TWI458565B - Coating machine and coating method - Google Patents

Description

Coating device and coating method

The present invention relates to a coating machine and a coating method for applying a coating liquid onto a substrate.

In a flat panel display such as a liquid crystal display or a plasma display, a photoresist is applied to a glass substrate (referred to as a coating). Cloth substrate). The coated substrate is formed by a coating device that uniformly coats the photoresist.

The coating device has a stage on which a substrate is carried, a coating unit that discharges a photoresist, and the coating unit is moved while discharging the photoresist from the coating unit. A photoresist film having a uniform thickness is formed on the substrate.

Specifically, as described in Patent Document 1 below, when a substrate is supplied to the stage, the substrate is adsorbed and held on the stage by causing a negative pressure to be generated in the adsorption hole on the stage. At this time, in order to prevent the air layer from being interposed between the substrate and the stage by the air bubbles, the central portion of the substrate is carried by the central portion of the substrate while the substrate is being bent. Further, after the substrate is adsorbed on the stage, the resist liquid is discharged by the movement of the coating unit, and a coating film is formed on the substrate.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-281091

However, in the coating apparatus described in Patent Document 1, the coating unit moves after the entire substrate is adsorbed and fixed on the stage, so that the cycle time of the coating device becomes long. In other words, it is difficult to finely adjust the positioning substrate due to the increase in the size of the substrate. Therefore, it takes time to carry and fix the entire large-sized substrate on the platform for accuracy, and the cycle time of the entire coating device is long-term. tendency.

The present invention has been made in view of the above problems, and an object of the invention is to provide a coating apparatus and a coating method capable of suppressing the entire coating apparatus even when the stage of the substrate fixed to the coating apparatus takes time. The cycle time is long-term.

In order to solve the above problems, the coating apparatus of the present invention includes: a stage on which a substrate is supported; and a coating liquid is formed by relatively moving a substrate supported on a surface of the stage, and a coating film is formed on the substrate. The coating unit is characterized in that a substrate adsorption means for arranging an adsorption holding substrate on the stage, the substrate adsorption means having an initial adsorption portion for adsorbing an initial film formation region of a substrate on which an initial film at the start of coating is formed And a main adsorption portion that adsorbs a coating film formation region other than the initial film formation region, and after the adsorption of the surface of the substrate corresponding to the initial adsorption portion is completed, the adsorption operation of the main adsorption portion is completed, and the coating is performed. The formation of the film at the beginning of the unit begins.

According to the coating apparatus described above, since the substrate adsorption means for adsorbing the substrate has the initial adsorption portion and the main adsorption portion, the adsorption portion is adsorbed by the initial adsorption portion. After a part of the substrate, the coating unit can be moved and the coating of the substrate portion corresponding to the initial adsorption portion can be started. In other words, since the coating unit can be immediately moved to the substrate portion corresponding to the initial adsorption portion after the adsorption of the substrate is started, the coating operation can be started after the entire substrate is adsorbed and fixed as compared with the prior art. The cycle time of the entire coating apparatus is shortened.

Further, in the initial stage adsorption unit and the main adsorption unit of the substrate adsorption means, a suction hole formed on a surface of the stage is formed, and the substrate adsorption means includes suction to attract the suction hole. And a switching means for selectively generating an attractive force from the suction means in the initial adsorption portion and the main adsorption portion.

According to this configuration, the suction force is generated only in the initial adsorption portion by the operation switching means, and a part of the substrate is adsorbed to the initial adsorption portion, and the suction force is generated in the main adsorption portion to adsorb and fix the entire substrate. Therefore, it is not necessary to arrange the suction means in each of the initial adsorption portion and the main adsorption portion.

Further, in the initial adsorption unit and the main adsorption unit of the substrate adsorption means, a suction hole formed on the surface of the stage is formed, and the substrate adsorption means causes the suction force to be generated in the initial adsorption unit. The suction means of the suction port and the suction means for causing the suction force to be generated in the suction port of the main adsorption portion are independently disposed in the initial adsorption portion and the main adsorption portion.

According to this configuration, the initial adsorption portion and the main adsorption portion of the substrate adsorption means can be independently produced with an appropriate timing. Health.

Further, the initial adsorption unit and the main adsorption unit may be formed with an adsorption groove for adsorbing the substrate on the surface of the stage, and the adsorption groove is formed by being connected to the suction hole and formed on the surface of the stage. The adsorption groove of the initial adsorption portion and the adsorption groove of the main adsorption portion are independently formed by the partition portions that are prevented from being connected to each other.

