TWI554337B - Resin coating means - Google Patents

Resin coating means Download PDF

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Publication number
TWI554337B
TWI554337B TW100144831A TW100144831A TWI554337B TW I554337 B TWI554337 B TW I554337B TW 100144831 A TW100144831 A TW 100144831A TW 100144831 A TW100144831 A TW 100144831A TW I554337 B TWI554337 B TW I554337B
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Taiwan
Prior art keywords
sheet
workpiece
pressing
holding
resin
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TW100144831A
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Chinese (zh)
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TW201236767A (en
Inventor
Kazutaka Kuwana
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Disco Corp
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Publication of TWI554337B publication Critical patent/TWI554337B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00Means for manipulating or holding work, e.g. for separate articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05BSPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/14Arrangements for preventing or controlling structural damage to spraying apparatus or its outlets, e.g. for breaking at desired places; Arrangements for handling or replacing damaged parts
    • B05B15/16Arrangements for preventing or controlling structural damage to spraying apparatus or its outlets, e.g. for breaking at desired places; Arrangements for handling or replacing damaged parts for preventing non-intended contact between spray heads or nozzles and foreign bodies, e.g. nozzle guards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/023Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/06Work supports, e.g. adjustable steadies

Description

樹脂塗布裝置 Resin coating device 發明領域 Field of invention

本發明係有關於一種用以塗布樹脂覆蓋半導體晶圓等工件(被加工物)之一面之樹脂塗布裝置。 The present invention relates to a resin coating apparatus for coating a surface of a workpiece (object to be processed) such as a semiconductor wafer with a resin.

發明背景 Background of the invention

為去除製造半導體裝置時所用之工件之波紋或翹曲,故提出一種將樹脂塗布於工件一面,待樹脂硬化後磨削工件使工件表面變平坦之加工方法(參照專利文獻1為例)。 In order to remove the corrugation or warpage of the workpiece used in the manufacture of the semiconductor device, a processing method in which the resin is applied to one side of the workpiece and the workpiece is ground after the resin is cured is used to flatten the surface of the workpiece (see Patent Document 1 as an example).

用以循上述方法塗布樹脂之裝置,係於台部上供給液狀樹脂並於樹脂上載置工件後,降下按壓墊令工件向樹脂按壓,藉以使樹脂均勻塗布於工件之背面全體(參照專利文獻2為例)。 The apparatus for coating a resin by the above method is to supply a liquid resin on a table and to place a workpiece on a resin, and then lower the pressing pad to press the workpiece against the resin, so that the resin is uniformly applied to the entire back surface of the workpiece (refer to the patent literature). 2 as an example).

【先前技術文獻】 [Previous Technical Literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本專利公開公報特開第2009-148866號 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-148866

【專利文獻2】日本專利公開公報特開第2010-155298號 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-155298

發明概要 Summary of invention

然而,習知之樹脂塗布裝置係藉由將按壓墊降下至事 先設定之預定位置,使工件向樹脂按壓,故工件厚度不均或樹脂量有所增減時,將產生樹脂未適切散佈,無法於工件之背面全體均勻塗布樹脂之問題。 However, the conventional resin coating device is lowered by pressing the pressing pad When the predetermined position is set first and the workpiece is pressed against the resin, when the thickness of the workpiece is uneven or the amount of the resin is increased or decreased, the resin is not properly spread, and the resin cannot be uniformly applied to the entire back surface of the workpiece.

本發明即有鑑於此點而形成者,目的在於提供一種無論工件厚度不均或樹脂量有所增減,皆可適切散佈樹脂之樹脂塗布裝置。 The present invention has been made in view of the above, and it is an object of the invention to provide a resin coating apparatus which can appropriately spread a resin irrespective of uneven thickness of a workpiece or an increase or decrease in the amount of resin.

本發明之樹脂塗布裝置,係具有:按壓部,係具有一可吸附保持工件之按壓面者;台部,係與前述按壓面對向配置者;樹脂供給部,係將液狀樹脂供給於前述台部上表面者;移動部,係用以使前述按壓面接近及離開前述台部者;及,控制部,係用以控制前述移動部之動作者;該樹脂塗布裝置係用以將保持於前述按壓面之前述工件由上按壓供給於前述台部上表面之前述液狀樹脂,使前述液狀樹脂於前述工件下表面擴展者;前述按壓部具有一壓力感測器,係用以於前述移動部令前述按壓面所保持之前述工件接近前述台部,使前述液狀樹脂被按壓而擴展於前述工件下表面時,檢測前述按壓面所受之壓力者;前述控制部係依據前述壓力感測器檢測出之壓力,控制前述移動部之動作。 The resin coating device of the present invention includes a pressing portion having a pressing surface capable of adsorbing and holding the workpiece, a table portion facing the pressing surface, and a resin supply portion supplying the liquid resin to the foregoing a top portion of the table portion; a moving portion for bringing the pressing surface closer to and away from the table portion; and a control portion for controlling the actor of the moving portion; the resin coating device for holding the The workpiece on the pressing surface is pressed against the liquid resin supplied to the upper surface of the table portion to expand the liquid resin on the lower surface of the workpiece; the pressing portion has a pressure sensor for the aforementioned The moving portion causes the workpiece held by the pressing surface to approach the table portion, and when the liquid resin is pressed and spread over the lower surface of the workpiece, the pressure applied to the pressing surface is detected; and the control portion is based on the pressure feeling The pressure detected by the detector controls the action of the moving portion.

藉由該構造,以按壓面所保持之工件由上按壓供給於台部上表面之液狀樹脂時,可依按壓部所受之壓力調節按壓部之壓入量,因此無論工件厚度不均或樹脂量有所增減,皆可適切散佈樹脂。 According to this configuration, when the workpiece held by the pressing surface presses the liquid resin supplied to the upper surface of the table portion, the pressing amount of the pressing portion can be adjusted according to the pressure applied to the pressing portion, so that the thickness of the workpiece is uneven or The amount of resin may be increased or decreased, and the resin may be appropriately dispersed.

又,上述樹脂塗布裝置中,前述控制部宜於前述壓力感測器檢測出達預先設定之壓力以上之壓力時,停止前述移動部令前述按壓面所保持之前述工件接近前述台部之動作。 Further, in the resin coating device, the control unit preferably stops the movement of the workpiece held by the pressing surface close to the table portion when the pressure sensor detects a pressure equal to or higher than a predetermined pressure.

進而,上述樹脂塗布裝置中,前述控制部宜於前述壓力感測器檢測出壓力在前一次檢測出之壓力以下時,停止前述移動部令前述按壓面所保持之前述工件接近前述台部之動作。 Further, in the resin coating device, the control unit preferably stops the movement of the workpiece held by the pressing surface when the pressure sensor detects that the pressure is less than or equal to the previously detected pressure. .

藉由本發明,無論工件厚度不均或樹脂量有所增減,均可適切散佈樹脂。 According to the present invention, the resin can be appropriately dispersed regardless of the uneven thickness of the workpiece or the increase or decrease in the amount of the resin.

圖式簡單說明 Simple illustration

第1圖係本實施形態之樹脂塗布裝置之透視圖。 Fig. 1 is a perspective view of a resin coating apparatus of the present embodiment.

第2圖係本實施形態之晶匣收容部之透視圖。 Fig. 2 is a perspective view of the wafer housing portion of the embodiment.

第3圖係本實施形態之晶匣收容部之截面示意圖。 Fig. 3 is a schematic cross-sectional view showing the wafer housing portion of the embodiment.

第4(a)~(c)圖係本實施形態之外部門及內部門之開閉動作之說明圖。 The fourth (a) to (c) drawings are explanatory diagrams of the opening and closing operations of the departments and internal departments other than the present embodiment.

第5圖係本實施形態之黏附裝置之截面示意圖。 Fig. 5 is a schematic cross-sectional view showing the adhering device of the embodiment.

第6(a)~(d)圖係本實施形態之黏附裝置之黏附動作之說明圖。 6(a) to (d) are explanatory views of the adhesion operation of the adhering device of the present embodiment.

第7圖所示者係本實施形態中按壓感測器之測定值與移動部開始移動後之經過時間之一般關係。 The figure shown in Fig. 7 is a general relationship between the measured value of the pressing sensor and the elapsed time after the moving portion starts moving in the present embodiment.

第8圖所示者係本實施形態中按壓感測器之測量結果之一例。 The figure shown in Fig. 8 is an example of the measurement result of the pressing sensor in the present embodiment.

第9圖所示者係本實施形態中壓力感測器對保持板-台部間之間隙變化之測量結果所呈現之映射圖之一例。 The figure shown in Fig. 9 is an example of a map showing the measurement result of the change in the gap between the holding plate and the table portion by the pressure sensor in the present embodiment.

第10(a)、(b)圖係本實施形態之黏附裝置之裝配作業說明圖。 Fig. 10 (a) and (b) are explanatory views of the assembly work of the adhering device of the present embodiment.

第11圖係本實施形態之薄片供給部之側面示意圖。 Fig. 11 is a side view showing the sheet supply portion of the embodiment.

第12圖係本實施形態之第一、第二送風部之擴大圖。 Fig. 12 is an enlarged view of the first and second air blowing portions of the embodiment.

第13圖係本實施形態之捲式薄片支持部之部分截面示意圖。 Fig. 13 is a partial cross-sectional view showing the roll sheet supporting portion of the embodiment.

第14A(a)~(c)圖係本實施形態之薄片供給部進行薄片切斷動作之說明圖。 14A(a) to (c) are explanatory views of a sheet cutting operation performed by the sheet supply unit of the embodiment.

第14B(d)~(f)圖係本實施形態之薄片供給部進行薄片切斷動作之說明圖。 14B(d) to (f) are explanatory views of the sheet cutting operation performed by the sheet supply unit of the embodiment.

第15(a)、(b)圖係本實施形態中捲式薄片支持部對捲式薄片進行鎖定動作及解鎖動作之說明圖。 Fig. 15 (a) and (b) are explanatory views showing a locking operation and an unlocking operation of the roll sheet by the roll sheet supporting portion in the embodiment.

第16圖所示者係本實施形態中光感測器對捲式薄片之變化之測量結果所呈現之映射圖之一例。 The figure shown in Fig. 16 is an example of a map showing the measurement result of the change of the roll sheet by the photo sensor in the present embodiment.

第17(a)、(b)圖係本實施形態之台部之示意圖。 The seventeenth (a) and (b) drawings are schematic views of the table portion of the present embodiment.

第18圖係本實施形態之薄片傳送部之截面示意圖。 Fig. 18 is a schematic cross-sectional view showing the sheet conveying portion of the embodiment.

第19(a)~(d)圖係本實施形態中薄片傳送部對薄片進行貼附動作之說明圖。 19(a) to (d) are explanatory views of the attaching operation of the sheet conveying unit to the sheet in the embodiment.

第20(a)~(d)圖係變形例中使用薄片保持部貼附薄片之動作說明圖。 20(a) to (d) are diagrams for explaining the operation of attaching a sheet using a sheet holding portion in a modification.

第21(a)、(b)圖係變形例之台部之截面示意圖。 21(a) and (b) are schematic cross-sectional views of the table portion of the modification.

用以實施發明之形態 Form for implementing the invention

關於本實施形態,參照附圖詳細說明如下。第1圖係本實施形態之樹脂塗布裝置之透視圖。另,本實施形態之樹脂塗布裝置並非以第1圖所示之構造為限。樹脂塗布裝置只要是以液狀樹脂於工件單面黏附薄片者,可具有任何構造。此外,第1圖中為便於說明,以虛線表示樹脂塗布裝置之外部框體。 This embodiment will be described in detail below with reference to the drawings. Fig. 1 is a perspective view of a resin coating apparatus of the present embodiment. Further, the resin coating device of the present embodiment is not limited to the structure shown in Fig. 1 . The resin coating device may have any structure as long as it is a liquid resin adhered to one side of the workpiece. In addition, in the first drawing, for convenience of explanation, the outer frame of the resin coating device is indicated by a broken line.

如第1圖所示,樹脂塗布裝置1係配置於磨削加工之前段,其構造係以液狀樹脂將薄片S黏附於工件W下表面。該樹脂塗布裝置1係進行供給液狀樹脂於吸附保持在台部602上之薄片S,並將按壓部604所保持之工件W對著薄片S由上按壓在台部602上方之動作。樹脂塗布裝置1係藉由將工件W對薄片S緊壓,使液狀樹脂遍及裝置面全區。 As shown in Fig. 1, the resin coating apparatus 1 is disposed in a stage before the grinding process, and is configured to adhere the sheet S to the lower surface of the workpiece W with a liquid resin. In the resin coating apparatus 1, the liquid S is supplied to the sheet S which is adsorbed and held by the table portion 602, and the workpiece W held by the pressing portion 604 is pressed against the sheet S from above the table portion 602. In the resin coating apparatus 1, the liquid W is spread over the entire surface of the apparatus by pressing the workpiece W against the sheet S.

工件W為未形成裝置圖案者,係以線鋸切斷圓柱狀鑄錠製成。於工件W下表面黏附液狀樹脂,以吸收線鋸進行切斷時所產生之波紋或翹曲等。工件W係呈收容於晶匣4內之狀態搬入樹脂塗布裝置1。 The workpiece W is not formed into a device pattern, and is formed by cutting a cylindrical ingot with a wire saw. A liquid resin is adhered to the lower surface of the workpiece W to absorb ripples or warpage generated when the wire saw is cut. The workpiece W is carried into the resin coating device 1 in a state of being housed in the wafer 4.

另,工件W不限於矽晶圓(Si)、砷化鎵(GaAs)、碳化矽(SiC)等晶圓。舉例言之,亦可取陶瓷、玻璃、藍寶石(Al2O3)系無基材料基板、板狀金屬或樹脂之延性材料、需要微米級至次微米級平坦度(TTV:Total Thickness Variation)之各種加工材料作為工件。此外,此處所謂平坦度,係指工件W以被磨削面為基準面對厚度方向測量所得之高度中,最大值與最小值之差。又,薄片S則凡如聚對苯二甲酸乙二酯 等具有彈性之柔軟材料皆可。 Further, the workpiece W is not limited to a wafer such as germanium wafer (Si), gallium arsenide (GaAs), or tantalum carbide (SiC). For example, a ceramic, glass, sapphire (Al 2 O 3 ) based substrate without a base material, a ductile material of a plate metal or a resin, and various types of TTV (Total Thickness Variation) may be used. The material is processed as a workpiece. Further, the term "flatness" as used herein refers to the difference between the maximum value and the minimum value among the heights of the workpiece W measured in the thickness direction with respect to the ground surface. Further, the sheet S may be any flexible material such as polyethylene terephthalate.

樹脂塗布裝置1係具有沿X軸方向延伸之長方體狀之外部框體2。外部框體2之後端部設有晶匣收容部100,該晶匣收容部100具有上下2段之晶匣台103(參照第2圖)。上段之晶匣台103載置用以收容加工前之工件W之搬入側晶匣4。下段之晶匣台103載置用以收容附薄片S之工件W之搬出側晶匣5。外部框體2內,於晶匣收容部100前方設有第一工件傳送部200,用以對晶匣4、5進行工件W之搬入及搬出動作。 The resin coating device 1 has an outer frame 2 having a rectangular parallelepiped shape extending in the X-axis direction. The rear end portion of the outer casing 2 is provided with a wafer housing portion 100 having a wafer stage 103 having two stages of upper and lower sides (see FIG. 2). The wafer stage 103 of the upper stage is placed with the loading side wafer 4 for accommodating the workpiece W before processing. The wafer stage 103 of the lower stage is placed with the carry-out side wafer 5 for accommodating the workpiece W with the sheet S attached thereto. In the outer casing 2, a first workpiece transfer unit 200 is provided in front of the wafer housing unit 100 for carrying in and carrying out the workpiece W to the wafers 4 and 5.

第一工件傳送部200之前方空間由支持於柱狀部605背面之座台3劃分上下。座台3上表面設有工件檢測部400,用以檢測加工前之工件W之位置及朝向。座台3下表面設有薄片切割部500,用以將黏附於工件W上之薄片S沿工件W之外形切割。第一工件傳送部200係將加工前之工件W由上段之晶匣4內傳送至工件檢測部400,並將附有薄片S之工件W由薄片切割部500傳送至下段之晶匣5內。 The space in front of the first workpiece transfer unit 200 is divided into upper and lower sides by a table 3 supported by the back surface of the columnar portion 605. A workpiece detecting portion 400 is provided on the upper surface of the table 3 for detecting the position and orientation of the workpiece W before processing. The lower surface of the table 3 is provided with a sheet cutting portion 500 for cutting the sheet S adhered to the workpiece W along the outside of the workpiece W. The first workpiece transfer unit 200 conveys the workpiece W before machining from the upper wafer 4 to the workpiece detecting portion 400, and transports the workpiece W with the sheet S from the sheet cutting portion 500 to the wafer 5 of the lower stage.

工件檢測部400及薄片切割部500前方設有黏附裝置600,用以將保護用薄片S藉由液狀樹脂黏附於工件W上。黏附裝置600係具有一用以吸附保持薄片S之台部602、及一位於台部602上方用以吸附保持工件W之按壓部604。台部602附近設有樹脂供給部603,用以對台部602上之薄片S供給光硬化性液狀樹脂。黏附裝置600係藉由使保持有工件W之按壓部604靠向業經供給液狀樹脂之薄片S,進行黏附動作。又,黏附裝置600之基台601內設有發光部636(參照第5圖),用以使光線經台部602照射液狀樹脂。 An adhesion device 600 is disposed in front of the workpiece detecting unit 400 and the sheet cutting unit 500 for adhering the protective sheet S to the workpiece W by a liquid resin. The adhesion device 600 has a table portion 602 for adsorbing and holding the sheet S, and a pressing portion 604 located above the table portion 602 for sucking and holding the workpiece W. A resin supply unit 603 is provided in the vicinity of the table portion 602 to supply the photocurable liquid resin to the sheet S on the table portion 602. The adhesion device 600 performs an adhesion operation by bringing the pressing portion 604 holding the workpiece W toward the sheet S through which the liquid resin is supplied. Further, a light-emitting portion 636 (see FIG. 5) is provided in the base 601 of the adhesion device 600 for illuminating the liquid resin through the stage portion 602.

工件檢測部400及薄片切割部500側邊設有第二工件傳送部300,用以於工件檢測部400與黏附裝置600間、及黏附裝置600與薄片切割部500間傳送工件W。第二工件傳送部300係將加工前之工件W由工件檢測部400傳送至按壓部604,並將附有薄片S之工件W由台部602傳送至薄片切割部500。黏附裝置600前方設有薄片供給部700,用以對黏附裝置600供給薄片S。薄片供給部700係將由捲式薄片R放出之薄片S按預定長度切斷。 The workpiece detecting unit 400 and the sheet cutting unit 500 are provided with a second workpiece transfer unit 300 for transferring the workpiece W between the workpiece detecting unit 400 and the attaching device 600 and between the adhering device 600 and the sheet cutting unit 500. The second workpiece transfer unit 300 transports the workpiece W before the processing from the workpiece detecting unit 400 to the pressing unit 604, and transports the workpiece W with the sheet S to the sheet cutting unit 500 from the stage unit 602. A sheet supply portion 700 is provided in front of the adhesion device 600 for supplying the sheet S to the adhesion device 600. The sheet supply unit 700 cuts the sheet S discharged from the roll sheet R by a predetermined length.

薄片供給部700側邊設有薄片傳送部800,用以將薄片供給部700放出之薄片S傳送至黏附裝置600。薄片傳送部800係保持在薄片供給部700中按預定長度切斷之薄片S,再傳送至台部602上。又,外部框體2中設有一用以整合控制樹脂塗布裝置1各部之控制部6。控制部6係由用以執行樹脂塗布裝置1之各種處理之處理器或記憶體等構成。記憶體係依用途由ROM(Read Only Memory)、RAM(Random Access Memory)等一個或數個儲存媒體構成。 A sheet conveying portion 800 is provided on the side of the sheet supply portion 700 for conveying the sheet S discharged from the sheet supply portion 700 to the adhering device 600. The sheet conveying unit 800 holds the sheet S cut by the predetermined length in the sheet supply unit 700 and conveys it to the table unit 602. Further, the outer casing 2 is provided with a control portion 6 for integrally controlling the respective portions of the resin coating device 1. The control unit 6 is constituted by a processor or a memory or the like for executing various processes of the resin coating device 1. The memory system is composed of one or a plurality of storage media such as a ROM (Read Only Memory) or a RAM (Random Access Memory) depending on the application.

如上構成之樹脂塗布裝置1,係由搬入側之晶匣4將加工前之工件W傳送至黏附裝置600,並由薄片供給部700將薄片S傳送至黏附裝置600。繼之,於黏附裝置600黏合工件W與薄片S,並將附有薄片S之工件W傳送至薄片切割部500。附有薄片之工件W於薄片切割部500沿工件W之外形切割薄片S,並傳送至搬出側之匣盒5。 In the resin coating apparatus 1 configured as described above, the workpiece W before processing is conveyed to the adhesion device 600 by the wafer 4 on the loading side, and the sheet S is conveyed by the sheet supply unit 700 to the adhesion device 600. Next, the workpiece W and the sheet S are bonded to the bonding apparatus 600, and the workpiece W to which the sheet S is attached is conveyed to the sheet cutting portion 500. The workpiece W with the sheet is cut by the sheet cutting portion 500 along the outside of the workpiece W, and is conveyed to the cassette 5 on the carry-out side.

關於構成樹脂塗布裝置之各部分,則個別說明如下。首先,針對晶匣收容部說明全體構造。第2圖係本實施形態 之晶匣收容部之透視圖。另,第2圖中為便於說明,晶匣收容部之框體部分以虛線表示。 The respective portions constituting the resin coating device will be individually described below. First, the entire structure will be described for the wafer housing unit. Figure 2 is the embodiment A perspective view of the crystal housing. In addition, in FIG. 2, for convenience of explanation, the frame portion of the wafer housing portion is indicated by a broken line.

如第2圖所示,晶匣收容部100之作用係作為晶匣4對樹脂塗布裝置1之搬入口及搬出口。晶匣收容部100具有一用以構成外部框體2後端側之側壁部之收容部本體101。收容部本體101中形成有上下2段且左右成對之晶匣用之收容室102。上段之兩收容室中分別收容搬入側之晶匣4,下段之兩收容室則分別收容搬出側之晶匣5。各收容室102連結樹脂塗布裝置1之內側與外側,使工件W經由裝置內側之開口端進出晶匣4、5,並經由裝置外側之開口端將晶匣4、5搬入及搬出。 As shown in Fig. 2, the operation of the wafer housing unit 100 serves as a loading port and a port for the resin coating apparatus 1 of the wafer 4. The wafer housing portion 100 has a housing portion body 101 for constituting a side wall portion on the rear end side of the outer housing 2. The accommodating portion main body 101 is formed with a accommodating chamber 102 for two rows of the upper and lower sides and the right and left pairs of wafers. In the two storage chambers of the upper stage, the wafers 4 on the loading side are respectively accommodated, and the two chambers in the lower stage respectively accommodate the wafers 5 on the loading and unloading side. Each of the storage chambers 102 is connected to the inside and the outside of the resin coating apparatus 1, and the workpiece W is introduced into and out of the wafers 4 and 5 through the open end of the inside of the apparatus, and the wafers 4 and 5 are carried in and out through the open end of the apparatus.

