TW201619080A - Method for cutting of bonded substrate - Google Patents
Method for cutting of bonded substrate Download PDFInfo
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- TW201619080A TW201619080A TW104132440A TW104132440A TW201619080A TW 201619080 A TW201619080 A TW 201619080A TW 104132440 A TW104132440 A TW 104132440A TW 104132440 A TW104132440 A TW 104132440A TW 201619080 A TW201619080 A TW 201619080A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H7/00—Marking-out or setting-out work
- B25H7/04—Devices, e.g. scribers, for marking
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract
Description
本發明係關於一種接合基板之切割方法，更詳細而言，本發明係關於一種利用雷射對液晶基板等進行劃線切割時，不僅能夠最大限度減小基板之無用部分即形成有密封層之虛設部，且能夠獲得平滑之切割面之接合基板之切割方法。 The present invention relates to a method of cutting a bonded substrate. More specifically, the present invention relates to a method of performing a scribing cut on a liquid crystal substrate or the like by using a laser, which can not only minimize the useless portion of the substrate but also form a sealing layer. A dummy portion, and a method of cutting a bonded substrate of a smooth cut surface can be obtained.
一般而言，先前於液晶基板切割時，切割基板之無用部分即形成有密封層之虛設部時，僅利用劃線輪進行切割。 In general, when the unnecessary portion of the dicing substrate is formed as a dummy portion of the sealing layer when the liquid crystal substrate is diced, the dicing is performed only by the scribing wheel.
具體而言，一般之液晶基板係於上部玻璃部與下部玻璃部之間填充液晶層之後，以液晶層不向外部漏液之方式用密封層(sealing layer)包住液晶層之框部分來進行密封。 Specifically, a general liquid crystal substrate is filled with a liquid crystal layer between the upper glass portion and the lower glass portion, and then the liquid crystal layer is covered with a sealing layer to surround the frame portion of the liquid crystal layer so as not to leak to the outside. seal.
即，此構造係使密封層附著於上部玻璃部與下部玻璃部之相互對向面上，以液晶層不流向外部之方式對其等之間進行密封。 That is, in this configuration, the sealing layer is adhered to the opposing faces of the upper glass portion and the lower glass portion, and the liquid crystal layer is sealed between the liquid crystal layers and the like without flowing to the outside.
又，為了提高密封性，選擇使如上述般密封之密封層朝基板平面之寬度較寬地形成之結構。 Further, in order to improve the sealing property, a structure in which the sealing layer sealed as described above is formed to have a wide width toward the plane of the substrate is selected.
而且，實際情形係，因如上述般以較大寬度形成之密封層，液晶基板之框部分包含具有較大寬度之密封層，當前係於邊框尺寸大之狀態下使用，或者為了減小邊框尺寸而將密封層之外周部分切去以形成薄邊框。 Further, in actuality, since the sealing layer is formed with a large width as described above, the frame portion of the liquid crystal substrate includes a sealing layer having a large width, which is currently used in a state in which the frame size is large, or in order to reduce the size of the frame. The outer peripheral portion of the sealing layer is cut away to form a thin bezel.
但，最近亦有將液晶基板彼此平面連結而使用之情形，於此情 形時，出現了顯示圖像時在密封層之外周部分彼此連結部位處圖像不平滑之問題。 However, recently, there have been cases in which liquid crystal substrates are connected to each other in a plane. In the case of the shape, there is a problem that the image is not smooth at the joint portion of the outer peripheral portion of the seal layer when the image is displayed.
因此，為了能解決如上所述之問題，而最大幅度地切去液晶基板之密封層之寬度，利用劃線輪深入至液晶基板之密封層進行切割。 Therefore, in order to solve the above problem, the width of the sealing layer of the liquid crystal substrate is cut off to the maximum extent, and the scribing wheel is used to penetrate into the sealing layer of the liquid crystal substrate for cutting.
