TW200618868A - Stage for mounting substrate and method for attracting and separating substrate - Google Patents

Stage for mounting substrate and method for attracting and separating substrate

Info

Publication number
TW200618868A
TW200618868A TW094129776A TW94129776A TW200618868A TW 200618868 A TW200618868 A TW 200618868A TW 094129776 A TW094129776 A TW 094129776A TW 94129776 A TW94129776 A TW 94129776A TW 200618868 A TW200618868 A TW 200618868A
Authority
TW
Taiwan
Prior art keywords
stage
substrate
suction
pipe
jetting
Prior art date
Application number
TW094129776A
Other languages
Chinese (zh)
Other versions
TWI404574B (en
Inventor
Atsuo Kajima
Kazunobu Yamaguchi
Shinji Takase
Tsuneo Tanimoto
Takashi Kiyama
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Tazmo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Tazmo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200618868A publication Critical patent/TW200618868A/en
Application granted granted Critical
Publication of TWI404574B publication Critical patent/TWI404574B/en

Links

Abstract

To provide a substrate-mounting stage permitting horizontal fixing of e.g. a glass substrate without intervening air and easy detachment of substrates. The stage 1 is divided into two or more concentric areas 1a, 1b, 1c, 1d and 1e, from the planar standpoint, and the density of suction and jetting holes 2 formed in the most central area 1a is made to be higher than those of the holes formed in the outer areas 1b to 1e. A suction and jetting nozzle 4 is inserted into each hole 2 and connected to a pipe on the back side of the stage 1. Each pipe is connected selectively to a vacuum pump or an air line through a switching valve not shown here. A pipe is arranged in each area so that suction and jetting can be controlled in each area.
TW094129776A 2004-08-31 2005-08-30 Stage for mounting substrate and method for attracting and separating substrate TWI404574B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252361A JP4443353B2 (en) 2004-08-31 2004-08-31 Substrate mounting stage and substrate adsorption / separation method

Publications (2)

Publication Number Publication Date
TW200618868A true TW200618868A (en) 2006-06-16
TWI404574B TWI404574B (en) 2013-08-11

Family

ID=36149751

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129776A TWI404574B (en) 2004-08-31 2005-08-30 Stage for mounting substrate and method for attracting and separating substrate

Country Status (4)

Country Link
JP (1) JP4443353B2 (en)
KR (1) KR101488933B1 (en)
CN (1) CN100553797C (en)
TW (1) TWI404574B (en)

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TWI679714B (en) * 2014-10-29 2019-12-11 日商Ａｇｃ股份有限公司 Substrate adsorption device, substrate bonding device and bonding method, and manufacturing method of electronic device

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KR100832802B1 (en) * 2006-11-27 2008-05-27 세메스 주식회사 Substrate processing apparatus and method for driving lift pin of the same
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JP4801644B2 (en) * 2007-08-30 2011-10-26 東京応化工業株式会社 Substrate holding device, substrate processing apparatus, and substrate processing method
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KR101315497B1 (en) * 2011-12-27 2013-10-07 주식회사 나래나노텍 Improved Device and Method of Separating Substrate, and Coating Apparatus Having the Same
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KR101821636B1 (en) * 2013-08-28 2018-03-08 에이피시스템 주식회사 apparatus for holding substrate
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JP2015171764A (en) * 2014-03-11 2015-10-01 セムコ株式会社 Engraving medium fixing structure
CN105277868B (en) * 2014-07-11 2018-06-26 致茂电子(苏州)有限公司 test device
CN105628068A (en) * 2014-10-30 2016-06-01 宁波舜宇光电信息有限公司 Fixture preventing measurement deviation and manufacturing method thereof
KR101854880B1 (en) * 2016-06-28 2018-05-04 주식회사 휴템 Silicon substrate direct bonding method and apparatus system thereof, silicon substrate direct bonding apparatus align parts verification method
US10374161B2 (en) 2017-08-16 2019-08-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Glass substrate separation method and glass substrate separation device
CN107686007B (en) * 2017-08-16 2019-08-20 武汉华星光电半导体显示技术有限公司 Glass substrate separation method and glass substrate separator
JP7210896B2 (en) * 2018-04-23 2023-01-24 東京エレクトロン株式会社 SUBSTRATE PLACEMENT DEVICE AND SUBSTRATE PLACEMENT METHOD
JP7161185B2 (en) * 2018-10-23 2022-10-26 株式会社平安コーポレーション Suction table of wood processing machine
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JP2991110B2 (en) * 1996-05-01 1999-12-20 日本電気株式会社 Substrate suction holding device
JP2002134597A (en) * 2000-10-27 2002-05-10 Ushio Inc Stage apparatus
JP2003188246A (en) * 2001-12-18 2003-07-04 Nikon Corp Method and apparatus for sucking substrate
TW593087B (en) * 2003-05-30 2004-06-21 Au Optronics Corp Turnover carrier platform

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465713B (en) * 2007-05-23 2014-12-21 Lasertec Corp Substrate holding apparatus
TWI458565B (en) * 2007-11-08 2014-11-01 Toray Eng Co Ltd Coating machine and coating method
TWI458564B (en) * 2007-11-21 2014-11-01 Toray Eng Co Ltd Coating machine and fixing method of a substrate
TWI679714B (en) * 2014-10-29 2019-12-11 日商Ａｇｃ股份有限公司 Substrate adsorption device, substrate bonding device and bonding method, and manufacturing method of electronic device

Also Published As

Publication number Publication date
CN1754629A (en) 2006-04-05
JP2006068592A (en) 2006-03-16
TWI404574B (en) 2013-08-11
KR101488933B1 (en) 2015-02-03
JP4443353B2 (en) 2010-03-31
KR20060050860A (en) 2006-05-19
CN100553797C (en) 2009-10-28

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