KR101383644B1 - Substrate separation device and for method for separating the substrate using thereof - Google Patents
Substrate separation device and for method for separating the substrate using thereof Download PDFInfo
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- KR101383644B1 KR101383644B1 KR1020120059171A KR20120059171A KR101383644B1 KR 101383644 B1 KR101383644 B1 KR 101383644B1 KR 1020120059171 A KR1020120059171 A KR 1020120059171A KR 20120059171 A KR20120059171 A KR 20120059171A KR 101383644 B1 KR101383644 B1 KR 101383644B1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
The present invention relates to a substrate separation device for separating a parent substrate into a plurality of unit substrates, the plurality of separation being disposed on one side of the parent substrate and arranged in one direction, supporting at least a portion of the parent substrate, and capable of lifting up and down respectively. And a drive unit for individually raising and lowering the member and the plurality of separating members at a time difference.
Therefore, according to embodiments of the present invention, it is possible to minimize the problem that the unit substrate or the adjacent parent substrate region is damaged when the parent substrate is separated into the unit substrate. Therefore, a unit substrate having a clean separation area can be obtained as compared with the prior art, and the defect rate of the unit substrate can be lowered and product quality can be improved.
Description
The present invention relates to a substrate separation apparatus and a substrate separation method using the same, and to a substrate separation apparatus for easily separating a parent substrate into a plurality of unit substrates and a substrate separation method using the same.
In general, panels used for flat panel displays are usually manufactured using a brittle substrate, and the panel is roughly classified into a single plate substrate composed of one sheet or a bonded substrate bonded to two substrates.
Since the bonded substrate is processed into small and various sizes, such as a panel for a liquid crystal display of a mobile phone, to a large size such as a panel such as a TV or a display, the bonded substrate is separated into a unit substrate having a predetermined size from the large parent substrate. Used as a panel.
The method for separating a large parent substrate into a plurality of unit substrates may include forming a plurality of scribe lines on the mother substrate, pressing the mother substrate to generate cracks in the scribe line, and separating the mother substrate into the unit substrates. Steps.
In this case, a separate substrate separation apparatus is required to separate the unit substrate from the mother substrate where the crack is generated along the scribe line. Conventional substrate separation apparatus includes an adsorption pad for supporting a parent substrate, a support block for supporting a pair of adsorption pads, and a cylinder connected to the support block to lift up and down a pair of adsorption pads.
A method of separating the parent substrate into a plurality of unit substrates by using the substrate separation apparatus will be briefly described as follows.
First, the pair of adsorption pads are lowered using a cylinder so that the mother substrate is supported by the pair of adsorption pads. At this time, the pair of adsorption pads support a region between two adjacent scribe lines among the plurality of scribe lines. Thereafter, when a pair of adsorption pads are simultaneously raised by using a cylinder, a region raised by the pair of adsorption pads is separated, which is a unit substrate.
On the other hand, conventionally, since a pair of adsorption pads rise to the same height at the same time, the pair of adsorption pads is perpendicular to the upper surface of the parent substrate. Accordingly, the impact applied to the area between the both ends of the unit substrate to be separated and the parent substrate is large. Thus, a problem arises in that the separated unit substrate or the adjacent parent substrate region is damaged (eg, tearing occurs), and the damaged unit substrate cannot be used as a panel. Therefore, the defective occurrence rate rises and the panel production rate decreases.
Korean Patent No. 10-0960468 discloses a mother substrate cutting method for separating a mother substrate into a liquid crystal display panel by raising the mother substrate after the braking process by using a trans hand.
One object of the present invention is to provide a substrate separation apparatus for easily separating a parent substrate into a plurality of unit substrates and a substrate separation method using the same.
Another technical problem of the present invention is to provide a substrate separating apparatus and a substrate separating method using the same in minimizing damage to the mother substrate or the unit substrate during the operation of separating the mother substrate into a plurality of unit substrates.
The present invention relates to a substrate separation device for separating a parent substrate into a plurality of unit substrates, the plurality of unit substrates being disposed above and arranged in one direction, supporting at least a portion of the parent substrate, and being capable of lifting up and down respectively. Separating member; And a drive unit for individually raising and lowering the plurality of separation members at a time difference.
Preferably, the separating member is a suction pad.
The drive unit includes a plurality of drive units, each connected to a plurality of separating members.
