CN110053289B - Vacuum adhesive bonding machine - Google Patents
Vacuum adhesive bonding machine Download PDFInfo
- Publication number
- CN110053289B CN110053289B CN201910396815.9A CN201910396815A CN110053289B CN 110053289 B CN110053289 B CN 110053289B CN 201910396815 A CN201910396815 A CN 201910396815A CN 110053289 B CN110053289 B CN 110053289B
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- CN
- China
- Prior art keywords
- sliding block
- gasket
- corrugated pipe
- clamp body
- cavity
- Prior art date
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- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 124
- 238000003466 welding Methods 0.000 claims abstract description 42
- 238000003825 pressing Methods 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 7
- 239000005357 flat glass Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims 6
- 125000006850 spacer group Chemical group 0.000 description 20
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B9/00—Presses specially adapted for particular purposes
Abstract
The invention relates to a vacuum adhesive bonding machine which comprises a vacuum cavity capable of vacuumizing, wherein a switchable cavity cover plate is arranged at the top of the vacuum cavity, a welding corrugated pipe is arranged in the vacuum cavity, a corrugated pipe guide post is arranged at the outer side of the welding corrugated pipe, a corrugated pipe adapter plate is arranged above the welding corrugated pipe, a clamp body assembly capable of keeping two substrates to be bonded aligned is arranged on the corrugated pipe adapter plate, a lower pressing head for supporting the substrates is arranged in the clamp body assembly, the lower pressing head is supported on the corrugated pipe adapter plate through a lower heat insulation plate, an upper pressing head arranged on the cavity cover plate is arranged right above the lower pressing head, and the upper pressing head is positioned in the vacuum cavity when the cavity cover plate is pressed on the vacuum cavity. The invention can meet the requirements of small pressure and high pressure uniformity in the bonding process, and is convenient to use, safe and reliable.
Description
Technical Field
The invention relates to a bonding machine, in particular to a vacuum adhesive bonding machine, and belongs to the technical field of micro-nano processing.
Background
In the technical field of micro-nano technology, the adhesive bonding process is increasingly widely applied. The pressure uniformity requirement of the adhesive bonding is extremely high, and the required pressure is much smaller than that of other bonding processes, however, the pressure applying mode of the traditional bonding machine is that a cylinder applies force or a formed corrugated pipe applies force. The cylinder force application method can apply a large force, but the uniformity of the force is very poor. The forming corrugated pipe can generate certain deformation in the force application process, so that the pressure uniformity can be effectively improved, but the force application resolution of the forming corrugated pipe is very low and is usually more than 1000N due to the processing technology of the forming corrugated pipe and the wall thickness of the forming corrugated pipe. It is apparent that these two modes of application are not applicable for low pressure, high pressure uniformity of the adhesive bonding process.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a vacuum adhesive bonding machine which can meet the requirements of small pressure and high pressure uniformity in the adhesive bonding process, and is convenient to use, safe and reliable.
According to the technical scheme provided by the invention, the vacuum adhesive bonding machine comprises a vacuum cavity capable of vacuumizing, wherein a switchable cavity cover plate is arranged at the top of the vacuum cavity, and when the cavity cover plate is pressed in the vacuum cavity, the top end of the vacuum cavity can be sealed by the cavity cover plate;
a welding corrugated pipe capable of being filled with positive pressure gas is arranged in the vacuum cavity, a corrugated pipe guide post capable of guiding the welding corrugated pipe in a lifting manner is arranged on the outer side of the welding corrugated pipe, a corrugated pipe adapter plate is arranged above the welding corrugated pipe, a clamp body assembly capable of keeping two substrates to be bonded aligned is arranged on the corrugated pipe adapter plate, a lower pressure head for supporting the substrates is arranged in the clamp body assembly, the lower pressure head is supported on the corrugated pipe adapter plate through a lower heat insulation plate, an upper pressure head arranged on a cavity cover plate is arranged right above the lower pressure head, and the upper pressure head is positioned in the vacuum cavity when the cavity cover plate is pressed on the vacuum cavity;
when the positive pressure gas is filled into the welding corrugated pipe through the gas connection port at the bottom of the vacuum cavity, the welding corrugated pipe can drive the lower pressure head to move towards the direction close to the upper pressure head through the corrugated pipe adapter plate, and when the substrate on the lower pressure head is contacted with the upper pressure head, the welding corrugated pipe can provide required bonding pressure for bonding the substrate between the upper pressure head and the lower pressure head.
The heater is arranged between the lower pressure head and the lower heat insulation plate, the upper pressure head is fixedly arranged on the cavity cover plate through the upper heat insulation plate and the cover plate connecting plate, the cavity cover plate is connected with the vacuum cavity through the hinge, and the cavity cover plate can be locked on the vacuum cavity through the cavity cover plate lock.
The cavity cover plate is provided with a cover plate handle, the cavity cover plate lock comprises a locking base arranged at the top end of the vacuum cavity and a cover plate pressing block arranged on the cavity cover plate, a handle connecting block is arranged in the locking base through a lock body rotating shaft, and a rotatable handle is arranged on the handle connecting block.
