WO2013001771A1

WO2013001771A1 - Display device manufacturing method

Info

Publication number: WO2013001771A1
Application number: PCT/JP2012/004069
Authority: WO
Inventors: 信介齋田
Original assignee: シャープ株式会社
Priority date: 2011-06-28
Filing date: 2012-06-22
Publication date: 2013-01-03

Abstract

In the present invention, a TFT substrate (10) provided with, on a side edge section of the TFT substrate, a terminal section (12) for connecting an outer circuit, and a flexible opposing substrate (20) are caused to oppose each other and be bonded together via a sealing material (30) inward from the terminal section (12) so that the opposing substrate (20) extends out to a region opposite to the terminal section (12) and at least a portion of the terminal section (12) is covered by an extension portion (20a) of the opposing substrate (20), after which the extension portion (20a) the opposing substrate (20) is bent so as to turn away from the terminal section (12) and is made into a curved state with an expanded space therebetween with the terminal section (12), and in this curved state, the extension portion (20a) of the opposite substrate (20) is cut off on the outer side of the seal material (30) by laser light (L) to expose the terminal section (12) with respect to the opposite substrate (20).

Description

Manufacturing method of display device

The present invention relates to a method for manufacturing a display device, and more particularly to measures for preventing damage to terminal portions in a display device using a plastic substrate.

A liquid crystal display device, which is a kind of display device, includes an element substrate on which a switching element such as a TFT (Thin Film Transistor) and a pixel electrode are formed, and a counter substrate on which a common electrode facing the element substrate is formed. A structure in which a liquid crystal layer is sealed inside the sealing material between the two substrates is bonded to each other through a frame-shaped sealing material that surrounds the electrode pair. A portion in which the liquid crystal layer is interposed constitutes a display unit that displays an image.

In a liquid crystal display device, the element substrate is protruded to the side of the counter substrate and the side edge of the element substrate exposed from the counter substrate is used as a terminal portion, and the terminal portion is provided outside the display portion. is there. Thus, since the terminal portion is configured by exposing the element substrate from the counter substrate outside the sealing material, it is necessary to remove the counter substrate portion extending above the terminal portion in the manufacturing process. Hereinafter, the counter substrate portion to be removed is referred to as a material removal portion, and the step of removing the material removal portion is referred to as a terminal extraction step.

As such a liquid crystal display device, instead of an element substrate using a glass substrate and a counter substrate, a flexible plastic substrate is used, and an element substrate capable of reducing the overall weight and thickness of the device, and A liquid crystal display device including a counter substrate is known.

In the terminal drawing process in the manufacture of a liquid crystal display device using a plastic substrate, the plastic substrate has a property that is more flexible and has higher tensile strength than a glass substrate, so the so-called scribe break method, that is, the element substrate and the counter substrate. After the scribe groove is put on the design dividing line with a diamond cutter etc., the substrate is divided by applying a pressing force to the dividing line and the material removal part is folded. It is difficult to apply the method to take.

Therefore, various methods have been proposed for the terminal drawing process in the manufacture of a liquid crystal display device using a plastic substrate.

For example, in Patent Document 1, as a terminal extraction process, a diamond cutter performs a half cut that leaves a predetermined thickness on the cutting line of the material removal portion of the counter substrate, and the element substrate is bent at the terminal portion and the terminal portion. A method for removing a material removal portion by separating the material removal portion after causing the material removal portion to be raised by a removal head is disclosed.

Further, in Patent Document 2, as a terminal extracting step, a scribe groove is formed in a parting line of a material removal portion in a counter substrate by laser light irradiation, and then a peripheral side surface is formed of an elastic body and the peripheral side surface is adhesive. A cylindrical rotating body having a scribe groove is adhered to the outer surface of the counter substrate on which a scribe groove is formed, and the counter substrate is bent by the rotation of the rotating body and is broken along the scribe groove. A method of tearing off the part is disclosed.

In addition, in Patent Document 3, a reflection metal film that reflects laser light is formed on the parting line of the material removal portion on the surface of the counter substrate that faces the element substrate as a terminal extraction step. A method of cutting the material removal portion by irradiation is disclosed. According to the document 3, according to the method, when the material removal part is cut by laser light irradiation, the reflection metal film blocks the irradiation of the laser light to the terminal part, and the damage to the terminal part can be reduced. Is described.

JP 2001-0255518 A JP 2010-2435556 A JP 2009-0098425 A

However, in the terminal extraction process of Patent Document 1, it is difficult to half-cut the plastic substrate using a diamond cutter as the plastic substrate becomes thinner. The substrate is likely to be completely cut. In this case, since the material removal portion and the terminal portion are in a positional relationship close to each other, the diamond cutter reaches the terminal portion and damages the wiring and terminals on the terminal portion, which may damage the terminal portion.

Also, in the terminal pulling out process of Patent Document 2, the material removal part is torn along the scribe groove, so that burrs are generated on the fracture surface. Although the substrate with burrs becomes a cause of defects in the subsequent process, it takes time to chamfer the burrs, and the manufacturing efficiency decreases. In addition, when a scribe groove is formed in a plastic substrate by laser light irradiation, a relatively thick substrate must be adopted as the plastic substrate in order to avoid a situation in which the laser light penetrates the plastic substrate. If it does so, the advantage of the plastic substrate which enables thickness reduction and weight reduction cannot fully be utilized.

In addition, in the terminal extraction process of Patent Document 3, the reflective metal film is melted by the irradiation energy of the laser beam, and the metal piece is scattered on the terminal part, and the adjacent wiring and terminals on the terminal part connect the metal piece. There is a risk of short circuit. Further, when the plastic substrate constituting the counter substrate has extremely high flexibility, the cut-side end portion bends toward the terminal portion side, so that the remaining portion of the reflective metal film remaining on the cut-side end portion is a terminal. There is also a risk of contact with the part, leading to poor conductivity in the terminal part.

Of course, the above-mentioned problems also occur in a liquid crystal display device using a plastic substrate only for the counter substrate.

The present invention has been made in view of such a point, and the object of the present invention is to cut the substrate portion extending above the terminal portion without generating burrs, without damaging the terminal portion. It is to expose in a good state with no poor conductivity.

In order to achieve the above object, in the present invention, the cutting means is completely cut in a curved state in which the material removal portion is bent and separated from the terminal portion.

