JP2013205487A - Manufacturing method for thin film element substrate and display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate joining in outer peripheral portions and separation in the inside portions in a glass support substrate and a film-deposited substrate.SOLUTION: A manufacturing method includes: a joining process for joining a support substrate 61a and a film-deposited substrate 10 in outer peripheral portions F to form a glass joined body 70; a thin film element formation process for forming a thin film element on a surface inside the outer peripheral portion F of the film-deposited substrate 10 in the glass joined body 70a; and a separation process for cutting the outer peripheral portion F of the glass joined body 70a formed with the thin film element thereon to separate the film-deposited substrate 10 portion formed with the thin film element thereon from the glass joined body 70a. In the joining process, the glass joined body 70a is formed to be direct or indirect surface contact with each other in the outer peripheral portions F and suppress a contact area in the inside portions C at a boundary surface of the support substrate 61a and the film-deposited substrate 10.

Description

  The present invention relates to a method for manufacturing a thin film element substrate and a display panel, and more particularly to a method for manufacturing a thin film element substrate and a display panel using a thin glass substrate.

  A liquid crystal display panel includes, for example, a TFT (Thin Film Transistor) substrate and a CF (Color Filter) substrate provided as thin film element substrates so as to face each other, and a liquid crystal layer provided between the two substrates. I have. Here, in a liquid crystal display panel for mobile use such as a mobile phone, for example, thinning of a thin film element substrate such as a TFT substrate and a CF substrate and weight reduction are strongly demanded.

  As a method of manufacturing a thin liquid crystal display panel, for example, a TFT substrate and a CF substrate are produced using a pair of glass substrates having a thickness of about 0.7 mm, and a liquid crystal display panel having a thickness of about 1.4 mm is obtained. A manufacturing method in which each glass substrate constituting the TFT substrate and the CF substrate is thinned by etching after the production is well known.

  Further, as a method of manufacturing a thin liquid crystal display panel, for example, a relatively thin glass substrate is fixed on a relatively thick glass support substrate, and a thin film device is formed on the substrate. A manufacturing method for separating the supporting substrate and the deposition target substrate after forming the substrate has been proposed (see, for example, Patent Documents 1 and 2).

Japanese Patent Laid-Open No. 2003-216068 (FIGS. 1 and 3) JP 2005-338281 A

  By the way, in the said patent document 1, the 1st manufacturing method which arrange | positions a relatively thick glass substrate on a relatively thin glass substrate, and fuse | melts the outer peripheral part of two glass substrates by irradiation of a laser beam, A second manufacturing method is disclosed in which a relatively thick glass substrate is disposed on a relatively thin glass substrate via a spacer, and the outer peripheral portions of the two glass substrates are fused by laser light irradiation. However, in the first manufacturing method, in the fused two glass substrates, there is a portion that adheres to each other even on the inner side of the outer peripheral portion, and an extremely strong adhesion force is generated in that portion. There is a possibility that the glass substrates cannot be separated from each other. In the second manufacturing method, for example, when a relatively thin glass substrate is difficult to bend due to its thickness, a relatively thin glass is formed at the outer peripheral portion of the two glass substrates separated by the spacer. Since it is necessary to fuse until the outer peripheral portion of the substrate is deformed and comes into contact with the outer peripheral portion of the relatively thick glass substrate, there is a possibility that the glass substrate may be damaged due to local stress generated during cooling. There is room for improvement in bonding at the outer periphery of the glass substrate.

  The present invention has been made in view of the above points, and the object of the present invention is to facilitate the bonding at the outer peripheral portion and the separation at the inner portion of the glass support substrate and the film formation substrate. It is in.

  In order to achieve the above-mentioned object, the present invention makes direct or indirect surface contact at the outer peripheral part and suppresses the contact area at the inner part at the interface between the support substrate of the glass bonded body and the film formation substrate. It is what I did.

  Specifically, in the method for manufacturing a thin film element substrate according to the present invention, a glass substrate is bonded by bonding a relatively thick glass support substrate and a relatively thin glass film formation substrate at the outer periphery of each other. A thin film element forming step of forming a thin film element on the inner surface of the outer peripheral portion of the deposition target substrate of the glass bonded body formed in the bonding step, and a thin film in the thin film element forming step Separating the portion of the film formation substrate on which the thin film element is formed from the glass bonded body by cutting the outer periphery of the glass bonded body on which the element is formed, and in the bonding process, At the interface between the support substrate and the film formation substrate, the glass joined body is directly or indirectly brought into surface contact with the outer peripheral portion and the contact area at the inner portion inside the outer peripheral portion is suppressed. Form.

  According to the above method, in the bonding step of bonding the relatively thick glass support substrate and the relatively thin glass film formation substrate at the outer periphery of each other, the support substrate and the film formation substrate Since the glass bonded body is formed so as to be in direct or indirect surface contact at the outer peripheral portion at the interface, for example, laser light is irradiated to the end surface portion of the supporting substrate and the deposition target substrate that are in surface contact with the outer peripheral portion. Then, the support substrate and the film formation substrate are joined by slightly melting the end surface portion, and the joining at the outer peripheral portion of the support substrate and the film formation substrate becomes easy. Further, in the bonding process, the glass bonded body is formed so as to suppress the contact area in the inner part inside the outer peripheral part at the interface between the support substrate and the deposition target substrate. When the thin film element is formed on the surface of the substrate on which the bonded body is formed, even if the glass bonded body is in close contact with the inner side, the glass bonded body is fixed at the inner side at the interface between the support substrate and the target substrate. It is suppressed. Therefore, in the separation step, by cutting the outer peripheral portion of the glass bonded body, the portion of the film forming substrate on which the thin film element is formed is easily separated from the glass bonded body. A thin thin film element substrate is reliably manufactured using the glass substrate. Therefore, in the method for manufacturing a thin thin film element substrate, it is possible to facilitate the bonding at the outer peripheral portion and the separation at the inner portion in the glass support substrate and the deposition target substrate.

  In the bonding step, the glass bonded body may be formed so that one surface of the inner portion is a rough surface at the interface between the support substrate and the deposition target substrate.

  According to the above method, since one surface of the inner part is a rough surface (for example, arithmetic average roughness Ra is 5 nm or more) at the interface between the support substrate and the film formation substrate of the glass bonded body, At the interface between the supporting substrate and the film formation substrate, the contact area on the inner side is specifically suppressed. Here, even if the surfaces of the second support substrate and the second film formation substrate are in direct surface contact with each other at the outer peripheral portion at the interface between the support substrate and the film formation substrate of the glass bonded body, the surface indirectly It may be in contact.

  In the bonding step, the glass bonded body may be formed so that a glass tape material is disposed on the outer peripheral portion at the interface between the support substrate and the deposition target substrate.

  According to the above method, when the glass bonded body is formed, the glass tape material is disposed on the outer peripheral portion at the interface between the supporting substrate and the film forming substrate. In the outer peripheral portion at the interface of the substrate, the surfaces of the support substrate and the deposition target substrate are indirectly in surface contact with each other through the tape material.

  In the bonding step, a plurality of spacers for maintaining the distance between the support substrate and the film formation substrate are disposed on the inner side at the interface between the support substrate and the film formation substrate, respectively, and the outer peripheral portion is provided with the spacer. You may form the said glass joined body so that a glass-made tape material may be arrange | positioned.

  According to the above method, when forming the glass joined body, at the interface between the support substrate and the deposition target substrate, a plurality of spacers are disposed on the inner side, and a glass tape material is disposed on the outer peripheral portion. At the interface between the support substrate of the glass bonded body and the film formation substrate, the contact area at the inner side is specifically suppressed, and at the outer periphery of the interface between the support substrate of the glass bonded body and the film formation substrate, the support substrate In addition, the surfaces of the deposition target substrates are indirectly in surface contact with each other through the tape material.