各收容室102底面設有用以載置晶匣4、5之晶匣台103。晶匣台103係於各收容室102中安裝成可藉由上下2段之滑動板104、105向裝置外側滑動之狀態。收容部本體101設有4個用以開閉各收容室102之裝置外側開口之滑動式外部門106、與4個用以開閉各收容室102之裝置內側開口之滑動式內部門107。各外部門106係安裝於面向樹脂塗布裝置1外部之收容部本體101側面,並可藉由操作員手動開閉。各內部門107係安裝於面向樹脂塗布裝置1內部之收容部本體101側面,並可配合樹脂塗布裝置1之動作自動開閉。 The bottom surface of each of the storage chambers 102 is provided with a wafer stage 103 on which the wafers 4 and 5 are placed. The wafer stage 103 is attached to each of the storage chambers 102 so as to be slidable toward the outside of the apparatus by the slide plates 104 and 105 of the upper and lower stages. The accommodating portion main body 101 is provided with four sliding outer doors 106 for opening and closing the outer opening of the accommodating chambers 102, and four sliding inner portions 107 for opening and closing the inner openings of the accommodating chambers 102. Each of the external departments 106 is attached to the side of the housing portion 101 facing the outside of the resin coating device 1, and can be manually opened and closed by an operator. Each of the internal departments 107 is attached to the side surface of the accommodating portion main body 101 facing the inside of the resin coating device 1, and can be automatically opened and closed in accordance with the operation of the resin coating device 1.

上段之收容室102之外部門106及內部門107向上滑動時呈開啟狀態,向下滑動時形形成關閉狀態。下段之收容室102之外部門106及內部門107向上滑動時呈關閉狀態,向下滑動時形成開啟狀態。又,收容部本體101設有用以將各 外部門106及各內部門107鎖定在關閉狀態之鎖定機構。鎖定機構於對應之外部門106及內部門107中任一方處於開啟狀態時,將任另一方鎖定在關閉狀態。 When the department 106 and the inner door 107 outside the accommodating chamber 102 of the upper stage are slid upward, they are in an open state, and when they are slid downward, they are formed in a closed state. The department 106 and the inner door 107 outside the accommodating chamber 102 in the lower stage are closed when sliding upward, and are opened when sliding downward. Moreover, the housing portion 101 is provided to The outer door 106 and each inner door 107 lock the locking mechanism in the closed state. When the locking mechanism is in an open state in either of the corresponding external department 106 and the internal department 107, the other party is locked in the closed state.

參照第3圖,說明晶匣收容部之詳細構造。第3圖係本實施形態之晶匣收容部之截面示意圖。 The detailed structure of the wafer housing portion will be described with reference to Fig. 3 . Fig. 3 is a schematic cross-sectional view showing the wafer housing portion of the embodiment.

如第3圖所示,晶匣台103具有上下2段之滑動板104、105,係配置成可相對於各收容室102之底面滑動之狀態。下段之滑動板104係卡合形成可相對於各收容室102之底面向裝置外側滑動之狀態。上段之滑動板105則卡合形成可相對於下段之滑動板104向裝置外側滑動之狀態。晶匣台103係構成可於使第一工件傳送部200可侵入晶匣4內之前位置、與從該前位置離開內部門107之後位置間滑動之狀態。 As shown in FIG. 3, the wafer table 103 has the slide plates 104 and 105 of the upper and lower stages, and is arranged in a state of being slidable with respect to the bottom surface of each of the storage chambers 102. The slide plate 104 of the lower stage is engaged with the slide plate 104 so as to be slidable toward the outside of the apparatus with respect to the bottom of each of the storage chambers 102. The slide plate 105 of the upper stage is engaged to form a state in which it can slide toward the outside of the apparatus with respect to the slide plate 104 of the lower stage. The wafer stage 103 is configured to be slidable between a position before the first workpiece transfer unit 200 can enter the wafer 4 and a position after leaving the inner door 107 from the front position.

更詳而言之,下段之滑動板104靠內部門107側之一端部111,係於收容室102底面上、收容室102之裝置內側開口端與自該開口端朝裝置外側滑開之滑開位置間移動。又,上段之滑動板105靠內部門107側之一端部112,係於下段之滑動板104上、下段之滑動板104一端部111與自該一端部111朝裝置外側滑開之滑開位置間移動。因此,晶匣台103可朝裝置外側大幅拉出,提高操作員進行晶匣4、5之搬入作業及搬出作業之作業性。 More specifically, the sliding plate 104 of the lower stage is located on the bottom surface 111 of the inner door 107 side, and is attached to the bottom surface of the receiving chamber 102, the open end of the inside of the receiving chamber 102, and the sliding opening from the open end toward the outside of the device. Move between locations. Further, the upper sliding plate 105 is located at one end 112 of the inner door 107 side, and is attached to the sliding plate 104 of the lower stage, the one end portion 111 of the lower sliding plate 104, and the sliding position of the sliding portion 104 from the one end portion 111 toward the outside of the device. mobile. Therefore, the wafer table 103 can be largely pulled out toward the outside of the apparatus, thereby improving the workability of the operator to carry in and carry out the loading operation of the wafers 4 and 5.

外部門106係安裝成可相對於收容部本體101外側面朝上下方向滑動之狀態。外部門106可藉由操作員手動操作進行開閉。上段之外部門106可定位於用以關閉收容室102之裝置外側開口端之關閉位置、及由關閉位置朝上方退離使 收容室102之裝置外側開口端開啟之開啟位置。下段之外部門106可定位於用以關閉收容室102之裝置外側開口端之關閉位置、及由關閉位置朝下方退離使收容室102之裝置外側開口端開啟之開啟位置。 The outer door 106 is attached in a state of being slidable in the vertical direction with respect to the outer side surface of the housing portion body 101. The external department 106 can be opened and closed by an operator's manual operation. The upper portion 106 can be positioned to close the closed position of the open end of the device for closing the receiving chamber 102, and to be retracted upward from the closed position. The open position of the open end of the outside of the device of the accommodating chamber 102 is opened. The lower portion 106 can be positioned at a closed position for closing the open end of the device outside the accommodating chamber 102, and an open position at which the open end of the device of the accommodating chamber 102 is opened downward by the closed position.

內部門107係安裝成可相對於收容部本體101內側面朝上下方向滑動之狀態。內部門107係配合樹脂塗布裝置1之動作自動開閉。上段之內部門107可定位於用以關閉收容室102之裝置內側開口端之關閉位置、及由關閉位置朝上方退離使收容室102之裝置內側開口端開啟之開啟位置。下段之內部門107可定位於用以關閉收容室102之裝置內側開口端之關閉位置、及由關閉位置朝下方退離使收容室102之裝置內側開口端開啟之開啟位置。 The inner door 107 is attached in a state of being slidable in the vertical direction with respect to the inner side surface of the housing portion body 101. The inner door 107 is automatically opened and closed in accordance with the operation of the resin coating device 1. The upper portion 107 can be positioned at a closed position for closing the open end of the inside of the device of the accommodating chamber 102, and an open position at which the open end of the device of the accommodating chamber 102 is opened upward by the closed position. The inner portion 107 of the lower stage can be positioned at a closed position for closing the open end of the inside of the apparatus of the containing chamber 102, and an open position for opening the inner open end of the apparatus of the containing chamber 102 from the closed position downward.

又,上段之外部門106及內部門107係於上端部形成有鎖定用之卡合孔113。下段之外部門106及內部門107係於下端部形成有鎖定用之卡合孔113。 Further, the upper portion 106 and the inner portion 107 are formed with locking engagement holes 113 at the upper end portion. The lower portion 106 and the inner portion 107 are formed with locking engagement holes 113 at the lower end portion.

呈上,本實施形態之晶匣收容部100係設置橫2列上下2段之內部門107及外部門106,並可朝上下方向開閉。因此,可縮小晶匣收容部100之左右方向尺寸,並可減少操作員在橫向並列配置複數加工裝置之工廠等之移動範圍,降低操作員之負擔。 In the wafer storage unit 100 of the present embodiment, the inner door 107 and the outer door 106 of the upper and lower two rows are arranged in two rows, and can be opened and closed in the vertical direction. Therefore, the size of the wafer housing portion 100 in the left-right direction can be reduced, and the movement range of the factory or the like in which the plurality of processing apparatuses are arranged side by side in the lateral direction can be reduced, and the burden on the operator can be reduced.

鎖定機構具有鎖定銷114及門感測器115,係分別對應各外部門106及各內部門107設於收容部本體101。上段之鎖定銷114係對應位於關閉位置之外部門106及內部門107之上端部配置。上段之門感測器115係配置於上段之鎖定銷 114附近、距離位於開啟位置之外部門106及內部門107之上端部較上方之處。下段之鎖定銷114係對應位於關閉位置之外部門106及內部門107之上端部配置。下段之門感測器115係配置於下段之鎖定銷114附近、距離位於開啟位置之外部門106及內部門107之下端部較下方之處。 The locking mechanism has a locking pin 114 and a door sensor 115, which are respectively disposed in the housing portion 101 corresponding to each of the external departments 106 and the internal departments 107. The locking pin 114 of the upper stage is disposed corresponding to the upper end of the department 106 and the inner door 107 outside the closed position. The upper door sensor 115 is configured as a locking pin in the upper stage Near the 114, the distance is higher than the upper end of the department 106 and the inner door 107 outside the open position. The locking pin 114 of the lower stage is disposed corresponding to the upper end of the department 106 and the inner door 107 outside the closed position. The lower door sensor 115 is disposed in the vicinity of the lock pin 114 of the lower stage, and is located below the lower end of the department 106 and the inner door 107 outside the open position.

鎖定銷114係設定成可因應門感測器115之檢測,在未予圖示之電磁圈等控制下出沒於收容部本體101之外側面及內側面。鎖定銷114係藉由未予圖示之回動彈簧賦予一朝向收容部本體101內側之勢能,並使電磁圈通電藉以對抗回動彈簧賦予之勢能而突出於收容部本體101外。藉由將鎖定銷114卡合於外部門106及內部門107之卡合孔113中,使外部門106及內部門107鎖定在關閉狀態。 The lock pin 114 is set so as to be incident on the outer side surface and the inner side surface of the accommodating portion main body 101 under the control of an electromagnetic coil (not shown) in response to the detection by the door sensor 115. The lock pin 114 is provided with a potential energy toward the inside of the accommodating portion body 101 by a return spring (not shown), and the electromagnetic coil is energized to protrude outside the accommodating portion body 101 against the potential energy imparted by the return spring. By engaging the lock pin 114 in the engagement hole 113 of the outer door 106 and the inner door 107, the outer door 106 and the inner door 107 are locked in the closed state.

關於門感測器115,以光感測器為例,係藉由外部門106及內部門107之遮蔽,檢測出外部門106及內部門107呈開啟狀態。外部門106用之門感測器115若檢測出外部門106呈開啟狀態,即向同收容室之內部門107用之鎖定銷114供給驅動電流。反之,內部門107用之門感測器115若檢測出內部門107呈開啟狀態,則向同收容室之外部門106用之鎖定銷114供給驅動電流。 Regarding the door sensor 115, taking the photo sensor as an example, it is detected by the external department 106 and the internal department 107 that the external department 106 and the internal department 107 are turned on. When the door sensor 115 for the outer door 106 detects that the outer door 106 is in the open state, the drive current is supplied to the lock pin 114 for the department 107 in the same receiving chamber. On the other hand, if the door sensor 115 for the internal door 107 detects that the inner door 107 is in the open state, the drive current is supplied to the lock pin 114 for the department 106 other than the storage room.

如此一來,鎖定機構係因應外部門106用之門感測器115對外部門106之檢測,使對應同一晶匣台103之內部門107用鎖定銷114鎖定內部門107。又,鎖定機構係因應內部門107用之門感測器115對內部門107之檢測,使對應同一晶匣台103之外部門106用鎖定銷114鎖定外部門106。因此, 外部門106及內部門107中任一方一滑離關閉位置,則任另一方不滑離關閉位置,從而可提高操作員之作業安全性。 In this way, the locking mechanism detects the external department 106 by the door sensor 115 used by the external department 106, so that the department 107 corresponding to the same wafer stage 103 locks the inner door 107 with the locking pin 114. Further, the locking mechanism detects the inner door 107 by the door sensor 115 for the inner door 107, so that the department 106 corresponding to the same wafer table 103 locks the outer door 106 with the locking pin 114. therefore, When either of the outer door 106 and the inner door 107 slides away from the closed position, the other side does not slip off the closed position, thereby improving the operator's work safety.

參照第4圖,說明外部門及內部門之開閉動作。第4圖係本實施形態之外部門及內部門之開閉動作之說明圖。另,第4圖中係就上段之外部門及內部門之開閉動作進行說明,但下段之外部門及內部門亦同。 Refer to Figure 4 to explain the opening and closing actions of the external department and the internal department. Fig. 4 is an explanatory view showing the opening and closing operations of the department and the internal department in the present embodiment. In addition, in Figure 4, the opening and closing actions of the departments and internal departments outside the upper section are explained, but the departments and internal departments outside the lower section are also the same.

如第4(a)圖所示,初期狀態係外部門106及內部門107位於關閉位置。此時,外部門106用之鎖定銷114係對準外部門106之卡合孔113,內部門107用之鎖定銷114係對準內部門107之卡合孔113。各鎖定銷114係藉由回動彈簧賦予之勢能置位於收容部本體101內,並位於對應之卡合孔113外。 As shown in Fig. 4(a), the initial state external department 106 and the internal department 107 are in the closed position. At this time, the locking pin 114 of the outer door 106 is aligned with the engaging hole 113 of the outer door 106, and the locking pin 114 of the inner door 107 is aligned with the engaging hole 113 of the inner door 107. Each of the locking pins 114 is placed in the housing portion 101 by the potential of the return spring and is located outside the corresponding engaging hole 113.

如第4(b)圖所示,操作員使外部門106向上方(開啟位置)滑動,則外部門106用之門感測器115受到外部門106遮蔽。外部門106用之門感測器115一經遮蔽,即檢測出外部門106呈開啟狀態,並對圍繞內部門107用鎖定銷114之電磁圈輸入驅動電流。隨之,驅動內部門107用之鎖定銷114反抗回動彈簧賦予之勢能,使鎖定銷114突出伸入內部門107之卡合孔113內。藉此可使內部門107以鎖定銷114鎖定在關閉狀態。 As shown in Fig. 4(b), the operator slides the outer door 106 upward (open position), and the door sensor 115 used by the outer door 106 is shielded by the outer door 106. Once the door sensor 115 is shielded by the outer door 106, the outer door 106 is detected to be in an open state, and the drive current is input to the inner door 107 by the electromagnetic coil of the lock pin 114. Accordingly, the driving inner portion 107 uses the locking pin 114 against the potential energy imparted by the return spring to cause the locking pin 114 to protrude into the engaging hole 113 of the inner door 107. Thereby, the inner door 107 can be locked in the closed state with the locking pin 114.

其次,由操作員將晶匣台103向外拉出,並於晶匣台103上載置前門呈開放式之晶匣4。此時,樹脂塗布裝置1經內部門107劃分為內側與外側,故可確保操作員之作業安全性。繼而,若操作員將外部門106滑至關閉位置,外部門106用之門感測器115露出,並停止對圍繞內部門107用鎖定銷 114之電磁圈輸入驅動電流。如此一來,內部門107用之鎖定銷114將因回動彈簧賦予之勢能推回收容部本體101側,使鎖定銷114由內部門107之卡合孔113退出。藉此可使呈關閉狀態之內部門107解鎖。 Next, the operator pulls the wafer table 103 outward, and places the front door open on the wafer table 103. At this time, the resin coating device 1 is divided into the inner side and the outer side via the inner door 107, so that the operator's work safety can be ensured. Then, if the operator slides the outer door 106 to the closed position, the outer door 106 exposes the door sensor 115 and stops the locking pin for the inner door 107. The electromagnetic coil of 114 inputs the drive current. In this way, the inner door 107 uses the locking pin 114 to push the potential energy given by the return spring to the side of the container body 101, so that the locking pin 114 is withdrawn from the engaging hole 113 of the inner door 107. Thereby, the department 107 in the closed state can be unlocked.

如第4(c)圖所示,第一工件傳送部200取出工件W時,內部門107向上方(開啟位置)滑動,使內部門107用之門感測器115受內部門107遮蔽。內部門107用之門感測器115一經遮蔽,即檢測出內部門107呈開啟狀態,並對圍繞外部門106用鎖定銷114之電磁圈輸入驅動電流。隨之,驅動外部門106用之鎖定銷114反抗回動彈簧賦予之勢能,使鎖定銷114突出伸入外部門106之卡合孔113內。藉此可使外部門106以鎖定銷114鎖定在關閉狀態。 As shown in Fig. 4(c), when the first workpiece transfer unit 200 takes out the workpiece W, the inner door 107 slides upward (open position), and the door sensor 115 for the inner door 107 is shielded by the inner door 107. The inner door 107 is shielded by the door sensor 115, that is, the inner door 107 is detected to be in an open state, and the drive current is input to the outer door 106 by the electromagnetic coil of the lock pin 114. Accordingly, the drive outer door 106 uses the lock pin 114 against the potential energy imparted by the return spring to cause the lock pin 114 to protrude into the engagement hole 113 of the outer door 106. Thereby the outer door 106 can be locked in the closed state with the locking pin 114.

藉此構造,第一工件傳送部200取出工件W時,操作員無法打開外部門106,故可確保操作員之作業安全性。其次,一經第一工件傳送部200由晶匣4取出全部工件W,則內部門107滑動至關閉位置使內部門107用之門感測器115露出,並停止對圍繞外部門106用鎖定銷114之電磁圈輸入驅動電流。如此一來,外部門106用之鎖定銷114將因回動彈簧賦予之勢能推回收容部本體101側,使鎖定銷114由外部門106之卡合孔113退出。藉此可使呈關閉狀態之外部門106解鎖。 With this configuration, when the first workpiece transfer unit 200 takes out the workpiece W, the operator cannot open the outer door 106, so that the operator's work safety can be ensured. Next, once the first workpiece transfer unit 200 takes out all the workpieces W from the wafer 4, the inner door 107 slides to the closed position to expose the door sensor 115 for the inner door 107, and stops the locking pin 114 for the surrounding outer door 106. The electromagnetic coil inputs the drive current. In this way, the outer door 106 uses the locking pin 114 to push the potential energy given by the return spring to the side of the container body 101, so that the locking pin 114 is withdrawn from the engaging hole 113 of the outer door 106. Thereby, the department 106 outside the closed state can be unlocked.

另,本實施形態係分別將搬入側之晶匣4載置於上段之晶匣台103、將搬出側之晶匣5載置於下段之晶匣台103,但並非以此為限,亦可將搬出側之晶匣5載置於上段之晶匣台 103、將搬入側之晶匣4載置於下段之晶匣台103。此外,亦可將搬入側之晶匣4與搬出側之晶匣5分左右載置於晶匣台103。 In the present embodiment, the wafer 4 on the loading side is placed on the wafer stage 103 in the upper stage, and the wafer 5 on the carrying side is placed on the wafer stage 103 in the lower stage, but not limited thereto. Place the wafer 5 on the carry-out side in the upper stage 103. The wafer 4 on the loading side is placed on the wafer stage 103 of the lower stage. Further, the wafer 4 on the loading side and the wafer on the carry-out side may be placed on the wafer table 103 for about 5 minutes.

又,本實施形態係形成有左右一對且上下2段之4個晶匣用收容室,但收容室之數目可適當加以變更。可僅形成2個收容室,亦可形成4個以上。 Further, in the present embodiment, four storage chambers for the wafers are formed in a pair of right and left and two upper and lower stages, but the number of the storage chambers can be appropriately changed. Only two storage chambers may be formed, or four or more may be formed.

又,本實施形態係於收容室設有外部門106,但亦可不設外部門106。且,外部門106非以滑動式門為限,亦可為迴旋式門。另,外部門106不限定手動開閉之構造,亦可為半自動開閉之構造。 Further, in the present embodiment, the external department 106 is provided in the storage room, but the external department 106 may not be provided. Moreover, the outer door 106 is not limited to a sliding door, and may also be a swing door. In addition, the external department 106 does not limit the structure of manual opening and closing, and may be a semi-automatic opening and closing structure.

又,本實施形態係做成以上下2段之滑動板104、105拉出晶匣台103之構造,但亦可做成以1個滑動板拉出之構造。且,亦可做成僅將下段之晶匣台103向裝置外側拉出,上段之晶匣台13不向裝置外側拉出之構造。另,亦可使晶匣4隨著外部門106朝開啟位置滑動而向裝置外側拉出。 Further, in the present embodiment, the slide plates 104 and 105 of the lower two stages are configured to pull out the wafer table 103. However, the structure may be pulled out by one slide plate. Further, it is also possible to adopt a structure in which only the lower stage wafer stage 103 is pulled out to the outside of the apparatus, and the upper stage wafer stage 13 is not pulled out to the outside of the apparatus. Alternatively, the wafer 4 can be pulled out toward the outside of the apparatus as the outer door 106 slides toward the open position.

又,本實施形態中,鎖定機構係藉由門感測器115與鎖定銷114鎖定外部門106及內部門107,但並非以此為限。鎖定機構只要在同一收容室102之外部門106及內部門107中任一方呈開啟狀態時,將任另一方鎖定在關閉狀態即可。 Further, in the present embodiment, the lock mechanism locks the outer door 106 and the inner door 107 by the door sensor 115 and the lock pin 114, but is not limited thereto. When the locking mechanism is in the open state of either the department 106 or the internal department 107 other than the same storage chamber 102, the other one may be locked in the closed state.

又,本實施形態係於收容部本體101設有鎖定機構,但亦可做成不設鎖定機構之構造。且,設置鎖定機構者,做成至少於內部門107呈開啟狀態時,將外部門106鎖定在關閉狀態即可。 Further, in the present embodiment, the accommodating portion main body 101 is provided with a locking mechanism, but a structure in which no locking mechanism is provided may be employed. Further, when the locking mechanism is provided, it is sufficient that the outer door 106 is locked in the closed state when the inner door 107 is in the open state.