Specifically, the method for manufacturing a display device according to the present invention has a structure in which a pair of substrates are bonded together with a sealing material, and one substrate has a terminal portion for connecting an external circuit at a side end. The present invention is directed to a method for manufacturing a display device in which at least the other substrate has flexibility, and the following solution is taken.

That is, the first invention is
A first substrate having a terminal portion for connecting an external circuit at a side end portion and a second substrate having flexibility are opposed to each other, and the second substrate extends to an opposing region of the terminal portion. Displayed between the first substrate and the second substrate with or after being bonded via a sealing material located inside the terminal portion so that at least a part of the terminal portion is covered by the extending portion. A display panel manufacturing process for manufacturing a display panel by interposing a medium layer;
The extended portion of the second substrate is bent so as to be separated from the terminal portion, so that the space between the terminal portion and the extended portion is in a curved state, and the extended portion of the second substrate in the curved state And cutting out the outer side of the sealing material by a cutting means to expose the terminal portion from the second substrate.

In the first aspect of the present invention, the material removal portion of the second substrate bonded to the first substrate is bent in a terminal drawing step so as to be separated from the terminal portion, thereby forming a curved state. In this curved state, the space between the material removal portion and the terminal portion is widened, and the surface of the material removal portion facing the first substrate faces the outside of the terminal portion, so that the cutting means is applied to the terminal portion. The material removal portion can be cut without any problems. Thereby, even if it is a case where a laser beam is used as a cutting | disconnection means, it can avoid irradiating a laser beam to a terminal part. Then, since there is no need to form a reflective metal film on the cutting line as in Patent Document 3 described above, adjacent terminals and wirings on the terminal portion are short-circuited by cutting the material removal portion. Thus, it is possible to avoid a situation in which poor conductivity occurs in the terminal portion. Moreover, since the material removal portion can be completely cut by the cutting means, no burrs are generated on the cut surface.

According to a second aspect of the present invention, in the method for manufacturing the display device of the first aspect,
The curved state is a state in which the surface facing the first substrate in the extended portion of the second substrate faces the outside of the terminal portion so that the normal line does not pass through the terminal portion. Features.

In the second aspect of the invention, the material removal part is set in a curved state in which the normal line of the surface facing the first substrate does not pass through the terminal part in the terminal taking-out step. In this curved state, the material removal portion can be cut in a direction perpendicular to the surface of the second substrate without applying a cutting means to the terminal portion. If the material removal part is cut in an oblique direction with respect to the surface of the second substrate, the cut-side end of the second substrate remains in a relatively long and excessively protruding state on the outside of the sealing material, causing a defect in a later process. It becomes. On the other hand, according to the second invention, as described above, since the material removal portion can be cut in a direction perpendicular to the surface of the second substrate, occurrence of defects in the subsequent process can be suppressed.

According to a third aspect of the present invention, in the method for manufacturing the display device of the first or second aspect,
The first substrate also has flexibility,
In the terminal extraction step, the first substrate portion on the terminal portion side is also bent so as to be separated from the second substrate.

In the third aspect of the invention, in addition to making the second substrate curved, the first substrate portion on the terminal side is also bent away from the second substrate so that it is also curved. In this way, when both the material removal portion and the first substrate portion on the terminal portion side are in a curved state, the material removal portion and the first substrate portion on the terminal portion side are separated from each other. Compared to the case where only the curved portion is curved, even if the bending angle for bending the material removal portion is small, the first substrate portion on the terminal portion side is also in the curved state between the material removal portion and the terminal portion. Can fully expand the space. Thereby, it becomes much easier to perform the cutting process of the material removal part without applying the cutting means to the terminal part.

In addition, since the bending angle for bending the material removal portion is smaller than in the case where only the material removal portion is in a curved state, the stress applied to the bonding surface between the second substrate and the sealing material is suppressed, and The two substrates are prevented from peeling off from the sealing material. Furthermore, as in the second aspect of the invention, it is possible to easily realize a curved state in which the surface facing the first substrate in the material removal portion faces the outside of the terminal portion so that the normal line does not pass through the terminal portion. Therefore, it is possible to easily suppress the occurrence of defects in the subsequent process.

According to a fourth aspect of the present invention, in the method for manufacturing the display device according to the third aspect of the present invention,
In the terminal pulling-out step, the display panel is placed on a curved stage having a convex curved surface with suction means for fixing the display panel by suction so that the first substrate is located on the stage side. The first substrate portion on the terminal side is bent so as to be separated from the second substrate by the suction operation of the curved stage.

In the fourth aspect of the invention, a curved surface stage is employed as the stage on which the display panel is placed, and the first substrate portion on the terminal portion side is bent so as to be separated from the second substrate side by the suction means provided in the curved surface stage. Compared to the case where a tool other than the stage on which the display panel is placed is used separately or in combination with the same stage, the first substrate portion on the terminal side is simplified. The curved state can be obtained.

A fifth invention is a method of manufacturing a display device according to any one of the first to fourth inventions,
In the terminal extracting step, a laser beam is used as the cutting means.

In the fifth invention, laser light is used as the cutting means. Since the cutting process by laser light irradiation can be performed at high speed, the manufacturing efficiency of the display device can be improved.

A sixth invention is a method of manufacturing a display device according to the fifth invention, wherein
In the terminal projecting step, in the curved state, the second substrate is irradiated with laser light from the first substrate side.

In the sixth invention, the second substrate is irradiated with laser light from the first substrate side. Conversely, when the second substrate is irradiated with laser light from the opposite side of the first substrate, the laser beam is transmitted through the second substrate when the second substrate is irradiated with the laser light. There is a possibility that the light emission direction faces the terminal portion side due to refraction or scattering, and the laser light is irradiated to the terminal portion. On the other hand, according to the sixth aspect of the invention, it is possible to reliably prevent damage to the terminal portion by eliminating a factor that the terminal portion is irradiated with laser light.

A seventh invention is the method of manufacturing a display device according to any one of the first to fourth inventions,
In the terminal drawing step, an ultrasonic cutter or a heat cutter is used as the cutting means.

In this seventh invention, since the ultrasonic cutter or the heat cutter is used as the cutting means, the stress applied to the bonding surface between the second substrate and the sealing material when cutting the material removal portion is suppressed, and the second substrate is It is prevented from peeling off from the sealing material.

Also, when cutting the material removal part by laser light irradiation, there is a possibility that the laser light may be scattered around, and when equipment for protection is required, an ultrasonic cutter or a heat cutter is used. Since the cutting means itself is not scattered around like the laser beam, the material removal part can be cut more safely.

