KR101383644B1 - Substrate separation device and for method for separating the substrate using thereof - Google Patents

Substrate separation device and for method for separating the substrate using thereof Download PDF

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Publication number
KR101383644B1
KR101383644B1 KR1020120059171A KR20120059171A KR101383644B1 KR 101383644 B1 KR101383644 B1 KR 101383644B1 KR 1020120059171 A KR1020120059171 A KR 1020120059171A KR 20120059171 A KR20120059171 A KR 20120059171A KR 101383644 B1 KR101383644 B1 KR 101383644B1
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South Korea
Prior art keywords
substrate
members
separation
separating
auxiliary
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KR1020120059171A
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Korean (ko)
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KR20130135531A (en
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박민규
임종섭
이종철
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이종철
주식회사 아바코
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Priority to KR1020120059171A priority Critical patent/KR101383644B1/en
Priority to CN201310214495.3A priority patent/CN103456662B/en
Publication of KR20130135531A publication Critical patent/KR20130135531A/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

Abstract

The present invention relates to a substrate separation device for separating a parent substrate into a plurality of unit substrates, the plurality of separation being disposed on one side of the parent substrate and arranged in one direction, supporting at least a portion of the parent substrate, and capable of lifting up and down respectively. And a drive unit for individually raising and lowering the member and the plurality of separating members at a time difference.
Therefore, according to embodiments of the present invention, it is possible to minimize the problem that the unit substrate or the adjacent parent substrate region is damaged when the parent substrate is separated into the unit substrate. Therefore, a unit substrate having a clean separation area can be obtained as compared with the prior art, and the defect rate of the unit substrate can be lowered and product quality can be improved.

Description

Substrate separation device and for method for separating the substrate using equivalent}

The present invention relates to a substrate separation apparatus and a substrate separation method using the same, and to a substrate separation apparatus for easily separating a parent substrate into a plurality of unit substrates and a substrate separation method using the same.

In general, panels used for flat panel displays are usually manufactured using a brittle substrate, and the panel is roughly classified into a single plate substrate composed of one sheet or a bonded substrate bonded to two substrates.

Since the bonded substrate is processed into small and various sizes, such as a panel for a liquid crystal display of a mobile phone, to a large size such as a panel such as a TV or a display, the bonded substrate is separated into a unit substrate having a predetermined size from the large parent substrate. Used as a panel.

The method for separating a large parent substrate into a plurality of unit substrates may include forming a plurality of scribe lines on the mother substrate, pressing the mother substrate to generate cracks in the scribe line, and separating the mother substrate into the unit substrates. Steps.

In this case, a separate substrate separation apparatus is required to separate the unit substrate from the mother substrate where the crack is generated along the scribe line. Conventional substrate separation apparatus includes an adsorption pad for supporting a parent substrate, a support block for supporting a pair of adsorption pads, and a cylinder connected to the support block to lift up and down a pair of adsorption pads.

A method of separating the parent substrate into a plurality of unit substrates by using the substrate separation apparatus will be briefly described as follows.

First, the pair of adsorption pads are lowered using a cylinder so that the mother substrate is supported by the pair of adsorption pads. At this time, the pair of adsorption pads support a region between two adjacent scribe lines among the plurality of scribe lines. Thereafter, when a pair of adsorption pads are simultaneously raised by using a cylinder, a region raised by the pair of adsorption pads is separated, which is a unit substrate.

On the other hand, conventionally, since a pair of adsorption pads rise to the same height at the same time, the pair of adsorption pads is perpendicular to the upper surface of the parent substrate. Accordingly, the impact applied to the area between the both ends of the unit substrate to be separated and the parent substrate is large. Thus, a problem arises in that the separated unit substrate or the adjacent parent substrate region is damaged (eg, tearing occurs), and the damaged unit substrate cannot be used as a panel. Therefore, the defective occurrence rate rises and the panel production rate decreases.

Korean Patent No. 10-0960468 discloses a mother substrate cutting method for separating a mother substrate into a liquid crystal display panel by raising the mother substrate after the braking process by using a trans hand.

Korea Patent Registration No. 10-0960468

One object of the present invention is to provide a substrate separation apparatus for easily separating a parent substrate into a plurality of unit substrates and a substrate separation method using the same.

