JP5796774B2 - Cleaving method and apparatus for brittle plate - Google Patents

Description

  The present invention relates to a cleaving method and cleaving apparatus for a brittle plate, and more particularly to a cleaving method and cleaving apparatus for a brittle plate that cleave a flat plate made of a brittle material such as glass, crystallized glass, and ceramic with high dimensional accuracy. is there.

  Conventionally, when obtaining a glass piece of a predetermined size from a large glass plate, first, a scribe line is formed on one glass surface of the large glass plate with a tool or laser light, and then the glass is cut in a direction to tear the scribe line. A method of cleaving a glass plate by applying a stress to the plate is employed.

  For example, in Patent Document 1, a glass plate having a scribe line formed on the upper surface is clamped from above and below by an anvil having a pair of downward projections and an upward pusher to cause bending stress to act on the glass plate. A glass breaker that breaks a glass plate along a scribe line is disclosed.

  Further, in Patent Document 2, a scribe line is formed in a grid pattern on the upper surface by laser light, and the lower surface side is pressed with a linear head while pressing the upper surface of the glass plate with a jig. Is disclosed along the scribe lines. First, a plurality of strip-shaped glass plates are obtained by cleaving a glass plate in order from one end portion with a scribe line in one direction among a plurality of scribe lines formed in a grid pattern. A rectangular glass piece such as a cover glass for an optical element, for example, is obtained by arranging the strip-shaped glass plates and aligning scribe lines in other directions and cleaving again.

Japanese Utility Model Publication No. 62-37050 JP 2004-221541 A (paragraph 0083, FIG. 5)

  However, although the glass breaker described in Patent Document 1 can press the glass plate by linearly moving the pusher in a direction perpendicular to the glass plate, it must be manually cleaved while holding the glass breaker. Therefore, it is not easy to accurately press the formation position of the scribe line from the lower surface side of the glass plate with a pusher, and it is difficult to cleave the glass plate with high dimensional accuracy along the scribe line.

  Further, although the glass cleaving method described in Patent Document 2 can efficiently obtain a large number of glass pieces from a large glass plate, it is possible to directly obtain defects or protrusions on the cut cross section of each glass piece or the glass plate surface. There is a risk that high dimensional accuracy may not be stably obtained with respect to angles, etc., and therefore the burden of subsequent glass piece sorting work becomes excessive, and high reliability and low cost are required, for example, optical cover glass for mass production It was not suitable as a cleaving method.

  The present invention was made in view of the above-described problems in the conventional method of cleaving a brittle plate, and cleaves a brittle plate formed with a scribe line with high dimensional accuracy along the scribe line. It is an object of the present invention to provide a cleaving method and a cleaving apparatus for a brittle plate that can be performed.

The present invention relates to a brittle plate having a scribe line formed on its upper surface, an anvil having a pair of downward projections and a depression between the projections, and an upward movement that moves toward and away from the depression of the anvil. A method for cleaving a brittle plate material, which is clamped from above and below by a pusher and cleaves the brittle plate material along the scribe line,
One end side of the brittle plate placed on the mounting table with the scribe line facing upward is protruded laterally from the end of the mounting table, and the scribe line to be cleaved of the brittle plate is connected to the mounting table. Positioning step for positioning to a position directly above the tip of the pusher provided so as to be movable up and down on the side, and pushing up one end side of the positioned brittle plate to separate the one end of the brittle plate from the mounting table In the separation step, with the pusher in a state where the pair of protrusions of the anvil are in contact with the scribe line on the upper surface of the brittle plate while the one end side of the brittle plate is separated from the mounting table. And a cleaving step of cleaving the brittle plate along the scribe line by pressing the scribe line from the lower surface side of the brittle plate.

  Further, the present invention is characterized in that, in the separation step, the pusher pushes up the scribe line of the brittle plate material from the lower surface side to separate one end side of the brittle plate material from the mounting table.

