CN112582296B - Wafer bonding device and method - Google Patents

Wafer bonding device and method Download PDF

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Publication number
CN112582296B
CN112582296B CN201910935165.0A CN201910935165A CN112582296B CN 112582296 B CN112582296 B CN 112582296B CN 201910935165 A CN201910935165 A CN 201910935165A CN 112582296 B CN112582296 B CN 112582296B
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wafer
positioning
separation
module
cam
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CN112582296A (en
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郭耸
朱鸷
赵滨
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention provides a wafer bonding device and a wafer bonding method, wherein a bearing module is used for bearing a wafer, a plurality of wafer positioning units and a plurality of wafer separation units are circumferentially arranged on the bearing module and are respectively used for clamping the wafer and separating two overlapped wafers, a driving module synchronously drives the wafer positioning units and the wafer separation units to reciprocate along the radial direction of the bearing module according to a set time sequence, and the positioning, clamping and bonding of the wafer can be realized in the wafer bonding device without additional clamps and alignment machines by arranging the time sequences of the wafer positioning units and the wafer separation units, so that the bonding efficiency is improved, the preparation cost is reduced, the whole machine is small in quality, the occupied space is small, the internal structure is compact, and the reliability is high.

Description

Wafer bonding device and method
Technical Field
The present invention relates to the field of semiconductor manufacturing technology, and in particular, to a wafer bonding apparatus and method
Background
The wafer bonding device can combine two wafers with the same material or different materials. At present, two wafers are generally required to be aligned before bonding, and then bonding is performed, so that the process has high requirements on alignment accuracy of the wafers. In the prior art, two wafers are aligned on an alignment machine generally, after alignment is finished, the two aligned wafers are clamped and placed into a bonding machine through a clamp to be bonded, and after bonding is finished, the wafers are sent into a cooling chamber to be cooled. The clamp usually comprises a wafer separating unit and a wafer positioning unit, which respectively realize the functions of preventing two wafers from contacting each other and clamping and fixing the wafers. With the continuous development of the semiconductor industry, a large part of scenes with low alignment requirements exist in bonding application, the bonding application scenes are complicated and complicated by positioning the wafer through the appearance, and the yield is low and the energy consumption is high.
Disclosure of Invention
The invention aims to provide a wafer bonding device and a wafer bonding method, which can realize alignment and bonding in one device, improve the yield and reduce the preparation cost.
In order to achieve the above object, the present invention provides a wafer bonding apparatus, comprising:
the bearing module is used for bearing the wafer;
the auxiliary bonding module comprises a plurality of wafer positioning units and a plurality of wafer separation units, wherein the wafer positioning units and the wafer separation units are arranged along the circumferential direction of the bearing module, the wafer positioning units are used for clamping wafers on the bearing module, and the wafer separation units are used for separating two overlapped wafers on the bearing module;
and the driving module synchronously drives the wafer positioning unit and the wafer separation unit to reciprocate along the radial direction of the bearing module according to a set time sequence so as to finish positioning and clamping of the wafer.
Optionally, the auxiliary bonding module at least comprises three wafer separation units and three wafer positioning units.
Optionally, the wafer separation units are uniformly arranged along the circumferential direction of the bearing module, and the wafer positioning units are uniformly arranged along the circumferential direction of the bearing module.
Optionally, the driving module comprises a driving assembly and a cam assembly, the cam assembly comprises a positioning driving cam and a separation driving cam which are coaxially arranged, and the driving assembly drives the positioning driving cam and the separation driving cam to synchronously rotate;
the positioning driving cam is used for driving the wafer positioning unit to move along the radial direction of the bearing module, and the separation driving cam is used for driving the wafer separation unit to move along the radial direction of the bearing module.
Optionally, the positioning drive cam and the separation drive cam have a set rotation angle.
Optionally, the outer contour lines of the separation driving cam and the positioning driving cam are triangular cams.
Optionally, the rotation speeds of the positioning driving cam and the separating driving cam are 5-10 revolutions/min.
Optionally, the drive assembly includes vacuum motor and turbine worm structure, turbine worm structure includes engaged with turbine and worm, vacuum motor's pivot with the worm is connected, the turbine with separate drive cam with the coaxial setting of location drive cam, the vacuum motor drive when the worm rotates, drive separate drive cam with the location drive cam synchronous rotation.
Optionally, the torque of the vacuum motor is smaller than 2N.m, and the speed ratio of the turbine worm structure is larger than 1:50.
Optionally, the driving assembly includes a vacuum motor, the separation driving cam and the positioning driving cam are sleeved outside a rotating shaft of the vacuum motor, and the vacuum motor directly drives the separation driving cam and the positioning driving cam to synchronously rotate.
Optionally, the torque of the vacuum motor is greater than or equal to 2n·m.