Another technical problem of the present invention is to provide a substrate separating apparatus and a substrate separating method using the same in minimizing damage to the mother substrate or the unit substrate during the operation of separating the mother substrate into a plurality of unit substrates.

The present invention relates to a substrate separation device for separating a parent substrate into a plurality of unit substrates, the plurality of unit substrates being disposed above and arranged in one direction, supporting at least a portion of the parent substrate, and being capable of lifting up and down respectively. Separating member; And a drive unit for individually raising and lowering the plurality of separation members at a time difference.

Preferably, the separating member is a suction pad.

The drive unit includes a plurality of drive units, each connected to a plurality of separating members.

The drive unit, a power source for providing a power up and down; A lifting member for supporting the separation member; And a drive shaft, one end of which is connected to the power source and the other end of which is connected to the elevating member, wherein the power source is a servo motor.

It extends in the direction in which the parent substrate is located, and includes an auxiliary member capable of lifting up and down.

The auxiliary member is provided in plurality,

It is arranged in the outward direction of each of the plurality of separating members.

And the auxiliary member is bent in a direction in which the separation member is positioned.

And an auxiliary drive unit for lifting up and down each of the auxiliary members.

The present invention provides a substrate separation method for separating the parent substrate into a plurality of unit substrates by using a plurality of separation members that support at least a portion of the parent substrate. Corresponding positioning above the region to be separated from the mother substrate; Lowering the plurality of separation members to support a parent substrate on the plurality of separation members; And individually lifting the plurality of separating members with a time difference while the plurality of separating members support the parent substrate.

Individually raising the plurality of separation members at a time difference may include: raising one of the separation members of the plurality of separation members; Raising another separating member which is not raised in the previous step among the plurality of separating members.

It is preferable to raise the heights of the plurality of separating members differently.

The auxiliary member provided on one side of each of the plurality of separation members is lowered so that the end of the auxiliary member supports the mother substrate, thereby helping to separate the mother substrate.

Forming a plurality of scribe lines on the parent substrate prior to the step of correspondingly positioning the plurality of separation members above the region to be separated from the parent substrate; And pressing the parent substrate.

In the step of lowering the plurality of separation members to support the parent substrate to the plurality of separation members, the plurality of separation members are located in the parent substrate region located between two adjacent scribe lines of the plurality of scribe lines. I support it.

According to embodiments of the present invention, a problem in which the unit substrate or the adjacent parent substrate region is damaged in the operation of separating the parent substrate into the unit substrate can be minimized. Therefore, a unit substrate having a clean separation area can be obtained as compared with the prior art, and the defect rate of the unit substrate can be lowered and product quality can be improved.

1 is a cross-sectional view showing main parts of a substrate separation apparatus according to an embodiment of the present invention.
2 is a cross-sectional view sequentially illustrating a process of separating a plurality of unit substrates from a mother substrate using a substrate separation apparatus according to an embodiment of the present invention.
3 is a cross-sectional view sequentially illustrating a process of separating a mother substrate using an auxiliary member according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.

The mother substrate MS described in the present invention is a brittle material substrate such as a glass substrate, a ceramic, a semiconductor wafer, or the like used for a flat panel display. For the sake of explanation, in the present embodiment, two glass substrates used in a liquid crystal display are bonded. An apparatus and a method of separating a mother substrate MS into a plurality of unit substrates will be described as an example.

1 is a cross-sectional view showing main parts of a substrate separation apparatus according to an embodiment of the present invention.

After the scribe line is formed, the substrate separation apparatus according to the embodiment is a device for separating the parent substrate MS pressurized on both sides of the scribe line or the scribe line into a plurality of unit substrates. The mother substrate MS is a substrate in which two substrates, that is, the first substrate S1 and the second substrate S2 are bonded to each other.

As shown in FIG. 1, the substrate separating apparatus supports the table 100 on which the mother substrate MS is mounted and the mother substrate MS, and the plurality of separation members 200a and 200b respectively move up and down with a time difference. It includes a separation module 700 having a) and a support block 800 for horizontally moving by fixing the separation module 700. In addition, although not shown, the first horizontal moving module installed to be coupled to the support block 800 from the upper side of the table 100 to horizontally move the separation module 700, the surface plate disposed below the table 100 and Located between the table and the surface plate, the separation module 700 includes a second horizontal moving module for horizontally moving the parent substrate MS in a direction orthogonal to the horizontal moving direction.