An eighth invention is the method of manufacturing a display device according to any one of the first to seventh inventions,
In the terminal pulling-out step, a pulling jig having an adhesive layer is used, the adhesive layer is adhered to the surface of the extended end portion of the extended portion of the second substrate, and the second jig is lifted by the pulling operation of the pulling jig. The extending portion of the substrate is bent so as to be separated from the terminal portion.

In the eighth invention, a pulling jig having an adhesive layer is used. This lifting jig does not need to be inserted between the material removal portion and the terminal portion, and is attached to the surface of the extended end portion of the material removal portion to use the material removal portion in a curved state. Therefore, the terminal portion is not damaged even when the material removal portion is bent.

A ninth invention is a method of manufacturing a display device according to any one of the first to eighth inventions,
The second substrate includes a plastic substrate as a base substrate.

According to the ninth aspect, the second substrate can be reduced in weight and thickness, and as a result, the entire device can be reduced in weight and thickness.

A tenth aspect of the invention is a method for manufacturing a display device according to the ninth aspect of the invention,
The thickness of the plastic substrate included in the second substrate is 5 μm or more and 50 μm or less.

In the tenth aspect of the invention, since the plastic substrate used for the second substrate is relatively thin with a thickness of 5 μm to 50 μm, the second substrate can be reduced in weight and thickness, and the second substrate can be realized. The substrate can have excellent flexibility, and the second substrate can be easily bent in the terminal drawing process.

An eleventh aspect of the invention is a method for manufacturing the ninth or tenth display device,
The first substrate also includes a plastic substrate as a base substrate.

In the eleventh aspect, since the plastic substrate is used for both the first substrate and the second substrate, the entire device can be reduced in weight and thickness, and a display device with excellent flexibility is manufactured. be able to.

A twelfth aspect of the invention is a method for manufacturing a display device according to the eleventh aspect of the invention,
The plastic substrate included in the first substrate has a thickness of 5 μm or more and 50 μm or less.

In the twelfth aspect of the invention, since the plastic substrate used for the first substrate is relatively thin with a thickness of 5 μm to 50 μm, the first substrate can be reduced in weight and thickness, and the first substrate can be realized. The substrate can be provided with excellent flexibility, and the first substrate can be easily bent in the terminal drawing process.

A thirteenth invention is a method of manufacturing a display device according to any one of the first to twelfth inventions,
In the display panel manufacturing step, the sealing material is formed in a frame shape, and a liquid crystal layer is sealed as the display medium layer inside the sealing material.

In addition, the frame shape here includes not only a completely closed frame shape but also a frame shape having a cut in part.

In the thirteenth invention, a liquid crystal display device is manufactured by enclosing a liquid crystal layer inside a frame-shaped sealing material between the first substrate and the second substrate. Thus, also when manufacturing a liquid crystal display device, the effect of this invention is show | played effectively.

According to the present invention, the material removal portion is bent to be separated from the terminal portion, and the material removal portion is completely cut by the cutting means in the curved state, so that the terminal portion can be formed without generating burrs. The opposing board | substrate part can be cut | disconnected and it can expose in the favorable state without a conductive defect, without damaging a terminal part.

FIG. 1 is a plan view schematically showing the liquid crystal display device according to the first embodiment. 2 is a cross-sectional view showing a cross-sectional structure taken along the line II-II in FIG. 3A and 3B are plan views showing a bonding step in the method for manufacturing a liquid crystal display device according to Embodiment 1. FIG. 4A to 4D are cross-sectional views illustrating a liquid crystal injection step in the method of manufacturing the liquid crystal display device according to the first embodiment. FIG. 5 is a plan view showing a sealing step in the method of manufacturing the liquid crystal display device according to the first embodiment. 6A to 6D are cross-sectional views illustrating a terminal lead-out process in the method for manufacturing the liquid crystal display device according to the first embodiment. 7A and 7B are cross-sectional views illustrating a terminal lead-out process in the method of manufacturing the liquid crystal display device according to the second embodiment. FIGS. 8A to 8C are cross-sectional views showing a terminal lead-out process in the method of manufacturing the liquid crystal display device according to the third embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
In the first embodiment, a liquid crystal display device S of an active matrix driving method (TFT driving method) will be described as an example of an application target of the method for manufacturing a display device according to the present invention.

-Configuration of liquid crystal display device S-
The configuration of the liquid crystal display device S is shown in FIGS. FIG. 1 is a schematic plan view of the liquid crystal display device S. FIG. FIG. 2 is a schematic cross-sectional view showing a cross-sectional structure taken along the line II-II in FIG. In FIG. 1, illustration of the polarizing plate 37 on the counter substrate 20 is omitted.

<Schematic configuration of liquid crystal display device S>
The liquid crystal display device S includes a liquid crystal panel P which is a display panel in which a pair of

substrates

10 and 20 are bonded together and a liquid crystal layer 32 is sealed as a display medium layer between the

substrates

10 and 20. More specifically, the liquid crystal panel P includes a TFT substrate 10 that is a first substrate, a counter substrate 20 that is a second substrate disposed to face the TFT substrate 10, and the TFT substrate 10 and the counter substrate 20. A frame-shaped sealing material 30 for adhering both outer peripheral edge portions and a liquid crystal layer 32 surrounded and sealed by the sealing material 30 between the TFT substrate 10 and the counter substrate 20 are provided. In addition, in the case where the liquid crystal display device S is a transmissive liquid crystal display device, a backlight unit configured to emit planar light to the liquid crystal panel P side on the back side of the liquid crystal panel P ( (Not shown).

This liquid crystal panel P is an area where the TFT substrate 10 and the counter substrate 20 overlap, and has, for example, a rectangular display area D for displaying an image on the inner side of the sealing material 30, that is, the area where the liquid crystal layer 32 is provided. is doing. The display area D is composed of a plurality of pixels, which are the minimum unit of an image, arranged in a matrix.

Further, the liquid crystal panel P has a frame region F which is a non-display region having a rectangular frame shape, for example, around the display region D. For example, on one side (left side in FIGS. 1 and 2) of the frame region F, there is provided a protruding portion 10a in which the TFT substrate 10 protrudes from the counter substrate 20 and the surface of the counter substrate 20 is exposed to the outside. .

