CN117198940A - Preheating device and preheating method for packaging semiconductor products - Google Patents
Preheating device and preheating method for packaging semiconductor products Download PDFInfo
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- CN117198940A CN117198940A CN202311231616.5A CN202311231616A CN117198940A CN 117198940 A CN117198940 A CN 117198940A CN 202311231616 A CN202311231616 A CN 202311231616A CN 117198940 A CN117198940 A CN 117198940A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 57
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 118
- 238000010438 heat treatment Methods 0.000 claims abstract description 107
- 238000009423 ventilation Methods 0.000 claims abstract description 90
- 230000008569 process Effects 0.000 claims abstract description 16
- 230000000630 rising effect Effects 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims description 55
- 238000004891 communication Methods 0.000 claims description 18
- 230000000903 blocking effect Effects 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 abstract description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 239000001301 oxygen Substances 0.000 abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 53
- 239000000463 material Substances 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 5
- 230000001360 synchronised effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The application relates to the technical field of semiconductor product preheating, in particular to a preheating device and a preheating method for packaging a semiconductor product, wherein the preheating device comprises a supporting unit, a heating ventilation unit and a temperature adjusting unit, the supporting unit is used for supporting a tool, and the heating ventilation unit comprises a heating component and a ventilation component with an external air passage; the temperature adjusting unit is used for driving the heating assembly to move close to or away from the tool, the supporting unit is used for supporting the tool, and the temperature adjusting unit is combined to drive the heating assembly to move, so that the temperature rising speed of the tool is controlled by controlling the distance between the heating assembly and the tool, and the sintering yield is improved; and in the preheating process, ventilation of the sealing cavity is kept, real-time atmosphere protection is implemented on the semiconductor product in the tool, the oxygen content in the sealing cavity is controlled, and oxidation of the product in the sealing cavity in the preheating process is avoided.
Description
Technical Field
The application relates to the technical field of semiconductor product preheating, in particular to a preheating device and a preheating method for packaging a semiconductor product.
Background
With the rapid development of electronic products and semiconductor industry, the sintering technology is gradually called as the main stream in the semiconductor product packaging process, and the semiconductor product packaging adopting the sintering technology usually needs to undergo three stages of preheating, sintering and cooling;
at present, a semiconductor product preheating device mainly comprises a preheating table and a heating component arranged on the preheating table and used for providing a heat source, wherein during preheating, a semiconductor product is placed in a sintering mold, and when the sintering mold reaches the preheating table, preheating is started; however, the conventional preheating device for semiconductor products cannot control the temperature rising speed during preheating, so that the sintering quality of the semiconductor products is easily affected, and the sintering mold is of an open structure, and the semiconductor in the sintering mold is easily oxidized due to contact with oxygen after temperature rising.
Disclosure of Invention
The application aims to solve the technical problems that: in order to solve the problems that the sintering quality of a semiconductor product is easily affected and the semiconductor is easily oxidized due to the fact that the preheating speed of the preheating device for the semiconductor product cannot be controlled during preheating in the prior art, the preheating device for packaging the semiconductor product is provided, and a preheating method based on the preheating device for packaging the semiconductor product is provided.
The technical scheme adopted for solving the technical problems is as follows: a preheating device for packaging semiconductor products, comprising:
the support unit is used for supporting the tool, the tool is provided with an air tap and a sealing cavity, and the air tap is fixedly connected with the tool and communicated with the sealing cavity;
the heating ventilation unit comprises a heating component and a ventilation component with an external air passage inside, and the heating component is used for heating the tool supported by the supporting unit; at least one ventilation component is used for introducing gas into the sealing cavity and at least one ventilation component is used for discharging gas from the sealing cavity, and the ventilation components are in one-to-one correspondence with the air nozzles;
and the temperature adjusting unit is used for driving the heating assembly to move close to or away from the tool so as to adjust the temperature rising speed of the tool, when the tool is supported by the supporting unit, the ventilation assembly is communicated with the sealing cavity through the air tap corresponding to the ventilation assembly, and in the process that the temperature adjusting unit drives the heating ventilation unit to move close to or away from the tool, the ventilation assembly is kept communicated with the sealing cavity through the air tap corresponding to the ventilation assembly.
Further, the air tap is internally provided with an air tap and an air valve which is arranged corresponding to the air tap, two ends of the air tap are respectively provided with an outer port positioned at the outer side of the air tap and an inner port communicated with the sealing cavity, the outer port and the inner port of the air tap are mutually communicated when the air valve is in an open state, and the outer port and the inner port of the air tap are mutually separated when the air valve is in a closed state;
when the fixture is placed in the supporting unit, the fixture presses the ventilation assembly downwards, so that the ventilation assembly pushes the air valve in the corresponding air tap to an open state, and an external air passage of the ventilation assembly is communicated with an external port of the air valve in the corresponding air tap in a sealing way; when the ventilation assembly leaves the air valve, the air valve is restored to the closed state.
Further, the ventilation assembly comprises a lower air rod and a first elastic element, the external air passage is positioned in the lower air rod, the lower air rod is vertically and slidably arranged on the heating assembly, the first elastic element upwards abuts against the lower air rod, and when the fixture is placed on the supporting unit, the lower air rod upwards abuts against an air valve in an air tap corresponding to the ventilation assembly where the lower air rod is positioned, so that the air valve is pushed to be in an open state.
Further, the device also comprises a pressing unit;
the pressing mechanism comprises a pressing block and a pressing power assembly, the pressing power assembly is used for driving the pressing block to move up and down, and the pressing block is located above the tool on the supporting unit and used for pressing the tool downwards.
Further, each air tap is provided with two air paths, namely an upper air path and a lower air path; the outer port of the upper air channel is positioned on the side of the upper surface of the tool, and the outer port of the lower air channel is positioned on the side of the lower surface of the tool;
when the tool is placed on the supporting unit, the tool presses the ventilation assembly downwards, so that the ventilation assembly pushes an air valve in a lower air passage corresponding to the ventilation assembly to an open state;
the lower extreme of briquetting has a plurality of shutoff pieces, shutoff piece and the air cock one-to-one on the frock, when the briquetting pushed down the frock, the shutoff piece covered the outer port of the upper gas circuit of sealing up rather than corresponding air cock.