  Further, the present invention provides a holding step of sucking and holding the split piece obtained by cleaving the brittle plate material in the cleaving step with the anvil through an intake hole provided in a hollow portion of the anvil, and suction with the anvil. An unloading step of moving the anvil to unload it.

Further, the present invention is a brittle plate material cleaving device for cleaving along a scribe line a brittle plate material having a scribe line formed on the upper surface,
A mounting table on which the brittle plate material can be mounted with the scribe line facing up; an anvil provided above the mounting table and having a pair of downward projections and a depression between the projections; An upward pusher which is provided on the side of the mounting table so as to be movable up and down and moves toward and away from the depression of the anvil, and one end of the brittle plate material which is provided on the mounting table and placed on the mounting table A positioning means for projecting the side from the end of the mounting table to the side, and positioning a scribe line to be cut of the brittle plate material at a position directly above the tip of the pusher; and one end side of the positioned brittle plate material Separating means for lifting the brittle plate material away from the mounting table by pushing it up at the push-up portion, while the one end side of the brittle plate material is separated from the mounting table by the separating device. Protrusion Is pressed against the scribe line on the upper surface of the brittle plate, and the scribe line is pressed from the lower surface side of the brittle plate by the pusher to cleave the brittle plate along the scribe line. It is characterized by that.

  Further, the present invention is characterized in that the push-up portion of the separating means is the pusher.

  Further, the present invention provides a suction means for sucking a split piece obtained by cleaving the brittle plate material through an intake hole provided in a recess of the anvil, and a split piece sucked and held by the anvil by the suction means. And a moving means for moving the anvil to carry it out.

  According to the method and apparatus for cleaving a brittle plate according to the present invention, after the scribe line of the brittle plate is accurately positioned on the mounting table at a position immediately above the tip of the pusher, the brittle plate is clamped by the anvil and the pusher. Therefore, the pusher can accurately press the formation position of the scribe line from the lower surface side of the brittle plate, and the brittle plate can be cleaved along the scribe line with high dimensional accuracy.

  Moreover, since the one end side of the brittle plate member is sandwiched between the anvil and the pusher while the one end side of the brittle plate member is separated from the mounting table, the one end side of the brittle plate member is scribed between the pair of protrusions of the anvil at the time of cleaving. A space that can be curved and deformed symmetrically about the line can be secured, and bending stress can be applied symmetrically to one end side of the brittle plate material. Therefore, the brittle plate material can be cleaved stably with high dimensional accuracy with respect to cracks and protrusions in the cut section, perpendicularity to the plate surface, and the like.

  Further, if the push-up portion of the separating means is shared with the pusher, the device configuration can be simplified. In addition, since the pusher can push up the position immediately below the scribe line on the lower surface of the brittle plate, the positioning accuracy of the brittle plate can be stably maintained, and the cleaving operation can be performed with higher dimensional accuracy.

  In addition, if the split piece immediately after the cutting is sucked and held by the anvil by the suction means, and the anvil itself is moved by the moving means and then the split piece is carried out, the split piece and the other members are unloaded at the time of unloading as in the prior art. There is no risk of chipping or cracking due to contact. Moreover, since the split piece can be supported by suction on one side of the anvil and the depression, it can be held by suction, for example, a cover glass or the like like the conventional suction tweezers that sucked the central part of the split piece. There is no risk of damaging the central part of the split piece, which is important for ensuring the function.

It is a whole side view of the cleaving apparatus of a brittle board material of this embodiment. It is a top view of the brittle board | plate material of this embodiment, (a) represents the state cut | disconnected by the scribe line 11A of one direction among several grid-form scribe lines, (b) is the scribe line 11B of another direction. It represents the state cleaved by. It is a side view explaining each process of the cleaving method of the brittle board material of this embodiment, (a) represents a positioning process, (b) represents a separation process, (c), (d) is a cleaving process and suction. It represents a process. It is a side view explaining the carrying-out process of the cleaving method of the brittle board material of this embodiment. It is a side view explaining each process of the cleaving method of the brittle board material of other embodiments concerning the present invention.