According to this configuration, when the suction force is generated in the suction hole, the suction force is also generated in the adsorption groove that communicates with the suction hole, so that the entire substrate portion facing the adsorption groove is attracted to the adsorption groove side. Moreover, even in the case where the bubble is interposed between the substrate and the stage, the bubble can be attracted by the adsorption groove, and the problem that the bubble remains between the substrate and the stage can be avoided. Further, the adsorption groove of the initial adsorption portion and the adsorption groove of the main adsorption portion are formed separately, and when the suction force is generated in the initial adsorption portion, the attraction force can be prevented from acting on the substrate portion adsorbed to the main adsorption portion.

Further, the initial adsorption unit and the main adsorption unit of the substrate adsorption means may include pin members for holding the substrate, and the pin members are respectively housed in the stage and may be protruded from the surface of the stage. The pin member of the initial adsorption portion is housed in the platform before the pin member of the main adsorption portion.

According to this configuration, when the substrate is placed on the stage, a part of the substrate can be initially carried on the initial adsorption portion. Thereby, the adsorption of the substrate in the initial adsorption portion can be started earlier than the adsorption of the substrate in the main adsorption portion. Further, the substrate is carried by the initial adsorption portion, and then the main adsorption portion is carried, and the air layer existing between the substrate and the initial adsorption portion is dissipated to the main adsorption portion side. according to Thereby, it is possible to suppress the air layer from being present between the substrate and the stage (initial adsorption portion) by bubbles.

Further, the pin member of the main adsorption unit may be sequentially housed in the stage by the initial adsorption unit side.

According to this configuration, since the substrate portion carried by the main adsorption portion is unidirectionally loaded from the initial adsorption portion side toward the main adsorption portion side, the air layer existing between the substrate and the stage sequentially escapes to the unloaded side. According to this, it is possible to suppress the air layer from being present between the substrate and the stage with bubbles.

Further, in order to solve the above problems, the coating method of the present invention is a coating method of a coating apparatus having a process of: carrying a substrate carrying process on a surface of a stage; and discharging on a substrate carried on the stage The initial film formation process of the initial film is formed in a state in which the coating unit of the coating liquid is stopped; and the coating liquid is discharged by the coating unit after the formation of the initial film, and the coating is applied to the substrate. The unit is moved to form a coating film forming process of the coating film on the substrate, wherein the substrate carrying process has an adsorption process of adsorbing the substrate on the surface of the platform, and the adsorption process comprises: adsorbing the substrate on which the initial film is formed. An initial adsorption process of the initial film formation region; and a main adsorption process for adsorbing a coating film formation region of the substrate other than the initial film formation region, and the initial film is started before the main adsorption process is completed after the initial adsorption process is completed Form the process.

According to this configuration, since the coating film forming process by the coating unit is started before the main adsorption process is completed after the initial adsorption process is completed, the coating film formation process is completed after the substrate carrier process is completed as in the related art. The coating method that is only started can be shortened by the cycle time in the entire coating apparatus.

According to the coating apparatus and the coating method of the present invention, even if the stage of the substrate fixed to the coating apparatus takes time, the cycle time of the entire coating apparatus can be suppressed from becoming long.

The form of the embodiment related to the present invention will be described using the drawings.

Fig. 1 is a plan view schematically showing a coating apparatus according to an embodiment of the present invention. Fig. 2 is a side view thereof, and Fig. 3 is a view showing a state in which a part of the substrate is carried by the coating device.

As shown in FIG. 1 to FIG. 3, the coating device is formed by forming a coating film of a liquid material (hereinafter referred to as a coating liquid) such as a chemical liquid or a photoresist liquid on the substrate 10, and includes a base 2; The substrate 21 carrying the substrate 10; and the coating unit 30 configured to move the platform 21 in a specific direction (left-right direction in FIG. 1).

In the following description, the direction in which the coating unit 30 moves is the X-axis direction, the direction orthogonal to the X-axis direction on the horizontal plane is the Y-axis direction, and the two directions orthogonal to the X-axis and the Y-axis direction. The direction is described in the Z-axis direction.

A platform 21 is disposed in the center portion of the base 2 described above. The platform 21 carries and holds the substrate 10 carried therein on its surface. Further, a substrate adsorption means 40 is disposed on the platform 21, and the base adsorption means 40 can be used to provide a base. The plate 10 is adsorbed and held on the surface of the stage 21. Specifically, the platform 21 is formed with a plurality of suction holes 41a and 42a (see FIG. 4) opened on the surface thereof, and the suction holes 41a and 42a and the vacuum pump 81 (vacuum pumps 81a and 81b) are connected via pipes. 84 connections. In addition, when the vacuum pump 81 is operated in a state where the substrate 10 is carried on the surface of the stage 21, an attraction force is generated in the suction holes 41a and 42a, and the substrate 10 is attracted to the surface side of the stage 21 to be adsorbed and held. In the present embodiment, as shown in FIG. 3, the initial adsorption unit 41 to be described later is connected to the vacuum pump 81a, and the main adsorption unit 42 to be described later is connected to the vacuum pump 81b, and the initial adsorption unit 41 and the main adsorption unit 42 are separately provided. Vacuum pump 81 (vacuum pumps 81a, 81b).