但，密封層具有如橡膠般之脆性性質，因此利用劃線輪對液晶基板之密封層進行劃線時，會出現以下問題，劃線時若接觸到較脆之密封層，便會失去直線性、或者無法沿著劃線移動而朝其他方向移行，基板切斷時出現基板不良。 However, since the sealing layer has a rubber-like brittle property, when the sealing layer of the liquid crystal substrate is scribed by the scribing wheel, the following problems occur, and if the sealing layer is contacted with a brittle sealing layer, the linearity is lost. Or it is impossible to move along the scribe line and move in the other direction, and the substrate is defective when the substrate is cut.
尤其係，用於對接合基板進行劃線之現有上、下劃線輪方式中，實際情形係進而產生以下問題：切割難以深入到位於構成接合基板之上部玻璃部與下部玻璃部之間之密封層，即便劃線輪之劃線作業完成後，亦殘留一部分密封層而未完全切割密封層，玻璃部未完全分離。 In particular, in the conventional upper and lower scribing wheel systems for scribing the bonded substrate, the actual problem is that the cutting is difficult to penetrate into the sealing layer between the glass portion and the lower glass portion constituting the upper portion of the bonded substrate. Even after the scribing wheel is finished, a part of the sealing layer remains without completely cutting the sealing layer, and the glass portion is not completely separated.
又，實際情形係進而出現以下問題：因密封層而劃線輪之直線性下降，無法以所需程度自液晶基板去除虛設部，且液晶基板之切斷面因密封層而不具有平滑面，使得必須廢棄之不良品增加。 Further, the actual situation is further caused by the fact that the linearity of the scribing wheel is lowered by the sealing layer, and the dummy portion cannot be removed from the liquid crystal substrate to a desired extent, and the cut surface of the liquid crystal substrate does not have a smooth surface due to the sealing layer. Increased the number of defective products that must be discarded.
又，最近使複數個液晶基板平面地相互框接觸而顯示大型畫面之在售圖像裝置不斷增加，於此情形時正積極研究使液晶基板之框中能夠顯示畫面之液晶層以外之其他部分、例如密封層變得最小。 In addition, recently, a number of image-capturing devices that display a large-sized screen in a plurality of liquid crystal substrates in a plane are in contact with each other. In this case, other parts other than the liquid crystal layer capable of displaying a screen in the frame of the liquid crystal substrate are being actively studied. For example, the sealing layer becomes minimal.
因此，本發明係為了解決現有問題而創作者，其目的在於提供一種接合基板之切割方法，利用雷射對液晶基板等接合基板進行劃線而切割時，不僅能夠最大限度地減小基板之無用虛設部，亦能獲得平滑之切割面。 Therefore, the present invention has been made in order to solve the conventional problems, and an object of the present invention is to provide a method for cutting a bonded substrate, which can not only minimize the uselessness of the substrate when the bonded substrate such as a liquid crystal substrate is scribed by laser. The dummy part can also obtain a smooth cut surface.
本發明之一實施形態之接合基板之切割方法用於對形成於接合基板之上部玻璃部與下部玻璃部之間之密封部上進行切割，且包含以下階段：對上述上部玻璃部及下部玻璃部之至少一者與上述密封部接觸之位置照射雷射，於上述上部玻璃部及下部玻璃部之至少一者之內表面側形成切割線；以及利用劃線輪，沿著上述切割線對上述玻璃部及下部玻璃部之至少一者進行劃線。 A method of cutting a bonded substrate according to an embodiment of the present invention is for cutting a sealing portion formed between an upper glass portion and a lower glass portion of a bonded substrate, and includes the following steps: the upper glass portion and the lower glass portion At least one of the laser beam is irradiated at a position in contact with the sealing portion, and a cutting line is formed on an inner surface side of at least one of the upper glass portion and the lower glass portion; and the glass is cut along the cutting line by a scribing wheel At least one of the portion and the lower glass portion are scribed.
又，於形成上述切割線之階段中，能夠於與上述密封部接觸之上述上部玻璃部及下部玻璃部之內表面側形成上述切割線，且於上述劃線階段中，能夠對上述上部玻璃部及下部玻璃部進行劃線。 Further, in the step of forming the dicing line, the dicing line can be formed on the inner surface side of the upper glass portion and the lower glass portion which are in contact with the sealing portion, and the upper glass portion can be formed in the scribe line step The lower glass portion is scribed.