  As shown in FIG. 1, the brittle plate material cleaving apparatus 10 according to the present embodiment is provided on the upper surface of the mounting table 2 on which the brittle plate material 1 having a plurality of scribe lines 11 formed thereon can be mounted. The anvil 3 and the side of the mounting table 2 are provided so as to be movable up and down. The pusher 4 that presses the brittle plate 1 from above and below in cooperation with the anvil 3 and the mounting table 2 are provided. Positioning means 5 for positioning at a predetermined position, separation means 6 for separating one end side of the positioned brittle plate 1 from the mounting table 2, and a split piece provided on the anvil 3 and obtained by cleaving the brittle plate 1 A suction means 7 for sucking and holding by the anvil 3 and a moving means (not shown) for moving the anvil 3 itself to carry out the split pieces are provided.

  The brittle plate 1 is made of a flat glass plate or ceramic plate. As shown in FIG. 2, a plurality of scribe lines 11 (11A, 11B) are formed in a lattice shape on the upper surface by a known thermal processing laser cutting device in advance. It is formed to a predetermined depth. First, as shown in FIG. 2A, the brittle plate 1 is cut from one end of the scribe line 11A in one direction among the plurality of grid-like scribe lines by the brittle plate cleaving device 10 of the present embodiment. Cleaving sequentially, a plurality of strip-shaped split pieces 12 are formed. After that, as shown in FIG. 2 (b), the obtained strip-shaped split pieces 12 are arranged with the scribe lines 11B in the other directions aligned, and the scribe lines 11B are cleaved again sequentially from one end. A plurality of rectangular split pieces 13 are formed. The brittle plate material cleaving apparatus 10 of the present embodiment can also cleave at the same time in a state where a plurality of strip-shaped pieces 12 are arranged in parallel as the brittle plate material.

  As shown in FIG. 1, the mounting table 2 has a horizontal mounting surface 21 on the top, and the brittle plate 1 is mounted on the mounting surface 21 in a horizontal posture with the scribe line 11 facing upward. The mounting table 2 is provided with a guide mechanism (not shown) that regulates the orientation of the brittle plate 1 so that the scribe line 11 of the mounted brittle plate 1 is parallel to the end 22 of the mounting table 2. Yes.

  The anvil 3 has a substantially long plate shape extending in a direction parallel to the end portion 22 of the mounting table 2 (perpendicular to the plane of FIG. 1), and has a length that is equal to or greater than the full width of the brittle plate 1. A pair of downward projections 31 parallel to each other and a depression 32 between these projections 31 are formed at the lower part of the anvil 3, and the center 33 of the depression 32 is a pusher 4 described below. It is provided above the mounting table 2 so as to be located immediately above the front end portion 41.

  The pusher 4 is provided in the vicinity of the end 22 of the mounting table 2 and has a substantially long plate shape extending in a direction parallel to the end 22 of the mounting table 2 (perpendicular to the plane of FIG. 1). 1 or more than the full width. A tip portion 41 parallel to the end portion 22 of the mounting table 2 is formed on the upper portion of the pusher 4 and is in linear contact with the lower surface of the brittle plate 1 when it is raised. Under the pusher 4, a pressing actuator 42 made of an air cylinder is provided. By operating the pressing actuator 42, the pusher 4 can be linearly moved up and down in the vertical direction. The tip 41 can be moved toward and away from the center 33 of the recess 32 of the anvil 3.

  The positioning means 5 is provided in the upper part of the mounting table 2, and pushes the brittle plate 1 on the mounting table 2 directly, and the pushing unit 51 advances and retreats horizontally along the mounting surface 21 of the mounting table 2. It is comprised from the drive part 52 to move. The drive unit 52 of the present embodiment is composed of a feed screw mechanism that is driven by a control motor (not shown). By operating the control motor, the push-out unit 51 can be moved forward and backward accurately. Thus, the positioning means 5 causes the one end side of the brittle plate 1 to protrude from the end portion 22 of the mounting table 2 to the side, and accurately positions the scribe line 11 to be cut at a position directly above the tip end portion 41 of the pusher 4. can do.