Further, as shown in FIG. 4, the substrate adsorption means 40 is constituted by the initial adsorption unit 41 and the main adsorption unit 42. Here, FIG. 4 is a view showing the stage 21, FIG. 4(a) is an overall perspective view of the stage 21, and FIG. 4(b) is an enlarged view of a surface portion thereof. In the initial adsorption unit 41, an initial film is formed on the substrate 10 at the start of application by the coating unit 30, and a surface portion of the substrate 10 on which the initial film is formed (the initial film formation region 11 shown in FIG. 3) ) adsorbed on the platform 21 . In addition, since the initial film formed by the coating unit 30 has a linear shape, the initial film formation region 11 may have a linear shape in which an initial film is formed, but may be a predetermined region including the linear shape. In other words, the region having a degree that the initial film can be stably formed without causing coating unevenness may be used. In the present embodiment, a certain region including the linear shape may be displayed.

In the initial adsorption unit 41, as shown in Fig. 4(b), the suction hole 41a and the adsorption groove 41b are formed, and the suction pump 41a is operated to cause the suction force to be attracted. The hole 41a and the adsorption groove 41b. Specifically, the adsorption groove 41b is formed in a lattice shape on the surface of the stage 21, and is connected to the suction hole 41a. When the substrate 10 (initial film formation region 11) is carried by the initial adsorption unit 41, the suction hole 41a and the adsorption groove 41b are covered by the substrate 10. By operating the vacuum pump 81a in this state, the suction force acts on the suction hole 41a and the adsorption groove 41b, and the initial film formation region 11 of the substrate 10 is adsorbed to the initial adsorption portion 41. Further, even when air bubbles are present between the initial film formation region 11 of the substrate 10 and the initial adsorption portion 41 of the stage 21, the bubbles can be attracted to the adsorption grooves 41b formed over the entire initial adsorption portion 41. The air bubbles are prevented from remaining between the initial film formation region 11 of the substrate 10 and the initial adsorption portion 41 of the stage 21. Accordingly, it is not required to be carried by the central portion of the substrate 10 in order to avoid the intervening of bubbles, and may be carried by the initial film formation region 11 of the end portion of the substrate 10.

Further, the main adsorption unit 42 adsorbs the surface (the coating film formation region 12 shown in FIG. 3) of the substrate 10 except for the portion where the initial film is formed, on the stage 21. The main adsorption unit 42 has the same configuration as that of the initial adsorption unit 41, and has a suction hole 42a and a suction groove 42b that forms a lattice shape and communicates with the suction hole 42a. Moreover, the coating film formation region 12 of the substrate 10 is adsorbed to the main adsorption portion 42 by operating the vacuum pump 81b. Further, even in the case where air bubbles are present between the coating film forming region 12 of the substrate 10 and the main adsorption portion 42 of the stage 21, the bubbles can be attracted to the adsorption grooves 42b, thereby preventing the bubbles from remaining on the substrate 10. The film formation region 12 is between the main adsorption portion 42 of the stage 21.

Further, as shown in FIG. 4(b), the adsorption groove 41b of the initial adsorption portion 41 is formed. A compartment portion 43 is formed between the adsorption groove 42b of the main adsorption portion 42, and the adsorption groove 41b and the adsorption groove 42b are not connected to each other but are formed separately. According to this, even when the vacuum pump 81a (vacuum pump 81b) on the side of the initial adsorption unit 41 (or the main adsorption unit 42 side) is operated, the adsorption groove 41b of the main adsorption unit 42 (or the initial adsorption unit 41 side) is not formed. 42b is attractive.

Further, a substrate elevating mechanism for elevating and lowering the substrate 10 is disposed on the stage 21. Specifically, a plurality of pin holes are formed in the initial adsorption portion 41 and the main adsorption portion 42 on the surface of the stage 21, and an ejector pin capable of lifting and lowering in the Z-axis direction is embedded in the pin hole ( Lift pin 51 (pin member of the present invention). That is, when the substrate 10 is carried in a state where the ejector pin 51 is protruded from the surface of the stage 21, the tip end portion of the ejector pin 51 abuts against the substrate 10 and can hold the substrate 10, so that the ejector pin 51 is pushed out. The substrate 10 is placed on the surface of the stage 21 (the initial adsorption unit 41 and the main adsorption unit 42) by being lowered and accommodated in the pin hole (see FIG. 3).