又，於形成上述切割線之階段中，能夠於與上述密封部接觸之上述上部玻璃部及下部玻璃部之任一者之內表面側形成上述切割線，且於上述劃線階段中，能夠對與形成有上述切割線之上述上部玻璃部或下部玻璃部對向之相反側之上述下部玻璃部或上部玻璃部進行劃線。 Further, in the step of forming the dicing line, the dicing line can be formed on the inner surface side of any of the upper glass portion and the lower glass portion that is in contact with the sealing portion, and can be The lower glass portion or the upper glass portion on the opposite side of the upper glass portion or the lower glass portion on which the cut line is formed is scribed.
又，亦可包含以下階段：於上述劃線階段之後，沿著上述切割線，利用斷開輥或斷開條進行斷開。 Moreover, the following stage may be included: after the scribing stage, the disconnection roller or the disconnecting strip is used to break along the cutting line.
根據本發明，具有以下效果：對具有密封層之接合基板之密封層上進行切割時，不僅能夠使作為切割部位之密封層容易地分離，亦能形成美觀之切割面。 According to the present invention, when the sealing layer is bonded to the bonding substrate having the sealing layer, not only the sealing layer as the cutting portion can be easily separated, but also an attractive cutting surface can be formed.
1‧‧‧雷射 1‧‧ ‧ laser
10‧‧‧接合基板 10‧‧‧ Bonding substrate
11a‧‧‧上部玻璃部 11a‧‧‧Upper glass department
11b‧‧‧下部玻璃部 11b‧‧‧Lower glass department
13a、13b‧‧‧切割線 13a, 13b‧‧‧ cutting line
14‧‧‧虛設部 14‧‧‧Dummy Department
20‧‧‧密封部 20‧‧‧ Sealing Department
30‧‧‧液晶部 30‧‧‧Liquid LCD Department
70‧‧‧劃線輪 70‧‧‧marking wheel
圖1係表示一般之接合基板之平面之圖。 Fig. 1 is a view showing a plane of a general bonded substrate.
圖2係表示本發明之一實施形態之接合基板之切割方法中，利用雷射形成切割線之階段之圖。 Fig. 2 is a view showing a stage in which a cutting line is formed by laser in a method of cutting a bonded substrate according to an embodiment of the present invention.
圖3係表示於本發明之一實施形態之接合基板之切割方法中，形成切割線之後利用劃線輪進行劃線之階段之圖。 Fig. 3 is a view showing a stage in which a scribe line is formed by a scribing wheel after forming a dicing line in the method of cutting a bonded substrate according to an embodiment of the present invention.
圖4係表示於本發明之一實施形態之接合基板之切割方法中，對接合基板進行劃線之後進行切割之剖面之圖。 Fig. 4 is a cross-sectional view showing a cross-section of a bonded substrate after performing dicing on a method of dicing a bonded substrate according to an embodiment of the present invention.
圖5係表示本發明之另一實施形態之接合基板之切割方法中，利用雷射形成切割線之圖。 Fig. 5 is a view showing a cutting line formed by laser using a laser in a method of cutting a bonded substrate according to another embodiment of the present invention.
圖6係表示圖5之切割線形成後利用劃線輪進行劃線之階段之圖。 Fig. 6 is a view showing a stage in which the scribing wheel is formed by scribing after the cutting line of Fig. 5 is formed.
圖7係表示圖6中劃線後經切割之接合基板之剖面之圖。 Fig. 7 is a view showing a cross section of the bonded substrate cut after the scribe line in Fig. 6.
參照圖式，如下所述具體地說明本發明之一實施形態之接合基板之切割方法。 A method of cutting a bonded substrate according to an embodiment of the present invention will be specifically described below with reference to the drawings.
如圖1及圖2所示，本實施形態之接合基板(10)包含上部玻璃部(11a)及下部玻璃部(11b)，於上述上部玻璃部(11a)與下部玻璃部(11b)之間形成有顯示圖像之液晶部(30)。而且，以上述液晶部(30)不向接合基板(10)之外部漏液之方式，利用密封部(20)對液晶部(30)之外周進行密封。 As shown in FIGS. 1 and 2, the bonded substrate (10) of the present embodiment includes an upper glass portion (11a) and a lower glass portion (11b) between the upper glass portion (11a) and the lower glass portion (11b). A liquid crystal portion (30) for displaying an image is formed. Further, the liquid crystal portion (30) is sealed to the outer periphery of the liquid crystal portion (30) by the sealing portion (20) so that the liquid crystal portion (30) does not leak to the outside of the bonded substrate (10).