回到第1圖,針對第一工件傳送部、工件檢測部、第二 工件傳送部、薄片切割部進行說明。如第1圖所示,第一工件傳送部200係支持於一對配置於外部框體2底壁部並與Y軸方向平行之導軌201上,並可藉由滾珠螺桿式移動機構沿Y軸方向移動。又,第一工件傳送部200係具有可沿上下方向移動之支持台202、設於支持台202上之多連桿機構203、及設於多連桿機構203前端之工件保持部204。 Returning to Fig. 1, for the first workpiece transfer portion, the workpiece detecting portion, and the second The workpiece transfer unit and the sheet cutting unit will be described. As shown in Fig. 1, the first workpiece transfer unit 200 is supported by a pair of guide rails 201 disposed on the bottom wall portion of the outer casing 2 and parallel to the Y-axis direction, and can be moved along the Y-axis by a ball screw type moving mechanism. Move in direction. Further, the first workpiece transfer unit 200 has a support table 202 that is movable in the vertical direction, a multi-link mechanism 203 provided on the support table 202, and a workpiece holding unit 204 provided at the tip end of the multi-link mechanism 203.

支持台202係藉由未予圖示之Z軸馬達上下移動,使工件保持部204在高度方向上調正。多連桿機構203係由三連桿構成,並使工件保持部204於水平方向上調正。第一工件傳送部200係藉由控制滾珠螺桿式移動機構、支持台202、多連桿機構203之驅動,於搬入側之晶匣4與工件檢測部400間、薄片切割部500與搬出側之晶匣5間傳送工件W。 The support table 202 is moved up and down by a Z-axis motor (not shown) to adjust the workpiece holding portion 204 in the height direction. The multi-link mechanism 203 is composed of three links and adjusts the workpiece holding portion 204 in the horizontal direction. The first workpiece transfer unit 200 is driven between the wafer 4 on the carry-in side and the workpiece detecting unit 400, and on the sheet cutting unit 500 and the carry-out side by controlling the driving of the ball screw type moving mechanism, the support table 202, and the multi-link mechanism 203. The workpiece W is transferred between the wafers 5.

工件檢測部400係具有一供第一工件傳送部200所傳送之工件W暫置之暫置桌401、及一用以拍攝暫置桌401上之工件W之攝影部402。暫置桌401係形成直徑小於工件W之圓板狀。攝影部402係配置成藉由L字形之臂部403支持於暫置桌401上方,將暫置桌401上之工件W全體納入拍攝範圍之狀態。攝影部402讀取工件W之外形,並將工件W之影像數據輸出至控制部6。控制部6則算出工件W在水平方向上之朝向或中心位置。 The workpiece detecting unit 400 has a temporary table 401 for temporarily placing the workpiece W conveyed by the first workpiece transfer unit 200, and a photographing unit 402 for photographing the workpiece W on the temporary table 401. The temporary table 401 is formed into a disk shape having a diameter smaller than that of the workpiece W. The photographing unit 402 is disposed such that the L-shaped arm portion 403 is supported above the temporary table 401, and the entire workpiece W on the temporary table 401 is placed in the imaging range. The photographing unit 402 reads the shape of the workpiece W and outputs the image data of the workpiece W to the control unit 6. The control unit 6 calculates the orientation or center position of the workpiece W in the horizontal direction.

第二工件傳送部300係支持於一對配置於外部框體2底壁部並與X軸方向平行之導軌301上,並可藉由滾珠螺桿式移動機構沿X軸方向移動。又,第二工件傳送部300具有與第一工件傳送部200同樣之支持台302、多連桿機構303、及 工件保持部304。第二工件傳送部300係因應工件檢測部400之檢測結果控制滾珠螺桿式移動機構、支持台302、多連桿機構303之驅動,藉以於工件檢測部400與按壓部604間、台部602與薄片切割部500間將工件W定位於適當之傳送位置。 The second workpiece transfer unit 300 is supported by a pair of guide rails 301 disposed on the bottom wall portion of the outer casing 2 and parallel to the X-axis direction, and is movable in the X-axis direction by the ball screw type moving mechanism. Further, the second workpiece transfer unit 300 has a support table 302, a multi-link mechanism 303, and the same as the first workpiece transfer unit 200. The workpiece holding portion 304. The second workpiece transfer unit 300 controls the driving of the ball screw type moving mechanism, the support table 302, and the multi-link mechanism 303 in response to the detection result of the workpiece detecting unit 400, whereby the workpiece detecting unit 400 and the pressing unit 604 and the table portion 602 are The workpiece W is positioned between the sheet cutting portions 500 at an appropriate transfer position.

薄片切割部500係具有一安裝於座台3下部之旋轉台501、及一由旋轉台501外周面向外突出之切刀502。旋轉台501係形成可繞Z軸旋轉、且可沿Z軸方向移動之狀態。切刀502係配合工件W之外形尺寸調整刀刃之位置。薄片切割部500對配置於下方之附薄片S之工件W,藉由旋轉台501沿Z軸方向移動調整對薄片S之切入深度,並利用旋轉台501之旋轉沿工件W之外形切割薄片S。 The sheet cutting portion 500 has a rotary table 501 attached to the lower portion of the table 3, and a cutter 502 projecting outward from the outer circumferential surface of the rotary table 501. The rotary table 501 is in a state of being rotatable about the Z axis and movable in the Z-axis direction. The cutter 502 adjusts the position of the blade in accordance with the shape of the workpiece W. The sheet cutting unit 500 adjusts the depth of cut of the sheet S by the rotation of the rotary table 501 in the Z-axis direction with respect to the workpiece W disposed on the lower sheet S, and cuts the sheet S along the workpiece W by the rotation of the rotary table 501.

參照第1圖及第5圖詳細說明黏附裝置。第5圖係本實施形態之黏附裝置之截面示意圖。 The adhesion device will be described in detail with reference to Figs. 1 and 5. Fig. 5 is a schematic cross-sectional view showing the adhering device of the embodiment.

如第1圖及第5圖所示,黏附裝置600係具有略長方體狀之基台601。基台601上表面之略前半部,設置有用以吸附保護用薄片S之台部602。台部602係藉由石英等透光性材料形成圓板狀。台部602之上表面中央形成有上視呈圓形之凹部651。台部602利用該凹部651之階差,拉伸並吸附薄片S以消除薄片S之皺紋。台部602附近設有用以於薄片S上表面供給液狀樹脂之樹脂供給部603。 As shown in FIGS. 1 and 5, the adhesion device 600 is a base 601 having a substantially rectangular parallelepiped shape. The front half of the upper surface of the base 601 is provided with a table portion 602 for adsorbing the protective sheet S. The stage portion 602 is formed in a disk shape by a light transmissive material such as quartz. A concave portion 651 having a circular shape in a top view is formed at the center of the upper surface of the table portion 602. The stage portion 602 stretches and adsorbs the sheet S by the step of the concave portion 651 to eliminate the wrinkles of the sheet S. A resin supply portion 603 for supplying a liquid resin to the upper surface of the sheet S is provided in the vicinity of the table portion 602.

樹脂供給部603係安裝成可配合黏附裝置600之動作,於基台601上表面迴旋於薄片S之中央位置、與自中央位置退離之退離位置間之狀態。液狀樹脂係使用紫外線硬化性 樹脂等光硬化性樹脂,舉例言之,可選擇具有黏度約50~30000[MPa]之樹脂。樹脂供給部603係連接設於基台601內之未予圖示之樹脂槽,並將自樹脂槽汲取之液狀樹脂供給於薄片S上表面。 The resin supply unit 603 is attached to the state in which the adhesion device 600 is attached, and the upper surface of the base 601 is rotated between the center position of the sheet S and the retracted position retreating from the center position. Liquid resin is UV curable A photocurable resin such as a resin, for example, a resin having a viscosity of about 50 to 30,000 [MPa] can be selected. The resin supply unit 603 is connected to a resin tank (not shown) provided in the base 601, and supplies the liquid resin picked up from the resin tank to the upper surface of the sheet S.

基台601上表面之略後半部,立設有用以將按壓部604支持於台部602上方之柱狀部605。柱狀部605前面設有用以使按壓部604接近及退離台部602之移動部606。移動部606係具有一對與Z軸方向平行之導軌611、及設置成可於一對導軌611上滑動之Z軸桌板612。Z軸桌板612係構成可藉由滾珠螺桿式移動機構沿Z軸方向移動之狀態。Z軸桌板612前面藉由支持部613支持按壓部604。 A slightly rear half of the upper surface of the base 601 is provided with a columnar portion 605 for supporting the pressing portion 604 above the table portion 602. A moving portion 606 for bringing the pressing portion 604 toward and away from the table portion 602 is provided in front of the columnar portion 605. The moving portion 606 has a pair of guide rails 611 that are parallel to the Z-axis direction, and a Z-axis table 612 that is slidable on the pair of guide rails 611. The Z-axis table 612 is configured to be movable in the Z-axis direction by the ball screw type moving mechanism. The pressing portion 604 is supported by the support portion 613 on the front of the Z-axis table 612.

按壓部604係具有安裝於支持部613下部之基底構件621。基底構件621下表面形成有上視呈圓形之凹部622。基底構件621之凹部622中,收容有呈止拔狀態之按壓板623。按壓板623下表面安裝有用以吸附保持工件W之保持板624。於保持板624形成有用以吸引保持工件W之吸引口。吸引口係藉由設於黏附裝置600內之通路631連接氣體吸引部632。氣體吸引部632係藉由通路631使保持板624之吸引口產生吸力。 The pressing portion 604 has a base member 621 attached to a lower portion of the support portion 613. A concave portion 622 having a circular shape in a top view is formed on the lower surface of the base member 621. In the recessed portion 622 of the base member 621, a pressing plate 623 that is in a pulled-out state is housed. A holding plate 624 for holding and holding the workpiece W is attached to the lower surface of the pressing plate 623. The retaining plate 624 is formed to attract a suction port that holds the workpiece W. The suction port is connected to the gas suction portion 632 by a passage 631 provided in the adhesion device 600. The gas suction portion 632 causes suction at the suction port of the holding plate 624 by the passage 631.

保持板624之吸引口與氣體吸引部632間之通路631中係設有用以測量通路631內之壓力之壓力感測器633。壓力感測器633係檢測保持板624之吸附力降低、或工件W自吸引口脫落(位移)等。按壓部604係進行將保持於保持板624之工件W緊壓在業經供給液狀樹脂L之薄片S上之動作。 即,保持板624之用以保持工件W之保持面,係成為用以對薄片S按壓工件W之按壓面634。藉此構造,可使工件W下表面全區均勻布滿液狀樹脂。 A pressure sensor 633 for measuring the pressure in the passage 631 is provided in the passage 631 between the suction port of the holding plate 624 and the gas suction portion 632. The pressure sensor 633 detects that the suction force of the holding plate 624 is lowered, or the workpiece W is detached (displaced) from the suction port, or the like. The pressing portion 604 performs an operation of pressing the workpiece W held by the holding plate 624 against the sheet S through which the liquid resin L is supplied. That is, the holding surface of the holding plate 624 for holding the workpiece W is a pressing surface 634 for pressing the workpiece W against the sheet S. With this configuration, the entire surface of the lower surface of the workpiece W can be uniformly filled with the liquid resin.

又,基底構件621之凹部622內底面與按壓板623之上表面間,設有作為壓力感測器之按壓感測器635。按壓感測器635係藉由保持板624及按壓板623,檢測由液狀樹脂作用於按壓面634之壓力變化。作用於按壓面634之壓力係隨著液狀樹脂L向工件W外緣擠壓流布而增加,一旦溢出工件W外緣則開始降低。黏附裝置600利用此一特性,因應按壓力之變化調整移動部606之驅動量,以使液狀樹脂L佈及工件W外緣。 Further, between the bottom surface of the concave portion 622 of the base member 621 and the upper surface of the pressing plate 623, a pressing sensor 635 as a pressure sensor is provided. The pressing sensor 635 detects the pressure change of the liquid resin acting on the pressing surface 634 by the holding plate 624 and the pressing plate 623. The pressure acting on the pressing surface 634 increases as the liquid resin L is pressed against the outer edge of the workpiece W, and starts to decrease once the outer edge of the workpiece W overflows. The adhesive device 600 utilizes this characteristic to adjust the driving amount of the moving portion 606 in accordance with the change in pressure so that the liquid resin L and the outer edge of the workpiece W are formed.

另,舉例言之,黏附裝置600亦可於按壓感測器635檢測出達預先設定之臨界值以上之壓力時,停止移動部606對按壓部604之驅動。又,舉例言之,黏附裝置600亦可於按壓感測器635檢測出壓力降低時,停止移動部606對按壓部604之驅動。如此一來,本實施形態之黏附裝置600可因應液狀樹脂之壓力變化調整按壓部604之壓入量。因此,因應按壓面634與台部602上表面之間隔調整按壓部604之壓入量時,不致於因工件W或薄片S之尺寸誤差、樹脂之塗布量誤差等而導致液狀樹脂之塗布範圍不均。總而言之,黏附樹脂時,考慮到若有未黏附樹脂之部位則磨削時將產生工件W破裂等,且溢出之樹脂量若過多不僅浪費樹脂,溢出之部分更因氧氣阻隔無法充分經紫外線硬化,造成傳送與磨削時之問題。進而,更有過度溢出之樹脂於磨削時捲入, 誘發磨削異常之可能性。考慮到該等因素,樹脂宜為恰好布滿於工件W全面之狀態或由工件W略微溢出之狀態,凡依壓力調整按壓部604之壓入量,可維持上述理想之黏附狀態。 In addition, for example, the adhesion device 600 may stop the driving of the pressing portion 604 by the moving portion 606 when the pressing sensor 635 detects a pressure equal to or greater than a predetermined threshold value. Further, for example, the adhesion device 600 may stop the driving of the pressing portion 604 by the moving portion 606 when the pressing sensor 635 detects a decrease in pressure. As a result, the adhesion device 600 of the present embodiment can adjust the amount of pressing of the pressing portion 604 in response to the pressure change of the liquid resin. Therefore, when the pressing amount of the pressing portion 604 is adjusted in accordance with the interval between the pressing surface 634 and the upper surface of the table portion 602, the coating range of the liquid resin is not caused by the dimensional error of the workpiece W or the sheet S, the coating amount error of the resin, or the like. Uneven. In short, when the resin is adhered, it is considered that if there is a portion where the resin is not adhered, the workpiece W may be broken during grinding, and if the amount of the resin overflowed is excessively wasteful of the resin, the overflow portion may not be sufficiently cured by ultraviolet rays due to the oxygen barrier. Causes problems during transfer and grinding. Furthermore, the resin which is excessively overflowing is involved in the grinding, The possibility of inducing grinding anomalies. In consideration of such factors, the resin is preferably in a state of being completely covered with the workpiece W or slightly overflowing from the workpiece W, and the pressing amount of the pressing portion 604 is adjusted according to the pressure to maintain the desired adhesion state.

基台601內設置有用以向台部602照射紫外光等光線之發光部636。發光部636藉由經台部602照射之光線使液狀樹脂L硬化,於工件W與薄片S間形成樹脂膜。發光部636之照射係於按壓部604之緊壓動作完畢後,即,按壓部604離開工件W後進行。藉此,可使工件W無內部應力殘留並對工件W形成樹脂膜。 A light-emitting portion 636 for irradiating the table portion 602 with light such as ultraviolet light is provided in the base 601. The light-emitting portion 636 cures the liquid resin L by the light irradiated through the stage portion 602, and forms a resin film between the workpiece W and the sheet S. The irradiation of the light-emitting portion 636 is performed after the pressing operation of the pressing portion 604 is completed, that is, after the pressing portion 604 is separated from the workpiece W. Thereby, the workpiece W can be left without internal stress and the resin W can be formed on the workpiece W.

又,黏附裝置600係設有一用以檢測保持板624與台部602之間隔之間隔檢測設備。間隔檢測設備係於由保持板624之吸引口向台部602噴射空氣之狀態下,使保持板624接近台部602,並測量通路631內之壓力變化,藉以檢測保持板624與台部602之間隔。間隔檢測設備之構造包含一設於黏附裝置600並藉由通路631連接吸引口之氣體供給部637、與上述控制部6之處理器及記憶體等。 Further, the adhesion device 600 is provided with an interval detecting device for detecting the interval between the holding plate 624 and the table portion 602. The interval detecting device causes the holding plate 624 to approach the table portion 602 in a state where the air is ejected from the suction port of the holding plate 624 to the table portion 602, and measures the pressure change in the path 631, thereby detecting the interval between the holding plate 624 and the table portion 602. . The structure of the interval detecting device includes a gas supply unit 637 provided in the adhesion device 600 and connected to the suction port via the passage 631, a processor and a memory of the control unit 6, and the like.

壓力感測器633並用以於吸附工件W時測量通路631內之吸氣壓力,且構成亦可於檢測間隔時測量通路631內之排氣壓力之狀態。又,記憶體儲存有用以呈現通路631內對保持板624與台部602之間隔變化所產生之壓力變化之映射圖(map)。該映射圖係於預先由吸引口噴射空氣之狀態下,使保持板624接近台部602,同時以壓力感測器633測量通路631內之壓力而生成。處理器係依據記憶體所儲存之映射圖 與壓力感測器633之測量結果,算出保持板624與台部602之間隔。 The pressure sensor 633 is used to measure the suction pressure in the passage 631 when the workpiece W is adsorbed, and constitutes a state in which the exhaust pressure in the passage 631 can also be measured at the detection interval. Moreover, the memory is stored to present a map of pressure changes in the path 631 that change the spacing between the holding plate 624 and the table portion 602. This map is generated by the pressure sensor 633 measuring the pressure in the passage 631 while the holding plate 624 is approaching the table portion 602 in a state where the air is previously ejected from the suction port. The processor is based on the map stored in the memory. The distance between the holding plate 624 and the table portion 602 is calculated from the measurement result of the pressure sensor 633.

黏附裝置600係藉由以間隔檢測設備檢測保持板624與台部602之間隔,於運轉前之維修時實施按壓部604之裝配作業。黏附裝置600將壓力感測器633作為用以測量通路631內之吸氣壓力之感測器使用外,亦作為背壓感測器使用。因此,利用保持板624中吸附工件W用之既有之通路631及壓力感測器633,可構成裝配機構。如此一來,本實施形態之黏附裝置600不需重新設置位置感測器,即可藉由價廉且簡易之構造實施裝配作業。 The adhesion device 600 detects the interval between the holding plate 624 and the table portion 602 by the interval detecting device, and performs the assembling operation of the pressing portion 604 at the time of maintenance before the operation. The adhesion device 600 uses the pressure sensor 633 as a sensor for measuring the suction pressure in the passage 631, and is also used as a back pressure sensor. Therefore, the assembly mechanism can be constructed by using the existing passage 631 and the pressure sensor 633 for holding the workpiece W in the holding plate 624. In this way, the adhesion device 600 of the present embodiment can perform the assembly work by an inexpensive and simple structure without resetting the position sensor.

參照第6圖及第7圖,說明黏附裝置之黏附動作。第6圖係本實施形態之黏附裝置之黏附動作之說明圖。第7圖所示者係本實施形態中按壓感測器之測定值與移動部開始移動後之經過時間之一般關係。另,第7圖中,分別以縱軸表示按壓感測器之測定值,以橫軸表示移動部開始移動後之經過時間。 Referring to Figures 6 and 7, the adhesion of the adhesion device will be described. Fig. 6 is an explanatory view showing the adhesion operation of the adhering device of the present embodiment. The figure shown in Fig. 7 is a general relationship between the measured value of the pressing sensor and the elapsed time after the moving portion starts moving in the present embodiment. In addition, in Fig. 7, the measured value of the pressing sensor is indicated by the vertical axis, and the elapsed time after the moving portion starts moving is indicated by the horizontal axis.

如第6(a)圖所示,初期狀態係薄片S吸附保持於台部602上,且保持有工件W之按壓部604定位於台部602上方。薄片S中央形成有樹脂供給部603所供給之液狀樹脂L之積液。由該狀態開始藉由移動部606令按壓部604向下移動,使工件W壓散液狀樹脂L之積液。 As shown in Fig. 6(a), in the initial state, the sheet S is adsorbed and held on the table portion 602, and the pressing portion 604 holding the workpiece W is positioned above the table portion 602. The liquid of the liquid resin L supplied from the resin supply unit 603 is formed in the center of the sheet S. From this state, the moving portion 606 causes the pressing portion 604 to move downward, and the workpiece W is pressed against the liquid of the liquid resin L.

如第6(b)圖所示,按壓部604向下移動,使工件W接觸液狀樹脂L,則工件W壓散液狀樹脂,使液狀樹脂L沿工件W下表面開始擴散。此時,藉由設於按壓部604之按壓感測 器635,開始測量液狀樹脂L經由工件W作用於按壓面634之壓力變化。如第7圖所示,由該初期狀態至對應第6(b)圖之時點t1間,藉由工件W與液狀樹脂L之接觸,使作用於按壓面634之負載(壓力)穩定增加。 As shown in Fig. 6(b), when the pressing portion 604 is moved downward to bring the workpiece W into contact with the liquid resin L, the workpiece W is pressed against the liquid resin, and the liquid resin L is caused to spread along the lower surface of the workpiece W. At this time, the pressing is provided by the pressing portion 604 The 635 starts measuring the pressure change of the liquid resin L acting on the pressing surface 634 via the workpiece W. As shown in Fig. 7, the load (pressure) acting on the pressing surface 634 is stably increased by the contact of the workpiece W with the liquid resin L from the initial state to the time t1 corresponding to the sixth (b) figure.

如第6(c)圖所示,若由第6(b)圖所示之狀態將按壓部604再向下移動,則工件W繼續壓散液狀樹脂L,使液狀樹脂L散佈至工件W外緣前。如第7圖所示,由對應第6(b)圖之時點t1至對應第6(c)圖之時點t2間,隨著液狀樹脂L向工件W外緣擴散,作用於按壓面634之負載更為增加。 As shown in Fig. 6(c), if the pressing portion 604 is moved downward by the state shown in Fig. 6(b), the workpiece W continues to disperse the liquid resin L, and the liquid resin L is dispersed to the workpiece. W before the outer edge. As shown in Fig. 7, between the time t1 corresponding to the sixth (b) figure and the time t2 corresponding to the sixth (c) figure, the liquid resin L is diffused toward the outer edge of the workpiece W, and acts on the pressing surface 634. The load is even more increased.