Further, the upper end part of the lower air rod is provided with a communication hole communicated with the external air passage and a jacking part protruding upwards from the upper end part of the lower air rod, the upper end part of the lower air rod is provided with a sealing ring sleeved outside the jacking part and the communication hole at the same time, and the outer port is positioned at the lower end part of the air nozzle;
when the tool is placed on the supporting unit, the sealing ring is propped against the lower end part of the air tap corresponding to the air tap where the sealing ring is located, so that the communication hole of the air tap is communicated with the outer port of the lower end part of the corresponding air tap in a sealing way, and the jacking part is propped against the air valve in the air tap corresponding to the air tap where the sealing ring is located upwards, so that the air valve is pushed to be in an open state.
Further, the air tap is provided with an inner cavity, a lower hole and a side hole, the outer end part of the side hole is an inner port, the outer end part of the lower hole is an outer port, and the inner end part of the upper hole, the inner end part of the side hole and the inner end part of the lower hole are all extended to be communicated with the inner cavity;
the air channel formed among the lower hole, the inner cavity and the side holes is a lower air channel, the air valve in the lower air channel comprises a lower sealing piece which is movably arranged in the inner cavity, the lower sealing piece is arranged at the position of blocking the end part of the inner end of the lower hole through a second elastic element, and the lower sealing piece is pressed down on a lower air rod to compress the second elastic element so as to release the blocking of the end part of the inner end of the lower hole when moving upwards, so that the air valve of the lower air channel is in an open state.
Further, the supporting unit comprises a supporting table and at least two supporting columns, the supporting columns are fixedly connected with the supporting table and located above the supporting table, positioning protrusions are upwards protruded at the upper end parts of the supporting columns, positioning grooves matched with the positioning protrusions are formed in the tool, each positioning protrusion corresponds to one positioning groove, the lower surface of the tool is in contact with the upper end parts of the supporting columns, and the positioning protrusions are inserted into the corresponding positioning grooves.
Further, the heating assembly comprises a heating seat, a heating plate and a heating element for providing a heat source;
the heating seat is connected with the supporting table in a vertical sliding mode and is located above the supporting table, the heating plate is fixedly installed on the heating seat, the heating element is arranged in the heating plate, the upper surface of the heating plate is arranged opposite to the lower surface of the tool on the supporting column, and the temperature adjusting unit is arranged below the supporting table.
The application also provides a preheating method based on the preheating device for packaging the semiconductor product, which comprises the following steps:
s1, placing a tool with a semiconductor product in a sealing cavity on a supporting unit;
s2, pressing the tool downwards by using a pressing block;
s3, the temperature adjusting unit drives the heating assembly of the heating ventilation unit to be attached to the lower surface of the tool to start preheating, and meanwhile, the ventilation assembly for introducing gas into the sealing cavity is used for introducing protective gas into the sealing cavity, and the protective gas in the sealing cavity is discharged through the ventilation assembly for discharging gas from the sealing cavity;
s4, adjusting the temperature rising speed of the tool by controlling the distance between the heating assembly and the tool; during this process, shielding gas is maintained in and out of the sealed chamber.
The beneficial effects of the application are as follows: the preheating device for packaging the semiconductor product utilizes the supporting unit to support the tool, and combines the design that the temperature adjusting unit drives the heating assembly to move, so that the temperature rising speed of the tool is controlled by controlling the distance between the heating assembly and the tool, and the sintering yield is improved; and in the preheating process, ventilation of the sealing cavity is kept, real-time atmosphere protection is implemented on the semiconductor product in the tool, the oxygen content in the sealing cavity is controlled, and oxidation of the product in the sealing cavity in the preheating process is avoided.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the application, which proceeds with reference to the accompanying drawings.
Drawings
The application will be further described with reference to the drawings and examples.
FIG. 1 is a three-dimensional schematic view of a preheating device for packaging semiconductor products according to the present application;
FIG. 2 is an enlarged schematic view of a portion of FIG. 1A;
FIG. 3 is a schematic front view of a preheating device for packaging semiconductor products according to the present application;
FIG. 4 is a schematic cross-sectional view of B-B of FIG. 3;
FIG. 5 is an enlarged partial schematic view of C in FIG. 4;
FIG. 6 is a three-dimensional schematic of a tooling;
FIG. 7 is a three-dimensional schematic view of the heating ventilation unit mounted on the support unit;
FIG. 8 is an enlarged partial schematic view of D in FIG. 7;
FIG. 9 is a three-dimensional schematic of a hold-down unit;
FIG. 10 is a schematic top view of the heating ventilation unit mounted on the support unit;
FIG. 11 is a schematic view in section E-E of FIG. 10;
FIG. 12 is an enlarged partial schematic view of F in FIG. 11;
FIG. 13 is a schematic cross-sectional view of the tooling at the nozzle;
FIG. 14 is a schematic cross-sectional view of a press block pressing a tooling onto a support unit;
fig. 15 is a partially enlarged schematic view of G in fig. 14.
In the figure: 1. the support unit, 11, the support table, 12, the support column, 121, the location is protruding;
2. a vent assembly; 2a, an air inlet assembly, 2b and an exhaust assembly; 21. the first elastic element (22), the lower air rod (221), the external air passage (222), the communication hole (223), the jacking part (224), the outer step surface (23), the sealing ring (24), the air rod seat (241), the sliding hole (242), the inner step surface (25) and the pipe joint;
3. a heating assembly; 31. the heating seat, 32, the heating plate, 33, the heating element, 34, the guide rod, 35, the sliding sleeve, 36, the connecting plate, 37 and the side plate;
4. a temperature adjusting unit; 41. the device comprises an adjusting motor 42, a driving belt pulley 43, a driven belt pulley 44, a synchronous belt 45, a screw rod 46 and a transmission nut;
5. a tool; 51. air tap, 511, upper hole, 512, inner cavity, 513, lower hole, 514, side hole; 52. the air channel 521, the outer port 522, the inner port 52a, the upper air channel 52b and the lower air channel; 53. the air valve, 531, the second elastic element, 532, the upper seal, 533, the lower seal, 534, the communication structure; 54. film material 55, cover plate 551, window hole 56, sealing cavity 57 and positioning groove;
6. the device comprises a pressing unit 61, a pressing power assembly 62, a pressing block 621, an elastic pad 622, a groove part 63, a plugging piece 631 and a plugging pad.