Further, by raising the ejector pin 51 in a state where the substrate 10 is carried on the surface of the stage 21, the tip end portion of the ejector pin 51 abuts against the substrate 10, and the substrate 10 can be held at the tip end portion of the plurality of ejector pins 51. The predetermined height position. According to this, it is possible to suppress the contact portion with the substrate 10 as much as possible, and it is possible to smoothly replace the substrate 10 without damaging the substrate 10.

Here, in the case of the carrier substrate 10, the timing at which the ejector pin 51 in the initial adsorption portion 41 is earlier than the ejector pin 51 in the main adsorption portion 42 is accommodated in the pin hole, and is held by the ejector pin 51. The substrate 10 is first carried by the initial adsorption unit 41 and then carried by the main adsorption unit 42. Accordingly, the air layer existing between the substrate 10 and the initial adsorption portion 41 is dissipated to the main adsorption portion 42. On the side, it is possible to suppress the air layer from interposing between the substrate 10 and the initial adsorption portion 41 with bubbles.

In addition, the ejector pin 51 in the main adsorption unit 42 is also accommodated in the pin hole from the initial adsorption unit 41 side toward the initial adsorption unit 41 side (see FIG. 3). According to this, the coating film formation region 12 of the substrate 10 is unidirectionally carried by the initial adsorption portion 41 side toward the unloaded side (the right side in FIG. 3). Therefore, by sequentially dissipating the air layer existing between the substrate 10 and the stage 21 to the unloaded side, it is possible to suppress the air layer from being present between the substrate 10 and the stage 21 as bubbles.

Further, a positioning mechanism (not shown) of the substrate 10 is disposed on the stage 21, and the substrate 10 carried by the initial adsorption unit 41 can be positioned. In other words, when the substrate 10 held by the ejector pin 51 is placed on the initial adsorption portion 41 of the substrate 10 (the initial film formation region 11), the portion is positioned by the positioning mechanism. In the state in which the initial film formation region 11 of the substrate 10 is positioned by the initial adsorption portion 41, the vacuum pump 81a is operated to adsorb and hold the initial film formation region 11 to the initial adsorption portion 41. Then, the substrate 10 is adsorbed and held by the main adsorption unit 42 by operating the vacuum pump 81b. According to this, the entire substrate 10 can be adsorbed and held on the stage 21 with high precision.

Further, the coating unit 30 is coated with a coating liquid on the substrate 10. As shown in FIG. 5, the coating unit 30 has a leg portion 31 coupled to the base 2 and a slit nozzle portion 34 extending in the Y-axis direction, across the base 2 in the Y-axis direction. The state can be moved in the X-axis direction and installed. Specifically, rails 22 extending in the X-axis direction are respectively provided at both end portions of the base 2 in the Y-axis direction, and the leg portions 31 are slidably attached to the rails 22. Further, a linear motor 33 is attached to the leg portion 31, and the coating unit 30 is moved to the X-axis side by driving the linear motor 33. The direction can be stopped at any position.

Specifically, the coating unit 30 is stopped at the position of the detachment platform 21 in the initial state, that is, the evacuation position (position A in FIG. 9). Further, when the coating operation is started, the initial film formation position (position C in FIG. 9) in which the initial film is formed is moved to stop at this position.

A slit nozzle portion 34 to which a coating liquid is applied is attached to the leg portion 31 of the coating unit 30. Specifically, the leg portion 31 is provided with a rail 37 extending in the Z-axis direction and a slider 35 sliding along the rail 37, and the slider 35 and the slit nozzle portion 34 are connected. . Further, a ball screw mechanism driven by a servo motor 36 (refer to FIG. 6) is attached to the slider 35, and the servo motor 36 is driven to move the slider 35 in the Z-axis direction, and can be arbitrarily The position stops. That is, the slit nozzle portion 34 is supported by attaching and detaching the substrate 10 held by the stage 21.

The slit nozzle portion 34 is a coating liquid applied to form a coating film on the substrate 10. The slit nozzle portion 34 is a columnar member having a shape extending in a unidirectional direction, and is disposed substantially perpendicular to the running direction of the coating unit 30. In the slit nozzle portion 34, a slit nozzle 34a extending in the longitudinal direction is formed, and the coating liquid supplied to the slit nozzle portion 34 is discharged by the slit nozzle 34a in the same length direction. Therefore, the coating unit 30 is moved in the X-axis direction while the coating liquid is discharged by the slit nozzle 34a, and a coating film having a certain thickness is formed on the substrate 10 in the longitudinal direction of the slit nozzle 34a. .