如第6(d)圖所示,若由第6(c)圖所示之狀態將按壓部604再向下移動,則工件W再繼續壓散液狀樹脂L,使液狀樹脂L略溢出工件W外緣。此時,藉由設於按壓部604之按壓感測器635,測出液狀樹脂L經由工件W作用於按壓面634之壓力減少。如第7圖所示,由對應第6(c)圖之時點t2至對應第6(d)圖之時點t3間,作用於按壓面634之負載隨著液狀樹脂L到達工件W外緣而增加,且液狀樹脂L溢出工件W外緣時作用於按壓面634之負載減少。 As shown in Fig. 6(d), if the pressing portion 604 is moved downward by the state shown in Fig. 6(c), the workpiece W continues to disperse the liquid resin L, causing the liquid resin L to slightly overflow. The outer edge of the workpiece W. At this time, the pressing force sensor 635 provided in the pressing portion 604 detects that the pressure of the liquid resin L acting on the pressing surface 634 via the workpiece W is reduced. As shown in Fig. 7, the load acting on the pressing surface 634 reaches the outer edge of the workpiece W with the liquid resin L from the time point t2 corresponding to the sixth (c) figure to the time t3 corresponding to the sixth (d) figure. When the liquid resin L overflows the outer edge of the workpiece W, the load acting on the pressing surface 634 is reduced.

由此可知,作用於按壓面634之負載係以液狀樹脂L到達工件W外緣之時點為頂點開始產生變化。因此,亦可在該頂點前預設臨界值,當按壓感測器635測出臨界值以上之負載時,停止移動部606移動按壓部604。舉例言之,對於對應時點t2負載設臨界值,使按壓部604於時點t2停止移動。藉此,可將液狀樹脂L擴展至工件W外緣附近,使工件W幾近全區布滿液狀樹脂L。 From this, it can be seen that the load acting on the pressing surface 634 starts to change when the liquid resin L reaches the outer edge of the workpiece W as a vertex. Therefore, the threshold value may be preset before the vertex, and when the pressing sensor 635 detects a load equal to or greater than the critical value, the moving portion 606 is stopped from moving the pressing portion 604. For example, the threshold value is set for the corresponding time point t2, and the pressing portion 604 is stopped at the time point t2. Thereby, the liquid resin L can be expanded to the vicinity of the outer edge of the workpiece W, so that the liquid W is almost completely filled with the liquid resin L.

又,作用於按壓面634之負載係以頂點為界開始降低,因此亦可於按壓感測器635檢測出負載相對於前一次測出之負載降低時,停止移動部606移動按壓部604。舉例言之,於負載開始降低之時點t3使按壓部604停止移動。因此,可將液狀樹脂L擴展至稍微溢出工件W外緣之程度,使工件W下表面全區布滿液狀樹脂L。另,用以顯示壓力變化之圖表之曲線形狀係隨樹脂之塗布量或黏度、樹脂散佈面積而改變。 Further, since the load acting on the pressing surface 634 starts to decrease with the apex as the boundary, the pressing portion 604 can be stopped when the pressing sensor 635 detects that the load is reduced with respect to the previous measured load. For example, the pressing portion 604 stops moving at a point t3 at which the load starts to decrease. Therefore, the liquid resin L can be expanded to a degree that slightly overflows the outer edge of the workpiece W, so that the entire surface of the lower surface of the workpiece W is filled with the liquid resin L. Further, the shape of the graph for displaying the pressure change is changed depending on the coating amount or viscosity of the resin and the resin scattering area.

參照第8圖,具體說明按壓感測器之測量結果之一例。第8圖所示者係本實施形態中按壓感測器之測量結果之一例。另,第8圖中,分別以縱軸表示按壓感測器之測量值、以橫軸表示移動部開始移動後之經過時間。 An example of the measurement result of the pressing sensor will be specifically described with reference to Fig. 8. The figure shown in Fig. 8 is an example of the measurement result of the pressing sensor in the present embodiment. In addition, in Fig. 8, the measured value of the pressing sensor is indicated by the vertical axis, and the elapsed time after the moving portion starts moving is indicated by the horizontal axis.

以黏附裝置600進行黏附動作,於2~4吋左右之晶圓全面塗布液量達可形成厚度約100~1000[μm]之薄膜程度之樹脂(黏度約1500[CPs]),以按壓感測器635測量作用於按壓面634之負載時,測得如第8圖所示之測量結果。另,在此係設定移動部606驅動按壓部604之移動速度為0.1[mm/sec],並設定按壓感測器635之測量頻率為1次100[msec]。由0[sec]至25[sec]之間,負載由0[kN]穩定增加至0.1[kN]。由25[sec]至28[sec]之間,負載由0.1[kN]急遽增加至1.3[kN]。28[sec]之後,負載由1.3[kN]急遽減少。 Adhesive device 600 performs adhesion operation, and the total amount of the coating liquid on the wafer of about 2 to 4 Å reaches a film thickness of about 100 to 1000 [μm] (viscosity about 1500 [CPs]) for pressing sensing. When measuring the load acting on the pressing surface 634, the 635 measures the measurement result as shown in Fig. 8. In this case, the moving speed of the pressing unit 604 by the movement unit 606 is set to 0.1 [mm/sec], and the measurement frequency of the pressing sensor 635 is set to be 100 [msec] once. From 0 [sec] to 25 [sec], the load is steadily increased from 0 [kN] to 0.1 [kN]. Between 25 [sec] and 28 [sec], the load is increased from 0.1 [kN] to 1.3 [kN]. After 28 [sec], the load is reduced by 1.3 [kN].

由該測量結果可知,測出負載1.3[kN]時,液狀樹脂L到達工件W外緣。又,測出負載1.2[kN]時,與測出負載1.3[kN]時,按壓部604之移動位置幾無差異。因此,移動部 606之停止條件可將臨界值設為1.2[kN],以於液狀樹脂L大約到達工件W外緣時,停止移動部606之驅動。 From the measurement results, it was found that when the load 1.3 [kN] was measured, the liquid resin L reached the outer edge of the workpiece W. Further, when the load 1.2 [kN] is measured, when the load is 1.3 [kN], the moving position of the pressing portion 604 is slightly different. Therefore, the mobile department The stop condition of 606 can be set to 1.2 [kN] to stop the driving of the moving portion 606 when the liquid resin L reaches the outer edge of the workpiece W.

參照第9圖及第10圖,說明黏附裝置之裝配作業。第9圖所示者係本實施形態中壓力感測器對保持板-台部間之間隙變化之測量結果所呈現之映射圖之一例。第10圖係本實施形態之黏附裝置之裝配作業說明圖。第9圖係分別以縱軸表示壓力感測器之測定值,以橫軸表示保持部與台部之間隙。 The assembly work of the adhesion device will be described with reference to Figs. 9 and 10. The figure shown in Fig. 9 is an example of a map showing the measurement result of the change in the gap between the holding plate and the table portion by the pressure sensor in the present embodiment. Fig. 10 is an explanatory view showing the assembly work of the adhering device of the present embodiment. In the ninth figure, the measured value of the pressure sensor is indicated by the vertical axis, and the gap between the holding portion and the land is indicated by the horizontal axis.

在裝配作業前,由吸引口噴射空氣之狀態下,改變保持板624與台部602之間隔同時測量通路631內之壓力後,生成第9圖所示之映射圖。另,在此設定氣體供給部637之空氣供給流量為25[L/min],並以10[μm]之間隔縮小保持板624與台部602間之間隙,再以壓力感測器633施以測量。如映射圖所示,壓力感測器633之測定值係隨保持板624接近台部602而增加。黏附裝置600係參照該圖,設定以保持板624距離台部602之希望高度為基準位置,再實施裝配作業。 Before the assembly work, the air in the suction port is ejected, and the pressure in the passage 631 is measured while changing the interval between the holding plate 624 and the table portion 602, and then the map shown in Fig. 9 is generated. Further, the air supply flow rate of the gas supply unit 637 is set to 25 [L/min], and the gap between the holding plate 624 and the table portion 602 is narrowed at intervals of 10 [μm], and then applied by the pressure sensor 633. measuring. As shown in the map, the measured value of the pressure sensor 633 increases as the holding plate 624 approaches the table portion 602. Referring to the drawing, the bonding apparatus 600 sets the holding position of the holding plate 624 from the desired height of the table portion 602 as a reference position, and performs an assembly operation.

具體言之,如第10(a)圖所示,將保持板624定位於完全離開台部602之位置,並藉由氣體供給部637由吸引口噴射空氣。此時,因保持板624-台部602間之間隙大,故可確保吸引口噴射之空氣之外逸道路,並保持通路631內為低壓力。由該狀態開始驅動移動部606使保持板624向台部602接近,則保持板624-台部602間之間隙逐漸縮小。因此,由吸引口噴射之空氣之外逸道路縮小,通路631內之壓力開始增加。 Specifically, as shown in Fig. 10(a), the holding plate 624 is positioned at a position completely away from the table portion 602, and air is ejected from the suction port by the gas supply portion 637. At this time, since the gap between the holding plate 624 and the table portion 602 is large, it is possible to ensure that the air blown by the suction port escapes the road and keep the inside of the passage 631 low. When the moving portion 606 is driven in this state and the holding plate 624 approaches the table portion 602, the gap between the holding plate 624 and the table portion 602 is gradually reduced. Therefore, the air escaped by the suction port is reduced, and the pressure in the passage 631 starts to increase.

如第10(b)圖所示,映射圖上與保持板624-台部602間之希望間隙相對應之壓力,一經壓力感測器633測出,則移動部606停止驅動。此時保持板624距離台部602之高度位置設為按壓方向上之基準位置。舉例言之,保持板624-台部602間之希望間隙為10[μm]時,則於壓力感測器633測出96[kPa]之時點上停止移動部606之驅動,此時按壓部604距離台部602之高度設為基準位置(參照第9圖)。 As shown in Fig. 10(b), the pressure corresponding to the desired gap between the holding plate 624 and the table portion 602 on the map is detected by the pressure sensor 633, and the moving portion 606 stops driving. At this time, the height position of the holding plate 624 from the table portion 602 is set as the reference position in the pressing direction. For example, when the desired gap between the holding plate 624 and the table portion 602 is 10 [μm], the driving of the moving portion 606 is stopped when the pressure sensor 633 detects 96 [kPa], and the pressing portion 604 is pressed at this time. The height of the distance table portion 602 is set as a reference position (refer to Fig. 9).

另,本實施形態亦可藉由多孔材料等形成保持板624。即,形成於保持板624之吸引口亦可由設於多孔材料之細孔形成。 Further, in the present embodiment, the holding plate 624 may be formed of a porous material or the like. That is, the suction port formed in the holding plate 624 may be formed by pores provided in the porous material.

又,本實施形態中,按壓感測器635係設於按壓板623與基底構件621間,但並非以此為限。按壓感測器635只要得以測量液狀樹脂作用於按壓面634之壓力,設於任何位置皆可。 Further, in the present embodiment, the pressing sensor 635 is provided between the pressing plate 623 and the base member 621, but is not limited thereto. The pressing sensor 635 can be provided at any position as long as it can measure the pressure of the liquid resin acting on the pressing surface 634.

又,本實施形態中,係藉由按壓感測器635測量按壓面634所承受之來自液狀樹脂之壓力,但並非以此為限。按壓感測器635亦可設於保持板624之按壓面634,測量工件W所承受之來自液狀樹脂之壓力。 Further, in the present embodiment, the pressure from the liquid resin which the pressing surface 634 receives is measured by the pressing sensor 635, but it is not limited thereto. The pressing sensor 635 may also be provided on the pressing surface 634 of the holding plate 624 to measure the pressure from the liquid resin which the workpiece W is subjected to.

又,本實施形態中,液狀樹脂係設定為光硬化性樹脂,但並非以此為限。液狀樹脂為可將工件W黏附於薄片S之樹脂即可,舉例言之,亦可使用熱硬化性樹脂。且,液狀樹脂並不限於完全液狀之狀態,更包含膠狀之固體。 Further, in the present embodiment, the liquid resin is set as a photocurable resin, but it is not limited thereto. The liquid resin may be a resin that can adhere the workpiece W to the sheet S. For example, a thermosetting resin can also be used. Further, the liquid resin is not limited to a completely liquid state, and further contains a gelatinous solid.

又,本實施形態中,係將樹脂供給部603安裝成可對基台601迴旋之狀態,但並非以此為限。樹脂供給部603只要 可對薄片S供給液狀樹脂,則任何構造皆可。 Further, in the present embodiment, the resin supply portion 603 is attached so as to be rotatable to the base 601, but it is not limited thereto. The resin supply unit 603 is only required Any liquid can be supplied to the sheet S, and any configuration is acceptable.

又,本實施形態中,係於基底構件621設有按壓板623及保持板624構成按壓部604,但並非以此為限。按壓部604只要具有用以吸附保持工件W之按壓面634即可。 Further, in the present embodiment, the pressing member 623 and the holding plate 624 are provided on the base member 621 to constitute the pressing portion 604, but the present invention is not limited thereto. The pressing portion 604 only needs to have a pressing surface 634 for sucking and holding the workpiece W.

又,本實施形態中,係於移動部606設有滾珠螺桿式之移動機構,但並非以此為限。移動部606為可使按壓面634離開及接近台部602之構造即可。 Further, in the present embodiment, the moving portion 606 is provided with a ball screw type moving mechanism, but it is not limited thereto. The moving portion 606 may be configured to allow the pressing surface 634 to move away from and approach the table portion 602.

又,本實施形態中,係以單一之壓力感測器633測量通路631內之吸氣壓與排氣壓,但並非以此為限,亦可於黏附裝置600設置吸氣用之壓力感測器與排氣用之壓力感測器。且,壓力感測器633亦可改用可測量流體特性之變化之感測器,例如流量感測器。 Moreover, in the present embodiment, the suction pressure and the exhaust pressure in the passage 631 are measured by a single pressure sensor 633, but not limited thereto, and the pressure sensor for inhaling may be provided in the adhesion device 600 and Pressure sensor for exhaust. Moreover, the pressure sensor 633 can also be used with a sensor that can measure changes in fluid characteristics, such as a flow sensor.

又,本實施形態中,係將保持板624-台部602間之間隙與通路631內之壓力之關係以映射圖形式儲存於記憶體,但並非以此為限。記憶體得以儲存用以呈現保持板624-台部602間之間隙與通路631內之壓力之關係之數據即可,舉例言之,亦可以表格形式(table)儲存保持板624-台部602間之間隙與通路631內之壓力之關係。 Further, in the present embodiment, the relationship between the gap between the holding plate 624 and the table portion 602 and the pressure in the passage 631 is stored in the memory in a map form, but it is not limited thereto. The memory can be stored to present data relating to the relationship between the gap between the plate 624 and the table 602 and the pressure in the passage 631. For example, the table 624 can also be stored in a table form. The relationship between the gap and the pressure within the passage 631.

又,本實施形態中,於裝配作業時,係藉由氣體供給部637向台部602吹送空氣,但並非以此為限,氣體供給部637可吹送任何凡可吹向台部602之氣體。 Further, in the present embodiment, air is blown to the table portion 602 by the gas supply portion 637 during the assembly work, but the gas supply portion 637 can blow any gas that can be blown toward the table portion 602.

參照第11圖,詳細說明薄片供給部。第11圖係本實施形態之薄片供給部之側面示意圖。第12圖係本實施形態之第一、第二送風部之擴大圖。 The sheet supply unit will be described in detail with reference to Fig. 11 . Fig. 11 is a side view showing the sheet supply portion of the embodiment. Fig. 12 is an enlarged view of the first and second air blowing portions of the embodiment.

如第11圖所示,薄片供給部700係由捲式薄片R拉出薄片S,再按預定長度切斷。捲式薄片R係將薄片S捲繞於滾筒701上而構成。關於薄片S,舉例言之係具有50[μm]左右厚度之聚對苯二甲酸乙二酯之薄膜。薄片S並非以上述薄膜為限,亦可依各種用途適當加以變更。關於滾筒701,舉例言之係由聚乙烯形成之直徑3吋之樹脂管。滾筒701並非以上述樹脂管為限,例如聚丙烯、ABS樹脂等形成之樹脂管、或紙管皆可。 As shown in Fig. 11, the sheet supply unit 700 pulls the sheet S from the roll sheet R and cuts it to a predetermined length. The roll sheet R is formed by winding a sheet S around a drum 701. As the sheet S, for example, a film of polyethylene terephthalate having a thickness of about 50 [μm] is used. The sheet S is not limited to the above film, and may be appropriately changed depending on various uses. As for the drum 701, for example, a resin tube having a diameter of 3 inches formed of polyethylene is used. The drum 701 is not limited to the above-mentioned resin tube, and may be a resin tube formed of polypropylene, ABS resin or the like, or a paper tube.

薄片供給部700係具備有一用以裝設捲式薄片R之捲式薄片支持部702、及一用以由捲式薄片R拉出薄片S之薄片拉出部703。捲式薄片支持部702與薄片拉出部703間,藉由第一、第二被動滾子704、705、夾持部706形成薄片S之傳送路徑。捲式薄片支持部702係插入貫通捲式薄片R之滾筒701,支持捲式薄片R並使其可以滾筒701之伸長方向為旋轉軸進行旋轉。捲式薄片支持部702係構成可由內側固定滾筒701之狀態,並可與捲式薄片R形成一體進行旋轉。 The sheet supply unit 700 includes a roll sheet support portion 702 for mounting the roll sheet R, and a sheet pull-out portion 703 for pulling the sheet S from the roll sheet R. Between the roll sheet supporting portion 702 and the sheet drawing portion 703, the first and second passive rollers 704, 705 and the nip portion 706 form a transport path of the sheet S. The roll sheet support portion 702 is inserted into the roll 701 that passes through the roll sheet R, and supports the roll sheet R so that the stretch direction of the roll 701 can be rotated as a rotation axis. The roll sheet supporting portion 702 is configured to be able to fix the drum 701 from the inside, and is rotatable integrally with the roll sheet R.

又,捲式薄片支持部702面對傳送方向依順行旋轉方向旋轉時,由張力賦予部707賦予制動力(逆進旋轉方向之旋轉力)。張力賦予部707藉由對捲式薄片支持部702賦予制動力,使由捲式薄片R拉出之薄片S產生張力作用。即使以一定力量拉出薄片S時,施加於捲式薄片支持部702之轉矩亦將因應捲式薄片S之直徑變化。因此,張力賦予部707為使薄片S產生適度之張力,乃配合捲式薄片R之直徑變化調整制動力。 Further, when the roll sheet supporting portion 702 is rotated in the forward rotation direction toward the conveying direction, the tension applying portion 707 applies the braking force (the rotational force in the reverse rotation direction). The tension applying unit 707 applies a braking force to the roll sheet supporting portion 702 to cause a tension action on the sheet S pulled by the roll sheet R. Even when the sheet S is pulled out with a certain force, the torque applied to the roll sheet supporting portion 702 will vary depending on the diameter of the roll sheet S. Therefore, the tension applying portion 707 adjusts the braking force in accordance with the diameter change of the roll sheet R in order to generate an appropriate tension of the sheet S.

第一、第二被動滾子704、705係配置於傳送路徑上捲式薄片支持部702之下游。第一、第二被動滾子704、705係分別旋轉接觸由捲式薄片R拉出之薄片S表面。傳送路徑上,第一、第二被動滾子704、705間係配置有第一、第二送風部708、709。第一送風部708係面對薄片S表面,藉由吹送空氣去除薄片S表面側之異物。第二送風部709係面對薄片S背面,藉由吹送空氣去除薄片S背面側之異物。 The first and second passive rollers 704, 705 are disposed downstream of the transport path upper roll support portion 702. The first and second passive rollers 704, 705 are respectively in rotational contact with the surface of the sheet S pulled by the roll sheet R. In the transport path, first and second air blowing portions 708 and 709 are disposed between the first and second passive rollers 704 and 705. The first air blowing portion 708 faces the surface of the sheet S, and removes foreign matter on the surface side of the sheet S by blowing air. The second air blowing unit 709 faces the back surface of the sheet S, and removes foreign matter on the back side of the sheet S by blowing air.

如第12圖所示,第一、第二送風部708、709係具有形成有吹送側通路721與吸引側通路722之塊體723。通路721之吹出附近急遽窄縮,提高吹向薄片S之氣體之流速。該通路721之吹出附近之間隙宜為50~500[μm],若為50~200[μm]更佳。本實施形態中,通路721之吹出附近之間隙係設定為100[μm]。 As shown in Fig. 12, the first and second air blowing portions 708 and 709 have a block body 723 in which a blowing side passage 721 and a suction side passage 722 are formed. The vicinity of the blowing of the passage 721 is sharply narrowed, and the flow rate of the gas blown toward the sheet S is increased. The gap in the vicinity of the blowing of the passage 721 is preferably 50 to 500 [μm], and more preferably 50 to 200 [μm]. In the present embodiment, the gap in the vicinity of the blowing of the passage 721 is set to 100 [μm].

塊體723係接近薄片S配置。未送風狀態下塊體723與薄片S之間隙宜為0~100[μm],若為0~50[μm]更佳。本實施形態中,未送風狀態下塊體723與薄片S之間隙係設為0[μm]。即使塊體723與薄片S之間隙設為0[μm],亦可在進行送風後藉由薄片S之張力與送風之風量形成一定之間隙,並去除數十[μm]左右之異物。 The block 723 is arranged close to the sheet S. The gap between the block 723 and the sheet S in the unheated state is preferably 0 to 100 [μm], and more preferably 0 to 50 [μm]. In the present embodiment, the gap between the block 723 and the sheet S in the non-supply state is set to 0 [μm]. Even if the gap between the block 723 and the sheet S is set to 0 [μm], a certain gap can be formed by the tension of the sheet S and the air volume of the air blow after the air blowing, and foreign matter of several tens [μm] can be removed.

第一、第二送風部708、709係將空氣送入吹送側之通路721,並由吸引側之通路722吸引空氣,藉此產生如箭頭A1所示之氣流。由吹送側之通路721吹出之空氣係於塊體723與薄片S之間隙掃起異物,並經由吸引側之通路722排出。如此一來,即可藉由第一、第二送風部708、709洗淨 薄片S兩面。 The first and second air blowing portions 708 and 709 send air to the passage 721 on the blowing side, and the air is sucked by the passage 722 on the suction side, thereby generating an air flow as indicated by an arrow A1. The air blown by the passage 721 on the blowing side sweeps the foreign matter in the gap between the block 723 and the sheet S, and is discharged through the passage 722 on the suction side. In this way, the first and second air blowing portions 708 and 709 can be washed. The sheet S has two sides.