  The separation means 6 includes a push-up portion 61 that directly pushes up the lower surface on one end side of the brittle plate 1 that protrudes from the end portion 22 of the mounting table 2, and a push-up actuator 62 that includes an air cylinder that linearly moves the push-up portion 61 in the vertical direction. It consists of and. In the present embodiment, the push-up portion 61 of the separating means 6 is shared with the pusher 4, and the push-up portion 61 is formed integrally with the pusher 4. Thus, by operating the push-up actuator 62, the pusher 4 can be linearly moved up and down in the vertical direction, and the pusher 4 pushes up the lower surface on one end side of the brittle plate 1 to mount one end side of the brittle plate 1. The mounting surface 2 can be separated from the mounting surface 21.

  Note that the push-up portion 61 of the separating means 6 may be provided separately from the pusher 4 without being shared with the pusher 4. Further, the push-up actuator 62 of the separating means 6 may be shared with the push actuator 42 of the pusher 4. Further, the pressing actuator 42 of the pusher 4 and / or the lifting actuator 62 of the separating means 6 may be constituted by a feed screw mechanism that is operated by a control motor.

  The suction means 7 includes an intake hole 71 opened in the hollow portion 32 of the anvil 3 and an intake pump (not shown) connected to the intake hole 71 via an intake pipe 72. By operating this intake pump, the air in the recess 32 can be sucked through the intake hole 71 and the fragment obtained by cleaving the brittle plate 1 can be sucked and held by the anvil 3.

  Moreover, the anvil 3 is comprised so that it can move to the triaxial direction orthogonal to each other by the moving means not shown. As the moving means, for example, a known linear moving mechanism such as a feed screw mechanism or a rack-pinion mechanism, or a moving mechanism such as a so-called robot arm can be adopted. By operating the moving means, the split piece sucked and held by the anvil 3 can be carried out of the mounting table 2 by moving the anvil 3 itself.

  Hereinafter, the cleaving method of the brittle plate 1 by the brittle plate cleaving apparatus 10 of the present embodiment will be described with reference to FIGS. 3 and 4.

  First, as shown in FIG. 3A, a positioning process is performed in which the brittle plate 1 having the scribe line 11 formed on the upper surface is placed on the mounting table 2 and positioned at a predetermined position on the mounting table 2. That is, by extruding the brittle plate 1 at the pushing portion 51 of the positioning means 5, one end of the brittle plate 1 is protruded laterally from the end 22 of the mounting table 2, and the scribe line 11 to be cut off of the brittle plate 1 is formed. The pusher 4 is positioned at a position directly above the tip 41. In addition, after mounting the brittle board | plate material 1 on the mounting base 2, the scribe line 11 may be formed in the upper surface of the brittle board | plate material 1, and you may make it perform the positioning process of the brittle board | plate material 1 after that.

  Next, as shown in FIG. 3 (b), a separation step of pushing up one end side of the positioned brittle plate 1 and separating it from the mounting table 2 is performed. That is, by operating the push-up actuator 62 of the separating means 6 and pushing up the scribe line 11 of the brittle plate 1 from the lower surface side at the tip 41 of the pusher 4, one end side of the brittle plate 1 is placed on the placement surface of the placement table 2. 21. Thus, a gap C is formed between the lower surface of the brittle plate 1 and the mounting surface 21 of the mounting table 2 immediately below the protruding portion 31 on the positioning means 5 side of the pair of protruding portions 31 of the anvil 3. .