Table 100 according to the embodiment is manufactured in the shape of a square plate (plate). However, the table 100 is not limited thereto and may be manufactured in various shapes corresponding to the shape of the mother substrate MS. The table 100 is provided with fixing means for supporting and fixing the mother substrate MS. In the embodiment, a plurality of adsorption holes for adsorbing and fixing the mother substrate MS by vacuum suction force are provided. However, the fixing means for supporting and fixing the mother substrate MS is not limited to the adsorption holes, and various means such as clamps, trays, and electrostatic chucks may be used.

The first horizontal moving module may include, for example, a first guide rail extending in one direction and a first moving block positioned between the first guide rail and the support block 800 and sliding along the first guide rail. Thus, the support block 800 supporting the separation module 700 may be horizontally moved by the first guide rail and the first moving block. In addition, the second horizontal moving module may be, for example, a second moving block positioned between the second guide rail and the second guide rail and the table extending in a direction orthogonal to the first guide rail on the surface plate and sliding along the second guide rail. Can be done with. Accordingly, the table 100 supporting the mother substrate MS may be horizontally moved by the second guide rail and the second moving block. Of course, the first and second horizontal moving modules are not limited to the configuration and structure described above, and various ones capable of horizontally moving the separation module 700 and the table 100 may be used.

The separation module 700 separates the parent substrate MS into a plurality of unit substrates. The separation module 700 supports the parent substrate MS, and each of the plurality of separation members 200a and 200b and the plurality of separation members that can lift up and down, respectively. It is connected to each of the (200a, 200b), extends in the direction in which the drive unit 300, the parent substrate (MS) is positioned to raise and lower the plurality of separation members (200a, 200b) individually with a time difference, The plurality of auxiliary members 400a and 400b, the plurality of auxiliary driving units 500 for raising and lowering the plurality of auxiliary members 400a and 400b, and the driving unit 300 and the auxiliary driving unit 500 are mounted. Fixing members 600a and 600b.

The substrate separating apparatus according to the embodiment includes two separating members 200a and 200b (that is, first and second separating members 200a and 200b). However, the number of separation members 200a and 200b is not limited thereto and may be provided in two or more numbers.

Each of the first and second separation members 200a and 200b is positioned above the table 100 to support the parent substrate MS, and in this embodiment, the adsorption force to support the mother substrate MS with adsorption force. Use a pad. In addition, the adsorption pad according to the embodiment is manufactured in a shape, for example, a trapezoidal shape, in which a width thereof gradually increases toward the parent substrate MS. However, the first and second separation members 200a and 200b are not limited to the suction pad and the trapezoidal shape, and may be used in various means and shapes capable of supporting and fixing the parent substrate MS.

Each of the first and second separation members 200a and 200b is lifted up and down individually by the first and second driving units 300b to be described later. When the second separation members 200a and 200b are lifted up, the first separation member 200a and the second separation member 200b individually rise with a time difference. In other words, in the past, the plurality of separating members 200a and 200b simultaneously raised while supporting the parent substrate MS, but in the present invention, the plurality of separating members 200a and 200b sequentially rise with time difference. . As a result, the separation can be performed stably without damaging the unit substrate or the adjacent parent substrate MS, and the separation operation can be easily performed. A detailed description of separating the parent substrate MS into a plurality of unit substrates using the plurality of separation members 200a and 200b according to the embodiment will be given below.

The driving unit 300 lifts and lowers the first and second separation members 200a and 200b separately, and the first driving unit 300a and the second separation member 200b to lift and lower the first separation member 200a. It includes a second drive unit (300b) for raising and lowering.