  In the bonding step, the peripheral edge of the film formation substrate is disposed inside the peripheral edge of the support substrate, and the outer peripheral edge of the tape material is the peripheral edge of the film formation substrate and the peripheral edge of the support substrate. You may form the said glass joined body so that it may arrange | position between.

  According to the above method, when the glass joined body is formed, the outer peripheral end of the tape material is disposed between the peripheral end of the film formation substrate and the peripheral end of the support substrate. Laser light is easily irradiated to the interface and the interface between the tape material and the film formation substrate, and the support substrate and the film formation substrate are efficiently bonded.

  In the bonding step, the support substrate and the deposition target substrate may be bonded to each other at a peripheral portion in a reduced pressure atmosphere.

  According to the above method, the support substrate and the film formation substrate are bonded to each other at the outer periphery in a reduced-pressure atmosphere to form a glass bonded body. Therefore, an air layer is formed at the interface between the support substrate and the film formation substrate. Is difficult to be formed, and breakage of the glass joined body under vacuum or high temperature is suppressed.

  In the film formation substrate, the corner on the support substrate side in the cross-sectional shape along the thickness direction is a right angle, and in the bonding step, the peripheral edge of the film formation substrate is more than the peripheral edge of the support substrate. The glass joined body may be formed so as to be disposed on the inner side.

  According to the above method, the corners on the support substrate side in the cross-sectional shape along the thickness direction of the film formation substrate are right angles, and when forming the glass joined body, the peripheral edge of the film formation substrate is the support substrate. Since the gap is difficult to form at the interface between the support substrate and the substrate to be deposited, for example, the laser beam can be reliably suppressed by suppressing unnecessary reflection and absorption at the interface. The support substrate and the deposition target substrate are easily bonded.

  Moreover, the manufacturing method of the display panel which concerns on this invention joins the 1st support substrate made from a relatively thick glass, and the 1st film-formation board | substrate made from a relatively thin glass in a mutual outer peripheral part, A first thin film element is formed on the inner surface of the outer peripheral portion of the first deposition target substrate of the first glass bonded body formed in the first bonding process and the first bonding process for forming the first glass bonded body. The second thin film element forming step, the relatively thick glass second supporting substrate, and the relatively thin glass second film-deposited substrate are bonded to each other at the outer peripheral portion thereof, whereby the second glass bonding A second thin film element for forming a second thin film element on the inner surface of the outer peripheral portion of the second deposition target substrate of the second glass bonded body formed in the second bonding step. The first thin film element is formed in the element forming step and the first thin film element forming step. By bonding the glass bonded body and the second glass bonded body on which the second thin film element is formed in the second thin film element forming step so that the first thin film element and the second thin film element face each other, the bonded body The first thin film element is formed from the bonded body by cutting each outer peripheral part of the first glass bonded body and the second glass bonded body in the bonded process formed in the bonded process and the bonded process. A separation step of separating a portion of the first film formation substrate formed and a portion of the second film formation substrate on which the second thin film element is formed, and in the first bonding step, the first support At the interface between the substrate and the first film-deposited substrate, the first glass is in contact with the outer peripheral portion directly or indirectly, and the contact area at the inner portion inside the outer peripheral portion is suppressed. In the second joining step, a joined body is formed. At the interface between the second support substrate and the second film formation substrate, in direct or indirect surface contact with the outer peripheral portion, and so as to suppress the contact area on the inner side inside the outer peripheral portion, The second glass joined body is formed.

  According to the above method, in the first bonding step of bonding the relatively thick first support substrate made of glass and the first thin film formation substrate made of glass at the outer periphery of each other, Since the first glass joined body is formed so as to be in direct or indirect surface contact at the outer peripheral portion at the interface between the support substrate and the first deposition target substrate, the first support substrate and the first glass substrate that are in surface contact with the outer peripheral portion For example, the first support substrate and the first film formation substrate are bonded to each other by simply irradiating the end surface portion of the one film formation substrate with laser light and slightly melting the end surface portion. And the joining in the outer peripheral part of a 1st film-forming board | substrate becomes easy. In the first bonding step, the first glass bonded body is formed at the interface between the first support substrate and the first film-formed substrate so as to suppress the contact area at the inner side portion. When the first thin film element is formed on the surface of the first deposition target substrate of the first glass joined body in the forming step, even if the first glass joined body is in close contact with the inner portion, the first glass joined body first Adhesion at the inner side of the interface between the support substrate and the first film formation substrate is suppressed. On the other hand, in the second bonding step of bonding the relatively thick glass-made second support substrate and the relatively thin glass-made second deposition target substrate at the outer peripheral portions of each other, the second support substrate and the second support substrate. Since the second glass joined body is formed so as to be in direct or indirect surface contact with the outer peripheral portion at the interface of the film formation substrate, the second support substrate and the second film formation substrate in surface contact with the outer peripheral portion. For example, the second support substrate and the second film-forming substrate are bonded to each other by simply irradiating the end surface part with a laser beam and slightly melting the end surface part. Bonding at the outer periphery of the film substrate is facilitated. Further, in the second bonding step, the second glass bonded body is formed so as to suppress the contact area on the inner side at the interface between the second support substrate and the second film formation substrate, so that the second thin film element thereafter When the second thin film element is formed on the surface of the second deposition target substrate of the second glass joined body in the forming step, even if the second glass joined body is in close contact with the inner side, the second glass joined body second Adhesion at the inner side of the interface between the support substrate and the second deposition target substrate is suppressed. Therefore, in the separation step performed after the bonding step of bonding the first glass joined body on which the first thin film element is formed and the second glass joined body on which the second thin film element is formed, the first glass joined body and By cutting each outer peripheral portion of the second glass joined body, the portion of the first film-formed substrate on which the first thin film element is formed is easily separated from the first glass joined body, and the second glass joined body Since the portion of the second film formation substrate on which the second thin film element is formed is easily separated from the first film formation substrate and the second film formation substrate, that is, a thin glass substrate is used. The display panel is reliably manufactured. Therefore, in the method for manufacturing a thin display panel, it is possible to facilitate the bonding at the outer peripheral portion and the separation at the inner portion in the glass support substrate and the deposition target substrate.

  In the first bonding step, the first glass bonded body is formed so that the first tape material made of glass is disposed on the outer peripheral portion at the interface between the first supporting substrate and the first film formation substrate. In the second bonding step, a glass-made second tape material is disposed on the outer peripheral portion at the interface between the second support substrate and the second film formation substrate, and the size of the second film formation substrate is the size of the second film formation substrate. 1st glass joined body is formed so that it may become smaller than the size of the inner part of 1 glass joined body, and in the pasting process, the 1st glass joined body and the 2nd glass joined body are made into the 2nd tape material. You may paste together at intervals more than thickness.

  According to the above method, in the first bonding step, the first tape material made of glass is disposed on the outer peripheral portion at the interface between the first support substrate and the first deposition target substrate, and in the second bonding step, the second support is provided. A second tape material made of glass is disposed on the outer peripheral portion at the interface between the substrate and the second film formation substrate, and the size of the second film formation substrate is smaller than the size of the inner side portion of the first glass bonded body. Thus, the second glass joined body is formed, and in the pasting step, the first glass joined body and the second glass joined body are pasted at an interval equal to or greater than the thickness of the second tape material. The surface step formed due to the thickness of the first tape material on the surface of the first film formation substrate, and the thickness of the second tape material on the surface of the second film formation substrate of the second glass joined body. The first glass joined body and the second glass without being affected by the surface step formed due to It is possible to bond ensures conjugate.

  According to the present invention, at the interface between the support substrate of the glass bonded body and the film formation substrate, surface contact is made directly or indirectly at the outer peripheral portion, and the contact area at the inner portion is suppressed, so that the glass support is provided. Bonding at the outer peripheral portion and separation at the inner portion of the substrate and the deposition target substrate can be facilitated.