  The gap C can be appropriately set according to the material and dimensions of the brittle plate 1, the depth of the scribe line 11, and the like. For example, when the brittle plate 1 made of a glass material having a length of 200 mm, a width of 300 mm, and a thickness of 0.5 mm, in which a large number of scribe lines 11 are formed in a lattice shape with an interval of 2.5 mm, is about 0. Leave a gap C of 2 mm. The gap C is preferably 0.01 to 0.5 mm when obtaining several millimeter square pieces, and 0.5 to 3.0 mm is preferred when obtaining several tens of square pieces. If the gap C is smaller than 0.01 mm, a gap necessary for cleaving cannot be secured, and the brittle plate 1 cannot be cleaved with high accuracy. On the other hand, if the gap C exceeds 3.0 mm, positioning is performed. The brittle plate 1 may be displaced.

  Next, as shown in FIGS. 3 (c) and 3 (d), the one end side of the brittle plate 1 is clamped from above and below by the anvil 3 and the pusher 4 while the one end of the brittle plate 1 is separated from the mounting table 2. Then, a cleaving process for cleaving the brittle plate 1 is performed. In this embodiment, first, as shown in FIG. 3C, a pair of anvils 3 is lowered by lowering the anvil 3 in the vertical direction while supporting one end of the brittle plate 1 from the lower surface side with the pusher 4. The protrusions 31 and 31 are brought into contact with the symmetric positions with respect to the scribe line 11 on the upper surface of the brittle plate member 1 and then the pressing actuator 42 is operated as shown in FIG. 11 is pressed from the lower surface side of the brittle plate 1, and the brittle plate 1 is cleaved along the scribe line 11. In this way, a split piece 12 having a predetermined size is obtained from the brittle plate 1.

  Next, a holding step of sucking and holding the split piece 12 obtained by the cutting step with the anvil 3 is performed. That is, as shown in FIG. 3 (d), the split piece 12 is sucked through the suction hole 71 of the suction means 7 and held by the anvil 3 immediately after the cutting. In the present embodiment, as shown in FIG. 3C, intake from the suction hole 71 is started from the stage of the cleaving process in which the pair of protrusions 31 of the anvil 3 are brought into contact with the upper surface of the brittle plate 1. In this way, it is possible to reliably suck and hold the split piece 12 immediately after splitting with the anvil 3.

  Next, as shown in FIG. 4, an unloading process is performed in which the split piece 12 held by the anvil 3 is moved to the next process by moving the anvil 3 itself. In this embodiment, first, as shown in FIG. 4 (a), the anvil 3 is raised in the vertical direction by a moving means (not shown) while the split piece 12 is sucked by the suction means 7, and then FIG. ), The split piece 12 is unloaded from the mounting table 2 by moving the anvil 3 to the side.

  Then, the anvil 3 stops intake by the intake hole 71 at the carry-out destination, or blows off from the intake hole 71 to release the split piece 12, and then returns to the standby position shown in FIG. To do. Further, during this unloading process, the pusher 4 is lowered by the operation of the pressing actuator 42 and the lifting actuator 62 and returned to the standby position, as shown in FIG. 4A, while shown in FIG. 4B. As described above, the pushing portion 51 of the positioning means 5 pushes the brittle plate 1 again by a set distance, thereby positioning the scribe line 11 to be next cut at a position immediately above the tip portion 41 of the pusher 4. In this way, the cleaving operation on the next scribe line 11 of the brittle plate 1 is performed.

  According to the cleaving apparatus 10 for a brittle plate material of the present embodiment, a split piece made of a glass material with dimensions of 2.5 ± 0.05 mm on one side × 2.5 ± 0.05 mm on the other side × 0.5 mm on the side It was possible to achieve high dimensional accuracy with the squareness of the cross section within 90 ± 3 °, the protrusion dimension within 20 μm, the chipping dimension within 200 μm width, and the length within 300 μm.