經上述密封部(20)密封之接合基板(10)之框部，存在形成上部玻璃部(11a)及下部玻璃部(11b)時為無用部分之虛設部(14)。相當於此種虛設部(14)之上部玻璃部(11a)及下部玻璃部(11b)之框部之間亦包含密封部(20)。 The frame portion of the bonded substrate (10) sealed by the sealing portion (20) has a dummy portion (14) which is an unnecessary portion when the upper glass portion (11a) and the lower glass portion (11b) are formed. A seal portion (20) is also included between the frame portions corresponding to the upper glass portion (11a) and the lower glass portion (11b) of the dummy portion (14).
位於上述接合基板(10)之框側之虛設部(14)較佳為使其大小最小化，以提高藉由接合基板(10)之面積來顯示之圖像之品質。因此，如圖1所示之A部分所示，沿著箭頭方向切割形成有密封部(20)之虛設部(14)時，必須於液晶部不漏液之範圍內使密封部(20)及虛設部(14)最小限度殘留地進行切割。 The dummy portion (14) on the frame side of the bonded substrate (10) is preferably minimized in size to improve the quality of an image displayed by bonding the area of the substrate (10). Therefore, as shown in the portion A shown in FIG. 1, when the dummy portion (14) in which the sealing portion (20) is formed is cut in the direction of the arrow, it is necessary to make the sealing portion (20) and the liquid crystal portion not leaking. The dummy portion (14) performs cutting with minimal residual.
為此，於本實施形態之接合基板之切割方法中，首先如圖2所示，於接合基板(10)上照射一次雷射(1)，且滲透至上部玻璃部(11a)及 下部玻璃部(11b)之厚度之深處，於與密封部(20)接觸之上部玻璃部(11a)及下部玻璃部(11b)形成切割線(13a、13b)。 Therefore, in the method of cutting a bonded substrate of the present embodiment, first, as shown in FIG. 2, a laser (1) is irradiated onto the bonded substrate (10), and the upper glass portion (11a) is infiltrated and The depth of the lower glass portion (11b) is deeper, and the upper glass portion (11a) and the lower glass portion (11b) are in contact with the sealing portion (20) to form cutting lines (13a, 13b).
即，上部玻璃部(11a)之切割線(13a)與下部玻璃部(11b)之切割線(13b)分別形成於，與形成於上部玻璃部(11a)和下部玻璃部(11b)之間之密封部(20)接觸之上部玻璃部(11a)之內表面之位置與下部玻璃部(11b)之內表面之位置上。 That is, the cutting line (13a) of the upper glass portion (11a) and the cutting line (13b) of the lower glass portion (11b) are formed between the upper glass portion (11a) and the lower glass portion (11b), respectively. The sealing portion (20) contacts the position of the inner surface of the upper glass portion (11a) and the inner surface of the lower glass portion (11b).
然後，利用雷射，於與密封部(20)接觸之上部玻璃部(11a)之內表面側與下部玻璃部(11b)之內表面側，分別形成切割線(13a)及切割線(13b)時，形成有切割線(13a、13b)之位置周邊之密封部(20)亦包含於受雷射照射影響之區域，藉此具有較脆性質之密封部(20)硬化而變成容易切開之性質。 Then, by using the laser, the cutting line (13a) and the cutting line (13b) are respectively formed on the inner surface side of the upper glass portion (11a) and the inner surface side of the lower glass portion (11b) in contact with the sealing portion (20). At the time, the sealing portion (20) around the position where the cutting line (13a, 13b) is formed is also included in the region affected by the laser irradiation, whereby the sealing portion (20) having a brittle property is hardened to become an easily cuttable property. .