The top of the vacuum cavity is provided with a cavity sealing adapter plate, the cavity cover plate can be connected with the cavity sealing adapter plate in an adapting way, and the vacuum cavity is also provided with an observation window cover plate and an observation window glass arranged in the observation window cover plate.
The clamp body assembly comprises a clamp body, the clamp body is supported on the corrugated pipe adapter plate through a clamp body positioning column, a substrate positioning hole for placing a substrate is formed in the clamp body, the substrate positioning hole is located in the central area of the clamp body and penetrates through the clamp body, a plurality of uniformly distributed substrate interval positioning mechanisms are arranged on the clamp body, and before a substrate on a pressing head contacts with an upper pressing head, two substrates on the pressing head can be in an interval state through the substrate interval positioning mechanisms.
The substrate interval positioning mechanism comprises a substrate gasket capable of being arranged between two substrates, a gasket sliding block connected with the substrate gasket and a sliding block tension spring for providing a sliding block acting force for the gasket sliding block to move towards the direction far away from the center of the clamp body; the gasket sliding block can move along the length direction of the gasket sliding block on the clamp body;
the device comprises a clamp body, a gasket sliding block, a sliding block bolt mechanism and a gasket sliding block, wherein the gasket sliding block is arranged on the clamp body, the gasket sliding block is arranged on the gasket sliding block, and the gasket sliding block is fixedly connected with the gasket sliding block;
a positioning sphere in the clamp body and a sphere spring which is arranged in the clamp body and can be matched with the positioning sphere; the first end of the sliding block bolt body penetrates out of the stop block, and the second end of the sliding block bolt body penetrates through the sliding block bolt guide hole and then can be adjacent to the positioning ball body;
the positioning ball body is positioned below the gasket slide block, when the positioning ball body contacts with the gasket slide block under the action of the ball body spring, the positioning ball body can block the gasket slide block to move, and when the positioning ball body is far away from the gasket slide block through the slide block latch body, the gasket slide block can drive the substrate gasket to move towards the direction close to the stop block under the action of the slide block tension spring.
The device also comprises elastic plungers which can be connected with the sliding block latch bodies in an adapting way, wherein the elastic plungers can be connected with the cavity cover plates in an adapting way through elastic plunger mounting blocks, and substrate interval positioning mechanisms on the number clamp bodies of the elastic plungers are in one-to-one correspondence; when the clamp body is driven to move by the welded corrugated pipe, the elastic plunger can be matched with the sliding block bolt body and can press the sliding block bolt body.
The gasket slide block lower slide plate body is arranged in the clamp body, the gasket slide block upper slide plate body is arranged on the lower surface of the gasket slide block, and the gasket slide block can slide on the clamp body through the cooperation of the gasket slide block upper slide plate body and the gasket slide block lower slide plate body.
The clamp is characterized in that a side baffle mechanism for preventing the substrate from shifting is further arranged in the clamp body, the side baffle mechanism comprises a baffle positioning column which can be fixed with the corrugated pipe adapter plate, a guide sleeve sleeved on the baffle positioning column and a side baffle which is fixed with the guide sleeve, and the side baffle can move along with the guide sleeve relative to the baffle positioning column.
The vacuum cavity is assembled on a frame cover plate at the top end of the frame, the touch display screen is arranged on the upper part of the front face of the frame through the torque hinge, and casters which are uniformly distributed are arranged at the bottom end of the frame.
The invention has the advantages that: when the positive pressure gas is filled into the welding corrugated pipe through the gas connection port at the bottom of the vacuum cavity, the welding corrugated pipe can drive the lower pressure head to move towards the direction close to the upper pressure head through the corrugated pipe adapter plate, and when the substrate on the lower pressure head is contacted with the upper pressure head, the welding corrugated pipe can provide required bonding pressure for the adhesive bonding of the substrate between the upper pressure head and the lower pressure head, namely, the welding corrugated pipe can be utilized to ensure the uniformity of the pressure, and can provide higher pressure resolution, so that the welding corrugated pipe is safe and reliable.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a cross-sectional view of the vacuum chamber of the present invention.
Fig. 3 is a cross-sectional view of the present invention after the upper ram is in contact with the lower ram.
Fig. 4 is a schematic view of the clamp body assembly of the present invention mated with a bellows adapter plate.
FIG. 5 is a schematic view showing the cooperation between the side flap mechanism and the lower ram of the present invention.
FIG. 6 is a schematic view of a clip assembly of the present invention.
Fig. 7 is a cross-sectional view of a substrate spacing positioning mechanism of the present invention.
FIG. 8 is a schematic view of a substrate spacer in the substrate spacing positioning mechanism of the present invention away from the center region of the chuck body.
Fig. 9 is a cross-sectional view of the substrate spacing positioning mechanism of fig. 8.
