TW201440982A - Cutting wheel - Google Patents

Abstract

A cutting wheel for cutting a strengthened glass substrate is provided. The cutting wheel has an outer diameter, an inner diameter, an axial direction, a radial direction, a circumferential direction and a wheel thickness. A thickness of the cutting wheel decreases from the wheel thickness along the radial direction toward the outer diameter to form a cutting edge with a cutting angle. A plurality of cutting grooves extend in the direction not parallel to the circumferential direction from the cutting edge on a surface of the cutting wheel, and the cutting grooves has a groove depth. The cutting wheel of the present invention is adapted for cutting a highly strengthened glass substrate by optimizing the outer diameter, the inner diameter, the cutting angle of the cutting edge, the groove depth of the cutting grooves and an amount of the cutting grooves.

Description

Cutting wheel

The present invention relates to a cutting wheel, and more particularly to a cutting wheel for cutting a strengthened glass substrate.

At present, glass substrates are widely used in various parts of electronic products, such as screens and casings. In order to prevent the glass substrate from being easily scratched or broken, the glass substrate is usually reinforced. In the manufacturing process, the glass substrate needs to be cut into a smaller size glass substrate to match the application of various devices. However, since the tempered glass substrate is high in hardness and the crack generated in the cutting process is difficult to control, how to cut the tempered glass substrate and split the glass substrate along a predetermined dicing line is an important issue in the industry.

First, referring to FIG. 1 , the glass substrate 1 ′ of the general tempered glass substrate 1 or the under-CT (Center Tensile stress) 10 MPa comprises a tensile layer 11 and at least one compression formed on the tensile layer 11 . Layer 12. The stretched layer 11 has tensile internal stress, and the compressed layer 12 has a compressive internal stress, whereby the strengthened glass substrate 1 or the glass substrate 1' reinforced with less than 10 MPa is more wear-resistant and less susceptible to cracking.

Referring to FIGS. 1 and 2A, a conventional cutter wheel 31 for cutting an unreinforced or non-reinforced glass substrate or reinforcing a glass substrate 1' of less than 10 MPa has a thickness gradually increasing from the radial direction to the outer diameter of the cutter wheel. One of the cutting edges 311 is formed. In general, when the glass substrate 1' which is less than CT10 MPa is cut by using the cutter wheel 31, a scribe opening 13 is first formed along a predetermined cutting line, and at this time, the glass substrate 1' is simultaneously drilled into the glass substrate. Within 1' The crack 14 of the portion and the horizontal crack 15 substantially parallel to the surface of the glass substrate 1'. Thereafter, a step of extending the crack 14 having a depth exceeding the thickness of the compression layer 12 inside the glass substrate 1' and penetrating the thickness t of the glass substrate 1' is performed to cause the glass substrate 1' to be split along a predetermined cutting line. During the process, the horizontal crack 15 causes the cross section of the glass substrate 1' to be uneven and the quality is not good.

Please refer to FIG. 2B , another conventional cutting blade 33 for cutting an unreinforced or unreinforced glass substrate or reinforcing a glass substrate 1 ′ of less than 10 MPa, except for having a thickness from the thickness of the cutter wheel to the outer diameter in the radial direction. Further, one of the cutting edges 331 is formed, and a plurality of cutting grooves 333 are formed on the cutting edge 331 of the cutting blade 33. The cutting groove 333 can cut the cutter wheel 33 to strengthen the glass substrate 1' which is less than 10 MPa to form the scribe opening 13. The crack 14 formed at the same time can further deepen the inside of the glass substrate 1' which is less than 10 MPa, and is reduced. The formation of horizontal cracks 15 However, if the tempered glass substrate 1 having a CT of 10 MPa or more is cut, the conventional dicing blade 33 is deepened by the crack 14 to strengthen the inside of the glass substrate 1 to cause tempered glass when the tempered glass substrate 1 is further reinforced. The substrate 1 is more likely to not be broken along a predetermined cutting line. Therefore, the conventional cutting cutter wheel 33 having the cutting groove 333 is generally considered to be difficult to meet the quality requirements when the tempered glass substrate 1 is cut to be more reinforced.