On the protruding portion 10a, a plurality of terminals 12a arranged along the edge of the TFT substrate 10 and lead wires 14 connected thereto and extending to the display region D side are formed. The terminal part 12 for circuit connection is comprised. A wiring board (not shown) such as FPC (Flexible Printed Circuit) is connected to the terminal portion 12, and an image corresponding to an image to be displayed from an external driver IC (Integrated Circuit) via the wiring substrate. A display signal including data is input.

As will be described in detail later, the terminal portion 12 on the protruding portion 10a is exposed to the outside by cutting and removing the extended portion of the counter substrate 20 facing the protruding portion 10a as a material removal portion. S is manufactured by connecting the wiring board after cutting the material removal portion.

The TFT substrate 10 and the counter substrate 20 are formed in, for example, a rectangular shape, and

alignment films

34 and 35 are provided on inner surfaces facing each other, and

polarizing plates

36 and 37 are provided on outer surfaces, respectively. The transmission axis of the polarizing plate 36 on the TFT substrate 10 and the polarizing plate 37 on the counter substrate 20 differ by 90 °.

The sealing material 30 is formed in a rectangular frame shape having a cut line 30a in a portion along the side opposite to the side on the terminal portion 12 arrangement side, for example. A sealing material 33 is filled in the cut portion 30 a of the sealing material 30. The sealing material 30 and the sealing material 33 are made of a photocurable resin, a combined photocuring and thermosetting resin, or a thermosetting resin. The liquid crystal layer 32 is made of, for example, a nematic liquid crystal material having electro-optical characteristics.

<Configuration of TFT substrate 10>
The TFT substrate 10 includes a film-like flexible plastic substrate 11 formed of a resin material as a base substrate. The thickness of the plastic substrate 11 is preferably 200 μm or less, and more preferably 5 μm or more and 50 μm or less, from the viewpoint of ensuring flexibility.

As the resin material for forming the plastic substrate 11, for example, organic materials such as acrylic, polyimide, polyetherimide, polyamideimide, polyethersulfone, cyanate ester, cyclic polyolefin, and copolymers thereof can be used. When the liquid crystal display device S is a transmissive type, the resin material forming the plastic substrate 11 needs to be transparent.

The plastic substrate 11 has a glass transition temperature of 200 ° C. or higher and can be used to form a driving TFT element. Other resins such as polyester, polyamide, and polycarbonate, a lubricant, and a heat stabilizer , A weather stabilizer, a pigment, a dye, an inorganic filler and the like may be appropriately contained. In the case of a liquid crystal panel that does not include a TFT element such as a display panel that performs segment display, the material for forming the plastic substrate 11 is not limited to the glass transition temperature of the above condition (200 ° C. or higher).

Further, the TFT substrate 10 includes a plurality of gate wirings (not shown) provided on the plastic substrate 11 so as to extend in parallel with each other, and a gate insulating film (not shown) provided so as to cover the gate wirings. A plurality of source wirings (not shown) provided on the gate insulating film so as to extend in parallel to each other in a direction orthogonal to the gate wirings, and provided at each intersection of the gate wirings and the source wirings. TFT (not shown), an interlayer insulating film (not shown) provided so as to cover each source wiring and each TFT, and a plurality of pixel electrodes 16 provided in a matrix on the interlayer insulating film. ing. In FIG. 2, for convenience, the plurality of pixel electrodes 16 are illustrated as one layer.

The gate wiring and the source wiring are formed in a lattice shape as a whole so as to partition each pixel, and the TFT and the pixel electrode 16 are provided for each pixel. Each TFT includes a gate electrode connected to a corresponding gate wiring and covered with a gate insulating film, an island-shaped semiconductor layer overlapping the gate electrode through the gate insulating film, and a part on one side of the semiconductor layer And a source electrode connected to the corresponding source wiring, and a drain electrode partially connected to the other side of the semiconductor layer so as to face the source electrode. Each pixel electrode 16 is connected to the drain electrode of the corresponding TFT through a contact hole formed in the interlayer insulating film, and is covered with the alignment film 34.

<Configuration of counter substrate 20>
Similarly to the TFT substrate 10, the counter substrate 20 also includes a film-like flexible plastic substrate 21 formed of a resin material as a base substrate. The thickness of the plastic substrate 21 is preferably 200 μm or less, and more preferably 5 μm or more and 50 μm or less, from the same viewpoint as the plastic substrate 11 constituting the TFT substrate.

The plastic substrate 21 needs transparency, and as its forming material, for example, an organic material such as acrylic, epoxy, polyethersulfone, polycarbonate, cyclic polyolefin, and polyimide can be used.

The counter substrate 20 has a black matrix (not shown) provided on the plastic substrate 21 so as to partition each pixel so as to correspond to the gate wiring and the source wiring, and between the grids of the black matrix. A plurality of color filters (not shown) including a red layer, a green layer, and a blue layer provided so as to be periodically arranged, and a common electrode 22 provided so as to cover these black matrix and each color filter, Photo spacers (not shown) provided in a columnar shape on the common electrode 22 are provided.

In the present embodiment, the counter substrate 20 is provided with a photo spacer. However, the photo spacer may be formed on the TFT substrate 10 side. Instead of the photo spacer, a plastic ball having a uniform particle diameter or the like may be used. A configuration may be adopted in which a spherical spacer made of is sandwiched between both

substrates

10 and 20.

<Operation of the liquid crystal display device S>
In the liquid crystal display device S configured as described above, in each pixel, a gate signal is sent to the gate electrode via the gate wiring based on the display signal input from the external driver IC via the terminal portion 12, and the TFT is When the transistor is turned on, a source signal is sent to the source electrode through the source wiring, and a predetermined charge is written into the pixel electrode 16 through the semiconductor layer and the drain electrode. At this time, a potential difference is generated between each pixel electrode 16 of the TFT substrate 10 and the common electrode 22 of the counter substrate 20, and a predetermined voltage is applied to the liquid crystal layer 32. Then, in each pixel, an image is displayed by changing the alignment state of the liquid crystal molecules according to the magnitude of the voltage applied to the liquid crystal layer 32 and adjusting the transmittance of light incident from the backlight unit, for example, with the liquid crystal layer 32. The

-Manufacturing method of liquid crystal display device S-
Next, an example is given and demonstrated about the manufacturing method of the said liquid crystal display device S. FIG.