Further, a height position detecting sensor 32 is attached to the leg portion 31 (refer to figure 2). The height position detecting sensor 32 measures the height position of the substrate 10 in the Z-axis direction. Specifically, the laser light is output downward in the Z direction, and the laser light reflected by the substrate 10 is received, whereby the Z-direction distance to the substrate 10 can be measured. Further, the height position of the substrate 10 can be calculated from the relationship between the measurement distance to the substrate 10 and the height position of the slit nozzle 34a of the slit nozzle portion 34. Thereby, the coating operation can be performed by making the distance between the substrate 10 and the slit nozzle 34a of the slit nozzle portion 34 constant.

Further, a foreign matter detecting sensor 39 is attached to the leg portion 31 at a height position at which the substrate 10 is held. The foreign matter detecting sensor 39 is for detecting whether or not foreign matter is present on the substrate 10. Specifically, the foreign matter sensor is a light-emitting portion that emits laser light by the leg portion 31 on one side in the Y-axis direction, and a light-receiving portion that receives laser light from the light-emitting portion on the leg portion 31 on the other side in the Y-axis direction. The configuration is mounted at a position slightly higher than the surface of the substrate 10. Then, if foreign matter is present on the substrate 10, the foreign matter can be detected by being shielded by the laser light received by the light receiving unit. According to this, it is possible to prevent the slit nozzle 34a or the substrate 10 from being damaged by biting foreign matter between the slit nozzle 34a and the substrate 10.

Next, the configuration of the control system of the above coating apparatus will be described using a block diagram shown in FIG. 6.

Figure 6 is a block diagram showing a control system of the control device 90 disposed in the coating device. As shown in Fig. 6, the coating device is provided with a control device 90 for controlling the driving of the various units described above. The control device 90 includes a control main unit 91, a drive control unit 92, an input/output device control unit 93, and an external device control unit 94.

The control main unit 91 includes a well-known CPU that performs logical operations; A ROM (Read-Only Memory) that stores various programs such as the CPU, and a RAM (Random Access Memory) that memorizes various data at a time during device operation; It is a HDD (Hard Disk) that stores various programs such as a program or an OS (Operating System) and memorizes production programs. Further, the control main unit 91 includes a main control unit 91a, an arithmetic determination unit 91b, and a storage unit 91c.

The main control unit 91a is a drive device that drives and controls the servo motor 36, the linear motor 33, and the like of each unit through the drive control unit 92 in order to execute a series of coating operations in accordance with a program stored in advance.

The calculation determination unit 91b performs calculation and determination by measurement results of the respective sensors and the like. In the present embodiment, the height position of the surface of the substrate 10 to the slit nozzle 34a of the slit nozzle portion 34 is calculated based on the height position data measured by the height position detecting sensor 32. Then, the calculation result is compared with the height position data stored in the memory unit 91c, which will be described later, and is controlled by the main control unit 91a, and the height position of the slit nozzle 34a of the slit nozzle portion 34 becomes a predetermined height position.

Moreover, it is determined by the measurement result from the foreign matter detecting sensor 39 whether or not foreign matter is present on the substrate 10. That is, while the application unit 30 is being moved, it is judged whether or not the foreign matter is present by the output signal from the foreign matter detecting sensor 39. Specifically, when the light from the light-emitting portion is irradiated with the foreign matter, the signal in the light-receiving portion changes, and it is determined that foreign matter is present on the substrate 10. Further, in this case, the coating operation is stopped without starting the movement of the coating unit 30, and an abnormality is displayed on the touch panel 82 at the same time, and the operator is warned.

The memory unit 91c is for storing various materials, and stores calculation results and the like at one time. Specifically, the height position data of the surface of the substrate 10 at the time of the coating operation to the slit nozzle 34a of the slit nozzle portion 34 is stored.

The drive control unit 92 drives and controls the linear motor 33, the servo motor 36, and the like in accordance with a control signal from the main control unit 91a. Specifically, the linear motor 33 and the servo motor 36 are controlled to drive and control the movement of the coating unit 30 and the lifting operation of the slit nozzle portion 34.

The input/output device control unit 93 is an input/output device that controls the foreign matter detecting sensor 39, the keyboard 83, the touch panel 82, and the like. Specifically, when there is a foreign matter on the substrate 10 and the signal in the light receiving portion changes, the input/output device control unit 93 outputs a signal in accordance with the signal from the foreign matter detecting sensor 39 to the control main unit 91. When the control main unit 91 determines that there is a foreign object, the warning display for prompting the operator via the input/output device control unit 93 is performed on the touch panel 82. Further, the keyboard 83 and the touch panel 82 can be used to set conditions for the coating operation.

The external device control unit 94 performs drive control of the external device based on a control signal from the main control unit 91a. In the present embodiment, the vacuum pump 81 (81a, 81b) is connected, and by driving the vacuum pump 81, the substrate 10 can be adsorbed and held in the initial adsorption unit 41 and the main adsorption unit 42.