Therefore, a cutting cutter wheel is provided which can suppress the formation of the horizontal crack 15 and can avoid the problem that the strengthened glass substrate 1 does not break along the predetermined cutting line when the strengthened glass substrate 1 is cut, which is a technique of the present invention. The field needs to be solved urgently.

SUMMARY OF THE INVENTION An object of the present invention is to provide a cutting blade which can suppress the formation of horizontal cracks and can avoid the problem that the strengthened glass substrate does not break along a predetermined cutting line when the strengthened glass substrate is cut.

Wherein, the cutting wheel for cutting a tempered glass substrate of the present invention has an outer diameter, an inner diameter, an axial direction, a radial direction, a circumferential direction and a thickness of one of the cutter wheels in the axial direction. One thickness of the cutter wheel is tapered from the diameter of the cutter wheel toward the outer diameter to form a cutting edge having a cutting angle, and extending along the surface of the cutting blade on the cutting blade to form a non-parallel to the circumferential direction The plurality of cutting grooves, and the cutting groove has a groove depth.

In order to achieve the above object, in the cutting wheel of the present invention, the outer diameter is substantially between 1 and 10 mm, the inner diameter is substantially between 0.4 and 2 mm, and the cutting angle of the cutting blade is substantially between 100 and 160, and the cutting is performed. The groove depth of the groove is substantially between 1 μm and 3 μm, and the number of one of the cutting grooves is substantially the outer diameter in units of mm multiplied by 100 to 300.

1‧‧‧ strengthened glass substrate

1'‧‧‧ glass substrate

101‧‧‧ Straight line

102‧‧‧ Curve

103‧‧‧ surface

104‧‧‧ edge

11‧‧‧ Stretch layer

12‧‧‧Compression layer

13‧‧‧Scratch opening

14‧‧‧ crack

15‧‧‧ horizontal cracking

T‧‧‧thickness

31‧‧‧Cutting cutter wheel

311‧‧‧ cutting blade

33‧‧‧Cutting cutter wheel

331‧‧‧ Cutting blade

333‧‧‧Cutting trough

5‧‧‧Cutting cutter wheel

51‧‧‧ Cutting blade

52‧‧‧Axis hole

53‧‧‧Cutting trough

55‧‧‧ clamping surface

A‧‧‧Axial

c‧‧‧Weighing

D‧‧‧OD

D‧‧‧ groove depth

H‧‧‧Inner diameter

R‧‧‧radial

T‧‧‧knife wheel thickness

Θ‧‧‧ cutting angle

7‧‧‧Cutter wheel retaining parts

71‧‧‧Rotary pin

73‧‧‧ Positioning Department

1 is a schematic view of a tempered glass substrate; FIG. 2A is a schematic view showing one of the conventional cutting knives for cutting a tempered glass substrate; FIG. 2B is another conventional cutting knives having a cutting groove for cutting a tempered glass substrate. Figure 3A is a side elevational view of one of the cutting blades of the present invention; Figure 3B is a front view of one of the cutting blades of the present invention; Figure 3C is a perspective view of one of the cutting blades of the present invention; The schematic diagram of the fixing method of the cutting wheel and the cutter wheel holder of the present invention; and FIG. 5 is a schematic view of the cutting blade of the present invention engraving a strengthened glass substrate along a predetermined cutting line.

Referring to FIGS. 3A to 3C, the cutting wheel 5 for cutting a more reinforced tempered glass substrate 1 has an outer diameter D, an inner diameter H, an axial direction, a radial direction r, a circumferential direction c, and One of the cutter wheel thicknesses T along the axial direction A. The thickness of the cutter wheel 5 is tapered from the cutter wheel thickness T in the radial direction r to the outer diameter D to form a cutting blade 51 having a cutting angle θ. A plurality of cutting grooves 53 are formed on the cutting blade 51 of the cutting wheel 5, the cutting grooves 53 are not parallel to the circumferential direction c in the extending direction of the surface of the cutting wheel 5, and the cutting groove 53 has a self-cutting blade 51 toward the cutting wheel 5 The groove depth d of the inner extension.