Optionally, the wafer positioning unit includes a positioning bracket and a positioning thimble, one end of the positioning thimble is arranged at the top of the positioning bracket, and the other end extends out of the positioning bracket and points to the radial direction of the bearing module; the wafer separation unit comprises a separation bracket and a separation sheet, one end of the separation sheet is arranged at the top of the separation bracket, and the other end of the separation sheet extends out of the separation bracket and points to the radial direction of the bearing module.
Optionally, the one end of the positioning thimble is connected with the positioning bracket through a damping structure.
Optionally, the positioning support and the separation support are both arranged on a linear guide rail, the linear guide rail is arranged along the radial direction of the bearing module, one end of the linear guide rail, which is far away from the center of the bearing module, corresponds to a zero position, and one end, which is close to the center of the bearing module, corresponds to a working position.
Optionally, the locating support with all be provided with an induction piece on the separation support, be provided with the inductor on the linear guide rail working position, the locating support or the separation support is followed corresponding linear guide rail from the zero position and is moved to when the inductor inducted the induction piece, the location thimble or the separation piece reaches the working position, the inductor sends out the signal of putting in place.
Optionally, a return spring is further connected between the positioning support and the corresponding linear guide rail, when the positioning thimble or the separation sheet is at the zero position, the return spring is in a stretched state, and when the positioning support or the separation support moves from the zero position to the working position along the corresponding linear guide rail, the return spring is restored to the natural state.
Optionally, the wafer bonding device further includes a vacuum chamber, and the carrying module, the auxiliary bonding module and the driving module are all located in the vacuum chamber.
The invention also provides a method for bonding wafers by using the wafer bonding device, which comprises the following steps:
in a first time period, the wafer positioning unit and the wafer separation unit are both in zero positions, and a first wafer is placed on the bearing module;
in a second time period, the wafer separation unit moves from a zero position to a working position;
in a third time period, the wafer positioning unit moves from a zero position to a working position and clamps the first wafer;
in a fourth time period, placing a second wafer on the bearing module, and separating the first wafer from the second wafer by the wafer separation unit and preparing the conditions required by bonding;
in a fifth time period, the wafer separation unit moves from a working position to a zero position;
bonding the first wafer and the second wafer in a sixth time period;
in a seventh time period, the wafer positioning unit moves from the working position to the zero position.
Optionally, the conditions required for bonding include a vacuum environment within the vacuum chamber, a temperature within the vacuum chamber, and vacuum adsorption of the first wafer by the carrier module.
Optionally, the second period of time is equal to the fifth period of time, and the third period of time is equal to the seventh period of time.
Optionally, the cam assembly of the driving module includes a positioning driving cam and a separating driving cam that are coaxially disposed, and in the first time period to the seventh time period, the angle through which the positioning driving cam and the separating driving cam rotate is (360/n) °, where n is the number of the wafer positioning units or the wafer separating units.
In the wafer bonding device and the wafer bonding method provided by the invention, the bearing module is used for bearing the wafer, the bearing module is circumferentially provided with the plurality of wafer positioning units and the plurality of wafer separation units which are respectively used for clamping the wafer and separating and overlapping two wafers, the driving module synchronously drives the wafer positioning units and the wafer separation units to reciprocate along the radial direction of the bearing module according to a set time sequence, and the positioning, clamping and bonding of the wafer can be realized in the wafer bonding device without additional clamps and alignment machines by setting the time sequence of the wafer positioning units and the wafer separation units, so that the bonding efficiency is improved, the preparation cost is reduced, the whole machine is small in quality, the occupied space is small, the internal structure is compact, and the reliability is high.
Drawings
Fig. 1 is a schematic structural diagram of a wafer bonding apparatus according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a distribution of auxiliary bonding modules according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating another exemplary structure of a wafer bonding apparatus according to a first embodiment of the present invention;
FIG. 4a is a schematic diagram of a wafer positioning unit in a zero position according to an embodiment of the present invention;
FIG. 4b is a schematic diagram of a wafer separation unit in a zero position according to an embodiment of the present invention;
FIG. 5a is a schematic diagram of a wafer positioning unit in a working position according to a first embodiment of the present invention;
FIG. 5b is a schematic diagram of a wafer separation unit in a working position according to a first embodiment of the present invention;
fig. 6 is a schematic structural diagram of a driving module of a wafer bonding apparatus according to an embodiment of the present invention;
FIG. 7 is a schematic view illustrating a set rotation angle between a positioning driving cam and a separating driving cam of a wafer bonding apparatus according to a first embodiment of the present invention;
FIG. 8 is a flowchart of a wafer bonding method according to a first embodiment of the present invention;
FIG. 9 is a timing diagram illustrating operation of the wafer positioning unit and the wafer separation unit according to the first embodiment of the present invention;
fig. 10 is a schematic structural diagram of a wafer bonding apparatus according to a second embodiment of the present invention;
fig. 11 is a schematic structural diagram of a driving module of a wafer bonding apparatus according to a second embodiment of the present invention;
wherein, the reference numerals are as follows:
00-wafer; 01-notch; 10-vacuum chamber; a 101-interface assembly; 20-a carrier module; 30-an auxiliary bonding module; 301-a wafer positioning unit; 3011-positioning a thimble; 3012-positioning a bracket; 3013-a damping structure; 302-wafer separation units; 3021-separating sheets; 3022-separating the stents; 303-linear guide rail; 304-a return spring; 401-an inductor; 402-sensing a piece; 50-a drive module; 501-a vacuum motor; 502-a worm gear structure; 5021-turbine; 5022-worm; 503-positioning a drive cam; 504-separate drive cams; 505-coupling.