Detailed Description
The application will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the application and therefore show only those features which are relevant to the application, and orientation and reference (e.g., up, down, left, right, etc.) may be used solely to aid in the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.
As shown in fig. 1 to 15, a preheating device for packaging semiconductor products comprises a supporting unit 1, a heating ventilation unit and a temperature adjusting unit 4:
as shown in fig. 4, 5 and 6, the supporting unit 1 is used for supporting a tool 5, the tool 5 is provided with an air tap 51 and a sealing cavity 56, the air tap 51 is fixedly connected with the tool 5, and the air tap 51 is communicated with the sealing cavity 56; the structure of forming the seal cavity 56 on the tooling 5 may be, but is not limited to, the following: placing a semiconductor product on the tooling 5, paving a film material 54 on the tooling 5, enabling the film material 54 to cover the semiconductor product, pressing the film material 54 on the tooling 5 through a cover plate 55, and forming a sealing cavity 56 between the tooling 5 and the film material 54, wherein the semiconductor product is positioned in the sealing cavity 56; the membrane material 54 can be made of thermal deformation resistant material such as Teflon, polyimide, etc.; the cover plate 55 may be, but is not limited to, pressing the film 54 on the tool 5 by magnetic adsorption, where the cover plate 55 and/or the tool 5 are/is provided with magnetic members, the cover plate 55 is magnetically adsorbed to the tool 5 by the magnetic members, and the magnetic members may be specifically high temperature resistant magnets, for example, the magnetic members are fixed on the tool 5, and the cover plate 55 is made of a material capable of being magnetically adsorbed, so that the cover plate 55 can press the film 54 by magnetic adsorption;
as shown in fig. 1 and 11, the heating ventilation unit is provided with a heating component 3 and a ventilation component 2, wherein the heating component 3 is used for heating the tooling 5 supported by the supporting unit 1; at least one ventilation assembly 2 is used for introducing gas into the sealing cavity 56, the ventilation assembly 2 used for introducing gas into the sealing cavity 56 is an air inlet assembly 2a, at least one ventilation assembly 2 is used for discharging gas from the sealing cavity 56, the ventilation assembly 2 used for discharging gas from the sealing cavity 56 is an air outlet assembly 2b, and the ventilation assemblies 2 are in one-to-one correspondence with the air nozzles 51, namely, each air nozzle 51 on the tool 5 is independently provided with one ventilation assembly 2; the ventilation assembly 2 is internally provided with an external air channel 221, the external air channel 221 of the air inlet assembly 2a can be communicated with a protection air source through a pipeline, the external air channel 221 of the exhaust assembly 2b can also be communicated with a vacuumizing mechanism through a pipeline, and the vacuumizing mechanism is a vacuum pump; the installation position of each ventilation assembly 2 can be correspondingly adjusted according to the distribution position of the air nozzles 51 of the tooling 5, for example, one end of the tooling 5 is provided with two air nozzles 51 for air intake, the other end is provided with two air nozzles 51 for air exhaust, and correspondingly, one end of the heating ventilation unit is provided with two air inlet assemblies 2a, and the other end is provided with two air exhaust assemblies 2b.
As shown in fig. 4, the temperature adjusting unit 4 is used for driving the heating component 3 to move close to or away from the tool 5 so as to adjust the temperature rising speed of the tool 5, and the temperature adjusting unit 4 can be, but is not limited to, a linear module, a cylinder, an electric push rod or other linear motion mechanisms; when the tool 5 is supported by the supporting unit 1, the ventilation assembly 2 is communicated with the sealing cavity 56 through the air tap 51 corresponding to the ventilation assembly 2, and in the process that the temperature adjusting unit 4 drives the heating ventilation unit to be close to or far away from the tool 5, the ventilation assembly 2 is kept communicated with the sealing cavity 56 through the air tap 51 corresponding to the ventilation assembly;
the preheating device for packaging the semiconductor product supports the tooling 5 by utilizing the supporting unit 1 and combines the design that the temperature adjusting unit 4 drives the heating assembly 3 to move, so that the temperature rising speed of the tooling 5 is controlled by controlling the distance between the heating assembly 3 and the tooling 5, and the sintering yield is improved; in the preheating process, the protective gas of the gas source can be filled into the sealing cavity 56 through the gas inlet component 2a and the gas nozzle 51 corresponding to the gas inlet component 2a, the protective gas can be nitrogen, the protective gas in the sealing cavity 56 can be discharged out of the sealing cavity 56 through the gas nozzle 51 corresponding to the gas outlet component 2b and the gas outlet component 2b, the ventilation of the sealing cavity 56 is kept in the preheating process, the real-time atmosphere protection is implemented on the semiconductor product in the tool 5, the oxygen content in the sealing cavity 56 is controlled, and the oxidation of the product in the sealing cavity 56 in the preheating process is avoided; the temperature adjusting unit 4 may be, but is not limited to, capable of pushing the tool 5 away from the supporting unit 1, so as to facilitate the tool 5 to be separated from the supporting unit 1.
In some examples, as shown in fig. 6, 11, 12 and 13, the air tap 51 is provided with an air channel 52 and an air valve 53 corresponding to the air channel 52, two ends of the air channel 52 are respectively an outer port 521 positioned outside the air tap 51 and an inner port 522 communicated with the sealing cavity 56, when the air valve 53 is in an open state, the outer port 521 and the inner port 522 of the air channel 52 where the air valve 53 is positioned are mutually communicated, and when the air valve 53 is in a closed state, the outer port 521 and the inner port 522 of the air channel 52 where the air valve 53 is positioned are mutually blocked;
when the tooling 5 is placed on the supporting unit 1, the tooling 5 presses the ventilation assembly 2 downwards, so that the ventilation assembly 2 pushes the air valve 53 in the corresponding air tap 51 to an open state, and the external air channel 221 of the ventilation assembly 2 is communicated with the external port 521 of the air valve 53 in the corresponding air tap 51 in a sealing way; when the ventilation assembly 2 leaves the air valve 53, the air valve 53 is restored to the closed state;
the air valve 53 in the air tap 51 is opened by pressing the tooling 5 on the ventilation assembly 2, so that the ventilation assembly 2 is automatically communicated with the sealing cavity 56; when the fixture 5 leaves the supporting unit 1, the air valve 53 which is not pressed by the ventilation assembly 2 automatically resets, the sealing cavity 56 becomes a closed environment, and oxidation of the surface of the semiconductor product in the sealing cavity 56 caused by contact with air can be avoided.