Referring to FIG. 4 together, the cutting cutter wheel 5 can be held by a cutter wheel holder 7 when in use. Upper and fixed to the cutting device for driving the cutter holder 7 by the cutter wheel holder 7. The cutter wheel holder 7 has a pivot pin 71 and two positioning portions 73. The positioning portion 73 positions the cutting wheel 5 in the axial direction A of the cutting wheel 5, which can be achieved by the positioning portion 73 slightly clamping the clamping faces 55 on both sides of the cutter wheel 5, and passing the rotating shaft pin 71 through the cutting blade The shaft hole 52 of the wheel 5 holds the cutting wheel 5 at a fixed position of the cutter holder 7, and the cutting wheel 5 can be rotated in the axial direction A by the driving of the cutting device, and is on the strengthened glass substrate 1. Describe the depth and path of your desire.

In the cutting wheel 5 of the present invention, the outer diameter D is substantially between 1 and 10 mm, the inner diameter H of the shaft hole 52 is substantially between 0.4 and 2 mm, and the cutting angle θ of the cutting blade 51 is substantially between 100 and Up to 160°, the groove depth d of the cutting groove 53 is substantially between 1 μm and 3 μm, and the number of the cutting grooves 53 is substantially the outer diameter D in units of mm multiplied by 100 to 300.

Thereby, the cutting wheel 5 of the present invention can reduce the formation of the horizontal crack 14 as shown in FIG. 1, so that the section of the strengthened glass substrate 1 is flat and the quality is better, and the cutting wheel 5 can avoid cutting. When the glass substrate 1 is reinforced more strongly, the tempered glass substrate 1 does not break along the predetermined cutting line. Furthermore, since the cutting wheel 5 of the present invention has the cutting groove 53, it is not necessary to scribe the tempered glass substrate 1 from the edge 104 of the tempered glass substrate 1 as in the prior art, but as shown in FIG. It is shown that the inside of the surface 103 of the tempered glass substrate 1 is directly scribed together without degrading the cutting quality. The conventional cutterless cutter 31 having no cutting groove as shown in FIG. 2A cannot be cut from the inside because it does not have the cutting groove 53 as in the present invention, and must be cut from the outside of the strengthened glass substrate 1 as shown in the drawing. The strength of the tempered glass substrate 1 after the cutting of the cutter wheel 31 having no cutting groove shown in 2A is lower than the strength of the tempered glass substrate 1 after cutting using the cutting blade 5 of the present invention. Since the scribing of the inside of the surface 103 of the tempered glass substrate 1 directly reduces the cutting quality, and cannot directly scribe the inside of the surface 103 of the tempered glass substrate 1 as shown in FIG. 5, it is necessary to self-strengthen the edge of the glass substrate 1. 104 begins to scribe the strengthened glass substrate 1.

For the dimensions of the outer diameter D, please refer to FIGS. 3A to 3C. When the outer diameter D is less than 2mm, The cutter wheel 5 is small in size and therefore difficult to manufacture, and the load applied to the cutter wheel 5 is significantly concentrated, so that the load controller that controls the load application will require more control. When the outer diameter D is larger than 3 mm, although the size of the cutter wheel 5 becomes larger, the life of the cutter wheel 5 can be lengthened. However, when the size is too large, the curve 102 is cut along the curve 102 shown in FIG. It is prone to the problem that the cornering or cracking speed is too fast to cause the strengthened glass substrate 1 to not be broken along the predetermined cutting line 10, with the result that the minimum processable curvature of the curve that the cutting cutter wheel 5 can cut is not as desired. Accordingly, preferably, the outer diameter D of the cutting wheel 5 of the present invention is substantially between 2 and 3 mm. Furthermore, although the dimensional error caused by the processing precision of the equipment must be stored when the cutting wheel 5 is processed, and the error is inevitable during the measurement, the current measurement data shows that the outer diameter D of the cutting wheel 5 The cutting yield at about 2 mm is greater than the cutting yield at an outer diameter D of about 3 mm, so the outer diameter D of the cutter wheel 5 is preferably about 2 mm.

Regarding the size of the inner diameter H, please refer to FIGS. 3A to 3C. When the inner diameter H is less than 0.5 mm, the cutter wheel 5 and the rotation pin 71 shown in Fig. 4 are difficult to manufacture, and the force that the rotation pin 71 can withstand is also lowered. When the inner diameter H is larger than 1.1 mm, the sliding friction between the rotating shaft pin 71 and the cutting wheel 5 is increased, which causes a decrease in the scoring stability, but the effect on the life of the cutting wheel 5 is not significant. Accordingly, preferably, the inner diameter H of the cutting wheel 5 of the present invention is substantially between 0.5 and 1.1 mm.