  As described above, according to the cleaving apparatus 10 and the cleaving method for the brittle plate material of the present embodiment, the positioning means 5 accurately positions the scribe line 11 of the brittle plate material 1 on the mounting table 2 at a position immediately above the tip 41 of the pusher 4. After that, since the brittle plate 1 is sandwiched between the anvil 3 and the pusher 4, the pusher 4 can accurately press the formation position of the scribe line 11 from the lower surface side of the brittle plate 1. Can be cleaved with high dimensional accuracy.

  Moreover, since the one end side of the brittle plate 1 is clamped by the anvil 3 and the pusher 4 while the one end side of the brittle plate 1 is separated from the mounting table 2 by the separating means 6, as shown in FIG. 3 (c). During the cleaving, a space in which one end side of the brittle plate 1 can be curved and deformed symmetrically with respect to the scribe line 11 between the pair of protrusions 31 of the anvil 3 can be secured, and bending stress is applied to one end of the brittle plate 1. It can act symmetrically. Therefore, the brittle plate 1 can be cleaved stably with high dimensional accuracy with respect to the cracks and protrusions of the cut section, the perpendicularity to the plate surface, and the like.

  If one end side of the brittle plate 1 is sandwiched between the anvil 3 and the pusher 4 without separating one end of the brittle plate 1 from the mounting table 2, one end of the brittle plate 1 is positioned on the anvil 3 during cleaving. The other side of the brittle plate material 1 interferes with the placement surface 21 of the mounting table 2, and the bending stress is symmetrical with respect to the brittle plate material 1. Therefore, a predetermined squareness or the like cannot be realized in the split section.

  Further, according to the brittle plate material cleaving device 10 and the cleaving method of the present embodiment, the push-up portion 61 of the separating means 6 is shared with the pusher 4, so that the device configuration can be simplified. Further, since the pusher 4 can push up the position immediately below the scribe line 11 on the lower surface of the brittle plate 1, the positioning accuracy of the brittle plate 1 can be stably maintained, and the cleaving operation can be performed with higher dimensional accuracy. it can.

  Further, according to the brittle plate material cleaving apparatus 10 and the cleaving method of the present embodiment, the abutment piece 12 immediately after cleaving is sucked and held by the anvil 3 by the suction means 7, and the anvil 3 itself is moved by the moving means to be cleaved. Since the fragments 12 are carried out, there is no possibility that the broken pieces 12 will come into contact with other members at the time of carrying out, causing cracks, cracks, etc., as in the prior art. Moreover, as shown in FIG. 4 (a), the split piece 12 can be supported and sucked by the tip of the projection 31 on one side of the anvil 3 and the bottom surface of the recess 32, so that the central part of the split piece There is no risk of damaging the central portion of the split piece 12 that is important for ensuring the function of, for example, a cover glass or the like, unlike the conventional suction tweezers that sucked the water.

  As mentioned above, although the cleaving apparatus and cleaving method of the brittle board | plate material of this embodiment were demonstrated, this invention can be implemented also in other embodiment.

  For example, in the above embodiment, in the cleaving step, as shown in FIG. 3C, after the anvil 3 is lowered and the pair of protrusions 31 and 31 are brought into contact with the upper surface of the brittle plate 1, FIG. As shown in d), the pusher 4 is raised to press the lower surface of the brittle plate 1, but the present invention is not limited to this, and as shown in FIG. After separating one end side from the mounting table 2, as shown in FIG. 5B, the anvil 3 is lowered so that only one protrusion 31 is brought into contact with the upper surface of the brittle plate 1, and then FIG. As shown in c) and (d), the pusher 4 may be raised to press the lower surface of the brittle plate 1 to break the brittle plate 1.

  In addition, the anvil 3 is made to stand by with respect to the mounting table 2 in advance, for example, at the position shown in FIG. 5B, and the brittle plate 1 is separated only by the raising operation of the pusher 4 without moving the anvil 3 downward. You may make it perform a process and a cleaving process. About relative clamping operation by the anvil 3 and the pusher 4, various design changes are possible according to the material of the brittle board | plate material 1 which should be cut, a dimension, the depth of the scribe line 11, etc. FIG.