The drive unit, a power source for providing a power up and down; A lifting member for supporting the separation member; And a drive shaft, one end of which is connected to the power source and the other end of which is connected to the elevating member, wherein the power source is a servo motor.
It extends in the direction in which the parent substrate is located, and includes an auxiliary member capable of lifting up and down.
The auxiliary member is provided in plurality,
It is arranged in the outward direction of each of the plurality of separating members.
And the auxiliary member is bent in a direction in which the separation member is positioned.
And an auxiliary drive unit for lifting up and down each of the auxiliary members.
The present invention provides a substrate separation method for separating the parent substrate into a plurality of unit substrates by using a plurality of separation members that support at least a portion of the parent substrate. Corresponding positioning above the region to be separated from the mother substrate; Lowering the plurality of separation members to support a parent substrate on the plurality of separation members; And individually lifting the plurality of separating members with a time difference while the plurality of separating members support the parent substrate.
Individually raising the plurality of separation members at a time difference may include: raising one of the separation members of the plurality of separation members; Raising another separating member which is not raised in the previous step among the plurality of separating members.
It is preferable to raise the heights of the plurality of separating members differently.
The auxiliary member provided on one side of each of the plurality of separation members is lowered so that the end of the auxiliary member supports the mother substrate, thereby helping to separate the mother substrate.
Forming a plurality of scribe lines on the parent substrate prior to the step of correspondingly positioning the plurality of separation members above the region to be separated from the parent substrate; And pressing the parent substrate.
In the step of lowering the plurality of separation members to support the parent substrate to the plurality of separation members, the plurality of separation members are located in the parent substrate region located between two adjacent scribe lines of the plurality of scribe lines. I support it.
According to embodiments of the present invention, a problem in which the unit substrate or the adjacent parent substrate region is damaged in the operation of separating the parent substrate into the unit substrate can be minimized. Therefore, a unit substrate having a clean separation area can be obtained as compared with the prior art, and the defect rate of the unit substrate can be lowered and product quality can be improved.
1 is a cross-sectional view showing main parts of a substrate separation apparatus according to an embodiment of the present invention.
2 is a cross-sectional view sequentially illustrating a process of separating a plurality of unit substrates from a mother substrate using a substrate separation apparatus according to an embodiment of the present invention.
3 is a cross-sectional view sequentially illustrating a process of separating a mother substrate using an auxiliary member according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Wherein like reference numerals refer to like elements throughout.
The mother substrate MS described in the present invention is a brittle material substrate such as a glass substrate, a ceramic, a semiconductor wafer, or the like used for a flat panel display. For the sake of explanation, in the present embodiment, two glass substrates used in a liquid crystal display are bonded. An apparatus and a method of separating a mother substrate MS into a plurality of unit substrates will be described as an example.
1 is a cross-sectional view showing main parts of a substrate separation apparatus according to an embodiment of the present invention.
After the scribe line is formed, the substrate separation apparatus according to the embodiment is a device for separating the parent substrate MS pressurized on both sides of the scribe line or the scribe line into a plurality of unit substrates. The mother substrate MS is a substrate in which two substrates, that is, the first substrate S1 and the second substrate S2 are bonded to each other.
As shown in FIG. 1, the substrate separating apparatus supports the table 100 on which the mother substrate MS is mounted and the mother substrate MS, and the plurality of
Table 100 according to the embodiment is manufactured in the shape of a square plate (plate). However, the table 100 is not limited thereto and may be manufactured in various shapes corresponding to the shape of the mother substrate MS. The table 100 is provided with fixing means for supporting and fixing the mother substrate MS. In the embodiment, a plurality of adsorption holes for adsorbing and fixing the mother substrate MS by vacuum suction force are provided. However, the fixing means for supporting and fixing the mother substrate MS is not limited to the adsorption holes, and various means such as clamps, trays, and electrostatic chucks may be used.