3 is a cross-sectional view of the liquid crystal display panel according to Embodiment 1. FIG. It is sectional drawing which shows the 1st joining process for manufacturing the liquid crystal display panel which concerns on Embodiment 1, a 2nd joining process, and the bonding process. 10 is a cross-sectional view showing a modification of the first joining step for manufacturing the liquid crystal display panel according to Embodiment 1. FIG. 10 is a cross-sectional view showing a first bonding step for manufacturing a liquid crystal display panel according to Embodiment 2. FIG. It is sectional drawing which shows the 1st joining process for manufacturing the liquid crystal display panel which concerns on Embodiment 3. FIG. It is sectional drawing which shows the 1st joining process for manufacturing the liquid crystal display panel which concerns on Embodiment 4. FIG. It is sectional drawing which shows the 1st joining process for manufacturing the liquid crystal display panel which concerns on Embodiment 5. FIG. It is sectional drawing which shows the 1st joining process for manufacturing the liquid crystal display panel which concerns on Embodiment 6. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 3 show Embodiment 1 of a method for manufacturing a thin film element substrate and a display panel according to the present invention. Here, FIG. 1 is a cross-sectional view of the liquid crystal display panel 50 of the present embodiment. Moreover, FIG. 2 is sectional drawing which shows the 1st joining process for manufacturing the liquid crystal display panel 50, a 2nd joining process, and a bonding process. Specifically, FIG. 2A is a cross-sectional view of the first glass bonded body 70a formed in the first bonding step, and FIG. 2B is a second glass bonded formed in the second bonding step. It is sectional drawing of the body 80, and FIG.2 (c) is sectional drawing of the bonding body 90 formed in a bonding process. Further, FIG. 3 is a cross-sectional view of a first glass joined body 70b formed in a modification of the first joining step for manufacturing the liquid crystal display panel 50.

  As shown in FIG. 1, the liquid crystal display panel 50 includes a TFT substrate 20 and a CF substrate 40 provided as thin film element substrates so as to face each other, and a liquid crystal layer provided between the TFT substrate 20 and the CF substrate 40. 45 and a sealing material 46 (see FIG. 2C) provided for adhering the TFT substrate 20 and the CF substrate 40 to each other and enclosing the liquid crystal layer 45 between the TFT substrate 20 and the CF substrate 40. I have.

  As shown in FIG. 1, the TFT substrate 20 includes a thin glass substrate 10a (for example, about 0.05 mm), a plurality of gate lines provided on the glass substrate 10a so as to extend in parallel to each other, and each gate line. A gate insulating film 12 provided so as to cover the plurality of source lines, a plurality of source lines provided on the gate insulating film 12 so as to extend in parallel to each other in a direction orthogonal to the respective gate lines, and each gate line and each source line A plurality of TFTs 5 provided for each intersection, that is, for each sub-pixel that is the minimum unit of an image, an interlayer insulating film 15 provided so as to cover each TFT 5, and a matrix on the interlayer insulating film 15 And a plurality of pixel electrodes 16 connected to the respective TFTs 5 and an alignment film (not shown) provided so as to cover the pixel electrodes 16.

  As shown in FIG. 1, the TFT 5 has a gate electrode 11 provided on the glass substrate 10 a, a gate insulating film 12 provided to cover the gate electrode 11, and the gate electrode 11 on the gate insulating film 12. Thus, the semiconductor layer 13 provided in an island shape and the source electrode 14a and the drain electrode 14b provided on the semiconductor layer 13 so as to be separated from each other are provided.

  The gate electrode 11 is a part or a lateral projecting portion for each sub-pixel of the gate line.

The semiconductor layer 13 is provided on, for example, an intrinsic amorphous silicon layer (not shown) having a channel region and an intrinsic amorphous silicon layer so that the channel region is exposed, and n connected to the source electrode 14a and the drain electrode 14b, respectively. ^{+ An} amorphous silicon layer (not shown).

  The source electrode 14a is a part or a lateral projecting portion for each sub-pixel of the source line.

  The drain electrode 14 b is connected to the pixel electrode 16 through a contact hole (not shown) formed in the interlayer insulating film 15.

  As shown in FIG. 1, the TFT substrate 20 having the above configuration includes the gate electrode 11, the gate insulating film 12, the semiconductor layer 13, the source electrode 14a, the drain electrode 14b, the interlayer insulating film 15, the pixel electrode 16, and the like. The TFT array layer 17 is provided as a thin film element on the glass substrate 10a.

  As shown in FIG. 1, the counter substrate 40 includes a thin glass substrate 30 a (for example, about 0.05 mm), a black matrix 31 provided in a lattice shape on the glass substrate 30 a, and each lattice of the black matrix 31. A plurality of colored layers 32 such as a red layer, a green layer and a blue layer, a common electrode 33 provided so as to cover the black matrix 31 and each colored layer 32, and a height of 5 μm on the common electrode 33. A plurality of photo spacers (not shown) provided in a columnar shape and an alignment film (not shown) provided so as to cover the common electrode 33 and each photo spacer are provided. In the counter substrate 40, as shown in FIG. 1, the color filter layer 34 including the black matrix 31, the colored layer 32, the common electrode 33, and the like described above is provided as a thin film element on the glass substrate 30a.

  The liquid crystal layer 45 is made of, for example, a nematic liquid crystal material having electro-optical characteristics.

  The liquid crystal display panel 50 configured as described above applies a predetermined voltage for each sub-pixel to the liquid crystal layer 45 disposed between each pixel electrode 16 on the active matrix substrate 20 and the common electrode 33 on the counter substrate 40. By changing the alignment state of the liquid crystal layer 45, for example, the transmittance of light from the backlight is adjusted to each sub-pixel to display an image.

  Next, a method for manufacturing the liquid crystal display panel 50 of the present embodiment will be described with reference to FIG. Here, the manufacturing method of the liquid crystal display panel 50 of the present embodiment includes a first bonding step, a first thin film element forming step, a second bonding step, a second thin film element forming step, a bonding step, and a separation step. In FIG. 2C, the TFT array layer 17 formed on the surface of the first film formation substrate 10 and the color filter layer 34 formed on the surface of the second film formation substrate 30 are omitted. The bonding body 90 is illustrated.

<First joining step>
First, for example, direct processing such as sand blasting or embossing on the surface of the inner portion C inside the outer peripheral portion F of the non-alkali glass glass substrate having a thickness of about 0.7 mm, or a fine resist By performing indirect processing such as etching using a pattern, the surface of the inner portion C is roughened so that the arithmetic average roughness Ra is 5 nm or more, and the first support substrate 61a (FIG. 2A). Reference).

  Subsequently, a non-alkali glass first tape material 62a (see FIG. 2A) having a thickness of about 5 μm and a width of about 3 mm is disposed on the outer peripheral portion F of the first support substrate 61a. Here, the thickness of the first tape material 62a is preferably about 5 μm to 50 μm.