In some examples, the ventilation assembly 2 includes a lower air rod 22 and a first elastic element 21, the external air channel 221 is located in the lower air rod 22, the lower air rod 22 is installed on the heating assembly 3 in a vertically sliding manner, the first elastic element 21 abuts against the lower air rod 22 upwards, the first elastic element 21 may specifically be a spring, when the tool 5 is placed on the support unit 1, the lower air rod 22 abuts against the air valve 53 in the air tap 51 corresponding to the ventilation assembly 2 where it is located upwards, so as to push the air valve 53 to an open state; through the design of first elastic element 21 for lower gas pole 22 can elasticity flexible from top to bottom to this realization can laminate frock 5 all the time, pushes up the pneumatic valve 53 and moves to the open state, but also can produce the cushioning effect in the moment that lower gas pole 22 contacted with pneumatic valve 53, protection lower gas pole 22 and pneumatic valve 53.
In some examples, as shown in fig. 1, 4 and 9, a pressing unit 6 is further included; the pressing mechanism comprises a pressing block 62 and a pressing power assembly 61, the pressing power assembly 61 is used for driving the pressing block 62 to move up and down, the pressing power assembly 61 can be, but is not limited to, a linear module, a cylinder, an electric push rod or the like, the pressing power assembly 61 adopts a cylinder as an example, and a piston rod of the cylinder serving as the pressing power assembly 61 is fixedly connected with the pressing block 62; the pressing block 62 is located above the tooling 5 on the supporting unit 1 and is used for pressing the tooling 5 downwards, so that the tooling 5 can be flattened, micro deformation possibly existing in the tooling 5 can be flattened, the semiconductor product is more attached to the tooling 5, attachment of the tooling 5 to the heating component 3 is facilitated, and uniformity of temperature rise of the semiconductor product is improved; meanwhile, the pressing block 62 can also press the semiconductor product in the sealing cavity 56 to prevent the semiconductor product from deforming;
specifically, the tool 5 is provided with a plurality of sealing cavities 56, a plurality of window holes 551 on the cover plate 55 can be arranged, the part of the cover plate 55 between two adjacent window holes 551 is pressed against the film material 54, the part of the pressing block 62 corresponding to the sealing cavities 56 is provided with a groove 622 with a downward opening, when the pressing block 62 presses the tool 5, the lower surface of the pressing block 62 presses the cover plate 55, and the bottom of the groove 622 presses the film material 54 corresponding to the sealing cavities 56 so as to press the semiconductor product in the sealing cavities 56;
as shown in fig. 9 and 14, the lower surface of the pressing block 62 may further fix an elastic pad 621, the pressing block 62 is pressed on the cover plate 55 by the elastic pad 621, so that the pressing block 62 is pressed on the cover plate 55 more closely, micro-deformation of the tool 5 is reduced, the elastic pad 621 may penetrate through the avoiding holes corresponding to the window holes 551 one by one, when the elastic pad 621 is pressed on the cover plate 55, the avoiding holes are aligned with the corresponding window holes 551, and the material of the elastic pad 621 may be, but is not limited to, rubber or silica gel with high temperature resistance.
In some examples, as shown in fig. 9, 13, 14 and 15, each air tap 51 has two air passages 52, an upper air passage 52a and a lower air passage 52b, respectively; the outer port 521 of the upper air path 52a is positioned on the side of the upper surface of the tooling 5, and the outer port 521 of the lower air path 52b is positioned on the side of the lower surface of the tooling 5; an upper and lower double-ventilation structure can be formed through the upper air passage 52a and the lower air passage 52b, so that the air nozzle 51 is provided with different access points for supplying and protecting air sources or vacuum pumps, and ventilation can be realized through the upper air passage 52a and the lower air passage 52b; for example, during the process of transporting the tool 5, a protective gas may be introduced from the upper gas path 52a into the sealing cavity 56; when the tooling 5 is in the working procedures of preheating, sintering or cooling, etc., protective gas is introduced into the sealing cavity 56 from the lower gas path 52b;
in this embodiment, when the tooling 5 is placed on the supporting unit 1, the tooling 5 presses the ventilation assembly 2 downward, so that the ventilation assembly 2 pushes the air valve 53 in the lower air passage 52b corresponding to the air tap 51 to an open state;
the lower end of the pressing block 62 is provided with a plurality of blocking pieces 63, the blocking pieces 63 are in one-to-one correspondence with the air nozzles 51 on the tooling 5, and when the pressing block 62 presses the tooling 5, the blocking pieces 63 cover and seal the outer ports 521 of the upper air passages 52a corresponding to the air nozzles 51; while pressing the tooling 5 by the pressing block 62, the blocking piece 63 simultaneously blocks the outer port 521 of the upper air passage 52a, so that leakage at the upper air passage 52a can be prevented when the ventilation assembly 2 vacuumizes the sealing cavity 56 through the lower air passage 52b; the lower surface of the blocking member 63 may be fixed with a blocking pad 631, and the blocking member 63 covers and seals the outer port 521 of the upper air passage 52a corresponding to the air tap 51 through the blocking pad 631, and the blocking pad 631 may be, but is not limited to, rubber or silica gel with high temperature resistance, etc.
