CN104362107B - Wafer vacuum bonder and bonding method - Google Patents
Wafer vacuum bonder and bonding method Download PDFInfo
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- CN104362107B CN104362107B CN201410570392.5A CN201410570392A CN104362107B CN 104362107 B CN104362107 B CN 104362107B CN 201410570392 A CN201410570392 A CN 201410570392A CN 104362107 B CN104362107 B CN 104362107B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a kind of wafer vacuum bonder and bonding method, the position of first piece of wafer is just defined after the advance of first time locating piece by it, it is then placed in second piece of wafer, then evacuation again, when locating piece is return, second piece of wafer is just write in the state of vacuum and is dropped on first piece of wafer, then so that second piece of wafer and the position of first piece of wafer is limited by the advance of locating piece more simultaneously, then pressed again, locating piece is recalled again after pressing, so ensure that in pressing, the position of two pieces of wafers is perfect corresponding.Thus structure is simple, easy to operate, cost is relatively low, and is capable of the perfect bonding of wafer.
Description
Technical field
The present invention relates to microelectronics technology, it is especially a kind of wafer vacuum bonder and bonding method.
Background technology
Wafer bonding refer to by two panels wafer contacts enough closely so that they can firmly be combined together, mesh
Front wafer bond techniques are required for special wafer bonding system to realize.Due to the material requirements of wafer itself, to wafer
Bonding requirement very high it is desirable to two wafer can bubble-free perfectly fit together, if required during wafer bonding no
Bubble, then be necessary for completing under vacuum conditions being bonded, but require two pieces of wafers can during wafer bonding again
Perfect corresponding, existing wafer bonding system is usually to realize the position pair of two pieces of wafers in vacuum environment using mechanical hand
Should, complex structure, relatively costly.
Content of the invention
The technical problem to be solved is to overcome the defect of prior art, there is provided a kind of positioning is simple, one-tenth
This is relatively low, and can make the wafer vacuum bonder of the perfect bonding of two pieces of wafers.
For solving above-mentioned technical problem, the present invention proposes a kind of wafer vacuum bonder, and it includes casing, in described casing
Be provided with vacuum generator, described casing is provided with the press of internal closing, described press include fixture on casing and
It is located on fixture and makes the lid of internal closing when covering, be provided with pressing plate in described lid, the lower surface of described pressing plate is provided with
Heating plate, is provided with thermal insulation layer between described pressing plate and heating plate, be provided with the pallet for placing wafer, described support in described fixture
The lower section of disk is provided with heater, and the surrounding of described pallet is provided with multiple locating pieces in diametric(al) movement, and described each is fixed
Position block is driven by the cylinder being arranged on fixture outer wall, and the head of each locating piece described is additionally provided with support.
After said structure, moving forward and backward twice by locating piece, make two pieces of wafers perfect corresponding, then pass through
It is to contact under vacuum conditions that pressing plate is pressed downward making two pieces of wafer bondings, first piece of wafer and second piece of wafer, therefore both it
Between bubble-free, then so that two pieces of wafer position is corresponded to by operating locating piece, the operation of locating piece is completed by cylinder, structure
Simply, easy to operate, cost is relatively low, and is capable of the perfect bonding of wafer.
Described support is that the tinsel being connected to positioning block header is bent outwardly and makes.Using this structure, the system of support
Make comparisons simple, and less with the frictional force of wafer, during wafer landing, position will not occur big to change so that follow-up
Operation is fairly simple, and because structure is simple, is easy to cleaning below or the work changed.
It is additionally provided with the multiple contour limited block perpendicular to clamp base in described fixture.Using this structure, limited block
Can offseting with the pressing plate on lid, enabling pressing plate to reach setting position in pressing, thus ensure that two pieces of wafers in key
The distance between two pieces of wafers during conjunction are consistent, and bonding effect is preferable.
Described locating piece has three, and described three locating pieces are evenly arranged around pallet.Can using three locating pieces
Positioned with the position on pallet by wafer, structure is simple, and cost is relatively low.
At least provided with " C " the clevis head being driven by pushing mechanism, when lid covers on fixture, institute on described casing
State the edge that chuck can clamp fixture and lid in inside promotion, make fixture and lid clamping.Using this structure, in lid
When covering on fixture, can make to be sealed between lid and fixture, using chuck clamping it is ensured that bonding strength, and
Tightness within press, thus vacuum can be made to keep inside press.