Reference numerals illustrate: 1-handle, 2-cover plate press block, 3-handle connecting block, 4-locking base, 5-lock body rotating shaft, 6-hinge, 7-cavity cover plate, 8-cover plate handle, 9-cavity sealing adapter plate, 10-vacuum cavity, 11-observation window cover plate, 12-observation window glass, 13-frame cover plate, 14-frame body, 15-embedded handle, 16-side panel, 17-torque hinge, 18-display screen shell, 19-touch display screen, 20-starting button, 21-front fixed door plate, 22-front door plate, 23-caster wheel, 24-cover plate connecting plate, 25-upper heat insulation plate, 26-upper pressure head, 27-elastic plunger mounting block, 28-elastic plunger, 29-clamp body assembly, 30-side baffle mechanism 31-lower press head, 32-lower heat insulation plate, 33-bellows guide column, 34-heater, 35-bellows adapter plate, 36-welded bellows, 37-substrate, 38-side baffle, 39-side baffle fixing screw, 40-guide sleeve, 41-bellows adapter plate guide connection hole, 42-clamp body positioning column, 43-clamp body, 44-sleeve spring, 45-guide column fixing plate, 46-baffle positioning column, 47-fixing plate fixing screw, 48-slide block bolt body, 49-baffle cover plate, 50-gasket slide block, 51-baffle, 52-first tension spring fixing screw, 53-slide block tension spring, 54-substrate gasket, 55-second tension spring fixing screw, the device comprises a substrate positioning hole 56-substrate, a gasket slide block upper slide plate body 57-gasket slide block lower slide plate body 58-gasket slide block lower slide plate body, a gasket slide block lower slide plate body fixing screw 59-ball spring 60-ball spring 61-positioning ball, a slide block bolt guide hole 62-slide block, a gasket slide block upper slide plate body fixing screw 63-gasket slide block, a slide block bolt body spring 64-slide block, a guide sleeve positioning hole 65-and a gas connecting port 66-gas.
Detailed Description
The invention will be further described with reference to the following specific drawings and examples.
As shown in fig. 1, 2 and 3: in order to meet the requirements of small pressure and high pressure uniformity in the bonding process, the invention comprises a vacuum cavity 10 capable of vacuumizing, wherein a switchable cavity cover plate 7 is arranged at the top of the vacuum cavity 10, and when the cavity cover plate 7 is pressed on the vacuum cavity 10, the top end of the vacuum cavity 10 can be sealed by utilizing the cavity cover plate 7;
a welding corrugated pipe 36 capable of being filled with positive pressure gas is arranged in the vacuum cavity 10, a corrugated pipe guide post 33 capable of guiding the welding corrugated pipe 36 in a lifting manner is arranged on the outer side of the welding corrugated pipe 36, a corrugated pipe adapter plate 35 is arranged above the welding corrugated pipe 36, a clamp body assembly 29 capable of keeping two substrates 37 to be bonded aligned is arranged on the corrugated pipe adapter plate 35, a lower pressing head 31 for supporting the substrates 37 is arranged in the clamp body assembly 29, the lower pressing head 31 is supported on the corrugated pipe adapter plate 35 through a lower heat insulation plate 32, an upper pressing head 26 mounted on a cavity cover plate 7 is arranged right above the lower pressing head 31, and when the cavity cover plate 7 is pressed on the vacuum cavity 10, the upper pressing head 26 is positioned in the vacuum cavity 10;
when the welding bellows 36 is filled with positive pressure gas through the gas connection port 66 at the bottom of the vacuum chamber 10, the welding bellows 36 can drive the lower ram 31 to move in a direction approaching to the upper ram 26 through the bellows adapter plate 35, and when the substrate 37 on the lower ram 31 is in contact with the upper ram 26, a required bonding pressure can be provided for the adhesive bonding of the substrate 37 between the upper ram 26 and the lower ram 31 through the welding bellows 36.
Specifically, the vacuum chamber 10 has a square box shape, the chamber cover 7 is adapted to the top end of the vacuum chamber 10, the top of the vacuum chamber 10 can be opened by the chamber cover 7, and when the chamber cover 7 is pressed against the vacuum chamber 10, the upper end of the vacuum chamber 10 can be sealed by the chamber cover 7. When the top of the vacuum chamber 10 is opened by the chamber cover 7, the substrate 37 to be bonded can be placed on the lower press head 31, or the bonded substrate 37 can be taken out of the vacuum chamber 10.
The welding bellows 36 is located at the lower part in the vacuum chamber 10, and a bellows guide post 33 is further provided in the vacuum chamber 10, and lifting and lowering of the welding bellows 36 in the inflation and deflation process can be guided by the bellows guide post 33. The bellows adapter 35 is connected to the top of the welded bellows 36, and the clamp body assembly 29 is located above the bellows adapter 35, so that the substrates 37 to be bonded can be aligned by the clamp body assembly 29, the substrates 37 to be bonded can be supported by the lower pressing head 31, and the lower pressing head 31 is supported on the bellows adapter 35 by the lower heat insulation plate 32. When the welding bellows 36 is inflated, the welding bellows 36 can drive the bellows adapter plate 35 to move in a direction approaching the upper ram 26, and under the action of the bellows guide post 33, the bellows adapter plate 35 can drive the lower ram 31 and the clamp body assembly 29 to move synchronously. When the substrate 37 on the lower ram 31 is in contact with the upper ram 26, the bonding process for both substrates 37 can be accomplished by soldering the bellows 36 to provide the necessary bonding pressure for the adhesive bonding of the substrate 37 between the upper ram 26 and the lower ram 31. The bellows adapter plate 35 is provided with a bellows adapter plate guide connecting hole 41, the bellows adapter plate 35 can be connected and matched with the bellows guide column 33 through the bellows adapter plate guide connecting hole 41, and the bellows guide column 35 can ascend and descend under the guide of the bellows guide column 33.