In this embodiment, a TFT substrate 10 and a counter substrate 20 are manufactured one by one, and a single wafer manufacturing method for manufacturing the liquid crystal panel P by bonding the two

substrates

10 and 20 will be described as an example. Also, a mother panel including a plurality of cell units constituting the liquid crystal panel P is manufactured, and the mother panel is divided into cell units, thereby being applied to a multi-chamfer manufacturing method in which a plurality of the liquid crystal panels P are simultaneously manufactured. can do.

The manufacturing method of the liquid crystal display device S includes a TFT substrate manufacturing process, a counter substrate manufacturing process, a display panel manufacturing process, a terminal extraction process, and a mounting process.

<TFT substrate manufacturing process>
On the plastic substrate 11 prepared in advance, the terminal portion 12 (terminal 12a), the lead wiring 14, the gate wiring, the gate insulating film, the source wiring, the TFT, the interlayer insulating film, and the pixel electrode 16 are formed by a CVD (Chemical Vapor Deposition) method. Alternatively, the TFT substrate 10 is manufactured by forming by a known method of repeatedly performing film formation processing such as sputtering or photolithography.

<Opposite substrate manufacturing process>
The black matrix, the color filter, the common electrode 22 and the photo spacer are repeatedly formed on the plastic substrate 21 having the same size as that of the TFT substrate 10 by repeatedly performing a film forming process by spin coating or sputtering or photolithography. The counter substrate 20 is fabricated by forming the method.

<Display panel manufacturing process>
Next, the display panel manufacturing process to be performed includes a bonding step, a liquid crystal injection step, and a sealing step.

<Bonding step>
The procedure of the bonding step is shown in FIGS. 3 (A) and 3 (B).

First,

alignment films

34 and 35 are formed by a printing method on the surfaces of the TFT substrate 10 and the counter substrate 20 on the side where the

electrodes

16 and 22 are formed, and then a rubbing process is performed as necessary. Next, as shown in FIG. 3A, a sealing material 30 made of a thermosetting resin is drawn in a frame shape along the periphery of the substrate on the surface of the counter substrate 20 on the alignment film 35 side, as shown in FIG. At this time, the sealing material 30 is not formed into a completely closed frame shape, but is formed into a frame shape having a cut 30a in a portion along one side (the right side in FIG. 3A). In addition, a blank area 20a located outside the sealing material 30 is left on the opposite side (the left side in FIG. 3A) of the position where the cut 30a is formed on the counter substrate 20.

In this embodiment, the sealing material 30 is drawn on the surface of the counter substrate 20. However, the present invention is not limited to this, and the sealing material 30 may be drawn on the surface of the TFT substrate 10 on the alignment film 34 side. Good. In this case, for example, the sealing material 30 is drawn in a frame shape having a cut 30 a on the opposite side portion of the side on the terminal portion 12 arrangement side so as to be positioned inside the substrate 10 relative to the terminal portion 12.

Subsequently, the TFT substrate 10 and the counter substrate 20 are opposed to each other, and are bonded through the sealing material 30 in a state where the formation surfaces of the

alignment films

34 and 35 face each other so that the

electrodes

16 and 22 face each other. Thereafter, the sealing material 30 is heated to be cured, and as shown in FIG. 3 (B), a liquid crystal having a gap portion 31 inside the sealing material 30 and constituted by the cuts 30a of the sealing material 30. The bonding panel P ′ having the inlet 30b is configured. At this time, the opposing substrate 20 portion on the opposite side to the cut 30a of the sealing material 30, that is, the blank area 20a is located on the terminal portion 12 so that the cut 30a of the sealing material 30 is located on the opposite side of the terminal portion 12 The TFT substrate 10 and the counter substrate 20 are bonded together so as to extend upward and cover the terminal portion 12 with the extended portion 20a.

<Liquid crystal injection step>
The procedure of the liquid crystal injection step to be performed next is shown in FIGS. 4A to 4D, the sealing material 30 is indicated by a solid line for convenience.

The above-mentioned bonding panel P ′ is put into the vacuum chamber 50 together with the container 51 storing the liquid crystal material 32a as shown in FIG. 4A, and the vacuum chamber 50 is evacuated to a high vacuum state. And in this vacuum environment, as shown in FIG.4 (B), the liquid-crystal injection hole 30b of the bonding panel P 'is immersed in the said liquid-crystal material 32a.

Next, as shown in FIG. 4C, the inside of the vacuum chamber 50 is opened to atmospheric pressure by leaking air. As a result, the liquid crystal material 32a is injected into the gap 31 from the liquid crystal injection port 30b. If it is left for a predetermined time in this state, as shown in FIG. 4D, the liquid crystal material 32 a is filled in the entire gap portion 31 to form the liquid crystal layer 32. Thereafter, the bonding panel P ′ is taken out from the vacuum chamber 50.

<Sealing step>
FIG. 5 shows the liquid crystal panel P in a state where the liquid crystal inlet 30b is sealed in the subsequent sealing step.

Pressure is applied to both surfaces of the bonding panel P ′ having the liquid crystal layer 32 so that the cell thickness (thickness of the liquid crystal layer 32) between the TFT substrate 10 and the counter substrate 20 is set to a predetermined thickness. A sealing material 33 made of an ultraviolet curable resin is applied to the injection port 30b. And this sealing material 33 is hardened by irradiation of an ultraviolet-ray, and as shown in FIG. 5, the liquid-crystal injection hole 30b is sealed. Thus, the liquid crystal panel P is manufactured.

<Terminal extraction process>
6A to 6D show the procedure of the terminal extraction process to be performed next. In this terminal lead-out process, the extended portion 20a of the counter substrate shown in FIG. 6A is cut outside the sealing material 30 with the material removal portion. A broken line 24 shown in FIG. 6A indicates a design cutting line of the material removal portion 20a.

First, as shown in FIG. 6B, the liquid crystal panel P is placed on a curved surface stage 52 having a convex curved surface. The curved surface stage 52 is provided with suction means such as a vacuum chuck or an electrostatic chuck, and the liquid crystal panel P is sucked and fixed by the suction operation of the suction means. By the suction operation of the curved surface stage 52, the liquid crystal panel P is placed on the curved surface stage 52 and then bent along the placement surface, and the TFT substrate 10 portion on the terminal portion 12 side is separated from the material removal portion 20a of the counter substrate 20. To be bent.

Next, the material removal portion 20a of the counter substrate 20 is bent using a pulling jig 54 having an L-shaped claw 54a.