Alpha-setting a rotation angle; t1-a first period of time; t2-a second time period; t3-a third time period; t4-fourth time period; t5-fifth time period; t6-sixth time period; t7-seventh time period.
Detailed Description
Specific embodiments of the present invention will be described in more detail below with reference to the drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Example 1
Referring to fig. 1-3, the present embodiment provides a wafer bonding apparatus, including:
a carrying module 20 for carrying a wafer 00;
the auxiliary bonding module 30 comprises a plurality of wafer positioning units 301 and a plurality of wafer separation units 302 which are arranged along the circumferential direction of the bearing module 20, wherein the wafer positioning units 301 are used for clamping the wafers 00 on the bearing module 20, and the wafer separation units 302 are used for separating two overlapped wafers 00 on the bearing module 20;
the driving module 50 synchronously drives the wafer positioning unit 301 and the wafer dividing unit 302 to reciprocate along the radial direction of the carrying module 20 according to a set time sequence, so as to complete positioning and clamping of the wafer 00.
Specifically, as shown in fig. 1, the wafer bonding apparatus has a vacuum chamber (only a lower cavity of the vacuum chamber is schematically shown in fig. 1), an interface component 101 is disposed on a sidewall of the vacuum chamber, and the interface component 101 is, for example, an interface of a gas path, a water path and a circuit, and may be used as a transmission path of a vacuum pipeline, a compressed air pipeline, a cooling water pipeline and a cable pipeline (cables such as a motor, a sensor, and a heating wire of a heating disc). Each interface can be connected with the vacuum cavity through a pipeline flange and a sealing ring so as to ensure the sealing performance of the vacuum cavity.
As shown in fig. 1-3, in this embodiment, the carrying module 20, the auxiliary bonding module 30 and the driving module 50 are all disposed in the vacuum chamber. The carrier module 20 is a carrier for carrying the wafer 00, and has a vacuum adsorption chamber (not shown) therein for performing vacuum adsorption on the wafer 00. It should be understood that the vacuum chamber also has a component for bonding, such as a bonding head, etc., and the component for bonding may be any of the prior art, and the present invention is not limited.
Further, as shown in fig. 2, the auxiliary bonding die 30 has three wafer positioning units 301 and three wafer dividing units 302. The wafer 00 has a notch 01 (notch) on the wafer edge for positioning, and two wafer positioning units 301 clamp two positions on the wafer 00 to limit the wafer 00 from moving horizontally, and the other wafer positioning unit 301 aligns with the notch 01 on the wafer 00 to limit the wafer 00 from rotating horizontally. Since the wafer 00-level bonding is to bond two wafers 00 together, the two wafers 00 overlapped in the vertical direction cannot contact each other before the bonding preparation is completed, in this embodiment, the three wafer dividing units 302 divide the two wafers overlapped on the carrier module 20, so that the crystal faces of the two wafers do not have any contact portion.
Optionally, the three wafer positioning units 301 are uniformly distributed along the circumferential direction of the carrier module 20, and the three wafer separation units 302 are uniformly distributed along the circumferential direction of the carrier module 20, so that the capability of clamping or separating the wafer 00 is more stable and easier to control. Of course, the wafer positioning units 301 and the wafer dividing units 302 may also be unevenly distributed along the circumference of the carrier module 20, which is not limited by the present invention.
It should be understood that in other embodiments, the wafer 00 may also have no notch 01, and the wafer positioning unit 301 may be directly used to clamp three positions on the wafer 00. In addition, the number of the wafer positioning units 301 and the wafer dividing units 302 in the present invention is not limited to three, but may be 4, 5, or 6, and when the number of the notches 01 on the wafer 00 is two, the number of the wafer positioning units 301 may be even two.
As shown in fig. 3, the wafer positioning unit 301 includes a positioning support 3012 and positioning pins 3011, one end of each positioning pin 3011 is disposed at the top of the corresponding positioning support 3012, and the other end extends out of the corresponding positioning support 3012 and points to the radial direction of the carrier module 20 (also the radial direction of the wafer); the wafer separation unit 302 includes a separation bracket 3022 and a separation sheet 3021, wherein one end of the separation sheet 3021 is disposed at the top of the separation bracket 3022, and the other end extends out of the separation bracket 3022 and points to the radial direction of the carrier module 20; the positioning pins 3011 and the separating plate 3021 are used for clamping and separating a wafer, respectively. In this embodiment, the positioning support 3012 is connected to one end of the positioning pin 3011 by a damping structure 3013, where the damping structure 3013 is, for example, a spring, so as to buffer an impact force generated by the positioning pin 3011 on the wafer when the positioning pin clamps the wafer.