  Further, as shown in FIG. 2A, on the first support substrate 61a on which the first tape material 62a is disposed, a first deposition made of a non-alkali glass glass substrate having a thickness of about 0.05 mm, for example. After the film substrate 10 is disposed, a reduced-pressure atmosphere (for example, 0) is applied to the interface between the first support substrate 61a and the first tape material 62a and the interface between the first tape material 62a and the first deposition target substrate 10. .1 Pa) is irradiated with the laser beam L to soften and fuse the interfaces of the glass materials, and the first support substrate 61a and the first deposition target substrate 10 are surrounded by the outer periphery F of each other. The first glass joined body 70a is formed by joining over the above. The bonding at the outer peripheral portion F is preferably performed over the entire circumference, but the interface between the first support substrate 61a and the first tape material 62a, and the first tape material 62a and the first film-formed substrate. In the case where each surface has sufficient flatness at the interface with 10, it is possible to prevent infiltration of a chemical solution or the like in the first thin film element forming step by bringing these surfaces into close contact with each other. The joining at the outer peripheral portion F may be performed partially. In addition, the thickness of the first deposition target substrate 10 is preferably about 0.03 mm to 0.1 mm. Here, the first glass bonded body 70a is indirectly brought into surface contact with the outer peripheral portion F by the first tape material 62a at the interface between the first support substrate 61a and the first film formation substrate 10, and the first support substrate. The rough surface of 61a is configured to suppress the contact area at the inner portion C. In the present embodiment, as shown in FIG. 2A, the outer peripheral portions F of the first support substrate 61a and the first film formation substrate 10 are indirectly connected to each other via the first tape material 62a at the interface between them. The first glass joined body 70a in surface contact with the outer peripheral portion of the first supporting substrate 61a and the first film-forming substrate 10 is omitted as shown in FIG. The first glass joined body 70b in which F is in direct surface contact at the interface may be used.

<First thin film element forming step>
The gate electrode 11, the gate insulating film 12, and the semiconductor are formed on the inner surface of the outer peripheral portion F of the first deposition target substrate 10 of the first glass bonded body 70a formed in the first bonding step using a known method. The layer 13, the source electrode 14a, the drain electrode 14b, the interlayer insulating film 15, the pixel electrode 16, and the like are formed, and the TFT array layer 17 is formed.

<Second joining step>
First, for example, direct processing such as sand blasting or embossing on the surface of the inner portion C inside the outer peripheral portion F of the non-alkali glass glass substrate having a thickness of about 0.7 mm, or a fine resist By performing indirect processing such as etching using a pattern, the surface of the inner portion C is roughened so that the arithmetic average roughness Ra is 5 nm or more, and the second support substrate 71 (FIG. 2B). Reference).

  Subsequently, a non-alkali glass second tape material 72 (see FIG. 2B) having a thickness of about 5 μm and a width of about 2 mm is disposed on the outer peripheral portion F of the second support substrate 71, for example. Here, the thickness of the second tape material 72 is preferably about 5 μm to 50 μm.

  Further, as shown in FIG. 2B, on the second support substrate 71 on which the second tape material 72 is disposed, for example, a second substrate made of an alkali-free glass substrate having a thickness of about 0.05 mm. After the film substrate 30 is disposed, a reduced pressure atmosphere (for example, 0) is applied to the interface between the second support substrate 71 and the second tape material 72 and the interface between the second tape material 72 and the second film formation substrate 30. (About 1 Pa) under the respective laser beams L, the interface of each glass material is softened and fused, and the second supporting substrate 71 and the second film-forming substrate 30 are entirely surrounded by the outer peripheral portion F of each other. The 2nd glass joined body 80 is formed by joining over this. In addition, although it is preferable that joining in the outer peripheral part F is performed over the perimeter, the interface of the 2nd support substrate 71 and the 2nd tape material 72, and the 2nd tape material 72 and the 2nd film-forming substrate In the case where each surface has sufficient flatness at the interface with 30, it is possible to prevent infiltration of a chemical solution or the like in the second thin film element forming step by bringing the surfaces into close contact with each other. The joining at the outer peripheral portion F may be performed partially. Further, the thickness of the second film formation substrate 30 is preferably about 0.03 mm to 0.1 mm. Here, the second glass bonded body 80 is indirectly in surface contact with the outer peripheral portion F by the second tape material 72 at the interface between the second support substrate 71 and the second film formation substrate 30, and the second support substrate. The rough surface 71 is configured to suppress the contact area at the inner portion C. Further, in the second glass joined body 80, as shown in FIG. 2C, the size of the second deposition target substrate 30 in plan view is the same as that in the plan view of the inner portion C of the first glass joined body 70a. It is smaller than the size. Furthermore, in this embodiment, as shown in FIG. 2B, the second glass joined body in which the second tape material 72 is interposed at the interface between the outer peripheral portion F of the second support substrate 71 and the second deposition target substrate 30. Although 80 is illustrated, the second tape material 72 may be omitted as in the first glass joined body 70b.

<Second thin film element forming step>
The black matrix 31, the colored layer 32, and the common electrode are formed on the inner surface of the outer peripheral portion F of the second deposition target substrate 30 of the second glass bonded body 80 formed in the second bonding step using a known method. 33 or the like is formed, and the color filter layer 34 is formed.

<Bonding process>
First, for example, a sealant 46 is formed in a frame shape using a dispenser on the surface of the second deposition target substrate 30 of the second glass bonded body 80 on which the color filter layer 34 is formed in the second thin film element forming step. draw.

  Subsequently, for example, using a dispenser, the liquid crystal material (45) is dropped onto a region surrounded by the sealing material 46 on the surface of the second deposition target substrate 30 on which the sealing material 46 is drawn.

  Further, a second glass joined body 80 including the second film-forming substrate 30 onto which the liquid crystal material (45) is dropped, and a first glass joined body in which the TFT array layer 17 is formed in the first thin film element forming step. After bonding 70a under reduced pressure, it is released to atmospheric pressure, and the sealing material 46 is cured, thereby forming a bonded body 90 as shown in FIG. 2 (c).

<Separation process>
In each surface of the 1st glass joined body 70a and the 2nd glass joined body 80 of the bonding body 90 formed at the said bonding process, along a cutting line B (refer FIG.2 (c)), for example, a laser beam is used. By irradiation, the portion (10a) of the first film formation substrate 10 where the TFT array layer 17 is formed from the bonded body 90 and the portion (30a) of the second film formation substrate 30 where the color filter layer 34 is formed. ).

  As described above, the TFT substrate 20, the CF substrate 40, and the liquid crystal display panel 50 including them can be manufactured according to the present embodiment.

  As described above, according to the method of manufacturing the liquid crystal display panel 50 of the present embodiment, the first support substrate 61a made of relatively thick glass, and the first film-formed substrate 10 made of relatively thin glass, In the first bonding step in which the outer peripheral portions F are bonded to each other, the first glass bonding is performed such that the outer peripheral portion F at the interface between the first support substrate 61a and the first deposition target substrate 10 is in direct or indirect surface contact. Since the body 70a (70b) is formed, the end surface portions of the first support substrate 61a and the first deposition target substrate 10 that are in surface contact with the outer peripheral portion F are irradiated with the laser light L to slightly melt the end surface portions. The first support substrate 61a and the first film formation substrate 10 are bonded only by doing so, and the bonding at the outer peripheral portion F of the first support substrate 61a and the first film formation substrate 10 can be facilitated. it can. In the first bonding step, the first glass bonded body 70a (70b) is formed at the interface between the first support substrate 61a and the first deposition target substrate 10 so as to suppress the contact area at the inner portion C. When the TFT array layer 17 is formed on the surface of the first deposition target substrate 10 of the first glass bonded body 70a (70b) in the subsequent first thin film element forming step, the first glass bonded body 70a (70b) is Even if the inner portion C is in close contact, the adhesion at the inner portion C at the interface between the first support substrate 61a and the first film formation substrate 10 of the first glass bonded body 70a (70b) can be suppressed. On the other hand, in the second bonding step of bonding the relatively thick glass-made second support substrate 71 and the relatively thin glass-made second film-forming substrate 30 at the outer peripheral portion F, the second support substrate. Since the second glass joined body 80 is formed so as to be in direct or indirect surface contact with the outer peripheral portion F at the interface between the first substrate 71 and the second deposition target substrate 30, the second support is in surface contact with the outer peripheral portion F. The second support substrate 71 and the second film formation substrate 30 are joined by simply irradiating the end face portions of the substrate 71 and the second film formation substrate 30 with the laser light L and slightly melting the end face portions. Thus, the bonding at the outer peripheral portion F of the second support substrate 71 and the second deposition target substrate 30 can be facilitated. In the second bonding step, the second glass bonded body 80 is formed at the interface between the second support substrate 71 and the second deposition target substrate 30 so as to suppress the contact area at the inner portion C. When the color filter layer 34 is formed on the surface of the second deposition target substrate 30 of the second glass bonded body 80 in the second thin film element forming step, even if the second glass bonded body 80 is closely adhered to the inner portion C, Adherence at the inner portion C at the interface between the second support substrate 71 and the second film formation substrate 30 of the second glass bonded body 80 can be suppressed. Therefore, in the separation step performed after the bonding step of bonding the first glass bonded body 70a (70b) on which the TFT array layer 17 is formed and the second glass bonded body 80 on which the color filter layer 34 is formed, The first film-formed substrate on which the TFT array layer 17 is formed from the first glass bonded body 70a (70b) by cutting each outer peripheral portion F of the first glass bonded body 70a (70b) and the second glass bonded body 80 10 portions can be easily separated, and the portion of the second film-forming substrate 30 on which the color filter layer 34 is formed can be easily separated from the second glass joined body 80. The thin liquid crystal display panel 50 can be reliably manufactured using the film formation substrate 10 and the second film formation substrate 30, that is, a thin glass substrate. Therefore, in the manufacturing method of the thin liquid crystal display panel 50, the first support substrate 61a and the first film formation substrate 10 made of glass, and the outer peripheral portion F of the second support substrate 71 and the second film formation substrate 30 are used. Bonding and separation at the inner portion C can be facilitated.