Specifically, the tip of the claw 54a of the pulling jig 54 is inserted between the terminal portion 12 and the material removal portion 20a as shown in FIG. 6 (B). Subsequently, as shown in FIG. 6C, the tip of the claw 54 a is hooked on the material removal portion 20 a, and the material removal portion 20 a is pulled up by the pulling up operation of the lifting jig 54. Then, the material removal portion 20 a of the counter substrate 20 is bent so as to be separated from the terminal portion 12, so that a space between the terminal portion 12 and the space is widened.

This curved state is a state in which the surface facing the TFT substrate 10 in the material removal portion 20a of the counter substrate 20 is directed outward to the extent that the normal line does not pass through the terminal portion 12. . At this time, if the material removal portion 20 a is pulled up too much, an excessive stress is applied to the bonding surface between the counter substrate 20 and the sealing material 30, and the counter substrate 20 may be peeled off from the sealing material 30.

However, in this embodiment, since the TFT substrate 10 portion on the terminal portion 12 side is also in a curved state that is bent away from the material removal portion 20a, only the material removal portion 20a of the counter substrate 20 is in a curved state. Compared to the above, even if the bending angle for bending the material removal portion 20a is small, the space between the material removal portion 20a and the terminal portion 12 is as much as the TFT substrate 10 portion on the terminal portion 12 side is also in a curved state. In addition to being sufficiently widened, the curved portion of the material removal portion 20a, that is, the surface of the material removal portion 20a facing the TFT substrate 10 is outside the terminal portion 12 so that the normal line does not pass through the terminal portion 12. Can be easily realized. And since the curve angle which bends the material removal part 20a of the opposing board | substrate 20 may be small, the stress concerning the adhesion surface of the opposing board | substrate 20 and the sealing material 30 can be suppressed, and the opposing board | substrate 20 makes the sealing material 30. Can be prevented from peeling off.

Subsequently, in the above-described curved state, as shown in FIG. 6C, the laser beam L as the cutting means is applied to the cutting substrate 24 on the counter substrate 20 from the TFT substrate 10 side with respect to the cutting line 24 of the material removal portion 20a. The material removal portion 20a is cut outside the sealing material 30 by irradiating at an angle perpendicular to or close to the opposite surface of the material. As a result, the material removal portion 20a can be cut without generating burrs, and the terminal portion 12 can be exposed in a good state with no conductive failure without being damaged.

That is, in the curved state, the space between the material removal portion 20a of the counter substrate 20 and the terminal portion 12 is widened, and the entire surface of the material removal portion 20a facing the TFT substrate 10 extends outside the terminal portion 12. It is suitable. And since the laser beam L is irradiated to the material removal portion 20a in such a curved state at an angle perpendicular to or close to the surface of the TFT substrate 10, the laser beam L is not irradiated to the terminal portion 12. The material removal portion 20a can be cut. Then, since there is no need to form a reflective metal film on the cutting line 24 of the material removal portion 20a as in Patent Document 3 described above, the adjacent terminals on the terminal portion 12 by cutting the material removal portion 20a. It is not necessary to cause a failure in the terminal portion 12 due to a short circuit between the wiring 12a and the wiring 14. In addition, since the material removal portion 20a is completely cut by the laser beam L, burrs are not generated on the cut surface.

At this time, conversely, when the opposite substrate 20 is irradiated with the laser light L from the side opposite to the TFT substrate 10, when the opposite substrate 20 is irradiated with the laser light L, the opposite substrate 20 There is a possibility that the laser beam L is transmitted through the inside, the emission direction of the transmitted light is directed toward the terminal portion 12 due to refraction or scattering, and the terminal portion 12 is irradiated with the laser light L. On the other hand, in the present embodiment, since the laser light L is irradiated from the TFT substrate 10 side, the cause of the laser light L being applied to the terminal portion 12 is eliminated, and damage to the terminal portion 12 is reliably prevented. be able to.

As described above, when the laser beam L is used as the cutting means of the material removal portion 20a, high-speed processing is possible while reliably preventing damage to the terminal portion 12, so that the manufacturing efficiency of the liquid crystal display device S is enhanced. As the laser beam L, an Ar laser, a YAG (Yttrium-Aluminum-Garnet) laser, a CO2 laser, or the like can be suitably used.

Next, the suction operation of the curved stage 52 is stopped, and the liquid crystal panel P is separated from the curved stage 52. In this way, as shown in FIG. 6D, the TFT substrate 10 portion on the terminal portion 12 side with respect to the counter substrate 20 is protruded to form the protrusion 10 a, and the terminal portion 12 is exposed from the counter substrate 20.

Thereafter,

polarizing plates

36 and 37 are attached to both sides of the liquid crystal panel P, respectively.

<Mounting process>
A wiring board such as an FPC connected to an external driver IC is connected to the terminal portion 12 of the liquid crystal panel P via an anisotropic conductive film or the like. Thereafter, a backlight unit or the like is mounted on the liquid crystal panel P as necessary.

By performing the above steps, the liquid crystal display device S shown in FIGS. 1 and 2 can be manufactured.

-Effect of Embodiment 1-
According to the first embodiment, the material removal portion 20a of the counter substrate 20 is bent to be separated from the terminal portion 12, and the material removal portion 20a is completely cut by irradiation with the laser light L in the curved state. Therefore, the material removal portion 20a of the counter substrate 20 extending above the terminal portion 12 can be cut without generating burrs, and the terminal portion 12 can be exposed in a good state without any conductive failure without being damaged. .

<< Embodiment 2 of the Invention >>
In the second embodiment, the configuration of the liquid crystal display device S and other steps in the manufacturing method thereof are the same as those of the first embodiment except that the terminal lead-out process is partially different from the first embodiment. Only the terminal drawing process will be described. In the following embodiments, the same components as those in FIGS. 1 to 6 are denoted by the same reference numerals, and the detailed description thereof will be omitted.

<Terminal extraction process>
7A and 7B show the procedure of the terminal extraction process in this embodiment. In the first embodiment, the pulling jig 54 having the L-shaped claw 54a is used as a means for bringing the material removal portion 20a into a curved state. A jig 56 is used.

First, as in the first embodiment, as shown in FIG. 7A, the liquid crystal panel P is placed on the curved surface stage 52, and the liquid crystal panel P is sucked and fixed by the suction operation of the curved surface stage 52. The liquid crystal panel P is bent along the mounting surface of the curved surface stage 52, and the TFT substrate 10 portion on the terminal portion 12 side is bent so as to be separated from the material removal portion 20a to be in a curved state.

