mold clamping position: Mold clamping position (4) The temperature of the forming mold: the temperature required when the granular resin is softened or melted and shaped (5) Molding time: the time required for the hardening and molding of the granular resin in the molding die (6) Vacuum: the degree of vacuum after exhausting the enclosed space during resin molding (7) Clamping pressure value: when closing the forming mold, use strain gauge to measure the value of the strain variable

In order to judge whether the quality of the resin molded product is good by measuring the state of the resin molded product and to improve the quality of the resin molded product, it is desirable that the resin molding apparatus has a molded product measuring unit that measures the state of the resin molded product, and the control unit is based on The resin image data and the molded product measurement data obtained by the molded product measurement unit feedback control the resin molding conditions.

As a specific example of the molded article measuring section, it is desirable that the molded article measuring section measures the thickness of a plurality of parts of the resin molded article. By measuring the thickness of a plurality of parts of the resin molded product, the quality of the resin molded product such as the thickness can be further improved. In addition, in order to improve the quality of the appearance and the like of the resin molded product, it is desirable that the molded product measurement unit photograph the resin molded product.

As a control sequence using molded product measurement data and resin image data, it is desirable that the control unit performs defect inspection of the resin molded product based on the molded product measurement data, and If it is determined to be defective, a determination regarding the uniformity of the particulate resin is performed based on the resin image data, and when it is determined that the particulate resin is not uniform, the Spread the conditions for feedback control.

Not only is the dispersed state of the granular resin, but if other information can be used to feedback control the resin molding conditions, the quality of the resin molded product will be further improved. Therefore, it is desirable that the resin molding apparatus has an object measurement unit that measures the state of the molding object, and the control unit controls the resin based on the resin image data and the object measurement data obtained by the object measurement unit Feedback control of forming conditions. In this way, by measuring the state of the object to be molded, it is possible to feedback-control the dispersion conditions such as the resin amount of the granular resin and the dispersion method.

In addition, it is desirable that the resin molding apparatus has a temperature measurement section that measures the temperature of the molding die, and the control section feeds back the resin molding conditions based on the resin image data and the temperature measurement data obtained by the temperature measurement section control. In this way, by measuring the temperature of the molding die, the resin molding conditions such as correction of the set temperature of the molding die can be feedback-controlled.

Further, it is desirable that the resin molding apparatus has a position measuring unit that measures the mold clamping position of the mold clamping mechanism that molds the mold, and the control unit measures the position based on the resin image data The position measurement data obtained by the Department is used for feedback control of the resin molding conditions. In this way, by measuring the mold clamping position, the resin molding conditions such as the correction of the mold clamping position can be feedback-controlled.

In particular, in order to further improve the quality of the thickness of the resin molded product, it is desirable that the control unit performs feedback control on the resin molding conditions to change at least the dispersion state of the granular resin.

In addition, a method of manufacturing a resin molded product using the resin molding device is also an embodiment of the present invention.

<An embodiment of the present invention> Hereinafter, an embodiment of the resin molding apparatus of the present invention will be described with reference to the drawings. In addition, with respect to any of the drawings shown below, for ease of understanding, schematic drawings are appropriately omitted or exaggerated. With regard to the same constituent elements, the same reference numerals are attached and the description is omitted as appropriate.

<Overall configuration of resin molding apparatus 100> The resin molding apparatus 100 of the present embodiment is an apparatus that manufactures a resin molded product P by resin sealing the electronic component Wx mounted on the substrate W that is the object of molding with the resin material J. In addition, examples of the substrate include a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, and a lead frame. In addition, the resin material J is, for example, a granular resin.

As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply and storage module A, two resin molding modules B, and a resin material supply module C as constituent elements, respectively. Each constituent element (each module A to module C) is detachable and replaceable with respect to each constituent element.

The substrate supply and storage module A includes: a substrate supply portion 11 that supplies a pre-sealed substrate W; a substrate storage portion 12 that houses a sealed substrate W (resin molded product P); and a substrate placement that delivers the pre-sealed substrate W and the resin molded product P Section 13; and a substrate transport mechanism 14 that transports the pre-sealed substrate W and the resin molded product P. The substrate mounting portion 13 moves in the Y direction between the position corresponding to the substrate supply portion 11 and the position corresponding to the substrate storage portion 12 in the substrate supply and storage module A. The substrate conveyance mechanism 14 moves in the X direction and the Y direction within the substrate supply and storage module A and each resin molding module B.