In some examples, as shown in fig. 11 and 12, the upper end of the lower air rod 22 is provided with a communication hole 222 communicating with the external air channel 221, and is provided with a jacking portion 223 protruding upwards from the upper end of the lower air rod 22, the upper end of the lower air rod 22 is provided with a sealing ring 23 sleeved outside the jacking portion 223 and the communication hole 222 at the same time, and the outer port 521 is positioned at the lower end of the air tap 51;
when the tool 5 is placed on the supporting unit 1, the sealing ring 23 is propped against the lower end part of the air tap 51 corresponding to the air vent assembly 2 where the sealing ring is positioned, so that the communication hole 222 of the air vent assembly 2 is communicated with the outer port 521 corresponding to the lower end part of the air tap 51 in a sealing way, and the jacking part 223 is propped against the air valve 53 in the air tap 51 corresponding to the air vent assembly 2 where the jacking part is positioned upwards so as to push the air valve 53 to be in an open state;
when the tool 5 is placed downwards on the supporting unit 1, the sealing ring 23 props against the lower end part of the air tap 51 corresponding to the ventilation assembly 2 where the sealing ring is positioned, so that the communication hole 222 of the ventilation assembly 2 is communicated with the outer port 521 of the corresponding air valve 53 in a sealing way, and the jacking part 223 props against the air valve 53 of the air tap 51 corresponding to the ventilation assembly 2 where the jacking part is positioned upwards so as to push the air valve 53 to be in an open state;
in this way, the jack-up part 223 is responsible for pushing the air valve 53 to open, the sealing ring 23 at the lower end part of the lower air rod 22 is responsible for sealing the lower air rod 22 and the air tap 51, and meanwhile, the upper end part of the lower air rod 22 can also play a role in limiting and protecting when the sealing ring 23 is pressed at the lower end part of the air tap 51, so that the jack-up part 223 is prevented from moving upwards relative to the tool 5 without limitation to crush the air valve 53.
In some examples, as shown in fig. 13, the air cap 51 has an inner cavity 512, a lower hole 513, and a side hole 514, the outer end of the side hole 514 is an inner end 522, the outer end of the lower hole 513 is an outer end 521, and the inner end of the upper hole 511, the inner end of the side hole 514, and the inner end of the lower hole 513 all extend to communicate with the inner cavity 512;
the air passage 52 formed among the lower hole 513, the inner cavity 512 and the side hole 514 is a lower air passage 52b, namely, the outer end part of the lower hole 513 is an outer port 521 of the lower air passage 52b, the air valve 53 in the lower air passage 52b comprises a lower sealing member 533 movably arranged in the inner cavity 512, the lower sealing member 533 is arranged at a position for blocking the inner end part of the lower hole 513 through a second elastic element 531, and the lower sealing member 533 is pressed down against the lower air rod 22 to release the blocking of the inner end part of the lower hole 513 when the second elastic element 531 is compressed to move upwards, so that the air valve 53 of the lower air passage 52b is in an open state;
after the jack-up part 223 leaves the lower sealing member 533, the second elastic element 531 pushes the lower sealing member 533 to move upwards to block the inner end of the lower hole 513, so that the air valve 53 can be pushed upwards by the jack-up part 223 to be opened;
the outer peripheral wall of the lower seal 533 is in contact with the inner peripheral wall of the inner chamber 512 to achieve a sliding installation of the lower seal 533 in the inner chamber 512 in the up-down direction; the lower sealing member 533 may be provided with a communicating structure 534, and when the lower sealing member 533 abuts against the bottom wall of the lower end of the inner cavity 512, the lower end of the communicating structure 534 of the lower sealing member 533 is completely staggered from the inner end of the lower hole 513 so as not to communicate with each other; when the lower seal 533 moves upward, the space above the lower seal 533 in the inner chamber 512 communicates with the space below the lower seal 533 through the communication structure 534 on the lower seal 533; the communication structure 534 may be a hole structure or/and a groove structure, that is, the communication structure 534 of the lower seal 533 may be a groove structure formed on the outer peripheral wall of the lower seal 533, or may be a hole structure penetrating between the upper surface and the lower surface of the lower seal 533, or the lower seal 533 may have both a groove structure and a hole structure;
the lower end of the air tap 51 may be further provided with an upper hole 511, the outer end of the upper hole 511 is an outer port 521 of the upper air channel 52a, the inner end of the upper hole 511 is located at the upper top wall of the inner cavity 512, an upper air channel 52a is formed among the upper hole 511, the inner cavity 512 and the side hole 514, the air valve 53 of the upper air channel 52a comprises an upper sealing member 532 movably arranged in the inner cavity 512, the upper sealing member 532 is arranged at a position for blocking the inner end of the upper hole 511 through a second elastic member 531, the upper sealing member 532 is pressed by an external force to compress the second elastic member 531 so as to release blocking of the inner end of the upper hole 511 when moving downwards, so that the air valve 53 of the upper air channel 52a is in an open state, and the outer port 521 of the upper air channel 52a is communicated with the inner port 522;
the second elastic element 531 is located between the upper seal 532 and the lower seal 533, one end of the second elastic element 531 abuts against the lower end of the upper seal 532, and the other end abuts against the upper end of the lower seal 533; the design that the upper sealing member 532 and the lower sealing member 533 share the second elastic member 531 not only can save cost and improve compactness of the structure, but also can promote improvement of sealing effect, because when the upper sealing member 532 moves downwards, the second elastic member 531 is compressed, and accordingly, the second elastic member 531 pushes the lower sealing member 533 downwards to push against the bottom wall of the lower end of the inner cavity 512 with higher pressure, so that sealing effect of the lower sealing member 533 on the inner end of the lower hole 513 is enhanced, and similarly, when the lower sealing member 533 moves upwards, the second elastic member 531 is compressed, and the second elastic member 531 pushes the upper sealing member 532 upwards to push against the top wall of the upper end of the inner cavity 512 with higher pressure, so that sealing effect of the upper sealing member 532 on the inner end of the upper hole 511 is enhanced;
the second elastic element 531 may be, but not limited to, a spring, which may be a cylindrical coil spring, and it should be noted that the upper seal 532 and the lower seal 533 may also be provided with a second elastic element 531 respectively, where one end of the second elastic element 531 corresponding to the upper seal 532 abuts against the inner cavity 512, and the other end abuts against the lower surface of the upper seal 532; one end of the second elastic element 531 corresponding to the lower seal 533 abuts against the inner cavity 512, and the other end abuts against the upper surface of the lower seal 533;
in some examples, as shown in fig. 1, 2, 7 and 8, the supporting unit 1 includes a supporting table 11 and at least two supporting columns 12, the supporting columns 12 are fixedly connected with the supporting table 11 and are located above the supporting table 11, the upper end parts of the supporting columns 12 are upwardly protruded with positioning protrusions 121, positioning grooves 57 matched with the positioning protrusions 121 are formed on the fixture 5, the positioning grooves 57 can be, but are not limited to, U-shaped or semicircular, the cross section of the positioning protrusions 121 can be circular, the upper ends of the positioning protrusions 121 can also be provided with conical guiding structures, the upper ends of the guiding structures are large and the lower ends of the guiding structures are small, each positioning protrusion 121 corresponds to one positioning groove 57, the lower surface of the fixture 5 is contacted with the upper end part of the supporting column 12, and the positioning protrusions 121 are inserted into the corresponding positioning grooves 57; the fixture 5 can be positioned on the supporting unit 1 through the matching of the positioning protrusion 121 and the positioning groove 57;
specifically, the supporting table 11 is provided with four supporting columns 12, four sides of the tool 5 are respectively contacted with top end parts of the four supporting columns 12, and further, middle parts of the four sides of the tool 5 are respectively contacted with the top end parts of the four supporting columns 12, so that the stability of supporting the tool 5 can be improved; of course, three or more support columns 12 may be used, which is not limited in this embodiment.