Next, the material removal portion 20a of the counter substrate 20 is bent using the pulling jig 56 having the weak adhesive layer 56a at the bottom.

Specifically, as shown in FIG. 7A, the weak adhesive layer 56a is adhered to the surface of the extended end portion of the material removal portion 20a in the counter substrate 20, and as shown in FIG. By removing the jig 56, the material removal portion 20a is pulled up. Then, the material removal portion 20a of the counter substrate 20 is bent so as to be separated from the terminal portion 12, and a curved state in which a space between the terminal portion 12 is widened at an angle similar to that of the first embodiment, To do.

Subsequently, in the above-described curved state, as shown in FIG. 7B, the laser beam L as the cutting means is applied from the TFT substrate 10 side to the TFT substrate 10 side of the counter substrate 20 with respect to the cutting line 24 of the material removal portion 20a. By irradiating the surface perpendicularly or at an angle close to the surface, the material removal portion 20 a is cut outside the sealing material 30. As a result, the material removal portion 20a can be cut without generating burrs, and the terminal portion 12 can be exposed in a good state with no conductive failure without being damaged.

Thereafter, the suction operation of the curved stage 52 is stopped and the liquid crystal panel P is separated from the curved stage 52. Thus, the portion of the TFT substrate 10 closer to the terminal portion 12 than the counter substrate 20 is protruded to form the protruding portion 10a, and the terminal portion 12 is exposed from the counter substrate 20.

-Effect of Embodiment 2-
According to the second embodiment, the same effects as those of the first embodiment can be obtained, and the pulling jig 56 having the weak adhesive layer 56a is used. Therefore, a part of the pulling jig 54 as in the first embodiment is used. Is not required to be inserted between the material removal portion 20a of the counter substrate 20 and the terminal portion 12, and the material removal portion 20a is curved by adhering to the surface of the extended end portion of the material removal portion 20a. The terminal portion 12 can be prevented from being damaged even when the material removal portion 20a is in a curved state.

<< Embodiment 3 of the Invention >>
Since the third embodiment is the same as the first embodiment except for the terminal putting out process, only the terminal putting out process having a different configuration will be described.

<Terminal extraction process>
8A to 8C show the procedure of the terminal extraction process in this embodiment. In the first embodiment, the laser beam L is used as a cutting means for cutting the material removal portion 20a. However, in this embodiment, an ultrasonic cutter 58 is used as the same means.

First, as in the first embodiment, as shown in FIG. 8A, the liquid crystal panel P is placed on the curved stage 52, and the liquid crystal panel P is sucked and fixed by the sucking operation of the curved stage 52. The liquid crystal panel P is bent following the mounting surface of the curved stage 52, and the TFT substrate 10 portion on the terminal portion 12 side is bent away from the material removal portion 20a to be bent at the same angle as in the first embodiment. And

Next, as in the second embodiment, as shown in FIG. 8B, the material removal portion 20a of the counter substrate 20 is bent using a pulling jig 56 having a weak adhesive layer 56a at the bottom.

Subsequently, in the curved state, the material removal portion 20a of the counter substrate 20 is cut from the surface side of the liquid crystal panel P by an ultrasonic cutter 58 as cutting means, as shown in FIGS. Cut along the line 24 on the outside of the sealing material 30. As a result, the material removal portion 20a can be cut without generating burrs, and the terminal portion 12 can be exposed in a good state with no conductive failure without being damaged.

-Effect of Embodiment 3-
According to the third embodiment, the same effect as in the first embodiment can be obtained, and the ultrasonic cutter 58 is used as a cutting means. Therefore, when the material removal portion 20a is cut, the counter substrate 20 and the sealing material 30 are used. It is possible to prevent the counter substrate 20 from being peeled off from the sealing material 30 by suppressing the stress applied to the adhesive surface.

Further, when the material removal portion 20a is cut by irradiation with the laser beam L, the laser beam L may be scattered around, and a protection facility is required. On the other hand, the ultrasonic cutter 58 is used. In this case, since the cutting means itself is not scattered around like the laser beam L, the material removal portion 20a can be cut more safely.

In the third embodiment, the ultrasonic cutter 58 is used as the cutting means in place of the laser beam L. However, the same effect can be obtained even if a heat cutter is used. In addition, from the viewpoint of preventing the counter substrate 20 from being peeled off from the sealing material 30, it is preferable to employ a cutting means that can reduce the stress applied to these bonding surfaces.

<< Other Embodiments >>
The first to third embodiments may be modified as follows.

<Configuration of TFT substrate 10>
In the first to third embodiments, the TFT substrate 10 includes the plastic substrate 11 as a base substrate. However, the present invention is not limited to this, and the TFT substrate 10 may be a glass substrate or a silicon substrate instead of the plastic substrate 11. May be provided.

<Configuration of means for bending the material removal portion 20a>
In the first embodiment, the pulling jig 54 having the L-shaped claw 54a is used, and in the second embodiment, the pulling jig 56 having the weak adhesive layer 56a is used to pull up the material removal portion 20a of the counter substrate 20 and bend it. However, the present invention is not limited to this, and the material removal portion 20a may be curved using a pulling jig having a suction function such as vacuum tweezers.

Further, instead of the pulling

jigs

54 and 56, a pulling mechanism that sandwiches and lifts both ends of the extending end of the material removal portion 20a may be employed. In addition, by blowing air between the material removal portion 20a and the terminal portion 12, a means such as a blower that raises the material removal portion 20a by its air pressure and makes it curved may be employed.

<Production method of liquid crystal panel P>
In the said Embodiment 1, the bonding panel P 'which has the space | gap part 31 is comprised by bonding the TFT substrate 10 and the opposing board | substrate 20 through the frame-shaped sealing material 30 which has the cut 30a, and this bonding panel P The liquid crystal material 32a is injected into the gap portion 31 'by using a pressure difference caused by evacuation from the liquid crystal injection port 30b formed by the cut 30a of the sealing material 30, and then the liquid crystal injection port 30b is formed by the sealing material 33. Although the liquid crystal panel P is manufactured by a so-called vacuum injection method for sealing, the present invention is not limited to this.