回到第11圖,第二被動滾子705之下游係配置有夾持部706。夾持部706之作用係藉由上側平板714與下側平板715上下包夾薄片S。上側平板714係由具有水平面之板材形成,並安裝於位在傳送路徑上方之驅動部716之桿體717上。下側平板715係由具有水平面之板材形成,並安裝於位在傳送路徑下方之驅動部718之桿體719上。上側平板714及下側平板715係分別在桿體717、719之驅動下上下移動。 Returning to Fig. 11, a downstream portion of the second passive roller 705 is provided with a grip portion 706. The clamping portion 706 functions by sandwiching the sheet S from above and below by the upper flat plate 714 and the lower flat plate 715. The upper flat plate 714 is formed of a plate having a horizontal surface and is mounted on the rod 717 of the driving portion 716 positioned above the conveying path. The lower side plate 715 is formed of a plate having a horizontal surface and is mounted on the rod body 719 of the driving portion 718 located below the conveying path. The upper flat plate 714 and the lower flat plate 715 are vertically moved by the rods 717 and 719, respectively.

上側平板714及下側平板715係因應薄片S之拉出及切斷移動至適當高度。具體言之,上側平板714及下側平板715係於藉由薄片拉出部703把持薄片S前端之上段位置731、與藉由後述之切斷部711切斷薄片S之下段位置732間朝上下方向移動(參照第14圖)。另,上側平板714及下側平板715之動作詳述於後。 The upper flat plate 714 and the lower flat plate 715 are moved to an appropriate height in response to the pulling and cutting of the sheet S. Specifically, the upper flat plate 714 and the lower flat plate 715 are held by the sheet drawing portion 703 at the upper end position 731 of the sheet S and the lower portion 732 of the sheet S by the cutting portion 711 which will be described later. Direction movement (refer to Figure 14). The operation of the upper flat plate 714 and the lower flat plate 715 is described in detail later.

夾持部706下游配置有切斷部711。切斷部711係具有一用以將薄片S沿與傳送方向成正交之寬度方向切斷之切刀735、及一用以吸附保持薄片S背面之保持部736。切刀735及保持部736係配置成夾住薄片S之傳送路徑並在上下方向相對向之狀態。切刀735係位於薄片S上方,並構成可藉由切刀移動部746由薄片S之寬度方向一端側向另一端側移動之狀態。保持部736係位於薄片S下方,並形成沿薄片S之寬度方向延伸之狹長狀。 A cutting portion 711 is disposed downstream of the clamping portion 706. The cutting portion 711 has a cutter 735 for cutting the sheet S in the width direction orthogonal to the conveying direction, and a holding portion 736 for sucking and holding the back surface of the sheet S. The cutter 735 and the holding portion 736 are disposed to sandwich the conveying path of the sheet S and are opposed to each other in the vertical direction. The cutter 735 is located above the sheet S, and is configured to be movable from one end side to the other end side in the width direction of the sheet S by the cutter moving portion 746. The holding portion 736 is located below the sheet S and has an elongated shape extending in the width direction of the sheet S.

保持部736具有一用以吸附保持薄片S背面之保持面737。保持面737係水平形成,並與移至下段位置之下側平 板715之上表面略成同一平面。保持面737上,沿保持部736之延伸方向形成有用以供切刀502之刀鋒滑走之切刀槽738。又,保持面737上夾住切刀槽738之兩側,沿切刀槽738形成有複數吸引口739。複數吸引口739係藉由未予圖示之通路連接空氣之吸引源及供給源。 The holding portion 736 has a holding surface 737 for adsorbing and holding the back surface of the sheet S. The retaining surface 737 is formed horizontally and is moved to the lower side of the lower position. The upper surface of the plate 715 is slightly flush. On the holding surface 737, a cutter groove 738 for sliding the blade of the cutter 502 is formed along the extending direction of the holding portion 736. Further, the holding surface 737 is sandwiched by both sides of the cutter groove 738, and a plurality of suction ports 739 are formed along the cutter groove 738. The plurality of suction ports 739 are connected to a suction source and a supply source of air by means of a passage (not shown).

切斷部711於切斷薄片時,係藉由複數吸引口739之吸引將拉出之薄片S吸附於保持面737,並於切刀移動部746之驅動下使切刀735之刀鋒沿切刀槽738滑行移動於切刀槽738內,藉以切斷薄片S。藉此,可於使薄片S保持於保持面737之狀態下切斷薄片S。又,切斷部711於拉出薄片時,藉由複數吸引口739吹送空氣阻止薄片S與保持面737接觸。藉由該空氣之吹送,可防止拉出薄片時薄片S與保持面737摩擦。 When the cutting portion 711 cuts the sheet, the pulled sheet S is attracted to the holding surface 737 by suction of the plurality of suction ports 739, and the cutting edge of the cutter 735 is driven by the cutter moving portion 746. The groove 738 is slidably moved in the cutter groove 738 to cut the sheet S. Thereby, the sheet S can be cut in a state where the sheet S is held on the holding surface 737. Further, when the cut portion 711 pulls out the sheet, the air is blown by the plurality of suction ports 739 to prevent the sheet S from coming into contact with the holding surface 737. By the blowing of the air, it is possible to prevent the sheet S from rubbing against the holding surface 737 when the sheet is pulled out.

薄片拉出部703係具有一用以把持薄片S前端之把持部741、及一用以使把持部741沿相對於桿體717、719之驅動方向呈傾斜之方向移動之移動部742。移動部742係具有一相對於水平面P傾斜設置之支持台743、一於支持台743上與X軸方向成平行之導軌744、及一設置成可於導軌744滑動之滑件745。滑件745係構成可藉由滾珠螺桿式之移動機構沿傾斜方向移動之狀態。滑件745上表面安裝有底板751。 The sheet drawing portion 703 has a grip portion 741 for gripping the leading end of the sheet S, and a moving portion 742 for moving the grip portion 741 in a direction inclined with respect to the driving direction of the rods 717, 719. The moving portion 742 has a support table 743 which is inclined with respect to the horizontal plane P, a guide rail 744 which is parallel to the X-axis direction on the support table 743, and a slider 745 which is provided to be slidable on the guide rail 744. The slider 745 is configured to be movable in the oblique direction by a ball screw type moving mechanism. A bottom plate 751 is mounted on the upper surface of the slider 745.

把持部741係具有一立設於底板751之固定板752。固定板752係由底板751後端立起,並朝前方側彎折,且前端部753再向下彎折。且,把持部741具有一可接近及離開固定板752之前端部753之可動板754。可動板754係彎折成側視 呈逆L狀,並具有一與固定板752之前端部753相對向之平板部755。可動板754係安裝於設於底板751後端側之驅動部756之桿體757上。 The grip portion 741 has a fixing plate 752 that is erected on the bottom plate 751. The fixing plate 752 is erected from the rear end of the bottom plate 751 and bent toward the front side, and the front end portion 753 is bent downward again. Moreover, the grip portion 741 has a movable plate 754 that can approach and exit the front end portion 753 of the fixing plate 752. The movable plate 754 is bent into a side view It has an inverted L shape and has a flat plate portion 755 opposite to the front end portion 753 of the fixing plate 752. The movable plate 754 is attached to the rod 757 of the driving portion 756 provided on the rear end side of the bottom plate 751.

把持部741係使可動板754之平板部755接近固定板752之前端部753以把持薄片S前端,並使可動板754之平板部755離開固定板752之前端部753以放開薄片S前端。又,把持部741係往斜上方向前方位置761移動後把持薄片S前端,並於把持薄片S前端之狀態下往斜下方向後方位置762移動,由捲式薄片R拉出薄片S(參照第14圖)。 The grip portion 741 is such that the flat plate portion 755 of the movable plate 754 approaches the front end portion 753 of the fixed plate 752 to grip the front end of the sheet S, and the flat plate portion 755 of the movable plate 754 is separated from the front end portion 753 of the fixed plate 752 to release the front end of the sheet S. Further, the grip portion 741 is moved to the front position 761 in the obliquely upward direction, and the leading end of the sheet S is gripped, and the tip end of the sheet S is moved to the rearward position 762 in the obliquely downward direction, and the sheet S is pulled by the roll sheet R (see 14 picture).

此時,把持部741把持薄片S之高度,在前方位置761時約與切斷部711上方之上段位置731一致,在後方位置762時則約與切斷部711切斷薄片S之下段位置732一致。即,把持部741在前方位置761時於不撞及保持部736之狀態下把持薄片S,並由前方位置761移往後方位置762,於使薄片S之背面與切斷部711之保持面成同一平面之狀態下拉出薄片S。 At this time, the grip portion 741 grips the height of the sheet S, and corresponds to the upper portion position 731 above the cutting portion 711 at the front position 761, and cuts the lower portion S of the sheet S with the cutting portion 711 at the rear position 762. Consistent. In other words, when the grip portion 741 is at the front position 761, the sheet S is gripped without being hit by the holding portion 736, and is moved from the front position 761 to the rear position 762 so that the rear surface of the sheet S and the cutting portion 711 are held. The sheet S is pulled down in the state of the same plane.

又,捲式薄片支持部702附近配置有一用以檢測捲式薄片R之直徑之直徑檢測部712。直徑檢測部712係具有例如在發光部765周圍設有光接收部766之反射型光感測器767、及上述控制部6之記憶體。光感測器767係用以檢測隨著捲式薄片R之直徑變化所產生之光接收量變化。記憶體中係儲存有例如用以表現光接收量與捲式薄片R直徑之關係之映射圖。該映射圖係藉由預先改變捲式薄片R之直徑,同時以光感測器767測量光接收量而生成。 Further, a diameter detecting portion 712 for detecting the diameter of the roll sheet R is disposed in the vicinity of the roll sheet supporting portion 702. The diameter detecting unit 712 includes, for example, a reflective photosensor 767 having a light receiving portion 766 around the light emitting portion 765, and a memory of the control portion 6. The photo sensor 767 is for detecting a change in the amount of light received as the diameter of the roll sheet R changes. A map for expressing the relationship between the amount of light received and the diameter of the roll sheet R is stored in the memory. This map is generated by previously changing the diameter of the roll sheet R while measuring the amount of light received by the light sensor 767.

捲式薄片R之直徑越小,光感測器767與捲式薄片R外周面之距離越大,因此光感測器767所測出之光接收量降低。又,若由捲式薄片R將薄片全部拉出,因滾筒701之反射率與薄片S之反射率不同,故光感測器767所測量之光接收量大為改變。直徑檢測部712乃利用該等特性,依據記憶體所儲存之映射圖與光感測器767之測量結果檢測捲式薄片R之之直徑及薄片S之有無。 The smaller the diameter of the roll sheet R, the larger the distance between the photo sensor 767 and the outer peripheral surface of the roll sheet R, and thus the amount of light received by the photo sensor 767 is lowered. Further, when all of the sheets are pulled out by the roll sheet R, since the reflectance of the drum 701 is different from the reflectance of the sheet S, the amount of light received by the photo sensor 767 is largely changed. The diameter detecting unit 712 uses these characteristics to detect the diameter of the roll sheet R and the presence or absence of the sheet S based on the map stored in the memory and the measurement result of the photo sensor 767.

將直徑檢測部712檢測出之捲式薄片R之直徑通知張力賦予部707。張力賦予部707再因應捲式薄片R之直徑調整制動力,以使薄片S產生適度之張力。又,將直徑檢測部712檢測有無薄片S之結果通知監視部768。監視部768若探知無薄片S從捲式薄片R拉出,則發出警報。 The tension applying unit 707 is notified of the diameter of the roll sheet R detected by the diameter detecting unit 712. The tension applying portion 707 adjusts the braking force in accordance with the diameter of the roll sheet R so that the sheet S generates an appropriate tension. Further, the diameter detecting unit 712 notifies the monitoring unit 768 of the result of detecting the presence or absence of the sheet S. When the monitoring unit 768 detects that the sheet S is not pulled out from the roll sheet R, an alarm is issued.

參照第13圖,說明捲式薄片支持部之詳細構造。第13圖係本實施形態之捲式薄片支持部之部分截面示意圖。 The detailed configuration of the roll sheet support portion will be described with reference to Fig. 13. Fig. 13 is a partial cross-sectional view showing the roll sheet supporting portion of the embodiment.

如第13圖所示,捲式薄片支持部702係具有一突出設置於圓板狀擋止板771之板面上之棒狀軸部772。捲式薄片R係支持於捲式薄片支持部702上,形成軸部772插入貫通滾筒701內,並經擋止板771擋住止動之狀態。軸部772係形成中空狀,且內部設有可沿軸向進退之驅動桿773。又,軸部772上設有一對爪部774,用以藉驅動桿773之進退由滾筒701內側將捲式薄片R鎖定及解鎖。 As shown in Fig. 13, the roll sheet supporting portion 702 has a rod-shaped shaft portion 772 which is protruded from the plate surface of the disk-shaped stopper plate 771. The roll sheet R is supported by the roll sheet support portion 702, and the shaft portion 772 is inserted into the through roller 701 and blocked by the stopper plate 771. The shaft portion 772 is formed in a hollow shape, and is internally provided with a driving rod 773 that can advance and retreat in the axial direction. Further, the shaft portion 772 is provided with a pair of claw portions 774 for locking and unlocking the roll sheet R by the inside of the drum 701 by the advancement and retreat of the drive rod 773.

軸部772中形成有用以收容驅動桿773並可供其進退之收容空間776。收容空間776係藉由形成於軸部772前端部之插通孔777、及形成於軸部772外周部之一對長孔781連結外 部。軸部772可藉由前端之插通孔777使驅動桿773之前端部778突出,並可藉由外周面之一對長孔781使一對爪部774直接接觸滾筒701之內面。又,軸部772中並形成有一連結收容空間776基端側之空氣之供給空間783。 A receiving space 776 is formed in the shaft portion 772 for accommodating the driving lever 773 and allowing it to advance and retreat. The accommodating space 776 is connected to the long hole 781 by one of the insertion holes 777 formed in the front end portion of the shaft portion 772 and one of the outer peripheral portions of the shaft portion 772. unit. The shaft portion 772 can protrude the front end portion 778 of the driving rod 773 by the insertion hole 777 at the front end, and the pair of claw portions 774 can directly contact the inner surface of the drum 701 by the one of the outer peripheral surfaces facing the long hole 781. Further, a supply space 783 for connecting the air on the proximal end side of the accommodating space 776 is formed in the shaft portion 772.

供給空間783因收容空間776中收容驅動桿773而密閉。驅動桿773因對供給空間783供給空氣,朝使前端部778向軸部772外突出之退出方向移動。又,驅動桿773因停止對供給空間783供給空氣,可在操作員手動操作下朝用以使前端部778收容於插通孔777內之進入方向移動。此時,驅動桿773之進入位置係於收容空間776與供給空間783間,以直接接觸由軸部772內周面突出之環狀塊體775為限。 The supply space 783 is sealed by accommodating the drive lever 773 in the accommodating space 776. The drive lever 773 moves air to the supply space 783 and moves toward the exit direction in which the distal end portion 778 protrudes outward from the shaft portion 772. Further, the drive lever 773 stops the supply of air to the supply space 783, and can be moved in the entering direction for accommodating the distal end portion 778 in the insertion hole 777 by the operator's manual operation. At this time, the entry position of the drive lever 773 is between the accommodating space 776 and the supply space 783, and is limited to directly contact the annular block 775 protruding from the inner peripheral surface of the shaft portion 772.

驅動桿773係具有一做成小直徑之前端部778、一直徑大於前端部778之前方部785、一中間部786、及一後方部787。前端部778於驅動桿773朝退出方向移動時,經由插通孔777由軸部772前端面突出。前端部778之突出部分係作為用以解除捲式薄片R之鎖定之解鎖用操作部。前方部785及後方部787係具有與形成於軸部772內之圓柱狀支持面788、789之內徑尺寸約略同尺寸之外徑尺寸,並支持成可藉由支持面788、789沿進退方向滑動之狀態。 The drive rod 773 has a small diameter front end portion 778, a front portion 785 having a diameter larger than the front end portion 778, an intermediate portion 786, and a rear portion 787. When the drive lever 773 moves in the withdrawal direction, the distal end portion 778 protrudes from the distal end surface of the shaft portion 772 via the insertion hole 777. The protruding portion of the front end portion 778 serves as an unlocking operation portion for releasing the locking of the roll sheet R. The front portion 785 and the rear portion 787 have outer diameters that are approximately the same size as the inner diameters of the cylindrical support surfaces 788 and 789 formed in the shaft portion 772, and are supported to extend in the advancing and retracting direction by the support surfaces 788 and 789. The state of the slide.

中間部786係配置於一對安裝成可對軸部772開閉之狀態之爪部774間。中間部786靠前方部785側,形成有直徑朝驅動桿773之進入方向變大之錐形面791。隨著錐形面791與驅動桿773共同進退,夾住一對爪部774前端側並相對向之錐形面791與滾筒701內面之間隔產生變化。 The intermediate portion 786 is disposed between the pair of claw portions 774 that are attached to the shaft portion 772 in an openable and closable state. The intermediate portion 786 is formed on the side of the front portion 785, and has a tapered surface 791 whose diameter increases toward the entering direction of the driving rod 773. As the tapered surface 791 moves forward and backward together with the drive lever 773, the front end side of the pair of claw portions 774 is sandwiched and the interval between the tapered surface 791 and the inner surface of the drum 701 is changed.

一對爪部774係對應一對長孔781配置於收容空間776內,並支持於一對長孔781之後方形成可於軸部772搖動之狀態。一對爪部774係具有臂部792及滾子部793,臂部792係由支持於搖動支點796上呈可搖動狀態之基端部向前方延伸者,滾子部793係設於臂部792之前端部者。臂部792係形成寬度由前端部向基端部窄縮之狀態,並具有由基端部向軸部772之徑向內側延伸之卡止部794。滾子部793係旋轉接觸中間部786之錐形面791。 The pair of claw portions 774 are disposed in the accommodating space 776 corresponding to the pair of long holes 781, and are supported in a state in which the shaft portion 772 is rocked after the pair of long holes 781. The pair of claw portions 774 have an arm portion 792 and a roller portion 793. The arm portion 792 is extended forward by a base end portion supported by the rocking fulcrum 796 in a swingable state, and the roller portion 793 is attached to the arm portion 792. Before the end. The arm portion 792 has a width in which the front end portion is narrowed toward the proximal end portion, and has a locking portion 794 extending from the proximal end portion toward the radially inner side of the shaft portion 772. The roller portion 793 is in a rotational contact with the tapered surface 791 of the intermediate portion 786.

若驅動桿773朝退出方向移動,則滾子部793經錐形面791向外推擠,使臂部792藉由長孔781往朝向滾筒701側之外側搖動。因此,一對爪部774直接接觸滾筒701內面從而鎖定捲式薄片R。又,若驅動桿773朝進入方向移動,則中間部786之後端面795將卡止部794朝進入方向擠壓,使臂部792往朝向驅動桿773側之內側搖動。因此,一對爪部774自滾筒701內面離開從而解除捲式薄片R之鎖定。另,捲式薄片支持部702對捲式薄片R之鎖定與解鎖詳述於後。 When the drive lever 773 is moved in the retracting direction, the roller portion 793 is pushed outward through the tapered surface 791, and the arm portion 792 is swung by the long hole 781 toward the outer side of the drum 701 side. Therefore, the pair of claw portions 774 directly contact the inner surface of the drum 701 to lock the roll sheet R. Further, when the driving lever 773 moves in the entering direction, the rear end portion 795 of the intermediate portion 786 presses the locking portion 794 in the entering direction, and the arm portion 792 swings toward the inner side of the driving lever 773 side. Therefore, the pair of claw portions 774 are separated from the inner surface of the drum 701 to release the locking of the roll sheet R. Further, the locking and unlocking of the roll sheet R by the roll sheet supporting portion 702 will be described later in detail.

參照第14A圖及第14B圖,說明薄片供給部進行之薄片切斷動作。第14A圖及第14B圖係本實施形態之薄片供給部進行薄片切斷動作之說明圖。 The sheet cutting operation by the sheet supply unit will be described with reference to Figs. 14A and 14B. 14A and 14B are explanatory views of a sheet cutting operation performed by the sheet supply unit of the embodiment.

如第14A(a)圖所示,上側平板714及下側平板715於下段位置732夾持薄片S。此時,薄片S前端係位於切斷部711(保持部736)之保持面737上。又,把持部741於使固定板752之前端部753與可動板754之平板部755分開之狀態下在後方位置762待機。此時,把持部741之高度係與可在下段 位置732把持薄片S前端之高度一致。 As shown in Fig. 14A(a), the upper flat plate 714 and the lower flat plate 715 hold the sheet S at the lower stage position 732. At this time, the leading end of the sheet S is located on the holding surface 737 of the cutting portion 711 (holding portion 736). Moreover, the grip portion 741 stands by at the rear position 762 in a state where the front end portion 753 of the fixed plate 752 is separated from the flat plate portion 755 of the movable plate 754. At this time, the height of the grip portion 741 can be in the lower section. The position 732 holds the height of the front end of the sheet S in the same direction.

其次,如第14A(b)圖所示,上側平板714及下側平板715以業已夾持薄片S之狀態按箭頭A2方向移向上段位置731。藉此,薄片S之前端移往切斷部711之保持面737上方。其次,如第14A(c)圖所示,把持部741朝斜上方(箭頭A3方向)向前方位置761移動。把持部741定位於前方位置761後,薄片S之前端將定位於固定板752之前端部753與可動板754之平板部755間。 Next, as shown in Fig. 14A(b), the upper flat plate 714 and the lower flat plate 715 are moved to the upper position 731 in the direction of the arrow A2 in a state in which the sheet S is held. Thereby, the front end of the sheet S is moved over the holding surface 737 of the cutting portion 711. Next, as shown in Fig. 14A(c), the grip portion 741 is moved obliquely upward (in the direction of the arrow A3) toward the front position 761. After the grip portion 741 is positioned at the front position 761, the front end of the sheet S is positioned between the front end portion 753 of the fixing plate 752 and the flat plate portion 755 of the movable plate 754.

其次,如第14B(d)圖所示,可動板754之平板部755向固定板752之前端部753接近(箭頭A4方向),並以固定板752與可動板754把持薄片S之前端。如此一來,於前方位置761時,把持部741之高度係與可在上段位置731把持薄片S之高度一致。 Next, as shown in Fig. 14B(d), the flat plate portion 755 of the movable plate 754 approaches the front end portion 753 of the fixed plate 752 (in the direction of the arrow A4), and the front end of the sheet S is held by the fixed plate 752 and the movable plate 754. As a result, at the front position 761, the height of the grip portion 741 matches the height of the grip sheet S at the upper position 731.