Next, the operation of the coating apparatus will be described with reference to the flowcharts shown in FIGS. 7 and 8 and the schematic diagram of the positional relationship of the display coating unit 30 shown in FIG. 9 . Further, in FIG. 9, the coating unit 30 at the retracted position (position A) is indicated by a solid line, and is indicated by a two-dot chain line at a height position. The coating unit 30 that measures the start position (position B) and the initial film formation position (position C).

First, the loading of the substrate 10 is performed in step S1. Specifically, in a state in which a plurality of ejector pins 51 are protruded from the surface of the stage 21, the substrate 10 is placed on the tip end portion of the ejector pin 51 by a robot hand (not shown).

Next, the substrate 10 (substrate carrying process) is carried on the stage 21 in steps S2 to S3. Specifically, in a state where the substrate 10 is held by the ejector pin 51 in step S2, the timing at which the ejector pin 51 of the initial adsorption portion 41 is earlier than the ejector pin 51 of the main adsorption portion 42 is The substrate 10 to be placed is placed so as not to fall, and the initial film formation region 11 of the substrate 10 is placed on the initial adsorption portion 41 of the stage 21 (see FIG. 3). As a result, since the air layer existing between the substrate 10 and the initial adsorption portion 41 is dissipated to the main adsorption portion 42 side, the air layer is effectively suppressed between the substrate 10 and the initial adsorption portion 41 by the air bubbles. Further, when the initial film formation region 11 is carried by the initial adsorption portion 41, the positioning mechanism operates to accurately position the initial film formation region 11. Then, the suction pump 41a and the adsorption groove 41b in the initial adsorption unit 41 are generated by the operation of the vacuum pump 81a, and the air bubbles interposed between the substrate 10 and the initial adsorption unit 41 are attracted to the suction hole 41a and the adsorption groove 41b. The initial film formation region 11 of the substrate 10 is adsorbed and held by the initial adsorption portion 41 (initial adsorption process). By fixing the initial film formation region 11 at the end portion of the substrate 10 in a state where it is accurately positioned, the positioning of the entire substrate 10 is accurately performed.

In the step S3, the overall adsorption of the substrate 10 is performed (main adsorption) The process is performed at the same time, and the coating operation is performed in S4. In other words, in the step S2, since the initial film formation region 11 of the substrate 10 is adsorbed to the initial adsorption portion 41 of the stage 21, the surface of the substrate 10 corresponding to the main adsorption portion 42 that has not been adsorbed is applied (the coating film formation region 12). It is adsorbed to the main adsorption portion 42 of the stage 21. Specifically, the coating film formation region 12 of the substrate 10 is sequentially placed by the initial adsorption portion 41 side by being sequentially housed in the stage 21 from the initial adsorption portion 41 side of the ejection pin 51 of the main adsorption portion 42. It is carried on the main adsorption portion 42. Accordingly, since the air layer existing between the substrate 10 and the stage 21 is sequentially dissipated to the unloaded side, the air layer is effectively suppressed by the presence of bubbles between the substrate 10 and the stage 21. In addition, since the initial film formation region 11 of the substrate 10 is accurately positioned, the vacuum pump 81b is operated in this state, and the coating film formation region 12 of the substrate 10 can be adsorbed to the main adsorption portion 42 and the substrate. 10 total adsorption is fixed to the platform 21. At this time, the air bubbles interposed between the substrate 10 and the main adsorption portion 42 are attracted to the suction holes 42a and the adsorption grooves 42b.

At the same time, the coating operation is started substantially simultaneously with the adsorption of the initial film formation region 11 of the substrate 10 in accordance with the flowchart of FIG.

First, the movement of the coating unit 30 is performed in step S41. That is, the movement of the coating unit 30 is started substantially simultaneously with the adsorption of the surface of the substrate 10 corresponding to the initial adsorption unit 41. Specifically, the coating unit 30 is moved from the retracted position (position A) to a position where the initial film is formed on the substrate 10 (initial film formation position, position C in FIG. 9).

In the middle of the movement, the measurement of the height position of the substrate 10 is started in step S42. Specifically, as shown in FIG. 9, if the coating unit 30 reaches the height level When the measurement start position (position B) is set, the measurement of the height position of the substrate 10 is started. That is, when the initial film formation region 11 of the substrate 10 is positioned directly below the height position detecting sensor 32, the measurement of the height position of the substrate 10 is started. Then, the height of the substrate 10 is continuously measured in accordance with the movement of the coating unit 30, and the height position of the slit nozzle portion 34 is adjusted in accordance with the measured value, and the slit nozzle 34a of the slit nozzle portion 34 and the surface of the substrate 10 are slit. The distance becomes certain.