That is, instead of the vacuum injection method described above, the sealing material 30 is drawn in a completely closed frame shape on the surface of the TFT substrate 10 or the counter substrate 20, and a predetermined amount of the liquid crystal material 32a is dropped inside the sealing material 30. Then, the TFT substrate 10 and the counter substrate 20 are bonded together under a vacuum environment through the sealing material 30 and the liquid crystal material 32a, and finally the sealing material 30 is cured, so that a liquid crystal panel P is manufactured by a so-called drop injection method. Also good.

The preferred embodiments of the present invention have been described above, but the technical scope of the present invention is not limited to the above-described embodiments. It is understood by those skilled in the art that the above embodiment is an exemplification, and that various modifications can be made to the combination of each component and each processing process, and such modifications are also within the scope of the present invention. By the way.

For example, in Embodiments 1 to 3 described above, the active matrix driving type liquid crystal display device S using TFTs has been described as an example. However, the present invention is not limited to this, and is not limited to three-terminal elements such as TFTs. The present invention is also applicable to an active matrix liquid crystal display device using a two-terminal element such as MIM (Metal Insulator Metal) as a drive element. Further, the display device manufacturing method according to the present invention can be applied not only to the active drive type liquid crystal display device S but also to the passive (multiplex) drive type liquid crystal display device. Furthermore, the method for manufacturing a display device according to the present invention can be applied to any type of display panel of transmissive type, reflective type, and transmissive / reflective type.

The display device manufacturing method according to the present invention includes not only the liquid crystal display device S but also an organic EL (Electro Luminescence) display device, an inorganic EL display device, and a display medium each having an EL (Electro Luminescence) layer as a display medium layer. It can be applied to a plasma display device having a gas layer such as neon gas or xenon gas as a layer. In addition, FED (Field-Emission Display), SED (Surface-conduction Electron-emitter Display) ), And can be widely applied as a manufacturing method of various display devices such as an electrowetting display device.

As described above, the present invention has a structure in which a pair of substrates are bonded to each other with a sealing material, one substrate is provided with a terminal portion for connecting an external circuit at a side end, and the other substrate is acceptable. It is useful for a method of manufacturing a display device having flexibility, and in particular, a substrate portion extending above the terminal portion without generating burrs is cut, and there is no poor conduction without damaging the terminal portion. It is suitable for a manufacturing method of a display device that is required to be exposed in a state.

L Laser light (cutting means)
S Liquid crystal display device 10 TFT substrate (first substrate)
DESCRIPTION OF

SYMBOLS

11, 21 Plastic substrate 12 Terminal part 12a Terminal 14 Lead-out wiring 16 Pixel electrode 20 Opposite substrate (2nd substrate)
20a Material removal part (extension part of second substrate, blank area)
22 Common electrode 24 Cutting line 30 Sealing material 30a Cut 30b Liquid crystal injection port 31 Void portion 32 Liquid crystal layer 32a Liquid crystal material 33

Sealing material

34, 35

Alignment film

36, 37 Polarizing plate 50 Vacuum chamber 51 Container 52

Curved stage

54, 56 Pulling up Jig 54a Claw 56a Weak adhesive layer 58 Ultrasonic cutter (cutting means)

Claims

A first substrate having a terminal portion for connecting an external circuit at a side end portion and a second substrate having flexibility are opposed to each other, and the second substrate extends to an opposing region of the terminal portion. Displayed between the first substrate and the second substrate with or after being bonded via a sealing material located inside the terminal portion so that at least a part of the terminal portion is covered by the extending portion. A display panel manufacturing process for manufacturing a display panel by interposing a medium layer;
The extended portion of the second substrate is bent so as to be separated from the terminal portion, so that the space between the terminal portion and the extended portion is in a curved state, and the extended portion of the second substrate in the curved state Cutting the outer side of the sealing material by a cutting means to expose the terminal portion from the second substrate, and a method for manufacturing a display device.
In the manufacturing method of the display device according to claim 1,
The curved state is a state in which the surface facing the first substrate in the extended portion of the second substrate faces the outside of the terminal portion so that the normal line does not pass through the terminal portion. A display device manufacturing method.
In the manufacturing method of the display device according to claim 1 or 2,
The first substrate also has flexibility,
The method of manufacturing a display device, wherein in the terminal extraction step, the first substrate portion on the terminal portion side is also bent so as to be separated from the second substrate.
In the manufacturing method of the display device according to claim 3,
In the terminal pulling-out step, the display panel is placed on a curved stage having a convex curved surface having suction means for sucking and fixing the display panel so that the first substrate is located on the stage side. A method of manufacturing a display device, comprising: bending the first substrate portion on the terminal portion side away from the second substrate by an adsorption operation of the curved stage.
The method for manufacturing a display device according to any one of claims 1 to 4,
A method of manufacturing a display device, characterized in that, in the terminal drawing step, laser light is used as the cutting means.
In the manufacturing method of the display device according to claim 5,
The method of manufacturing a display device, wherein, in the terminal-out step, the second substrate is irradiated with laser light from the first substrate side in the curved state.
The method for manufacturing a display device according to any one of claims 1 to 4,
In the terminal drawing step, an ultrasonic cutter or a heat cutter is used as the cutting means.
The method for manufacturing a display device according to any one of claims 1 to 7,
In the terminal pulling-out step, a pulling jig having an adhesive layer is used, the adhesive layer is adhered to the surface of the extended end portion of the extended portion of the second substrate, and the second jig is lifted by the pulling operation of the pulling jig. A method for manufacturing a display device, comprising: bending an extended portion of a substrate so as to be separated from the terminal portion.
The method for manufacturing a display device according to any one of claims 1 to 8,
The method for manufacturing a display device, wherein the second substrate includes a plastic substrate as a base substrate.
In the manufacturing method of the display device according to claim 9,
A method of manufacturing a display device, wherein the plastic substrate included in the second substrate has a thickness of 5 μm to 50 μm.
In the manufacturing method of the display device according to claim 9 or 10,
The display device manufacturing method, wherein the first substrate also includes a plastic substrate as a base substrate.
In the manufacturing method of the display device according to claim 11,
A method of manufacturing a display device, wherein a thickness of a plastic substrate provided in the first substrate is 5 μm or more and 50 μm or less.
The method for manufacturing a display device according to any one of claims 1 to 12,
In the display panel manufacturing step, the sealing material is formed in a frame shape, and a liquid crystal layer is sealed as the display medium layer inside the sealing material.