即，為了於上部玻璃部(11a)及下部玻璃部(11b)形成切割線(13a、13b)而照射雷射時，接著於接合基板(10)之間之密封部(20)受到雷射照射影響而密封部(20)自身硬化，變成易碎、或易切斷之物性。 That is, in order to form the dicing lines (13a, 13b) in the upper glass portion (11a) and the lower glass portion (11b) to irradiate the laser, the sealing portion (20) between the bonded substrates (10) is subjected to laser irradiation. The seal portion (20) itself hardens and becomes a property that is brittle or easily cut.
如此，利用雷射形成上部玻璃部(11a)之切割線(13a)與下部玻璃部(11b)之切割線(13b)之後，如圖3及圖4所示，利用劃線輪(70)，沿著上部玻璃部(11a)及下部玻璃部(11b)之切割線(13a、13b)，劃線至各玻璃部之厚度、即形成有密封部(20)之厚度之深處為止。 Thus, after the cutting line (13a) of the upper glass portion (11a) and the cutting line (13b) of the lower glass portion (11b) are formed by laser, as shown in FIGS. 3 and 4, the scribing wheel (70) is used. The cutting lines (13a, 13b) along the upper glass portion (11a) and the lower glass portion (11b) are scribed to the thickness of each glass portion, that is, the depth of the thickness of the sealing portion (20).
如此，利用雷射形成上部玻璃部(11a)之切割線(13a)與下部玻璃部(11b)之切割線(13b)之後，利用劃線輪沿著切割線(13a、13b)進行劃線時，預先形成之上述切割線(13a、13b)之周邊所接著之密封部(20)因雷射而預先硬化，處於切開、易碎性質提昇之狀態，因此能夠以良好之剖面品質容易地切割上部玻璃部(11a)及下部玻璃部(11b)。 In this manner, after the cutting line (13a) of the upper glass portion (11a) and the cutting line (13b) of the lower glass portion (11b) are formed by laser, the scribing wheel is used to scribe along the cutting line (13a, 13b). The sealing portion (20) which is formed around the cutting line (13a, 13b) formed in advance is pre-hardened by laser, and is in a state of being cut and fragile, so that the upper portion can be easily cut with good cross-sectional quality. Glass portion (11a) and lower glass portion (11b).
又，利用雷射照射上部玻璃部(11a)及下部玻璃部(11b)時，密封部(20)亦包含於受雷射影響之照射區域，藉此密封部(20)硬化而自身接著力弱化，互拉應力減少，劃線輪(70)移行時之方向不會因密封部 (20)而改變，能夠賦予劃線輪(70)之直線性。 Further, when the upper glass portion (11a) and the lower glass portion (11b) are irradiated with laser light, the sealing portion (20) is also included in the irradiation region affected by the laser, whereby the sealing portion (20) is hardened and the self-welding force is weakened. The mutual tensile stress is reduced, and the direction of the scribing wheel (70) when moving is not caused by the sealing portion. (20), the linearity of the scribing wheel (70) can be imparted.
另一方面，當然亦能進行以下步驟：利用劃線輪(70)，對上部玻璃部(11a)及下部玻璃部(11b)進行劃線之後，利用裂斷輥(roll breaker)或裂斷棒(bar breaker)將接合基板斷開。 On the other hand, of course, it is also possible to perform the following steps: after scribing the upper glass portion (11a) and the lower glass portion (11b) by the scribing wheel (70), using a roll breaker or a split rod Bar breaker disconnects the bonded substrate.
以下，參照圖5至圖7，說明本發明之另一實施形態。 Hereinafter, another embodiment of the present invention will be described with reference to Figs. 5 to 7 .
於本發明之另一實施形態中，與上述實施形態不同之處為，對接合基板(10)上照射一次雷射(1)，於與密封部(20)接觸之上部玻璃部(11a)及下部玻璃部(11b)中之任一者之內表面側形成切割線(13a)。 According to another embodiment of the present invention, the embodiment is different from the above embodiment in that the bonding substrate (10) is irradiated with the laser (1) once, and the sealing portion (20) is in contact with the upper glass portion (11a) and A cutting line (13a) is formed on the inner surface side of any of the lower glass portions (11b).