Described lid is connected on casing by a bracing frame, and described casing is provided with a support base, support frame as described above
One end and support seat hinge, the other end of bracing frame is hinged with the middle part in the outside of lid to make lid can turn with respect to bracing frame
Dynamic.Using this structure, when lid rotates with respect to fixture and comes, lid can be rotated again, so that lid can phase
Larger angle is rotated for fixture it might even be possible to rotate upward, then air can be better contacted with, radiating effect is more preferable.
Described lid is hinged with bracing frame to be referred to, support frame as described above is provided with rotation hole and pin-and-hole, and lid passes through a rotating shaft
It is connected with bracing frame through rotation hole and can rotate with respect to bracing frame, lid passes through pin-and-hole with bracing frame even by a pin
Connect.Using this structure, when pin is plugged, lid will not rotate with respect to bracing frame, and when pin is taken away, lid just can phase
Bracing frame is rotated, prevents when lid covers compression on fixture, lid rotates.
Described rotation hole is waist-shaped hole, and described rotating shaft can move left and right in waist-shaped hole, and described fixture is provided with gathering sill,
Described lid is provided with the guide protrusions with the cooperation of this gathering sill, and when described lid covers on fixture, guide protrusions embed guiding
In groove.Using this structure, coordinate the centering it is ensured that when lid covers on fixture, centering with guide protrusions and gathering sill
Precision very high so that the alignment effect in bonding for the wafer very good it is ensured that the quality of wafer bonding.
The present invention also provides a kind of wafer bonding method, and it comprises the following steps：
S1, above applied bonding glue first piece of wafer be put on pallet；
S2, control by cylinder multiple locating pieces to advance to pallet direction, first piece of wafer is positioned；
S3, on locating piece support place second piece of wafer, then close the lid closing press, and evacuation；
S4, when vacuum reaches setting value, controls multiple locating pieces to retreat, second piece of wafer drops from locating piece support
Fall above first piece of wafer；
S5, controls multiple locating pieces to advance to pallet direction again by cylinder, two pieces of wafers is positioned；
S6, pressing plate is controlled downwards by press, make first piece of wafer and second piece of wafer pressing, maintain t minute；
S7, the multiple locating pieces of control retreat again, then control heating plate and heater to carry out heating and make bonding glue solid
Change；
After the completion of S8, bonding, open press, the wafer after bonding is taken out.
In described step S4, the setting value of vacuum is：5～15 handkerchiefs, in described step S6, the time t of pressing is 2～10
Minute, in described step S7, heating-up temperature is：200～300 degree, the time is 5～15 minutes.Using above-mentioned parameter, wafer bonding
Effect more preferably, in hgher efficiency.
After said method, the present invention has advantages below：The present invention is after the advance of first time locating piece just by first
The position of block wafer is defined, and is then placed in second piece of wafer, then evacuation again, when locating piece is return, second piece of wafer
Just the state in vacuum is write and is dropped on first piece of wafer, then makes second piece of wafer and first piece by the advance of locating piece again
The position of wafer limits simultaneously, is then pressed again, recalls locating piece after pressing again, so ensure that in pressing, and two
The position of block wafer is perfect corresponding, and that is, two pieces of wafers overlap in the plane, and also do not have bubble between two pieces of wafers, pressure
Carry out heating cure again after conjunction.Using said method, step is simple, can be automatically controlled using PLC, and be bonded effect
Preferably, cost is relatively low, and efficiency is higher for fruit.
Brief description
Fig. 1 is the structural representation of wafer bonding machine；
Fig. 2 is the structural representation of press；
Fig. 3 is the enlarged diagram of part A in Fig. 1.
Fig. 4 is the structural representation of another embodiment of wafer bonding machine；
Fig. 5 is the structural representation of the lid open mode of another embodiment of wafer bonding machine；
Fig. 6 is the attachment structure schematic diagram of lid and fixture in wafer bonding machine.