The substrate supply and storage module A is provided with an object measuring section 20 that measures the state of the substrate W before sealing. The object measuring section 20 optically measures the pre-sealing substrate W, for example, a laser displacement meter can be used. The object measuring section 20 can measure the number of electronic parts (number of wafers) mounted on the pre-sealing substrate W (number of wafers), the number of stacks of electronic parts Wx (number of stages), and the mapping information of the electronic parts Wx (configuration information of the presence or absence of chips) .

Further, the substrate supply and storage module A is provided with a molded product measuring section 21 that measures the state of the resin molded product P. The molded article measuring section 21 optically measures the resin molded article P, and has: a thickness measuring section 21a that measures the thickness of a plurality of parts of the resin sealing surface of the resin molded article P; and a molded article imaging section 21b, which is applied to the resin molded article The resin sealing surface of P was taken. As the thickness measuring section 21a, a laser displacement meter can be used. The thickness data obtained by the thickness measurement unit 21a and the molded product image data obtained by the molded product imaging unit 21b are sent to the control unit 26 described later.

Each resin molding module B includes: a lower mold 2 that is a first molding mold in which a cavity 2C is formed; an upper mold 3 that is a second molding mold that holds a substrate W; and a mold clamping mechanism that molds the lower mold 2 and the upper mold 3 4. The specific configuration will be described later.

The resin material supply module C includes: a mobile table 15; a resin material accommodating portion 16 placed on the mobile table 15; a resin material input mechanism 17 that measures and feeds the resin material J to the resin material accommodating portion 16; The unit 16 supplies the resin material supply mechanism 18 of the resin material J to the cavity 2C of the lower mold. The moving table 15 moves in the X direction and the Y direction within the resin material supply module C. The resin material supply mechanism 18 moves in the X direction and the Y direction within the resin material supply module C and each resin molding module B.

The resin material input mechanism 17 is provided with a measurement unit 22 that measures the resin material J, and the resin measurement data obtained by the measurement unit 22 is sent to a control unit 26 described later.

In addition, the resin material supply module C is provided with a resin imaging unit 23 that images the state in which the resin material J of the resin material accommodating unit 16 is scattered. The resin image data obtained by the resin imaging unit 23 is sent to the control unit 26 described later.

<Specific structure of resin molding module B> Next, the specific configuration of the resin molded module B of the present embodiment will be described below.

As described above, as shown in FIG. 2, the resin molding module B includes: the lower mold 2 in which the cavity 2C is formed; the upper mold 3 holding the substrate W; and the lower mold 2 and the upper mold 3 are installed and the lower mold 2 and the upper The mold clamping mechanism 4 of the mold 3 is closed.

The mold clamping mechanism 4 includes a movable plate 41 on which the lower mold 2 is mounted, an upper fixed plate 42 on which the upper mold 3 is mounted, and a drive mechanism 43 for moving the movable plate 41 up and down.

The movable plate 41 is a member to which the lower mold 2 is mounted on the upper surface thereof, and is supported by a plurality of pillar portions 45 standing on the lower fixed plate 44 to be movable up and down.

The upper fixed plate 42 is a member to which the upper mold 3 is attached to the lower surface thereof, and is fixed to the upper end portions of the pair of left and right pillar portions 45 so as to face the movable plate 41.

The drive mechanism 43 is provided between the movable plate 41 and the lower fixed plate 44, and moves the movable plate 41 up and down to close the lower mold 2 and the upper mold 3 and apply a predetermined molding pressure. The drive mechanism 43 of the present embodiment is a linear motion mechanism that transfers the rotation to the movable plate 41 using a ball screw mechanism 431 that converts the rotation of a servo motor (servo motor) or the like into linear movement, but it may also use, for example, A link mechanism such as a toggle link transmits a power source such as a servo motor to the link mechanism of the movable plate 41.

Furthermore, in the present embodiment, the lower fixed disk 44, the pillar portion 45, and the upper fixed disk 42 constitute a fixed frame that houses the movable disk 41 and the drive mechanism 43.

In addition, between the lower mold 2 and the movable plate 41, a lower mold holding portion 46 is provided. The lower mold holding portion 46 includes a heating plate 461 that heats the lower mold 2, a heat insulating member 462 provided on the lower surface of the heating plate 461, and an upper surface of the heating plate 461 to surround the lower mold 2 Side wall member 463, and a sealing member 464 provided on the upper end of the side wall member 463.