Regarding the cutting angle θ of the cutting blade 51, please refer to FIGS. 3A to 3C. When the cutting angle θ is less than 125°, the load required for scoring the tempered glass substrate 1 is lowered, so that the load range used for scoring the tempered glass substrate 1 is lowered. As shown in FIG. 5, when the tempered glass substrate 1 is scribed along the predetermined cutting line 10 using the cutter wheel 5, the cutting device is applied to the cutting when the line 101 along the predetermined cutting line 10 is scored along the curve 102 along the predetermined cutting line 10. The load of the cutter wheel 5 must be different. When the profiled cutting is performed along the curve 102 of the predetermined cutting line 10, since the cutting blade 5 has to be turned along the curve 102 of the predetermined cutting line 10, the cutting device is applied to the load of the strengthened glass substrate 1 via the cutting blade 5 It is necessary to have a larger load than that required to cut the tempered glass substrate 1 along a predetermined cutting line 10 in a straight line. However, because the cutting wheel 5 is being used When the tempered glass substrate 1 is scribed, the change in the tempered glass substrate 1 is constant, and the cutting quality is ensured. Therefore, the force applied to the tempered glass substrate 1 needs to be maintained within a certain range, and it is not preferable. However, it is necessary to maintain the load of the cutting device applied to the tempered glass substrate 1 via the cutting blade 5 to maintain a certain degree, and it is not too small. Therefore, when the cutting angle θ of the cutting blade 51 is less than 125°, it is difficult to appropriately control the scribing of the strengthened glass substrate 1 when the cutting blade 5 is used.

Further, when the cutting angle θ of the cutting blade 51 is larger than 145°, the required load for the scribed glass substrate 1 to form the scribed opening 13 to the desired depth becomes large, and the cutting blade 5 will be more difficult to manufacture and the manufacturing cost. higher. In addition, the increase in load will cause the crack 14 formed at the time when the scribed glass substrate 1 is formed into the scribe opening 13 to be deeper, so that the tempered glass substrate 1 is more likely to be naturally split after being scribed to form the scribe opening 13, or even The tempered glass substrate 1 is caused to be less likely to break along the predetermined cutting line.

Accordingly, preferably, the cutting angle θ of the cutting blade 51 of the cutting blade 5 of the present invention is substantially between 125° and 145°. Furthermore, it is understood that the cutting yield when the cutting angle θ of the cutting blade 51 is about 125° is greater than the cutting yield of the cutting angle θ of substantially 145°, so the cutting angle θ of the optimal cutting blade 51 is substantially 125°.

Regarding the cutting groove 53, please refer to FIGS. 3A to 3C. The cutting groove 53 of the cutting wheel 5 of the present invention preferably extends substantially along the axial direction A of the cutting wheel 53 on the surface of the cutting wheel 5. Furthermore, the cross-sectional shape of the cutting groove 53 shown in FIG. 3B may be V-shaped, U-shaped or any possible shape, and is not particularly limited. Regarding the groove depth d of the cutting groove 53, it is necessary to consider that the cutting blade 51 of the cutting blade 5 itself naturally has a surface unevenness of about 1 μm, so if the groove depth d of the cutting groove 53 is made smaller than 1.5 μm, no cutting is formed with the cutting blade 51. The cutting effect of the groove 53 is not much different. Further, if the groove depth d of the cutting groove 53 is larger than 3 μm, the cutting yield thereof is lowered to 50% or less of the yield when the groove depth d is 2.5 μm or less. Further, if the groove depth d of the cutting groove 53 is larger than 2.5 μm, the depth of the crack 14 will become deep, and when the tempered glass substrate 1 is further reinforced, the dicing failure may occur. According to this, Preferably, the groove depth d of the cutting groove 53 of the cutting wheel 5 of the present invention is substantially between 1.5 μm and 2.5 μm. The groove depth d of the cutting groove 53 of the cutting blade 5 of the present invention is preferably substantially 2 μm, and the cutting yield is the highest in this case.