Further, a heater 34 is arranged between the lower pressing head 31 and the lower heat insulation plate 32, the upper pressing head 26 is fixedly arranged on the cavity cover plate 7 through the upper heat insulation plate 25 and the cover plate connecting plate 24, the cavity cover plate 7 is connected with the vacuum cavity 10 through the hinge 6, and the cavity cover plate 7 can be locked on the vacuum cavity 10 through the cavity cover plate lock.
In the embodiment of the present invention, the heater 34 may be in a conventional heating manner, such as resistance heating, and the lower pressure head 31 can be heated by the heater 34 to provide a temperature required for bonding the substrate 37, the temperature of the substrate 37 during bonding is generally below 250 ℃, the heater 34 can be controlled to heat according to the actual temperature requirement, and the specific heating control process is well known to those skilled in the art and will not be repeated herein. A cover plate connecting plate 24 is fixed on the inner surface of the cavity cover plate 7, an upper heat insulating plate 25 is fixed on the cover plate connecting plate 24, an upper pressing head 26 is fixed on the upper heat insulating plate 25, and the upper heat insulating plate 25 is positioned between the upper pressing head 26 and the cover plate connecting plate 24. The shape of the upper ram 26 and the like are adapted to the lower ram 31 so that bonding between the two substrates 37 can be achieved under the pressure provided by the upper ram 26 and the lower ram 31 when the upper ram 26 is in contact with the substrates 37 on the lower ram 31.
Further, a cover plate handle 8 is arranged on the cavity cover plate 7, the cavity cover plate lock comprises a locking base 4 arranged at the top end of the vacuum cavity 10 and a cover plate pressing block 2 arranged on the cavity cover plate 7, a handle connecting block 3 is arranged in the locking base 4 through a lock body rotating shaft 5, and a rotatable handle 1 is arranged on the handle connecting block 3.
In the embodiment of the invention, the cavity cover plate 7 can be conveniently pulled through the cover plate handle 8, the handle 1 is L-shaped, the cover plate pressing block 2 is provided with the notch which can be matched with the handle 1, and when the handle 1 is opposite to the cover plate pressing block 2, the cavity cover plate 7 can be prevented from being opened by blocking the cover plate pressing block 2 by the handle 1. When the handle 1 is turned and the handle 1 is made not to correspond to the cover gland 2, the cavity cover 7 can be made in an open state.
In addition, a cavity sealing adapter plate 9 is arranged at the top end of the vacuum cavity 10, the cavity cover plate 7 can be connected with the cavity sealing adapter plate 9 in an adapting mode, and an observation window cover plate 11 and an observation window glass 12 arranged in the observation window cover plate 11 are further arranged on the vacuum cavity 10. In the embodiment of the present invention, the observation window cover 11 is disposed on the front and/or side of the vacuum chamber 10, and the condition of the vacuum chamber 10 can be observed through the observation window glass 12.
As shown in fig. 4, 6 and 8, the fixture body assembly 29 includes a fixture body 43, the fixture body 43 is supported on the bellows adapter plate 35 by a fixture body positioning column 42, a substrate positioning hole 56 for placing the substrate 37 is provided in the fixture body 43, the substrate positioning hole 56 is located in a central area of the fixture body 43 and the substrate positioning hole 56 penetrates through the fixture body 43, a plurality of uniformly distributed substrate spacing positioning mechanisms are provided on the fixture body 43, and before the substrate 37 on the lower press head 31 contacts with the upper press head 26, two substrates 37 on the lower press head 31 can be in a spacing state by the substrate spacing positioning mechanisms.
In the embodiment of the present invention, the clamp body 43 is in a ring shape, the clamp body 43 and the bellows adapter plate 35 are parallel to each other, and the clamp body 43 can be supported on the bellows adapter plate 35 through the clamp body positioning column 42. The substrate positioning holes 56 are adapted to the substrate 37 so that the substrate 37 can be placed on the lower press head 31 through the substrate positioning holes 56. Before the substrate 37 on the lower ram 31 contacts the upper ram 26, the two substrates 37 on the lower ram 31 can be placed in a spaced state by the substrate spacing positioning mechanism, wherein the spaced state refers to specifically that the two substrates 37 are not contacted, so that no gas exists between the two substrates 37 during bonding, and the substrates 37 and Shi Jiajian are prepared for bonding by matching the lower ram 31 with the upper ram 26.