Between the upper mold 3 and the upper fixed plate 42, an upper mold holding portion 47 is provided. The upper mold holding portion 47 includes a heating plate 471 that heats the upper mold 3, a heat insulating member 472 provided on the upper surface of the heating plate 471, and a lower surface of the heating plate 471 to surround the upper mold 3 Side wall member 473, and a sealing member 474 provided at the lower end of the side wall member 473. When the driving mechanism 43 is used for mold clamping, the sealing member 464 of the side wall member 463 and the sealing member 474 of the side wall member 473 are in close contact with each other, and the space in which the lower mold 2 and the upper mold 3 are housed is isolated from outside air. In addition, it may be configured such that one of the sealing member 464 and the sealing member 474 is not provided.

The upper mold 3 is a member that sucks and holds the back surface of the substrate W. An suction hole (not shown) is formed on the lower surface of the upper mold 3, and a suction flow path (not shown) is formed inside the upper mold 3. The internal flow path is connected to an external suction device (not shown).

As shown in FIGS. 2 and 3, a cavity 2C is formed in the lower mold 2, and the cavity 2C houses the electronic component Wx and the resin material J mounted on the substrate W. Specifically, the lower mold 2 has a bottom member 201 that is a single member that forms the bottom surface of the cavity 2C, and a side member 202 that surrounds the bottom member 201. The cavity 2C is formed by the upper surface of the bottom member 201 and the inner peripheral surface of the side member 202. The bottom surface member 201 of this embodiment is a flat plate having a rectangular shape in plan view, and the side surface member 202 has a rectangular frame shape in plan view. The side member 202 is provided so as to be relatively movable up and down relative to the bottom member 201. Specifically, the base plate 203 with respect to the lower mold 2 is supported by a plurality of elastic members 204 such as coil springs (see FIG. 2 ). In addition, in order to improve the mold releasability of the resin molded product P, the lower mold 2 of this embodiment is covered with a mold release film 28.

In addition, the resin molding module B is provided with a temperature measuring part 24 that measures the temperature of the molding die (lower die 2 or upper die 3). The temperature measuring section 24 may directly measure the temperature of the forming mold, or may measure the temperature of the mold holding section (such as a hot plate, etc.) that holds the forming mold. The temperature data of the forming mold obtained by the temperature measuring unit 24 is sent to the control unit 26 described later.

Furthermore, the resin molding module B is provided with a position measuring section 25 that measures the mold clamping position of the mold clamping mechanism 4 that molds the lower mold 2 or the upper mold 3. The position measuring unit 25 of the present embodiment calculates the encoder value of the servo motor that is the driving source for raising and lowering the movable disk 41 to indirectly detect the mold clamping position. The mold clamping position data obtained by the position measuring section 25 is sent to the control section 26 described later. In addition, the position measuring unit 25 can be variously modified according to the form of the drive mechanism 43.

<Operation of Resin Molding Device 100> The operation of resin molding (resin sealing) of the resin molding apparatus 100 will be described with reference to FIGS. 1 to 4. The operations shown below are performed by the control unit 26 controlling each part of the resin molding apparatus 100. In addition, the control unit 26 is a dedicated or general-purpose computer having a central processing unit (Central Processing Unit, CPU), internal memory, input/output interface, analog-to-digital (AD) converter, and the like.

In the substrate supply and storage module A, the substrate before sealing W is sent from the substrate supply portion 11 to the substrate mounting portion 13. Next, the substrate conveyance mechanism 14 located at a predetermined standby position is moved to receive the pre-sealing substrate W from the substrate mounting portion 13 (see FIG. 1 ). Then, the substrate conveyance mechanism 14 is moved to the resin molding module B, and the pre-sealing substrate W is held by the upper mold 3 that has been opened (see FIG. 2 ). Then, the substrate transport mechanism 14 is returned to the predetermined standby position.

In the carrying-in step of the pre-sealing substrate W, the object measuring unit 20 measures the number of electronic parts of the pre-sealing substrate W, the number of stacks of the electronic parts Wx, and the mapping information.

On the other hand, in the resin material supply module C, the release film 28 is formed into a predetermined shape, the mobile station 15 located at a predetermined standby position is moved, and the release film 28 and the release film 28 are sequentially placed on the mobile station 15 The frame member (not shown) is formed as the resin material accommodating portion 16. Then, the resin material accommodating part 16 is moved to the resin material input mechanism 17 (refer FIG. 1). Next, a predetermined amount of resin material J is introduced from the resin material input mechanism 17 into the inside of the frame member of the resin material accommodating portion 16. Then, the mobile station 15 is returned to a predetermined standby position.