In some examples, as shown in fig. 4 and 11, the heating assembly 3 includes a heating base 31, a heating plate 32, and a heating element 33 that provides a heat source;
the heating seat 31 is connected with the supporting table 11 in an up-down sliding way, the guide rods 34 can be fixed on the heating seat 31, sliding sleeves 35 corresponding to the guide rods 34 one by one are fixed on the supporting table 11, the guide rods 34 penetrate through the sliding sleeves 35 corresponding to the guide rods downwards, so that the heating seat 31 is mounted on the supporting table 11 in an up-down sliding way, the sliding sleeves 35 can be linear bearings, two guide rods 34 can be arranged at one end of the heating seat 31, two guide rods 34 are arranged at the other end of the heating seat 31, the two guide rods 34 at the same end can be fixedly connected through a connecting plate 36, the mounting stability of the heating seat 31 can be improved, the heating seat 31 is positioned above the supporting table 11, and the connecting plate 36 is positioned below the supporting table 11;
the heating plate 32 is fixedly installed on the heating seat 31; the heating elements 33 are disposed in the heating plate 32, and the heating elements 33 may be electric heating pipes and installed in the heating plate 32 at intervals or equal intervals; side plates 37 are fixed on the heating seat 31 on four sides of the heating plate 32;
the upper surface of the heating plate 32 is arranged opposite to the lower surface of the tooling 5 on the support column 12, and the temperature adjusting unit 4 is arranged below the support table 11;
in order to improve the compactness of the structure and the accuracy of the up-and-down movement of the heating plate 32, the temperature adjusting unit 4 specifically comprises an adjusting motor 41, a driving belt pulley 42, a driven belt pulley 43, a synchronous belt 44, a screw rod 45 and a transmission nut 46, wherein the adjusting motor 41 is fixedly connected with the supporting table 11, the driving belt pulley 42 and the driven belt pulley 43 are both rotationally connected with the supporting table 11, the output end of the adjusting motor 41 is in transmission connection with the driving belt pulley 42, the driving belt pulley 42 is in transmission connection with the driven belt pulley 43 through the synchronous belt 44, the outer diameter of the driving belt pulley 42 is smaller than the outer diameter of the driven belt pulley 43, the speed reduction design is equivalent to the increase of the output torque of the driving belt pulley 42, the transmission nut 46 is fixedly connected with the driven belt pulley 43 coaxially, the upper end of the screw rod 45 is fixedly arranged on the heating seat 31, and the transmission nut 46 is in transmission connection with the screw rod 45 in a threaded manner, so that the adjusting motor 41 drives the driving belt pulley 42 to drive the driven belt pulley 43 to rotate through the synchronous belt 44, and the driven belt pulley 43 drives the transmission nut 46 to rotate, so that the screw rod 45 and the heating seat 31 on the heating plate 32 moves up and down, correspondingly; the adjusting motor 41, the driving belt pulley 42, the driven belt pulley 43, the synchronous belt 44 and the transmission nut 46 can be arranged below the supporting table 11, so that the compactness of the structure is improved;
the upper surface of the heating plate 32 may be a plane, and may be parallel to the lower surface of the tooling 5;
as shown in fig. 11 and 12, the ventilation assembly 2 further includes a gas rod seat 24, the gas rod seat 24 is fixed on the heating plate 32, a sliding hole 241 is formed in the gas rod seat 24, the lower gas rod 22 is in one-to-one correspondence with the gas rod seat 24, the lower gas rod 22 is slidably mounted in the sliding hole 241 of the gas rod seat 24 corresponding to the lower gas rod seat, an inner step surface 242 may be provided at the lower end of the sliding hole 241, the lower gas rod 22 may be provided with an outer step surface 224, the outer step surface 224 is located above the inner step surface 242, one end of the first elastic element 21 abuts against the outer step surface 224, the other end abuts against the inner step surface 242, the upper surface of the gas rod seat 24 may be flush with the upper surface of the heating plate 32, the lower end of the lower gas rod 22 may protrude downward from the sliding hole 241, the lower end of the lower gas rod 22 may be screwed with a pipe joint 25, the pipe joint 25 may be communicated with an external air passage 221 in the lower gas rod 22, and the pipe joint 25 may also abut against the lower end of the gas rod seat 24 to prevent the lower gas rod 22 from being separated upward from the sliding hole 241; the air source or the vacuum mechanism conduit may be in communication with the external air channel 221 via the coupling 25.