With continued reference to fig. 3, in order to facilitate the reciprocal movement of the wafer positioning unit 301 and the wafer dividing unit 302 along the radial direction of the carrier module 20, in this embodiment, the positioning support 3012 and the dividing support 3022 are both disposed on a linear guide 303, the linear guide 303 is disposed along the radial direction of the carrier module 20, and the positioning support 3012 and the dividing support 3022 can be driven by the driving module 50 to reciprocate along the linear guide 303, so that the positioning pins 3011 and the dividing sheets 3021 are located at different positions along the radial direction of the carrier module 20. For convenience of description, as shown in fig. 4a and 4b, an end of the linear guide 303 away from the center of the carrier module 20 corresponds to a zero position, that is, when the positioning support 3012 or the separating support 3022 moves along the linear guide 303 to an end away from the wafer 00, the positioning pins 3011 and the separating sheet 3021 are in a zero position, and at this time, the positioning pins 3011 and the separating sheet 3021 are not in contact with the wafer, and do not clamp or separate the wafer. As shown in fig. 5a and 5b, the end of the linear guide 303 near the center of the carrier module 20 corresponds to a working position, that is, when the positioning support 3012 or the separating support 3022 moves along the linear guide 303 to near the end of the wafer, the positioning pins 3011 and the separating sheet 3021 are in the working position, and at this time, the positioning pins 3011 push against the edge (or notch) of the wafer to clamp the wafer, and the separating sheet 3021 is located above the wafer carried by the carrier module 20.
As shown in fig. 3, a return spring 304 is further connected between the positioning support 3012 and the corresponding linear guide rail 303, when the positioning thimble 3011 or the separation sheet 3021 is at the zero position, the return spring 304 is in a stretched state, and when the positioning support 3012 or the separation support 3022 moves from the zero position to the working position along the corresponding linear guide rail 303, the return spring 304 is restored to the natural state, and based on this, when the positioning support 3012 or the separation support 3022 moves from the zero position to the working position, the return spring 304 can be relied on to return to the working position, and when the positioning support 3012 or the separation support 3022 moves from the working position to the zero position, the tension of the return spring 304 needs to be overcome.
Optionally, the positioning support 3012 and the separation support 3022 are both provided with an induction piece 402, the working position of the linear guide 303 is provided with an inductor 401, when the positioning support 3012 or the separation support 3022 moves from a zero position to the sensor 401 along the corresponding linear guide 303 to induce the induction piece 402, the positioning thimble 3011 or the separation piece 3021 reaches the working position, and the sensor 401 sends out a signal in place. For example, when the sensors 401 corresponding to the three wafer positioning units 301 each send out an in-place signal, it indicates that the wafer has been successfully clamped, and the next process may be performed. In this embodiment, the sensor 401 is a position switch.
With continued reference to fig. 3, the wafer positioning unit 301 and the wafer dividing unit 302 are synchronously driven by one of the driving modules 50. Specifically, referring to fig. 6, the driving module 50 includes a driving assembly and a cam assembly, and the driving assembly is used for driving the cam assembly to rotate. Specifically, the driving assembly includes a vacuum motor 501 and a worm gear structure 502, the worm gear structure 502 includes a worm gear 5021 and a worm 5022 that are meshed with each other, a rotating shaft of the vacuum motor 501 is connected with the worm 5022 through a coupling 505, and when the vacuum motor 501 is turned on, the worm 5022 drives the worm gear 5021 to start rotating. The cam assembly comprises a separation driving cam 504 and a positioning driving cam 503, the turbine 5021 is coaxially arranged with the separation driving cam 504 and the positioning driving cam 503, and when the turbine 5021 rotates, the separation driving cam 504 and the positioning driving cam 503 are driven to synchronously rotate.