Regarding the number of the cutting grooves 53, please refer to Figs. 3A to 3C. Under the same conditions of the tempered glass substrate 1, the same outer diameter D, the inner diameter H, and the cutting angle θ of the same cutting blade 51, the number of the appropriate cutting grooves 53 can be the highest. According to experiments, when the number of the cutting grooves 53 is substantially the outer diameter D in units of mm multiplied by 200 to 250, the yield is generally high.

Moreover, since the setting of the cutting conditions is related to the thickness t and the strength of the tempered glass substrate 1 to be cut, it has been experimentally found that when the cutting blade 5 of the present invention is used for cutting, it has substantially CT (Center Tensile stress, center stretching). When the tempered glass substrate 1 having a stress of 10 MPa or more is used to cut the tempered glass substrate 1 having substantially CT22 MPa, if the thickness t of the tempered glass substrate 1 is approximately 0.55 mm, the number of the dicing grooves 53 is preferably 400. When the thickness of the tempered glass substrate 1 is substantially 0.7 mm, the number of the preferred cutting grooves 53 is substantially 500.

According to the present invention, the cutting wheel 5 of the present invention is suitable for cutting one by optimizing the outer diameter D, the inner diameter H, the cutting angle θ of the cutting blade 51, the groove depth d of the cutting groove 53, and the number of the cutting grooves 53. The highly strengthened tempered glass substrate 1 is obtained with high cutting quality, and can be directly scribed by the inside of the surface of the tempered glass substrate 1.

5‧‧‧Cutting cutter wheel

51‧‧‧ Cutting blade

52‧‧‧Axis hole

53‧‧‧Cutting trough

55‧‧‧ clamping surface

A‧‧‧Axial

c‧‧‧Weighing

D‧‧‧OD

D‧‧‧ groove depth

H‧‧‧Inner diameter

R‧‧‧radial

T‧‧‧knife wheel thickness

Θ‧‧‧ cutting angle

Claims (8)

A cutting cutter wheel for cutting a tempered glass substrate, the cutting cutter wheel having an outer diameter, an inner diameter, an axial direction, a radial direction, a circumferential direction and a thickness of the cutter wheel along the axial direction, the cutting cutter wheel One thickness is tapered from the thickness of the cutter wheel toward the outer diameter to form a cutting edge having a cutting angle, and a cutting groove is formed along the surface of the cutting blade to form a plurality of cutting grooves not parallel to the circumferential direction, And the cutting grooves have a groove depth, wherein: the outer diameter is substantially between 1 and 10 mm; the inner diameter is substantially between 0.4 and 2 mm; the cutting angle of the cutting blade is substantially between 100 and 160 The groove depth of the cutting grooves is substantially between 1 μm and 3 μm; and the number of one of the cutting grooves is substantially the outer diameter in units of mm multiplied by 100 to 300. The cutting wheel of claim 1, wherein: the outer diameter is substantially between 2 and 3 mm; the inner diameter is substantially between 0.5 and 1.1 mm; and the cutting angle of the cutting blade is substantially between 125 and 145°; the groove depth of the cutting grooves is substantially between 1.5 μm and 2.5 μm; and the number of the cutting grooves is substantially the outer diameter in units of mm multiplied by 200 to 250. The cutting wheel of claim 2, wherein: the outer diameter is substantially 2 mm; the cutting angle of the cutting blade is substantially 125; and the groove depth of the cutting grooves is substantially 2 μm. The cutting wheel of claim 3, wherein the thickness of one of the strengthened glass substrates is substantially When the upper is 0.55 mm, the number of the cutting grooves is approximately 400. The cutting wheel according to claim 3, wherein the thickness of one of the tempered glass substrates is substantially 0.7 mm, and the number of the cutting grooves is substantially 500. The cutting blade according to claim 4 or 5, wherein the cutting blade is used for cutting the tempered glass substrate having substantially CT (Center Tensile Stress) of 10 MPa or more. The cutting wheel of claim 6, wherein the cutting wheel is for cutting the strengthened glass substrate having substantially CT22 MPa. The cutting wheel of claim 1, wherein the cutting groove extends substantially along the axial direction of the cutting wheel.