In the resin feeding step, the measuring section 22 measures the resin material J, and the resin imaging section 23 photographs the resin material J which is put into the resin material accommodating section 16 and is in a scattered state.

Next, the resin material supply mechanism 18 located at a predetermined standby position is moved, and the resin material accommodating portion 16 accommodating the resin material J is received from the mobile station 15. Then, the resin material supply mechanism 18 is moved to the resin molding module B, and the mold release film 28 of the resin material accommodating portion 16 and the resin material J accommodated in the resin material accommodating portion 16 are supplied to the mold of the lower mold 2 that has been opened. Chamber 2C (see Figure 2). Then, the resin material supply mechanism 18 is returned to a predetermined standby position. In addition, the release film 28 may be in close contact before the resin material J is supplied to the cavity 2C.

Here, the lower mold 2 is previously heated to a predetermined temperature by the heating plate 461, and the resin material J is softened or melted.

After the above steps, in the resin molding module B, the movable plate 41 is raised by the driving mechanism 43, and the sealing member 474 of the upper mold holding portion 47 and the sealing member 464 of the lower mold holding portion 46 are in close contact to form a sealed space (See Figure 3). In this state, the closed space is set to a vacuum state by an exhaust mechanism (not shown).

Then, the movable mechanism 41 is further raised by the drive mechanism 43, the side member 202 is pressed by the upper mold 3, the elastic member 204 is compressed and deformed, the electronic component Wx of the substrate W is impregnated in the resin material J, and the component mounting surface of the substrate W is coated with resin Material J coating. In this state, the lower mold 2 and the upper mold 3 are clamped by a predetermined mold clamping pressure (see FIG. 3 ). After a predetermined time has passed, the lower mold 2 is lowered by the mold clamping mechanism 4, and the lower mold 2 and the upper mold 3 are opened (see FIG. 4). In addition, the closed space can be returned to atmospheric pressure during the mold clamping process.

In the mold clamping step, the temperature measuring section 24 measures the temperature of the forming mold, and the position measuring section 25 measures the mold clamping position.

Next, the substrate conveyance mechanism 14 of the substrate supply and storage module A is moved, and the resin molded product P is received from the mold-opening upper mold 3. The substrate conveyance mechanism 14 is moved to the substrate mounting portion 13, and the resin molded product P is transferred to the substrate mounting portion 13 (see FIG. 1 ). The sealed substrate W is stored in the substrate storage portion 12 from the substrate mounting portion 13. In this way, resin sealing is completed.

In the step of carrying out the resin molded product P, the thickness of the resin sealing surface of the resin molded product P is measured by the thickness measuring unit 21a, and the resin sealing surface of the resin molded product P is measured by the molded product imaging unit 21b. Shooting.

Then, the control unit 26 collects information from each part of the resin molding apparatus 100 in the above steps, and performs feedback control on the resin molding conditions based on the information.

Specifically, as shown in FIG. 5, the control unit 26 collects the following information (1) to (8) for each resin molding: (1) Electronic part number data and stacking number data obtained by the object measurement unit 20. (2) Map data of the electronic component Wx obtained by the object measurement unit 20. (3) The resin measurement data obtained by the measurement unit 22. (4) Resin image data obtained by the resin imaging unit 23. (5) Temperature data of the forming mold obtained by the temperature measuring unit 24. (6) Mold clamping position data obtained by the position measuring section 25. (7) Thickness data obtained by the thickness measuring section 21a. (8) Molded article image data obtained by the molded article imaging unit 21b.

<Defective detection of resin molded product P> Then, the control unit 26 detects the thickness defect of the resin molded product P based on the thickness data of the resin molded product P. At this time, the control unit 26 compares the preset thickness reference value with the thickness data, for example, to detect the thickness defect of the resin molded product P.

In addition, the control unit 26 detects a defective appearance of the resin molded product P based on the molded product image data of the resin molded product P (for example, unfilled electronic parts Wx or resin leakage, etc.). At this time, the control unit 26 compares the preset reference image data with the molded product image data, for example, and detects a defective appearance of the resin molded product P.

<judgment of unfavorable factors> The control unit 26 determines these defective factors in the following manner when (a) the thickness defect is detected and (b) the appearance defect is detected.

(A) Detection of poor thickness The control unit 26 uses the electronic part number data and the stacking number data to determine whether there is a false recognition of the electronic part Wx and whether the calculated value of the resin amount is correct. In addition, the control unit 26 uses the resin measurement data to determine whether the resin measurement value is correct.