The positioning brackets 3012 of the three wafer positioning units 301 may be respectively connected to the edges of the positioning driving cams 503 by a cam roller, when the positioning driving cams 503 rotate, the three positioning brackets 3012 may move along the linear guide 303 synchronously, the separating brackets 3022 of the three wafer separating units 302 may be respectively connected to the edges of the separating driving cams 504 by a cam roller, and when the separating driving cams 504 rotate, the three separating brackets 3022 may move along the linear guide 303 synchronously. It will be appreciated that each of the cam rollers is always in contact with either the positioning drive cam 503 or the partition drive cam 504 to translate the profile of either the positioning drive cam 503 or the partition drive cam 504 into linear motion of either the positioning frame 3012 or the partition frame 3022
Further, as shown in fig. 7, in this embodiment, the separation driving cam 504 and the positioning driving cam 503 are both triangular cams, for example, regular triangular cams, that is, the outer profiles of the separation driving cam 504 and the positioning driving cam 503 are both regular triangles. By way of example, the positioning driving cam 503 is disc-shaped and has three protruding parts (the top of which can be seen as triangle), the three protruding parts are connected by a gentle part (the side of which can be seen as triangle), the positioning driving cam 503 is always in a rotating state during operation, when the positioning support 3012 is in contact with the gentle part of the positioning driving cam 503, the positioning support 3012 is not moved, the positioning ejector pin 3011 is always in an operating position, the positioning driving cam 503 continues to rotate until the positioning support 3012 starts to move along a direction away from the wafer along the linear guide 303 when the positioning support 3012 moves from the gentle part to the protruding part, until the positioning support 3012 is in contact with the protruding part of the positioning driving cam 503, the positioning ejector pin 3011 reaches a zero position, the top of the protruding part has a certain width, when the positioning driving cam 503 continues to rotate, the positioning support 3012 does not move, the positioning ejector pin 3011 also can be kept in the zero position for a period, when the positioning support 3012 moves from the gentle part until the protruding part moves from the lower support 3012 to the protruding part until the linear guide 3012 moves back to the linear guide 3012, and the positioning driving cam 3011 moves along the direction until the linear guide 3011 moves back to the direction when the positioning support 3012 moves back to the linear guide when the movement is performed. Further, since the outer contour of the positioning driving cam 503 is a regular triangle, the three positioning brackets 3012 can be moved synchronously (synchronously moved toward each other or synchronously moved away from each other).
Of course, the outer contours of the dividing driving cam 504 and the positioning driving cam 503 in the present invention are not limited to regular triangles, and when the number of the wafer positioning units 301 or the wafer dividing units 302 is n, the outer contours of the dividing driving cam 504 and the positioning driving cam 503 are regular n-sided shapes. Also, when the wafer positioning units 301 or the wafer dividing units 302 are not uniformly distributed in the circumferential direction of the carrier module 20, the outer profile lines of the dividing driving cams 504 and the positioning driving cams 503 are not regular polygons, but the positions of the protrusions are designed according to the positions of the wafer positioning units 301 or the wafer dividing units 302.
It should be appreciated that the divider drive cam 504 drives the divider support 3022 in the same manner as the positioning drive cam 503 drives the positioning support 3012, but that the positioning drive cam 503 and the divider drive cam 504 have a set rotational angle α (or may be understood as the phase angle between the positioning drive cam 503 and the divider drive cam 504) such that the actions of the wafer positioning unit 301 and the wafer dividing unit 302 are not synchronized, but have a set timing. It can be seen that the wafer positioning unit 301 and the wafer dividing unit 302 can reciprocate along the radial direction of the carrier module 20 according to the set time sequence by the positioning driving cam 503 and the dividing driving cam 504 which are coaxially arranged, so as to complete positioning and clamping of the wafer.
Further, as shown in fig. 1 and 3, the vacuum motor 501 in this embodiment is of a small torque type (torque less than 2n·m) due to the space limitation in the vacuum chamber. The positioning driving cam 503 and the separating driving cam 504 need to overcome the tension of the return spring 304 during operation, so in this embodiment, the speed ratio is selected to be greater than 1: the worm wheel 5021 worm 5022 assembly of the driving module 50 is driven, so that the wafer positioning unit 301 and the wafer separating unit 302 can be synchronously driven even though the torque of the vacuum motor 501 is small, and the occupied space of the whole driving module 50 is small.
In order to prove that the driving module 50 designed in this embodiment is sufficient for driving the wafer positioning unit 301 and the wafer dividing unit 302 synchronously, the rotational speeds of the positioning driving cam 503 and the dividing driving cam 504 are set to be 5-10 rpm, so that the wafer positioning unit 301 and the wafer dividing unit 302 can be considered to move on the linear guide 303 at a constant speed, so that the positioning driving cam 503 and the dividing driving cam 504 only need to overcome the tension of the return spring 304, and the return spring 304 with a spring constant k of 0.25N/mm is selected according to practical situations, the maximum displacement amount is 28mm, and the practical displacement amount is about 20-25 mm. According to Hokko's law: the pulling force f=kx, x is the displacement of the return springs 304, and each return spring 304 generates a pulling force of at most 6.25N, and the driving module 50 is operated with at most three return springs 304 simultaneously, and the maximum pressure angle of the positioning driving cam 503 and the separating driving cam 504 is about 35 °, so that the driving module 50 needs to overcome the pulling force of at least about 23N. In the present embodiment, the vacuum motor 501 and the worm 5021 and worm 5022 assembly have the maximum speed ratio to output 100N force, so the requirement is satisfied.