Further, the substrate interval positioning mechanism comprises a substrate spacer 54 capable of being placed between two substrates 37, a spacer slider 50 connected with the substrate spacer 54, and a slider tension spring 53 for providing a force for moving the spacer slider 50 away from the center of the clamp body 43; the gasket slide block 50 can move along the length direction of the gasket slide block 50 on the clamp body 43;
the device further comprises a slide block bolt mechanism capable of controlling the movement state of the gasket slide block 50 on the clamp body 43, wherein the slide block bolt mechanism comprises a stop block 51 fixedly connected with the clamp body 43 and a slide block bolt body 48 capable of moving in the stop block 51, a slide block bolt guide hole 62 is arranged on the gasket slide block 50, and the slide block bolt guide hole 62 penetrates through the gasket slide block 50 and is distributed along the length direction of the gasket slide block 50;
a positioning sphere 61 in the jig body 43 and a sphere spring 60 provided in the jig body 43 and adapted to the positioning sphere 61; the first end of the sliding block latch body 48 passes through the stop block 51, and the second end of the sliding block latch body 48 passes through the sliding block latch guide hole 62 and can be adjacent to the positioning sphere 61;
the positioning sphere 61 is located below the spacer slider 50, when the positioning sphere 61 contacts with the spacer slider 50 under the action of the sphere spring 60, the spacer slider 50 can be blocked by the positioning sphere 61, and when the positioning sphere 61 is far away from the spacer slider 50 through the slider latch body 48, the spacer slider 50 can drive the substrate spacer 54 to move towards the direction approaching the stop block 51 under the action of the slider tension spring 53.
In the embodiment of the present invention, the substrate pad 54 is located at the end of the pad slider 50 adjacent to the central area of the fixture body 43, the substrate pad 54 and the pad slider 50 are coaxially distributed, and the axis of the pad slider 50 passes through the center of the fixture body 43. The first tension spring fixing screw 52 is arranged on the clamp body 43, the second tension spring fixing screw 55 is arranged on the gasket slide block 50, the second tension spring fixing screw 55 is adjacent to the substrate gasket 54 on the gasket slide block 50, the acting force of the gasket slide block 50 moving in the direction far away from the center of the clamp body 43 can be provided through the slide block tension spring 53, and the moving direction of the gasket slide block 50 on the clamp body 43 is consistent with the length direction of the gasket slide block 50.
Since the slider tension spring 53 can provide a force for the movement of the spacer slider 50, it is necessary to cooperate with the spacer slider 50 by a slider latch mechanism in order to control the position state of the substrate spacer 54. The slider latch guide holes 62 penetrate the gasket slider 50, and the length direction of the slider latch guide holes 62 is consistent with the length direction of the gasket slider 50. In order to be matched with the gasket sliding block 50, the length direction of the sliding block latch body 48 is perpendicular to the length direction of the gasket sliding block 50, the sliding block latch body 48 is arranged on the stop block 51, the sliding block latch body 48 can move along the length direction of the sliding block latch body 48 on the stop block 51, a sliding block latch body spring 64 is arranged in the stop block 51, when the sliding block latch body 48 is pressed to move towards the direction close to the positioning ball body 61, the sliding block latch body spring 64 can be compressed through the sliding block latch body 48, and the first end of the sliding block latch body 48 penetrates out of the stop block 51, so that the pressing of the sliding block latch body 48 can be conveniently realized.
The positioning ball 61 is located in the fixture body 43, the positioning ball 61 corresponds to the second end of the slider latch body 48, and the ball spring 60 is further disposed in the fixture body 43, in general, the positioning ball 61 is matched with the ball spring 60, the positioning ball 61 can protrude out of the surface of the fixture body 43, so that the positioning ball 61 is matched with the gasket slider 50, and the gasket slider 50 can be blocked from moving, namely, under the action of the slider tension spring 53, the gasket slider 50 cannot move on the fixture body 43 due to the blocking action of the positioning ball 61.
The slider latch guide hole 62 is adapted to the second end of the slider latch body 48 such that the second end of the slider latch body 48 can pass through the slider latch guide hole 62 and then approach the positioning sphere 61. After the slider latch body 48 is pressed, the second end of the slider latch body 48 can contact with the positioning ball 61 and push the positioning ball 61 into the fixture body 43, and when the positioning ball 61 is separated from the spacer slider 50, the spacer slider 50 can move under the action of the slider tension spring 53, so that the substrate spacer 54 can be far away from the corresponding vacuum adsorption hole 2. When the force applied to the slider latch body 48 is removed, the slider latch body 48 is reset by the slider latch body spring 64, the positioning ball 61 is reset by the ball spring 60, and at this time, the substrate pad 54 is moved in a direction approaching the corresponding vacuum suction hole 2 by the pad slider 50. From the above description, it is clear that the substrate pad 54 can be placed on the chuck body 43 without being affected by the bottom silicon wafer after the substrate pad 54 moves in the direction approaching the stopper 51, and the substrate pad 54 can be placed on the bottom silicon wafer when the substrate pad 54 moves in the direction approaching the corresponding vacuum suction hole 2.