其次,如第14B(e)圖所示,使下側平板715按箭頭A5方向向下段位置732移動以解除薄片S之夾持,同時使把持部741朝斜下方(箭頭A6方向)向後方位置762移動以拉出薄片S。此時,把持部741改變把持薄片S之位置之高度,由上段位置731移動至下段位置732。又,拉出薄片S時,由形成於保持面737之複數吸引口739對薄片S吹送空氣。藉由該吹送空氣之動作可防止拉出薄片S時薄片S與保持面737摩擦。 Next, as shown in Fig. 14B(e), the lower flat plate 715 is moved to the lower position 732 in the direction of the arrow A5 to release the grip of the sheet S, while the grip portion 741 is moved obliquely downward (in the direction of the arrow A6) to the rear position. The 762 moves to pull out the sheet S. At this time, the grip portion 741 changes the height of the position at which the sheet S is held, and moves from the upper position 731 to the lower position 732. Further, when the sheet S is pulled out, air is blown to the sheet S by the plurality of suction ports 739 formed on the holding surface 737. By the action of the blowing air, it is possible to prevent the sheet S from rubbing against the holding surface 737 when the sheet S is pulled out.

其次,如第14B(f)圖所示,薄片S之拉出動作完了後,藉由複數吸引口739將薄片S吸附於保持面737,並以薄片傳送部800由上方保持拉出在把持部741與保持面737間之薄片S。繼之,於以薄片傳送部800保持薄片S之狀態下,切刀 735沿形成於保持面737之切刀槽738滑動,以與傳送方向成正交之寬度方向切斷薄片S。複數吸引口739係隔著切刀槽738形成於兩側,因此於複數吸引口739保持住薄片S之狀態下沿切刀槽738切斷薄片S,可使切斷動作穩定進行。 Next, as shown in Fig. 14B(f), after the pulling operation of the sheet S is completed, the sheet S is adsorbed to the holding surface 737 by the plurality of suction ports 739, and is held by the sheet conveying portion 800 from above. A sheet S between the 741 and the holding surface 737. Then, in a state where the sheet S is held by the sheet conveying portion 800, the cutter The 735 slides along the slit 738 formed in the holding surface 737, and cuts the sheet S in the width direction orthogonal to the conveying direction. Since the plurality of suction ports 739 are formed on both sides with the cutter groove 738 interposed therebetween, the sheet S is cut along the cutter groove 738 while the plurality of suction ports 739 hold the sheet S, and the cutting operation can be stably performed.

切斷薄片S後,則解除把持部741對薄片S之把持,並藉由薄片傳送部800將薄片S傳送至台部602。此時,上側平板714移往下段位置732夾持薄片S,回到第14A(a)圖所示之狀態。呈前述,本實施形態係使把持部741由前方位置761朝斜後方移向後方位置762,藉以改變薄片S之高度並拉出薄片S。因此,僅需使把持部741沿傾斜方向之單軸方向移動即可,故相較於沿前後方向及上下方向之雙軸方向移動之構造,可藉由價廉且簡易之構造拉出薄片S。 When the sheet S is cut, the holding of the sheet S by the grip portion 741 is released, and the sheet S is conveyed to the table portion 602 by the sheet conveying portion 800. At this time, the upper flat plate 714 moves to the lower stage position 732 to sandwich the sheet S, and returns to the state shown in Fig. 14A(a). As described above, in the present embodiment, the grip portion 741 is moved obliquely rearward from the front position 761 toward the rear position 762, whereby the height of the sheet S is changed and the sheet S is pulled out. Therefore, it is only necessary to move the grip portion 741 in the uniaxial direction in the oblique direction. Therefore, the sheet S can be pulled out by an inexpensive and simple structure as compared with the structure in which the grip portion 741 moves in the biaxial direction in the front-rear direction and the up-and-down direction. .

參照第15圖,說明捲式薄片支持部對捲式薄片進行之鎖定動作及解鎖動作。第15圖係本實施形態中捲式薄片支持部對捲式薄片進行鎖定動作及解鎖動作之說明圖。 Referring to Fig. 15, the locking operation and the unlocking operation of the roll sheet by the roll sheet supporting portion will be described. Fig. 15 is an explanatory view showing a locking operation and an unlocking operation of the roll sheet by the roll sheet supporting portion in the embodiment.

如第15(a)圖所示,捲式薄片R解鎖時,驅動桿773係推入軸部772之收容空間776最後方,並直接接觸設於軸部772內周面之環狀塊體775。一對爪部774係以中間部786之後端面795直接接觸卡止部794,並如箭頭A7所示,將臂部792之前端側壓在驅動桿773外周面。此時,設於臂部792前端部之滾子部793係旋轉接觸錐形面791之小直徑側。 As shown in Fig. 15(a), when the roll sheet R is unlocked, the drive lever 773 is pushed into the rearmost side of the housing space 776 of the shaft portion 772, and directly contacts the annular block 775 provided on the inner peripheral surface of the shaft portion 772. . The pair of claw portions 774 are in direct contact with the locking portion 794 by the end surface 795 of the intermediate portion 786, and the front end side of the arm portion 792 is pressed against the outer peripheral surface of the driving lever 773 as indicated by an arrow A7. At this time, the roller portion 793 provided at the front end portion of the arm portion 792 is rotated to contact the small diameter side of the tapered surface 791.

於該捲式薄片R解鎖之狀態下,若於供給空間783供給空氣,則驅動桿773開始朝退出方向移動。若驅動桿773開始朝退出方向移動,滾子部793於錐形面791上由小直徑側 向大直徑側移動。因此,臂部792乃如箭頭A8所示,以搖動支點796為中心朝滾筒701側搖動。繼之如第15(b)圖所示,若將驅動桿773朝退出方向完全推出,則臂部792之前端側藉由長孔781緊咬於滾筒701內面與錐形面791間。 When the roll sheet R is unlocked, if the air is supplied to the supply space 783, the drive lever 773 starts moving in the exit direction. If the drive lever 773 starts moving in the exit direction, the roller portion 793 is on the tapered surface 791 by the small diameter side. Move to the large diameter side. Therefore, the arm portion 792 is rocked toward the drum 701 centering on the swing fulcrum 796 as indicated by an arrow A8. Then, as shown in Fig. 15(b), when the drive lever 773 is fully pushed out in the withdrawal direction, the front end side of the arm portion 792 is bitten between the inner surface of the drum 701 and the tapered surface 791 by the long hole 781.

藉此構造,可使臂部792緊壓滾筒701內面,並藉由臂部792由滾筒701內側鎖定捲式薄片R。此時,臂部792係如箭頭A8之搖動方向所示,由朝向擋止板771之傾斜方向直接接觸滾筒701內面。因此,於捲式薄片R碰觸擋止板771因而止動之狀態下,再藉由一對爪部774鎖定。又,於鎖定捲式薄片R之狀態下,作為解鎖用操作部之驅動桿773之前端部778係經由軸部772之插通孔777向外部突出。 With this configuration, the arm portion 792 can be pressed against the inner surface of the drum 701, and the roll sheet R can be locked by the inner side of the drum 701 by the arm portion 792. At this time, the arm portion 792 directly contacts the inner surface of the drum 701 in the oblique direction toward the stopper plate 771 as indicated by the rocking direction of the arrow A8. Therefore, in a state where the roll sheet R hits the stopper plate 771 and is thus stopped, it is locked by the pair of claw portions 774. In the state in which the roll sheet R is locked, the front end portion 778 of the drive lever 773 as the unlocking operation portion protrudes outward through the insertion hole 777 of the shaft portion 772.

該鎖定狀態下,停止對供給空間783供給空氣後,若操作員按壓由軸部772突出之驅動桿773之前端部778,則驅動桿773開始朝進入方向移動。若驅動桿773開始朝進入方向移動,則臂部792前端側由緊咬於捲式薄片R之滾筒701內面與錐形面791間之狀態脫離。繼之,如第15(a)圖所示,若驅動桿773朝進入方向完全推入,則中間部786之後端面795直接接觸一對爪部774之卡止部794。由於該卡止部794與後端面795之直接接觸,臂部792將如箭頭A7所示以搖動支點796為中心朝驅動桿773側搖動。 In the locked state, after the supply of air to the supply space 783 is stopped, when the operator presses the front end portion 778 of the drive lever 773 protruding from the shaft portion 772, the drive lever 773 starts moving in the entering direction. When the driving lever 773 starts to move in the entering direction, the front end side of the arm portion 792 is separated from the state between the inner surface of the roller 701 of the roll sheet R and the tapered surface 791. Then, as shown in Fig. 15(a), if the drive lever 773 is fully pushed in the entering direction, the rear end portion 795 of the intermediate portion 786 directly contacts the locking portion 794 of the pair of claw portions 774. Due to the direct contact of the locking portion 794 with the rear end surface 795, the arm portion 792 will swing toward the drive lever 773 side centering on the rocking fulcrum 796 as indicated by an arrow A7.

藉此構造,使臂部792完全離開滾筒701內面,並解除對捲式薄片R之鎖定。如此一來,係藉由操作員之手動操作解鎖,故不會因停止供給空氣等而自動解除鎖定。因此,捲式薄片R解鎖時,必須加上操作員之操作,故可制止操作 員意外解除捲式薄片R之鎖定。 With this configuration, the arm portion 792 is completely separated from the inner surface of the drum 701, and the locking of the roll sheet R is released. In this way, the operator is unlocked by manual operation, so that the lock is not automatically released by stopping the supply of air or the like. Therefore, when the roll sheet R is unlocked, the operation of the operator must be added, so that the operation can be stopped. The person accidentally unlocked the roll sheet R.

參照第16圖,說明直徑檢測部對捲式薄片之直徑檢測處理。第16圖所示者係本實施形態中光感測器對捲式薄片之變化之測量結果所呈現之映射圖之一例。另,第16圖中,捲式薄片係PET薄膜,滾筒係聚乙烯製。此外,分別以縱軸表示光感測器對應光接收量之測量電壓,以橫軸表示光感測器至測量對象之距離。 Referring to Fig. 16, the diameter detecting portion will be described for the diameter detecting process of the roll sheet. The figure shown in Fig. 16 is an example of a map showing the measurement result of the change of the roll sheet by the photo sensor in the present embodiment. In addition, in Fig. 16, the roll type sheet is a PET film, and the roll is made of polyethylene. Further, the vertical axis represents the measured voltage of the photosensor corresponding to the light receiving amount, and the horizontal axis represents the distance from the photo sensor to the measuring object.

如第16圖所示,驅動薄片供給部700前,改變與測量對象之距離,並測量光感測器767之測量電壓後,得到實線W1、虛線W2之測量結果。其中,實線W1係以捲式薄片R為測量對象時之測量結果,虛線W2係僅以滾筒701為測量對象時之測量結果。如實線W1所示,隨著光感測器767之光接收面與捲式薄片R之外周面之距離增加,光感測器767對應光接收量之測量電壓降低。圖例中,光感測器767之光接收面與捲式薄片R之外周面之距離由96[mm]增加至160[mm],則測量電壓由5.0[V]降低至1.4[V]。 As shown in Fig. 16, before the sheet supply unit 700 is driven, the distance from the measurement target is changed, and the measurement voltage of the photo sensor 767 is measured, and the measurement results of the solid line W1 and the broken line W2 are obtained. The solid line W1 is a measurement result when the roll sheet R is a measurement target, and the broken line W2 is a measurement result when only the drum 701 is a measurement target. As indicated by the solid line W1, as the distance between the light receiving surface of the photo sensor 767 and the peripheral surface of the roll sheet R increases, the photosensor 767 decreases in the measured voltage corresponding to the light receiving amount. In the drawing, the distance between the light receiving surface of the photo sensor 767 and the outer peripheral surface of the rolled sheet R is increased from 96 [mm] to 160 [mm], and the measured voltage is lowered from 5.0 [V] to 1.4 [V].

又,如虛線W2所示,光感測器767之光接收面與滾筒701之外周面之距離越大,光感測器767對應光接收量之測量電壓越低。圖例中,光感測器767之光接收面與圓筒701之外周面之距離由45[mm]增加至160[mm],則測量電壓由2.4[V]降低至1.2[V]。如此一來,滾筒701因反射率低於薄片S,故相較於以捲式薄片R為測量對象時,測量電壓較低。映射圖則儲存於控制部6之記憶體中。 Further, as indicated by a broken line W2, the greater the distance between the light receiving surface of the photo sensor 767 and the outer peripheral surface of the drum 701, the lower the measured voltage of the light sensor 767 corresponding to the light receiving amount. In the drawing, the distance between the light receiving surface of the photo sensor 767 and the outer peripheral surface of the cylinder 701 is increased from 45 [mm] to 160 [mm], and the measured voltage is lowered from 2.4 [V] to 1.2 [V]. As a result, since the reflectance of the drum 701 is lower than that of the sheet S, the measurement voltage is lower than when the roll sheet R is used as the measurement target. The map is stored in the memory of the control unit 6.

驅動薄片供給部700時,直徑檢測部712係參照記憶體 所儲存之映射圖,依據由捲式薄片R反射之光線之光接收量檢測捲式薄片R之直徑。直徑檢測部712係將測得之捲式薄片R直徑輸出至張力賦予部707。藉此構造,張力賦予部707於因應捲式薄片R之直徑改變施加於捲式薄片支持部702之轉矩時,亦可調整制動力使薄片S產生適度之張力。因此,可避免施予薄片S之張力過大以致薄片S拉長,或把持部741拉出薄片S時因負載影響導致動作不穩定等問題。此外,可避免若薄片S上產生之張力過小以致薄片S鬆弛,從而無法適當進行切斷薄片S之動作等問題。 When the sheet supply unit 700 is driven, the diameter detecting unit 712 refers to the memory. The stored map detects the diameter of the roll sheet R based on the light receiving amount of the light reflected by the roll sheet R. The diameter detecting unit 712 outputs the measured roll sheet R diameter to the tension applying unit 707. With this configuration, the tension applying portion 707 can adjust the braking force to cause the sheet S to generate an appropriate tension when the torque applied to the roll sheet supporting portion 702 is changed in accordance with the diameter of the roll sheet R. Therefore, it is possible to avoid the problem that the tension applied to the sheet S is excessively large so that the sheet S is elongated, or the grip portion 741 is pulled out of the sheet S, and the operation is unstable due to the influence of the load. Further, it is possible to prevent the sheet S from being loosened when the tension generated on the sheet S is too small, so that the problem of the operation of cutting the sheet S cannot be appropriately performed.

又,直徑檢測部712係參照記憶體所儲存之映射圖,由捲式薄片R與滾筒701之反射率差異檢測薄片S之有無。此時,直徑檢測部712係於薄片將盡前對捲式薄片R之測量電壓、與當下對滾筒701之測量電壓間,設定臨界值。繼之,直徑檢測部712以光感測器767測得臨界值以下之測量電壓時,檢測薄片S業已用盡。圖例中,因160[mm]時薄片S用盡,故設定1.3[V]為臨界值,藉以檢測薄片S之有無。 Further, the diameter detecting unit 712 detects the presence or absence of the sheet S by the difference in reflectance between the roll sheet R and the drum 701 with reference to the map stored in the memory. At this time, the diameter detecting portion 712 sets a critical value between the measured voltage of the roll sheet R and the current measured voltage of the drum 701 before the sheet is exhausted. Then, when the diameter detecting portion 712 measures the measured voltage below the critical value by the photo sensor 767, the detecting sheet S has been used up. In the example, since the sheet S is used up at 160 [mm], 1.3 [V] is set as a critical value to detect the presence or absence of the sheet S.

直徑檢測部712係將薄片S之有無通知監視部768。監視部768探知業已無薄片S從捲式薄片R拉出時發出警報,提醒操作員進行捲式薄片R之更換作業。 The diameter detecting unit 712 notifies the monitoring unit 768 of the presence or absence of the sheet S. The monitoring unit 768 detects that the sheet S has not been pulled out from the roll sheet R, and alerts the operator to perform the replacement operation of the roll sheet R.

另,本實施形態中係將光接收量與捲式薄片R之關係以映射圖形式儲存於記憶體,但並非以此為限。記憶體得以儲存用以呈現光接收量與捲式薄片R之關係之數據即可,舉例言之,亦可以表格形式儲存光接收量與捲式薄片R之關係。 Further, in the present embodiment, the relationship between the light receiving amount and the roll sheet R is stored in the memory in the form of a map, but it is not limited thereto. The memory can be stored to present data relating to the relationship between the amount of light received and the roll sheet R. For example, the relationship between the amount of light received and the roll sheet R can also be stored in a tabular form.

又,本實施形態中,直徑檢測部712係依據反射型光感測器767之光接收量檢測出捲式薄片R之直徑,但並非以光感測器為限。直徑檢測器712僅需具有可測量與捲式薄片R直徑相對應之物理量之感測器即可,舉例言之,亦可設置測力計並由捲式薄片R之重量檢測捲式薄片R之直徑。此時,係將測力計設於捲式薄片支持部702。 Further, in the present embodiment, the diameter detecting unit 712 detects the diameter of the roll sheet R based on the light receiving amount of the reflective photo sensor 767, but is not limited to the photo sensor. The diameter detector 712 only needs to have a sensor capable of measuring the physical quantity corresponding to the diameter of the roll sheet R. For example, a load cell can also be provided and the roll sheet R can be detected by the weight of the roll sheet R. diameter. At this time, the dynamometer is provided to the roll sheet support portion 702.

又,本實施形態中,係以反射率比捲式薄片低之材質形成滾筒701,但並非以此為限。檢測薄片S之有無時,滾筒701具有與捲式薄片R不同之反射率即可,舉例言之,亦可以反射率高於捲式薄片R之材質形成。 Further, in the present embodiment, the drum 701 is formed of a material having a lower reflectance than the rolled sheet, but it is not limited thereto. When the presence or absence of the sheet S is detected, the drum 701 may have a reflectance different from that of the roll sheet R. For example, it may be formed such that the reflectance is higher than that of the roll sheet R.

又,本實施形態中,係藉由張力賦予部707對捲式薄片支持部702施予逆進旋轉方向之旋轉力,以賦予張力於薄片S,但並非以此為限。張力賦予部707係一用以賦予薄片S適度之張力之構造即可,舉例言之,亦可做成使捲式薄片支持部702產生摩擦力之構造。 In the present embodiment, the tension applying portion 707 applies a rotational force in the reverse rotation direction to the roll sheet supporting portion 702 to apply tension to the sheet S, but is not limited thereto. The tension applying portion 707 may be configured to impart a moderate tension to the sheet S. For example, a structure in which the roll sheet supporting portion 702 generates a frictional force may be employed.

又,本實施形態中,係於發光部636周圍設置光接收部766形成光感測器767,但並非以此為限。光感測器767亦可做成於光接收部766周圍設置發光部636之構造。 Further, in the present embodiment, the light receiving portion 766 is provided around the light emitting portion 636 to form the photo sensor 767, but the present invention is not limited thereto. The photo sensor 767 may be configured to have a light-emitting portion 636 provided around the light receiving portion 766.

又,本實施形態中,係將光感測器767之輸出通知張力賦予部707及監視部768,但並非以此為限。亦可將光感測器767之輸出通知控制部6,並藉由控制部6通知張力賦予部707及監視部768。 In the present embodiment, the output of the photo sensor 767 is notified to the tension applying unit 707 and the monitoring unit 768, but not limited thereto. The output of the photo sensor 767 can be notified to the control unit 6, and the tension applying unit 707 and the monitoring unit 768 can be notified by the control unit 6.

又,本實施形態中,係藉由一對爪部774將捲式薄片R鎖定於捲式薄片支持部702,但並非以此為限。捲式薄片支 持部702只要為用以鎖定捲式薄片R之構造,則可具有任何構造。 Further, in the present embodiment, the roll sheet R is locked to the roll sheet support portion 702 by the pair of claw portions 774, but the present invention is not limited thereto. Roll sheet The holding portion 702 may have any configuration as long as it has a structure for locking the roll sheet R.

又,本實施形態中,係藉由第一、第二送風部708、709對薄片S噴射空氣以洗淨薄片S,但並非以此為限。第一、第二送風部708、709亦可噴射空氣以外之氣體以洗淨薄片S。 Further, in the present embodiment, the sheet S is ejected to the sheet S by the first and second air blowing portions 708 and 709, but the sheet S is not limited thereto. The first and second air blowing portions 708 and 709 may also eject a gas other than air to wash the sheet S.

又,本實施形態中,係由吸引口739吹送空氣,藉以防止拉出薄片S時薄片S與保持面737摩擦,但並非以此為限。若拉出薄片S時薄片S與保持面737不會摩擦,亦可不需由吸引口739吹送空氣。 Further, in the present embodiment, air is blown from the suction port 739 to prevent the sheet S from rubbing against the holding surface 737 when the sheet S is pulled out, but it is not limited thereto. If the sheet S is not rubbed against the holding surface 737 when the sheet S is pulled out, it is not necessary to blow air by the suction port 739.

又,本實施形態中,薄片拉出部703係於以把持部741把持薄片S前端之狀態下,滑動把持部741藉以將薄片S由捲式薄片R拉出,但並非以此為限。薄片拉出部703無論構成何種形式,僅需為可由捲式薄片R拉出薄片S之構造即可。 Further, in the present embodiment, the sheet drawing portion 703 is in a state where the grip portion 741 grips the leading end of the sheet S, and the sliding grip portion 741 pulls the sheet S from the roll sheet R, but is not limited thereto. The sheet drawing portion 703 only needs to have a configuration in which the sheet S can be pulled out from the roll sheet R regardless of the form.

參照第1圖、第17圖及第18圖,詳細說明台部及薄片傳送部。第17圖係本實施形態之台部之示意圖。另,第17圖中,(a)係台部之上表面示意圖,(b)係(a)之B1-B1截面圖。第18圖係本實施形態之薄片傳送部之截面示意圖。 The table portion and the sheet conveying portion will be described in detail with reference to Figs. 1, 17 and 18. Fig. 17 is a schematic view showing the table portion of the embodiment. In addition, in Fig. 17, (a) is a schematic view of the upper surface of the table portion, and (b) is a B1-B1 cross-sectional view of the system (a). Fig. 18 is a schematic cross-sectional view showing the sheet conveying portion of the embodiment.

如第17圖所示,台部602係以透光性材料形成圓板狀,上表面除外周區域外,中央區域設有凹部651。台部602上表面因凹部651形成階狀,並分別於外周區域形成第一保特面652、於凹部651內底面形成第二保持面653、於凹部651內周面形成由第一保持面652至第二保持面653之側面654。於第一保持面652形成有2個成同心圓狀之第一吸引口 655,用以吸引保持薄片S之外周區域。於第二保持面653與側面654之角部形成有環狀之第二吸引口656(吸引口),用以吸引薄片S之中央區域。 As shown in Fig. 17, the table portion 602 is formed into a disk shape by a light transmissive material, and the upper surface is provided with a concave portion 651 except for the peripheral region. The upper surface of the base portion 602 is stepped by the recessed portion 651, and the first retaining surface 652 is formed in the outer peripheral region, the second retaining surface 653 is formed on the inner bottom surface of the recessed portion 651, and the first retaining surface 652 is formed on the inner peripheral surface of the recessed portion 651. To the side 654 of the second holding surface 653. Forming two concentric first suction ports on the first holding surface 652 655 for attracting the peripheral area of the holding sheet S. An annular second suction port 656 (suction port) is formed at a corner of the second holding surface 653 and the side surface 654 for attracting the central portion of the sheet S.