The first horizontal moving module may include, for example, a first guide rail extending in one direction and a first moving block positioned between the first guide rail and the
The separation module 700 separates the parent substrate MS into a plurality of unit substrates. The separation module 700 supports the parent substrate MS, and each of the plurality of
The substrate separating apparatus according to the embodiment includes two separating
Each of the first and
Each of the first and
The driving
Each of the first and
In the embodiment, a servo motor is used as the first and
For example, the first and
However, the shapes of the first and
Each of the first and
The first and
Hereinafter, the lifting and lowering operation of the
When the
The
The
The first
The
Each of the first and second
In an embodiment, a cylinder may be used as the
Hereinafter, the lifting and lowering operation of the first
When the first
The
2 is a cross-sectional view sequentially illustrating a process of separating a plurality of unit substrates from a mother substrate using a substrate separation apparatus according to an embodiment of the present invention. Hereinafter, for convenience of description, a mother substrate region or a mother substrate region to be separated from the mother substrate using a substrate separation apparatus is referred to as a "unit substrate (us)".
First, although not shown, a plurality of scribe lines SL1 and SL2 are formed on each of the first and second substrates S1 and S2 joined up and down using a scribing apparatus. Then, cracks are generated by pressing both sides of the scribe lines SL1 and SL2 or the scribe lines SL1 and SL2 using the pressurizing device. Since the scribing apparatus for forming the scribe lines SL1 and SL2 on the first and second substrates S1 and S2 and the pressurizing apparatus for pressurizing the mother substrate MS are generally used in the art, Detailed description thereof will be omitted.
Here, cracks are generated along the scribe lines SL1 and SL2 in the mother substrate MS pressed by the pressing device, but the mother substrate MS is not completely separated into a plurality of unit substrates us. . Thus, the mother substrate MS is separated into a plurality of unit substrates us using the substrate separation apparatus according to the embodiment of the present invention.
To this end, first, as shown in FIG. 2A, the mother substrate MS on which the first substrate S1 and the second substrate S2 are bonded is seated on the table 100. In the exemplary embodiment, the mother substrate MS is seated so that the first substrate S1 is positioned above, but the mother substrate MS may be seated in the opposite direction. When the mother substrate MS is seated on the table 100, the mother substrate MS is fixed on the table 100 by providing suction force through the suction hole.
Next, using the first horizontal moving unit and the
If the first and second separation members are located above the area between the two scribe lines SL1, as shown in FIG. 2B, the first and
Thereafter, as shown in FIG. 2C, one of the first and
Subsequently, as illustrated in FIG. 2D, the
Of course, the height of raising the
Then, as shown in Fig. 2E, both the first and second driving units are operated to raise the first and second separating members. At this time, it is preferable to raise the first and
3 is a cross-sectional view sequentially illustrating a process of separating a mother substrate using an auxiliary member according to an exemplary embodiment of the present invention.
As shown in (c) and (d) of FIG. 2 or (a) of FIG. 3, when raising one of the first and
In the above description, the first and second
As described above, in the exemplary embodiment of the present invention, the
MS: Mo substrates US: Unit substrates
200a: first separating
300a:
400a: first
500a: first
Claims (14)
A plurality of separation members positioned on one side of the mother substrate, arranged in one direction, supporting at least a portion of the mother substrate, and capable of lifting up and down respectively;
A drive unit for individually raising and lowering the plurality of separation members at a time difference;
The mother substrate extends in a direction in which the mother substrate is located, and can be lifted and lowered, and when descending, the mother substrate is in contact with the mother substrate located on both sides of the mother substrate supported by the plurality of separation members. Substrate separation apparatus comprising a plurality of auxiliary members disposed in.
And the separating member is an adsorption pad.
And the driving unit includes a plurality of driving units connected to the plurality of separation members, respectively.
The driving unit includes:
A power source providing up and down power;
A lifting member for supporting the separation member; And
One end is connected to the power source and the other end comprises a drive shaft connected to the elevating member,
The power source is a servo motor (servo motor) substrate separation apparatus.
And the auxiliary member is bent in a direction in which the separation member is positioned.
And an auxiliary drive unit for lifting up and down each of the auxiliary members.
Moving the plurality of separation members to correspondingly position the plurality of separation members above an area to be separated from the parent substrate;
Lowering the plurality of separation members to support a parent substrate on the plurality of separation members;
Individually lifting the plurality of separating members with a time difference while the plurality of separating members support the parent substrate;
Lt; / RTI >
In the step of individually raising the plurality of separating members at a time difference, the plurality of auxiliary members disposed in an outward direction of each of the plurality of separating members is lowered so that an end of each of the plurality of auxiliary members is separated from the plurality of separating members. A substrate separation method for assisting separation of a unit substrate by bringing into contact with a mother substrate region located on both sides of the mother substrate supported on the substrate.