In particular, a stop cover 49 is also provided on the stop 51. In order to realize smooth movement of the gasket slide 50 on the clamp body 43, a gasket slide lower slide plate body 58 is arranged in the clamp body 43, a gasket slide upper slide plate body 57 is arranged on the lower surface of the gasket slide 50, and the gasket slide 50 can slide on the clamp body 43 by matching the gasket slide upper slide plate body 57 with the gasket slide lower slide plate body 58. The gasket-slider lower slider body 58 is fixed to the jig body 43 by a gasket-slider lower slider body fixing screw 59, and the gasket-slider upper slider body 57 is fixedly connected to the gasket slider 50 by a gasket-slider upper slider body fixing screw 63. The surfaces of the upper gasket-slider sliding plate body 57 and the lower gasket-slider sliding plate body 58 are smooth, and the stability and the reliability of the sliding of the gasket slider 50 on the clamp body 43 can be ensured by matching the upper gasket-slider sliding plate body 57 with the lower gasket-slider sliding plate body 58.
Further, the device also comprises elastic plungers 28 which can be connected with the sliding block latch bodies 48 in an adapting way, wherein the elastic plungers 28 can be connected with the cavity cover plate 7 in an adapting way through the elastic plunger mounting blocks 27, and the substrate interval positioning mechanisms on the fixture bodies 43 of the elastic plungers 28 are in one-to-one correspondence; the elastic plunger 28 can be engaged with the slider latch body 48 and can press the slider latch body 48 when the clamp body 43 is driven to move by the welding bellows 36.
In the embodiment of the invention, an elastic plunger mounting block 27 is mounted on the cover plate connecting plate 24, and an elastic plunger 28 is positioned on the outer ring of the upper pressure head 26. As is clear from the above description, when the spacer slider 50 is required to move in a direction away from the center of the jig body 43, the slider latch body 48 is required to be pressed. In a specific implementation, when the clamp body 43 is driven to move towards the direction approaching the elastic plunger 28 by the welding bellows 36, the elastic plunger 28 can be in contact with the slider latch body 48, and along with the continuous approach of the clamp body 43 to the elastic plunger 28, the pressing of the slider latch body 48 by the elastic plunger 28 can be realized, so that the substrate pad 54 can be driven to move away from the central area of the clamp body 43 by the pad slider 50, and after the substrate pad 54 moves away from the central area of the clamp body 43, the spacing of the substrate pad 54 to the two substrates 37 on the lower press head 31 can be stopped, so that preparation is made for the contact and bonding of the two subsequent substrates 37. As shown in fig. 2, 6 and 7, the elastic plunger 28 does not press the slider latch body 48, and as shown in fig. 3, 8 and 9, the elastic plunger 28 presses the slider latch body 48, so that the substrate pad 54 follows the movement of the pad slider 50 on the fixture body 43.
As shown in fig. 5, a side baffle mechanism 30 for preventing the substrate 37 from being deviated is further disposed in the fixture body 43, the side baffle mechanism 30 includes a baffle positioning post 46 capable of being fixed with the bellows adapter plate 35, a guide sleeve 40 sleeved on the baffle positioning post 46, and a side baffle 38 fixed with the guide sleeve 40, and the side baffle 38 can move relative to the baffle positioning post 46 following the guide sleeve 40.
In the embodiment of the present invention, a guide sleeve positioning hole 65 is provided in the jig body 43, and the guide sleeve positioning hole 65 is communicated with the substrate positioning hole 56. The guide sleeve 40 can be allowed to be embedded through the guide sleeve positioning holes 65, the guide post fixing plate 45 is arranged at the bottom end of the baffle positioning post 46, the guide post fixing plate 45 can be fixed with the corrugated pipe adapter plate 35 through the fixing plate fixing screws 47, and the length direction of the baffle positioning post 46 is perpendicular to the corrugated pipe adapter plate 35. A sleeve spring 44 is provided in the guide sleeve 40, and the side fence 38 is fixed to the guide sleeve 40 by a side fence fixing screw 39. When the substrate 37 is positioned in the substrate positioning hole 56, the substrate 37 can be positioned in the central area of the lower pressing head 31 by utilizing the matching of the side baffle piece 38 and the outer ring edge of the substrate 37, so that the substrate 37 is prevented from being deviated and the subsequent bonding is prevented from being influenced. In particular use, the side tabs 38 may be rotated or raised and lowered relative to the tab posts 46 following the guide sleeve 40 to accommodate the blocking of the outer edges of the substrate 37 under different conditions.
Further, the vacuum chamber 10 is assembled on a frame cover 13 at the top end of the frame 14, a touch display screen 19 is mounted on the upper part of the front surface of the frame 14 through a torque hinge 17, and casters 23 uniformly distributed are arranged at the bottom end of the frame 14.