Further, at the same time, the foreign matter detection is started by the foreign matter detecting sensor 39 in step S34. That is, whether or not foreign matter is present on the substrate 10 after the start of the height position measurement is detected. Then, when the foreign matter is detected on the substrate 10, the movement of the coating unit 30 is stopped, and when the foreign matter is not detected, the movement is moved to the initial film formation position. In this manner, the coating unit 30 travels on the initial adsorption unit 41 while performing height position detection and foreign matter detection.

Next, an initial film is formed in step S44. Specifically, when the coating unit 30 reaches the initial film formation position (position C), the coating unit 30 stops at this position. Then, a predetermined amount of the coating liquid is discharged in a state where the coating unit 30 is stopped at the initial film formation position, and the coating liquid discharged through the slit nozzle 34a is transmitted so that the slit nozzle 34a and the substrate 10 are The status of the link. That is, an initial film made of a coating liquid is formed between the slit nozzle 34a and the substrate 10. As described above, the initial film formation process is completed by forming the initial film over the longitudinal direction of the slit nozzle 34a.

Next, main coating (coating film forming process) is started in step S45. That is, by further moving the coating unit 30 from the initial film formation position, one The coating liquid is discharged, and a coating film is formed on the surface of the substrate 10 corresponding to the main adsorption portion 42. Further, before and after the main coating operation is started, the entire adsorption of the substrate 10 in the step S3 is completed.

Next, the take-out of the substrate 10 is performed in step S5. In other words, after the formation of the coating film is completed on the surface of the substrate 10 by the main coating in S45, the initial adsorption portion 41 and the ejection pin 51 of the main adsorption portion 42 are raised to eject the tip end portion of the pin 51. The substrate 10 is held. Then, the delivery of the substrate 10 is performed on a robot (not shown), and the substrate 10 is discharged from the surface of the stage 21.

According to the coating apparatus and the coating method, the substrate adsorption means 40 for adsorbing the substrate has the initial adsorption portion 41 and the main adsorption portion 42, so that a part of the substrate 10 is adsorbed by the initial adsorption portion 41, and then the coating can be performed. The cloth unit 30 moves and can start coating the surface of the substrate 10 corresponding to the initial adsorption portion 41. In other words, since the application unit 30 can be immediately moved to the surface of the substrate 10 corresponding to the initial adsorption unit 41 after the adsorption of the substrate is started, the coating operation is started after the entire substrate 10 is adsorbed and fixed as in the related art. In comparison with the situation, the cycle time as the entire coating apparatus can be shortened.

In the above-described embodiment, the vacuum pump 81a that causes the suction force to be generated in the suction hole 41a of the initial adsorption unit 41 and the vacuum pump 81b that causes the suction force to be generated in the suction hole 42a of the main adsorption unit 42 are disposed. However, as shown in FIG. 10, the suction force may be generated in the suction holes 41a and 42a of the initial adsorption unit 41 and the main adsorption unit 42 by the vacuum pump 81. Specifically, the switching valve 44 can be attached to the piping 84 that connects the vacuum pump 81 and the initial suction unit 41 and the suction holes 41a and 42a of the main adsorption unit 42 to automatically switch the switching valve 44 by the control device. Selectively The suction force is generated in the suction hole 41a of the initial adsorption unit 41 and the suction hole 42a of the main adsorption unit 42. Thus, by making the vacuum pump 81 common, it can be regarded as a more inexpensive coating apparatus.

Further, in the above-described embodiment, the description is made with respect to an example in which the ejector pin 51 of the initial adsorption portion 41 is placed earlier than the ejector pin 51 of the main adsorption portion 42, but all the ejector pins 51 are The same timing can be accommodated by the occupant. According to this, it is possible to prevent the substrate 10 held by the tip end portion of the ejector pin 51 from falling off the ejector pin 51 side of the initial adsorption portion 41 that was accommodated at an early timing.

2‧‧‧Abutment

10‧‧‧Substrate

11‧‧‧ Initial film formation area

12‧‧‧ Coating film formation area

21‧‧‧ platform

22, 37‧‧ ‧ rails

30‧‧‧ Coating unit

31‧‧‧ feet

32‧‧‧ Height position detection sensor

33‧‧‧Linear motor

34‧‧‧Slotted nozzle section

34a‧‧‧Slot nozzle

35‧‧‧ Slider

36‧‧‧Servo motor

39‧‧‧ Foreign object detection sensor

40‧‧‧Substrate adsorption means

41‧‧‧ Initial adsorption department

41a, 42a‧‧‧ attracting holes

41b, 42b‧‧ ‧ adsorption ditch

42‧‧‧Main adsorption department

51‧‧‧Top sales

81, 81a, 81b‧‧‧ vacuum pump

82‧‧‧Touch panel

83‧‧‧ keyboard

84‧‧‧Pipe

90‧‧‧Control device

91‧‧‧Control body

91a‧‧‧Main Control Department

91b‧‧‧Decision Judgment Department

91c‧‧‧Memory Department

92‧‧‧Drive Control Department

93‧‧‧Input/output device control unit

Fig. 1 is a plan view showing a coating apparatus according to an embodiment of the present invention.