圖5中表示於與密封部(20)接觸之上部玻璃部(11a)之內表面之位置形成切割線(13a)。 Fig. 5 shows a cutting line (13a) formed at a position in contact with the sealing portion (20) at the inner surface of the upper glass portion (11a).
以此方式利用雷射在上部玻璃部(11a)之內表面側形成切割線(13a)之情形時，形成有切割線(13a)之位置周邊之密封部(20)亦包含於受雷射影響之區域，藉此密封部(20)硬化而物性變成易切割之性質。 When the cutting line (13a) is formed on the inner surface side of the upper glass portion (11a) by the laser in this manner, the sealing portion (20) formed around the position of the cutting line (13a) is also affected by the laser. The area is thereby hardened by the sealing portion (20) and the physical properties become cleavable.
然後，於如上述般利用雷射形成上部玻璃部(11a)之切割線(13a)之後，如圖6所示，於與形成有切割線(13a)之玻璃部對向之相反側之玻璃部即下部玻璃部(11b)上，利用劃線輪(70)沿著上述切割線(13a)移行，劃線至下部玻璃部(11b)之厚度、即形成有密封部(20)之接合面之深度為止。 Then, after the cutting line (13a) of the upper glass portion (11a) is formed by laser as described above, as shown in Fig. 6, the glass portion opposite to the glass portion on which the cutting line (13a) is formed is opposed. That is, the lower glass portion (11b) is moved along the cutting line (13a) by the scribing wheel (70), and is scribed to the thickness of the lower glass portion (11b), that is, the joint surface of the sealing portion (20) is formed. Depth so far.
即，於本發明之另一實施形態中，利用劃線輪(70)沿著上述切割線(13a)，對形成有切割線(13a)之上部玻璃部(11a)之相反側即下部玻璃部(11b)進行劃線。然後，上述切割線(13a)之周邊所接著之密封部(20)已受到雷射照射影響而硬化，變得具有易切開、或易碎性質之物性，因此於本發明之另一實施形態中，僅對下部玻璃部(11b)進行劃線便能夠容易地切割包含密封部(20)之接合基板。 That is, in another embodiment of the present invention, the scribing wheel (70) is used to form the lower glass portion opposite to the upper glass portion (11a) of the cutting line (13a) along the cutting line (13a). (11b) Perform scribing. Then, the sealing portion (20) following the periphery of the cutting line (13a) is hardened by the influence of laser irradiation, and has physical properties of easy-cut or fragile properties. Therefore, in another embodiment of the present invention, The bonding substrate including the sealing portion (20) can be easily cut only by scribing the lower glass portion (11b).
又，為了實現更完全之切割，當然亦能進行以下步驟：於利用劃線輪(70)劃線之後，利用裂斷輥(roll breaker)或裂斷棒(bar breaker) 對接合基板(1)施加衝擊，藉此進行斷開。 Also, in order to achieve a more complete cut, it is of course also possible to perform the following steps: after scribing with the scribing wheel (70), using a roll breaker or a bar breaker. An impact is applied to the bonded substrate (1) to thereby break.
又，於本發明之另一實施形態中，於與形成有切割線(13a)之上部玻璃部(11a)對向之下部玻璃部(11b)上利用劃線輪(70)進行劃線，但亦可於形成有切割線(13a)之上部玻璃部(11a)上利用劃線輪(70)進行劃線。 Further, in another embodiment of the present invention, the scribing wheel (70) is scribed on the lower glass portion (11b) opposite to the upper glass portion (11a) on which the cutting line (13a) is formed, but It is also possible to perform scribing on the upper glass portion (11a) on which the cutting line (13a) is formed by the scribing wheel (70).