In the embodiment of the present invention, the frame 14 is in a cabinet or other form, and an air source capable of inflating the welding bellows 36, a controller for controlling the heating state of the heater 34, etc. can be stored in the frame 14, specifically, the air source in the frame 14 can be adaptively connected with the air connection port 66 at the bottom end of the vacuum cavity 10, so that the welding bellows 36 can be inflated with the required positive pressure air. The embedded handle 15 is arranged on the side panel 16 of the frame body 14, the front fixing door plate 21 is arranged on the upper portion of the front face of the frame body 14, the front door plate 22 is arranged under the front fixing door plate 21, the touch display screen 19 is arranged in the display screen shell 18, the starting button 20 is further arranged on the display screen shell 18, the touch display screen 19 can be started through the starting button 20, the touch display screen 19 can be in a conventional common mode, the touch display screen 19 can be connected with a controller and the like in the frame body 14, so that display and control of the inflation state of the welding bellows 36 can be achieved, the specific control process can be selected according to requirements, and the touch display screen is well known to those skilled in the art and is not repeated herein.
In specific operation, the substrate 37 and the clamp body assembly 29 are placed in the vacuum cavity 10, the substrate 37 is supported on the lower pressure head 31, the two substrates 37 are separated by the substrate gasket 38, and no air exists between bonding surfaces of the two substrates when the vacuum cavity 10 is vacuumized; the edges of the substrates 37 are caught by the side flaps 38 to ensure that the relative positions of the two substrates 37 do not shift.
When the vacuum chamber 10 is evacuated (50 Pa or less), the welding bellows 36 is filled with positive pressure gas, and the welding bellows 36 is raised by the gas pressure. During the rising process: the slider latch body 48 will contact the spring plunger 28 and receive a downward force, at which time the spacer slider 50 will drive the substrate spacer 54 to move away from the center of the clamp body 43 under the action of the slider tension spring 53, thereby enabling the two substrates 37 to contact. The bonding bellows 36 is capable of driving the substrate 37 into contact with the upper ram 26 as the bonding bellows 38 continues to rise, and the bonding bellows 38 is capable of providing bonding pressure for the adhesive bonding of the substrate 37 disposed between the upper ram 26 and the lower ram 31 by driving the lower ram 31 to move toward the upper ram 26.
In the embodiment of the invention, the welded bellows 36 is a thin hollow membrane formed by a plurality of stamping modes, and the welded bellows 36 has the advantages of good flexibility, large deformation, long service life and the like by utilizing a highly bendable and telescopic metal tube manufactured by precision welding, so that the pressure uniformity can be ensured, and higher pressure resolution (10N can be achieved), namely, the welded bellows 36 is utilized to drive the bellows adapter plate 35 to lift so as to drive the lower pressure head 31 to move towards the upper pressure head 26, and when the upper pressure head 26 is contacted with the substrate 37, the lower pressure head 31 and the upper pressure head 26 can apply required bonding force to the substrate 37, so that the actual bonding requirement is met.
Claims (7)
1. The vacuum adhesive bonding machine comprises a vacuum cavity (10) capable of being vacuumized, wherein a switchable cavity cover plate (7) is arranged at the top of the vacuum cavity (10), and when the cavity cover plate (7) is pressed on the vacuum cavity (10), the top end of the vacuum cavity (10) can be sealed by the cavity cover plate (7); the method is characterized in that:
a welding corrugated pipe (36) capable of being filled with positive pressure gas is arranged in the vacuum cavity (10), a corrugated pipe guide post (33) capable of guiding the welding corrugated pipe (36) in a lifting manner is arranged on the outer side of the welding corrugated pipe (36), a corrugated pipe adapter plate (35) is arranged above the welding corrugated pipe (36), a clamp body assembly (29) capable of keeping two substrates (37) to be bonded aligned is arranged on the corrugated pipe adapter plate (35), a lower pressing head (31) for supporting the substrates (37) is arranged in the clamp body assembly (29), the lower pressing head (31) is supported on the corrugated pipe adapter plate (35) through a lower heat insulation plate (32), an upper pressing head (26) arranged on a cavity cover plate (7) is arranged right above the lower pressing head (31), and the upper pressing head (26) is positioned in the vacuum cavity (10) when the cavity cover plate (7) is pressed on the vacuum cavity (10);
when positive pressure gas is filled into the welding corrugated pipe (36) through the gas connection port (66) at the bottom of the vacuum cavity (10), the welding corrugated pipe (36) can drive the lower pressure head (31) to move towards the direction close to the upper pressure head (26) through the corrugated pipe adapter plate (35), and when the substrate (37) on the lower pressure head (31) is in contact with the upper pressure head (26), the required bonding pressure can be provided for bonding the substrate (37) between the upper pressure head (26) and the lower pressure head (31) through the welding corrugated pipe (36);
the clamp body assembly (29) comprises a clamp body (43), the clamp body (43) is supported on the corrugated pipe adapter plate (35) through a clamp body positioning column (42), a substrate positioning hole (56) for placing a substrate (37) is formed in the clamp body (43), the substrate positioning hole (56) is located in the central area of the clamp body (43) and penetrates through the clamp body (43), a plurality of uniformly distributed substrate interval positioning mechanisms are arranged on the clamp body (43), and before the substrate (37) on the lower press head (31) is contacted with the upper press head (26), the two substrates (37) on the lower press head (31) can be in an interval state through the substrate interval positioning mechanisms;