  In addition, the present invention can be carried out in a mode in which various improvements, modifications and variations are added based on the knowledge of those skilled in the art without departing from the spirit of the present invention. It may be implemented in a form in which any invention specific matter is replaced with another technology within a range where the same action or effect occurs, or the invention specific matter configured integrally may be constituted by a plurality of members. In addition, the invention specific items constituted by a plurality of members may be implemented in an integrated configuration.

DESCRIPTION OF SYMBOLS 10 Fragile board | plate material cutting apparatus 1 Brittle board | plate material 11 Scribe wire 12 Split piece 2 Mounting stand 3 Anvil 31 Protrusion part 32 Indentation part 4 Pusher 41 Tip part 5 Positioning means 6 Separation means 61 Push-up part 7 Suction means 71 Intake hole C With brittle board material Gap between the mounting table

Claims (4)

A brittle plate having a scribe line formed on the upper surface is vertically moved by an anvil having a pair of downward projections and a depression between the projections, and an upward pusher that moves toward and away from the depression of the anvil. A method of cleaving the brittle plate material by crushing the brittle plate material along the scribe line,
One end side of the brittle plate placed on the mounting table with the scribe line facing upward is protruded laterally from the end of the mounting table, and the scribe line to be cleaved of the brittle plate is connected to the mounting table. A positioning step for positioning at a position directly above the tip of the pusher provided so as to be vertically movable laterally;
A separating step of pushing up one end side of the positioned brittle plate material and separating the one end side of the brittle plate material from the mounting table;
While the one end side of the brittle plate material is separated from the mounting table, the pusher pushes the scribe line with the pair of protrusions of the anvil in contact with the symmetric position with respect to the scribe line on the upper surface of the brittle plate material. A cleaving step of cleaving the brittle plate along the scribe line by pressing from the lower surface side of the brittle plate;
A holding step of sucking and holding the split piece obtained by cleaving the brittle plate material in the cleaving step with the anvil through an air intake hole provided in a hollow portion of the anvil;
An unloading step of unloading the split piece sucked and held by the anvil by moving the anvil;
A method for cleaving a brittle plate, comprising: In the separation step,
2. The method of cleaving a brittle plate according to claim 1, wherein the pusher pushes up the scribe line of the brittle plate from the lower surface side to separate one end of the brittle plate from the mounting table. A brittle plate cleaving device for cleaving along a scribe line a brittle plate having a scribe line formed on the upper surface,
A mounting table capable of mounting the brittle plate material with the scribe line facing upward;
An anvil which is provided above the mounting table and has a pair of downward projections and a depression between the projections;
An upward pusher which is provided on the side of the mounting table so as to be movable up and down, and moves closer to and away from the depression of the anvil;
One end side of the brittle plate material provided on the mounting table and projecting from the end of the mounting table to the side is provided on the mounting table, and a scribe line to be cleaved of the brittle plate material is provided at the tip of the pusher. Positioning means for positioning at a position directly above the part;
Separating means for pushing up one end side of the positioned brittle plate material with a push-up portion to separate one end side of the brittle plate material from the mounting table,
A suction means for sucking the brittle plate material through an intake hole provided in a hollow portion of the anvil;
Moving means for moving the anvil;
With
While the one end side of the brittle plate member is separated from the mounting table by the separating means, the pair of protrusions of the anvil are brought into contact with a symmetric position with respect to the scribe line on the upper surface of the brittle plate member. Cleaving the brittle plate along the scribe line by pressing the scribe line from the lower surface side of the brittle plate,
An apparatus for cleaving a brittle plate material, in which a split piece obtained by cleaving the brittle plate material is sucked and held by the anvil with the anvil, and the anvil is moved by the moving means and carried out .   The brittle plate material cleaving apparatus according to claim 3, wherein the push-up portion of the separation means is the pusher.

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