Each of the first and second driving units 300a and 300b is connected to the separating members 200a and 200b and is provided on the lifting members 340a and 340b and the supporting block 800 to support the separating members 200a and 200b. Power sources 310a and 310b installed to provide lifting force, one end of which is connected to power sources 310a and 310b to drive shafts 320a and 320b and lifting members 340a and 340b to penetrate the lifting members 340a and 340b. It includes a lift (330a, 330b) to raise and lower). In other words, the drive unit 300 includes first and second lifting members 340a and 340b connected to the first and second separation members 200a and 200b, respectively, and first and second power sources providing lifting force. (310a, 310b), one end is connected to the first and second power source (310a, 310b), respectively, the first and second drive shaft (320a) installed to penetrate the first and second elevating members (340a, 340b) , 320b), and first and second elevators 330a and 330b for elevating and lowering the first and second elevator members 340a and 340b, respectively. Accordingly, the first and second separation members 200a and 200b may be individually lifted up and down.

In the embodiment, a servo motor is used as the first and second power sources 310a and 310b, but the present invention is not limited thereto, and the driving shafts 320a and 320b and the lifting blocks 330a-2 and 330b-2 are lifted and lowered. Various means of providing power can be used. The first and second driving shafts 320a and 320b are connected to the first and second driving units 300a and 300b, respectively.

For example, the first and second lifting members 340a and 340b may include, for example, a vertical portion extending in the longitudinal direction in which the mother substrate MS is located and one end thereof connected to the vertical portion and extending in a horizontal direction with the mother substrate MS. It is made of a shape consisting of a horizontal part, that is, the letter “b” of a Korean consonant. In addition, the first and second lifting members 340a and 340b are disposed such that the other ends of the first and second lifting members 340a and 340b face each other. The first and second driving shafts 320a and 320b are installed to penetrate the upper portions of the first and second lifting members 340a and 340b.

However, the shapes of the first and second lifting members 340a and 340b are not limited to the shapes described above, and various shapes that support and lift the first and second separation members 200a and 200b. For example, it may be manufactured in a straight bar shape.

Each of the first and second elevators 330a and 330b is provided with guide rails 330a-1 and 330a-2 and guide rails 330a-1 and 330a-2 mounted on the inner surfaces of the fixing members 600a and 600b. And lifting blocks 300a-2 and 300b-2 mounted to connect between the lifting members 340a and 340b and sliding along the guide rails 330a-1 and 330a-2.

The first and second fixing members 600a and 600b extend in the longitudinal direction and are mounted such that one end thereof is connected to the lower portion of the support block 800. Here, the first fixing member 600a is located between the first elevator 330a and the first auxiliary driver 500a which will be described later, and the second fixing member 600b is the second elevator 330b and the second auxiliary driver. Located between the driving unit 500b. At this time, the first guide rail 330a-1 is mounted on the inner surface of the first fixing member 600a, the first auxiliary driving part 500a is mounted on the outer surface, and the inner surface of the second fixing member 600b. It is preferable that the second guide rail 330b-1 is mounted, and the second auxiliary driver 500b is mounted on the outer surface. Accordingly, the first driving unit 300a and the first auxiliary driving unit 500a are mounted and fixed by the first fixing member 600a, and the second driving unit 300b and the first auxiliary driving unit are mounted and fixed by the second fixing member 600b. 500a is fixed to be mounted.

Hereinafter, the lifting and lowering operation of the first separating member 200a by the first driving unit 300a will be briefly described. Here, the lifting and lowering operation of the second separating member 200b by the second driving unit 300b is the same as that of the first driving unit 300a and the first separating member 200a, and thus, the second driving unit 300b and the first driving unit 300b. 2, the description of the operation of the separating member 200b will be omitted.

When the first power source 310a is operated, the first elevating member 340a is raised or lowered by the first drive shaft 320a and the first elevator 330a connected to the first power source 310a. Here, the first drive shaft 320a is provided to penetrate the upper portion of the first elevating member 340a, and the first elevating block 330a-2 is disposed on the outer surface of the first elevating member 340a. Since it is mounted, the first elevating member 340a moves up or down along the first drive shaft 320a and the first elevating block 330a-2. At this time, the first lifting block 330a-2 slides along the first guide rail 330a-1 in the upward direction or the downward direction. By this operation, the first separation member 200a descends in the direction in which the mother substrate MS is located or rises in the opposite direction.