As shown in the figure：1st, casing, 2, press, 2.1, lid, 2.2, fixture, 3, pallet, 4, locating piece, 5, cylinder, 6, limit
Position block, 7, pressing plate, 8, thermal insulation layer, 9, heating plate, 10, press cylinder, 11, pushing mechanism, 12, chuck, 13, bracing frame, 13.1,
Rotation hole, 13.2, pin-and-hole, 14, support base, 15, rotating shaft, 16, gathering sill, 17, guide protrusions.
Specific embodiment
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description：
As Figure 1-3：The present invention proposes a kind of wafer vacuum bonder, and it includes casing 1, is provided with described casing 1
Vacuum generator, described casing 1 is provided with the press 2 of internal closing, described press 2 include fixture 2.2 on casing 1 with
And be located on fixture 2.2 and make the lid 2.1 of internal closing when covering, it is provided with pressing plate 7, described pressing plate 7 in described lid 2.1
Lower surface be provided with heating plate 9, be provided with thermal insulation layer 8 between described pressing plate 7 and heating plate 9, be provided with for putting in described fixture 2.2
Put the pallet 3 of wafer, the lower section of described pallet 3 is provided with heater, the surrounding of described pallet 3 be provided with multiple in diametric(al) shifting
Dynamic locating piece 4, each locating piece 4 described is driven by the cylinder 5 being arranged on fixture 2.2 outer wall, each locating piece 4 described
Head is additionally provided with support 4.1.
Described press 2 has the chamber of internal closing, and chamber is connected with vacuum generator, and vacuum generator can be within the chamber
Evacuation, the outside of the upper lid of press 2 is provided with press cylinder 10, and the output shaft of press cylinder 10 is connected with the pressing plate of press 2,
Band dynamic pressure plate moves up and down, and described lid 2.1 is connected on fixture 2.2 by two cylinders, covers in fixture 2.2 in lid 2.1
When upper, constituted the closing space within press 2, in the present embodiment, pallet 3 is circle, and the lower section of pallet 3 is provided with heater
Pallet 3 can be heated, after pressing plate 7 compresses wafer downwards, the heating plate on pressing plate 7 and pallet 3 enter to wafer simultaneously
Row heating.Described locating piece 4 is driven by the cylinder 5 being located on fixture 2.2 outer wall, along in the diametric(al) of pallet 3, can direction
Pallet or the direction away from pallet are moved, and make the locating piece 4 can be with the side of wafer after advance by setting the stroke of cylinder 5
Offset, thus positioning to the position of wafer.The positioning of circular wafers just can be realized using three locating pieces.Locating piece
Head is provided with support, and support 4.1 is located at the position of the upper end of locating piece, and the locating piece below support and wafer offset, support with
It is provided with distance between wafer.The present embodiment medium-height trestle 4.1 is bent outwardly for the tinsel being connected to locating piece 4 head and makes.This
Tinsel bending camber in embodiment, because wafer has the presence of bonding glue in bonding, therefore for keeping the effect of bonding,
Locating piece 4 needs timing to be carried out during using, and makes tinsel be pressed in locating piece 4 by pressing plate in the present embodiment
On, remove more convenient during cleaning.Certainly described locating piece can also be 4,5 or more, but it is still protected in the application
Within the scope of shield.
It is additionally provided with the multiple contour limited block perpendicular to clamp base in described fixture.During wafer bonding,
The thickness of bonding glue need to control that is to say, that two pieces of wafers after bonding, distance between the two need set point it
Interior, using this structure, during pressing plate pressing, arrive to limited block and just stop pressing, so that the distance between two pieces of wafers is determined.
For the different wafer bondings requiring it is only necessary to change the limited block of differing heights.In the embodiment shown in fig. 1, institute
State the outside that limited block 6 is located at pallet, be column.In the embodiment shown in fig. 5, described limited block, is located at the upper table of pallet
The periphery in face, is lamellar, though the limited block of above-mentioned two embodiment be different shape, be all limited block, its purpose be all for
The thickness of control key rubber alloy.
As shown in Figure 4, Figure 5, at least provided with " C " the clevis head 12 being driven by pushing mechanism 11 on described casing 1, when
When lid 2.1 covers on fixture 2.2, described chuck 12 can clamp fixture 2.2 and the edge of lid 2.1 in inside promotion, makes
Fixture 2.2 and lid 2.1 clamp.Described pushing mechanism is cylinder it is also possible to be the straight line being moved by motor belt motor in the present embodiment
Motion, or other straight-line motion mechanism.