Individually raising the plurality of separating members at a time difference;
Raising the separation member of any of the plurality of separation members;
And raising another separation member that is not raised in the previous step among the plurality of separation members.
And separating heights of the plurality of separation members from each other.
Before the step of correspondingly positioning the plurality of separation members above the area to be separated from the parent substrate,
Forming a plurality of scribe lines on the parent substrate; And
Pressing the parent substrate.
In the step of lowering the plurality of separation members, the parent substrate is supported on the plurality of separation members,
And the plurality of separating members support a parent substrate region located between two adjacent scribe lines of the plurality of scribe lines.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020120059171A KR101383644B1 (en) | 2012-06-01 | 2012-06-01 | Substrate separation device and for method for separating the substrate using thereof |
CN201310214495.3A CN103456662B (en) | 2012-06-01 | 2013-05-31 | Substrate separator and use the base plate separation method of this device |
Applications Claiming Priority (1)
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KR1020120059171A KR101383644B1 (en) | 2012-06-01 | 2012-06-01 | Substrate separation device and for method for separating the substrate using thereof |
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KR20130135531A KR20130135531A (en) | 2013-12-11 |
KR101383644B1 true KR101383644B1 (en) | 2014-04-09 |
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KR1020120059171A KR101383644B1 (en) | 2012-06-01 | 2012-06-01 | Substrate separation device and for method for separating the substrate using thereof |
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CN (1) | CN103456662B (en) |
Families Citing this family (9)
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KR102336572B1 (en) * | 2015-01-23 | 2021-12-08 | 삼성디스플레이 주식회사 | Substrate desorption apparatus and method for manufacturing display device using threrof |
KR102400550B1 (en) * | 2015-03-16 | 2022-05-23 | 주식회사 탑 엔지니어링 | Breaking system for attached substrate |
TWI576302B (en) * | 2015-05-28 | 2017-04-01 | 友達光電股份有限公司 | Plate removing equipment and method for removing plate using the same |
JP2017095294A (en) * | 2015-11-20 | 2017-06-01 | 三星ダイヤモンド工業株式会社 | Substrate cutting device |
CN107153286B (en) * | 2017-06-07 | 2020-07-17 | 友达光电(厦门)有限公司 | Lobe of a leaf unit and display panel's preparation system |
JP2019107779A (en) * | 2017-12-15 | 2019-07-04 | 三星ダイヤモンド工業株式会社 | Pickup unit |
KR102371176B1 (en) * | 2018-02-09 | 2022-03-08 | 주식회사 오럼머티리얼 | Method for separating mask adhere to frame |
KR102440620B1 (en) * | 2018-08-07 | 2022-09-06 | 주식회사 오럼머티리얼 | Mask set and method for changing mask of mask integrated frame |
TWI709492B (en) * | 2019-11-22 | 2020-11-11 | 辛耘企業股份有限公司 | Stripping device |
Citations (2)
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JPH0980367A (en) * | 1995-09-11 | 1997-03-28 | Hitachi Ltd | Liquid crystal cell and spacer sheet separating device |
KR100960468B1 (en) * | 2005-12-29 | 2010-05-28 | 엘지디스플레이 주식회사 | Method of cutting liquid crystal display panel and method of fabricating liquid crystal display panel using the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009080367A (en) * | 2007-09-27 | 2009-04-16 | Sony Corp | Display device, its driving method, and electronic equipment |
KR100889308B1 (en) * | 2007-11-21 | 2009-03-18 | 세메스 주식회사 | Scribing apparatus and method, apparatus for cutting substrate using the scribing apparatus |
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2012
- 2012-06-01 KR KR1020120059171A patent/KR101383644B1/en active IP Right Grant
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2013
- 2013-05-31 CN CN201310214495.3A patent/CN103456662B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0980367A (en) * | 1995-09-11 | 1997-03-28 | Hitachi Ltd | Liquid crystal cell and spacer sheet separating device |
KR100960468B1 (en) * | 2005-12-29 | 2010-05-28 | 엘지디스플레이 주식회사 | Method of cutting liquid crystal display panel and method of fabricating liquid crystal display panel using the same |
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KR20130135531A (en) | 2013-12-11 |
CN103456662B (en) | 2016-04-27 |
CN103456662A (en) | 2013-12-18 |
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