The drive unit 300 is not limited to the above-described configuration and structure, and means of various configurations and structures capable of raising and lowering the first and second separation members 200b separately may be used.

The auxiliary members 400a and 400b are auxiliary mechanisms for assisting the separation operation of the parent substrate MS. In this embodiment, two auxiliary members 400a and 400b are provided. However, the number of the auxiliary members 400a and 400b is not limited thereto and may be provided in two or less or more.

The first auxiliary member 400a is located outward of the first separating member 200a, the second auxiliary member 400b is located outward of the second separating member 200b, and the first auxiliary member 400a is located. ) And the second auxiliary member 400b are installed to face each other. That is, as shown in FIG. 1, the first auxiliary member 400a is positioned on the left side with respect to the first separating member 200a, and the second auxiliary member 400b is right on the basis of the second separating member 200b. Located in Each of the first and second auxiliary members 400b is bent in the direction in which the first and second separation members 200b are positioned, and the area thereof is narrower toward the direction in which the first and second separation members 200b are located. Lost hook shape. Of course, the shape of the first and second auxiliary members 400b is not limited thereto, and may be manufactured in various shapes, for example, a bar shape extending in a direction in which the mother substrate is located.

The auxiliary driving unit 300 lifts up and down each of the first and second auxiliary members 400a and 400b separately, and includes the first auxiliary driving part 500a and the second auxiliary driving part 500b.

Each of the first and second auxiliary driving units 500a and 500b is formed in the auxiliary power sources 510a and 510b for providing the lifting force and extends in the longitudinal direction, and has one end connected to the auxiliary power sources 510a and 510b. 520b), extending in the horizontal direction, one end connected to the auxiliary drive shafts 520a and 520b and one end connected to the connection members 530a and 530b, and the other end to the separation member 200a and 200b. Connected support members 540a, 540b.

In an embodiment, a cylinder may be used as the auxiliary power sources 510a and 510b, and the auxiliary driving shafts 520a and 520b may be pistons that extend in the vertical direction and extend or contract by cylinder driving. The connecting members 530a and 530b extend from the auxiliary drive shafts 520a and 520b in the direction in which the separating members 200a and 200b are positioned. The support members 540a and 540b are mounted on the other ends of the connection members 530a and 530b.

Hereinafter, the lifting and lowering operation of the first auxiliary member 400a by the first auxiliary driving unit 500a will be briefly described. Here, the raising and lowering operation of the second auxiliary member 400b by the second auxiliary driving unit 500b is the same as that of the first auxiliary driving unit 500a and the first auxiliary member 400a, and thus the second auxiliary driving unit 500b. ) And the operation of the second auxiliary member 400b will be omitted.

When the first auxiliary power source 510a is operated, the first driving shaft 520a is extended in the direction in which the mother substrate MS is located or contracts in a direction opposite to the direction in which the mother substrate MS is located according to the operation. Accordingly, the first auxiliary member 400a connected to the first drive shaft 520a is raised or lowered through the first connection member 530a and the first support member 540a.

The auxiliary drive unit 300 is not limited to the above-described configuration and structure, and means of various configurations and structures capable of raising and lowering the first and second auxiliary members 400b separately may be used.

2 is a cross-sectional view sequentially illustrating a process of separating a plurality of unit substrates from a mother substrate using a substrate separation apparatus according to an embodiment of the present invention. Hereinafter, for convenience of description, a mother substrate region or a mother substrate region to be separated from the mother substrate using a substrate separation apparatus is referred to as a "unit substrate (us)".

First, although not shown, a plurality of scribe lines SL1 and SL2 are formed on each of the first and second substrates S1 and S2 joined up and down using a scribing apparatus. Then, cracks are generated by pressing both sides of the scribe lines SL1 and SL2 or the scribe lines SL1 and SL2 using the pressurizing device. Since the scribing apparatus for forming the scribe lines SL1 and SL2 on the first and second substrates S1 and S2 and the pressurizing apparatus for pressurizing the mother substrate MS are generally used in the art, Detailed description thereof will be omitted.

Here, cracks are generated along the scribe lines SL1 and SL2 in the mother substrate MS pressed by the pressing device, but the mother substrate MS is not completely separated into a plurality of unit substrates us. . Thus, the mother substrate MS is separated into a plurality of unit substrates us using the substrate separation apparatus according to the embodiment of the present invention.