第一吸引口655係藉由形成於台部602內部之通路連接未予圖示之吸引源。第二吸引口656係藉由形成於台部602內部之通路連接吸引源。又,連結第二吸引口656之通路設有大氣安全閥。台部602係藉由第一吸引口655之吸引將薄片S之外周區域吸附保持於第一保持面652。此時,由薄片S與第二保持面653、側面654形成一封閉空間657(參照第17(b)圖)。台部602係藉由第二吸引口656由該封閉空間657吸引空氣使薄片S貼住第二保持面653。 The first suction port 655 is connected to a suction source (not shown) via a passage formed inside the table portion 602. The second suction port 656 is connected to the suction source by a passage formed inside the table portion 602. Further, an air safety valve is provided in the passage connecting the second suction port 656. The table portion 602 sucks and holds the outer peripheral region of the sheet S on the first holding surface 652 by suction of the first suction port 655. At this time, a closed space 657 is formed by the sheet S, the second holding surface 653, and the side surface 654 (see FIG. 17(b)). The table portion 602 draws air from the closed space 657 by the second suction port 656 to cause the sheet S to stick to the second holding surface 653.

若空氣由封閉空間657吸出,則薄片S因第一保持面652與第二保持面653之階差而下拉且沿著第二保持面653緊密附著。第二保持面653除形成有第二吸引口656之外周緣外均呈平坦狀,故可提高對薄片S之附著性,且無發光部636(參照第5圖)所照射之光線產生散射之問題。因此,可使平坦之薄片S完好貼在工件W上。 If the air is sucked out of the closed space 657, the sheet S is pulled down by the step of the first holding surface 652 and the second holding surface 653 and is closely attached along the second holding surface 653. The second holding surface 653 is flat except for the periphery of the second suction opening 656. Therefore, the adhesion to the sheet S can be improved, and the light irradiated by the non-light-emitting portion 636 (see FIG. 5) is scattered. problem. Therefore, the flat sheet S can be properly attached to the workpiece W.

又,藉由打開大氣安全閥,並由第二吸引口656將空氣流入薄片S與第二保持面653間,可藉由作用於薄片S之張力(復原力)使薄片S由第二保持面653掀起。如此一來,本實施形態之台部602可使薄片S氣密附著於第二保持面653,並可輕易掀起貼住第二保持面653之薄片S。 Further, by opening the atmospheric safety valve and flowing air between the sheet S and the second holding surface 653 by the second suction port 656, the sheet S can be made of the second holding surface by the tension (restoring force) acting on the sheet S. 653 starts. As a result, the table portion 602 of the present embodiment allows the sheet S to be hermetically attached to the second holding surface 653, and the sheet S attached to the second holding surface 653 can be easily picked up.

如第1圖所示,薄片傳送部800係具有一由配置於外部框體2底壁部之基台801內突出之傳送臂部802、及一設於傳 送臂部802前端之薄片保持部803。傳送臂部802係構成可藉由設於基台801內之未予圖示之移動機構控制下沿X軸方向及Z軸方向移動之狀態。薄片保持部803係上視呈矩形,並具有用以保持薄片S之保持面。薄片傳送部800係藉由基台801內之移動機構於薄片供給部700與台部602間傳送薄片S。 As shown in Fig. 1, the sheet conveying unit 800 has a conveying arm portion 802 which is protruded from the base 801 disposed on the bottom wall portion of the outer casing 2, and The sheet holding portion 803 at the tip end of the arm portion 802 is sent. The transfer arm portion 802 is configured to be movable in the X-axis direction and the Z-axis direction under the control of a moving mechanism (not shown) provided in the base 801. The sheet holding portion 803 has a rectangular shape in plan view and has a holding surface for holding the sheet S. The sheet conveying unit 800 conveys the sheet S between the sheet supply unit 700 and the stage unit 602 by a moving mechanism in the base 801.

如第18圖所示,薄片保持部803除下表面之外周區域外,於中央區域形成有凹部811。薄片保持部803下表面之外周區域形成保持面812,並形成有用以吸引保持薄片S之外周區域之吸引口813。吸引口813係藉由形成於薄片保持部803內部之通路連接未予圖示之吸引源。凹部811安裝有以伸縮材料形成之膨脹膜(膨脹部)814。膨脹膜814之安裝係與凹部811內底面間隔些微間隙。 As shown in Fig. 18, the sheet holding portion 803 has a concave portion 811 formed in the central portion except for the outer peripheral region except the lower surface. The outer peripheral region of the lower surface of the sheet holding portion 803 forms a holding surface 812, and a suction port 813 for attracting the peripheral region of the holding sheet S is formed. The suction port 813 is connected to a suction source (not shown) via a passage formed inside the sheet holding portion 803. The concave portion 811 is attached with an expansion film (expansion portion) 814 formed of a stretchable material. The mounting of the expansion film 814 is spaced apart from the bottom surface of the recess 811 by a slight gap.

凹部811之內底面形成有一用以向膨脹膜814中央部分供給空氣之供給口816。供給口816係藉由形成於薄片保持部803內部之通路連接未予圖示之供給源。藉由供給口816供給空氣,則膨脹膜814由中央部分開始鼓起膨脹成圓頂狀。在使薄片S保持於台部602上第一保持面652之狀態下,薄片保持部803藉由使膨脹膜814膨脹成圓頂狀,將薄片S之中央部分擠壓貼住台部602之第二保持面653。 A bottom surface of the recess 811 is formed with a supply port 816 for supplying air to the central portion of the expansion membrane 814. The supply port 816 is connected to a supply source (not shown) via a passage formed inside the sheet holding portion 803. When the air is supplied through the supply port 816, the expanded film 814 is bulged from the central portion and expanded into a dome shape. In a state where the sheet S is held on the first holding surface 652 of the table portion 602, the sheet holding portion 803 is pressed into the dome portion by the expansion film 814, and the central portion of the sheet S is pressed against the table portion 602. Two holding faces 653.

繼之,受擠壓貼住第二保持面653之薄片S如上述因第二吸引口656之吸引而吸附於第二保持面653上。此時,因薄片中央部分受擠壓貼住第二保持面653,可將氣泡由薄片S中央向外推出使薄片S緊密附著於第二保持面653。藉此, 可阻止氣泡跑入薄片S與台部602間,並提高第二保持面653與薄片S之附著性。 Then, the sheet S pressed against the second holding surface 653 is attracted to the second holding surface 653 by the suction of the second suction opening 656 as described above. At this time, since the central portion of the sheet is pressed against the second holding surface 653, the bubble can be pushed outward from the center of the sheet S to closely adhere the sheet S to the second holding surface 653. With this, The bubble can be prevented from running between the sheet S and the land portion 602, and the adhesion of the second holding surface 653 to the sheet S can be improved.

參照第19圖,說明薄片之貼附動作。第19圖係本實施形態中薄片傳送部對薄片進行貼附動作之說明圖。 Referring to Fig. 19, the attachment operation of the sheet will be described. Fig. 19 is an explanatory view showing an operation of attaching a sheet to a sheet conveying unit in the embodiment.

如第19(a)圖所示,薄片保持部803由薄片供給部700取得薄片S,並將薄片S定位於台部602上方。此時,薄片S係以藉由吸引口813將外周區域保持於保持面812之狀態進行傳送。薄片保持部803以保持薄片S之狀態向下移動,並將薄片S載置於台部602之第一保持面652上。薄片S一置放於台部602上,即以第一吸引口655將薄片S之外周區域吸附於第一保持面652。此時,薄片S與第二保持面653與側面654形成封閉空間657。 As shown in Fig. 19 (a), the sheet holding portion 803 takes the sheet S from the sheet supply portion 700 and positions the sheet S above the table portion 602. At this time, the sheet S is conveyed while holding the outer peripheral region on the holding surface 812 by the suction port 813. The sheet holding portion 803 moves downward in a state in which the sheet S is held, and the sheet S is placed on the first holding surface 652 of the table portion 602. The sheet S is placed on the table portion 602, that is, the outer peripheral portion of the sheet S is adsorbed to the first holding surface 652 by the first suction port 655. At this time, the sheet S and the second holding surface 653 and the side surface 654 form a closed space 657.

其次,如第19(b)圖所示,台部602之第一保持面652一吸附薄片S之外周區域,則薄片保持部803解除以吸引口813保持薄片S之動作。繼之,薄片保持部803由供給口816向膨脹膜814供給空氣,使膨脹膜814膨脹成圓頂狀。藉此,使薄片S之中央部分受擠壓而貼住台部602之第二保持面653。 Next, as shown in Fig. 19(b), when the first holding surface 652 of the table portion 602 adsorbs the outer peripheral region of the sheet S, the sheet holding portion 803 releases the operation of holding the sheet S by the suction port 813. Then, the sheet holding portion 803 supplies air to the expansion film 814 from the supply port 816, and expands the expansion film 814 into a dome shape. Thereby, the central portion of the sheet S is pressed and adhered to the second holding surface 653 of the table portion 602.

其次,如第19(c)圖所示,台部602藉由第二吸引口656由封閉空間657吸引空氣,使薄片S貼附於第二保持面653。此時,薄片S因凹部651之階差而拉皺,並藉由膨脹膜814擠壓展平使氣泡由中央部分向外推出。業經推出之氣泡由第二吸引口656吸引排出,使薄片S由內側向外側逐漸緊密附著於第二保持面653。因此,可阻止氣泡跑入薄片S與台部602間。薄片S貼附於台部602後,薄片保持部803由台部 602上離開,並對薄片S實施上述之工件W黏附動作。 Next, as shown in Fig. 19(c), the table portion 602 attracts air from the closed space 657 by the second suction port 656, and the sheet S is attached to the second holding surface 653. At this time, the sheet S is wrinkled by the step of the concave portion 651, and is flattened by the expansion film 814 so that the bubble is pushed outward from the central portion. The bubble that has been pushed out is sucked and discharged by the second suction port 656, and the sheet S is gradually adhered to the second holding surface 653 from the inside to the outside. Therefore, the bubble can be prevented from running between the sheet S and the land portion 602. After the sheet S is attached to the table portion 602, the sheet holding portion 803 is made up of the table portion The 602 is left and the above-described workpiece W adhesion operation is performed on the sheet S.

其次,如第19(d)圖所示,工件W之黏附動作完畢後,台部602停止由第二吸引口656吸引空氣,並打開用以使封閉空間657內與大氣相通之大氣安全閥。藉由打開大氣安全閥,使空氣由第二吸引口656流入薄片S與第二保持面653間,並藉由作用於薄片S之張力(復原力)使薄片S由第二保持面653掀起。如此一來,即使薄片S氣密貼附於第二保持面653時,仍可輕易由第二保持面653掀起薄片S。 Next, as shown in Fig. 19(d), after the sticking operation of the workpiece W is completed, the table portion 602 stops sucking air from the second suction port 656, and opens an atmospheric safety valve for opening the atmosphere in the closed space 657. By opening the atmospheric safety valve, air is caused to flow between the sheet S and the second holding surface 653 from the second suction port 656, and the sheet S is lifted by the second holding surface 653 by the tension (restoring force) acting on the sheet S. As a result, even if the sheet S is airtightly attached to the second holding surface 653, the sheet S can be easily picked up by the second holding surface 653.

另,本實施形態中,係於薄片保持部803設有膨脹膜814,但並非以此為限。薄片保持部803僅需可保持薄片S之構造即可,舉例言之,亦可如第20圖所示,於下表面全區形成保持面812而不設膨脹膜814。 In the present embodiment, the expansion film 814 is provided in the sheet holding portion 803, but it is not limited thereto. The sheet holding portion 803 only needs to be configured to hold the sheet S. For example, as shown in Fig. 20, the holding surface 812 may be formed on the entire lower surface without the expansion film 814.

以下參照第20圖,說明變形例中使用薄片保持部對薄片進行之貼附動作。第20圖係變形例中使用薄片保持部貼附薄片之動作說明圖。另,在此對同一名稱標示同一元件符號。 Hereinafter, a attaching operation of the sheet using the sheet holding portion in the modification will be described with reference to Fig. 20. Fig. 20 is an explanatory view showing an operation of attaching a sheet using a sheet holding portion in a modification. In addition, the same component symbol is denoted by the same name herein.

如第20(a)圖所示,薄片保持部803係由薄片供給部700取得薄片S,並將薄片S定位於台部602上方。此時,係以藉由吸引口813將薄片S保持於保持面812之狀態進行傳送。薄片保持部803以保持薄片S之狀態向下移動,並將薄片S載置於台部602之第一保持面652上。薄片S一置放於台部602上,即以第一吸引口655將薄片S之外周區域吸附於第一保持面652。 As shown in FIG. 20( a ), the sheet holding unit 803 obtains the sheet S by the sheet supply unit 700 and positions the sheet S above the table portion 602 . At this time, the sheet S is held by the suction port 813 while being held by the holding surface 812. The sheet holding portion 803 moves downward in a state in which the sheet S is held, and the sheet S is placed on the first holding surface 652 of the table portion 602. The sheet S is placed on the table portion 602, that is, the outer peripheral portion of the sheet S is adsorbed to the first holding surface 652 by the first suction port 655.

其次,如第20(b)圖所示,台部602之第一保持面652一 吸附薄片S之外周區域,則薄片保持部803解除以吸引口813保持薄片S之動作。繼之,如第20圖(c)所示,台部602藉由第二吸引口656由薄片S與第二保持面653、側面654所形成之封閉空間657吸引空氣,使薄片S貼附於第二保持面653。此時,薄片S因凹部651之階差而拉皺,並緊密附著於第二保持面653。薄片S貼附於台部602後,薄片保持部803由台部602上離開,並對薄片S實施上述之工件W黏附動作。 Next, as shown in FIG. 20(b), the first holding surface 652 of the table portion 602 is When the outer peripheral region of the sheet S is adsorbed, the sheet holding portion 803 releases the operation of holding the sheet S by the suction port 813. Then, as shown in FIG. 20(c), the table portion 602 attracts air by the second suction port 656 from the closed space 657 formed by the sheet S and the second holding surface 653 and the side surface 654, so that the sheet S is attached thereto. The second holding surface 653. At this time, the sheet S is wrinkled by the step of the concave portion 651 and closely adheres to the second holding surface 653. After the sheet S is attached to the table portion 602, the sheet holding portion 803 is separated from the table portion 602, and the above-described workpiece W adhesion operation is performed on the sheet S.

其次,如第20(d)圖所示,工件W之黏附動作完畢後,台部602停止由第二吸引口656吸引空氣,並打開用以使封閉空間657內與大氣相通之大氣安全閥。藉由打開大氣安全閥,使空氣由第二吸引口656流入薄片S與第二保持面653間,並藉由作用於薄片S之張力(復原力)使薄片S由第二保持面653掀起。如此一來,即使薄片S氣密貼附於第二保持面653時,仍可輕易由第二保持面653掀起薄片S。 Next, as shown in Fig. 20(d), after the adhesion of the workpiece W is completed, the table portion 602 stops the suction of the air by the second suction port 656, and opens the atmospheric safety valve for opening the atmosphere in the closed space 657. By opening the atmospheric safety valve, air is caused to flow between the sheet S and the second holding surface 653 from the second suction port 656, and the sheet S is lifted by the second holding surface 653 by the tension (restoring force) acting on the sheet S. As a result, even if the sheet S is airtightly attached to the second holding surface 653, the sheet S can be easily picked up by the second holding surface 653.

又,本實施形態中,台部602之第二保持面653係形成平坦狀,但並非以此為限。第二保持面653亦可形成有連到第二吸引口656之凹槽。舉例言之,亦可如第21圖所示,於台部602形成一通過第二保持面653中心之凹槽901。第21圖中,(a)所示者係台部之上表面示意圖,(b)所示者係(a)之B2-B2截面圖。藉此構造,於降低發光部636(參照第5圖)之照射光散射之狀態下,可減少氣泡跑入第二保持面653與薄片S間,提高薄片S之吸附力。此例中,凹槽901無論做成任何形式,僅需為形成於第二保持面653上並連到第二吸引口656之構造即可。 Further, in the present embodiment, the second holding surface 653 of the table portion 602 is formed in a flat shape, but is not limited thereto. The second holding surface 653 may also be formed with a groove connected to the second suction opening 656. For example, as shown in FIG. 21, a groove 901 passing through the center of the second holding surface 653 may be formed in the table portion 602. In Fig. 21, (a) is a schematic view of the upper surface of the table portion, and (b) is a cross-sectional view taken along line B2-B2 of (a). With this configuration, in a state where the irradiation light of the light-emitting portion 636 (see FIG. 5) is reduced, the bubble can be prevented from entering between the second holding surface 653 and the sheet S, and the adsorption force of the sheet S can be increased. In this case, the groove 901 may be formed in any form and only needs to be formed on the second holding surface 653 and connected to the second suction port 656.

另,本實施形態中,係於連結第二吸引口656之通路設有大氣安全閥,但並非以此為限。只要可藉由第二吸引口656之吸引使薄片S吸附於第二保持面653,亦可做成不設大氣安全閥之構造。 In the present embodiment, the atmosphere safety valve is provided in the passage connecting the second suction port 656, but it is not limited thereto. As long as the sheet S can be attracted to the second holding surface 653 by the suction of the second suction port 656, a structure in which no atmospheric safety valve is provided can be used.

又,本實施形態中,係藉由第一吸引口655使薄片S吸附保持於第一保持面652,但並非以此為限。僅需使薄片S之外周區域保持於第一保持面652即可,舉例言之,亦可藉由夾緊機構等使薄片S之外周區域機械性保持於第一保持面652。 Further, in the present embodiment, the sheet S is adsorbed and held by the first holding surface 652 by the first suction port 655, but it is not limited thereto. It is only necessary to hold the outer peripheral region of the sheet S on the first holding surface 652. For example, the outer peripheral region of the sheet S may be mechanically held by the first holding surface 652 by a clamping mechanism or the like.

又,本實施形態中,係藉由第二吸引口656使薄片S吸附保持於第二保持面653,但並非以此為限。第二保持面653為用以吸附保持薄片S之中央區域之構造即可,舉例言之,亦可藉由形成於第二保持面653與側面654之角部之複數孔穴構成。 Further, in the present embodiment, the sheet S is adsorbed and held by the second holding port 656 by the second suction port 656, but it is not limited thereto. The second holding surface 653 may be a structure for adsorbing and holding the central portion of the sheet S. For example, it may be formed by a plurality of cavities formed at the corners of the second holding surface 653 and the side surface 654.

又,本實施形態中,係於第二保持面653與側面654之角部形成第二吸引口656,但並非以此為限。第二吸引口656亦可至少形成於第二保持面653及側面654之一方。 Further, in the present embodiment, the second suction port 656 is formed at the corner portion of the second holding surface 653 and the side surface 654, but the present invention is not limited thereto. The second suction port 656 may also be formed at least on one of the second holding surface 653 and the side surface 654.

在此參照第1圖,說明樹脂塗布裝置1所進行之全體動作流程。首先,於運轉前之維修時,實施黏附裝置600之裝配作業。藉此,設定按壓部604進行按壓操作時之基準位置。驅動樹脂塗布裝置1,由操作員將搬入側之晶匣4收容於晶匣收容部100後,以第一工件傳送部200將加工前之工件W由搬入側之晶匣4取出,暫置於暫置桌401。此時,若外部門106及內部門107中任一方呈開啟狀態,則任另一方 鎖定在關閉狀態,可確保操作員之作業安全性。 Here, the entire operation flow of the resin coating apparatus 1 will be described with reference to Fig. 1 . First, the assembly work of the adhesion device 600 is performed at the time of maintenance before the operation. Thereby, the reference position when the pressing unit 604 performs the pressing operation is set. When the operator holds the wafer 4 on the loading side in the wafer housing unit 100, the first workpiece transfer unit 200 removes the workpiece W before the processing from the wafer 4 on the loading side, and temporarily places it. Temporary table 401. At this time, if either of the external department 106 and the internal department 107 is turned on, the other party is Locked in the closed state ensures operator safety.

以攝影部402拍攝暫置桌401上之工件W,並於控制部6算出水平方向上之朝向或中心位置。依據算出之朝向或中心位置將拍攝後之工件W藉由第二工件傳送部300輸送至按壓部604,並藉由按壓部604之按壓面634保持於台部602上方。此外,往按壓部604傳送工件W之同時,以薄片供給部700由捲式薄片R拉出薄片S。拉出薄片S時,因應捲式薄片R之直徑變化進行調整,使薄片S產生適度之張力。 The photographing unit 402 photographs the workpiece W on the temporary table 401, and calculates the orientation or the center position in the horizontal direction in the control unit 6. The photographed workpiece W is transported to the pressing portion 604 by the second workpiece transport unit 300 in accordance with the calculated orientation or center position, and is held above the table portion 602 by the pressing surface 634 of the pressing portion 604. Further, while the workpiece W is being conveyed to the pressing portion 604, the sheet S is pulled out from the roll sheet R by the sheet supply portion 700. When the sheet S is pulled out, it is adjusted in accordance with the change in the diameter of the roll sheet R, so that the sheet S generates moderate tension.

以薄片供給部700拉出之薄片S,按預定長度切斷後藉由薄片傳送部800傳送至台部602上。此時,藉由設於薄片傳送部800之膨脹膜814之膨脹及台部602之凹部651,使薄片S氣密貼附於台部602。台部602上之薄片S,由樹脂供給部603供給液狀樹脂於中央部分。繼之,對黏附裝置600傳送薄片S及工件W後,將保持於按壓面634之工件W壓向業經供給液狀樹脂之薄片S。此時,因應液狀樹脂對按壓面634造成之壓力之變化,調整按壓部604之下壓量。藉此,使液狀樹脂遍及工件W之外緣。 The sheet S pulled out by the sheet supply portion 700 is cut to a predetermined length and then conveyed to the table portion 602 by the sheet conveying portion 800. At this time, the sheet S is hermetically attached to the land portion 602 by the expansion of the expansion film 814 provided in the sheet conveying portion 800 and the concave portion 651 of the table portion 602. The sheet S on the table portion 602 is supplied with a liquid resin from the resin supply portion 603 at the center portion. Then, after the sheet S and the workpiece W are conveyed to the adhering device 600, the workpiece W held on the pressing surface 634 is pressed against the sheet S through which the liquid resin is supplied. At this time, the amount of pressure under the pressing portion 604 is adjusted in response to the change in the pressure of the liquid resin against the pressing surface 634. Thereby, the liquid resin is spread over the outer edge of the workpiece W.