Of course, if the number of the wafer positioning units 301 and the wafer dividing units 302, and the types of the return springs 304 are changed, the specification of the vacuum motor 501 and the speed ratio of the worm 5021 and worm 5022 assembly can be adjusted accordingly, which is not illustrated here.
Based on this, as shown in fig. 8, the present embodiment further provides a wafer bonding method using the wafer bonding apparatus, including:
step S1: in a first time period, the wafer positioning unit and the wafer separation unit are both in zero positions, and a first wafer is placed on the bearing module;
step S2: in a second time period, the wafer separation unit moves from a zero position to a working position;
step S3: in a third time period, the wafer positioning unit moves from a zero position to a working position and clamps the first wafer;
step S4: in a fourth time period, placing a second wafer on the bearing module, and separating the first wafer and the second wafer by the wafer separation unit and preparing the bonding required conditions;
step S5: in a fifth time period, the wafer separation unit moves from a working position to a zero position;
step S6: bonding the first wafer and the second wafer in a sixth time period;
step S7: in a seventh time period, the wafer positioning unit moves from the working position to the zero position.
Specifically, as shown in fig. 2, 3, 6 and 9, the time for the wafer positioning unit 301 to move from the zero position to the working position or from the working position to the zero position is equal to the time for the positioning driving cam 503 to rotate by 24 ° and the time for the wafer separating unit 302 to move from the zero position to the working position or from the working position to the zero position is equal to the time for the separating driving cam 504 to rotate by 24 ° at the set rotation angle between the positioning driving cam 503 and the separating driving cam 504 of 24 °.
The wafer positioning unit 301 and the wafer dividing unit 302 reciprocate one cycle at a time from the zero position to the working position, and the positioning driving cam 503 and the dividing driving cam 504 rotate by 120 ° in one cycle.
First, the first period T1 is the last 12 ° (-12 ° -0 °) of the previous period, and in the first period T1, the positioning driving cam 503 and the dividing driving cam 504 rotate 12 °, at this time, the wafer positioning unit 301 and the wafer dividing unit 302 are both in zero positions, and in the first period T1, the first wafer is placed on the carrier module 20.
Next, the second period T2 (0 ° -24 °) is entered, and in the second period T2, the positioning driving cam 503 and the dividing driving cam 504 are rotated by 24 °, at this time, the wafer positioning unit 301 is maintained at the zero position, and the wafer dividing unit 302 is moved from the zero position to the working position.
Next, the third period T3 (24 ° -36 °) is entered, and in the third period T3, the positioning driving cam 503 and the dividing driving cam 504 are rotated by 12 °, at this time, the wafer dividing unit 302 is maintained at the operating position, and the wafer positioning unit 301 moves from the zero position to the operating position and holds the first wafer.
Next, the fourth period T4 (36 ° -54 °) is entered, in the fourth period T4, the positioning driving cam 503 and the separating driving cam 504 rotate 18 °, at this time, the second wafer is placed on the carrier module 20 and is ready for bonding, and since the wafer separating unit 302 and the wafer positioning unit 301 are both kept in the working position, the first wafer is held by the wafer positioning unit 301, and the second wafer and the first wafer are also separated by the wafer separating unit 302, the alignment work of the first wafer and the second wafer can be performed, and after the alignment is completed, the carrier module 20 can fix the first wafer by adsorption, and then vacuum the vacuum chamber and raise the temperature in the vacuum chamber, so that the vacuum chamber satisfies the conditions required for bonding.
Next, the fifth period T5 (54 ° to 78 °) is entered, and in the fifth period T5, the positioning driving cam 503 and the dividing driving cam 504 are rotated by 12 °, at this time, the wafer positioning unit 301 is held at the operating position, the wafer dividing unit 302 is moved from the operating position to the zero position, and the first wafer and the second wafer are brought into contact and pre-bonding is possible.
Next, the sixth time period T6 (78 ° -96 °) is entered, and in the sixth time period T6, the positioning driving cam 503 and the dividing driving cam 504 are rotated by 18 °, at this time, the wafer positioning unit 301 is held at the operating position, the wafer dividing unit 302 is held at the zero position from the operating position, and the first wafer and the second wafer perform the wafer level bonding process.
Next, the seventh time period T7 (96 ° -108 °) is entered, and in the seventh time period T7, the positioning driving cam 503 and the dividing driving cam 504 are rotated by 12 °, at this time, the wafer dividing unit 302 is kept at the zero position, and the wafer positioning unit 301 is moved from the operating position to the zero position.
The remaining 12 ° of the cycle may be used as the first time period for the next cycle, during which time the bonded wafer may be removed and a new first wafer placed, starting the next cycle. Therefore, the positioning driving cam 503 and the separating driving cam 504 in the application are always in an operating state, different procedures are executed in different angle ranges, the bonding efficiency is very high, the positioning driving cam 503 and the separating driving cam 504 do not need to be driven separately, at least 50% of parts are reduced, the occupied space is small, and the structure is very stable.