To this end, first, as shown in FIG. 2A, the mother substrate MS on which the first substrate S1 and the second substrate S2 are bonded is seated on the table 100. In the exemplary embodiment, the mother substrate MS is seated so that the first substrate S1 is positioned above, but the mother substrate MS may be seated in the opposite direction. When the mother substrate MS is seated on the table 100, the mother substrate MS is fixed on the table 100 by providing suction force through the suction hole.

Next, using the first horizontal moving unit and the support block 800, the separation module 700 is moved correspondingly to the upper side of the parent substrate MS region to be separated. In this case, the first and second separation members 200a and 200b of the separation module 700 are positioned above the mother substrate MS, for example, above the region between two adjacent scribe lines SL1 formed on the first substrate S1. Move it to

If the first and second separation members are located above the area between the two scribe lines SL1, as shown in FIG. 2B, the first and second driving members 300a and 300b may be used. The first and second separation members 200a and 200b are lowered to support the parent substrate MS. That is, the first and second power sources 310a and 310b are operated to operate the first and second elevators 330a and 330b and the first and second drive shafts 320a and 320b, respectively. 2 Lowering members 340a and 340b are lowered. Accordingly, lower surfaces of the first and second separation members 200a and 200b are in contact with an area between two adjacent scribe lines SL1 formed on the first substrate S1 to support the parent substrate.

Thereafter, as shown in FIG. 2C, one of the first and second separation members 200a and 200b is first raised. For example, first, the first driving unit 300a is operated to raise the first elevating member 340a, thereby raising the first separating member 200a connected to the first elevating member 340a. At this time, since the second driving unit 300b has not operated, the second separating member 200b does not rise or fall. Thus, the region supported by the first separating member 200a is positioned higher than the region supported by the second separating member 200b. Therefore, as shown in FIG. 2C, the unit substrate us rises in a state inclined at a predetermined inclination, and at this time, the end portions of the unit substrate us are supported by the first separation member 200a. One end adjacent to the area is separated from the parent substrate MS.

Subsequently, as illustrated in FIG. 2D, the second driving unit 300b is operated to raise the second elevating member 340b, thereby separating the second connected to the second elevating member 340b. The member 200b is raised. At this time, it is effective to raise the height where the second separation member is raised to be higher than the first separation member that is raised first. Thus, the region supported by the second separating member 200b is positioned higher than the region supported by the first separating member 200a. Therefore, as shown in FIG. 2 (d), the unit substrate (us) rises in a state inclined at a predetermined inclination, wherein at both ends of the unit substrate (us), the unit substrate (us) is supported by the second separation member (200b). The other end adjacent to the area is separated from the parent substrate MS.

Of course, the height of raising the second separating member 200b may be raised to be lower than or equal to the height of the first separating member 200a.

Then, as shown in Fig. 2E, both the first and second driving units are operated to raise the first and second separating members. At this time, it is preferable to raise the first and second separation members 200a and 200b so that the unit substrate us is not inclined.

3 is a cross-sectional view sequentially illustrating a process of separating a mother substrate using an auxiliary member according to an exemplary embodiment of the present invention.

As shown in (c) and (d) of FIG. 2 or (a) of FIG. 3, when raising one of the first and second separating members 200a and 200b, the first and second auxiliary members 400a are raised. , 400b) may be lowered to assist separation of the unit substrate (us). That is, the mother substrate MS whose first and second auxiliary members 400a and 400b are supported by the first and second separation members 200a and 200b by operating the first and second auxiliary drivers respectively. It is lowered to be in contact with the mother substrate (MS) area located on both sides of the. At this time, the unit substrate (us) is easily separated from the mother substrate (MS) by the force that the first and second auxiliary members (400a, 400b) press the mother substrate (MS).

In the above description, the first and second auxiliary members 400a and 400b are simultaneously lowered, but the present invention is not limited thereto, and the first and second auxiliary members 400a and 400b may be lowered individually. For example, when the first separation member 200a is raised, the first auxiliary member 400a may be raised, and when the second separation member 200b is raised, the second auxiliary member 400b may be raised. Of course, the present invention is not limited thereto and vice versa.