結束工件W對薄片S之按壓後,藉由發光部636發光照射使液狀樹脂硬化,於工件W與薄片S間形成樹脂膜。此時,係於業已解除工件W對薄片S之按壓之狀態下使液狀樹脂硬化,因此不會使工件W殘留內部應力。附有薄片S之工件W係藉由第二工件傳送部300自台部602取出,並配置於薄片切割部500下方。繼之,附有薄片S之工件W於薄片切割部500沿工件W外形切除多餘之薄片S後,藉由第一工件 傳送部200由薄片切割部500推入搬出側之晶匣5。 After the workpiece W is pressed against the sheet S, the liquid resin is cured by the light-emitting portion 636, and a resin film is formed between the workpiece W and the sheet S. At this time, since the liquid resin is cured in a state where the workpiece W is pressed against the sheet S, the internal stress does not remain in the workpiece W. The workpiece W to which the sheet S is attached is taken out from the table portion 602 by the second workpiece transfer portion 300 and disposed under the sheet cutting portion 500. Then, the workpiece W with the sheet S is cut by the sheet cutting portion 500 along the outer shape of the workpiece W by the first workpiece. The conveying unit 200 is pushed by the sheet cutting unit 500 into the wafer 5 on the carry-out side.

呈上,藉由本實施形態之樹脂塗布裝置1,可於將保持於按壓面634之工件W由上按壓供給於台部602上表面之液狀樹脂L時,因應按壓部604所受之壓力之變化調節按壓部604之壓入量,因此無論工件W之厚度不均或液狀樹脂L數量有所增減,皆可適切散佈液狀樹脂L。 In the resin coating apparatus 1 of the present embodiment, when the workpiece W held on the pressing surface 634 is pressed against the liquid resin L supplied to the upper surface of the table portion 602, the pressure applied to the pressing portion 604 can be applied. Since the amount of pressing of the pressing portion 604 is changed, the liquid resin L can be appropriately dispersed regardless of the thickness unevenness of the workpiece W or the amount of the liquid resin L.

又,此次揭示之實施形態係全部要點之舉例說明而非以該實施形態為限。本發明之範圍除上述實施形態之說明外並以申請專利範圍呈示,凡與申請專利範圍均等之意涵及範圍內之全部變更,均屬本發明之範圍。 Further, the embodiments disclosed herein are illustrative of all points and are not intended to limit the scope of the embodiments. The scope of the present invention is defined by the scope of the present invention, and all modifications within the scope and scope of the invention are intended to be within the scope of the invention.

如以上說明,本發明具有無論工件厚度不均或樹脂量有所增減皆可適切散佈樹脂之效果,且在用以塗布樹脂覆蓋半導體晶圓等工件(被加工物)之一面之樹脂塗布裝置上尤為有用。 As described above, the present invention has an effect that the resin can be appropriately dispersed regardless of the thickness of the workpiece or the amount of the resin is increased or decreased, and the resin coating device for coating the surface of the workpiece (the workpiece) such as a semiconductor wafer with a resin is coated. Especially useful.

1‧‧‧樹脂塗布裝置 1‧‧‧Resin coating device

2‧‧‧外部框體 2‧‧‧External frame

3‧‧‧座台 3‧‧‧Seat

4‧‧‧搬入側之晶匣 4‧‧‧ Moving into the side of the crystal

5‧‧‧搬出側之晶匣 5‧‧‧ Moving out of the side of the crystal

6‧‧‧控制部 6‧‧‧Control Department

100‧‧‧晶匣收容部 100‧‧‧Crystal Refuge Department

101‧‧‧收容部本體 101‧‧‧The body of the housing department

102‧‧‧收容室 102‧‧‧ Containment room

103‧‧‧晶匣台 103‧‧‧crystal table

104‧‧‧下段之滑動板 104‧‧‧Sliding plate in the lower section

105‧‧‧上段之滑動板 105‧‧‧Sliding plate of the upper section

106‧‧‧外部門 106‧‧‧Outside department

107‧‧‧內部門 107‧‧‧Internal department

111‧‧‧下段之滑動板之一端部 111‧‧‧ One end of the sliding plate in the lower section

112‧‧‧上段之滑動板之一端部 112‧‧‧One end of the sliding plate of the upper section

113‧‧‧卡合孔 113‧‧‧Snap holes

114‧‧‧鎖定銷 114‧‧‧Lock pin

115‧‧‧門感測器 115‧‧‧ Door Sensor

200‧‧‧第一工件傳送部 200‧‧‧First workpiece transfer unit

201‧‧‧導軌 201‧‧‧rails

202‧‧‧支持台 202‧‧‧Support Desk

203‧‧‧多連桿機構 203‧‧‧Multi-bar linkage

204‧‧‧工件保持部 204‧‧‧Workpiece holding department

300‧‧‧第二工件傳送部 300‧‧‧Second workpiece transfer unit

301‧‧‧導軌 301‧‧‧rail

302‧‧‧支持台 302‧‧‧Support Desk

303‧‧‧多連桿機構 303‧‧‧Multi-bar linkage

304‧‧‧工件保持部 304‧‧‧Working Holder

400‧‧‧工件檢測部 400‧‧‧Workpiece Inspection Department

401‧‧‧暫置桌 401‧‧‧ temporary table

402‧‧‧攝影部 402‧‧‧Photography Department

403‧‧‧臂部 403‧‧‧ Arms

500‧‧‧薄片切割部 500‧‧‧Sheet cutting department

501‧‧‧旋轉台 501‧‧‧Rotating table

502‧‧‧切刀 502‧‧‧Cutter

600‧‧‧黏附裝置 600‧‧‧Adhesive device

601‧‧‧基台 601‧‧‧Abutment

602‧‧‧台部 602‧‧

603‧‧‧樹脂供給部 603‧‧‧Resin Supply Department

604‧‧‧按壓部 604‧‧‧ Pressing Department

605‧‧‧柱狀部 605‧‧‧ Column

606‧‧‧移動部 606‧‧‧Mobile Department

611‧‧‧導軌 611‧‧‧rail

612‧‧‧Z軸桌板 612‧‧‧Z-axis table

613‧‧‧支持部 613‧‧‧Support Department

621‧‧‧基底構件 621‧‧‧Base member

622‧‧‧凹部 622‧‧‧ recess

623‧‧‧按壓板 623‧‧‧ Press plate

624‧‧‧保持板 624‧‧‧Maintenance board

631‧‧‧通路 631‧‧‧ pathway

632‧‧‧氣體吸引部 632‧‧‧Gas suction department

633‧‧‧壓力感測器 633‧‧‧pressure sensor

634‧‧‧按壓面 634‧‧‧ Pressing surface

635‧‧‧按壓感測器 635‧‧‧Press sensor

636‧‧‧發光部 636‧‧‧Lighting Department

637‧‧‧氣體供給部 637‧‧‧Gas Supply Department

651‧‧‧凹部 651‧‧‧ recess

652‧‧‧第一保持面 652‧‧‧First holding surface

653‧‧‧第二保持面 653‧‧‧second holding surface

654‧‧‧側面 654‧‧‧ side

655‧‧‧第一吸引口 655‧‧‧ first attraction

656‧‧‧第二吸引口 656‧‧‧second suction port

657‧‧‧封閉空間 657‧‧‧closed space

700‧‧‧薄片供給部 700‧‧‧Sheet Supply Department

701‧‧‧滾筒 701‧‧‧Roller

702‧‧‧捲式薄片支持部 702‧‧‧Rolled sheet support

703‧‧‧薄片拉出部 703‧‧‧Sheet pull-out

704‧‧‧第一被動滾子 704‧‧‧First passive roller

705‧‧‧第二被動滾子 705‧‧‧Second passive roller

706‧‧‧夾持部 706‧‧‧ gripping department

707‧‧‧張力賦予部 707‧‧‧Training Department

708‧‧‧第一送風部 708‧‧‧First air supply department

709‧‧‧第二送風部 709‧‧‧Second air supply department

711‧‧‧切斷部 711‧‧‧cutting department

712‧‧‧直徑檢測部 712‧‧‧Diameter Testing Department

714‧‧‧上側平板 714‧‧‧Upper flat panel

715‧‧‧下側平板 715‧‧‧Lower slab

716‧‧‧驅動部 716‧‧‧ Drive Department

717‧‧‧桿體 717‧‧‧ rod body

718‧‧‧驅動部 718‧‧‧ Drive Department

719‧‧‧桿體 719‧‧‧ rod body

721‧‧‧吹送側之通路 721‧‧‧Blowing side access

722‧‧‧吸引側之通路 722‧‧‧Attraction side access

723‧‧‧塊體 723‧‧‧ Block

731‧‧‧上段位置 731‧‧‧The last position

732‧‧‧下段位置 732‧‧‧The next position

735‧‧‧切刀 735‧‧‧Cutter

736‧‧‧保持部 736‧‧‧ Keeping Department

737‧‧‧保持面 737‧‧‧ Keep face

738‧‧‧切刀槽 738‧‧‧cutting slot

739‧‧‧吸引口 739‧‧‧ attracting mouth

741‧‧‧把持部 741‧‧‧ Holding Department

742‧‧‧移動部 742‧‧‧Mobile Department

743‧‧‧支持台 743‧‧‧Support desk

744‧‧‧導軌 744‧‧‧rails

745‧‧‧滑件 745‧‧‧Sliding parts

746‧‧‧切刀移動部 746‧‧‧Cutter movement department

751‧‧‧底板 751‧‧‧floor

752‧‧‧固定板 752‧‧‧ fixed plate

753‧‧‧前端部 753‧‧‧ front end

754‧‧‧可動板 754‧‧‧ movable plate

755‧‧‧平板部 755‧‧‧ Flat section

756‧‧‧驅動部 756‧‧‧Drive Department

757‧‧‧桿體 757‧‧‧ rod body

761‧‧‧前方位置 761‧‧‧ front position

762‧‧‧後方位置 762‧‧‧ rear position

765‧‧‧發光部 765‧‧‧Lighting Department

766‧‧‧光接收部 766‧‧‧Light Receiving Department

767‧‧‧反射型光感測器 767‧‧‧reflective light sensor

768‧‧‧監視部 768‧‧‧Monitor

771‧‧‧擋止板 771‧‧‧stop plate

772‧‧‧軸部 772‧‧‧Axis

773‧‧‧驅動桿 773‧‧‧ drive rod

774‧‧‧爪部 774‧‧‧ claws

775‧‧‧環狀塊體 775‧‧‧ annular block

776‧‧‧收容空間 776‧‧‧ accommodating space

777‧‧‧插通孔 777‧‧‧ inserted through hole

778‧‧‧前端部 778‧‧‧ front end

781‧‧‧長孔 781‧‧‧ long hole

783‧‧‧供給空間 783‧‧‧Supply space

785‧‧‧前方部 785‧‧‧ front part

786‧‧‧中間部 786‧‧‧Intermediate

787‧‧‧後方部 787‧‧‧ Rear

788、789‧‧‧支持面 788, 789‧‧‧ support surface

791‧‧‧錐形面 791‧‧‧Conical surface

792‧‧‧臂部 792‧‧‧ Arms

793‧‧‧滾子部 793‧‧‧Roller

794‧‧‧卡止部 794‧‧‧ card stop

795‧‧‧後端面 795‧‧‧ rear end face

796‧‧‧搖動支點 796‧‧‧Shake fulcrum

800‧‧‧薄片傳送部 800‧‧‧Sheet Transfer Department

801‧‧‧基台 801‧‧‧Abutment

802‧‧‧傳送臂部 802‧‧‧Transport arm

803‧‧‧薄片保持部 803‧‧‧Sheet holding department

811‧‧‧凹部 811‧‧‧ recess

812‧‧‧保持面 812‧‧‧ Keep face

813‧‧‧吸引口 813‧‧‧ attracting mouth

814‧‧‧膨脹膜 814‧‧‧Expanded film

816‧‧‧供給口 816‧‧‧ supply port

901‧‧‧凹槽 901‧‧‧ Groove

L‧‧‧液狀樹脂 L‧‧‧Liquid resin

P‧‧‧水平面 P‧‧‧ water level

R‧‧‧捲式薄片 R‧‧‧ roll sheet

S‧‧‧薄片 S‧‧‧Sheet

W‧‧‧工件 W‧‧‧Workpiece

第1圖係本實施形態之樹脂塗布裝置之透視圖。 Fig. 1 is a perspective view of a resin coating apparatus of the present embodiment.

第2圖係本實施形態之晶匣收容部之透視圖。 Fig. 2 is a perspective view of the wafer housing portion of the embodiment.

第3圖係本實施形態之晶匣收容部之截面示意圖。 Fig. 3 is a schematic cross-sectional view showing the wafer housing portion of the embodiment.

第4(a)~(c)圖係本實施形態之外部門及內部門之開閉動作之說明圖。 The fourth (a) to (c) drawings are explanatory diagrams of the opening and closing operations of the departments and internal departments other than the present embodiment.

第5圖係本實施形態之黏附裝置之截面示意圖。 Fig. 5 is a schematic cross-sectional view showing the adhering device of the embodiment.

第6(a)~(d)圖係本實施形態之黏附裝置之黏附動作之說明圖。 6(a) to (d) are explanatory views of the adhesion operation of the adhering device of the present embodiment.

第7圖所示者係本實施形態中按壓感測器之測定值與 移動部開始移動後之經過時間之一般關係。 The figure shown in Fig. 7 is the measured value of the pressing sensor in the present embodiment. The general relationship of the elapsed time after the mobile part starts moving.

第8圖所示者係本實施形態中按壓感測器之測量結果之一例。 The figure shown in Fig. 8 is an example of the measurement result of the pressing sensor in the present embodiment.

第9圖所示者係本實施形態中壓力感測器對保持板-台部間之間隙變化之測量結果所呈現之映射圖之一例。 The figure shown in Fig. 9 is an example of a map showing the measurement result of the change in the gap between the holding plate and the table portion by the pressure sensor in the present embodiment.

第10(a)、(b)圖係本實施形態之黏附裝置之裝配作業說明圖。 Fig. 10 (a) and (b) are explanatory views of the assembly work of the adhering device of the present embodiment.

第11圖係本實施形態之薄片供給部之側面示意圖。 Fig. 11 is a side view showing the sheet supply portion of the embodiment.

第12圖係本實施形態之第一、第二送風部之擴大圖。 Fig. 12 is an enlarged view of the first and second air blowing portions of the embodiment.

第13圖係本實施形態之捲式薄片支持部之部分截面示意圖。 Fig. 13 is a partial cross-sectional view showing the roll sheet supporting portion of the embodiment.

第14A(a)~(c)圖係本實施形態之薄片供給部進行薄片切斷動作之說明圖。 14A(a) to (c) are explanatory views of a sheet cutting operation performed by the sheet supply unit of the embodiment.

第14B(d)~(f)圖係本實施形態之薄片供給部進行薄片切斷動作之說明圖。 14B(d) to (f) are explanatory views of the sheet cutting operation performed by the sheet supply unit of the embodiment.

第15(a)、(b)圖係本實施形態中捲式薄片支持部對捲式薄片進行鎖定動作及解鎖動作之說明圖。 Fig. 15 (a) and (b) are explanatory views showing a locking operation and an unlocking operation of the roll sheet by the roll sheet supporting portion in the embodiment.

第16圖所示者係本實施形態中光感測器對捲式薄片之變化之測量結果所呈現之映射圖之一例。 The figure shown in Fig. 16 is an example of a map showing the measurement result of the change of the roll sheet by the photo sensor in the present embodiment.

第17(a)、(b)圖係本實施形態之台部之示意圖。 The seventeenth (a) and (b) drawings are schematic views of the table portion of the present embodiment.

第18圖係本實施形態之薄片傳送部之截面示意圖。 Fig. 18 is a schematic cross-sectional view showing the sheet conveying portion of the embodiment.

第19(a)~(d)圖係本實施形態中薄片傳送部對薄片進行貼附動作之說明圖。 19(a) to (d) are explanatory views of the attaching operation of the sheet conveying unit to the sheet in the embodiment.

第20(a)~(d)圖係變形例中使用薄片保持部貼附薄片之 動作說明圖。 In the 20th (a) to (d) modification, the sheet holding portion is attached to the sheet. Action description chart.

第21(a)、(b)圖係變形例之台部之截面示意圖。 21(a) and (b) are schematic cross-sectional views of the table portion of the modification.

6‧‧‧控制部 6‧‧‧Control Department

600‧‧‧黏附 600‧‧‧Adhesive

601‧‧‧基台 601‧‧‧Abutment

602‧‧‧台部 602‧‧

603‧‧‧樹脂供給部 603‧‧‧Resin Supply Department

604‧‧‧按壓部 604‧‧‧ Pressing Department

605‧‧‧柱狀部 605‧‧‧ Column

606‧‧‧移動部 606‧‧‧Mobile Department

612‧‧‧Z軸桌台 612‧‧‧Z-axis table

613‧‧‧支持部 613‧‧‧Support Department

621‧‧‧基底構件 621‧‧‧Base member

622‧‧‧凹部 622‧‧‧ recess

623‧‧‧按壓板 623‧‧‧ Press plate

624‧‧‧保持板 624‧‧‧Maintenance board

631‧‧‧通路 631‧‧‧ pathway

632‧‧‧氣體吸引部 632‧‧‧Gas suction department

633‧‧‧壓力感測器 633‧‧‧pressure sensor

634‧‧‧按壓面 634‧‧‧ Pressing surface

635‧‧‧按壓感測器 635‧‧‧Press sensor

636‧‧‧發光部 636‧‧‧Lighting Department

637‧‧‧氣體供給部 637‧‧‧Gas Supply Department

651‧‧‧凹部 651‧‧‧ recess

L‧‧‧液狀樹脂 L‧‧‧Liquid resin

S‧‧‧薄片 S‧‧‧Sheet

W‧‧‧工件 W‧‧‧Workpiece

Claims (2)

一種樹脂塗布裝置,係具有:按壓部,係具有一可吸附保持工件之按壓面;台部,係與前述按壓面對向配置;樹脂供給部,係將液狀樹脂供給於前述台部上表面;移動部,係用以使前述按壓面相對於前述台部接近及離開;及,控制部,係用以控制前述移動部之動作;該樹脂塗布裝置係以保持於前述按壓面之前述工件由上按壓供給於前述台部上表面之前述液狀樹脂,使前述液狀樹脂於前述工件下表面擴展;前述按壓部具有一壓力感測器,係用以於前述移動部令前述按壓面所保持之前述工件接近前述台部,使前述液狀樹脂被按壓而擴展於前述工件下表面時,檢測前述按壓面所受之壓力;前述控制部係依據前述壓力感測器檢測出之壓力,控制前述移動部之動作,並於前述壓力感測器檢測出壓力在之前檢測出之壓力以下時,停止前述移動部令前述按壓面所保持之前述工件接近前述台部之動作。 A resin coating device comprising: a pressing portion having a pressing surface capable of adsorbing and holding a workpiece; a table portion disposed to face the pressing surface; and a resin supply portion supplying a liquid resin to the upper surface of the table portion a moving portion for bringing the pressing surface closer to and away from the table portion; and a control portion for controlling an operation of the moving portion; the resin coating device for holding the workpiece on the pressing surface Pressing the liquid resin supplied to the upper surface of the table portion to expand the liquid resin on the lower surface of the workpiece; the pressing portion has a pressure sensor for holding the pressing surface in the moving portion The workpiece is close to the table portion, and when the liquid resin is pressed and spread over the lower surface of the workpiece, the pressure applied to the pressing surface is detected; and the control unit controls the movement based on the pressure detected by the pressure sensor. The operation of the portion, and when the pressure sensor detects that the pressure is below the pressure detected before, stopping the moving portion to cause the pressing surface The operation of the workpiece holding closest portion of the table. 一種樹脂塗布裝置,係具有:按壓部,係具有一可吸附保持工件之按壓面及吸引口;台部,係與前述按壓面對向配置; 樹脂供給部,係將液狀樹脂供給於前述台部上表面;移動部,係用以使前述按壓面相對於前述台部接近及離開;及,控制部,係用以控制前述移動部之動作;該樹脂塗布裝置係以保持於前述按壓面之前述工件由上按壓供給於前述台部上表面之前述液狀樹脂,使前述液狀樹脂於前述工件下表面擴展;並具有:氣體吸引部,係在前述吸引口產生吸引力;壓力感測器,配置於前述氣體吸引部與前述吸引口之間;及間隔檢測設備,用以檢測前述按壓部與前述台部之間隔;前述按壓部具有一按壓感測器,係用以於前述移動部令前述按壓面所保持之前述工件接近前述台部,使前述液狀樹脂被按壓而擴展於前述工件下表面時,檢測前述按壓面所受之壓力,前述控制部係依據前述按壓感測器檢測出之壓力,控制前述移動部之動作,前述間隔檢測設備具有:氣體供給部,將氣體供給至前述吸引口;記憶部,係在一面從前述吸引口噴出氣體一面變化前述按壓部與前述台部之間的距離時,記憶前述壓力感 測器檢測出的壓力變化;及算出部,依據前述壓力感測器檢測出的壓力值與前述壓力變化,算出前述按壓部與前述台部之間的距離。 A resin coating device comprising: a pressing portion having a pressing surface and a suction opening capable of adsorbing and holding a workpiece; and a table portion disposed to face the pressing surface; The resin supply unit supplies the liquid resin to the upper surface of the table portion; the moving portion is configured to bring the pressing surface closer to and away from the table portion; and the control portion controls the operation of the moving portion; In the resin coating apparatus, the liquid resin supplied to the upper surface of the table portion is pressed by the workpiece held on the pressing surface, and the liquid resin is expanded on the lower surface of the workpiece; and the gas suction portion is provided. An attraction force is generated in the suction port; a pressure sensor is disposed between the gas suction portion and the suction port; and an interval detecting device detects an interval between the pressing portion and the table portion; and the pressing portion has a pressing The sensor is configured to detect that the workpiece held by the pressing surface approaches the table portion, and when the liquid resin is pressed and spread over the lower surface of the workpiece, the pressure applied to the pressing surface is detected. The control unit controls the operation of the moving unit according to the pressure detected by the pressing sensor, and the interval detecting device has a gas supply , The gas is supplied to the suction port; when the memory unit, based on the discharge side of the gas from the suction port side of the distance between the pressing portion and the table portion changes, the pressure sensing memory The pressure change detected by the detector; and the calculation unit calculates the distance between the pressing portion and the table portion based on the pressure value detected by the pressure sensor and the pressure change.
TW100144831A 2011-01-13 2011-12-06 Resin coating means TWI554337B (en)

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