the substrate interval positioning mechanism comprises a substrate gasket (54) which can be arranged between two substrates (37), a gasket sliding block (50) connected with the substrate gasket (54) and a sliding block tension spring (53) for providing a acting force for moving the gasket sliding block (50) in a direction away from the center of the clamp body (43); the gasket sliding block (50) can move along the length direction of the gasket sliding block (50) on the clamp body (43);
the device comprises a clamp body (43), and is characterized by further comprising a sliding block bolt mechanism capable of controlling the movement state of a gasket sliding block (50) on the clamp body (43), wherein the sliding block bolt mechanism comprises a stop block (51) fixedly connected with the clamp body (43) and a sliding block bolt body (48) capable of moving in the stop block (51), a sliding block bolt guide hole (62) is formed in the gasket sliding block (50), and the sliding block bolt guide hole (62) penetrates through the gasket sliding block (50) and is distributed along the length direction of the gasket sliding block (50);
a positioning sphere (61) in the clamp body (43) and a sphere spring (60) which is arranged in the clamp body (43) and can be matched with the positioning sphere (61); the first end of the sliding block bolt body (48) penetrates out of the stop block (51), and the second end of the sliding block bolt body (48) penetrates through the sliding block bolt guide hole (62) and then can be adjacent to the positioning sphere (61);
the positioning ball body (61) is positioned below the gasket sliding block (50), when the positioning ball body (61) is contacted with the gasket sliding block (50) under the action of the ball spring (60), the movement of the gasket sliding block (50) can be blocked by the positioning ball body (61), and when the positioning ball body (61) is far away from the gasket sliding block (50) by the sliding block latch body (48), the gasket sliding block (50) can drive the substrate gasket (54) to move towards the direction close to the stop block (51) under the action of the sliding block tension spring (53);
the heater (34) is arranged between the lower pressing head (31) and the lower heat insulation plate (32), the upper pressing head (26) is fixedly arranged on the cavity cover plate (7) through the upper heat insulation plate (25) and the cover plate connecting plate (24), the cavity cover plate (7) is connected with the vacuum cavity (10) through the hinge (6), and the cavity cover plate (7) can be locked on the vacuum cavity (10) through the cavity cover plate lock.
2. The vacuum glue bonder of claim 1, wherein: set up apron handle (8) on chamber apron (7), chamber apron lock including set up in locking base (4) on vacuum cavity (10) top and set up in apron briquetting (2) on chamber apron (7) install handle connecting block (3) through lock body pivot (5) in locking base (4) set up rotatable handle (1) on handle connecting block (3).
3. The vacuum glue bonder of claim 1, wherein: the top of the vacuum cavity (10) is provided with a cavity sealing adapter plate (9), the cavity cover plate (7) can be connected with the cavity sealing adapter plate (9) in an adapting mode, and the vacuum cavity (10) is further provided with an observation window cover plate (11) and observation window glass (12) arranged in the observation window cover plate (11).
4. The vacuum glue bonder of claim 1, wherein: the device also comprises elastic plungers (28) which can be connected with the sliding block latch bodies (48) in an adapting way, wherein the elastic plungers (28) can be connected with the cavity cover plate (7) in an adapting way through elastic plunger mounting blocks (27), and substrate interval positioning mechanisms on the clamp bodies (43) of the elastic plungers (28) are in one-to-one correspondence; when the clamp body (43) is driven to move by the welding corrugated pipe (36), the elastic plunger (28) can be matched with the sliding block latch body (48) and can press the sliding block latch body (48).
5. The vacuum glue bonder of claim 1 or 4, wherein: a gasket slide block lower slide plate body (58) is arranged in the clamp body (43), a gasket slide block upper slide plate body (57) is arranged on the lower surface of the gasket slide block (50), and the gasket slide block (50) can slide on the clamp body (43) through the cooperation of the gasket slide block upper slide plate body (57) and the gasket slide block lower slide plate body (58).
6. The vacuum glue bonder of claim 1, wherein: the clamp is characterized in that a side baffle mechanism (30) for preventing the substrate (37) from deviating is further arranged in the clamp body (43), the side baffle mechanism (30) comprises a baffle positioning column (46) capable of being fixed with the corrugated pipe adapter plate (35), a guide sleeve (40) sleeved on the baffle positioning column (46) and a side baffle (38) fixed with the guide sleeve (40), and the side baffle (38) can move along with the guide sleeve (40) relative to the baffle positioning column (46).
7. The vacuum glue bonder of claim 1, wherein: the vacuum cavity (10) is assembled on a frame cover plate (13) at the top end of the frame (14), a touch display screen (19) is arranged on the upper part of the front surface of the frame (14) through a torque hinge (17), and casters (23) which are uniformly distributed are arranged at the bottom end of the frame (14).
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| CN201910396815.9A CN110053289B (en) | 2019-05-14 | 2019-05-14 | Vacuum adhesive bonding machine |
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| CN110634774B (en) * | 2019-09-05 | 2021-09-24 | 凌顶世纪科技成都有限公司 | Vacuum heating table |
| CN112582296B (en) * | 2019-09-29 | 2023-06-02 | 上海微电子装备（集团）股份有限公司 | Wafer bonding device and method |
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