  Further, according to the method for manufacturing the liquid crystal display panel 50 of the present embodiment, in the first bonding step, the first tape material made of glass is formed on the outer peripheral portion F at the interface between the first support substrate 61a and the first film formation substrate 10. 62a is disposed, and in the second bonding step, a second tape material 72 made of glass is disposed on the outer peripheral portion F at the interface between the second support substrate 71 and the second film formation substrate 30, and the second film formation substrate. The 2nd glass joined body 80 is formed so that the magnitude | size of 30 may become smaller than the magnitude | size of the inner side part C of the 1st glass joined body 70a, and a 1st glass joined body 70a and a 2nd glass joined in a bonding process. Since the body 80 is bonded at an interval equal to or greater than the thickness of the second tape material 72, the body 80 is formed on the surface of the first deposition target substrate 10 of the first glass joined body 70a due to the thickness of the first tape material 62a. Surface step and the second glass joined body 80 2 The first glass bonded body 70a and the second glass bonded body 80 are securely bonded to the surface of the film formation substrate 30 without being affected by the surface step formed due to the thickness of the second tape material 72. Can be matched.

  Further, according to the method for manufacturing the liquid crystal display panel 50 of the present embodiment, the first glass bonding is performed by bonding the first support substrate 61a and the first film formation substrate 10 at the outer peripheral portion F in a reduced-pressure atmosphere. The body 70a (70b) is formed, and the second support substrate 71 and the second deposition target substrate 30 are bonded to each other at the outer peripheral portion F to form the second glass bonded body 80. Therefore, the first support substrate 61a In addition, an air layer is hardly formed at the interface between the first deposition target substrate 10 and the second support substrate 71 and the second deposition target substrate 30, and the first glass bonded body 70 a under a vacuum or high temperature. (70b) and the breakage of the second glass joined body 80 can be suppressed.

  In the present embodiment, a method for manufacturing a liquid crystal display panel in which the surfaces of the first support substrate 61a and the second support substrate 71 are roughened is exemplified. 2 The present invention can also be applied to a method for manufacturing a liquid crystal display panel in which each surface of the film formation substrate 30 is roughened.

<< Embodiment 2 of the Invention >>
FIG. 4 is a cross-sectional view of the first glass joined body 70c formed in the first joining step for manufacturing the liquid crystal display panel of the present embodiment. In addition, in each following embodiment, the same code | symbol is attached | subjected about the same part as FIGS. 1-3, and the detailed description is abbreviate | omitted.

  In Embodiment 1 described above, the method of manufacturing the liquid crystal display panel by forming the first glass joined body so that one surface of the inner side of the supporting substrate and the deposition target substrate is a rough surface is illustrated. In the embodiment, a method of manufacturing a liquid crystal display panel by forming a first glass joined body so as to dispose a spacer and a tape material at an interface between a support substrate and a deposition target substrate is illustrated.

  Although the manufacturing method of the liquid crystal display panel of this embodiment is provided with the 1st joining process, the 1st thin film element formation process, the 2nd joining process, the 2nd thin film element formation process, the pasting process, and the separation process, the 1st thin film element The forming process, the second thin film element forming process, the bonding process, and the separating process are substantially the same as the corresponding processes in the first embodiment, and the second bonding process is the same as the first bonding process and the size of the substrate. In this embodiment, only the first bonding step will be described.

<First joining step>
First, for example, an alkali-free glass having a thickness of about 5 μm and a width of about 3 mm is formed on the outer peripheral portion F of the first support substrate 61b (see FIG. 4) made of an alkali-free glass substrate having a thickness of about 0.7 mm. The first tape material 62a is disposed, and a plurality of spacers 63 (see FIG. 4) such as spherical silica particles having a diameter of about 5 μm or cylindrical glass fibers are provided on the inner side C inside the outer peripheral part F. Deploy. In the present embodiment, the spacers 63 are exemplified as those scattered on the substrate surface. However, the spacers 63 may be photo spacers formed on the substrate surface using photolithography. Here, the height of the spacer 63 is preferably 5 μm or less.

  Subsequently, as shown in FIG. 4, on the first support substrate 61b on which the first tape material 62a and the spacer 63 are arranged, for example, a first substrate made of an alkali-free glass substrate having a thickness of about 0.05 mm. After the deposition substrate 10 is disposed, a reduced pressure atmosphere (for example, the interface between the first support substrate 61b and the first tape material 62a and the interface between the first tape material 62a and the first deposition target substrate 10) Each of the glass materials is softened and fused by irradiating the laser beam L under about 0.1 Pa), so that the first supporting substrate 61b and the first film-forming substrate 10 are completely moved at the outer peripheral portion F of each other. By joining over the circumference, the first glass joined body 70c is formed. Here, the first glass joined body 70c is indirectly in surface contact with the outer peripheral portion F by the first tape material 62a at the interface between the first support substrate 61b and the first deposition target substrate 10, and by the spacers 63. It is comprised so that the contact area in the inner part C may be suppressed. In addition, although it is preferable that joining in the outer peripheral part F is performed over the perimeter, you may be performed partially like the said Embodiment 1. FIG.

  Thereafter, similarly to the first embodiment, the liquid crystal display panel of the present embodiment is manufactured by sequentially performing the first thin film element forming step, the second bonding step, the second thin film element forming step, the bonding step, and the separation step. can do.

  As described above, according to the method of manufacturing the liquid crystal display panel of the present embodiment, the first support substrate 61b made of a relatively thick glass and the first glass substrate made of a relatively thin glass, as in the first embodiment. In the first bonding step of bonding the first film formation substrate 10 to each other at the outer peripheral portion F, the outer peripheral portion F at the interface between the first support substrate 61b and the first film formation substrate 10 is interposed via the first tape material 62a. Since the first glass joined body 70c is formed so as to be in indirect surface contact, the laser beam L is applied to the end surfaces of the first support substrate 61b and the first film formation substrate 10 that are in surface contact with the outer peripheral portion F. The first support substrate 61b and the first film formation substrate 10 are joined by irradiating and slightly melting the end face portion, and the outer peripheral portion F of the first support substrate 61b and the first film formation substrate 10 is joined. Can be easily joined. In the first bonding step, the first glass bonded body 70c is formed at the interface between the first support substrate 61b and the first deposition target substrate 10 so as to suppress the contact area at the inner portion C. When the TFT array layer 17 is formed on the surface of the first film formation substrate 10 of the first glass bonded body 70c in the first thin film element forming step, even if the first glass bonded body 70c is in close contact with the inner portion C, Adhesion at the inner portion C at the interface between the first support substrate 61b and the first film formation substrate 10 of the first glass bonded body 70c can be suppressed. Further, in the second bonding step, as in the first embodiment, it is possible to facilitate the bonding at the outer peripheral portion F of the second support substrate and the second film formation substrate, and the second glass bonded body. Since adhesion at the inner portion C at the interface between the second support substrate and the second film formation substrate can be suppressed, the outer periphery of the glass support substrate and the film formation substrate in the thin liquid crystal display panel manufacturing method The joining at the part F and the separation at the inner part C can be facilitated.