The preheating method based on the preheating device for packaging the semiconductor product comprises the following steps:
s1, placing a semiconductor product on the upper surface of a fixture 5, covering the semiconductor product with a film material 54, pressing the film material 54 on the fixture 5 through a cover plate 55, forming a sealing cavity 56 between the upper surface of the fixture 5 and the lower surface of the film material 54, placing the semiconductor product in the sealing cavity 56, placing the fixture 5 on a supporting unit 1, supporting the lower surface of the fixture 5 by the upper end part of a supporting column 12, and inserting a positioning protrusion 121 into a positioning groove 57 corresponding to the positioning protrusion to position the fixture 5 on the supporting unit 1;
the sealing ring 23 of the tooling 5 placed on the support column 12 will prop against the lower end of the air tap 51 corresponding to the air vent assembly 2 where it is located, so that the communication hole 222 of the air vent assembly 2 is in sealing communication with the outer port 521 of the air valve 53 corresponding to it, and the jack-up part 223 props up against the air valve 53 corresponding to the air tap 51 corresponding to the air vent assembly 2 where it is located, so as to push the air valve 53 to an open state, and in this process, the first elastic element 21 will be compressed;
s2, a pressing power assembly 61 of the pressing unit 6 drives a pressing block 62 to move downwards until the pressing block 62 presses the tool 5; the tooling 5 can be flattened, so that micro-deformation of the tooling 5 during preheating is reduced, the semiconductor product is more attached to the tooling 5, the attachment of the lower surface of the tooling 5 to the upper surface of the heating plate 32 is facilitated, and the temperature rising uniformity is improved;
s3, the temperature adjusting unit 4 drives the heating seat 31 and the heating plate 32 on the heating seat to move upwards, so that the upper surface of the heating plate 32 is attached to the lower surface of the tool 5; the heat generated by the operation of the heating element 33 begins to preheat the tooling 5 through the heating plate 32;
meanwhile, the protective gas of the gas source is filled into the sealing cavity 56 through the gas inlet assembly 2a and the gas tap 51 corresponding to the gas inlet assembly 2a, and the protective gas in the sealing cavity 56 can be discharged out of the sealing cavity 56 through the gas tap 51 corresponding to the gas outlet assembly 2b and the gas outlet assembly 2b, so that the real-time atmosphere protection is implemented on the semiconductor product in the tool 5 in the preheating process;
s4, the temperature adjusting unit 4 drives the heating seat 31 and the heating plate 32 on the heating seat to move up and down, and the heating speed of the tool 5 is adjusted by controlling the distance between the heating assembly 3 and the tool 5; in the process of moving the heating plate 32, the first elastic element 21 forces the lower air rod 22 to always prop against the air valve 53 of the air tap 51 corresponding to the ventilation assembly 2 where the lower air rod is located, so that the air valve 53 is pushed to be in an open state, and the whole-process atmosphere protection of the semiconductor product in the tool 5 is realized.
The above-described preferred embodiments according to the present application are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present application. The technical scope of the present application is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. A preheating device for packaging semiconductor products, which is characterized in that: comprising the following steps:
the support unit (1) is used for supporting the tool (5), the tool (5) is provided with an air tap (51) and a sealing cavity (56), and the air tap (51) is fixedly connected with the tool (5) and is communicated with the sealing cavity (56);
the heating ventilation unit comprises a heating component (3) and a ventilation component (2) with an external air passage (221) inside, wherein the heating component (3) is used for heating a tool (5) supported by the supporting unit (1); at least one ventilation assembly (2) is used for introducing gas into the sealing cavity (56), and at least one ventilation assembly (2) is used for discharging gas from the sealing cavity (56), wherein the ventilation assemblies (2) are in one-to-one correspondence with the air nozzles (51);
and the temperature adjusting unit (4) is used for driving the heating assembly (3) to move close to or away from the tool (5) so as to adjust the temperature rising speed of the tool (5), when the tool (5) is supported by the supporting unit (1), the ventilation assembly (2) is communicated with the sealing cavity (56) through the air tap (51) corresponding to the ventilation assembly, and in the process that the temperature adjusting unit (4) drives the heating ventilation unit to move close to or away from the tool (5), the ventilation assembly (2) is kept communicated with the sealing cavity (56) through the air tap (51) corresponding to the ventilation assembly.
2. The preheating device for packaging semiconductor products according to claim 1, wherein: the air tap (51) is internally provided with an air channel (52) and an air valve (53) which is arranged corresponding to the air channel (52), two ends of the air channel (52) are respectively provided with an outer port (521) positioned at the outer side of the air tap (51) and an inner port (522) communicated with the sealing cavity (56), the outer port (521) and the inner port (522) of the air channel (52) where the air valve (53) is positioned are mutually communicated when the air valve (53) is in an open state, and the outer port (521) and the inner port (522) of the air channel (52) where the air valve (53) is positioned are mutually separated when the air valve (53) is in a closed state;
when the tool (5) is placed on the supporting unit (1), the tool (5) presses the ventilation assembly (2) downwards, so that the ventilation assembly (2) pushes the air valve (53) in the corresponding air tap (51) to an open state, and the external air channel (221) of the ventilation assembly (2) is communicated with the external port (521) of the air valve (53) in the corresponding air tap (51) in a sealing way; when the ventilation assembly (2) leaves the air valve (53), the air valve (53) is restored to the closed state.
3. The preheating device for packaging semiconductor products according to claim 2, wherein: the ventilation assembly (2) comprises a lower air rod (22) and a first elastic element (21), the external air channel (221) is located in the lower air rod (22), the lower air rod (22) is vertically and slidably installed on the heating assembly (3), the first elastic element (21) is upwards abutted to the lower air rod (22), and when the tool (5) is placed on the supporting unit (1), the lower air rod (22) is upwards abutted to an air valve (53) in an air tap (51) corresponding to the ventilation assembly (2) where the lower air rod (22) is located, so that the air valve (53) is pushed to be in an open state.
4. The preheating device for packaging semiconductor products according to claim 2, wherein: also comprises a pressing unit (6);
the pressing mechanism comprises a pressing block (62) and a pressing power assembly (61), the pressing power assembly (61) is used for driving the pressing block (62) to move up and down, and the pressing block (62) is located above the tool (5) on the supporting unit (1) and used for pressing the tool (5) downwards.