In addition, the control unit 26 uses the resin image data to make a determination regarding the uniformity of the dispersion state of the resin material J. Here, as the determination method, for example, comparison with the reference image data when the dispersion state is uniform, or image processing of the resin image data, and digitization of the dispersion state are used for determination.

Furthermore, the control unit 26 uses the mold clamping position data to determine whether the mold clamping position during molding is correct. At this time, the control unit 26 compares and determines the preset reference position with the measured mold clamping position, for example. In addition, the control unit 26 uses the temperature data of the forming die to determine whether the temperature of the forming die during forming is correct. At this time, for example, the control unit 26 compares the preset reference temperature with the measured temperature of the molding die to determine.

(B) Detection of poor appearance The control unit 26 uses the map data to determine whether the mounting arrangement of the electronic component Wx is correct. At this time, the control unit 26 compares the reference array input in advance with the measured mounting array to determine.

In addition, the control unit 26 uses the resin image data to make a determination regarding the uniformity of the dispersion state of the resin material J. Here, as the determination method, for example, comparison with the reference image data when the dispersion state is uniform, or image processing of the resin image data, and numerical determination of the dispersion state are performed.

Furthermore, the control unit 26 uses the mold clamping position data to determine whether the mold clamping position during molding is correct. At this time, the control unit 26 compares and determines the preset reference position with the measured mold clamping position, for example. In addition, the control unit 26 uses the temperature data of the forming die to determine whether the temperature of the forming die during forming is correct. At this time, for example, the control unit 26 compares the preset reference temperature with the measured temperature of the molding die to determine.

<Feedback control of resin molding conditions> (A) Detection of poor thickness The control unit 26 changes the set value of the amount of resin to be input based on the determination results using the electronic part number data and the stacking number data. In addition, the control unit 26 corrects the resin measurement value obtained by the measurement unit 22 based on the determination result using the measurement data.

In addition, when it is determined that the resin material J is uneven based on the determination result using the resin image data, the control unit 26 changes the synchronization operation of the mobile station 15 when the resin is dispersed in order to change the dispersion condition of the resin material J . For example, it is considered that a portion with a large number of resin materials J scattered in the resin image data speeds up the moving speed of the mobile station 15, and a portion with a small number of resin materials J scattered reduces the moving speed of the mobile table 15.

Furthermore, the control unit 26 changes the set position of the mold clamping position based on the result of the determination using the mold clamping position data. In addition, the control unit 26 changes the set temperature of the forming mold based on the determination result using the temperature data of the forming mold.

(B) Detection of poor appearance The control unit 26 increases or decreases the amount of resin dispersion based on the position of the electronic component Wx based on the determination result using the map data. Here, as a method of increasing or decreasing the amount of resin dispersed, it may be considered that the amount of input from the resin material input mechanism 17 may be increased or decreased, or it may be considered to control the movement speed or movement timing of the mobile station 15 to increase or decrease.

In addition, when it is determined that the resin material J is uneven based on the determination result using the resin image data, the control unit 26 changes the synchronization operation of the mobile station 15 when the resin is dispersed in order to change the dispersion condition of the resin material J . For example, it is considered that a portion with a large number of resin materials J scattered in the resin image data speeds up the moving speed of the mobile station 15, and a portion with a small number of resin materials J scattered reduces the moving speed of the mobile table 15.

Furthermore, the control unit 26 changes the set position of the mold clamping position based on the result of the determination using the mold clamping position data. In addition, the control unit 26 changes the set temperature of the forming mold based on the determination result using the temperature data of the forming mold.

As described above, the control unit 26 changes the control amount of each unit based on the determination result, and in the next resin molding, resin molding in which feedback is performed is performed.

<Effect of this embodiment> According to the resin molding apparatus 100 of the present embodiment, the resin molding conditions are feedback-controlled based on the resin image data obtained by photographing the state where the granular resin material J is scattered, and therefore the thickness of the resin molded product P can be increased, for example Equal quality. In addition, since the liquid resin is not used as before, it is not necessary to consider its viscosity, and by using the granular resin, it is easy to uniformly arrange it within the molding range.

In addition, according to the present embodiment, each time a defect is detected, its factor is determined and fed back, so that the occurrence of a defective product in the next step can be avoided.

<Other modified embodiments> In addition, the present invention is not limited to the embodiments.