Described lid 2.1 is connected on casing 1 by a bracing frame 13, and described casing 1 is provided with a support base 14, described
One end of bracing frame 13 is hinged with support base 14, and the other end of bracing frame 13 is hinged with the middle part in the outside of lid 2.1 to make lid
2.1 can rotate with respect to bracing frame 13.Support frame as described above 13 is provided with rotation hole 13.1 and pin-and-hole 13.2, and lid 2.1 passes through
One rotating shaft is connected with bracing frame 13 through rotation hole 13.1 and can rotate with respect to bracing frame 13, and lid 2.1 is worn by a pin
Cross pin-and-hole 13.2 to be connected with bracing frame 13.When pin is inserted, lid will not rotate with respect to bracing frame, when pin pulls out,
Lid can rotate with respect to bracing frame.
Described rotation hole 13.1 is waist-shaped hole, and described rotating shaft can move left and right in waist-shaped hole, and described fixture 2.2 is provided with
Gathering sill 16, described lid 2.1 is provided with the guide protrusions 17 with this gathering sill 16 cooperation, and described lid 2.1 covers in fixture 2.2
When upper, guide protrusions 17 embed in gathering sill 16.As shown in fig. 6, the lower surface of lid is provided with guide protrusions, the upper end of fixture
The outside in face is provided with gathering sill, and guide protrusions are downwardly into during gathering sill it is ensured that the centrage of lid and fixture aligns.Protect
When card press moves downward, the pairing precision of upper and lower two pieces of wafers.
The present invention also provides a kind of wafer bonding method, and it comprises the following steps：
S1, above applied bonding glue first piece of wafer be put on pallet；
S2, control by cylinder multiple locating pieces to advance to pallet direction, first piece of wafer is positioned；
S3, on locating piece support place second piece of wafer, then close the lid closing press, and evacuation；
S4, when vacuum reaches setting value, controls multiple locating pieces to retreat, second piece of wafer drops from locating piece support
Fall above first piece of wafer；
S5, controls multiple locating pieces to advance to pallet direction again by cylinder, two pieces of wafers is positioned；
S6, pressing plate is controlled downwards by press, make first piece of wafer and second piece of wafer pressing, maintain t minute；
S7, the multiple locating pieces of control retreat again, then control heating plate and heater to carry out heating and make bonding glue solid
Change；
After the completion of S8, bonding, open press, the wafer after bonding is taken out.
In described step S4, the setting value of vacuum is：5～15 handkerchiefs, in described step S6, the time t of pressing is 2～10
Minute, in described step S7, heating-up temperature is：200～300 degree, the time is 5～15 minutes.
Embodiment：Two panels thickness is adopted in more than 0.3mm, the wafer of a diameter of 200mm, its bonding steps in the present embodiment
As follows：
S1, above applied bonding glue first piece of wafer be put on pallet；
S2, controlled by cylinder multiple locating pieces to pallet direction advance, first piece of wafer is centrally located position；
S3, on locating piece support place second piece of wafer, then close the lid closing press, and evacuation；
S4, when vacuum reaches 10 handkerchief, controls multiple locating pieces to retreat, second piece of wafer lands from locating piece support
To above first piece of wafer；
S5, controls multiple locating pieces to advance to pallet direction again by cylinder, two pieces of wafers is positioned two pieces
The edge of wafer is completely superposed；
S6, pressing plate is controlled downwards by press, make first piece of wafer and second piece of wafer pressing, maintain 15 minutes；
S7, retreated again by controlling multiple locating pieces, then control heating plate and heater to carry out heating and make bonding
Adhesive curing, heating-up temperature is 300 degree, and heat time heating time is 10 minutes；
After the completion of S8, bonding, open press, the wafer after bonding is taken out.