<< Embodiment 3 of the Invention >>
FIG. 5 is a cross-sectional view of the first glass joined body 70d formed in the first joining step for manufacturing the liquid crystal display panel of the present embodiment.

  In the first and second embodiments, the method of manufacturing the liquid crystal display panel by forming the first glass joined body so that the end face of the first film formation substrate and the end face of the first tape material coincide with each other is exemplified. In this embodiment, a method of manufacturing a liquid crystal display panel by forming the first glass joined body so that the end portion of the first tape material protrudes from the end face of the first deposition target substrate is exemplified.

  Although the manufacturing method of the liquid crystal display panel of this embodiment is provided with the 1st joining process, the 1st thin film element formation process, the 2nd joining process, the 2nd thin film element formation process, the pasting process, and the separation process, the 1st thin film element The forming process, the second thin film element forming process, the bonding process, and the separating process are substantially the same as the corresponding processes in the first embodiment, and the second bonding process is the same as the first bonding process and the size of the substrate. In this embodiment, only the first bonding step will be described.

<First joining step>
First, for example, the first tape material 62b of non-alkali glass having a thickness of about 5 μm and a width of about 3 mm is formed on the outer peripheral portion F of the first support substrate 61b made of a non-alkali glass glass substrate having a thickness of about 0.7 mm. (Refer to FIG. 5), and a plurality of spacers 63 such as spherical silica particles having a diameter of about 5 μm or cylindrical glass fibers are arranged on the inner side C inside the outer peripheral part F. Here, as shown in FIG. 5, the first tape material 62b has its outer peripheral end disposed inside the peripheral end of the first support substrate 61b.

  Subsequently, on the first support substrate 61b on which the first tape material 62b and the spacer 63 are disposed, for example, the first film formation substrate 10 made of an alkali-free glass substrate having a thickness of about 0.05 mm is disposed. . Here, as shown in FIG. 5, the peripheral edge of the first deposition target substrate 10 is arranged inside the outer peripheral edge of the first tape material 62 b.

  Further, as shown in FIG. 5, a reduced pressure atmosphere (for example, for example, the interface between the first support substrate 61b and the first tape material 62b and the interface between the first tape material 62b and the first film-formed substrate 10). Each of the glass materials is softened and fused by irradiating the laser beam L under about 0.1 Pa), so that the first supporting substrate 61b and the first film-forming substrate 10 are completely moved at the outer peripheral portion F of each other. The first glass bonded body 70d is formed by bonding over the circumference. Here, the first glass bonded body 70d is indirectly in surface contact with the outer peripheral portion F by the first tape material 62b at the interface between the first support substrate 61b and the first deposition target substrate 10, and by the spacers 63. It is comprised so that the contact area in the inner part C may be suppressed. In addition, although it is preferable that joining in the outer peripheral part F is performed over the perimeter, you may be performed partially like the said Embodiment 1. FIG.

  Thereafter, similarly to the first embodiment, the liquid crystal display panel of the present embodiment is manufactured by sequentially performing the first thin film element forming step, the second bonding step, the second thin film element forming step, the bonding step, and the separation step. can do.

  As described above, according to the method of manufacturing the liquid crystal display panel of the present embodiment, the first support substrate 61b made of a relatively thick glass and the first glass substrate made of a relatively thin glass, as in the first embodiment. In the first bonding step in which the first film formation substrate 10 is bonded to each other at the outer peripheral portion F, surface contact is indirectly made at the outer peripheral portion F at the interface between the first support substrate 61b and the first film formation substrate 10. Since the first glass bonded body 70d is formed, the end surface portions of the first support substrate 61b and the first film formation substrate 10 that are in surface contact with the outer peripheral portion F are irradiated with the laser light L, and the end surface portions are slightly formed. The first support substrate 61b and the first film formation substrate 10 are bonded only by melting, and the bonding at the outer peripheral portion F of the first support substrate 61b and the first film formation substrate 10 is facilitated. Can do. In the first bonding step, the first glass bonded body 70d is formed at the interface between the first support substrate 61b and the first deposition target substrate 10 so as to suppress the contact area at the inner portion C. When the TFT array layer 17 is formed on the surface of the first film formation substrate 10 of the first glass bonded body 70d in the first thin film element forming step, even if the first glass bonded body 70d is in close contact with the inner portion C, Adherence at the inner portion C at the interface between the first support substrate 61b and the first deposition target substrate 10 of the first glass bonded body 70d can be suppressed. Further, in the second bonding step, as in the first embodiment, it is possible to facilitate the bonding at the outer peripheral portion F of the second support substrate and the second film formation substrate, and the second glass bonded body. Since adhesion at the inner portion C at the interface between the second support substrate and the second film formation substrate can be suppressed, the outer periphery of the glass support substrate and the film formation substrate in the thin liquid crystal display panel manufacturing method The joining at the part F and the separation at the inner part C can be facilitated.

  Further, according to the method of manufacturing the liquid crystal display panel of the present embodiment, when forming the first glass joined body 70d, the outer peripheral end of the first tape material 62b is connected to the peripheral end of the first film formation substrate 10 and the first end. Since it is disposed between the peripheral edge of the support substrate 61b, the laser beam L is applied to the interface between the first support substrate 61b and the first tape material 62b and the interface between the first tape material 62b and the deposition target substrate 10. Therefore, the first support substrate 61b and the deposition target substrate 10 can be bonded efficiently.

<< Embodiment 4 of the Invention >>
FIG. 6 is a cross-sectional view of the first glass joined body 70e formed in the first joining step for manufacturing the liquid crystal display panel of the present embodiment.

  In the first, second, and third embodiments, the first glass joined body is formed so that the first tape material made of glass is interposed at the outer peripheral portion at the interface between the first support substrate and the first film-formed substrate, and the liquid crystal In the present embodiment, the method of manufacturing the display panel is exemplified. However, in the present embodiment, the first glass joined body is disposed so that the glass amorphous material is interposed in the outer peripheral portion at the interface between the first support substrate and the first film formation substrate. The method of forming and manufacturing a liquid crystal display panel is illustrated.

  Although the manufacturing method of the liquid crystal display panel of this embodiment is provided with the 1st joining process, the 1st thin film element formation process, the 2nd joining process, the 2nd thin film element formation process, the pasting process, and the separation process, the 1st thin film element The forming process, the second thin film element forming process, the bonding process, and the separating process are substantially the same as the corresponding processes in the first embodiment, and the second bonding process is the same as the first bonding process and the size of the substrate. In this embodiment, only the first bonding step will be described.

<First joining step>
First, for example, on the outer periphery F of the first support substrate 61b made of an alkali-free glass substrate having a thickness of approximately 0.7 mm, for example, an irregular shape such as an alkali-free glass powder glass or glass paste having a width of approximately 3 mm. A material 62c (see FIG. 6) is arranged, and a plurality of spacers 63 such as spherical silica particles having a diameter of about 5 μm or cylindrical glass fibers are arranged on the inner side C inside the outer peripheral part F.