1‧‧‧雷射 1‧‧ ‧ laser
11a‧‧‧上部玻璃部 11a‧‧‧Upper glass department
11b‧‧‧下部玻璃部 11b‧‧‧Lower glass department
13a、13b‧‧‧切割線 13a, 13b‧‧‧ cutting line
20‧‧‧密封部 20‧‧‧ Sealing Department
30‧‧‧液晶部 30‧‧‧Liquid LCD Department
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
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| ??10-2014-0134231 | 2014-10-06 | ||
| KR1020140134231A KR101623026B1 (en) | 2014-10-06 | 2014-10-06 | Method for cutting of bonded substrate |
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| TW201619080A true TW201619080A (en) | 2016-06-01 |
| TWI671267B TWI671267B (en) | 2019-09-11 |
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| JP (1) | JP6565544B2 (en) |
| KR (1) | KR101623026B1 (en) |
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| JP7020660B2 (en) * | 2016-11-29 | 2022-02-16 | 三星ダイヤモンド工業株式会社 | Brittle material Substrate fragmentation method and fragmentation device |
| KR102633196B1 (en) * | 2016-12-01 | 2024-02-05 | 주식회사 탑 엔지니어링 | Scribing apparatus and scribing method |
| WO2018131602A1 (en) * | 2017-01-10 | 2018-07-19 | 大日本印刷株式会社 | Light control cell, light control member, moving body and method for producing light control cell |
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| JP2003215551A (en) * | 2002-01-28 | 2003-07-30 | Matsushita Electric Ind Co Ltd | Manufacturing method of liquid crystal display |
| KR100689314B1 (en) * | 2003-11-29 | 2007-03-08 | 엘지.필립스 엘시디 주식회사 | Method of cutting liquid crystal display panel |
| JP2007137699A (en) * | 2005-11-16 | 2007-06-07 | Epson Imaging Devices Corp | Cutting method for glass substrate |
| CN101131519A (en) * | 2006-08-24 | 2008-02-27 | 精工爱普生株式会社 | Circuit board for electro-optical device, electro-optical device, and electronic apparatus |
| JP5299730B2 (en) * | 2006-10-13 | 2013-09-25 | Ｎｌｔテクノロジー株式会社 | Display device |
| JP2008276057A (en) | 2007-05-02 | 2008-11-13 | Active Inc | Method for processing transparent electrode film of liquid crystal display device |
| JP2009006334A (en) * | 2007-06-26 | 2009-01-15 | Seiko Epson Corp | Laser beam machining method and laser beam irradiating apparatus |
| RU2467364C2 (en) * | 2008-09-12 | 2012-11-20 | Шарп Кабусики Кайся | Method of making display panel |
| WO2010044217A1 (en) * | 2008-10-17 | 2010-04-22 | 株式会社リンクスタージャパン | Method for cutting mother glass substrate for display and brittle material substrate and method for manufacturing display |
| KR101041140B1 (en) * | 2009-03-25 | 2011-06-13 | 삼성모바일디스플레이주식회사 | Method for cutting substrate using the same |
| KR101818449B1 (en) * | 2010-12-15 | 2018-01-16 | 엘지디스플레이 주식회사 | Method of cutting liquid crystal display panel and fabricating liquid crystal display device |
| JP2014048432A (en) * | 2012-08-31 | 2014-03-17 | Mitsuboshi Diamond Industrial Co Ltd | Processing method of cell substrate |
| TWI583522B (en) * | 2012-10-25 | 2017-05-21 | 三星鑽石工業股份有限公司 | Disassembly method of laminated ceramic substrate |
| TW201435434A (en) * | 2013-03-05 | 2014-09-16 | hui-xin Sun | Cutting and reproducing method of liquid crystal panel module |
| JP5648160B2 (en) * | 2013-04-05 | 2015-01-07 | Ｔｏｗａ株式会社 | Processing apparatus and processing method |
| CN103819082A (en) * | 2014-02-20 | 2014-05-28 | 北京京东方光电科技有限公司 | Cutting method of liquid crystal panel, and liquid crystal panel |
| CN104028898B (en) * | 2014-05-23 | 2016-06-15 | 广东工业大学 | A kind of processing method and device of laser forming cutting sapphire substrate |
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| CN105479020B (en) | 2019-10-18 |
| KR20160040825A (en) | 2016-04-15 |
| KR101623026B1 (en) | 2016-05-20 |
| TWI671267B (en) | 2019-09-11 |
| CN105479020A (en) | 2016-04-13 |
| JP6565544B2 (en) | 2019-08-28 |
| JP2016074583A (en) | 2016-05-12 |
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