Claims (10)
1. a kind of wafer vacuum bonder it is characterised in that：It includes casing (1) and vacuum generator, on described casing (1)
It is provided with the press (2) of internal closing, described press (2) includes the fixture (2.2) on casing (1) and is located at fixture
(2.2) upper and make internal closing when covering lid (2.1), is provided with pressing plate (7), described pressing plate (7) in described lid (2.1)
Lower surface be provided with heating plate (9), be provided with thermal insulation layer (8) between described pressing plate (7) and heating plate (9), in described fixture (2.2)
It is provided with the pallet (3) for placing wafer, the lower section of described pallet (3) is provided with heater, and the surrounding of described pallet (3) is provided with
The locating piece (4) of multiple diametric(al) movements in pallet, described each locating piece (4) is by being arranged on fixture (2.2) outer wall
The first pushing mechanism (5) drive, the head of described each locating piece (4) is additionally provided with support (4.1).
2. wafer vacuum bonder according to claim 1 it is characterised in that：Described support (4.1) is to be connected to positioning
The tinsel of block (4) head is bent outwardly to be made.
3. wafer vacuum bonder according to claim 1 it is characterised in that：It is additionally provided with vertical in described fixture (2.2)
Multiple contour limited block (6) in fixture (2.2) bottom.
4. wafer vacuum bonder according to claim 1 it is characterised in that：Described locating piece (4) has three, and described three
Individual locating piece (4) is evenly arranged around pallet (3).
5. wafer vacuum bonder according to claim 1 it is characterised in that：At least provided with one on described casing (1)
" C " the clevis head (12) being driven by the second pushing mechanism (11), when lid (2.1) covers on fixture (2.2), described chuck
(12) fixture (2.2) and the edge of lid (2.1) can be clamped in inside promotion, make fixture (2.2) and lid (2.1) clamping.
6. wafer vacuum bonder according to claim 1 it is characterised in that：Described lid (2.1) passes through a bracing frame
(13) it is connected on casing (1), described casing (1) is provided with a support base (14), one end of support frame as described above (13) and support
Seat (14) is hinged, and the middle part in the outside of the other end of bracing frame (13) and lid (2.1) is hinged to make the lid (2.1) can be with respect to
Bracing frame (13) rotates.
7. wafer vacuum bonder according to claim 6 it is characterised in that：Described lid (2.1) and bracing frame (13)
Hinged refer to, support frame as described above (13) is provided with rotation hole (13.1) and pin-and-hole (13.2), lid (2.1) pass through a rotating shaft (15)
It is connected with bracing frame (13) through rotation hole (13.1) and can rotate with respect to bracing frame (13), lid (2.1) passes through a pin
It is connected through pin-and-hole (13.2) with bracing frame (13).
8. wafer vacuum bonder according to claim 7 it is characterised in that：Described rotation hole (13.1) is waist-shaped hole,
Described rotating shaft (15) can move left and right in waist-shaped hole, and described fixture (2.2) is provided with gathering sill (16), described lid (2.1)
It is provided with the guide protrusions (17) coordinating with this gathering sill (16), described lid (2.1) is covered when fixture (2.2) is upper, and guiding is convex
Play (17) to embed in gathering sill (16).
9. a kind of wafer bonding method it is characterised in that：It comprises the following steps：
S1, above applied bonding glue first piece of wafer be put on pallet；
S2, control by cylinder multiple locating pieces to advance to pallet direction, first piece of wafer is positioned；
S3, on locating piece support place second piece of wafer, then close the lid closing press, and evacuation；
S4, when vacuum reaches setting value, controls multiple locating pieces to retreat, second piece of wafer drops to from locating piece support
Above first piece of wafer；
S5, controls multiple locating pieces to advance to pallet direction again by cylinder, two pieces of wafers is positioned；
S6, pressing plate is controlled downwards by press, make first piece of wafer and second piece of wafer pressing, maintain t minute；
S7, the multiple locating pieces of control retreat again；
After the completion of S8, bonding, open press, the wafer after bonding is taken out.