As described above, in the exemplary embodiment of the present invention, the first separating member 200a and the second separating member 200b are lifted separately with a time difference. Accordingly, as shown in (c) and (d) of FIG. 2, the inclination is downward in the direction in which the other end of the unit substrate (us) is located (FIG. 2 (d)) is separated while rising. That is, the unit substrate us is separated while the twist rises. Thus, when the unit substrate (us) is separated from the mother substrate (MS), the impact applied to one end and the other end of the unit substrate (us) and the mother substrate (MS) is smaller than in the prior art. Therefore, as compared with when the first and second separation members 200a and 200b are formed at the same time (an angle of 90 ° with the upper surface of the parent substrate) as in the related art, one end and the other end of the unit substrate or the unit substrate Damage problems such as tearing of the mother substrate (MS) area that is in contact with one end and the other end can be minimized.

MS: Mo substrates US: Unit substrates
200a: first separating member 200b: second separating member
300a: first driver 300b: second driver
400a: first auxiliary member 400b: second auxiliary member
500a: first auxiliary driver 500b: second auxiliary driver

Claims (14)

A substrate separation apparatus for separating a parent substrate into a plurality of unit substrates,
A plurality of separation members positioned on one side of the mother substrate, arranged in one direction, supporting at least a portion of the mother substrate, and capable of lifting up and down respectively;
A drive unit for individually raising and lowering the plurality of separation members at a time difference;
The mother substrate extends in a direction in which the mother substrate is located, and can be lifted and lowered, and when descending, the mother substrate is in contact with the mother substrate located on both sides of the mother substrate supported by the plurality of separation members. Substrate separation apparatus comprising a plurality of auxiliary members disposed in.
The method according to claim 1,
And the separating member is an adsorption pad.
The method according to claim 1,
And the driving unit includes a plurality of driving units connected to the plurality of separation members, respectively.
The method of claim 3,
The driving unit includes:
A power source providing up and down power;
A lifting member for supporting the separation member; And
One end is connected to the power source and the other end comprises a drive shaft connected to the elevating member,
The power source is a servo motor (servo motor) substrate separation apparatus.
delete delete The method according to claim 1,
And the auxiliary member is bent in a direction in which the separation member is positioned.
The method of claim 7,
And an auxiliary drive unit for lifting up and down each of the auxiliary members.
A substrate separation method of separating a parent substrate into a plurality of unit substrates by using a plurality of separation members that support at least a partial region of the parent substrate.
Moving the plurality of separation members to correspondingly position the plurality of separation members above an area to be separated from the parent substrate;
Lowering the plurality of separation members to support a parent substrate on the plurality of separation members;
Individually lifting the plurality of separating members with a time difference while the plurality of separating members support the parent substrate;
Lt; / RTI >
In the step of individually raising the plurality of separating members at a time difference, the plurality of auxiliary members disposed in an outward direction of each of the plurality of separating members is lowered so that an end of each of the plurality of auxiliary members is separated from the plurality of separating members. A substrate separation method for assisting separation of a unit substrate by bringing into contact with a mother substrate region located on both sides of the mother substrate supported on the substrate.
The method of claim 9,
Individually raising the plurality of separating members at a time difference;
Raising the separation member of any of the plurality of separation members;
And raising another separation member that is not raised in the previous step among the plurality of separation members.
The method of claim 9,
And separating heights of the plurality of separation members from each other.
delete The method of claim 9,
Before the step of correspondingly positioning the plurality of separation members above the area to be separated from the parent substrate,
Forming a plurality of scribe lines on the parent substrate; And
Pressing the parent substrate.
The method according to claim 13,
In the step of lowering the plurality of separation members, the parent substrate is supported on the plurality of separation members,
And the plurality of separating members support a parent substrate region located between two adjacent scribe lines of the plurality of scribe lines.
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KR102400550B1 (en) * 2015-03-16 2022-05-23 주식회사 탑 엔지니어링 Breaking system for attached substrate
TWI576302B (en) * 2015-05-28 2017-04-01 友達光電股份有限公司 Plate removing equipment and method for removing plate using the same
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