Figure 2 is a side view of the above coating apparatus.

Fig. 3 is a view showing a state in which a part of a substrate is carried by the above coating apparatus.

4(a) and 4(b) are views showing a stage of the above coating apparatus, wherein (a) is a view showing the entire platform, and (b) is an enlarged view of a surface portion thereof.

Fig. 5 is a view showing details of a leg portion of a coating unit in the above coating device.

Fig. 6 is a block diagram showing a control system of the above coating apparatus.

Fig. 7 is a flow chart showing the operation of the above coating apparatus.

Fig. 8 is a flow chart showing the coating operation of the above coating apparatus.

Figure 9 is a view showing the position of the coating unit in the operation of the above coating apparatus Diagram of the relationship.

Fig. 10 is a schematic view showing a vacuum pump and a piping system of a coating device according to another embodiment.

10‧‧‧Substrate

11‧‧‧ Coating device

12‧‧‧ Coating film formation area

21‧‧‧ platform

30‧‧‧ Coating unit

34‧‧‧Slotted nozzle section

40‧‧‧Substrate adsorption means

41‧‧‧ Initial adsorption department

42‧‧‧Main adsorption department

51‧‧‧Top sales

81, 81a, 81b‧‧‧ vacuum pump

84‧‧‧Pipe

Claims (7)

A coating apparatus comprising: a stage on which a substrate is carried; and a coating unit that forms a coating film on the substrate by relatively moving the substrate supported on the surface of the stage while ejecting the coating liquid a substrate adsorption means for arranging an adsorption holding substrate on the platform, the substrate adsorption means having: an initial adsorption portion for adsorbing an initial film formation region of a substrate on which an initial film is formed at the start of coating; and adsorption in addition to the initial film In the main adsorption portion of the coating film formation region other than the formation region, after the adsorption of the surface of the substrate corresponding to the initial adsorption portion is completed, the coating unit starts the formation of the initial film before the adsorption operation of the main adsorption portion is completed. The coating device according to claim 1, wherein the initial adsorption portion and the main adsorption portion of the substrate adsorption means are respectively formed with a suction hole formed on a surface of the stage, and the substrate adsorption means includes: generating an attractive force A suction means for the suction hole; and a switching means for selectively generating an attractive force from the suction means for the initial adsorption portion and the main adsorption portion. The coating device according to the first aspect of the invention, wherein the initial adsorption portion and the main adsorption portion of the substrate adsorption means are respectively formed with a suction hole formed on a surface of the stage, and the substrate suction means causes attraction The suction means for the suction port of the initial adsorption portion and the suction means for causing the suction force to be generated at the suction port of the main adsorption portion are independently disposed in the initial adsorption portion and the main adsorption portion. The coating device according to the second or third aspect of the invention, wherein the initial adsorption portion and the main adsorption portion are formed with an adsorption groove for adsorbing the substrate on a surface of the platform, wherein the adsorption groove is connected to the suction hole. Further, it is formed on the surface of the platform, and the adsorption groove of the initial adsorption portion and the adsorption groove of the main adsorption portion are independently formed by the partition portions that are prevented from being connected to each other. The coating apparatus according to any one of the first to third aspect, wherein the initial adsorption unit and the main adsorption unit of the substrate adsorption means are provided with pin members for holding the substrate, and the pin members are respectively housed in the platform The inside of the platform may be protruded from the surface of the platform, and the pin member of the initial adsorption portion is housed in the platform before the pin member of the main adsorption portion. The coating device according to claim 5, wherein the pin member of the main adsorption portion is sequentially housed in the platform by the initial adsorption portion side. A coating method is a coating method of a coating device having a process of: carrying a substrate carrying process on a surface of a platform; and stopping a coating unit for discharging a coating liquid on a substrate carried on the platform; In the state of forming the initial film formation process of the initial film, and after the initial film is formed, the coating liquid is discharged by the coating unit, and the coating unit is moved relative to the substrate to form a coating on the substrate. The coating film forming process of the film is characterized in that: the substrate carrying process has an adsorption process of adsorbing the substrate on the surface of the platform, and the adsorption process comprises: an initial adsorption process of adsorbing the initial film forming region of the substrate on which the initial film is formed And adsorption in addition to the initial film formation The main adsorption process of the coating film formation region of the substrate other than the region, the initial film formation process is started before the main adsorption process is completed after the initial adsorption process is completed.