  Subsequently, as shown in FIG. 6, on the first support substrate 61b on which the irregular shaped material 62c and the spacer 63 are arranged, for example, a first deposition made of an alkali-free glass substrate having a thickness of about 0.05 mm. After disposing the film substrate 10, the interface of each glass material is softened and fused by irradiating the side surface of the amorphous material 62c with the laser light L under a reduced pressure atmosphere (for example, about 0.1 Pa). The first glass substrate 70e is formed by bonding the first support substrate 61b and the first film formation substrate 10 over the entire circumference at the outer peripheral portion F of each other. Here, the first glass bonded body 70e is indirectly in surface contact with the outer peripheral portion F by the indeterminate shape material 62c at the interface between the first support substrate 61b and the first film-formed substrate 10, and is inner by each spacer 63. It is comprised so that the contact area in the part C may be suppressed. In addition, although it is preferable that joining in the outer peripheral part F is performed over the perimeter, you may be performed partially like the said Embodiment 1. FIG.

  Thereafter, similarly to the first embodiment, the liquid crystal display panel of the present embodiment is manufactured by sequentially performing the first thin film element forming step, the second bonding step, the second thin film element forming step, the bonding step, and the separation step. can do.

  As described above, according to the method of manufacturing the liquid crystal display panel of the present embodiment, the first support substrate 61b made of a relatively thick glass and the first glass substrate made of a relatively thin glass, as in the first embodiment. In the first bonding step in which the first film formation substrate 10 is bonded to each other at the outer peripheral portion F, surface contact is indirectly made at the outer peripheral portion F at the interface between the first support substrate 61b and the first film formation substrate 10. Since the first glass bonded body 70e is formed, the end surface portions of the first support substrate 61b and the first film formation substrate 10 that are in surface contact with the outer peripheral portion F are irradiated with the laser light L, and the end surface portions are slightly formed. The first support substrate 61b and the first film formation substrate 10 are bonded only by melting, and the bonding at the outer peripheral portion F of the first support substrate 61b and the first film formation substrate 10 is facilitated. Can do. In the first bonding step, the first glass bonded body 70e is formed at the interface between the first support substrate 61b and the first deposition target substrate 10 so as to suppress the contact area at the inner portion C. When the TFT array layer 17 is formed on the surface of the first film formation substrate 10 of the first glass bonded body 70e in the first thin film element forming step, even if the first glass bonded body 70e is in close contact with the inner portion C, The adhesion of the first glass bonded body 70e at the inner portion C at the interface between the first support substrate 61b and the first deposition target substrate 10 can be suppressed. Further, in the second bonding step, as in the first embodiment, it is possible to facilitate the bonding at the outer peripheral portion F of the second support substrate and the second film formation substrate, and the second glass bonded body. Since adhesion at the inner portion C at the interface between the second support substrate and the second film formation substrate can be suppressed, the outer periphery of the glass support substrate and the film formation substrate in the thin liquid crystal display panel manufacturing method The joining at the part F and the separation at the inner part C can be facilitated.

<< Embodiment 5 of the Invention >>
FIG. 7 is a cross-sectional view of the first glass bonded body 70f formed in the first bonding step for manufacturing the liquid crystal display panel of the present embodiment.

  In Embodiment 4 described above, a liquid crystal display panel is manufactured by forming a first glass joined body so that an amorphous glass material is interposed at the outer peripheral portion at the interface between the first support substrate and the first film-formed substrate. Although the method is exemplified, in the present embodiment, the first glass joined body is formed so that the glass amorphous material is interposed along the end face of the first deposition target substrate on the first support substrate, and the liquid crystal A method for manufacturing a display panel is illustrated.

  Although the manufacturing method of the liquid crystal display panel of this embodiment is provided with the 1st joining process, the 1st thin film element formation process, the 2nd joining process, the 2nd thin film element formation process, the pasting process, and the separation process, the 1st thin film element The forming process, the second thin film element forming process, the bonding process, and the separating process are substantially the same as the corresponding processes in the first embodiment, and the second bonding process is the same as the first bonding process and the size of the substrate. In this embodiment, only the first bonding step will be described.

<First joining step>
First, for example, direct processing such as sand blasting or embossing on the surface of the inner portion C inside the outer peripheral portion F of the non-alkali glass glass substrate having a thickness of about 0.7 mm, or a fine resist By performing indirect processing such as etching using a pattern, the surface of the inner portion C is roughened so that the arithmetic average roughness Ra is 5 nm or more, thereby forming the first support substrate 61a.

  Subsequently, after disposing the first film formation substrate 10 made of, for example, a non-alkali glass glass substrate having a thickness of about 0.05 mm on the first support substrate 61a, the end surface of the first film formation substrate 10 is arranged. An amorphous material 62d (see FIG. 7) such as non-alkali glass powder glass or glass paste is applied to the lower part of the figure.

  Furthermore, as shown in FIG. 7, the interface of each glass material is softened and melted by irradiating the applied amorphous material 62d with a laser beam L under a reduced pressure atmosphere (for example, about 0.1 Pa). The first glass bonded body 70f is formed by bonding the first support substrate 61a and the first film formation substrate 10 to each other at the outer peripheral portion F over the entire periphery. Here, the first glass bonded body 70f is in direct surface contact with the outer peripheral portion F at the interface between the first support substrate 61a and the first film-formed substrate 10, and on the inner side by the rough surface of the first support substrate 61a. It is comprised so that the contact area in the part C may be suppressed. In addition, although it is preferable that joining in the outer peripheral part F is performed over the perimeter, you may be performed partially like the said Embodiment 1. FIG.

  Thereafter, similarly to the first embodiment, the liquid crystal display panel of the present embodiment is manufactured by sequentially performing the first thin film element forming step, the second bonding step, the second thin film element forming step, the bonding step, and the separation step. can do.

  As described above, according to the method of manufacturing the liquid crystal display panel of the present embodiment, the first support substrate 61a made of relatively thick glass and the first glass substrate made of relatively thin glass, as in the first embodiment. In the first bonding step in which the first film formation substrate 10 is bonded to each other at the outer peripheral portion F, surface contact is indirectly made at the outer peripheral portion F at the interface between the first support substrate 61 a and the first film formation substrate 10. Since the first glass bonded body 70f is formed, the end surface portions of the first support substrate 61a and the first film formation substrate 10 that are in surface contact with the outer peripheral portion F are irradiated with the laser light L, and the end surface portions are slightly formed. The first support substrate 61a and the first film formation substrate 10 are bonded only by melting, and the bonding at the outer peripheral portion F of the first support substrate 61a and the first film formation substrate 10 is facilitated. Can do. In the first bonding step, the first glass bonded body 70f is formed at the interface between the first support substrate 61a and the first deposition target substrate 10 so as to suppress the contact area at the inner portion C. When the TFT array layer 17 is formed on the surface of the first deposition target substrate 10 of the first glass bonded body 70f in the first thin film element forming step, even if the first glass bonded body 70f is in close contact with the inner portion C, The adhesion of the first glass bonded body 70f at the inner portion C at the interface between the first support substrate 61a and the first deposition target substrate 10 can be suppressed. Further, in the second bonding step, as in the first embodiment, it is possible to facilitate the bonding at the outer peripheral portion F of the second support substrate and the second film formation substrate, and the second glass bonded body. Since adhesion at the inner portion C at the interface between the second support substrate and the second film formation substrate can be suppressed, the outer periphery of the glass support substrate and the film formation substrate in the thin liquid crystal display panel manufacturing method The joining at the part F and the separation at the inner part C can be facilitated.

Embodiment 6 of the Invention
In each of the above embodiments, a method of manufacturing a liquid crystal display panel by forming a glass joined body including a support substrate and a deposition target substrate whose end faces are not chamfered is illustrated, but in this embodiment, FIG. As shown in FIG. 1, in order to suppress damage due to external impact, the first glass joined bodies 70g to 70i including the first support substrate 61c and the first film formation substrates 10b to 10d whose end faces are chamfered are provided. The method of forming and manufacturing a liquid crystal display panel is illustrated. Here, Fig.8 (a)-FIG.8 (c) are each sectional drawing of the 1st glass joining bodies 70g-70i formed at the 1st joining process for manufacturing the liquid crystal display panel of this embodiment. .