It should be understood that the setting rotation angle between the positioning drive cam 503 and the partition drive cam 504 in the present invention is not limited to 24 °, and the time of the first to seventh time periods T1 to T7 is not limited to the rotation angle listed above, and may be set according to actual requirements as long as the pressure angle, the time of loading and unloading, and the time required for bonding of the positioning drive cam 503 and the partition drive cam 504 are satisfied.
Of course, in the present embodiment, since the number of the wafer positioning units 301 and the wafer dividing units 302 is three, the angle by which the positioning driving cam 503 and the dividing driving cam 504 rotate is 120 ° in the first to seventh time periods, that is, one rotation period is 120 °, but it is understood that when the number of the wafer positioning units 301 or the wafer dividing units 302 is not three, the angle by which the positioning driving cam 503 and the dividing driving cam 504 rotate is (360/n) ° in the first to seventh time periods, where n is the number of the wafer positioning units 301 or the wafer dividing units 302.
Example two
As shown in fig. 10 and 11, the vacuum motor 501 in the present embodiment is of a large torque type (torque is 2n·m or more) unlike the first embodiment.
Specifically, as shown in fig. 11, the rotation axes of the separation driving cam 504 and the positioning driving cam 503 are directly connected with the rotation axis of the vacuum motor 501 through a coupling 505, and the vacuum motor 501 may directly drive the separation driving cam 504 and the positioning driving cam 503 to rotate synchronously. Compared with the embodiment, the embodiment has no worm and gear structure 502, which further reduces the number of parts, but occupies more space vertically, and is suitable for the scene with enough space in the vacuum chamber.
It should be understood that, in addition to the above-described structure, the driving module 50 further includes components such as a motor direct part, a cam base part, a bearing part, etc., which may be configured and added according to practical situations, and will not be described in detail herein.
In summary, in the wafer bonding device and method provided by the embodiment of the invention, the carrying module is used for carrying a wafer, the carrying module is circumferentially provided with a plurality of wafer positioning units and a plurality of wafer separation units, which are respectively used for clamping the wafer and separating two overlapped wafers, the driving module synchronously drives the wafer positioning units and the wafer separation units to reciprocate along the radial direction of the carrying module according to a set time sequence, and the positioning, clamping and bonding of the wafer can be realized in the wafer bonding device without additional clamps and alignment machines by setting the time sequences of the wafer positioning units and the wafer separation units, so that the bonding efficiency is improved, the preparation cost is reduced, the whole machine is small in quality, the occupied space is small, the internal structure is compact, and the reliability is high.
The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the invention without departing from the scope of the technical solution of the invention, and the technical solution of the invention is not departing from the scope of the invention.

Claims (20)

1. A wafer bonding apparatus, comprising:
the bearing module is used for bearing the wafer;
the auxiliary bonding module comprises a plurality of wafer positioning units and a plurality of wafer separation units, wherein the wafer positioning units and the wafer separation units are arranged along the circumferential direction of the bearing module, the wafer positioning units are used for clamping wafers on the bearing module, and the wafer separation units are used for separating two overlapped wafers on the bearing module;
the driving module synchronously drives the wafer positioning unit and the wafer separation unit to reciprocate along the radial direction of the bearing module according to a set time sequence so as to finish positioning and clamping of a wafer;
the driving module comprises a driving assembly and a cam assembly, the cam assembly comprises a positioning driving cam and a separation driving cam which are coaxially arranged, and the driving assembly drives the positioning driving cam and the separation driving cam to synchronously rotate;
the positioning driving cam is used for driving the wafer positioning unit to move along the radial direction of the bearing module, and the separation driving cam is used for driving the wafer separation unit to move along the radial direction of the bearing module.
2. The wafer bonding apparatus of claim 1, wherein the auxiliary bonding die block comprises at least three of the wafer dividing units and three of the wafer positioning units.
3. The wafer bonding apparatus according to claim 1 or 2, wherein the wafer dividing units are uniformly arranged along a circumferential direction of the carrier module, and the wafer positioning units are uniformly arranged along the circumferential direction of the carrier module.
4. The wafer bonding apparatus of claim 1, wherein the positioning drive cam and the separation drive cam have a set rotational angle.
5. The wafer bonding apparatus of claim 1, wherein the separation drive cam and the positioning drive cam are both triangular cams.
6. The wafer bonding apparatus of claim 1, wherein the rotational speed of the positioning drive cam and the dividing drive cam is between 5 rpm and 10 rpm.
7. The wafer bonding apparatus of claim 1, wherein the drive assembly comprises a vacuum motor and a worm and worm gear structure, the worm and worm gear structure comprising a worm gear and a worm engaged with each other, a shaft of the vacuum motor being connected to the worm, the worm gear being coaxially disposed with the separation drive cam and the positioning drive cam, the vacuum motor driving the worm to rotate, thereby driving the separation drive cam and the positioning drive cam to rotate synchronously.