5. The preheating device for packaging semiconductor products according to claim 4, wherein: each air tap (51) is provided with two air paths (52), namely an upper air path (52 a) and a lower air path (52 b); the outer port (521) of the upper air passage (52 a) is positioned on the side of the upper surface of the tool (5), and the outer port (521) of the lower air passage (52 b) is positioned on the side of the lower surface of the tool (5);
when the tool (5) is placed on the supporting unit (1), the tool (5) presses the ventilation assembly (2) downwards, so that the ventilation assembly (2) pushes an air valve (53) in a lower air passage (52 b) corresponding to the air tap (51) to an open state;
the lower extreme of briquetting (62) has a plurality of shutoff pieces (63), shutoff piece (63) and air cock (51) on frock (5) one-to-one, when briquetting (62) pushed down frock (5), outer port (521) of upper gas circuit (52 a) of shutoff piece (63) covering and sealing with its corresponding air cock (51).
6. A preheating device for packaging semiconductor products according to claim 3, wherein: the upper end part of the lower air rod (22) is provided with a communication hole (222) communicated with the external air channel (221), the upper end part of the lower air rod (22) is provided with a jacking part (223) protruding upwards from the upper end part of the lower air rod (22), the upper end part of the lower air rod (22) is provided with a sealing ring (23) sleeved outside the jacking part (223) and the communication hole (222) at the same time, and the external port (521) is positioned at the lower end part of the air nozzle (51);
when the tool (5) is placed on the supporting unit (1), the sealing ring (23) props against the lower end part of the air tap (51) corresponding to the ventilation assembly (2) where the tool is positioned, so that the communication hole (222) of the ventilation assembly (2) is communicated with the outer port (521) corresponding to the lower end part of the air tap (51) in a sealing way, and the jacking part (223) props against the air valve (53) in the air tap (51) corresponding to the ventilation assembly (2) where the tool is positioned upwards, so that the air valve (53) is pushed to be in an open state.
7. The preheating device for packaging semiconductor products according to claim 6, wherein: the air tap (51) is provided with an inner cavity (512), a lower hole (513) and a side hole (514), the outer end part of the side hole (514) is an inner end part (522), the outer end part of the lower hole (513) is an outer port (521), and the inner end part of the upper hole (511), the inner end part of the side hole (514) and the inner end part of the lower hole (513) are all extended to be communicated with the inner cavity (512);
the air channel (52) formed among the lower hole (513), the inner cavity (512) and the side hole (514) is a lower air channel (52 b), the air valve (53) in the lower air channel (52 b) comprises a lower sealing element (533) movably arranged in the inner cavity (512), the lower sealing element (533) is arranged at a position for blocking the inner end part of the lower hole (513) through a second elastic element (531), and the lower sealing element (533) is downwards pressed against the lower air rod (22) to compress the second elastic element (531) to release the blocking of the inner end part of the lower hole (513) when upwards moving, so that the air valve (53) of the lower air channel (52 b) is in an open state.
8. The preheating device for packaging semiconductor products according to claim 1, wherein: the supporting unit (1) comprises a supporting table (11) and at least two supporting columns (12), the supporting columns (12) are fixedly connected with the supporting table (11) and located above the supporting table (11), positioning protrusions (121) are upwards protruded from the upper end portions of the supporting columns (12), positioning grooves (57) matched with the positioning protrusions (121) are formed in the tool (5), one positioning groove (57) corresponds to each positioning protrusion (121), the lower surface of the tool (5) is in contact with the upper end portions of the supporting columns (12), and the positioning protrusions (121) are inserted into the corresponding positioning grooves (57).
9. The preheating device for packaging semiconductor products according to claim 8, wherein: the heating assembly (3) comprises a heating seat (31), a heating plate (32) and a heating element (33) for providing a heat source;
the heating seat (31) is connected with the supporting table (11) in an up-down sliding mode and is located above the supporting table (11), the heating plate (32) is fixedly installed on the heating seat (31), the heating element (33) is arranged in the heating plate (32), the upper surface of the heating plate (32) is arranged opposite to the lower surface of the tool (5) on the supporting column (12), and the temperature adjusting unit (4) is arranged below the supporting table (11).
10. A preheating method based on the preheating device for packaging semiconductor products according to any one of claims 1 to 9, characterized in that: the method comprises the following steps:
s1, placing a tool (5) for accommodating a semiconductor product in a sealing cavity (56) on a supporting unit (1);
s2, pressing the tool (5) downwards by using the pressing block (62);
s3, the temperature adjusting unit (4) drives the heating assembly (3) of the heating ventilation unit to be attached to the lower surface of the tool (5) to start preheating, and meanwhile, the ventilation assembly (2) for introducing gas into the sealing cavity (56) introduces protective gas into the sealing cavity (56), and the protective gas in the sealing cavity (56) is discharged through the ventilation assembly (2) for discharging the gas from the sealing cavity (56);
s4, adjusting the temperature rising speed of the tool (5) by controlling the distance between the heating assembly (3) and the tool (5); during this process, shielding gas is maintained in and out of the sealed chamber (56).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311231616.5A CN117198940A (en) | 2023-09-21 | 2023-09-21 | Preheating device and preheating method for packaging semiconductor products |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311231616.5A CN117198940A (en) | 2023-09-21 | 2023-09-21 | Preheating device and preheating method for packaging semiconductor products |
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| CN117198940A true CN117198940A (en) | 2023-12-08 |
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| CN202311231616.5A Pending CN117198940A (en) | 2023-09-21 | 2023-09-21 | Preheating device and preheating method for packaging semiconductor products |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117410216A (en) * | 2023-12-15 | 2024-01-16 | 江苏快克芯装备科技有限公司 | Chip packaging system |
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2023
- 2023-09-21 CN CN202311231616.5A patent/CN117198940A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117410216A (en) * | 2023-12-15 | 2024-01-16 | 江苏快克芯装备科技有限公司 | Chip packaging system |
| CN117410216B (en) * | 2023-12-15 | 2024-02-27 | 江苏快克芯装备科技有限公司 | Chip packaging system |
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