  In the first glass joined body 70g, as shown in FIG. 8A, the upper end portion of the first film-forming substrate 10b on the first support substrate 61c whose upper and lower end surfaces are chamfered is chamfered. Yes.

  In the first glass joined body 70h, as shown in FIG. 8B, the upper and lower ends of the end face of the first film-formed substrate 10c on the first support substrate 61c are chamfered.

  In the first glass bonded body 70i, as shown in FIG. 8C, the end surface of the first film formation substrate 10d on the first support substrate 61c is curved because it is cut by laser light or the like.

  Here, in the first glass joined bodies 70h and 70i, as shown in FIGS. 8B and 8C, unnecessary reflection and absorption occur in the irradiated portion of the laser light L, and the first support Although there is a possibility that the amount of light at the interface between the substrate 61c and the first film formation substrates 10c and 10d may decrease, in the first glass joined body 70g, as shown in FIG. Since the peripheral edge of 10b is arranged inside the peripheral edge of the first support substrate 61c, the corner on the first support substrate 61c side in the cross-sectional shape along the thickness direction of the first film formation substrate 10b is a right angle. When forming the first glass joined body 70g, it becomes difficult to form a gap in the interface portion between the first support substrate 61c and the first film-formed substrate 10b, and the laser beam L is reliably irradiated to the interface portion. The first support substrate 61c and the first film formation substrate 10b can be It can be joined to easily.

  In each of the above embodiments, a method for manufacturing a liquid crystal display panel has been exemplified. However, the present invention can also be applied to a method for manufacturing a TFT substrate and a CF substrate constituting a liquid crystal display panel, respectively.

  In each of the above embodiments, a liquid crystal display panel is exemplified as the display panel. However, the present invention is an organic EL (Electro Luminescence) panel, an electrowetting display panel, and a MEMS (Micro Electro Mechanical System) display. The present invention can also be applied to other display panels such as a panel.

  In each of the above embodiments, the TFT substrate using the TFT electrode connected to the pixel electrode as the drain electrode has been exemplified. However, the present invention is applied to the TFT substrate called the source electrode. Can also be applied.

  As described above, the present invention can facilitate the bonding at the outer peripheral portion and the separation at the inner portion of the glass support substrate and the deposition target substrate, and thus the thin substrate using the thin glass substrate. It is useful for the thin film element substrate and the display panel including the same.

C inner part F outer peripheral part 10, 10b-10d 1st film-forming substrate 17 TFT array layer (first thin film element)
20 TFT substrate (thin film device substrate)
30 Second substrate 34 Color filter layer (second thin film element)
40 CF substrate (thin film device substrate)
50 Liquid crystal display panels 61a to 61c First support substrates 62a and 62b First tape material 63 Spacers 70a to 70i First glass joined body 71 Second support substrate 72 Second tape material

Claims (9)

A bonding step of forming a glass bonded body by bonding a relatively thick glass supporting substrate and a relatively thin glass film-forming substrate at the outer periphery of each other,
A thin film element forming step of forming a thin film element on the inner surface of the outer peripheral portion of the film formation substrate of the glass bonded body formed in the bonding step;
A separation step of separating a portion of the film formation substrate on which the thin film element is formed from the glass bonded body by cutting an outer peripheral portion of the glass bonded body on which the thin film element is formed in the thin film element forming step. ,
In the bonding step, at the interface between the support substrate and the deposition target substrate, surface contact is made directly or indirectly at the outer peripheral portion, and the contact area at the inner portion inside the outer peripheral portion is suppressed. The manufacturing method of the thin film element substrate which forms the said glass joined body.   2. The thin film element substrate according to claim 1, wherein, in the bonding step, the glass bonded body is formed so that one surface of the inner portion is a rough surface at an interface between the support substrate and the deposition target substrate. Production method.   3. The thin film element substrate according to claim 2, wherein, in the bonding step, the glass bonded body is formed so that a glass tape material is disposed on the outer peripheral portion at an interface between the support substrate and the deposition target substrate. Production method.   In the bonding step, a plurality of spacers for maintaining the distance between the support substrate and the film formation substrate are disposed on the inner side at the interface between the support substrate and the film formation substrate, respectively, and the outer peripheral portion is provided with the spacer. The method for producing a thin film element substrate according to claim 1, wherein the glass joined body is formed so as to dispose a glass tape material.   In the bonding step, the peripheral edge of the film formation substrate is disposed inside the peripheral edge of the support substrate, and the outer peripheral edge of the tape material is the peripheral edge of the film formation substrate and the peripheral edge of the support substrate. The method for producing a thin film element substrate according to claim 3, wherein the glass joined body is formed so as to be disposed between the two.   6. The method for manufacturing a thin film element substrate according to claim 1, wherein, in the bonding step, the supporting substrate and the deposition target substrate are bonded to each other at a peripheral portion in a reduced pressure atmosphere. The deposition substrate has a right-angle corner on the support substrate side in a cross-sectional shape along the thickness direction,
7. The glass bonding body according to claim 1, wherein in the bonding step, the glass bonded body is formed such that a peripheral edge of the deposition target substrate is disposed inside a peripheral edge of the support substrate. Manufacturing method of thin film element substrate. A first bonding step of forming a first glass bonded body by bonding a relatively thick first supporting substrate made of glass and a first thin film forming substrate made of glass at the outer periphery of each other; ,
A first thin film element forming step of forming a first thin film element on an inner surface of an outer peripheral portion of the first deposition target substrate of the first glass bonded body formed in the first bonding step;
A second joining step of forming a second glass joined body by joining a relatively thick glass-made second support substrate and a relatively thin glass-made second film-forming substrate at the outer periphery of each other; ,
A second thin film element forming step of forming a second thin film element on the inner surface of the outer peripheral portion of the second deposition target substrate of the second glass bonded body formed in the second bonding step;
The first thin film element includes a first glass bonded body in which the first thin film element is formed in the first thin film element forming process, and a second glass bonded body in which the second thin film element is formed in the second thin film element forming process. And the bonding process which forms a bonding body by bonding together so that a 2nd thin film element may mutually oppose,
The 1st film-forming by which the said 1st thin film element was formed from this bonding body by cut | disconnecting each outer peripheral part of the 1st glass bonding body and 2nd glass bonding body in the bonding body formed at the said bonding process. A separation step of separating a portion of the substrate and a portion of the second film-formed substrate on which the second thin film element is formed,
In the first bonding step, at the interface between the first support substrate and the first film formation substrate, the outer peripheral portion is in direct or indirect surface contact, and the inner inner portion is in contact with the outer peripheral portion. In order to suppress the area, the first glass joined body is formed,
In the second bonding step, at the interface between the second support substrate and the second film formation substrate, the outer peripheral portion is in direct or indirect surface contact, and the inner inner portion is in contact with the outer peripheral portion. The manufacturing method of the display panel which forms the said 2nd glass joined body so that an area may be suppressed. In the first bonding step, the first glass bonded body is formed at the interface between the first support substrate and the first film-formed substrate so that the first tape material made of glass is disposed on the outer periphery.
In the second bonding step, at the interface between the second support substrate and the second film formation substrate, a second tape material made of glass is disposed on the outer peripheral portion, and the size of the second film formation substrate is the size described above. Forming the second glass joined body so as to be smaller than the size of the inner side of the first glass joined body,
The method for manufacturing a display panel according to claim 8, wherein, in the bonding step, the first glass bonded body and the second glass bonded body are bonded to each other at an interval equal to or greater than the thickness of the second tape material.

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