For example, the control part of the above-described embodiment determines the respective factors based on the poor thickness and poor appearance, but the factors may be determined without distinguishing these.

In addition, the control unit eliminates one unfavorable factor by changing one resin molding condition, but it is also possible to eliminate one unfavorable factor by changing multiple resin molding conditions.

In the above embodiment, the two resin molded modules B are connected between the substrate supply and the storage module A and the resin material supply module C, but it may be configured to supply the substrate to the storage module A and the resin material The supply module C is formed as one module, and the resin molding module B is connected to the module. Furthermore, the resin molding apparatus may not be modularized into modules as in the above-described embodiment.

In addition, of course, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist thereof.

2: Lower mold (forming mold) 2C: cavity 3: Upper mold (forming mold) 4: Mold clamping mechanism 11: substrate supply section 12: substrate storage 13: Board mounting section 14: substrate handling mechanism 15: mobile station 16: Resin Material Storage Department 17: Resin material input mechanism 18: Resin material supply mechanism 20: Object measurement department 21: Molded product measurement department 21a: thickness measurement section 21b: Molded product imaging department 22: Measurement Department 23: Resin camera department 24: Temperature measurement section 25: Position measurement department 26: Control Department 28: Release film 41: Activity disk 42: Upper fixed plate 43: Drive mechanism 44: Lower fixed plate 45: Pillar Department 46: Lower mold holding part 47: Upper mold holding part 100: resin molding device 201: bottom member 202: side member 203: base plate 204: elastic member 431: Ball screw mechanism 461, 471: heating plate 462, 472: Insulation components 463, 473: sidewall members 464, 474: sealing member A: Substrate supply and storage module (module) B: Resin molding module (module) C: Resin material supply module (module) J: Resin material (granular resin) P: Resin molded product W: Forming object (substrate) Wx: electronic parts

FIG. 1 is a plan view schematically showing the configuration of the resin molding apparatus of this embodiment. FIG. 2 is a diagram showing a method of manufacturing the resin molded article of the embodiment. FIG. 3 is a diagram showing a method of manufacturing the resin molded article of the embodiment. 4 is a diagram showing a method of manufacturing the resin molded article of the embodiment. FIG. 5 is a block diagram showing the configuration of each unit in the embodiment.

20: Object measurement department

21: Molded product measurement department

21a: thickness measurement section

21b: Molded product imaging department

22: Measurement Department

23: Resin camera department

24: Temperature measurement section

25: Position measurement department

26: Control Department

A: Substrate supply and storage module

B: Resin molding module

C: Resin material supply module

Claims (9)

A resin molding device is a resin molding device that uses granular resin for resin molding, including: A resin imaging unit to photograph the state in which the granular resin is dispersed; and The control unit feedback-controls the resin molding conditions based on the resin image data obtained by the resin imaging unit. The resin molding apparatus as described in item 1 of the patent application scope has a molded product measuring section that measures the state of the molded resin product, The control unit performs feedback control on the resin molding conditions based on the resin image data and the molded product measurement data obtained by the molded product measurement unit. The resin molding device according to item 2 of the patent application range, wherein the molded product measuring section measures the thickness of a plurality of parts of the resin molded product or photographs the resin molded product. The resin molding device according to item 2 of the patent application range, wherein the control unit performs defect inspection of the resin molded product based on the molded product measurement data, and determines that the resin molded product is defective Based on the resin image data, a determination is made regarding the uniformity of the granular resin, and when it is determined that the granular resin is not uniform, feedback control of the dispersion conditions of the granular resin is performed. The resin molding apparatus as described in item 1 of the patent application scope has an object measurement section that measures the state of the molding object, The control unit performs feedback control on the resin molding conditions based on the resin image data and the object measurement data obtained by the object measurement unit. The resin molding apparatus as described in item 1 of the patent application scope has a temperature measuring section that measures the temperature of the molding die, The control unit performs feedback control on the resin molding conditions based on the resin image data and the temperature measurement data obtained by the temperature measurement unit. The resin molding device according to item 1 of the patent application scope has a position measuring section that measures the mold clamping position of the mold clamping mechanism that molds the molding die, The control section performs feedback control on the resin molding conditions based on the resin image data and the position measurement data obtained by the position measurement section. The resin molding apparatus according to item 1 of the patent application range, wherein the control section performs feedback control on the resin molding conditions to change at least the dispersion state of the granular resin. A method for manufacturing a resin molded product using the resin molding device described in any one of patent application ranges 1 to 8.

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