10. wafer bonding method according to claim 9 it is characterised in that：In described step S4, the setting value of vacuum
For：1～100 handkerchief, in described step S6, the time t of pressing is 1～60 minute.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410570392.5A CN104362107B (en) | 2014-10-23 | 2014-10-23 | Wafer vacuum bonder and bonding method |
| PCT/CN2014/094300 WO2016061889A1 (en) | 2014-10-23 | 2014-12-19 | Wafer vacuum bonding machine and bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410570392.5A CN104362107B (en) | 2014-10-23 | 2014-10-23 | Wafer vacuum bonder and bonding method |
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| Publication Number | Publication Date |
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| CN104362107A CN104362107A (en) | 2015-02-18 |
| CN104362107B true CN104362107B (en) | 2017-03-01 |
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| CN201410570392.5A Active CN104362107B (en) | 2014-10-23 | 2014-10-23 | Wafer vacuum bonder and bonding method |
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| Country | Link |
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| CN (1) | CN104362107B (en) |
| WO (1) | WO2016061889A1 (en) |
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| CN205542727U (en) * | 2016-04-26 | 2016-08-31 | 浙江中纳晶微电子科技有限公司 | Bonded equipment of separating of wafer |
| CN105977172B (en) * | 2016-05-21 | 2018-03-30 | 哈尔滨工业大学 | A kind of auxiliary hand-operating wafer bonding device |
| CN109003915A (en) * | 2018-06-21 | 2018-12-14 | 河南仕佳光子科技股份有限公司 | Very thin friable material and smooth pallet bubble-free are glued into glutinous equipment and technique |
| CN109262868A (en) * | 2018-10-10 | 2019-01-25 | 镇江市高等专科学校 | It is a kind of to be cut by laser in wafer processing the device that rotate school position automatically |
| CN110053289B (en) * | 2019-05-14 | 2024-04-16 | 苏州美图半导体技术有限公司 | Vacuum adhesive bonding machine |
| CN110282598B (en) * | 2019-07-10 | 2021-12-28 | 苏州美图半导体技术有限公司 | Wafer low-temperature bonding method in vacuum environment |
| CN110527946B (en) * | 2019-09-04 | 2024-03-19 | 立讯电子科技（昆山）有限公司 | Coating device |
| CN111188029A (en) * | 2020-03-11 | 2020-05-22 | 上海弘枫实业有限公司 | Multi-frame graphite boat |
| CN112820667B (en) * | 2021-01-04 | 2022-05-17 | 深圳市铨天科技有限公司 | Pressing and fixing machining equipment for storing chips |
| CN112962144B (en) * | 2021-01-29 | 2023-11-28 | 连智(大连)智能科技有限公司 | Glue pressing device for monocrystalline or polycrystalline square silicon rod |
| CN114941124B (en) * | 2022-06-01 | 2024-04-30 | 江苏邑文微电子科技有限公司 | Vacuum wafer coating device |
| CN117409001B (en) * | 2023-12-14 | 2024-04-05 | 合肥晶合集成电路股份有限公司 | Bubble analysis method and analysis device for wafer bonding |
| CN117524897B (en) * | 2023-12-29 | 2024-03-19 | 苏州芯睿科技有限公司 | Wafer bonding alignment device |
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| CN1648032A (en) * | 2005-01-28 | 2005-08-03 | 华中科技大学 | Vacuum package device for micro system |
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| JPWO2002056352A1 (en) * | 2001-01-15 | 2004-05-20 | リンテック株式会社 | Lamination device and lamination method |
| US6908027B2 (en) * | 2003-03-31 | 2005-06-21 | Intel Corporation | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process |
| KR100594642B1 (en) * | 2005-07-25 | 2006-06-30 | 한국기계연구원 | Wafer bonding apparatus, system and method |
| TWI533394B (en) * | 2007-06-21 | 2016-05-11 | 尼康股份有限公司 | Conveying method and conveying device |
| KR20100034450A (en) * | 2008-09-24 | 2010-04-01 | 삼성전자주식회사 | Wafer bonding apparatus |
| KR101460057B1 (en) * | 2013-01-25 | 2014-11-11 | 주식회사 나노솔루션테크 | Wafer bonder |
| JP2014060429A (en) * | 2013-11-13 | 2014-04-03 | Nikon Corp | Wafer bonding device and wafer bonding method |
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- 2014-10-23 CN CN201410570392.5A patent/CN104362107B/en active Active
- 2014-12-19 WO PCT/CN2014/094300 patent/WO2016061889A1/en active Application Filing
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| CN1648032A (en) * | 2005-01-28 | 2005-08-03 | 华中科技大学 | Vacuum package device for micro system |
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| WO2016061889A1 (en) | 2016-04-28 |
| CN104362107A (en) | 2015-02-18 |
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