8. The wafer bonding apparatus of claim 7, wherein a torque of the vacuum motor is less than 2N-m and a speed ratio of the worm gear structure is greater than 1:50.
9. The wafer bonding apparatus of claim 1, wherein the drive assembly comprises a vacuum motor, the separation drive cam and the positioning drive cam are sleeved outside a rotating shaft of the vacuum motor, and the vacuum motor directly drives the separation drive cam and the positioning drive cam to synchronously rotate.
10. The wafer bonding apparatus of claim 9, wherein a torque of the vacuum motor is greater than or equal to 2N-m.
11. The wafer bonding apparatus according to claim 1, wherein the wafer positioning unit comprises a positioning bracket and a positioning thimble, one end of the positioning thimble is arranged at the top of the positioning bracket, and the other end extends out of the positioning bracket and points to the radial direction of the bearing module; the wafer separation unit comprises a separation bracket and a separation sheet, one end of the separation sheet is arranged at the top of the separation bracket, and the other end of the separation sheet extends out of the separation bracket and points to the radial direction of the bearing module.
12. The wafer bonding apparatus of claim 11, wherein the one end of the positioning pin is coupled to the positioning bracket via a damping structure.
13. The wafer bonding apparatus of claim 11, wherein the positioning support and the separation support are both disposed on a linear guide rail, the linear guide rail is disposed along a radial direction of the carrier module, and one end of the linear guide rail away from a center of the carrier module corresponds to a zero position and one end of the linear guide rail close to the center of the carrier module corresponds to a working position.
14. The wafer bonding apparatus of claim 13, wherein the positioning support and the separation support are each provided with an inductive piece, the linear guide rail is provided with an inductor in a working position, and the positioning support or the separation support moves from a zero position along a corresponding linear guide rail to the inductor to induce the inductive piece, the positioning thimble or the separation piece reaches the working position, and the inductor sends out an in-place signal.
15. The wafer bonding apparatus of claim 13, wherein a return spring is further connected between the positioning support and the corresponding linear guide rail, the return spring being in a stretched state when the positioning pins or the separating plates are in a zero position, the positioning support or the separating support being returned to a natural state when the positioning support or the separating plates move from the zero position to a working position along the corresponding linear guide rail.
16. The wafer bonding apparatus of claim 1, further comprising a vacuum chamber, wherein the carrier module, the auxiliary bonding module, and the drive module are all located within the vacuum chamber.
17. A method of wafer bonding using the wafer bonding apparatus of any of claims 1-16, comprising:
in a first time period, the wafer positioning unit and the wafer separation unit are both in zero positions, and a first wafer is placed on the bearing module;
in a second time period, the wafer separation unit moves from a zero position to a working position;
in a third time period, the wafer positioning unit moves from a zero position to a working position and clamps the first wafer;
in a fourth time period, placing a second wafer on the bearing module, and separating the first wafer from the second wafer by the wafer separation unit and preparing the conditions required by bonding;
in a fifth time period, the wafer separation unit moves from a working position to a zero position;
bonding the first wafer and the second wafer in a sixth time period;
in a seventh time period, the wafer positioning unit moves from the working position to the zero position.
18. The wafer bonding method of claim 17, wherein the conditions required for bonding include a vacuum environment within a vacuum chamber, a temperature within a vacuum chamber, and the carrier module vacuum adsorbing the first wafer.
19. The wafer bonding method of claim 17, wherein the second time period is equal to the fifth time period and the third time period is equal to the seventh time period.
20. The wafer bonding method of claim 17, wherein the cam assembly of the drive module comprises a positioning drive cam and a dividing drive cam coaxially disposed, the positioning drive cam and the dividing drive cam rotating through an angle of (360/n) ° in the first to seventh time periods, wherein n is the number of the wafer positioning units or the wafer dividing units.
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CN106340524A (en) * 2015-07-15 2017-01-18 上海微电子装备有限公司 Wafer bonding method
CN109003932A (en) * 2017-06-06 2018-12-14 苏斯微技术光刻有限公司 For handling the system and the relevant technologies of the substrate pair of alignment
CN110053289A (en) * 2019-05-14 2019-07-26 苏州美图半导体技术有限公司 Vacuum glue bonder

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Publication number Priority date Publication date Assignee Title
JP2004207436A (en) * 2002-12-25 2004-07-22 Ayumi Kogyo Kk Wafer prealignment method and its device, and wafer bonding method and its device
CN106340524A (en) * 2015-07-15 2017-01-18 上海微电子装备有限公司 Wafer bonding method
CN109003932A (en) * 2017-06-06 2018-12-14 苏斯微技术光刻有限公司 For handling the system and the relevant technologies of the substrate pair of alignment
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